CN101184630A - Gravure engraving roll and process for producing the same - Google Patents
Gravure engraving roll and process for producing the same Download PDFInfo
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- CN101184630A CN101184630A CNA200680018737XA CN200680018737A CN101184630A CN 101184630 A CN101184630 A CN 101184630A CN A200680018737X A CNA200680018737X A CN A200680018737XA CN 200680018737 A CN200680018737 A CN 200680018737A CN 101184630 A CN101184630 A CN 101184630A
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Abstract
A novel gravure engraving roll that has a surface-reinforcing coating layer being nontoxic and having no danger of pollution generation at all and that excels in printing life; and a process for producing the same. There is provided a gravure engraving roll comprising a metal hollow roll; a copper plating layer superimposed on the surface of the hollow roll and on its surface furnished with a multiplicity of gravure cells; a metal layer superimposed on the surface of the copper plating layer; a layer of carbide of said metal superimposed on the surface of the metal layer; and a diamondlike carbon coating covering the surface of the metal carbide layer.
Description
Technical field
The present invention relates to a kind of chromium plating that need not, the gravure engraving roll and the manufacture method thereof that can possess surface peening coating with abundant intensity, relate in particular to the gravure engraving roll and the manufacture method thereof that are provided with diamond-like-carbon (DLC) layer, this diamond-like-carbon layer is used as the surface peening coating of substitute chromium layer.
Background technology
In intaglio printing, with respect to gravure engraving roll (gravure roll), form the small recess (inking hole) of corresponding plate-making information and make the space of a whole page, printing ink is filled in this inking hole, be transferred to and be printed on the thing.Generally speaking, in gravure engraving roll, on the surface of the metal system hollow roller of aluminium or iron etc., be provided for forming the copper coating (plate) of the space of a whole page, by etching, on this copper coating, form a plurality of small recess (inking hole) of corresponding plate-making information, then, in order to increase the anti-brush power of gravure engraving roll, form the chromium layer of hard by chromium plating, with it as the surface peening coating, thereby finish plate-making (making of the space of a whole page).But, in the chromium plating operation,,, not only want the cost of overspending in order to realize job safety owing to use highly toxic Cr VI, also can cause pollution problem, therefore, a kind of surface peening coating of substitute chromium layer is developed in expectation now.
On the other hand, about the manufacturing of gravure engraving roll (gravure roll), be known that on the copper coating that forms the inking hole, to form diamond-like-carbon (DLC) layer, with its technology (Patent Document 1) as the surface peening coating, but exist the adherence of DLC layer and copper poor, the problem of peeling off easily.In addition, applicant of the present invention has proposed on metal hollow roller to form rubber or resin bed, form the tunicle of diamond-like-carbon (DLC) thereon again after, form the inking hole, thereby produce the technical scheme (Patent Document 2～4) of intaglio printing plate.
Patent Document 1: the spy opens flat 4-282296 communique
Patent Document 2: the spy opens flat 11-309950 communique
Patent Document 3: the spy opens flat 11-327124 communique
Patent Document 4: the spy opens the 2000-15770 communique
Summary of the invention
Problem in view of above-mentioned prior art existence, the present inventor person, surface peening coating at the substitute chromium layer has carried out research with keen determination, found that by carbonization metal level metal level and this metal, and diamond-like-carbon (DLC) layer is used in combination, can obtain to have the intensity that is equal to the chromium layer, and avirulence and at all need not to worry the surface peening coating of pollution problem, thereby the present invention finished.
The objective of the invention is to, a kind of novel gravure plate-making roller and manufacture method thereof are provided, this gravure engraving roll and manufacture method thereof possess avirulence and need not to worry to cause the surface peening coating of public hazards at all, and have good anti-brush power.
In order to address the above problem, gravure engraving roll of the present invention is characterised in that, comprising: metal system hollow roller; Be located on this hollow roller surface and form the copper coating in a plurality of inkings hole from the teeth outwards; Be located at the lip-deep metal level of this copper coating; Be located at the carbonization metal level of this metal on this layer on surface of metal; Diamond-like-carbon (DLC) tunicle on surface of this carbonization metal level is covered.
The manufacture method of gravure engraving roll of the present invention is characterised in that, comprising: the operation of preparing metal system hollow roller; On this hollow roller surface, form the copper facing operation of copper coating; The inking hole that forms a plurality of inkings hole on the surface of this copper coating forms operation; The metal level that forms metal level on the surface of this copper coating forms operation; The carbonization metal level that forms the carbonization metal level of this metal level on the surface of this metal level forms operation; The DLC carbon coating that forms the DLC carbon coating on the surface of this carbonization metal level forms operation.
Described carbonization metal level is preferably carbonization metal dipping bed, and the ratio of components of the carbon in this carbonization metal dipping bed is set to from described metal level side to described DLC carbon coating direction, and the ratio of carbon increases gradually.
The thickness that is preferably described copper coating is 50～200 μ m, the degree of depth in described inking hole is 5～150 μ m, described metal layer thickness is 0.1～1 μ m, and described carbonization metal layer thickness is 0.1～1 μ m, and the thickness of described DLC carbon coating is 0.1～10 μ m.
Preferably form described metal level, described carbonization metal level, preferred carbonization metal dipping bed respectively, reach described DLC carbon coating by sputtering method.
As described metal, but preferably adopt carbonization and the metal high with the compatibility of copper.
Described metal is preferably one or more the metal of selecting from tungsten (W), silicon (Si), titanium (Ti), chromium (Cr), tantalum (Ta) and zirconium (Zr).
The formation in described inking hole can be undertaken by etching method or electronic engraving method, but preferably adopt etching method.Here so-called etching method is meant after painting photosensitive liquid roasting direct on the version trunk face of gravure roll, forms the method in inking hole through etching.The electronic engraving method be meant by data signal make the mechanicalness work of diamond engraving needle and on the copper surface of gravure roll the method in engraving inking hole.
According to the present invention, owing to adopt diamond-like-carbon (DLC) tunicle as the surface peening coating, can omit the chromium plating operation, therefore need not to use highly toxic Cr VI, can be because of not realizing the cost of job safety overspending, also need not to worry pollution problem at all, and, therefore can produce good effect because diamond-like-carbon (DLC) tunicle has the intensity that is equal to mutually with the chromium layer and good anti-brush power.
Description of drawings
Fig. 1 is the mode declaration pattern specification figure of the manufacturing process of expression gravure engraving roll of the present invention.(a) be the whole profile of expression hollow roller; (b) be to be illustrated in the part amplification profile that has formed the state of copper coating on the surface of hollow roller; (c) be to be illustrated in the part amplification profile that has formed the state in inking hole on the copper coating of hollow roller; (d) be to be illustrated in the part amplification profile that has formed the state of carbide layers on the copper coating surface of hollow roller; (e) be to be illustrated in the part amplification profile that has formed the state of carbonization metal level on the layer on surface of metal of hollow roller; (f) be the part amplification profile that is illustrated in the state of diamond-like-carbon (DLC) tunicle that has been covered on the carbonization layer on surface of metal of hollow roller.
Fig. 2 is the flow chart of the manufacture method of expression gravure engraving roll of the present invention.
Fig. 3 is the amplification profile of wanting portion of expression gravure engraving roll of the present invention.
Symbol description
10 editions mother metals (hollow roller)
The 10a gravure engraving roll
12 copper coatings
14 inking holes
16 metal levels
18 carbonization metal levels, be preferably carbonization metal dipping bed
20 diamond-like-carbons (DLC) tunicle
The specific embodiment
Below, embodiments of the present invention are described, but these embodiments only are example, certainly,, can carry out various distortion as long as in the scope that does not exceed technological thought of the present invention.
Fig. 1 is the mode declaration pattern specification figure of the manufacturing process of expression gravure engraving roll of the present invention.(a) be the whole profile of expression hollow roller; (b) be to be illustrated in the part amplification profile that has formed the state of copper coating on the surface of hollow roller; (c) be to be illustrated in the part amplification profile that has formed the state in inking hole on the copper coating of hollow roller; (d) be to be illustrated in the part amplification profile that has formed the state of carbide layers on the copper coating surface of hollow roller; (e) be to be illustrated in the part amplification profile that has formed the state of carbonization metal level on the layer on surface of metal of hollow roller; (f) be the part amplification profile that is illustrated in the state of diamond-like-carbon (DLC) tunicle that has been covered on the carbonization layer on surface of metal of hollow roller.Fig. 2 is the flow chart of the manufacture method of expression gravure engraving roll of the present invention.Fig. 3 is the amplification profile of wanting portion of expression gravure engraving roll of the present invention.
With reference to figure 1～Fig. 3 the inventive method is described.In Fig. 1 (a) and Fig. 3, symbol 10 expression version mother metals adopt the metal system hollow roller of being made up of aluminium or iron etc. (step 100 among Fig. 2).By copper plating treatment, can on the surface of this hollow roller 10, form copper coating 12 (step 102 among Fig. 2).
On the surface of this copper coating 12, form a plurality of small recesses (inking hole) 14 (steps 104 among Fig. 2).Formation method as inking hole 14, can adopt etching method (after painting photosensitive liquid roasting direct on the version trunk face of gravure roll, form inking hole 14 through etching) and the electronic engraving method (make the work of diamond engraving needle mechanicalness by data signal, engraving inking hole 14 on the copper surface) disclosed method such as, but preferably adopt etching method.
Secondly, on the surface of the copper coating 12 (comprising inking hole 14) that forms inking hole 14, form metal level 16 (step 106 among Fig. 2).Moreover, on the surface of this metal level 16, form the carbonization metal level of this metal level, be preferably formed carbonization metal dipping bed 18 (step 108 among Fig. 2).As forming metal level 16 and carbonization metal level, being preferably the formation method of carbonization metal dipping bed 18, can be suitable for sputtering method, vacuum deposition method (Electron Beam Method), ion plating method (IonPlating Method), MBE (molecular beam epitaxy; Molecular Beam Epitaxy), laser ablation method (Laser Ablation Method), ion are assisted into embrane method, plasma vapor deposition processes disclosed methods such as (Plasma CVD Method), but are preferably adopted sputtering method.
As described metal, preferred employing can carbonization and the metal high with the compatibility of copper.As this metal, can adopt tungsten (W), silicon (Si), titanium (Ti), chromium (Cr), tantalum (Ta) and zirconium (Zr) etc.
Described carbonization metal level is preferably metal in the carbonization metal dipping bed 18 and adopts the metal identical with described metal level 16.The ratio of components of the carbon in the carbonization metal dipping bed 18 is set at from metal level 16 1 sides towards diamond-like-carbon described later (DLC) tunicle 20 directions, and the ratio of carbon increases gradually.That is, when carrying out film forming, the ratio of components that makes carbon increases (stepped or do not have stepped) gradually from 0%, becomes roughly 100% at last.
In this case, the carbonization metal level, the method of adjustment that is preferably the ratio of components of the carbon in the carbonization metal dipping bed 18 can adopt disclosed method, but for example (adopt the solid metal target by sputtering method, no stepped ground increases hydrocarbon gas gradually in argon gas atmosphere, methane gas for example, ethane gas, propane gas, the injection rate of acetylene gas etc.), can form ratio with the carbon in the carbonization metal level 18, be set at from copper coating 12 1 sides stepped or do not have stepped ground and increase gradually towards diamond-like-carbon (DLC) tunicle 20 directions, and the carbonization metal level that the proportion of composing that makes carbon and metal both sides changes, i.e. carbonization metal dipping bed 18.
So, by adjusting the carbon ratio example of carbonization metal level 18, carbonization metal level 18 densities with respect to copper coating 12 and diamond-like-carbon (DLC) tunicle 20 both sides are improved.In addition,, can form the certain carbonization metal level of proportion of composing of carbon and metal, it is played and the identical effect of carbonization metal dipping bed if the injection rate of hydrocarbon gas is made as necessarily.
Then, at described carbonization metal level, be preferably that lining forms diamond-like-carbon (DLC) tunicle 20 (steps 110 of Fig. 2) on the surface of carbonization metal dipping bed 18.Formation method as diamond-like-carbon (DLC) tunicle 20, with metal level 16 and carbonization metal level, be preferably carbonization metal dipping bed 18 the formation method identical, can be suitable for sputtering method, vacuum deposition method (Electron BeamMethod), ion plating method (Ion Plating Method), MBE (molecular beam epitaxy; MolecularBeam Epitaxy), laser ablation method (Laser Ablation Method), ion are assisted into embrane method, plasma vapor deposition processes disclosed methods such as (Plasma CVD Method), but are preferably adopted sputtering method.
By being covered with above-mentioned diamond-like-carbon (DLC) tunicle 20, make this diamond-like-carbon (DLC) tunicle 20 play the effect of surface peening coating, can obtain avirulence and need not to worry gravure engraving roll 10a pollution problem, that have good anti-brush power at all.
When so-called here sputtering method is meant and will makes the material (target) of film with ion bombardment, material is spattered to fly, and makes to spatter the material that flies and be deposited in the method for making film on the substrate, it is characterized in that, restriction to target material is few, can make the film large-area, that repeatability is good.
Vacuum deposition method (Electron Beam Method) is meant the material that will make film with the electron beam irradiation, make its heating evaporation, make this materials evaporated adhere to (accumulation) makes film on substrate method, it is characterized in that, film forming speed is fast, and is little etc. to the damage of substrate.
The ion plating method is to instigate after making the material evaporation of film, and (RF ion plating applies method by radio frequency (RF); RF Ion Plating) or electric arc (arc ions plating method; Arc Ion Plating) make the material ionization, make it be deposited in the method for making film on the substrate, it is characterized in that film forming speed is fast, adhesive strength is big etc.
Molecular beam epitaxy is meant and makes raw material evaporation in ultrahigh vacuum, and it is supplied to film forming method on the substrate after the heating.
Laser ablation method is to point to the laser pulse that target is injected densification, makes ion overflow film forming method on the substrate of subtend.
Ion is assisted into embrane method and is meant evaporation source and ion gun are set in vacuum tank, utilizes the booster action of ion to carry out the method for film forming.
Plasma vapor deposition processes is meant when carrying out the CVD method under reduced pressure, and forming film under low temperature more is purpose, utilizes plasma exciatiaon that unstrpped gas is decomposed, and makes it react the method for accumulation on substrate.
Below, enumerate embodiment the present invention is carried out more specific description, but these embodiment only are example, should not carry out limited explanation to these embodiment certainly.
(embodiment 1～3)
With circumference is that the gravure roll (aluminum hollow roller) of 600mm, barrel length 1100mm is installed in the plating coating groove, automatic carriage by computer system control makes the anode chamber near hollow roller, till 20mm, plating solution is overflowed flood whole hollow roller, at 18A/dm
2, form the copper coating of 80 μ m under the 6.0V condition.The plating time is 20 minutes, makes the uniform copper coating that plating surface does not have projection and hole (Pit).
On the copper coating of above-mentioned formation, coat light-sensitive surface, image is carried out laser explosure develop, form the resist pattern picture after the oxidation, then, carry out dry etchings such as plasma etching, carve out the image that constitutes by the inking hole, form galley by removing the resist pattern picture thereafter.At this moment, the degree of depth of making the inking hole is respectively 3 hollow rollers of 10 μ m (embodiment 1), 18 μ m (embodiment 2), 30 μ m (embodiment 3).
On the surface of the copper coating that has formed this inking hole, form tungsten (W) layer by sputtering method.Sputtering condition is as described below.Tungsten (W) test portion: solid tungsten target; Atmosphere: argon gas atmosphere; Film-forming temperature: 200～300 ℃; Film formation time: 60 minutes; Film forming thickness: 0.1 μ m.
Secondly, on the surface of tungsten (W) layer, form carbide layers.Sputtering condition is as described below.Tungsten (W) test portion: solid tungsten target; Atmosphere: in argon gas atmosphere, increase hydrocarbon gas gradually; Film-forming temperature: 200～300 ℃; Film formation time: 60 minutes; Film forming thickness: 0.1 μ m.
Moreover being covered on the surface of carbide layers by sputtering method forms diamond-like-carbon (DLC) tunicle.Sputtering condition is as described below.DLC test portion: solid carbon target; Atmosphere: argon gas atmosphere; Film-forming temperature: 200～300 ℃; Film formation time: 150 minutes; Film forming thickness: 1 μ m.So, finish the making of gravure engraving roll (gravure roll).
Adopt 3 above-mentioned gravure roll, 10 μ m), the embodiment 2 (degree of depth in inking hole: 18 μ m), (degree of depth in inking hole: gravure roll 30 μ m) is suitable for water color ink, oil-based ink and silver paste printing ink respectively to embodiment 3, adopts OPP film (OrientedPolypropylene Film: bidirectional stretching polypropylene film) carried out printing test (print speed printing speed: 200m/ branch to the embodiment 1 (degree of depth in inking hole:; The length of OPP film: 4000m).The mist version does not all appear in the printed article that obtains, and transfer printing is good.Results verification diamond-like-carbon (DLC) tunicle has the performance that is equal to mutually with existing chromium layer, is enough to use as the substitute of chromium layer.
(embodiment 4～6)
Same with embodiment 1～3, the degree of depth of making the inking hole is respectively 3 hollow rollers of 10 μ m (embodiment 4), 18 μ m (embodiment 5), 30 μ m (embodiment 6).Except tungsten (W) test portion is replaced by silicon (Si) test portion, above-mentioned 3 hollow rollers are carried out the processing same with embodiment 1～3, make gravure engraving roll, carry out same printing test then, the result can obtain not have edition mist and the good printed article of transfer printing equally.In these embodiments, also confirm diamond-like-carbon (DLC) tunicle and have the performance that is equal to mutually with existing chromium layer, be enough to use as the substitute of chromium layer.In addition, as the metal test portion, carry out same experiment with titanium (Ti), chromium (Cr), affirmation can obtain same result.
Claims (12)
1. a gravure engraving roll is characterized in that, comprising: metal system hollow roller; Be located on this hollow roller surface and form the copper coating in a plurality of inkings hole from the teeth outwards; Be located at the lip-deep metal level of this copper coating; Be located at the carbonization metal level of this metal on this layer on surface of metal; The DLC carbon coating on surface of this carbonization metal level is covered.
2. gravure engraving roll according to claim 1, it is characterized in that, described carbonization metal level is a carbonization metal dipping bed, and the ratio of components of the carbon in this carbonization metal dipping bed is set to from described metal level side to described DLC carbon coating direction, and the ratio of carbon increases gradually.
3. gravure engraving roll according to claim 1 and 2, it is characterized in that, the thickness of described copper coating is 50～200 μ m, the degree of depth in described inking hole is 5～150 μ m, described metal layer thickness is 0.1～1 μ m, described carbonization metal layer thickness is 0.1～1 μ m, and the thickness of described DLC carbon coating is 0.1～10 μ m.
4. according to each described gravure engraving roll in the claim 1～3, it is characterized in that, but described metal is carbonization and the metal high with the compatibility of copper.
5. according to each described gravure engraving roll in the claim 1～4, it is characterized in that described metal is one or more the metal of selecting from tungsten, silicon, titanium, chromium, tantalum and zirconium.
6. the manufacture method of a gravure engraving roll is characterized in that, comprising: the operation of preparing metal system hollow roller; On this hollow roller surface, form the copper facing operation of copper coating; The inking hole that forms a plurality of inkings hole on the surface of this copper coating forms operation; The metal level that forms metal level on the surface of this copper coating forms operation; The carbonization metal level that forms the carbonization metal level of this metal level on the surface of this metal level forms operation; The DLC carbon coating that forms the DLC carbon coating on the surface of this carbonization metal level forms operation.
7. the manufacture method of gravure engraving roll according to claim 6, it is characterized in that, described carbonization metal level is a carbonization metal dipping bed, the ratio of components of the carbon in this carbonization metal dipping bed is set to from described metal level side to described DLC carbon coating direction, and the ratio of carbon increases gradually.
8. according to the manufacture method of claim 6 or 7 described gravure engraving rolls, it is characterized in that, the thickness of described copper coating is 50～200 μ m, the degree of depth in described inking hole is 5～150 μ m, described metal layer thickness is 0.1～1 μ m, described carbonization metal layer thickness is 0.1～1 μ m, and the thickness of described DLC carbon coating is 0.1～10 μ m.
9. according to the manufacture method of each described gravure engraving roll in the claim 6～8, it is characterized in that, form described metal level, described carbonization metal level and described DLC carbon coating respectively by sputtering method.
10. according to the manufacture method of each described gravure engraving roll in the claim 6～9, it is characterized in that, but described metal is carbonization and the metal high with the compatibility of copper.
11. the manufacture method according to each described gravure engraving roll in the claim 6～10 is characterized in that, described metal is one or more the metal of selecting from tungsten, silicon, titanium, chromium, tantalum and zirconium.
12. the manufacture method according to each described gravure engraving roll in the claim 6～11 is characterized in that, carries out the formation in described inking hole by etching method or electronic engraving method.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005166067 | 2005-06-06 | ||
| JP166067/2005 | 2005-06-06 | ||
| JP288234/2005 | 2005-09-30 |
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| CN101184630A true CN101184630A (en) | 2008-05-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNA200680018737XA Pending CN101184630A (en) | 2005-06-06 | 2006-05-24 | Gravure engraving roll and process for producing the same |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102307730A (en) * | 2009-02-03 | 2012-01-04 | 海德堡印刷机械股份公司 | Method for producing anilox rolls |
| CN102381070A (en) * | 2010-08-30 | 2012-03-21 | 上海运青制版有限公司 | Copper-plated gravure roller base |
| CN101870191B (en) * | 2009-04-21 | 2012-09-19 | 东莞东运机械制造有限公司 | Novel material intaglio roller |
| CN103534094A (en) * | 2011-04-18 | 2014-01-22 | 卡巴-诺塔赛斯有限公司 | Intaglio printing plate, method of manufacturing the same and use thereof |
| CN111957499A (en) * | 2020-08-14 | 2020-11-20 | 澳科利高新技术（无锡）有限公司 | Gravure printing roller and method for manufacturing same |
| CN115190842A (en) * | 2020-03-09 | 2022-10-14 | 株式会社新克 | Full-automatic plate base material manufacturing system and plate base material manufacturing method |
-
2006
- 2006-05-24 CN CNA200680018737XA patent/CN101184630A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102307730A (en) * | 2009-02-03 | 2012-01-04 | 海德堡印刷机械股份公司 | Method for producing anilox rolls |
| CN102307730B (en) * | 2009-02-03 | 2014-04-16 | 海德堡印刷机械股份公司 | Method for producing anilox rolls |
| CN101870191B (en) * | 2009-04-21 | 2012-09-19 | 东莞东运机械制造有限公司 | Novel material intaglio roller |
| CN102381070A (en) * | 2010-08-30 | 2012-03-21 | 上海运青制版有限公司 | Copper-plated gravure roller base |
| CN103534094A (en) * | 2011-04-18 | 2014-01-22 | 卡巴-诺塔赛斯有限公司 | Intaglio printing plate, method of manufacturing the same and use thereof |
| CN115190842A (en) * | 2020-03-09 | 2022-10-14 | 株式会社新克 | Full-automatic plate base material manufacturing system and plate base material manufacturing method |
| CN111957499A (en) * | 2020-08-14 | 2020-11-20 | 澳科利高新技术（无锡）有限公司 | Gravure printing roller and method for manufacturing same |
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Open date: 20080521 |