CN101231361A - Method for manufacturing substrate with thin membrane pattern layer - Google Patents
Method for manufacturing substrate with thin membrane pattern layer Download PDFInfo
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- CN101231361A CN101231361A CNA2007100036520A CN200710003652A CN101231361A CN 101231361 A CN101231361 A CN 101231361A CN A2007100036520 A CNA2007100036520 A CN A2007100036520A CN 200710003652 A CN200710003652 A CN 200710003652A CN 101231361 A CN101231361 A CN 101231361A
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Abstract
The invention relates to a method for manufacturing basal plate with a film pattern layer, comprising the following steps: providing a pre-formed basal plate provided with a plurality of retaining walls with ink resistant characteristics and forming a plurality of accommodation spaces; respectively filling ink containing curable component into the plurality of accommodation spaces, wherein the ink volume in each accommodation space is larger than that of the corresponding accommodation space; and curing ink, so that the curable component in the ink forms film pattern layers in the accommodation spaces. The manufacturing method can meet the flatness requirement without wearing the retaining walls and film layers smoothly in a grinding or etching way.
Description
[technical field]
The present invention relates to a kind of manufacture method with substrate of patterned layer on substrate.
[background technology]
The method of making patterned layer on substrate at present mainly comprises: light lithography method and ink-jet method.
When adopting the light lithography method, need coating one deck photoresist layer on a substrate.The patterned layer on substrate of Xing Chenging is made a plurality of light shields on the estimation, carries out the coating photoresistance layer repeatedly at a substrate, adopts this light shield that this photoresist layer is exposed and develops, until patterned layer is finished.But this light lithography method need be used main equipment, the corresponding increase of its manufacturing cost.
With reference to Fig. 7, ink-jet method generally includes following steps: an amount of ink is filled in a plurality of receiving spaces that surrounded by a plurality of barricades 304 on the substrate 300; Solidified ink and form patterned layer on substrate 314.
But, as shown in Figure 7, because the contact angle of ink and barricade 304 is less, so can produce with barricade contact position ink face higher.After treating ink dried, produce patterned layer on substrate 314 situation in uneven thickness, and need further to handle so that have an even surface.The corresponding increase of its manufacturing time.
[summary of the invention]
In view of this, be necessary to provide a kind of manufacture method with substrate of patterned layer on substrate, this patterned layer on substrate has higher surface flatness.
A kind of manufacture method with substrate of patterned layer on substrate, its step is as follows:
One preformed substrate is provided, and it has a plurality of barricades that repel ink performance that have, and forms a plurality of receiving spaces between these a plurality of barricades; The ink that will contain curable composition is filled in respectively in these a plurality of receiving spaces, wherein is contained in the volume of the ink volume of each receiving space greater than its pairing receiving space; Solidified ink and make the curable composition in this ink in this receiving space, form patterned layer on substrate.
A kind of manufacture method with substrate of patterned layer on substrate, its step is as follows:
One preformed substrate is provided, and it has a plurality of barricades that repel ink performance that have, and forms a plurality of receiving spaces between these a plurality of barricades; The ink that will contain curable composition is filled in respectively in these a plurality of receiving spaces, and make the volume of the volume of curable composition of the ink in each receiving space and this receiving space roughly the same, wherein be contained in the volume of the ink volume of each receiving space greater than its pairing receiving space; Solidified ink and make the curable composition in this ink in this receiving space, form patterned layer on substrate.
Compared to prior art, described manufacturing method of film pattern layer, excess ink is filled in the receiving space that forms between two barricades, because the surface tension characteristics of liquid, excess ink can form a liquid level of heaving and be unlikely to overflow on the opening of each receiving space.And after ink dried was solidified, curable composition was stayed in the receiving space and is formed patterned layer on substrate in the ink, and the height of this patterned layer on substrate and the height of barricade are roughly close.This processing procedure can reach needed flatness requirement, solves the uneven situation of patterned layer on substrate that general ink jet type thin film manufacture process is caused.
[description of drawings]
Fig. 1 is the diagrammatic cross-section with preformed substrate of barricade.
Fig. 2 to Fig. 3 is the synoptic diagram of the manufacture method of preformed substrate shown in Figure 1.
Fig. 4, Fig. 5 and Fig. 6 are to use preformed substrate manufacturing shown in Figure 1 to have the synoptic diagram of method of the substrate of patterned layer on substrate.
Fig. 7 is the diagrammatic cross-section with conventional substrate of patterned layer on substrate.
[embodiment]
The present invention is described in further detail below in conjunction with accompanying drawing.
See also Fig. 1 to Fig. 6, a kind of manufacture method that has (for example, color layer) substrate 100 of patterned layer on substrate 114 on it is provided.This method step is as follows: a preformed substrate 11 is provided, and it has a plurality of barricades 104, and 104 of these a plurality of barricades form a plurality of receiving spaces 106; The ink 112 (for example, colored solution) that will contain curable composition is filled in respectively in these a plurality of receiving spaces 106, wherein is contained in the volume of ink 112 volumes of each receiving space greater than its pairing receiving space 106; Ink 112 in the curing receiving space 106 is so that the curable composition in this ink 112 forms patterned layer on substrate in this receiving space 106.
As shown in Figure 1, the preformed substrate 11 that is provided comprises a substrate 100, a plurality of barricade 104 that is formed on the substrate 100, and a plurality of receiving spaces 106 that surrounded by these a plurality of barricades 104.These a plurality of barricades 104 are with arranged in patterns of estimating and the upper surface 1042 with general planar.These a plurality of receiving spaces 106 are limited by these a plurality of barricades 104 and form.Adjacent barricade 104 is separated by a receiving space 106.These substrate 100 material selection glass.Certainly, baseplate material also can be selected quartz glass, Silicon Wafer, metal or fluoropolymer resin etc. for use.These a plurality of barricades 104 are made by fluoropolymer resin usually.In addition, these a plurality of barricades 104 can be made to be used as black matrix" by black resin or analog.
As shown in Figures 2 and 3, the manufacture method of this preformed substrate 11 specifically may further comprise the steps: a substrate 100 is provided; Coating one deck photoresist layer 202 on this substrate 100; Utilize a light shield 200 these photoresist layers 202 of exposure; And this photoresist layer 202 that develops forms a plurality of barricades 104.
In the present embodiment, this photoresist layer 202 is formed by the minus photoresist.Perhaps, can use the eurymeric photoresist, but the design of the light shield of this moment is different.This photoresist layer 202 is to utilize to be formed on someway on the substrate 100, for example, and method of spin coating, injection rubbing method, crack formula rubbing method etc.This light shield 200 is made according to the pattern of the expectation formation of barricade 104.Use 202 exposure of 200 pairs of these photoresist layers of this light shield, then photoresist layer 202 is developed.Therefore, this barricade 104 is formed on the substrate 100 with the pattern of estimating.In addition, this barricade 104 can be made up of the single or multiple lift structure, and for example, this barricade 104 can comprise bottom of being made by inorganic material and the upper strata of being made by organic material.
Perhaps, this preformed substrate 11 can make by the method for plastic forming, thereby this substrate 100 is formed in one with this barricade 104.
Barricade 104 should have certain repulsion ink performance.For example, the contact angle between ink 112 and the barricade 104 should be preferably more than 20 degree and 65 degree greater than 15 degree and less than 90 degree.In this scope, ink 112 can be contained in the receiving space 106 preferably.
As shown in Figure 4, by an ink discharge device 110 this ink 112 is filled in the receiving space 106.This ink discharge device 110 can be selected Thermal Bubble Ink-jet Printer device (Thermal Bubble Ink Jet PrintingApparatus) or piezoelectric ink jet device (Piezoelectric Ink Jet Printing Apparatus) for use.
As shown in Figure 5, roughly the same for the volume of the curable composition volume that reaches the ink 112 in the receiving space 106 and this receiving space 106, excess ink 112 can be filled in this receiving space 106.Because the surface tension characteristics of liquid, excess ink 112 can form a liquid level of heaving and be unlikely to overflow on the opening 108 of receiving space 106.Usually, the ratio of the volume of the receiving space that the curable composition volume of this ink is corresponding with this is in the scope of 65%-135%, and is preferred, in the scope of 80%-120%.And one of comparatively desirable situation is, the curable composition volume equates substantially with the volume of its receiving space 106.The volume of excess ink 112 is decided by the number percent that curable composition accounts in ink, the number percent that accounts in ink as curable composition is about 33%, this moment, the volume of excess ink 112 was about three times of volume of receiving space 106, and promptly the height H of excess ink 112 is three times of height h of barricade.The volume of receiving space 106 can be determined by following: the value that multiply by the height h gained of barricade with the surface area of substrate in the receiving space 106 is the volume of receiving space 106.Definite method of ink 112 volumes is similar to definite method of receiving space 106 volumes, and is no longer burdensome at this.Certainly, the volume of excess ink 112 can surpass the twice of the volume of receiving space 106.
These a plurality of receiving spaces 106 can carry out the filling of ink 112 one by one, perhaps carry out the filling of ink 112 simultaneously by a plurality of ink guns.In addition, these a plurality of receiving spaces 106 can be filled different inks respectively, for example carry out the RGB ink as required and fill.
As shown in Figure 6, solidify the ink 112 in the receiving space 106 and form patterned layer on substrate 114.This solidifies main by a vacuum extractor, a heating arrangement, and an exposure device or three's combination in any is carried out.Most of solvent in the ink 112 is evaporated, and curable composition is stayed in the receiving space 106, and these compositions in solidification process crosslinked situation may take place.Therefore, this patterned layer on substrate 114 flushes substantially with the upper surface 1042 of barricade 104.
Therefore, after solidified ink 112, the volume of patterned layer on substrate 114 is equal to or less than the volume at the curable composition of the ink 112 of same position in the receiving space 106.This volume may reduce because of the variable density that solidification process caused.Because the difference of the volume of this curable composition volume and this receiving space 106 is less than 35%, preferably, less than 20%, therefore, the ratio of the volume of patterned layer on substrate 114 and the volume of receiving space 106 is in 50% to 135% scope in the receiving space 106.Preferably, in the receiving space 106 ratio of the volume of patterned layer on substrate 114 and the volume of receiving space 106 in 70% to 120% scope.In addition, the thickness of this patterned layer on substrate 114 roughly is comparable to the height of barricade 104.The ratio of the thickness of patterned layer on substrate 114 and the height of barricade 104 is in 50% to 135% scope, preferably, and the scope 70% to 120%.
This patterned layer on substrate 114 has smooth surface and has the height roughly close with the height h of barricade 104.Usually, need not more flow process the surface of patterned layer on substrate 114 is handled, thereby shortened manufacturing time.
This substrate 100 is applicable to colored filter and organic exposure device.In addition, as required, this barricade 104 can partly remove from this substrate 100.
In addition, those skilled in the art also can do other variation in spirit of the present invention.Certainly, the variation that these are done according to spirit of the present invention all should be included within the present invention's scope required for protection.
Claims (32)
1. manufacture method with substrate of patterned layer on substrate, its step is as follows:
One preformed substrate is provided, and it has a plurality of barricades that repel ink performance that have, and forms a plurality of receiving spaces between these a plurality of barricades;
The ink that will contain curable composition is filled in respectively in these a plurality of receiving spaces, wherein is contained in the volume of the ink volume of each receiving space greater than its pairing receiving space; And
Solidified ink and make the curable composition in this ink in this receiving space, form patterned layer on substrate.
2. the manufacture method with substrate of patterned layer on substrate as claimed in claim 1 is characterized in that, the volume of the curable composition in the described ink is less than half of the volume of this ink.
3. the manufacture method with substrate of patterned layer on substrate as claimed in claim 1 is characterized in that, the volume that is housed in each receiving space ink inside is the twice at least of the volume of corresponding receiving space.
4. the manufacture method with substrate of patterned layer on substrate as claimed in claim 1 is characterized in that, described preformed substrate is made step by step by following:
One substrate is provided;
Coating one photoresist layer on this substrate;
Adopt light shield to this photoresist layer exposure; And
Develop this photoresist layer and form this a plurality of barricades.
5. the manufacture method with substrate of patterned layer on substrate as claimed in claim 1 is characterized in that, this preformed substrate is that the method by plastic forming makes.
6. the manufacture method with substrate of patterned layer on substrate as claimed in claim 1 is characterized in that, this ink is to be filled in this receiving space by ink discharge device.
7. the manufacture method with substrate of patterned layer on substrate as claimed in claim 6 is characterized in that described ink discharge device comprises Thermal Bubble Ink-jet Printer device or piezoelectric ink jet device.
8. the manufacture method with substrate of patterned layer on substrate as claimed in claim 1, it is characterized in that described ink is to be cured by a vacuum extractor, a heating arrangement or an exposure device, perhaps adopts two or three of above-mentioned three's mode to be cured simultaneously.
9. the manufacture method with substrate of patterned layer on substrate as claimed in claim 1, the ink that it is characterized in that being filled in the receiving space has the liquid level of heaving.
10. the manufacture method with substrate of patterned layer on substrate as claimed in claim 1 further comprises a step: behind solidification process, partly remove a plurality of barricades on the substrate.
11. the manufacture method with substrate of patterned layer on substrate as claimed in claim 1 is characterized in that, the ratio of the volume of the receiving space that the curable composition volume of this ink is corresponding with this is in the scope of 65%-135%.
12. the manufacture method with substrate of patterned layer on substrate as claimed in claim 1 is characterized in that, the ratio of the volume of the receiving space that the curable composition volume of this ink is corresponding with this is in the scope of 80%-120%.
13. the manufacture method with substrate of patterned layer on substrate as claimed in claim 1 is characterized in that, the ratio of the volume of this patterned layer on substrate and the volume of corresponding receiving space is in 50% to 135% scope.
14. the manufacture method with substrate of patterned layer on substrate as claimed in claim 1 is characterized in that, the ratio of the volume of this patterned layer on substrate and the volume of corresponding receiving space is in 70% to 120% scope.
15. the manufacture method with substrate of patterned layer on substrate as claimed in claim 1 is characterized in that, the ratio of the thickness of this patterned layer on substrate and the height of corresponding barricade is in 50% to 135% scope.
16. the manufacture method with substrate of patterned layer on substrate as claimed in claim 1 is characterized in that, the ratio of the thickness of this patterned layer on substrate and the height of corresponding barricade is in 70% to 120% scope.
17. the manufacture method with substrate of patterned layer on substrate as claimed in claim 1 is characterized in that contact angle between ink and the corresponding barricade is greater than 15 degree and less than 90 degree.
18. the manufacture method with substrate of patterned layer on substrate as claimed in claim 1 is characterized in that contact angle between ink and the corresponding barricade is greater than 20 degree and 65 degree.
19. the manufacture method with substrate of patterned layer on substrate as claimed in claim 1 is characterized in that described barricade is made up of the single or multiple lift structure.
20. the manufacture method with substrate of patterned layer on substrate, its step is as follows:
One preformed substrate is provided, and it has a plurality of barricades that repel ink performance that have, and forms a plurality of receiving spaces between these a plurality of barricades;
The ink that will contain curable composition is filled in respectively in these a plurality of receiving spaces, and make the volume of the volume of curable composition of the ink in each receiving space and this receiving space roughly the same, wherein be contained in the volume of the ink volume of each receiving space greater than its pairing receiving space; And
Solidified ink and make the curable composition in this ink in this receiving space, form patterned layer on substrate.
21. the manufacture method with substrate of patterned layer on substrate as claimed in claim 20 is characterized in that, the volume of the curable composition in the described ink is less than half of the volume of this ink.
22. the manufacture method with substrate of patterned layer on substrate as claimed in claim 20 is characterized in that, the volume that is housed in each receiving space ink inside is the twice at least of the volume of corresponding receiving space.
23. the manufacture method with substrate of patterned layer on substrate as claimed in claim 20 is characterized in that, described preformed substrate is made step by step by following:
One substrate is provided;
Coating one photoresist layer on this substrate;
Adopt light shield to this photoresist layer exposure; And
Develop this photoresist layer and form this a plurality of barricades.
24. the manufacture method with substrate of patterned layer on substrate as claimed in claim 20 is characterized in that, this preformed substrate is that the manufacture method by the substrate with patterned layer on substrate of plastic forming makes.
25. the manufacture method with substrate of patterned layer on substrate as claimed in claim 20 is characterized in that, this ink is to be filled in this receiving space by ink discharge device, and described ink discharge device comprises Thermal Bubble Ink-jet Printer device or piezoelectric ink jet device.
26. the manufacture method with substrate of patterned layer on substrate as claimed in claim 20, it is characterized in that described ink is to be cured by a vacuum extractor, a heating arrangement or an exposure device, perhaps adopts two or three of above-mentioned three's mode to be cured simultaneously.
27. the manufacture method with substrate of patterned layer on substrate as claimed in claim 20, the ink that it is characterized in that being filled in the receiving space has the liquid level of heaving.
28. the manufacture method with substrate of patterned layer on substrate as claimed in claim 20 further comprises a step: behind solidification process, partly remove a plurality of barricades on the substrate.
29. the manufacture method with substrate of patterned layer on substrate as claimed in claim 20 is characterized in that, the ratio of the volume of this patterned layer on substrate and the volume of corresponding receiving space is in 50% to 135% scope.
30. the manufacture method with substrate of patterned layer on substrate as claimed in claim 20 is characterized in that, the ratio of the volume of this patterned layer on substrate and the volume of corresponding receiving space is in 70% to 120% scope.
31. the manufacture method with substrate of patterned layer on substrate as claimed in claim 20 is characterized in that, the ratio of the thickness of this patterned layer on substrate and the height of corresponding barricade is in 50% to 135% scope.
32. the manufacture method with substrate of patterned layer on substrate as claimed in claim 20 is characterized in that, the ratio of the thickness of this patterned layer on substrate and the height of corresponding barricade is in 70% to 120% scope.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100036520A CN101231361A (en) | 2007-01-23 | 2007-01-23 | Method for manufacturing substrate with thin membrane pattern layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100036520A CN101231361A (en) | 2007-01-23 | 2007-01-23 | Method for manufacturing substrate with thin membrane pattern layer |
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| Publication Number | Publication Date |
|---|---|
| CN101231361A true CN101231361A (en) | 2008-07-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007100036520A Pending CN101231361A (en) | 2007-01-23 | 2007-01-23 | Method for manufacturing substrate with thin membrane pattern layer |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102096264A (en) * | 2011-02-24 | 2011-06-15 | 华映视讯（吴江）有限公司 | Pixel array substrate and reflective display panel |
| CN102152674A (en) * | 2010-11-25 | 2011-08-17 | 浙江大学 | Color printing method based on optical interference principle |
| WO2021173938A1 (en) * | 2020-02-26 | 2021-09-02 | Commscope Technologies Llc | Distributed antenna system antenna mount |
-
2007
- 2007-01-23 CN CNA2007100036520A patent/CN101231361A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102152674A (en) * | 2010-11-25 | 2011-08-17 | 浙江大学 | Color printing method based on optical interference principle |
| CN102096264A (en) * | 2011-02-24 | 2011-06-15 | 华映视讯（吴江）有限公司 | Pixel array substrate and reflective display panel |
| CN102096264B (en) * | 2011-02-24 | 2014-03-26 | 华映视讯（吴江）有限公司 | Pixel array substrate and reflective display panel |
| WO2021173938A1 (en) * | 2020-02-26 | 2021-09-02 | Commscope Technologies Llc | Distributed antenna system antenna mount |
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Open date: 20080730 |