CN1011889B - 新型静态破碎剂 - Google Patents
新型静态破碎剂Info
- Publication number
- CN1011889B CN1011889B CN87102228A CN87102228A CN1011889B CN 1011889 B CN1011889 B CN 1011889B CN 87102228 A CN87102228 A CN 87102228A CN 87102228 A CN87102228 A CN 87102228A CN 1011889 B CN1011889 B CN 1011889B
- Authority
- CN
- China
- Prior art keywords
- cement
- industrial grade
- agent
- citric acid
- gross weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000003068 static effect Effects 0.000 title claims abstract description 17
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 27
- 235000008733 Citrus aurantifolia Nutrition 0.000 claims abstract description 18
- 235000011941 Tilia x europaea Nutrition 0.000 claims abstract description 18
- 239000004571 lime Substances 0.000 claims abstract description 18
- 239000004567 concrete Substances 0.000 claims abstract description 9
- 239000011435 rock Substances 0.000 claims abstract description 5
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 30
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims description 20
- 239000004568 cement Substances 0.000 claims description 17
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 14
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 8
- 239000007787 solid Substances 0.000 claims description 8
- 239000012745 toughening agent Substances 0.000 claims description 8
- CZMRCDWAGMRECN-UGDNZRGBSA-N Sucrose Chemical compound O[C@H]1[C@H](O)[C@@H](CO)O[C@@]1(CO)O[C@@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 CZMRCDWAGMRECN-UGDNZRGBSA-N 0.000 claims description 6
- 229930006000 Sucrose Natural products 0.000 claims description 6
- 238000010276 construction Methods 0.000 claims description 5
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Substances [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 claims description 4
- 235000015320 potassium carbonate Nutrition 0.000 claims description 4
- 235000017550 sodium carbonate Nutrition 0.000 claims description 4
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 4
- 238000001354 calcination Methods 0.000 claims description 3
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 2
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 claims description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 2
- 239000011398 Portland cement Substances 0.000 claims description 2
- DPDMMXDBJGCCQC-UHFFFAOYSA-N [Na].[Cl] Chemical compound [Na].[Cl] DPDMMXDBJGCCQC-UHFFFAOYSA-N 0.000 claims description 2
- 230000002528 anti-freeze Effects 0.000 claims description 2
- 239000011575 calcium Substances 0.000 claims description 2
- 229910052791 calcium Inorganic materials 0.000 claims description 2
- XFWJKVMFIVXPKK-UHFFFAOYSA-N calcium;oxido(oxo)alumane Chemical compound [Ca+2].[O-][Al]=O.[O-][Al]=O XFWJKVMFIVXPKK-UHFFFAOYSA-N 0.000 claims description 2
- 239000007859 condensation product Substances 0.000 claims description 2
- NVVZQXQBYZPMLJ-UHFFFAOYSA-N formaldehyde;naphthalene-1-sulfonic acid Chemical compound O=C.C1=CC=C2C(S(=O)(=O)O)=CC=CC2=C1 NVVZQXQBYZPMLJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000003129 oil well Substances 0.000 claims description 2
- 239000011734 sodium Substances 0.000 claims description 2
- 229910052708 sodium Inorganic materials 0.000 claims description 2
- 159000000000 sodium salts Chemical class 0.000 claims description 2
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims description 2
- -1 Sunmorl N 60S Chemical compound 0.000 claims 1
- 239000001110 calcium chloride Substances 0.000 claims 1
- 229910001628 calcium chloride Inorganic materials 0.000 claims 1
- 238000005336 cracking Methods 0.000 abstract description 15
- 238000002156 mixing Methods 0.000 abstract description 8
- 239000002994 raw material Substances 0.000 abstract description 4
- 238000002360 preparation method Methods 0.000 abstract description 3
- 239000011150 reinforced concrete Substances 0.000 abstract description 3
- 239000000654 additive Substances 0.000 abstract 1
- 230000000996 additive effect Effects 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- 239000003814 drug Substances 0.000 description 10
- 239000013078 crystal Substances 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000000843 powder Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000006703 hydration reaction Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 241000209094 Oryza Species 0.000 description 2
- 235000007164 Oryza sativa Nutrition 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 2
- 239000000292 calcium oxide Substances 0.000 description 2
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 2
- 235000013339 cereals Nutrition 0.000 description 2
- BCAARMUWIRURQS-UHFFFAOYSA-N dicalcium;oxocalcium;silicate Chemical compound [Ca+2].[Ca+2].[Ca]=O.[O-][Si]([O-])([O-])[O-] BCAARMUWIRURQS-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004880 explosion Methods 0.000 description 2
- 239000010440 gypsum Substances 0.000 description 2
- 229910052602 gypsum Inorganic materials 0.000 description 2
- 238000003837 high-temperature calcination Methods 0.000 description 2
- 230000036632 reaction speed Effects 0.000 description 2
- 235000009566 rice Nutrition 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000003351 stiffener Substances 0.000 description 2
- 235000019976 tricalcium silicate Nutrition 0.000 description 2
- 229910021534 tricalcium silicate Inorganic materials 0.000 description 2
- 241000196324 Embryophyta Species 0.000 description 1
- 235000019738 Limestone Nutrition 0.000 description 1
- 208000034189 Sclerosis Diseases 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000029087 digestion Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010433 feldspar Substances 0.000 description 1
- 239000010436 fluorite Substances 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 238000005469 granulation Methods 0.000 description 1
- 230000003179 granulation Effects 0.000 description 1
- 230000036571 hydration Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000006028 limestone Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
Classifications
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- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B18/00—Shaping glass in contact with the surface of a liquid
- C03B18/02—Forming sheets
- C03B18/16—Construction of the float tank; Use of material for the float tank; Coating or protection of the tank wall
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/04—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with articles made from glass
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B23/00—Re-forming shaped glass
- C03B23/02—Re-forming glass sheets
- C03B23/023—Re-forming glass sheets by bending
- C03B23/03—Re-forming glass sheets by bending by press-bending between shaping moulds
- C03B23/0302—Re-forming glass sheets by bending by press-bending between shaping moulds between opposing full-face shaping moulds
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B23/00—Re-forming shaped glass
- C03B23/02—Re-forming glass sheets
- C03B23/023—Re-forming glass sheets by bending
- C03B23/03—Re-forming glass sheets by bending by press-bending between shaping moulds
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B18/00—Shaping glass in contact with the surface of a liquid
- C03B18/02—Forming sheets
- C03B18/04—Changing or regulating the dimensions of the molten glass ribbon
- C03B18/06—Changing or regulating the dimensions of the molten glass ribbon using mechanical means, e.g. restrictor bars, edge rollers
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- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B18/00—Shaping glass in contact with the surface of a liquid
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- C03B18/18—Controlling or regulating the temperature of the float bath; Composition or purification of the float bath
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- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B35/00—Transporting of glass products during their manufacture, e.g. hot glass lenses, prisms
- C03B35/14—Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands
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- C03B35/147—Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands by top-side transfer or supporting devices, e.g. lifting or conveying using suction of the non-contact type
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- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B35/00—Transporting of glass products during their manufacture, e.g. hot glass lenses, prisms
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- C03B35/16—Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands by roller conveyors
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- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B35/00—Transporting of glass products during their manufacture, e.g. hot glass lenses, prisms
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- C03B35/22—Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands on a fluid support bed, e.g. on molten metal
- C03B35/24—Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands on a fluid support bed, e.g. on molten metal on a gas support bed
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- C03C14/00—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
- C03C14/004—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix the non-glass component being in the form of particles or flakes
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
- H01L21/4807—Ceramic parts
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4857—Multilayer substrates
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B2225/00—Transporting hot glass sheets during their manufacture
- C03B2225/02—Means for positioning, aligning or orientating the sheets during their travel, e.g. stops
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2214/00—Nature of the non-vitreous component
- C03C2214/04—Particles; Flakes
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H01L2924/01004—Beryllium [Be]
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- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
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- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
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- H01L2924/20—Parameters
- H01L2924/207—Diameter ranges
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
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Abstract
一种用于破碎岩石、混凝土、钢筋混凝土结构的静态破碎剂,它由经过一定高温锻烧,保温一定时间的石灰,与凝结硬化剂,催固增强剂作为主剂,外加延缓剂,低温外加剂配制而成。上述原料的重量配合比依次为:50-95%∶2.25-22.5%;2.75-27.5%;0.1-4%∶0.5-2%∶掺水重量比30-40%。
这种新型静态破碎剂具有开裂时间短,膨胀力强、安全、适应各种气候条件,可适当调节破坏物开裂时间、成本低等特点。
Description
本发明涉及一种静态破碎剂,用于破碎岩石、混凝土和钢筋混凝土结构。
公知的静态破碎剂,如日本专利申请特开昭55-142894,其组成的主要成份硅酸三钙3Cao·Sio2晶粒占24-26%(重量),Cao晶粒占30-60%(重量)和石膏CaSo45-17%(重量)上述晶粒,是用一定量的石灰质原料、硅酸质原料和石膏按一定的重量比,经过破碎磨细、混合造粒后,在1350℃-1550℃温度下锻烧、磨细、得出的硅酸三钙3Cao·Sio2中含有50%以上Cao晶粒的烧结块粉末,这种破碎剂虽然有一定的膨胀力,但破坏物开裂速度缓慢,一般约需数小时乃至数日,才能发挥出最大膨胀力的作用,其适用温度范围为:-5℃-35℃,由于在工厂定型生产,在使用上受到一定的限制。美国专利US4,565,579石灰荧石破碎剂的开裂时间也需9-48小时,总之当前市场上见到的静态破碎剂还存在着下述问题,即(1)开裂时间长,(2)不适宜严寒和高温气候条件,(3)工厂化生产需要复杂的机具设备、工艺流程、检测手段,(4)不能在使用中根据环境温度适当调节破坏物开裂时间。
本发明的目的是提供一种新型静态破碎剂,它的开裂时间短,膨胀力强,各种原料能在常温下拌合,不需大型工厂化生产,成本低,按照表所列参考配合比,在气温为-22℃-44℃地区均能将物体破坏。
发明是这样实现的,采用经过1400℃-1600℃高温锻烧,保温在60小时以上的过烧石灰,凝结硬化剂,催固增强剂混合物为主
剂,外加延缓剂,低温外加剂配制而成。过烧石灰晶体粒度尺寸平均为35μ,其中<30μ者约占25%,>40μ者约占20%,在30-40μ间者约占55%,磨细后通过0.08m/m的筛孔,筛余量≯8%;凝结硬化剂采用425#以上的波特兰水泥(CM)、矿渣硅酸盐水泥(SCM)、白水泥(WCM)、油井水泥(OW)、矾土水泥(VM)其中之一;催固增强剂用硫铝酸盐早强水泥(CaSW)、高钙铝酸盐水泥(SHES)二者之一;延缓剂采用工业萘(uNF2)、β萘磺酸甲醛缩合物钠盐(NF)、精萘(FDN)、亚甲基二萘磺酸钠(NNO)、木质磺酸钙(MG)、白糖(SG)、柠檬酸(LMA)、葡萄糖酸钠(GLS)、福尔马林(FM)、柠檬酸+工业萘、柠檬酸+工业萘+碳酸钠、柠檬酸+碳酸钾、工业萘+碳酸钠、精萘+碳酸钾+葡萄糖酸钠+柠檬酸、福尔马林+白糖、工业萘+福尔马林、白糖+工业萘其中之一;低温外加剂采用氯化钙(CaCl2)、氯化钠(NaCl),汽车防冻液(AFS),混凝土防冻剂(AFA)其中之一。静态破碎剂的配合比,过烧石灰占主剂的50-95%(重量比),水泥凝结硬化剂占主剂的2.25-22.5%(重量比),催固增强剂占主剂的2.75-27.5%(重量比),延缓剂占主剂的0.1-4%(重量比),低温外加剂占主剂的0.5-2%,掺水重量比30-40%。
现进一步叙述本发明的技术细节和组成要素:
过烧石灰的生产工艺有两种途径,第一,将石灰石(碳酸钙含量不低于90%)用1400-1600℃高温锻烧,经保温60小时以上后,得到的晶体粒度尺寸平均为35μ,其中小于30μ者约占25%大于40μ者约占20%,在30-40μ之间约占55%,磨细后通
过0.08m/m筛孔,筛余量≯8%的灰白色粉末,第二种途径是直接从生产石灰窑中拣取过烧石灰磨细。当石灰锻烧温度在1200-1400℃时,且持续一定时间后,氧化钙的晶体发生重结晶,晶体颗粒开始逐渐增大,颗粒间空隙逐步减少,氧化钙的结构变得紧密,其密度增大,活性大大降低,消化时间延长,即意味着水分子向石灰颗粒内部的渗透速度和水化过程的延缓,这种过烧石灰作为膨胀源,其膨胀力可以达到300-500kg/cm2。
过烧石灰的质量检验方法,取100克过烧石灰粉在300毫升的塑料烧杯内与水混合,掺水重量比40%,当温度上升至100℃所需时间不小于4分钟,膨胀量大于150%时方属合格,允许在静态破碎剂中使用。
凝结硬化剂用于控制药剂向上膨胀及提供破碎强度并调节催固增强剂的凝固时间,催固增强剂与凝结硬化剂按一定比例关系配合使用,可以缩短药剂固化时间并增大其强度,按照固定比例关系配制的水泥凝结硬化剂和硫铝酸盐早强水泥或SHES催固增强剂再与过烧石灰磨细粉末及延缓剂混合,所配制的药剂再加入一定的用水量后,最快能在几分钟内硬化,使岩石和混凝土、钢筋混凝土缓慢破坏。
延缓剂用于延迟药剂的水化反应速度,如减水剂可增加浆液单位体积的药剂含量、流动度及和易性。延缓剂有单一型或复合型两种,后者延缓性能比较好。
低温外加剂用于降低浆液冰点,增大发热量,加快水化反应速度。
本发明列举了不同环境温度混凝土开裂时间的参考配合比及破坏时间短的新配合比设计,见表1
表1:静态破碎剂配合比及开裂时间表
ω/C-掺水重量比=水的重量/药剂重量
CR-瓷杯试验
RCP-钢筋混凝土构件试验
GR-花岗岩试验
备注栏中没有说明者,系混凝土块试验。
按表1选择参考配合比时,可按作业地点的环境温度查找开裂时间最短的配合比,若根据需要需延长开裂时间可以适当调整延缓剂的比例,以及减少过烧石灰的比例。
现结合实施例叙述本发明的使用细节。
实例1:衡广线大庙峡简易公路路堑施工,需爆破27米长石方约500m3,为了避免爆破影响中央、地方、铁路三条通讯干线和正下方高差25米处的通车隧道,采用静态爆破技术施工,该处上午10点后气温达44℃以上采用的配合比如表2
大庙峡路堑施工配合比 表2
环境 岩石 药剂配合比% 外加剂配合比% 掺水 备考
温度 开裂 过烧 重量
(℃) 时间 Casω CM 石灰 LMA uNF2NAC 比
27° 49′ 8.25 6.75 85 0.2 0.3 0.4 0.36
28° 70′ 8.25 6.75 85 0.25 0.3 0.4 0.36
29° 80′ 8.25 6.75 85 0.50 0.3 1.0 0.36
FDN
44℃ 60′ 22 18 60 0.48 1 1.52 0.36
44℃ 38′ 22 18 60 0.12 0 0.38 0.36
全段石方钻炮孔2893个,孔距0.25-0.4米,孔深0.5-1.2米。
实例2:拆除大庆地区钢筋混凝土框架梁,该梁基础长39米,宽8米,高6米,钢筋混凝土梁的断面为1×1.2,1×1.6m2两种,柱的断面为1×1.0m2,施工时室外温度-27℃室内-5℃~-9℃采用的配方如下:
环境 钢筋混 药剂配方比% 外加剂配 比% 掺水 备考
温度 凝土开 过烧 重量
(℃) 裂时间 Casω CM 石灰 LMA uNF2NAC 比
-6℃ 8h05 5.5 4.5 90 0.156 1 1 0.36
框架梁基础钻炮孔4728个,孔距0.2米,孔深1米,梁、柱开裂时间一般为5-10小时。
实例3,欲破坏一钢筋混凝土框架梁,作业温度14℃,求破坏时间最短的参考配比。
从表1查得12-15℃栏内最短开裂时间56分钟的参考配比为:
药剂配合比% 外加剂配合比% 掺水重 备考
Casω CM 过烧石灰 LMA uNF2NAC 量比
5.5 4.5 90 0.125 0.125 / 0.36
药剂配制有两种方法,第一种:将药剂与外加剂先行混合后,使用时才加水。第二种:将外加剂先溶于水中,使用时再与药剂混合,在此温度条件下,钢筋混凝土框架的最快破碎时间为1h09′。
Claims (5)
1、一种用于破碎岩石、混凝土和钢筋混凝土结构的静态破碎剂,其特征在于:由占总重50~95%的经过1400~1600℃锻烧,保温至少60小时的过烧石灰,占总重2.25~22.5%的凝结硬化剂,占总重2.75~27.5%的催固增强剂组成,或加入占总重0.1~4%的延缓剂或占总重0.5~2%的低温外加剂。
2、根据权利要求1所述的静态破碎剂,其特征在于采用425#以上的波特兰水泥,矿渣硅酸盐水泥、白水泥、油井水泥、矾土水泥之中的一种做为凝结硬化剂。
3、根据权利要求1所述的静态破碎剂,其特征在于采用硫铝酸盐早强水泥、高钙铝酸盐水泥两者之一做为催固增强剂。
4、根据权利要求1所述的静态破碎剂,其特征在于采用工业萘、β萘磺酸甲醛缩合物钠盐、精萘、亚甲基二萘磺酸钠、木质磺酸钙、白糖、柠檬酸、葡萄糖酸钠、福尔马林、柠檬酸+工业萘、柠檬酸+工业萘+碳酸钠、柠檬酸+碳酸钾、工业萘+碳酸钠、精萘+碳酸钾+葡萄糖酸钠+柠檬酸、福尔马林+白糖、工业萘+福尔马林、白糖+工业萘之中的一种做为延缓剂。
5、根据权利要求1所述的静态破碎剂,其特征在于采用氯化钙、氯化钠、汽车防冻液、混凝土防冻剂之中的一种做为低温外加剂。
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CN102010169B (zh) * | 2009-09-08 | 2013-04-03 | 北京中捷京工科技发展有限公司 | 一种静态破碎剂 |
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