CN101219430A - Watt level full solid state ultraviolet laser cleaning machine and laser cleaning method - Google Patents
Watt level full solid state ultraviolet laser cleaning machine and laser cleaning method Download PDFInfo
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- CN101219430A CN101219430A CNA2008100568527A CN200810056852A CN101219430A CN 101219430 A CN101219430 A CN 101219430A CN A2008100568527 A CNA2008100568527 A CN A2008100568527A CN 200810056852 A CN200810056852 A CN 200810056852A CN 101219430 A CN101219430 A CN 101219430A
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- 238000004140 cleaning Methods 0.000 title claims abstract description 89
- 239000007787 solid Substances 0.000 title claims abstract description 28
- 238000000034 method Methods 0.000 title claims abstract description 20
- 239000013078 crystal Substances 0.000 claims abstract description 32
- 230000003287 optical effect Effects 0.000 claims abstract description 25
- 239000000463 material Substances 0.000 claims description 8
- 230000003068 static effect Effects 0.000 claims description 8
- 230000011514 reflex Effects 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 4
- 230000009977 dual effect Effects 0.000 claims description 4
- 239000000428 dust Substances 0.000 claims description 4
- 238000009738 saturating Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 230000002045 lasting effect Effects 0.000 claims description 2
- 229910010293 ceramic material Inorganic materials 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 14
- 238000004377 microelectronic Methods 0.000 abstract description 7
- 239000011248 coating agent Substances 0.000 abstract description 5
- 238000000576 coating method Methods 0.000 abstract description 5
- 238000011109 contamination Methods 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 abstract description 4
- 239000002245 particle Substances 0.000 abstract description 4
- 238000004901 spalling Methods 0.000 abstract 1
- 238000005086 pumping Methods 0.000 description 6
- 238000003466 welding Methods 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 3
- 241000931526 Acer campestre Species 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000002000 scavenging effect Effects 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- QBLDFAIABQKINO-UHFFFAOYSA-N barium borate Chemical compound [Ba+2].[O-]B=O.[O-]B=O QBLDFAIABQKINO-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000005314 correlation function Methods 0.000 description 1
- 238000005090 crystal field Methods 0.000 description 1
- 239000011222 crystalline ceramic Substances 0.000 description 1
- 229910002106 crystalline ceramic Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 230000007096 poisonous effect Effects 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000007704 wet chemistry method Methods 0.000 description 1
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Abstract
The invention discloses a Watt-level all-solid ultraviolet laser cleaner and a laser cleaning method, which pertains to the optical energy cleaning technology field and are applied to cleaning micro electronic substrate such as the integrated circuit. The power of the cleaner is connected with a laser resonance chamber; two non-linear optical crystals, a selective microscope and a reflector are positioned in the light path of pulsed laser from the laser resonance chamber; a rotating mirror drum is fixed above one side of the reflector; a work piece to be cleaned is arranged on a convey belt; a blower is positioned at one side of the convey belt and a cleaner is arranged at the other side. By adopting the method, substrates to be cleaned can be continuously or discontinuously conveyed to go through the laser which is Watt-level pulse laser with about 266nm and comes from the all-solid laser; proper laser intensity, pulse frequency and irradiation time can be controlled to effectively remove micron and submicron particles, organics, oily contamination, etc. on the surface of the substrate. The adhesion of the coating after cleaning and the product yield rate are greatly improved and the warp or spalling of the coating rarely happens.
Description
Technical field
The invention belongs to luminous energy cleaning equipment scope, particularly a kind of Watt level full solid state ultraviolet laser cleaning machine and laser cleaning method.
Background technology
Carry out the technology that pollutant cleans with laser, start, but just really in industrial production, obtain to use up to the phase at the beginning of the nineties in last century in the middle nineteen seventies in last century.This is because of the develop rapidly along with microelectronics industry, integrated circuit, and integrated level particularly extensive, super large-scale integration is more and more higher, and is also more and more higher with the cleannes requirement of substrate to microelectronics such as silicon chips.The conventional clean technology, often powerless as machinery cleaning, wet-chemical cleaning, ultrasonic wave cleaning etc. to the removing of the contamination particle of micron, submicron order.In addition, mechanical removal methods also is easy to substrate is caused damage; Wet chemistry method can cause environmental pollution, particular job condition restriction that ultrasonic wave cleans its application in integrated circuit cleans.With these conventional clean methods by comparison, laser cleaning can effectively be removed the contamination particle, organic matter, greasy dirt of micron, submicron order etc., do not damage the workpiece that is cleaned, environment is not polluted, efficient height, cost are low, safe and reliable, do not damage operating personnel's health, realize cleaning automation control or the like easily.
The laser instrument that has been applied at present microelectronic substrates cleanings such as integrated circuit, LCD wiring board mainly contains excimer laser, CO
2Laser instrument and Nd:YAG laser instrument etc.Because Wavelength of Laser is short more, photon energy is high more, the corresponding cleaning ability is strong more, cleaning performance is good more, so the wavelength of the laser instrument that is used to clean is also shorter and shorter, excimer laser with activation output high-power (watt more than the level), ultraviolet (248nm), deep ultraviolet (193nm, 157nm) laser has obtained to use widely in microelectronic substrate cleaning field.But excimer laser has following shortcoming:
1. cost an arm and a leg, the excimer laser of an output 193nm, the price of Cymer Laser company is 600,000 dollars; 2. maintenance cost height, annual about 250,000 dollars; 3. the life-span lacks, and every work 28 hours will be changed one action gas; 4. repetition rate is low, and maximum operating frequency is 1kHz (a Cymer Laser company product); 5. working gas is poisonous, contaminated environment; 6. electro-optical efficiency is low; 7. physical dimension is big.
So, adopt excimer laser to clean, not only with high costs, use trouble, and contaminated environment.By comparison, be that all solid state laser of representative has following advantage with Nd:YAG:
1. cheap, general every laser instrument is no more than 60,000 dollars; Life-span long, the service life of pumping lamp can be greater than 300 hours, the LD pumping can be greater than 5000 hours; 3. standing charges are low, are less than 6,000 dollars the every year of lamp pump; Be less than 5,000 dollars the every year of LD pumping; 4. repetition rate height: generally at 1Hz～100kHz, the reached megahertz level that has; 5. spectral line width is very narrow; 6. can turn round also exportable nanosecond, psec, femtosecond pulse, dependable performance by continuous wave; 7. environment is not caused any pollution; 8 physical dimensions are little, are easy to and other system in combination.
Although all solid state lasers such as Nd:YAG have numerous advantages, very do not favored in the laser cleaning field before this, this be because the output wavelength of this type of laser instrument mostly at infrared band.By using nonlinear optical crystal to carry out frequency conversion, though can obtain the laser output of ultraviolet band, the ultraviolet light power output seldom surpasses 1 watt, for example uses barium metaborate (β-BaB
2O
4, being called for short BBO) and crystal makes the quadruple of the 1064nm laser of Nd:YAG laser instrument output, can obtain the Ultra-Violet Laser of 266nm.But because bbo crystal is easy to generate light and sells off damage under Ultra-Violet Laser irradiation, if its mean power of 266nm laser of exporting after the quadruple surpasses 300mW, bbo crystal will be destroyed.Because the Ultra-Violet Laser of output watt below the level, makes all solid state laser such as Nd:YAG be subjected to very big restriction in the application that high-accuracy microelectronic substrate cleans the field.
Recently, we have prepared novel nonlinear optical crystal CLBO (CsLiB
6O
10, be called for short CLBO), the 1064nm laser of the Nd:YAG laser instrument being exported with this crystal carries out quadruple, has obtained the 266nm Ultra-Violet Laser output of 28W; Under this background, we have finished the present invention, develop a watt level ultraviolet laser cleaning machine.Some other new ultra-violet nonlinear optical crystal of developing at present also might be used for the laser frequency conversion of provided by the invention watt of level ultraviolet laser cleaning machine.
Summary of the invention
The purpose of this invention is to provide a kind of Watt level full solid state ultraviolet laser cleaning machine and Ultra-Violet Laser cleaning method.Described laser cleaning machine is made up of ultraviolet laser, laser scanning system and dirt removal device three parts, it is characterized in that, the power supply 1 of described laser cleaning machine connects laser resonator 2, on the light path of the pulse laser 3 that laser resonator 2 is sent, two frequency multiplication nonlinear optical crystals 4, quadruple nonlinear optical crystal 6 and gating mirror 8 and speculum 10 are set; The side upper fixed one tilting mirror drum 13 of speculum 10 is placed on the conveyer belt 12 below speculum 10 and tilting mirror drum 13 and is washed workpiece 11; One of conveyer belt 12 is sidelong and is put hair-dryer 16, and opposite side is placed dust catcher 17.
Described tilting mirror drum 13 is formed cydariform by N face scanning mirror, rotational angular velocity is the ω radian per second, tilting mirror drum rotates and the corresponding central angle φ of minute surface=2 a π/N, and required time τ=2 π/N ω second is one side promptly scan the another side required time from conveyer belt 12.
The laser generation method of this kind full solid state ultraviolet laser cleaning machine comprises following step:
Described static rinse is that the pure quadruple frequency light 9 of watt level reflexes on a certain minute surface of tilting mirror drum 11 through speculum 10, the angle of adjusting minute surface makes the surface of the vertical irradiation of its reflection luminous energy to the workpiece to be cleaned 13 that places conveyer belt 12, after treating the required time of the lasting one section cleaning of irradiation, make conveyer belt 12 transmit the distance suitable with workpiece size to be cleaned, so that the workpiece that will clean shifts out, simultaneously also next part workpiece to be cleaned is moved to laser irradiation region, carry out laser irradiation and clean.This kind cleaning method is applicable to that workpiece size to be cleaned is littler than laser spot diameter, the workpiece that quantity is few, and conveyer belt 12 is stepping ground break transfer, because the tilting mirror drum does not rotate, so be called static rinse;
Described dynamic cleaning, if the size of workpiece to be cleaned is bigger than laser facula, or the workpiece enormous amount, then need rotate the tilting mirror drum, laser beam is scanned on workpiece, the whole irradiation of all surface of the works to be cleaned are arrived, to clean; Pure quadruple frequency light 9 reflexes to certain a pair of adjacent mirror facets I of tilting mirror drum 11 and the intersection A place between the II through speculum 10, in this position, as long as tilting mirror drum 11 rotates a small angle along clockwise direction, minute surface II is immediately with pure quadruple frequency light 9 reflections, folded light beam 14 is to the position B of conveyer belt 12, tilting mirror drum 11 continues to rotate along clockwise direction, when minute surface II forwards position near minute surface I to, at this moment folded light beam 15, irradiation is to the position C of conveyer belt 12, if the central angle φ=2 π/N of a minute surface correspondence of tilting mirror drum 11, N are the minute surface number, the value of N is by the diameter of tilting mirror drum, the tilting mirror drum is apart from the distance of conveyer belt and the width decision of conveyer belt; The N span is 10～100, and then the moving φ angle of tilting mirror drum revolution this moment promptly turns over a minute surface, and laser beam is just swept to the C end from the B end of conveyer belt 12, workpiece 13 is carried out irradiation clean; Therefore need the power of pure quadruple frequency light 9 enough big, the power density that spot diameter increases back laser is still enough big, and laser is shorter in the time that surface of the work to be cleaned stops, and in this case, conveyer belt also can certain speed transmit continuously.This kind needs tilting mirror drum rotates, and the cleaning that laser beam is scanned is called dynamic cleaning.
During cleaning that described laser beam scans, the spot size of pure quadruple frequency light 9 is in a centimetre magnitude, and will stop the second-time time when the irradiation workpiece cleans, and conveyer belt 12 is rotatably assorted down for the stepping break transfer or at the tilting mirror drum.Conveyer belt transmits continuously with certain speed.
Described tilting mirror drum 11 is formed cydariform by N face scanning mirror, rotational angular velocity is the ω radian per second, tilting mirror drum rotates and the corresponding central angle φ of minute surface=2 a π/N, and required time τ=2 π/N ω second is one side promptly clean the required time from the another side that scans of conveyer belt 12 to workpiece 13.
The grit dirt that described cleaning workpiece cleans out is blown afloat by hair-dryer 16, is got rid of by dust catcher 17 inspirations, thereby reaches not only cleaning workpiece but also protect the dual purpose of environment.
Beneficial effect of the present invention is: 1. cheap, general every laser instrument is no more than 60,000 dollars; Life-span long, the service life of pumping lamp can be greater than 300 hours, the LD pumping can be greater than 5000 hours; 3. standing charges are low, are less than 6,000 dollars the every year of lamp pump; Be less than 5,000 dollars the every year of LD pumping; 4. repetition rate height: generally at 1Hz～100kHz, the reached megahertz level that has; 5. spectral line width is very narrow; 6. can turn round also exportable nanosecond, psec, femtosecond pulse, dependable performance by continuous wave; 7. can effectively remove the contamination particle of micron, submicron order; 8. environment is not caused any pollution; 9. physical dimension is little, is easy to and other system in combination.10. clean back coating adhesion height, and the phenomenon that the coating warpage is seldom arranged, peel off, finished product rate height.
Description of drawings
Fig. 1 is the ultra-violet laser source structured flowchart.Fig. 1 illustrates the Ultra-Violet Laser block diagram that this laser cleaning machine is used:
Fig. 2 is the scanning theory and the contaminant exclusion allocation plan of dynamic laser cleaning machine.
Fig. 3 is laser beam scanning area schematic diagram on the conveyer belt that transmits continuously
The specific embodiment
The invention provides a kind of Watt level full solid state ultraviolet laser cleaning machine and Ultra-Violet Laser cleaning method; The structure of full solid state ultraviolet laser cleaning machine as shown in Figure 1 and Figure 2.Below in conjunction with accompanying drawing and practical example, laser cleaning machine structure provided by the invention and cleaning method are specifically described.
As shown in Figure 1, the semiconductor laser diode in the current excitation laser resonator 2 that is provided by power supply 1, the pump light that laser diode sends are absorbed the back by laser medium and produce laser generation.Laser medium can be the Nd:YAG monocrystalline, also can be Nd:YVO
4, laser crystal such as Nd:YLF; Can be the Nd:YAG crystalline ceramics, also can be other laser crystal or the transparent laser ceramic that can launch high-power nearly 1064nm laser.The laser that produces in the laser cavity 2 becomes pulse laser 3 outputs after the electric light of high repetition frequency or acousto-optic Q-switching or passive Q-adjusted switch modulation, carry out two frequencys multiplication by two frequency multiplication nonlinear optical crystals 4.Two frequency doubled lights 5 of outgoing carry out quadruple by quadruple nonlinear optical crystal 6, obtain the Ultra-Violet Laser 7 of nearly 266nm.(because different laser hosts have different crystal fields, so same active ions emitted laser wavelength in different substrates is slightly different.For example in Nd:YAG, the optical maser wavelength of Nd emission of ions is 1064nm, and in Nd:YLF, the optical maser wavelength of Nd emission of ions is 1053nm.So the ultraviolet wavelength after the quadruple is also incomplete same, but nearly 266nm, its scope is 260～270nm.) outgoing Ultra-Violet Laser 7 by to fundamental frequency light and two frequency doubled lights high anti-, to behind the high saturating gating mirror 8 of quadruple frequency light, obtain the pure quadruple frequency light 9 of watt level of the nearly 266nm of the pure quadruple of watt level, laser power density is greater than 1W/cm
2
The used nonlinear optical crystal of two frequencys multiplication is crystal such as KTP, LBO or BBO, or other can be used as the nonlinear optical material of high-power two frequencys multiplication, and the used nonlinear optical crystal of quadruple is that CLBO or other can be made watt nonlinear optical crystal of level quadruple.Pure laser of quadruple 9 reflexes to watt level pulse laser on a certain minute surface of tilting mirror drum 11 through speculum 10, adjusts the angle of minute surface, makes the surface of the vertical irradiation of its reflection luminous energy to the workpiece to be cleaned 13 that places conveyer belt 12, can carry out required cleaning.Here the said high electro-optical Q-switch that repeats is made by high-performance electro-optic crystal KTP, and the half-wave voltage of this Q-switch is lower than electrooptical switchinges such as KDP, LN, no ringing effect, and repetition rate can surpass MHz.Certainly, electro-optical Q-switch or acousto-optic Q-switching or passive Q-adjusted switch with electro-optic crystals such as LN, KDP are made also can be used for accent Q of the present invention, only poor-performing.
If the workpiece quantity of need cleaning is few, area to be cleaned is less than the laser facula area, can allow 11 stalls of tilting mirror drum, and its 266nm laser emission is nearly cleaned to workpiece 13 to be cleaned.Cleaned workpiece can shift out cleaning positions by hand, changes workpiece to be cleaned; Also can allow conveyer belt 12 shift out cleaned workpiece, and workpiece to be cleaned is moved on to cleaning positions by part.This Work conveyance system is made of conveyer belt and adjustable speed motor.This induction system stops to carry a period of time, and then continues to carry, so repeatedly constantly running after can certain speed carrying a segment distance (for example transmitting the distance that is equivalent to a workpiece size in 1/10 second); And cleaned workpiece is transported to next process.The cleaning that this class tilting mirror drum does not rotate is a static rinse.
If need the number pieces of cleaning huge, the workpiece area that maybe need clean is big more a lot of than laser facula, then must allow laser beam scan.Conveyer belt is the break transfer workpiece as previously mentioned, also conveying work pieces continuously.If the tilting mirror drum rotates with the angular speed of ω (radian per second), the diameter of laser beam spot 18 is D centimetre [seeing (18) among Fig. 3], during the conveyer belt transfer rate V=N ω D/2 π (cel) that then transmits continuously, can guarantee that the scanning of laser beam on workpiece neither repeats, also not drain sweep, as shown in Figure 3.The cleaning that this tilting mirror drum rotates is dynamically to clean.
Only lift the nearly 266nm Ultra-Violet Laser of of the present invention watt of level of several usefulness below microelectronic workpiece is carried out the practical routine of static rinse.
Practical example one
Make the 266nm laser of the Nd:YAG all solid state laser output 1W of quadruple with CLBO, pulse recurrence frequency is 20.3Hz, and spot diameter is 0.8cm, and 2,000 MH06LED substrates are cleaned; Cleaning condition is: constant-temperature constant-humidity environment (25 ℃, 65%), ten thousand grades of clean rooms, every element scavenging period 1.2 seconds.On the substrate after the cleaning, carry out the solid crystalline substance of led chip, and carry out gold ball bonding and connect.Compare with the substrate without laser cleaning, the solid brilliant shear strength of led chip of cleaning the back welding has improved 80%, and the welding pulling force has improved 120%, and the finished product rate exceeds 38%.
Practical example two
Make the 266nm laser of the Nd:YAG all solid state laser output 1W of quadruple with CLBO, pulse recurrence frequency is 20.3Hz, spot diameter is 0.8cm, to 26 " the used aluminum base PCB plate of LED-backlit module used of liquid crystal display; before the electronic component welding, carry out cleaning treatment; mainly clean the gold plated pads on the aluminum base PCB plate, 2000 pads are arranged on the every pcb board approximately.Cleaning condition is: constant-temperature constant-humidity environment (25 ℃, 65%), ten thousand grades of clean rooms, every pad scavenging period 1.5 seconds.。With carrying out reflow soldering process on the pcb board after cleaning, led light source and correlation function element are welded on the pcb board.Compare with the pcb board without laser cleaning, the element weld strength of cleaning the back welding improves greatly, improves approximately 80%, and the ratio of element welding failure reduced approximately 90%, reduced product and repaired link, improved reliability of products greatly.
Practical example three
Make the 266nm laser of the Nd:YAG all solid state laser output 1W of quadruple with CLBO, pulse recurrence frequency is 20.3Hz, spot diameter is 0.8cm, ceramic substrate to integrated encapsulated LED light source cleans, this ceramic substrate is the AlN material, the thermal conductivity factor height, and on AlN the plating silver layer as electric path and pad.With laser AlN sheet material is cleaned before the plating silver layer, cleaning condition is: constant-temperature constant-humidity environment (25 ℃, 65%), and ten thousand grades of clean rooms, scanning is cleaned to sheet material.On the AlN sheet material after the cleaning, carry out the plating of silver slurry.Compare with the sheet material without laser cleaning, the silver layer adhesive force that cleans the back plating has improved 120%, and the phenomenon that the coating warpage is seldom arranged, peel off, and the finished product rate exceeds more than 40%.
Only the present invention will be described for above-mentioned practical example, and the present invention is not construed as limiting.
Claims (10)
1. Watt level full solid state ultraviolet laser cleaning machine, described laser cleaning machine is made up of ultraviolet laser, laser scanning system and dirt removal device three parts, it is characterized in that, the power supply of described laser cleaning machine (1) connects laser resonator (2), on the light path of the pulse laser (3) that laser resonator (2) is sent, two frequency multiplication nonlinear optical crystals (4), quadruple nonlinear optical crystal (6) and gating mirror (8) and speculum (10) are set; The side upper fixed one tilting mirror drum (11) of speculum (10), the conveyer belt (12) below speculum (10) and tilting mirror drum (11) are gone up to place and are washed workpiece (13); One of conveyer belt (12) is sidelong and is put hair-dryer (16), and opposite side is placed dust catcher (17).
2. according to the described Watt level full solid state ultraviolet laser cleaning machine of claim 1, it is characterized in that, described tilting mirror drum (11) is formed cydariform by N face scanning mirror, rotational angular velocity is the ω radian per second, the tilting mirror drum rotates and the corresponding central angle φ of minute surface=2 a π/N, required time τ=2 π/N ω second, promptly from conveyer belt (12) one side the another side that scans workpiece (13) is cleaned the required time.
3. according to the described Watt level full solid state ultraviolet laser cleaning machine of claim 1, it is characterized in that the laser of described full solid state ultraviolet laser cleaning machine is produced as:
Power supply (1) offers laser resonator (2) exciting current, semiconductor laser diode in the exciting laser resonant cavity (2), the pump light that laser diode sends is absorbed the back by laser medium and produces laser generation, the laser that produces in the laser cavity (2) becomes pulse laser (3) output after the electric light of high repetition frequency or acousto-optic Q-switching modulation, the pulse laser (3) of output carries out two frequencys multiplication by two frequency multiplication nonlinear optical crystals (4), two frequency doubled lights (5) of outgoing carry out quadruple by quadruple nonlinear optical crystal (6), obtain the Ultra-Violet Laser (7) of 266nm; Ultra-Violet Laser (7) by high anti-to two frequency doubled lights (5), to behind the high saturating gating mirror (8) of quadruple frequency light (7), obtain the pure quadruple frequency light of watt level (9), laser power density is greater than 1W/cm
2
4. according to the described Watt level full solid state ultraviolet laser cleaning machine of claim 1, it is characterized in that, the Ultra-Violet Laser of the nearly 266nm of described acquisition quadruple, its wave-length coverage is 260nm～270nm.
5. according to the described Watt level full solid state ultraviolet laser cleaning machine of claim 1, it is characterized in that the laser medium of described all-solid-state ultraviolet laser is Nd:YAG, Nd:YVO
4Or Nd:YLF laser crystal; Or the Nd:YAG transparent laser ceramic, and other can launch the laser crystal or the transparent laser ceramic material of high-power nearly 1064nm laser.
6. according to the described Watt level full solid state ultraviolet laser cleaning machine of claim 1, it is characterized in that the Q-switch of described high repetition frequency is an acousto-optic Q-switching, or electro-optical Q-switch of making by electro-optic crystals such as KDP, LN, KTP or passive Q-adjusted Q-switch.
7. according to the described Watt level full solid state ultraviolet laser cleaning machine of claim 1, it is characterized in that described two frequency multiplication nonlinear optical crystals can be that KTP, LBO, bbo crystal or other can be made the nonlinear optical material of high-power two frequencys multiplication; The quadruple nonlinear optical crystal is that CLBO and other can be made watt nonlinear optical material of level quadruple.
8. the cleaning method of a Watt level full solid state ultraviolet laser cleaning machine is characterized in that, the cleaning method of described laser cleaning machine comprises static rinse and dynamically cleans dual mode:
Described static rinse is that the pure quadruple frequency light of watt level (9) reflexes on a certain minute surface of tilting mirror drum (11) through speculum (10), the angle of adjusting minute surface makes the surface of the vertical irradiation of its reflection luminous energy to the workpiece to be cleaned (13) that places conveyer belt (12), after treating the required time of the lasting one section cleaning of irradiation, make conveyer belt (12) transmit the distance suitable with workpiece size to be cleaned, so that the workpiece that will clean shifts out, simultaneously also next part workpiece to be cleaned is moved to laser irradiation region, carry out laser irradiation and clean.This kind cleaning method is applicable to that workpiece size to be cleaned is littler than laser spot diameter, the workpiece that quantity is few, and conveyer belt (12) is stepping ground break transfer, because the tilting mirror drum does not rotate, so be called static rinse;
Described dynamic cleaning, if the size of workpiece to be cleaned is bigger than laser facula, or the workpiece enormous amount, then need rotate the tilting mirror drum, laser beam is scanned on workpiece, the whole irradiation of all surface of the works to be cleaned are arrived, to clean; Pure quadruple frequency light (9) reflexes to certain a pair of adjacent mirror facets I of tilting mirror drum (11) and the intersection A place between the II through speculum (10), in this position, as long as tilting mirror drum (11) rotates a small angle along clockwise direction, minute surface II is immediately with pure quadruple frequency light 9 reflections, folded light beam (14) is to the position B of conveyer belt (12), tilting mirror drum (11) continues to rotate along clockwise direction, when minute surface II forwards position near minute surface I to, at this moment folded light beam (15), irradiation is to conveyer belt (12 position C, if the central angle φ=2 π/N of a minute surface correspondence of tilting mirror drum (11), N is the minute surface number, and the value of N is by the diameter of tilting mirror drum, the tilting mirror drum is apart from the distance of conveyer belt and the width decision of conveyer belt; Then the moving φ angle of tilting mirror drum revolution this moment promptly turns over a minute surface, and laser beam is just swept to the C end from the B end of conveyer belt (12), workpiece (13) is carried out irradiation clean; Therefore need the power of pure quadruple frequency light (9) enough big, the power density that spot diameter increases back laser is still enough big, and laser is shorter in the time that surface of the work to be cleaned stops, and in this case, conveyer belt transmits continuously with certain speed.This kind needs tilting mirror drum rotates, and the cleaning that laser beam is scanned is called dynamic cleaning; The continuous conveying work pieces of speed of the transfer rate V=N ω D/2 π (cel) of described conveyer belt.
9. the cleaning method of described Watt level full solid state ultraviolet laser cleaning machine according to Claim 8 is characterized in that, the minute surface number N of described composition tilting mirror drum (11), and along with the difference of tilting mirror drum diameter, but value is between 10～100.
10. the cleaning method of described Watt level full solid state ultraviolet laser cleaning machine according to Claim 8; it is characterized in that; the grit dirt that described cleaning workpiece cleans out is blown afloat by hair-dryer (16), is got rid of by dust catcher (17) inspiration, thereby reaches not only cleaning workpiece but also protect the dual purpose of environment.
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| CN (1) | CN101219430B (en) |
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| CN101574697B (en) * | 2009-06-15 | 2010-10-13 | 长春理工大学 | Portable all solid state dual wavelength laser cleaner |
| CN102218415A (en) * | 2011-03-10 | 2011-10-19 | 大连理工大学 | Method and device for cleaning tokamak first mirror by vacuum ultraviolet laser |
| CN102430547A (en) * | 2011-11-07 | 2012-05-02 | 中国科学院长春光学精密机械与物理研究所 | Deep ultraviolet optical film processing device |
| CN103111441A (en) * | 2013-02-07 | 2013-05-22 | 东南大学 | Device and method for cleaning partial pollutant on surfaces of clean materials |
| CN104043617A (en) * | 2014-05-19 | 2014-09-17 | 南京南车浦镇城轨车辆有限责任公司 | Laser cleaning equipment for oil stain on metallic surface |
| CN104175000A (en) * | 2014-08-26 | 2014-12-03 | 江苏大学 | Annular laser band deruster |
| CN105195468A (en) * | 2014-06-25 | 2015-12-30 | 核工业西南物理研究院 | Method and device for online cleaning and detection of first lens of fusion device |
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| CN108672413A (en) * | 2018-08-01 | 2018-10-19 | 中山普宏光电科技有限公司 | A kind of excimer laser intelligence cleaning equipment |
| CN109671616A (en) * | 2018-02-28 | 2019-04-23 | 江苏大学 | A kind of method of laser cleaning silicon wafer or lens surface particle |
| TWI664042B (en) * | 2016-02-15 | 2019-07-01 | 南韓商Ｅｏ科技股份有限公司 | Laser soldering repair process, laser soldering process and laser soldering system |
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| CN101574697B (en) * | 2009-06-15 | 2010-10-13 | 长春理工大学 | Portable all solid state dual wavelength laser cleaner |
| CN102218415A (en) * | 2011-03-10 | 2011-10-19 | 大连理工大学 | Method and device for cleaning tokamak first mirror by vacuum ultraviolet laser |
| CN102218415B (en) * | 2011-03-10 | 2014-10-22 | 大连理工大学 | Method and device for cleaning tokamak first mirror by vacuum ultraviolet laser |
| CN102430547A (en) * | 2011-11-07 | 2012-05-02 | 中国科学院长春光学精密机械与物理研究所 | Deep ultraviolet optical film processing device |
| CN103111441A (en) * | 2013-02-07 | 2013-05-22 | 东南大学 | Device and method for cleaning partial pollutant on surfaces of clean materials |
| CN103111441B (en) * | 2013-02-07 | 2015-01-28 | 东南大学 | Device and method for cleaning partial pollutant on surfaces of clean materials |
| CN104043617A (en) * | 2014-05-19 | 2014-09-17 | 南京南车浦镇城轨车辆有限责任公司 | Laser cleaning equipment for oil stain on metallic surface |
| CN105195468B (en) * | 2014-06-25 | 2017-08-18 | 核工业西南物理研究院 | A kind of method and apparatus of on-line cleaning and the detection mirror of fusion facility first |
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| CN104175000A (en) * | 2014-08-26 | 2014-12-03 | 江苏大学 | Annular laser band deruster |
| CN104175000B (en) * | 2014-08-26 | 2016-06-08 | 江苏大学 | A kind of loop laser band rust remover |
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| TWI664042B (en) * | 2016-02-15 | 2019-07-01 | 南韓商Ｅｏ科技股份有限公司 | Laser soldering repair process, laser soldering process and laser soldering system |
| CN107252797B (en) * | 2017-06-13 | 2019-05-24 | 苏州菲镭泰克激光技术有限公司 | Wide focal regions laser cleaning method and device |
| CN107252797A (en) * | 2017-06-13 | 2017-10-17 | 苏州菲镭泰克激光技术有限公司 | Wide focal regions laser cleaning method and device |
| CN107199251A (en) * | 2017-07-06 | 2017-09-26 | 武汉翔明激光科技有限公司 | A kind of laser cleaner |
| CN107199251B (en) * | 2017-07-06 | 2019-09-03 | 武汉翔明激光科技有限公司 | A kind of laser cleaner |
| CN109671616A (en) * | 2018-02-28 | 2019-04-23 | 江苏大学 | A kind of method of laser cleaning silicon wafer or lens surface particle |
| CN108672413A (en) * | 2018-08-01 | 2018-10-19 | 中山普宏光电科技有限公司 | A kind of excimer laser intelligence cleaning equipment |
| CN110153106A (en) * | 2019-04-29 | 2019-08-23 | 苏州创鑫激光科技有限公司 | A kind of laser cleaning system and cleaning method |
| CN110153106B (en) * | 2019-04-29 | 2024-02-13 | 苏州创鑫激光科技有限公司 | Laser cleaning system and cleaning method |
| CN113441479A (en) * | 2020-03-25 | 2021-09-28 | 中移(上海)信息通信科技有限公司 | Laser cleaning device and equipment |
| CN111842287A (en) * | 2020-07-07 | 2020-10-30 | 山东大学 | Non-contact positioning device for jet cleaning, cleaning system and method |
| CN113172048A (en) * | 2021-04-28 | 2021-07-27 | 浙江工业大学 | Method and device for synchronously detecting removal of pulse laser induced shock wave particles |
| CN114260582A (en) * | 2021-12-30 | 2022-04-01 | 南京泽尼克激光技术有限公司 | Laser inner carving machine with slippage-resistant and dislocation-resistant feeding workbench and method |
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