CN101191857A - Film pattern layer and its making method thereof - Google Patents
Film pattern layer and its making method thereof Download PDFInfo
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- CN101191857A CN101191857A CNA2006101497731A CN200610149773A CN101191857A CN 101191857 A CN101191857 A CN 101191857A CN A2006101497731 A CNA2006101497731 A CN A2006101497731A CN 200610149773 A CN200610149773 A CN 200610149773A CN 101191857 A CN101191857 A CN 101191857A
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Abstract
The invention relates to a thin film pattern layer, comprising a substrate, a plurality of retaining walls formed on the substrate, a plurality of receiving spaces formed among the retaining walls and a plurality of thin film layers formed in the receiving spaces, wherein thin film layers in each row are irregular in thickness distribution. In the thin film pattern layer, as the thin film layers made of the same materials are irregular in thickness, the thickness of the thin film layer made of the same materials is disarranged and becomes uniform, thereby the drawback of stripes caused by light passing though the thin film layer are reduced or eliminated. The invention also provides a method for making the thin film pattern layer.
Description
Technical field
The present invention relates to a kind of patterned layer on substrate and a kind of manufacturing method of film pattern layer.
Background technology
The method of making patterned layer on substrate at present mainly comprises: light lithography method and ink-jet method.
The light lithography method: by on the board structure of the required film of preparation coating, the coating photoresistance material, the light shield that will have predetermined pattern is located on the photoresist, and expose and develops, or add etch process, and the patterned layer on substrate that formation has predetermined pattern.This light lithography method needs complicated processing procedure, and the service efficiency of material is lower and cause the manufacturing cost height.
Ink-jet method a: board structure with a plurality of receiving spaces that limited by a plurality of barricades is provided, use an ink discharge device, go up a plurality of jet orifice by device, the ink that forms membraneous material is sprayed in these a plurality of receiving spaces, on this board structure, form predetermined patterned layer on substrate after ink is cured.Because this board structure that provides is often greater than the area that this a plurality of jet orifice directly contained, therefore, ink discharge device need provide the ranks relative motion of these a plurality of jet orifice and this board structure, and this ink-jet method just can once form patterned layer on substrate then.Because processing procedure is simplified in a large number, material uses economical, so cost significantly reduces.
In the prior art, in the patterned layer on substrate that is formed by ink-jet method, comprise a plurality of thin layers, owing to utilize a plurality of jet orifice and the relative motion of board structure ranks to finish, so the thin layer of the same material of going together uses same jet orifice making, its thickness is identical.Therefore, the thin layer homogeneity of this row same material is very high.But, the thin layer of different rows same material, owing to use different jet orifice to make, its thickness is difficult for identical again.Therefore, when the thin layer between the same material different rows has different-thickness, light transmission thereafter, therefore the different-thickness between this different rows is easily distinguished by human eye, forms linear strip flaw (MuraDefects).
Summary of the invention
In view of this, be necessary to provide a kind of patterned layer on substrate and a kind of manufacturing method of film pattern layer that reduces or eliminates strip flaw.
A kind of patterned layer on substrate comprises: a substrate and be formed at a plurality of barricades on the substrate, form a plurality of receiving spaces between these a plurality of barricades, and a plurality of thin layers that are formed in the receiving space, wherein, the distribution of the thin layer thickness in every row is irregular.
A kind of manufacturing method of film pattern layer may further comprise the steps: a substrate is provided, and its surface has a plurality of barricades, forms a plurality of receiving spaces between these a plurality of barricades; Filling ink is to these a plurality of receiving spaces, and it is irregular making the distribution that is filled to the ink volume of the same material in each receiving space among the colleague; And solidified ink to be to form a plurality of thin layers, makes in every row in the receiving space, and the thin layer thickness distribution of same material is irregular.
Another kind of manufacturing method of film pattern layer, may further comprise the steps: a substrate is provided, and its surface has a plurality of barricades, forms a plurality of receiving spaces between these a plurality of barricades; To this a plurality of receiving spaces, and make a plurality of jet orifice and substrate generation relative motion with a plurality of jet orifice filling inks of an ink discharge device, and make and be filled in each receiving space of going together, the distribution of the ink volume of same material is irregular; Reach solidified ink to form a plurality of thin layers, make in every capable receiving space, the thin layer thickness distribution of same material is irregular.
Described patterned layer on substrate is upset the thin layer thickness evenness of this row same material by the irregular distribution of the thin layer thickness of every capable same material, become inhomogeneous, thereby the strip flaw that light transmission is produced thereafter reduces or eliminates.
The irregular distribution of the ink volume of described Thinfilm pattern layer manufacturing method by being filled to same material in every row, make solidify the back thus behind the solidified ink layer among the formed colleague thin layer thickness distribution of same material be irregular, the thin layer thickness evenness of this row same material is upset, become inhomogeneous, thereby the strip flaw that light transmission is produced thereafter reduces or eliminates.
Description of drawings
A schematic cross-section of a kind of patterned layer on substrate that Fig. 1 provides for first embodiment of the invention.
Another schematic cross-section of a kind of patterned layer on substrate that Fig. 2 provides for first embodiment of the invention.
A schematic cross-section of a kind of patterned layer on substrate that Fig. 3 provides for second embodiment of the invention.
The schematic flow sheet of a kind of Thinfilm pattern layer manufacturing method that Fig. 4 provides for third embodiment of the invention.
The synoptic diagram of a kind of Thinfilm pattern layer manufacturing method that Fig. 5 a to 5f provides for third embodiment of the invention.
The schematic cross-section of a kind of substrate that Fig. 6 provides for third embodiment of the invention.
Embodiment
Below in conjunction with accompanying drawing the embodiment of the invention is described in further detail.
See also Fig. 1 and Fig. 2, first embodiment of the invention provides a kind of patterned layer on substrate 100.This patterned layer on substrate 100 comprises a substrate 102, is formed at a plurality of barricades 104 and a plurality of thin layer 106 on the substrate 102.
Preferably, the material of this substrate 102 is selected from glass, quartz glass, Silicon Wafer (Wafer), metal and plastics.These a plurality of barricades 104 limit a plurality of receiving spaces 107, and these a plurality of receiving spaces 107 are ranks and are arranged on the substrate 102.
Please consult Fig. 1 and Fig. 2 once more, these a plurality of thin layers 106 comprise the first film layer 106R, the second thin layer 106G and the 3rd thin layer 160B, and it is positioned at a plurality of receiving spaces 107.Wherein, thin layer 106 thickness distribution of same material are irregular in every row, and the thin layer of different materials is with a definite sequence repeated arrangement in every adjacent triplex row, as being series arrangement with the first film layer, second thin layer, the 3rd thin layer.Below with the concrete condition of the first film layer 106R explanation present embodiment.The distribution in the receiving space 107 in every row of the thickness of the first film layer 106R is irregular on substrate 102, that is to say that the thickness of the thickness of a first film layer 106R among the colleague in the receiving space 107 and two adjacent the first film layer 106R may be different.Therefore, because the irregular distribution of the first film layer 106R thickness in this row, the first film layer 106R thickness evenness in every row in the receiving space 107 will reduce, thereby cause in every row the first film layer 106R thickness evenness to be upset, the strip flaw that light transmission is produced thereafter reduces or eliminates.The situation of the situation of the second thin layer 106G and the 3rd thin layer 106B and the first film layer 106R is similar.
See also Fig. 3, a kind of patterned layer on substrate 100 ' that second embodiment of the invention provides.Present embodiment is different with first embodiment be in, a plurality of barricades 104 ' on this substrate 102 ' are integrated formed structures with substrate 102 '.
See also Fig. 4, the schematic flow sheet of a kind of manufacturing method of film pattern layer that third embodiment of the invention provides.This method mainly may further comprise the steps: a substrate is provided, and its surface has a plurality of barricades, forms a plurality of receiving spaces between these a plurality of barricades, and this receiving space is the ranks shape and is arranged in (step 10a) on the substrate; Filling ink is to these a plurality of receiving spaces, and making the distribution that is filled to the ink volume of the same material in each receiving space among the colleague is irregular (step 20a); And solidified ink to be to form a plurality of thin layers, makes in every row in the receiving space, and the thin layer thickness distribution of same material is irregular (step 30a).
In step 10a, the material of this substrate 102 is selected from glass, quartz glass, Silicon Wafer, metal and plastics.In the present embodiment, this substrate 102 is glass substrates.
See also Fig. 5 a to 5c, among this step 10a, this manufacture method with substrate 102 of a plurality of barricades 104 specifically may further comprise the steps:
Utilize dry film method (Dry Film Lamination), wet type rotary process (Wet Spin Coating) or wet type crack formula rubbing method (Wet Slit Coating) at minus photoresist layer 103 of this substrate 102 upper surfaces coating.
The light shield 200 that will have a default barricade pattern is located between this a minus photoresist layer 103 and an exposure machine light source (figure does not show), and utilizes this exposure machine light source this minus photoresist layer 103 that exposes.
Utilize visualization way, the minus photoresist layer at unexposed place is removed, form a plurality of barricades 104 that are located at substrate 102 upper surfaces.
Be appreciated that above-mentioned steps also can use the eurymeric photoresist, exposure place material is to stay or remove to have outside the difference in its corresponding light shield design and the processing procedure, does not influence enforcement of the present invention.
The another kind that present embodiment also provides has the manufacture method of the substrate 102 ' of a plurality of barricades 104 '.This method specifically may further comprise the steps:
A Jet forming machine and the mould with predetermined barricade pattern are provided;
Utilize Jet forming machine that baseplate material is penetrated to this mould;
The demoulding obtains the substrate 102 ' that this surface has a plurality of barricades 104 ', as shown in Figure 6.
This model has predetermined barricade pattern.The material of this substrate 102 ' is selected from glass, quartz glass, metal and plastics.This method is to utilize the technology of ejection formation, once forms the substrate 102 ' with a plurality of barricades 104 '.The step 10a purpose of present embodiment is in order to obtain a substrate with a plurality of barricades, needn't to exceed with above-mentioned specific embodiment and reach this purpose.
See also Fig. 5 d to 5e, in step 20a, utilize an ink discharge device 300 that the ink 108 of required membraneous material is filled in the receiving space 107 to form ink layer 110, and to make the distribution of ink layer 110 volumes of same material among the colleague be irregular, and the ink that makes adjacent triplex row different materials repeated arrangement regularly, as being series arrangement with the first film material, second membraneous material, the 3rd membraneous material.For the distribution of ink layer 110 volumes of realizing above-mentioned colleague's same material is irregular purposes, can realize by the voltage swing that control puts on the jet orifice 304 on these ink discharge device 300 shower nozzles 302.If the voltage swing that puts on the jet orifice 304 changes at random, then Pen Chu ink volume also is irregular variation.The voltage swing scope of this irregular variation is 80% to 120% of a normative reference voltage swing, is preferably 90% to 110%.This normative reference voltage can be manufacturing method of film pattern layer in the prior art, a voltage that is applied to the jet orifice of ink discharge device, and the size of this voltage is generally a steady state value.Because being applied to the voltage swing of jet orifice 304 is irregular variations, so the ink of same material ejection volume also is irregular variation in the colleague.This ink discharge device 300 can be a Thermal Bubble Ink-jet Printer device (Thermal Bubble Ink Jet Printing Device) or a piezoelectric ink jet device (Piezoelectric Ink Jet Printing Device).
Remove above-mentioned institute and say, outside the volume difference of the ink droplet of the receiving space that jet orifice 304 sprays into (Ink Droplet), another kind of mode is in the receiving space 107 in the colleague, inserts the ink droplet of varying number.If insert ink droplet quantity and change at random, then Pen Chu ink cumulative volume also is irregular variation.The ink droplet quantitative range of this irregular variation is 80% to 120% of a normative reference ink droplet quantity, is preferably 90% to 110%.This normative reference ink droplet quantity can be manufacturing method of film pattern layer in the prior art, and the ink droplet quantity of inserting receiving space 107 is generally a steady state value.Because inserting the ink droplet quantity of receiving space 107 is irregular variations, so the ink of same material ejection cumulative volume also is irregular variation in the colleague.
See also Fig. 5 f, in step 30a, ink layer 110 in the receiving space 107 is solidified by a solidification equipment (figure does not show), be positioned at a plurality of thin layers 106 on the transparency carrier 102 with formation, wherein, thin layer 106 thickness distribution of same material are irregular in every row, and the thin layer of every adjacent triplex row different materials is with a definite sequence repeated arrangement, as being series arrangement with the first film layer, second thin layer, the 3rd thin layer.This solidification equipment can be a heating arrangement or a ultraviolet rays emitting apparatus, or comprises a heating arrangement and a vacuum extractor.Because ink layer 110 volume distributed median of the ejection of same material are irregular among the colleague before, so thin layer 106 thickness distribution of same material are irregular among the formed colleague in solidified ink layer 110 back.Therefore, because the irregular distribution of thin layer 106 thickness of same material among this colleague, these row thin layer 106 thickness evenness will reduce, thereby cause thin layer 106 thickness evenness of same material in every row to be upset, and the strip flaw that light transmission is produced thereafter reduces or eliminates.
After the dry solidification process, just can form a patterned layer on substrate 100 as shown in Figure 2.In addition, can adopt remover to remove fully by a plurality of barricades 105 that form in the light shield processing procedure.
The manufacture method of the patterned layer on substrate 100 that present embodiment provided, the ink volume that is filled to the same material in the receiving space 107 among the colleague is irregular variation, so thin layer 106 thickness distribution of same material are irregular among the formed colleague in solidified ink layer 110 back.Therefore, because the irregular distribution of thin layer 106 thickness of same material among this colleague, thin layer 106 thickness evenness will reduce in this row, thereby cause thin layer 106 thickness evenness of same material in every row to be upset, and the strip flaw that light transmission is produced thereafter reduces or eliminates.
This patterned layer on substrate processing procedure is applicable to the manufacturing of colored filter and the manufacturing of organic light emitting apparatus.In the processing procedure of colored filter, a plurality of barricades promptly can be used as black matrix structure, a plurality of receiving spaces are available as the manufacturing of redgreenblue chromatograph, the manufacture that the manner provides, can form the good optical filter product that does not have linear strip flaw, wherein observe the chromatograph district of colleague, can find that color can be because of the different slightly slight variations of chromatograph thickness with color.And in the manufacturing of organic light emitting apparatus, available this processing procedure is finished the conductor layer of organic light emitting apparatus, the manufacturing of luminescent layer and electronics electricity hole transport layer etc.But formed Thinfilm pattern and required ink can be different.
In addition, those skilled in the art can also do other variation in spirit of the present invention.Certainly, the variation that these are done according to spirit of the present invention all should be included within the present invention's scope required for protection.
Claims (27)
1. patterned layer on substrate comprises:
A substrate;
Be formed at a plurality of barricades on the substrate, form a plurality of receiving spaces between these a plurality of barricades, this receiving space is the ranks shape and arranges; And
A plurality of thin layers that are formed in the receiving space;
It is characterized in that: the distribution of the thin layer thickness in every row is irregular.
2. patterned layer on substrate as claimed in claim 1 is characterized in that described baseplate material is selected from glass, quartz glass, Silicon Wafer, metal and plastics.
3. patterned layer on substrate as claimed in claim 1, it is characterized in that, described a plurality of thin layer comprises the first film layer, second thin layer and the 3rd thin layer, wherein, is series arrangement with the first film layer, second thin layer and the 3rd thin layer respectively in the receiving space of every adjacent triplex row.
4. patterned layer on substrate as claimed in claim 1 is characterized in that, described substrate and a plurality of barricade structure that is formed in one.
5. manufacturing method of film pattern layer may further comprise the steps:
A substrate is provided, and its surface has a plurality of barricades, forms a plurality of receiving spaces between these a plurality of barricades, and this receiving space is the ranks shape and is arranged on the substrate;
Filling ink is to these a plurality of receiving spaces, and it is irregular making the distribution that is filled to the ink volume of the same material in each receiving space among the colleague; And
Solidified ink to be to form a plurality of thin layers, makes in every row in the receiving space, and the thin layer thickness distribution of same material is irregular.
6. manufacturing method of film pattern layer as claimed in claim 5 is characterized in that, described a plurality of barricades form step by step by following:
Apply a photoresist layer at this upper surface of base plate;
The light shield that will have a predetermined barricade pattern is located between this photoresist layer and exposure machine light source, and this photoresist layer that exposes;
Utilize visualization way that the photoresist layer of non-barricade pattern part is removed, form a plurality of barricades that are located at upper surface of base plate.
7. manufacturing method of film pattern layer as claimed in claim 5 is characterized in that, described a plurality of barricades form step by step by following:
A Jet forming machine and the mould with predetermined barricade pattern are provided;
Utilize Jet forming machine that baseplate material is penetrated to this mould;
The demoulding obtains the substrate that this surface has a plurality of barricades.
8. manufacturing method of film pattern layer as claimed in claim 7 is characterized in that described baseplate material is selected from glass, quartz glass, metal and plastics.
9. manufacturing method of film pattern layer as claimed in claim 5, it is characterized in that, the described ink that is filled in every adjacent triplex row receiving space comprises the first film material, second membraneous material and the 3rd membraneous material, wherein, serve as that order is filled with the first film layer, second thin layer and the 3rd thin layer respectively in the receiving space of every adjacent triplex row.
10. manufacturing method of film pattern layer as claimed in claim 5, it is characterized in that, described filling step is to utilize an ink discharge device that ink is filled in the receiving space, and this ink discharge device comprises a shower nozzle and a jet orifice that is positioned on this shower nozzle at least.
11. manufacturing method of film pattern layer as claimed in claim 10 is characterized in that, described ink discharge device is a kind of of Thermal Bubble Ink-jet Printer device and piezoelectric ink jet device.
12. manufacturing method of film pattern layer as claimed in claim 5 is characterized in that, described curing schedule is to utilize a heating arrangement and/or a vacuum extractor or a light-emitting device solidified ink.
13. manufacturing method of film pattern layer as claimed in claim 12 is characterized in that, described light-emitting device is a ultraviolet rays emitting apparatus.
14. manufacturing method of film pattern layer as claimed in claim 10 is characterized in that, to be the voltage that puts on the jet orifice on the shower nozzle of this ink discharge device with control formed by the mode of irregular variation the ink volume of described irregular distribution.
15. manufacturing method of film pattern layer as claimed in claim 14 is characterized in that, the irregular variation of described voltage is meant that voltage swing or voltage waveform change.
16. manufacturing method of film pattern layer as claimed in claim 15 is characterized in that, the variation range of described voltage swing is 80% to 120% of a normal voltage or an average voltage.
17. manufacturing method of film pattern layer as claimed in claim 10 is characterized in that, the ink volume of described irregular distribution is formed in the ink droplet quantity of the inserting receiving space mode with irregular variation.
18. manufacturing method of film pattern layer as claimed in claim 17 is characterized in that, the variation range of described ink droplet quantity be standard ink drip quantity or average ink droplet quantity 80% to 120%.
19. a manufacturing method of film pattern layer may further comprise the steps:
A substrate is provided, and its surface has a plurality of barricades, forms a plurality of receiving spaces between these a plurality of barricades;
To this a plurality of receiving spaces, and make a plurality of jet orifice and substrate generation relative motion with a plurality of jet orifice filling inks of an ink discharge device, and make and be filled among the colleague in each receiving space, the distribution of the ink volume of same material is irregular; And
Solidified ink makes in every capable receiving space to form a plurality of thin layers, and the thin layer thickness distribution of same material is irregular.
20. manufacturing method of film pattern layer as claimed in claim 19, it is characterized in that, the described ink that is filled in every adjacent triplex row receiving space comprises the first film material, second membraneous material and the 3rd membraneous material, wherein, serve as that order is filled with the first film layer, second thin layer and the 3rd thin layer respectively in the receiving space of every adjacent triplex row.
21. manufacturing method of film pattern layer as claimed in claim 19 is characterized in that, described curing schedule is to utilize a heating arrangement and/or a vacuum extractor or a light-emitting device solidified ink.
22. manufacturing method of film pattern layer as claimed in claim 21 is characterized in that, described light-emitting device is a ultraviolet rays emitting apparatus.
23. manufacturing method of film pattern layer as claimed in claim 19 is characterized in that, the ink volume of described irregular distribution is formed by the mode of irregular variation with the voltage that control puts on a plurality of jet orifice of this ink discharge device.
24. manufacturing method of film pattern layer as claimed in claim 23 is characterized in that, the irregular variation of described voltage is meant that voltage swing or voltage waveform change.
25. manufacturing method of film pattern layer as claimed in claim 24 is characterized in that, the variation range of described voltage swing is 80% to 120% of a normal voltage or an average voltage.
26. manufacturing method of film pattern layer as claimed in claim 19 is characterized in that, the ink volume of described irregular distribution is formed in the ink droplet quantity of the inserting receiving space mode with irregular variation.
27. manufacturing method of film pattern layer as claimed in claim 26 is characterized in that, the variation range of described ink droplet quantity be standard ink drip quantity or average ink droplet quantity 80% to 120%.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006101497731A CN101191857B (en) | 2006-11-27 | 2006-11-27 | Film pattern layer and its making method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006101497731A CN101191857B (en) | 2006-11-27 | 2006-11-27 | Film pattern layer and its making method thereof |
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| CN101191857A true CN101191857A (en) | 2008-06-04 |
| CN101191857B CN101191857B (en) | 2010-04-21 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023113972A1 (en) * | 2021-12-17 | 2023-06-22 | Applied Materials, Inc. | Chemical ink flow stopper |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP3674584B2 (en) * | 2001-12-27 | 2005-07-20 | セイコーエプソン株式会社 | Liquid crystal display device and electronic apparatus provided with the liquid crystal display device |
| CN100529875C (en) * | 2005-03-19 | 2009-08-19 | 鸿富锦精密工业（深圳）有限公司 | Method of manufacturing color filter |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023113972A1 (en) * | 2021-12-17 | 2023-06-22 | Applied Materials, Inc. | Chemical ink flow stopper |
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