CN101214585A - Lead-free solder and preparation thereof - Google Patents
Lead-free solder and preparation thereof Download PDFInfo
- Publication number
- CN101214585A CN101214585A CNA2007103014928A CN200710301492A CN101214585A CN 101214585 A CN101214585 A CN 101214585A CN A2007103014928 A CNA2007103014928 A CN A2007103014928A CN 200710301492 A CN200710301492 A CN 200710301492A CN 101214585 A CN101214585 A CN 101214585A
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- Prior art keywords
- lead
- free solder
- preparation
- silver
- copper
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Abstract
The invention discloses a lead-free solder and preparation method which is mainly characiterized in that the invention adds a zinc element on the basis of silver-copper-stannum alloy and put into a furnace for smelting according to a weight percentage of metal raw materials. The lead-free solder of the invention can be prepared by melting to cast. Various physical forms of the invention can be obtained, such as blocks, rods, bars, balls, wires, pastes, etc., through a known general production method in the prior art. The invention can get a lead-free solder with the advantages of low melting point, excellent extending performance and environmental protection and provides an excellent welding material for electronic assembly and sealing as well as the welding processing like electrical equipments and communication equipments.
Description
Affiliated technical field:
The present invention relates to electronic material and electronics preparing technical field, specifically be suitable for a kind of lead-free solder of welding such as electronics assembling and encapsulation and electric equipment, Communication Equipment and preparation method thereof.
Background technology:
Tin-lead solder is with its excellent performance and cheap cost, become the important welding material in the current electronics assembling welding, but the harm that lead and compound thereof bring human habitat and safety makes countries in the world more and more sternly go through the legislation of restriction solder containing pb.Therefore the demand to the environment-friendly materials that can substitute solder containing pb is growing in the electronics industry, and the knowledge hierarchy of aspects such as lead-free solder tissue, performance, composition, equipment is set up in the unleaded an urgent demand of scolder.
The research work of relevant lead-free solder in recent years makes much progress, and has produced multiple series lead-free solder.Comprising the silver-bearing copper ashbury metal, although approach leypewter on the silver-bearing copper ashbury metal performance in many aspects, but still there are many deficiencies, the spreading property of metals such as copper, gap filling performance is relatively poor, and fusing point is higher, and the silver-bearing copper ashbury metal is easy to produce the low melting point eutectic composition, make it in later stage military service process, the intermetallic compounds layer of solder and wiring board copper can generate gradually in the solder joint.Because the fragility essence of intermetallic compound, the reliability of meeting severe exacerbation Joint Strength and weldering, therefore need generation by the intermetallic compounds layer that suppresses interior soft soldering alloy of solder joint and wiring board copper, thus indirect lifting Joint Strength and welding spot reliability.
Summary of the invention:
The objective of the invention is to for outside the shortcoming that overcomes above-mentioned prior art and the deficiency and provide a kind of and have that fusing point is low, spreading property is good, the lead-free solder of environmental protection, be welding processing such as electronics assembling and encapsulation and electric equipment, Communication Equipment, the wlding material of high-quality is provided.
Purpose of the present invention can be reached by following measure:
A kind of lead-free solder and preparation method thereof mainly is to add the zinc element on silver-bearing copper ashbury metal basis, according to the percentage by weight of raw metal, puts into stove and smelts, and the fusing casting promptly makes lead-free solder of the present invention.
Described raw metal percentage by weight is:
Silver: 0.25%-0.4%
Copper: 0.6%-1.0%
Zinc: 0.2%-1.0%
Phosphorus: 0.01%
Tin: surplus.
The present invention can access that a kind of fusing point is low, spreading property is good, the lead-free solder of environmental protection, be welding processing such as electronics assembling and encapsulation and electric equipment, Communication Equipment, the welding material of high-quality is provided, various physical aspects that obtain such as piece, rod, bar, ball, silk, cream etc., can conveniently carry out multiple welder's skill, as wave-soldering, manual welding etc., satisfy multiple needs.
The specific embodiment:
The preparation method of this lead-free solder can realize by following prescription:
Embodiment 1:
The percentage by weight of each raw material:
Silver: 0.25%
Copper: 0.65%
Zinc: 1.0%
Phosphorus: 0.01%
Tin: surplus
Put into stove and smelt, the fusing casting promptly makes lead-free solder of the present invention.
Embodiment 2:
The percentage by weight of each raw material:
Silver: 0.3%
Copper: 0.7%
Zinc: 0.8%
Phosphorus: 0.01%
Tin: surplus
Put into stove and smelt, the fusing casting promptly makes lead-free solder of the present invention.
Embodiment 3:
The percentage by weight of each raw material:
Silver: 0.35%
Copper: 0.75%
Zinc: 0.7%
Phosphorus: 0.01%
Tin: surplus
Put into stove and smelt, the fusing casting promptly makes lead-free solder of the present invention.
Embodiment 4:
The percentage by weight of each raw material:
Silver: 0.4%
Copper: 0.8%
Zinc: 0.5%
Phosphorus: 0.01%
Tin: surplus
Put into stove and smelt, the fusing casting promptly makes lead-free solder of the present invention.
Make all right various physical aspect productions of the lead-free solder that comes by this method, as piece, rod, bar, ball, silk, paste etc., its preparation method is a prior art, so do not give unnecessary details.
Claims (6)
1. lead-free solder and preparation method thereof is characterized in that: add the zinc element on silver-bearing copper ashbury metal basis, according to the percentage by weight of raw metal, put into stove and smelt, melt casting and promptly make lead-free solder of the present invention.
2. a kind of lead-free solder according to claim 1 and preparation method thereof, it is characterized in that: described raw metal percentage by weight is:
Silver: 0.25%-0.4%
Copper: 0.6%-1.0%
Zinc: 0.2%-1.0%
Phosphorus: 0.01%
Tin: surplus.
3. a kind of lead-free solder according to claim 1 and 2 and preparation method thereof, it is characterized in that: described raw metal percentage by weight is:
Silver: 0.25%
Copper: 0.65%
Zinc: 1.0%
Phosphorus: 0.01%
Tin: surplus.
4. a kind of lead-free solder according to claim 1 and 2 and preparation method thereof, it is characterized in that: described raw metal percentage by weight is:
Silver: 0.3%
Copper: 0.7%
Zinc: 0.8%
Phosphorus: 0.01%
Tin: surplus.
5. a kind of lead-free solder according to claim 1 and 2 and preparation method thereof, it is characterized in that: described raw metal percentage by weight is:
Silver: 0.35%
Copper: 0.75%
Zinc: 0.7%
Phosphorus: 0.01%
Tin: surplus.
6. a kind of lead-free solder according to claim 1 and 2 and preparation method thereof, it is characterized in that: described raw metal percentage by weight is:
Silver: 0.4%
Copper: 0.8%
Zinc: 0.5%
Phosphorus: 0.01%
Tin: surplus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007103014928A CN101214585A (en) | 2007-12-28 | 2007-12-28 | Lead-free solder and preparation thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007103014928A CN101214585A (en) | 2007-12-28 | 2007-12-28 | Lead-free solder and preparation thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101214585A true CN101214585A (en) | 2008-07-09 |
Family
ID=39621125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007103014928A Pending CN101214585A (en) | 2007-12-28 | 2007-12-28 | Lead-free solder and preparation thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101214585A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108115305A (en) * | 2017-12-18 | 2018-06-05 | 苏州铜宝锐新材料有限公司 | A kind of low melting point brazing material |
| CN108115311A (en) * | 2017-12-18 | 2018-06-05 | 苏州铜宝锐新材料有限公司 | A kind of preparation method of low melting point brazing material |
-
2007
- 2007-12-28 CN CNA2007103014928A patent/CN101214585A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108115305A (en) * | 2017-12-18 | 2018-06-05 | 苏州铜宝锐新材料有限公司 | A kind of low melting point brazing material |
| CN108115311A (en) * | 2017-12-18 | 2018-06-05 | 苏州铜宝锐新材料有限公司 | A kind of preparation method of low melting point brazing material |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20080709 |