CN101219546B - Die - Google Patents
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- Publication number
- CN101219546B CN101219546B CN2007101953090A CN200710195309A CN101219546B CN 101219546 B CN101219546 B CN 101219546B CN 2007101953090 A CN2007101953090 A CN 2007101953090A CN 200710195309 A CN200710195309 A CN 200710195309A CN 101219546 B CN101219546 B CN 101219546B
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- China
- Prior art keywords
- punch die
- jog
- stamping
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention relates to a die. The invention provides a die to make sure the service life and suppress the occur of blanking burr in a blanking process of the flexible PCB. A die is used for the planking process of the flexible PCB. A flexuous concavo-convex part viewed from side surface is continuously formed on the bottom of the die, and, in the whole surface of the bottom, the concavo-convex part is fixed in a slant parallel manner viewed from the bottom.
Description
Technical field
The present invention relates to punch die, in particular, the present invention relates to be used for the punch die of the stamping-out processing of printed circuit board (PCB).
Background technology
At the printed circuit board (PCB) that electronic equipment adopted, particularly by in the flexible printed circuit board of cable portion with the multilayer that connects between the parts installation portion, in having flexible cable portion and parts installation portion, have partly the different position of thickness (such as, with reference to patent documentation 1).
At the flexible printed circuit board at different position,, an example of the step of the goods profile being carried out stamping-out by common punch die is described by Fig. 9~Fig. 14 with such layer structure.Fig. 9 is illustrated in the flexible printed circuit board 50, and the state that a plurality of same circuit patterns form continuously by punch die, carries out stamping-out, separation to the goods profile 51 by a dotted line.
Figure 10 is the A portion enlarged drawing of Fig. 9, and Figure 10 (a) is a vertical view, and Figure 10 (b) is the cutaway view of the B-B line among Figure 10 (a).In corresponding flexible printed circuit board 50A, between the 1st end film 52a and the 2nd end film 52b, being situated between is provided with adhering part 53.In illustrated example, form 2 layers structure up and down, still, also can be formed on the part of above-mentioned adhering part 53, the sandwich construction of multilayer circuit pattern is set.In the present embodiment, for simplicity, omit the diagram of circuit pattern.
The goods profile 51 of above-mentioned flexible printed circuit board 50A is formed by 3 parts, at the parts installation portion 55 that has barrier bed 54,54 up and down, and is connected by cable portion 57 at the parts installation portion 56 that does not all have barrier bed up and down.In cable portion 57,, between counterdie 52a, 52b up and down, hollow bulb 58 is set at upper and lower settings barrier bed 54,54.
Here, label 59 expressions are provided for the zone with the peristome of device assembles on parts installation portion 56, and this peristome 59 also passes through punch die and stamping-out.In addition, label 54b represents the barrier bed of the circuit of adjacency.
Figure 11 represents to be undertaken by punch die the position of stamping-out, at the Outboard Sections of goods profile 51, the part 60 that has a hachure by 1 time step and stamping-out, the Outboard Sections at stamping-out position 60 is a waste part 61.In addition, between stamping-out position 60,60, prior residual a plurality of connecting portions 62.This connecting portion 62 constitutes goods and when cutting apart respectively, cuts off and remove after various the finishing of flexible printed circuit board 50A.
Figure 12 is positioned over state on the former 70 for expression flexible printed circuit board 50A, is the cutaway view at the position of the C-C line of Figure 11.Above former 70, place punch die 71, this punch die 71 descends, and stamping-out is carried out at stamping-out position shown in Figure 11 60.
Figure 13 represents the plane of goods profile 51, if by this figure, blank operation is described, then shown in the image pattern 13 (a) like that, above-mentioned punch die 71 descends, and at first, begins to block from the parts installation portion 55 of barrier bed with thickness maximum.From in appearance, the thickness of cable portion 57 is identical with installing component portion 55, still, owing to have hollow bulb 58, so push cable portion 57 delays and begin to block downwards by punch die 71.
So, shown in the image pattern 13 (b) like that, if blocking of parts installation portion 55 carried out, then follow, begin not have the blocking of parts installation portion 56 of barrier bed.Then, above-mentioned punch die 71 further descends, if parts installation portion 55 and parts installation portion 56 block end, then block from the both sides of cable portion 57, still, shown in the image pattern 13 (c) like that, if the direct of travel that blocks departs from, then produce the burr of stamping-out.
The reason that the direct of travel that blocks departs from is: in cable portion 57, have hollow bulb 58, shown in the image pattern 14 like that, because of the deflection of this hollow bulb 58, the direct of travel that blocks departs from.
As the scheme of the burr of the stamping-out that suppress to adopt punch die, people know have following perforation with punch die (such as, with reference to patent documentation 2), wherein, according to the front end from sword, the mode blade tip of Yan Shening is the shape of acute angle obliquely, and the mode of blade tip contact is blocked according to having the time difference.
In addition, people know that also the cross section that die forging drift (punch die) is arranged is V-arrangement or half elliptic, and the stamping-out angle of blade tip is less than 90 °, be preferably 45 ° blanking apparatus (such as, with reference to patent documentation 3).
Patent documentation 1: No. 3176858 communique of Japan's special permission
Patent documentation 2: Japanese kokai publication hei 9-150399 communique
Patent documentation 3: Japanese Unexamined Patent Application Publication 2003-533362 communique
Summary of the invention
The printed circuit board (PCB) of being put down in writing as patent documentation 1, have in the flexible printed circuit board at the different position of thickness with the parts installation portion in cable portion with flexibility, as described in as passing through Fig. 9~Figure 14, when carrying out stamping-out by punch die, because of the deflection of the hollow bulb of cable portion, the travel direction that blocks departs from and produces burr.
The perforation that patent documentation 2 is put down in writing can make the sharpness of punch die good with punch die, suppresses the burr of stamping-out, still, the different cable portion of thickness is being carried out the occasion of stamping-out, carries out the punch die contact if having time difference ground, then produces stamping-out and departs from.Particularly, cable portion requires the good material of flexural property, if the cable portion that forms by soft material contacts with the blade tip of punch die earlier, then is easy to generate stamping-out and departs from the thread burr that causes.In addition, if having the part of acute angle, then be easy to generate sword and curl the lost of life of mould at the blade tip of punch die.
In the blanking apparatus that patent documentation 3 is put down in writing, the cross section of die forging drift (punch die) is V-arrangement or half elliptic, but, identical with above-mentioned perforation with punch die, if blade tip is linearly, then can't suppress the generation of the wire burr that the time difference produces, if having the part of acute angle at front end, the lost of life of mould then.In addition, owing to adopt the structure of only pushing blinking scrap at blade tip, thus if the flexible high material of stamping-out, then because of flexible bounce-back, the situation that has blinking scrap to jump on the printed circuit board (PCB) would take place.In addition, disclose the shape that blade tip is seen as waveform from the side, still, in this occasion, blade tip mostly is the part of acute angle, and the intensity tender of machinery is easy to generate sword and curls the lost of life.
So, the objective of the invention is to stamping-out processing at printed circuit board (PCB), when being provided at the life-span of guaranteeing punch die, suppress the punch die of the generation of stamping-out burr.
The present invention proposes to achieve these goals, technical scheme 1 described invention provides a kind of punch die, this punch die is the punch die that is used for the stamping-out processing of printed circuit board (PCB), bottom surface at this punch die, form continuously and have the inclined side that is seen as same shape from the side or the jog of curved edges, and above-mentioned jog is provided with according to the mode of seeing dip-parallel from the bottom surface in whole scope of above-mentioned bottom surface.
According to this scheme, owing to, form the jog that is seen as same shape from the side continuously in the bottom surface of punch die, so if punch die descends, the protuberance of jog contacts with printed circuit board (PCB), then at first, is the dotted line shape and blocks printed circuit board (PCB).Follow the decline of punch die, then according to pressing on the blade tip, the truncation part ways of connecting of dotted line shape realizes blocking.So, even under the situation that the direct of travel that blocks departs from, still can block according to the mode of the not truncation part drawing crack between the dotted line shape truncation part, can absorb departing from of the direct of travel that blocks, can prevent the generation of burr.In addition, because above-mentioned jog is in whole scope of above-mentioned bottom surface, be provided with according to the mode of seeing dip-parallel from the bottom surface, so stamping-out line direction why no matter, jog touches with whole edge joint equably, produces above-mentioned effect.
Technical scheme 2 described inventions provide technical scheme 1 described punch die, it is characterized in that above-mentioned jog is wavy.
According to this scheme, because above-mentioned jog is in wave shape, so the blocking successfully of generation of pushing of blade tip carried out, the absorption that departs from of the direct of travel that blocks is also good.
In the present invention, because bottom surface at punch die, form the jog that is seen as same shape from the side continuously, such as, wavy, block printed circuit board (PCB) so be the dotted line shape, block according to dotted line shape truncation part ways of connecting, thus, departing from of the travel direction that blocks by absorption can prevent the generation of burr.Stamping-out line direction why no matter in addition,, is provided with, so all can prevent the generation of burr according to the mode of dip-parallel because wavy jog is in whole scope of punch die bottom surface.In addition, guarantee the intensity of machinery, the life-span that can keep mould more longways.In addition, owing to pass through the bottom surface integral body of punch die, the extruding blinking scrap, so blinking scrap drops really in the opening of former, the discharge of blinking scrap is also good.
Description of drawings
Fig. 1 is the front view of punch die of the present invention;
Fig. 2 is that α-α of Fig. 1 is to view;
Fig. 3 is that β-β of Fig. 1 is to view;
Fig. 4 is positioned over the front view of the state on the former for flexible printed circuit board;
Fig. 5 (a)~(c) is the vertical view of the stamping-out step of explanation goods profile;
Fig. 6 (a)~(d) is the key diagram of the variation of expression truncation part;
Fig. 7 is the key diagram of the size of the jog of expression punch die;
Fig. 8 (a) and (b) are the key diagram of the distortion example of the shape of the jog of expression punch die;
Fig. 9 is the vertical view that is formed with the flexible printed circuit board of a plurality of circuit patterns;
Figure 10 (a) and (b) are the A portion enlarged drawing among Fig. 9;
Figure 11 is the key diagram of expression by the position of punch die stamping-out;
Figure 12 is the existing example of expression, and flexible printed circuit board is positioned over the front view of the state on the former;
Figure 13 (a)~(c) is the existing example of expression, the vertical view of the stamping-out step of goods profile;
Figure 14 is the existing example of expression, the cutaway view of the cable portion of the state of hollow bulb 58 deflections.
The specific embodiment
Enumerate preferred embodiment below, punch die of the present invention is described.In order to realize at the processing of the stamping-out of printed circuit board (PCB), when being provided at the life-span of guaranteeing punch die, the purpose of the punch die of the generation of inhibition stamping-out burr, the present invention realizes by following manner, this mode is: at the punch die of the stamping-out processing that is used for printed circuit board (PCB), bottom surface at this punch die, form continuously and have the inclined side that is seen as same shape from the side or the jog of curved edges, and above-mentioned jog is provided with according to the mode of seeing dip-parallel from the bottom surface in whole scope of above-mentioned bottom surface.
Fig. 1 is the front view of punch die of the present invention, Fig. 2 be α-α of Fig. 1 to view, Fig. 3 is that β-β of Fig. 1 is to view.In addition, because the goods profile 51 of the corresponding flexible printed circuit board 50A of flexible printed circuit board 50 and institute's stamping-out and Fig. 9~shape shown in Figure 11 is identical, so the explanation that repeats omission.
Shown in the image pattern 1~3 like that, punch die 11 is set above former 10, this punch die 11 descends, and stamping-out is carried out at the stamping-out position 60 of flexible printed circuit board 50A shown in Figure 11.On the bottom surface of this punch die 11, form continuously and have the inclined side that is seen as same shape from the side or the jog 12 of curved edges.In the present embodiment, above-mentioned jog 12 forms the waveform of the curved edges with same shape, and this jog 12 is provided with according to the mode of seeing dip-parallel from the bottom surface in whole scope of above-mentioned punch die bottom surface.
Shown in the image pattern 3 like that, the recess 12a that represents this jog 12 by a dotted line, represent protuberance 12b by solid line, any person among each limit 11a of the directions X (left and right directions of Fig. 3) of relative punch die 11 and each limit 11b of Y direction (above-below direction), above-mentioned recess 12a and protuberance 12b are provided with abreast with basic 45 ° angle of inclination.
Like this, see from the bottom surface by the formation direction that makes above-mentioned jog 12 parallel obliquely, relative any limit 11a, the 11b in directions X or the Y direction, the end surface shape of jog 12 (in the present embodiment, being wavy) presents equably.The angle of inclination of each limit 11a, 11b in the above-mentioned jog 12 both needn't be 45 °, also can relative 1 limit was the angle of inclination arbitrarily of 40 ° or 35 ° etc.
Fig. 4 represents that flexible printed circuit board 50A is positioned over the state on the former 10, at the parts installation portion 55 that has barrier bed 54,54 up and down, and is connected by cable portion 57 at the parts installation portion 56 that does not have barrier bed up and down.Wherein, the Outboard Sections at stamping-out position 60 constitutes waste part 61.
Fig. 5 is the key diagram of the variation of expression truncation part for the vertical view of the blank operation of explanation goods profile 51, Fig. 6.If above-mentioned punch die 11 descends, then shown in the image pattern 5 (a) like that, the protuberance 12b that is formed at the jog 12 on the bottom surface of this punch die 11 at first contacts with the parts installation portion 55 of the barrier bed with thickness maximum, the preset lines L that blocks of parts installation portion 55 presses on raised part 12b place, shown in the image pattern 6 like that, a part of L1 that blocks preset lines L is the dotted line shape to be blocked.
Follow the decline of punch die 11,, further push and block preset lines L by raised part 12b, shown in the image pattern 6 (b) like that, the truncation part L1 of dotted line shape extends according to ways of connecting, not truncation part L2 drawing crack realizes blocking.Then, shown in the image pattern 6 (c) like that, the truncation part of dotted line shape connects, and becomes to block and finishes L3.
Shown in the image pattern 5 (b) like that, if the dotted line that blocks of parts installation portion 55 connects, block and finish, then the part with cable portion 57 begins to block, and carries out blocking of dotted line shape, meanwhile, begins not have the blocking of parts installation portion 56 of barrier bed.Blocking of cable portion 57 is identical with blocking of parts installation portion 55 with blocking of parts installation portion 56, shown in the image pattern 6 (a)~(c) like that, extend according to ways of connecting between the dotted line shape truncation part L1, not truncation part L2 drawing crack and blocking.
Shown in the image pattern 5 (c) like that, cable portion 57 is by the carrying out of blocking from parts installation portion 55 sides, and is final with the carrying out of blocking from parts installation portion 56 sides, connects between the dotted line shape blocks and finishes and block.
At this moment, even because of deflection of cable portion 57 etc., block under the situation that the travel direction of L1 departs from, shown in the image pattern 6 (d) like that, the dotted line shape blocks the part of weak strength that L1 seeks the machinery of material, the not truncation part L2 drawing crack between dotted line shape truncation part is blocked, thus, departing from of the direct of travel that blocks can be absorbed, the generation of burr can be prevented.
Fig. 7 represents the size of above-mentioned jog 12, according to the experimental result of blocking, then for the degree of depth of jog 12, if the degree of depth, then can't be carried out the blocking of dotted line shape of cable portion 57 less than 0.3mm, is easy to generate burr.On the other hand, if the degree of depth is less than 0.8mm, because the height of the blade tip of punch die 11 increases, so the lifetime of punch die 11.So the degree of depth of jog 12 can be in the scope of 0.3~0.8mm.
In addition, for the spacing of jog 12, if spacing is less than 1.0mm, owing to further making the front end of the protuberance 12b of the degree of depth that should guarantee 0.3 mm be shaped as acute angle, so be difficult to guarantee the life-span of punch die 11.On the other hand,, block direction and produce and depart from, produce burr if spacing greater than 2.0mm, is then blocked when carrying out from both sides at the dotted line shape of cable portion 57.So the spacing of jog 12 can be in the scope of 1.0~2.0mm.
Fig. 8 represents the distortion example of the shape of jog 12, in Fig. 8 (a), is provided with lambdoid jog 13, in this Fig. 8 (b), the jog 14 of tiny wavy (semicircle shape) is set.In shape arbitrarily, all realize the action effect identical with aforesaid wavy jog 12.
In addition, only otherwise break away from spirit of the present invention, the present invention can carry out various changes, certainly, the present invention relates to the scheme of this change.
Claims (2)
1. punch die, this punch die is the punch die that is used for the stamping-out processing of printed circuit board (PCB), bottom surface at this punch die, form continuously and have the inclined side that is seen as same shape from the side or the jog of curved edges, and above-mentioned jog is provided with according to the mode of seeing dip-parallel from the bottom surface in whole scope of above-mentioned bottom surface.
2. punch die according to claim 1 is characterized in that above-mentioned jog is wavy.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007003545 | 2007-01-11 | ||
JP2007003545A JP4989980B2 (en) | 2007-01-11 | 2007-01-11 | Punch type |
JP2007-003545 | 2007-01-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101219546A CN101219546A (en) | 2008-07-16 |
CN101219546B true CN101219546B (en) | 2011-10-12 |
Family
ID=39629744
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007101953090A Expired - Fee Related CN101219546B (en) | 2007-01-11 | 2007-12-06 | Die |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4989980B2 (en) |
CN (1) | CN101219546B (en) |
TW (1) | TW200833197A (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5307567B2 (en) * | 2009-01-23 | 2013-10-02 | 日本メクトロン株式会社 | Punch type |
KR101588242B1 (en) * | 2009-07-13 | 2016-01-25 | 삼성전자주식회사 | Apparatus and method for scroll of a portable terminal |
CN103095349A (en) * | 2011-10-31 | 2013-05-08 | 深圳光启高等理工研究院 | Wireless router based on flexible printed circuit board |
CN102632521B (en) * | 2012-04-28 | 2015-07-01 | 成都泰格微波技术股份有限公司 | Printed board and lining board positioning and cutting tool |
JP5872506B2 (en) * | 2013-06-03 | 2016-03-01 | 株式会社京写 | Method for manufacturing printed wiring board |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0639796A (en) * | 1992-07-28 | 1994-02-15 | Ibiden Co Ltd | Punching die |
JP2639788B2 (en) * | 1994-09-08 | 1997-08-13 | 稔 若村 | Drilling method for cutting through holes in double-sided printed circuit boards |
JP3681801B2 (en) * | 1995-11-30 | 2005-08-10 | 富士写真フイルム株式会社 | Photo film punch |
JP2003300197A (en) * | 2002-04-09 | 2003-10-21 | Fujitsu Media Device Kk | Printed wiring board cutter and method of cutting printed wiring board and cutting tool for printed wiring board |
-
2007
- 2007-01-11 JP JP2007003545A patent/JP4989980B2/en not_active Expired - Fee Related
- 2007-10-31 TW TW96140962A patent/TW200833197A/en not_active IP Right Cessation
- 2007-12-06 CN CN2007101953090A patent/CN101219546B/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN101219546A (en) | 2008-07-16 |
TWI354515B (en) | 2011-12-11 |
JP2008168384A (en) | 2008-07-24 |
TW200833197A (en) | 2008-08-01 |
JP4989980B2 (en) | 2012-08-01 |
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Granted publication date: 20111012 Termination date: 20211206 |
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