CN101211802B - 非流动、下装填方式的倒装片安装方法 - Google Patents

非流动、下装填方式的倒装片安装方法 Download PDF

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CN101211802B
CN101211802B CN2007101882095A CN200710188209A CN101211802B CN 101211802 B CN101211802 B CN 101211802B CN 2007101882095 A CN2007101882095 A CN 2007101882095A CN 200710188209 A CN200710188209 A CN 200710188209A CN 101211802 B CN101211802 B CN 101211802B
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植村成彦
中村昭广
森高志
松本博文
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Nippon Mektron KK
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Abstract

本发明涉及一种具备高度控制功能的非流动、下装填方式的倒装片安装方法。在该方法中，可靠地使隆起焊盘接触到基板的焊径电极上，能以高可靠性进行回流锡焊。在该方法中，在基板上事先涂敷树脂之后，在上述基板上装上附有隆起焊盘的半导体，基板的焊径电极与隆起焊盘接合，其特征在于：将上述基板装在回流夹具的基台上面，在该基板上涂敷高度充填有填料的树脂，在该基板的规定位置上装上上述附有隆起焊盘的半导体，同时，在该半导体的上部装上比上述基板的产品外形尺寸大的按压板，并且，在该按压板的下面和上述基台上面之间介设垫片，限制按压板的按压量，同时，用直立设置于上述基台上面的定位用的导向销，限制该按压板的水平移动。

Description

非流动、下装填方式的倒装片安装方法
技术领域
本发明涉及非流动、下装填方式的倒装片安装方法，特别涉及在基板上事先涂敷高度充填有填料的树脂，装上半导体时，可靠地使隆起焊盘接触到基板的焊径(パツド)电极上，高可靠性且可回流锡焊的、具备高度控制功能的非流动、下装填方式的倒装片安装方法。
背景技术
近年来，随着电子设备的小型化，从节省空间和提高电子性能等方面考虑，通过倒装片安装方法将半导体装到基板上的做法被广泛应用。倒装片安装方法，是指在位于半导体芯片里面的端子电极上设置被称为隆起焊盘的突起状电极，通过上述隆起焊盘使设置于基板上的焊径电极固定、导通。
上述隆起焊盘，虽然由焊料材料等形成，但是因接合面积小，安装强度往往不足，另外，还有由基板和半导体的热膨胀率差异等引发的变位，由机械冲击、热冲击引起的上述隆起焊盘离开焊径电极的危险。因此，为了提高接合强度，在上述隆起焊盘通过热熔接接合到基板的焊径电极后，在半导体和基板之间的空隙内流入环氧系的树脂，进行使其加热硬化的下装填处理。
但是，上述下装填处理，需要分别对锡焊引起的电极间的连接、树脂的硬化进行加热处理，因加热工序多而造成成本高。另外，从半导体和基板之间的间隙的侧方流入树脂的作业性恶化，还需要用于流入的空间，不利于电子器械的小型化。
为了克服这个不利点，提出下述非流动、下装填方式的倒装片安装方法：先向基板涂布树脂，之后，通过将带有隆起焊盘的半导体按压到基板上，挤开先行涂布的树脂，使隆起焊盘和焊径电极接触，在该状态下加热，由此电极间的连接和树脂的硬化在一次加热工序中进行(例如，参照专利文献1)。
在此，在下装填处理或者非流动、下装填处理中使用的环氧系树脂中，混入被称做充填料的氧化铝、氧化硅等的粉末，提高树脂的强度。在下装填处理中，因在隆起焊盘接合到焊径电极之后流入树脂，所以充填料不会造成不良影响。
但是，在非流动、下装填处理中，如图7所示，因仅凭半导体50的自重使隆起焊盘51接触到基板52的焊径电极53，混入在树脂54里的充填料55被夹在隆起焊盘51和焊径电极53之间，隆起焊盘51和焊径电极53之间产生间隙。在非流动、下装填处理中，因电极间的连接和树脂的硬化在同一加热工序中进行，所以隆起焊盘51和焊径电极53之间如果有间隙，这个间隙由树脂54堵塞，则不能导通电流。
如图8所示，如果由重锤56等强制地将半导体50向基板52按压，充填料55被挤出，或者，一边卷入充填料55，一边确保隆起焊盘51和焊径电极53的电流的导通。但是，在这个状态下，如果进行回流锡焊，隆起焊盘51向焊径电极53热熔着后，因重锤56的重量继续作用，有发生隆起焊盘51压坏，或者从焊径电极53露出，发生电流短路的危险。
在非流动、下装填处理中，作为使用重锤的构成，可以获知：在基板的上面涂布含有球状粒子的树脂，使该球状粒子配置到基板的焊径电极间的领域，在半导体的上部载置重锤，在那样的状态下进行回流锡焊的装置和方法(例如，参照专利文献2)。
专利文献1日本特开平10-125724号公报
专利文献2日本特开2001-53109号公报
发明内容
专利文献1记载的发明，先向基板涂布树脂，因电极间的连接和树脂的硬化在一次的加热工序中进行，可以通过工序的简单化降低成本。但是，如图7所示，混入在树脂里的充填料被夹在隆起焊盘和焊径电极之间，有导致电流不能导通的危险。混入树脂内的充填料少，或者一点儿都不混入，虽然能消除由充填料的夹入而导致的不佳状况，但是树脂的强度降低，有发生隆起焊盘破坏的危险。
专利文献2记载的发明，由重锤挤出充填料，或者，卷入充填料，在确保隆起焊盘和焊径电极的电流导通的同时，通过向树脂中混入球状粒子，使半导体和基板之间的间隙保持在规定的尺寸。但是，球状粒子不一定正确地配置在基板的焊径电极间的领域内，重锤有发生位置偏离的危险。
因此，在本发明的非流动、下装填方式的倒装片安装方法中，在基板上事先涂敷高度充填有填料的树脂，装上半导体，此时，可靠地使隆起焊盘接触到基板的焊径电极上，以高可靠性且可回流锡焊作为目的。
本发明是为了达成上述目的而提出的。技术方案1记载的发明提供一种具备高度控制功能的非流动、下装填方式的倒装片安装方法，在非流动、下装填方式的倒装片安装方法中，先向基板涂布树脂，之后，将带有隆起焊盘的半导体装到上述基板上，通过基板的焊径电极和上述隆起焊盘接合，其特征在于：将上述基板装在回流夹具的基台上面，在该基板上涂敷高度充填有填料的树脂，在该基板的规定位置上装上上述附有隆起焊盘的半导体，同时，在该半导体的上部装上比上述基板的产品外形尺寸大的重锤，并且，在该重锤的下面和上述基台上面之间介设垫片，限制重锤的按压量，同时，用直立设置于上述基台上面的定位导向件限制该重锤的水平移动。
通过该结构，在基板上事先涂敷高度充填有填料的树脂，装上半导体时，装在半导体上部的重锤使半导体强制的按压在基板上，该重锤通过定位导向件限制水平移动，因此，隆起焊盘不会引起错位，准确的按压在焊径电极上。
在该状态下，进行回流锡焊，即使混入树脂的填料被挟入在隆起焊盘与焊径电极之间，由于上述重锤使半导体强制的按压在基板上，所以该填料从隆起焊盘与焊径电极之间被挤出，上述隆起焊盘通过热熔接与焊径电极可靠的接合。或者，被挟入的填料被卷入隆起焊盘与焊径电极之间，并且从上方按压，上述隆起焊盘通过热熔接与焊径电极可靠的接合。另外，由于在重锤的下面和基台上面之间介设垫片，所以即使隆起焊盘被热熔接，重锤的按压量通过垫片被限制，不会发生隆起焊盘压坏或者隆起焊盘从焊径电极露出而引起电流短路的情况。
如上所述，本发明即使混入树脂的填料被挟入在隆起焊盘与焊径电极之间，通过重锤按压半导体，可以防止填料被挤出，或者卷入填料且在隆起焊盘与焊径电极之间产生间隙，进行回流锡焊可以确保隆起焊盘与焊径电极之间的电流导通。上述重锤通过定位导向限制水平移动，不会引起错位，并且，通过垫片限制按压量，可以防止隆起焊盘压坏。
这样，使用高度充填有填料的树脂，可以可靠的安装半导体，可有助于提高非流动、下装填方式的倒装片安装方法的作业性和信赖性。
附图说明
图1为本发明的安装方法所使用的回流夹具的分解立体图；
图2为模式的表示图1的回流夹具的结构状态的说明图；
图3表示图2的回流夹具的动作过程的说明图；
图4表示图2的回流夹具的最终过程的说明图；
图5表示图2的回流夹具的其他动作过程的说明图；
图6表示图5的回流夹具的最终过程的说明图；
图7模式的表示现有的非流动、下装填处理的不佳状况的说明图；
图8模式的表示通过重锤解决图7所示的不佳状况的一个实例的说明图。
具体实施方式
以下，例举适当的实施例对本发明的非流动、下装填方式的倒装片安装方法进行说明。在基板上事先涂敷高度充填有填料的树脂、装上半导体时，以正确的状态使隆起焊盘与基板的焊径电极接合，可进行可靠的回流锡焊，本发明为了达成上述目的，通过下述内容而实现：将上述基板装上在回流夹具的基台上面，在该基板上涂敷高度充填有填料的树脂，在该基板的规定位置上装上附有上述隆起焊盘半导体，同时，在该半导体的上部装上比上述基板的产品外形尺寸大的重锤，并且，在该重锤的下面和上述基台上面之间介设垫片，限制重锤的按压量，同时，用设立于上述基台上面的定位导向件限制该重锤的水平移动。
图1是本发明的安装方法所使用的回流夹具的分解立体图。该回流夹具10，由装上基板52的基台11，设置于该基台11的上方，使半导体50装上在基板52上的按压板21构成。
上述基台11的上面，设立用于在正确位置固定基板52的固定销12，在该基板52的两侧通过固定销14固定垫片13，并且在基板52的周围四角直立设置导向销15。
在上述按压板21上，导向孔22设置在与导向销15对应的位置，上述导向销15与导向孔22活动嵌入，按压板21相对基台11可上下移动的被定位，形成限制按压板21的水平移动的定位导向件。另外，该按压板21也作为重锤而作用，如后面所述，半导体50强制的按压到基板52上。
接着，对本发明的非流动、下装填方式的倒装片安装方法进行说明。图2是表示模式的夸张扩大上述回流夹具10的结构状态的主要部分的说明图。在上述基台11上，基板52被固定于规定位置，在设置有焊径电极53的基板52的表面上，预先涂敷高度充填有填料55的环氧类树脂54。
在涂敷了树脂54的基板52的上部，配置半导体50，设置于该半导体50的内面的隆起焊盘51与基板52的焊径电极53不错位，通过树脂54上下面对。并且，在该半导体50的上部装上比基板52的产品外形尺寸大的按压板21。
该按压板21也作为将半导体50强制的按压到基板52上的重锤而作用，上述半导体50的隆起焊盘51将事先涂敷的树脂54挤开，如图3所示，隆起焊盘51与焊径电极53接触。以该状态，通过回流焊接处理进行加热，如图4所示，隆起焊盘51热熔接，与基板52的焊径电极53接合，同时，树脂54固化，保护隆起焊盘51与焊径电极53的周围。
上述按压板21的下面和基台11的上面之间设置有垫片13，当按压板21与该垫片13接触，则按压板21的下降停止，因此，在隆起焊盘51与焊径电极53热熔接时，重锤56的重量不会继续作用。这样，按压板21的按压量通过垫片13限制，因此，可以防止隆起焊盘51压坏或者从焊径电极53露出而引起电流短路的情况。
另外，如图5所示，即使在混入树脂54的填料55被挟入隆起焊盘51与焊径电极53之间的场合，由于上述按压板21使半导体50强制的按压在基板52上，所以填料55从隆起焊盘51与焊径电极53之间被挤出，如图3所示，上述隆起焊盘51通过热熔接可靠的与焊径电极53接合。
或者，如图6所示，被挟入的填料55在隆起焊盘51与焊径电极53之间被卷入的同时，从上方被按压，上述隆起焊盘51通过热熔接可靠的与焊径电极53接合。在该场合下，按压板21的按压量通过垫片13限制，因此，也可以防止隆起焊盘51压坏或者从焊径电极53露出而引起电流短路的情况。
这样，使用高度充填有填料55的树脂54，可以可靠的安装半导体50，可有助于提高非流动、下装填方式的倒装片安装方法的作业性和信赖性。
并且，只要不脱离本发明的宗旨，本发明可以进行各种变化，并且，本发明涉及该变化的内容是显而易见的。

Claims (1)

1.一种具备控制高度功能的非流动、下装填方式的倒装片安装方法，在非流动、下装填方式的倒装片安装方法中，先向基板涂布树脂，之后，将带有隆起焊盘的半导体装到上述基板上，通过基板的焊径电极和上述隆起焊盘接合，其特征在于：
将上述基板装在回流夹具的基台上面，在该基板上涂敷充填有填料的树脂，在该基板的规定位置上装上上述附有隆起焊盘的半导体，同时，在该半导体的上部装上比上述基板的产品外形尺寸大的重锤，并且，在该重锤的下面和上述基台上面之间介设垫片，限制重锤的按压量，同时，用直立设置于上述基台上面的定位导向件限制该重锤的水平移动。
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