CN101207178A - 相变存储元件及其制造方法 - Google Patents
相变存储元件及其制造方法 Download PDFInfo
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- CN101207178A CN101207178A CNA2006101686983A CN200610168698A CN101207178A CN 101207178 A CN101207178 A CN 101207178A CN A2006101686983 A CNA2006101686983 A CN A2006101686983A CN 200610168698 A CN200610168698 A CN 200610168698A CN 101207178 A CN101207178 A CN 101207178A
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- phase change
- layer
- memory device
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- hard mask
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- 238000004519 manufacturing process Methods 0.000 title claims description 23
- 238000003860 storage Methods 0.000 title abstract description 10
- 230000008859 change Effects 0.000 claims description 171
- 238000000034 method Methods 0.000 claims description 46
- 229920002120 photoresistant polymer Polymers 0.000 claims description 39
- 230000009466 transformation Effects 0.000 claims description 37
- 238000005530 etching Methods 0.000 claims description 30
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 10
- 239000012782 phase change material Substances 0.000 claims description 8
- 238000009966 trimming Methods 0.000 claims description 6
- 229910010037 TiAlN Inorganic materials 0.000 claims description 3
- 229910004156 TaNx Inorganic materials 0.000 claims 1
- 229910010421 TiNx Inorganic materials 0.000 claims 1
- 230000007704 transition Effects 0.000 abstract description 8
- 239000010410 layer Substances 0.000 description 163
- 238000000151 deposition Methods 0.000 description 17
- 230000008021 deposition Effects 0.000 description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 12
- 238000005229 chemical vapour deposition Methods 0.000 description 10
- 229910052581 Si3N4 Inorganic materials 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 239000003989 dielectric material Substances 0.000 description 6
- 238000001259 photo etching Methods 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 239000000377 silicon dioxide Substances 0.000 description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 239000002131 composite material Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 238000003701 mechanical milling Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 239000013049 sediment Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000011232 storage material Substances 0.000 description 1
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Abstract
Description
Claims (31)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2006101686983A CN101207178B (zh) | 2006-12-22 | 2006-12-22 | 相变存储元件及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN2006101686983A CN101207178B (zh) | 2006-12-22 | 2006-12-22 | 相变存储元件及其制造方法 |
Publications (2)
Publication Number | Publication Date |
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CN101207178A true CN101207178A (zh) | 2008-06-25 |
CN101207178B CN101207178B (zh) | 2010-12-01 |
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ID=39567181
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN2006101686983A Active CN101207178B (zh) | 2006-12-22 | 2006-12-22 | 相变存储元件及其制造方法 |
Country Status (1)
Country | Link |
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CN (1) | CN101207178B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI569488B (zh) * | 2015-06-01 | 2017-02-01 | 華邦電子股份有限公司 | 電阻式隨機存取記憶體 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6670628B2 (en) * | 2002-04-04 | 2003-12-30 | Hewlett-Packard Company, L.P. | Low heat loss and small contact area composite electrode for a phase change media memory device |
US7381611B2 (en) * | 2003-08-04 | 2008-06-03 | Intel Corporation | Multilayered phase change memory |
-
2006
- 2006-12-22 CN CN2006101686983A patent/CN101207178B/zh active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI569488B (zh) * | 2015-06-01 | 2017-02-01 | 華邦電子股份有限公司 | 電阻式隨機存取記憶體 |
US10157962B2 (en) | 2015-06-01 | 2018-12-18 | Winbond Electronics Corp. | Resistive random access memory |
Also Published As
Publication number | Publication date |
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CN101207178B (zh) | 2010-12-01 |
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ASS | Succession or assignment of patent right |
Free format text: FORMER OWNER: POWERCHIP SEMICONDUCTOR CORP. NAN YA TECHNOLOGY CORP. PROMOS TECHNOLOGIES INC. WINBOND ELECTRONICS CORPORATION Owner name: NAN YA TECHNOLOGY CORP. Free format text: FORMER OWNER: INDUSTRY-TECHNOLOGY RESEARCH INSTITUTE Effective date: 20100702 |
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Free format text: CORRECT: ADDRESS; FROM: HSINCHU COUNTY, TAIWAN PROVINCE, CHINA TO: TAOYUAN COUNTY, TAIWAN PROVINCE |
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TA01 | Transfer of patent application right |
Effective date of registration: 20100702 Address after: Taoyuan County Applicant after: Nanya Sci. & Tech. Co., Ltd. Address before: Hsinchu County, Taiwan, China Applicant before: Industrial Technology Research Institute Co-applicant before: Powerchip Semiconductor Corp. Co-applicant before: Nanya Sci. & Tech. Co., Ltd. Co-applicant before: Maode Science and Technology Co., Ltd. Co-applicant before: Huabang Electronics Co., Ltd. |
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GR01 | Patent grant |