CN101212860A - 电磁能隙结构及具该电磁能隙结构的多层印刷电路板 - Google Patents
电磁能隙结构及具该电磁能隙结构的多层印刷电路板 Download PDFInfo
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- CN101212860A CN101212860A CNA2006101563610A CN200610156361A CN101212860A CN 101212860 A CN101212860 A CN 101212860A CN A2006101563610 A CNA2006101563610 A CN A2006101563610A CN 200610156361 A CN200610156361 A CN 200610156361A CN 101212860 A CN101212860 A CN 101212860A
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- conductive area
- electromagnetic energy
- energy gap
- gap structure
- circuit board
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- 238000010276 construction Methods 0.000 claims description 4
- 230000000452 restraining effect Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 11
- 238000010586 diagram Methods 0.000 description 8
- 238000004088 simulation Methods 0.000 description 6
- 230000005764 inhibitory process Effects 0.000 description 3
- 230000001939 inductive effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 235000002017 Zea mays subsp mays Nutrition 0.000 description 1
- 241000482268 Zea mays subsp. mays Species 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
类型 | 中心频率(GHz) | 尺寸(mm) | 缩小尺寸(%) | 连通柱直径(mm) | 连通柱高度(mm) | FBW |
矩形 | 2.3 | 12×12 | - | 0.8 | 0.77 | 58.8% |
N=1 | 2.3 | 7.2×7.2 | 40% | 0.8 | 0.77 | 38.5% |
N=2 | 2.3 | 3.6×3.6 | 70% | 0.8 | 0.77 | 31.6% |
Claims (12)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2006101563610A CN101212860B (zh) | 2006-12-29 | 2006-12-29 | 电磁能隙结构及具该电磁能隙结构的多层印刷电路板 |
Applications Claiming Priority (1)
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CN2006101563610A CN101212860B (zh) | 2006-12-29 | 2006-12-29 | 电磁能隙结构及具该电磁能隙结构的多层印刷电路板 |
Publications (2)
Publication Number | Publication Date |
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CN101212860A true CN101212860A (zh) | 2008-07-02 |
CN101212860B CN101212860B (zh) | 2010-04-07 |
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CN2006101563610A Expired - Fee Related CN101212860B (zh) | 2006-12-29 | 2006-12-29 | 电磁能隙结构及具该电磁能隙结构的多层印刷电路板 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104080263A (zh) * | 2013-03-29 | 2014-10-01 | 鸿富锦精密工业(深圳)有限公司 | 堆叠式电磁能隙结构 |
CN113015313A (zh) * | 2019-12-18 | 2021-06-22 | 瑞昱半导体股份有限公司 | 电磁能隙结构装置 |
CN113316307A (zh) * | 2021-04-17 | 2021-08-27 | 山东英信计算机技术有限公司 | 一种pcb板和服务器 |
US11375608B2 (en) | 2019-12-13 | 2022-06-28 | Realtek Semiconductor Corporation | Electromagnetic band gap structure apparatus |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3287544B2 (ja) * | 1997-08-28 | 2002-06-04 | 富士電機株式会社 | ノイズフィルタ |
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2006
- 2006-12-29 CN CN2006101563610A patent/CN101212860B/zh not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104080263A (zh) * | 2013-03-29 | 2014-10-01 | 鸿富锦精密工业(深圳)有限公司 | 堆叠式电磁能隙结构 |
US11375608B2 (en) | 2019-12-13 | 2022-06-28 | Realtek Semiconductor Corporation | Electromagnetic band gap structure apparatus |
CN113015313A (zh) * | 2019-12-18 | 2021-06-22 | 瑞昱半导体股份有限公司 | 电磁能隙结构装置 |
CN113316307A (zh) * | 2021-04-17 | 2021-08-27 | 山东英信计算机技术有限公司 | 一种pcb板和服务器 |
CN113316307B (zh) * | 2021-04-17 | 2022-08-23 | 山东英信计算机技术有限公司 | 一种pcb板和服务器 |
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Publication number | Publication date |
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CN101212860B (zh) | 2010-04-07 |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
CB03 | Change of inventor or designer information |
Inventor after: Zhang Qiufeng Inventor before: Yang Zhiming Inventor before: Lai Junyou Inventor before: Xue Guanghua Inventor before: Wang Jianlin Inventor before: Guo Weide |
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TR01 | Transfer of patent right |
Effective date of registration: 20170301 Address after: Tianjin City, Hexi District Dagu Road, the ancient Fangli 16-201 Patentee after: Zhang Qiufeng Address before: Taipei City, Taiwan, China Patentee before: Inventec Corporation |
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CP02 | Change in the address of a patent holder |
Address after: 541000 No. two, No. 5, West Road, Xiangshan District, Guilin, the Guangxi Zhuang Autonomous Region Patentee after: Zhang Qiufeng Address before: 300202 Tianjin city Hexi District Dagu road ancient Fangli 16-201 Patentee before: Zhang Qiufeng |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100407 Termination date: 20171229 |
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CF01 | Termination of patent right due to non-payment of annual fee |