CN101182099A - Method for making glass die-made-die-core with microstructure and glass die-made-die-core - Google Patents
Method for making glass die-made-die-core with microstructure and glass die-made-die-core Download PDFInfo
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- CN101182099A CN101182099A CNA200610138713XA CN200610138713A CN101182099A CN 101182099 A CN101182099 A CN 101182099A CN A200610138713X A CNA200610138713X A CN A200610138713XA CN 200610138713 A CN200610138713 A CN 200610138713A CN 101182099 A CN101182099 A CN 101182099A
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- glass
- microstructure
- protective layer
- moulding die
- base material
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Abstract
The invention provides a method of processing glass moulding kernels with a microstructure, and a glass moulding kernel. The processing method is to form a plurality of relative images of an optical component which is going to be molded through micro-shadow and etching technologies on base material which is larger or equal to 8mm and which is provided with a plate massive structure, and then to form a leaving protective layer on the surface of the base material. No chemical reaction is produced between the leaving protective layer and glass under the softening state, and the Vickers hardness of the layer is not less than 2000 degrees. The surface of the base material, of which a plurality of the images are formed, together with the leaving protective layer form the microstructure of the glass optical component to be molded relatively. And the glass moulding kernel with the microstructure is made. With the plate massive structured base material of a mold making unit and the protection of the leaving protective layer, the glass moulding kernel has the advantages of high stability and structural strength and perfect leaving property and durability.
Description
Technical field
The present invention relates to a kind of made-die-core (molding core), particularly relate to the manufacture method and the glass moulding die of the glass moulding die that a kind of glass mold forming uses.
Background technology
Optical glass component in the various optical articles, for example grating, microlens array .. etc., be to make light produce various phenomenon such as physical optics such as for example diffraction, refraction etc. with its microstructure (Micro structure) figure, and then the follow-up utilization that supplies other assembly in the optical articles, be one of spare part important in the optical articles; Before, be mostly directly to produce microstructure graph at glass baseplate surface with little shadow (Photolithography), etching (Etching), to produce these optical glass components, production efficiency is not only low, and cost of manufacture is high.
At present, existing dealer adopts the mode of glass mold forming to manufacture these optical glass components, to promote production efficiency simultaneously and to reduce cost of manufacture; But; How corresponding to the microstructure graph of the optical glass component of desiring mold forming, preparing the glass moulding die that is used for these superprecision optical glass components of glass mold forming, then is the challenge that primarily overcomes.
Generally speaking, this kind is used for the glass moulding die of these optical glass components of mold forming, nothing more than being mode with direct attrition process, or utilize unconventional production method such as discharge, laser to make, and because the microstructure of glass moulding die must be corresponding to the microstructure graph of optical glass component, therefore the degree of difficulty of attrition process is high, and also therefore, the cost of manufacture of the glass moulding die that this kind processing mode is made is also very high; And, with the glass moulding die of non-traditional processing mode processing and fabricatings such as discharge, laser, then be subject to microstructure and working accuracy and the relatively poor problem of surface appearance are often arranged.
Consult Fig. 1, the Japanese Patent spy opens the 2002-96333 patent application case and then discloses another kind of mode of making the glass moulding die, mainly be for example to select for use the block that constitutes with wolfram varbide (WC), titanium carbide (TiC), tantalum carbide materials such as (TaC) as base material 11, and on base material 11 surfaces with silicon nitride (SiN) deposition one layer thickness at the film of 1~10 μ m as microstructured layers 12; Then utilize little shadow technology and etching technique, behind the long-pending microstructure image 13 (pattern) of film (microstructured layers 12) formation that forms in this silicon nitride institute Shen, promptly make required glass moulding die 1 corresponding to the microstructure graph of optical glass component.
Consult Fig. 2, in addition, and for example the Japanese Patent spy opens the 2002-97030 patent application case, then further, change with silicon carbide on base material 11, deposit a layer thickness at the film of 1~10 μ m as microstructured layers 12, and between microstructured layers 12 and base material 11, add for example silicon nitride (SiN), silicon oxide (SiO
2) or the long-pending film 14 that forms in titanium nitride Shen such as (TiN), by these silicon nitrides (SiN), silicon oxide (SiO
2) or the long-pending film 14 that forms in titanium nitride material Shen such as (TiN), increase the strength of connection of microstructured layers 12 and base material 11, and then increase the structural strength and the weather resistance of whole glass moulding die 1.
But these mutual combination collocations with differing materials on base material 11 deposit at least one layer film, with film as microstructured layers 12 to form microstructure image 13 corresponding to the microstructure graph of optical glass component, and then make the mode of glass moulding die 1, because the stability when being subject to the relative base material of film 11 and linking and the deficiency of structural strength, and easily in high temp glass model processing procedure, allow glass moulding die 1 be damaged, and have influence on the yield of the optical glass component of production.
Therefore, how improving the glass moulding die that is used for the glass mold forming optical glass component at present, is one of dealer's direction of making great efforts to study.
Summary of the invention
The objective of the invention is to, a kind of making method and glass moulding die for preparing the glass moulding die with microstructure of structural strength height, excellent in te pins of durability is provided.
Another object of the present invention is to, the glass moulding die of a kind of structural strength height, excellent in te pins of durability is provided.
A kind of making method with glass moulding die of microstructure of the present invention earlier is the substrate surface that plate-like and thickness is not less than 8mm one, forms several images corresponding to this microstructure with little shadow technology and etching technique.
Be formed with on this surface of counting image at this base material again and form a release protective layer that does not produce chemical reaction with the glass of soft state; make this surface of counting image that is formed with of this base material constitute corresponding this microstructure of desiring the glass optical components of mold forming jointly, promptly make the glass moulding die that this has microstructure with this release protective layer.
In addition, a kind of glass moulding die of the present invention is applicable to mold forming one glass optical components, comprises a base material and a release protective layer.
This base material is plate-like and thickness is not less than 8mm, comprises that one is formed with the surface of several images, and this counts pattern to outward appearance aspect that should glass optical components.
This release protective layer is arranged on the surface that is formed with several images of this base material, and does not produce chemical reaction with the glass of soft state.
The surface that this of this base material has several images constitutes a microstructure in order to this glass optical components of mold forming with this release protective layer.
Effect of the present invention is with plate-like base material be shaped the image of corresponding glass optical components, and cooperates the release protective layer of release and hardness excellence to form microstructure, and can make the glass moulding die of structural strength height, excellent in te pins of durability.
About aforementioned and other technology contents, characteristics and effect of the present invention, in the following detailed description that cooperates with reference to a graphic preferred embodiment, can clearly present.
The present invention is described in detail below in conjunction with drawings and Examples.
Description of drawings
Fig. 1 is the synoptic diagram of the structure of existing a kind of glass moulding die;
Fig. 2 is the synoptic diagram of the structure of existing another kind of glass moulding die;
Fig. 3 is the schema of a preferred embodiment of the making method of a kind of glass moulding die with microstructure of the present invention; And
Fig. 4 is with the prepared synoptic diagram with glass moulding die of microstructure of the manufacture method of Fig. 3.
Embodiment
Before the present invention is described in detail, be noted that in the following description content similarly assembly is to represent with identical numbering.
Consult Fig. 3 and Fig. 4, a preferred embodiment of the making method of a kind of glass moulding die with microstructure of the present invention is the glass moulding die 4 that can make as Fig. 4, in order to the glass optical components of mold forming high degree of accuracy as shown in Figure 3.
At first consult Fig. 4, the prepared glass moulding die 4 of a preferred embodiment with the making method of a kind of glass moulding die with microstructure of the present invention comprises a base material 5, and a release protective layer 6.
Release protective layer 6 for example is selected from class and bores materials such as metal such as carbon or Ti, Ta, W, Mo, Al, Pt, Re, Ru, Ir, Rh and compound thereof and constitute; be not more than on the surface that is formed with several images 51 that 1 μ m is arranged at base material 5 with thickness; the glass with soft state does not produce chemical reaction; and dimension formula hardness is not less than 2000 degree, has excellent release and structural strength.
The surface with several images 51 of base material 5 and the release protective layer 6 common microstructures 7 that constitute corresponding to the microstructure graph of optical glass component, and can correspondence be molded as glass optical components.
After above-mentioned glass moulding die 4 as shown in Figure 3 manufacture method below cooperating describes in detail, when can more clearly understanding.
Consult Fig. 3, at first carry out step 31, form the image of number earlier with little shadow technology (Photolithography) and etching technique (Etching) being plate-like base material 5 surfaces corresponding to the microstructure graph of optical glass component.
Then carry out step 32; be formed with at base material 5 and form release protective layer 6 on the surface 51 of several images; and make base material 5 surfaces 51 and the release protective layer 6 common microstructures 7 that constitute corresponding to the microstructure graph of optical glass component, promptly make glass moulding die 4 with microstructure 7 as Fig. 4.
Below cooperate a preferable processing procedure and two concrete processing procedures to describe a kind of making method of the present invention in detail with glass moulding die of microstructure.
Preferable processing procedure one
At first, select for use thickness be the high-purity carborundum of plate-like structure of 100mm as base material, select a metal (or alloy) that has a height etching selectivity with silicon carbide to deposit an etch barrier for material on its surface; Then, behind coating photoresistance on the etch barrier, utilize light shield, reach program defining such as relevant exposure, development, etching, cleaning and go out a photoresistance image layers opposite with required microstructure shape; After the partially-etched barrier layer zone etching that the photoresistance image layers will not covered by the photoresistance image layers downwards removes, remove with being about to the photoresistance image layers, the etch barrier structure of retaining is the hard shielding opposite with microstructure (Hard Mask) figure again.
Then binding there is the base material of hard shielding figure to place reactive ion etch equipment in the etching gas that silicon carbide is had the height etching selectivity, SF6 for example .... in, the etching phenomenon is not taken place on the substrate surface that exposes shielding firmly that figure covers and carries out downwards, cooperate simultaneously with the rate of etch of etching period control, until the several images that etch corresponding microstructure base material; To shield figure firmly then and remove, substrate surface promptly is formed with the image of the corresponding microstructure of number.
Then, form the release protective layer of individual layer or several layers in substrate surface with chemical vapour deposition mode plating again, release protective layer can be diamond film, diamond-like carbon film, metal or alloy, promptly finishes the glass moulding die with microstructure.
Concrete processing procedure one
At first, form so that high-purity carborundum is powder sintered, and thickness is that the high-purity carborundum of plate-like structure of 100mm is as base material, behind the AZ1500 photoresistance (product of moral merchant Microchemicals company) of the about 1 μ m of the even coating thickness in surface, implement 2 minutes soft baking journeys of 120 ℃, exposure energy with 55mJ cooperates the light shield of corresponding required microstructure to expose 12 seconds subsequently, developed 40 seconds with 2.38% Tetramethylammonium hydroxide again, after cleaning, can on photoresistance, define and the identical graph of a correspondence of required microstructure shape.
Again in the mode of evaporation, after the substrate surface that forms corresponding figure with photoresistance deposits the gold thin film of the about 100nm of a layer thickness, adding the ultrasound shake with acetone washes and photoresistance is removed, at this moment, also the gold thin film that will be deposited on the photoresistance synchronously removes simultaneously, and only stay the gold thin film structure that directly is deposited on the base material part surface, and the gold thin film structure of retaining is the hard shielding figure of the microstructure aspect that is shaped corresponding to desire.
Then, under the pressure of 5mTorr, feed the sulfur fluoride (SF of 55sccm again in the mode of reactive ion etch
6) etching 4 minutes, can be on base material etching obtain the microstructure of the about 1.2 μ m of the degree of depth.
After will shielding the figure removal firmly with potassiumiodide (KI) solution then,, feed the C of 20sccm in the mode of ion plating (Ion Plating)
6H
6, 1.5 * 10
-1Under the pressure of Pa, deposit 80 minutes, can become release protective layer, finish the preparation of glass moulding die with microstructure at the long-pending diamond-like carbon film that forms the about 0.2 μ m of a layer thickness in the surperficial Shen that is formed with the image of counting corresponding microstructure of base material.
Concrete processing procedure two
At first, selection prepares in the chemical vapour deposition mode, and thickness be 150mm plate-like structure high-purity carborundum (SiC) as base material, amass the titanium film that forms the about 400nm of thickness on the surface with evaporation mode Shen, the even AZ1500 photoresistance of the about 1 μ m of coating thickness on the titanium film subsequently, and implement 2 minutes soft baking journeys of 120 ℃, exposure energy with 55mJ cooperates the light shield of corresponding required microstructure to expose 18 seconds subsequently, developed 55 seconds with 2.38% Tetramethylammonium hydroxide again, after cleaning, can on photoresistance, define the corresponding figure opposite with required microstructure shape.
Then, under the pressure of 3mTorr, feed the xenon fluoride (XeF of 45sccm in the mode of reactive ion etch
2), etching is after 15 minutes, cooperates to add the ultrasound shake with acetone and wash photoresistance is removed, and the titanium membrane structure of retention is the hard shielding figure of the microstructure aspect that is shaped corresponding to desire.
Then, under the pressure of 5mTorr, feed the sulfur fluoride (SF of 55sccm again in the mode of reactive ion etch
6) etching 6 minutes, can be on base material etching obtain the microstructure of the about 1.8 μ m of the degree of depth.
And then with H
2O: H
2O
2: HF=20: after solution soaking will be removed as the titanium membrane structure of hard shielding figure in about 30 seconds fully in 1: 1,, feed the C of 20sccm in the mode of ion plating
6H
6, 1.5 * 10
-1Under the pressure of Pa, deposit 80 minutes, can become release protective layer, finish the preparation of glass moulding die with microstructure at the long-pending diamond-like carbon film that forms the about 0.2 μ m of a layer thickness in the surperficial Shen that is formed with the image of counting corresponding microstructure of base material.
As shown in the above description; the present invention utilizes thickness thicker (more than several millimeters) to be base material 5 surfaces 51 of plate-like structure; utilize very sophisticated little shadow technology of development and etching technique; Accurate Shaping goes out several images of corresponding glass optical components; and cooperate release and hardness excellences on this surface 51 that is formed with several images; and the material that produces chemical reaction with the glass of soft state does not form release protective layer 6 and makes glass moulding die 4; because little shadow technology and etching technique are to the utmost in the development and application of semi-conductor industry to be ripe; therefore; it is high that formed thereby goes out several precisions of images of corresponding glass optical components in this way; and then make the glass moulding die that makes also have high precision; simultaneously; also have higher production efficiency and lower cost of manufacture; moreover; because base material 5 is the materials that adopt plate-like structure; so have higher structural strength; and cooperate release protective layer 6 to have excellent release and the high advantage of hardness; the more feasible glass moulding die of preparing 4 has the characteristics of release and excellent in te pins of durability; really can improve existing glass moulding die 1 and form microstructure image 13 with film; its stability and all insufficient shortcoming of structural strength reach creation purpose of the present invention.
The above, it only is preferred embodiment of the present invention, when not limiting scope of the invention process with this, promptly the simple equivalent of being done according to the present patent application claim and invention description content generally changes and modifies, and all still belongs in the scope that patent of the present invention contains.
Claims (10)
1. making method with glass moulding die of microstructure, this method comprises:
(a) be the substrate surface that plate-like and thickness is not less than 8mm one, form several images corresponding to this microstructure with little shadow technology and etching technique; And
(b) be formed with on this surface of counting image at this base material and form a release protective layer that does not produce chemical reaction with the glass of soft state; make this surface of counting image that is formed with of this base material constitute corresponding this microstructure of desiring the glass optical components of mold forming jointly, make the glass moulding die that this has microstructure with this release protective layer.
2. according to the described making method with glass moulding die of microstructure of claim 1, it is characterized in that: this base material is to be made of silicon carbide, wolfram varbide, aluminum oxide, zirconium white, silicon nitride, titanium carbide or tantalum carbide material.
3. according to the described making method with glass moulding die of microstructure of claim 1, it is characterized in that: the thickness of this release protective layer is not more than 1 μ m, and Vickers' hardness is not less than 2000 degree.
4. according to the described making method with glass moulding die of microstructure of claim 3, it is characterized in that: this release protective layer is that the material by one of the carbon of diamond structures or titanium, tantalum, tungsten, molybdenum, aluminium, platinum, rhenium, ruthenium, iridium, rhodium or its combination constitutes.
5. according to the described making method with glass moulding die of microstructure of claim 4, it is characterized in that: this release protective layer is to form in the chemical vapour deposition mode.
6. according to the described making method with glass moulding die of microstructure of claim 5, it is characterized in that: this release protective layer is to form in the ion plating mode.
7. a glass moulding die can be used for mold forming one glass optical components, it is characterized in that:
This glass moulding die comprises:
One base material is plate-like and thickness is not less than 8mm, comprises that one is formed with the surface of several images, and this counts pattern to outward appearance aspect that should glass optical components; And
One release protective layer is arranged on the surface that is formed with several images of this base material, and does not produce chemical reaction with the glass of soft state;
The surface that this of this base material has several images constitutes a microstructure in order to this glass optical components of mold forming with this release protective layer.
8. according to the described glass moulding die of claim 7, it is characterized in that: this base material is to be made of wolfram varbide, silicon carbide, aluminum oxide, zirconium white, silicon nitride, titanium carbide or tantalum carbide.
9. according to the described glass moulding die of claim 7, it is characterized in that: the thickness of this release protective layer is not more than 1 μ m, and Vickers' hardness is not less than 2000 degree.
10. according to the described glass moulding die of claim 9, it is characterized in that: this release protective layer is that the material by one of the carbon of diamond structures or titanium, tantalum, tungsten, molybdenum, aluminium, platinum, rhenium, ruthenium, iridium, rhodium or its combination constitutes.
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CN200610138713XA CN101182099B (en) | 2006-11-13 | 2006-11-13 | Method for making glass die-made-die-core with microstructure and glass die-made-die-core |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103094082A (en) * | 2011-10-31 | 2013-05-08 | 中芯国际集成电路制造(上海)有限公司 | Method to manufacture semi-conductor device |
CN105336594A (en) * | 2014-07-28 | 2016-02-17 | 中芯国际集成电路制造(上海)有限公司 | Forming method of semiconductor structure |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
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US6521324B1 (en) * | 1999-11-30 | 2003-02-18 | 3M Innovative Properties Company | Thermal transfer of microstructured layers |
DE10026976C2 (en) * | 2000-05-31 | 2002-08-01 | Schott Glas | Channel plate made of glass for flat screens and process for their manufacture |
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2006
- 2006-11-13 CN CN200610138713XA patent/CN101182099B/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103094082A (en) * | 2011-10-31 | 2013-05-08 | 中芯国际集成电路制造(上海)有限公司 | Method to manufacture semi-conductor device |
CN105336594A (en) * | 2014-07-28 | 2016-02-17 | 中芯国际集成电路制造(上海)有限公司 | Forming method of semiconductor structure |
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