CN101179088A - Multidirection conductive electric enhanced type CCM packaging structure and encapsulation method thereof - Google Patents
Multidirection conductive electric enhanced type CCM packaging structure and encapsulation method thereof Download PDFInfo
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- CN101179088A CN101179088A CNA2006101382418A CN200610138241A CN101179088A CN 101179088 A CN101179088 A CN 101179088A CN A2006101382418 A CNA2006101382418 A CN A2006101382418A CN 200610138241 A CN200610138241 A CN 200610138241A CN 101179088 A CN101179088 A CN 101179088A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
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Abstract
The invention relates to a package structure of a multidirectional conducting electrically-intensified compact camera module (CCM for short), which comprises a conducting wire platform, an image sensing chip, a plurality of wires, a sealing compound and a transparent cover plate, wherein the conducting wire platform further comprises a metal conducting wire frame and an insulating portion. A plurality of open grooves are arranged on the four sides of the insulating portion, and a leading foot extending from the metal conducting wire frame is embedded in the open groove, thereby forming the Socket Type conducting wire platform. The image sensing chip is conglutinated on the metal conducting wire frame on the depressed place of the conducting wire platform, and the leading foot on the upper edge of the conducting wire platform is electrically conducting with the image sensing chip via a plurality of wires, and then the transparent cover board is fixedly arranged on the top surface of the conducting wire platform through the sealing compound which includes a plurality of spacers.
Description
Technical field
The present invention relates to the encapsulating structure and the method for packing thereof of the electrical reinforced miniature lens module of a kind of multidirectional conducting, be particularly related to a kind of miniature lens module (Compact CameraModule that exists with runners (Socket Type) form, CCM), it can be bonded with each other with other electronic correlation product with the pin position of stitch kenel, and more can effectively improve product processing procedure and assembling optimization.
Background technology
Along with making rapid progress of science and technology epoch, carry-on information electronic product miscellaneous and equipment in response to and give birth to, and various product spare part all strides forward towards compact target.How to make product have more hommization, the notion of multimachine one, the volume-diminished Human Engineering that meets easy to carry more conforms with the demand that consumer's facility is followed the fashion, and is one of the main problem of existing market.And with mobile phone in conjunction with digital camera functionality or even MP3 or mobile computer, or with PDA in conjunction with digital camera functionality, promptly be that wherein an important improvement breaks through.
Observe commercially available all mobile phones at present, can find all to go development towards microminiaturized route, the mobile phone that especially has the function of taking pictures, hot especially machine, more in conjunction with the function of 3G, utilization network video phone makes user both sides all can link up with image to mobile phone now.Therefore, the route of following mobile phone will be diversification and Full Featured outfit, have an opportunity to replace existing digital camera, become in conjunction with photograph, communication, online etc., has multi-functional integration machine, and how making its assembling more convenient rapidly, manufacture process is simpler, volume is more frivolous, will be the main target of industry development.
See also shown in Figure 1ly, it is the existing CCM encapsulating structure structural representation of (Compact Camera Module miniature lens module is called for short CCM).Existing C CM encapsulating structure 1 is to include: a substrate 10, an image sensing chip 11, a ring dike 12, number of metal line 13, a glass cover-plate 14 and some tin balls 15.Wherein, described image sensing chip 11 is arranged on the substrate 10; with described number of metal line 13 described image sensing chip 11 and described substrate 10 are done and to be conducted; utilize described ring dike 12 around described image sensing chip 11 and be located on the described substrate 10; in order to the number of metal line 13 of protecting described image sensing chip 11 and being conducted with described substrate 10; and then described glass cover-plate 14 is set on described ring dike 12; make described image sensing chip 11 can see through the extraneous image of described glass cover-plate set on the described ring dike 12 14 acquisitions, and be connected with other electronic product by the set some tin balls 15 in described substrate 10 belows.
Yet, existing C CM encapsulating structure, when it does binding with different electric equipment products, must do spot welding with the circuit board of described binding electronic product with tin ball below the described CCM module substrate or weld pad is connected, its described CCM module and electronic product are done to conduct, the assembling process of not only described CCM module own is complicated, and does when conducting with other electronic product and must increase the spot welding step of connecting, production cost is increased and reduces packaging efficiency.
Summary of the invention
First purpose of the present invention, be to provide a multidirection conductive electric enhanced type CCM packaging structure and method, it is to use the centre depressed part that image sensing chip can be placed in one of the lead platform with certain thickness concavity shaped as frame support body, the adjacent four side of described lead platform is provided with some open grooves, and formation can supply the CCM module of the runners kenel (Socket Type) of corresponding stitch pin position.
Another object of the present invention, be to provide a multidirection conductive electric enhanced type CCM packaging structure and method, it is by the conductive metal frames in the lead platform included a metal-cored bar and number of metal lead foot, can make described CCM module not be subjected to other electromagnetism or electrostatic interference.
Another purpose of the present invention; be to provide a multidirection conductive electric enhanced type CCM packaging structure and method; be to utilize the sealing that includes some septs that one transparent cover plate is fixed on the end face of described lead platform concavity shaped as frame support body, reach the purpose that described transparent cover plate and image sensing chip keep a parastate and have more the not extrusion of protection metal wire.
A further object of the present invention, be to provide a multidirection conductive electric enhanced type CCM packaging structure and method, it is the extended number of metal lead foot of conductive metal frames on the described lead platform, be attached in the open groove in bottom surface, side of described lead platform with bending and the end face of shaped as frame support body, reach an electrical CCM module of multidirectional conducting that can connect conduction and side joint conduction down.
In order to achieve the above object, the present invention provides a kind of multidirection conductive electric enhanced type CCM packaging structure, includes: a lead platform is a concavity shaped as frame support body, and it is to include a conductive metal frames and an insulation division; One image sensing chip, it is to have a start face and a non-start face, and is incorporated into described non-start face on the conductive metal frames at concavity place of described lead platform; The number of metal line by stamping the mode of number of metal line, conducts described lead platform and described image sensing chip; One sealing includes a plurality of septs of tool predetermined particle diameter, and it is that filling is between a shaped as frame support body end face of described transparent cover plate and described lead platform; And a transparent cover plate, be covered in the image sensing district of described image sensing chip, and be fixed in by described sealing on the shaped as frame support body end face of described lead platform; Wherein, the spacing of described transparent cover plate and described image sensing chip is determined by the predetermined particle diameter of described sept.
Metal-cored bar on the described conductive metal frames can expose and be attached to described lead platform concavity place, can engage for the non-start face of its described image sensing chip, and on four adjacent sides of described lead platform, being provided with some open grooves near equidistant mode, described some open grooves are then through a bottom surface and a shaped as frame support body end face of described insulation division.
Again, extended one of them lead foot of number of metal lead foot can roughly be divided into four conductive sections around the described metal-cored bar, and described four conductive sections include in regular turn: a ground connection conductive section, connect conductive section, a side joint conductive section and a chip conductive section once.Wherein, described ground connection conductive section is the concavity place lower inner that is connected around described metal-cored bar and is embedded in described insulation division, other conductive section out of the ordinary that is connected behind described ground connection conductive section then runs through the outside, described insulation division bottom surface, respectively conductive section out of the ordinary is attached in regular turn in the bottom surface, the above open groove of side of described insulation division in the bending mode and shaped as frame support body end face, formation can be for the lead platform of the runners kenel (Socket Type) of corresponding stitch pin position.
The described start face of described image sensing chip is provided with an image sensing district, and be provided with some aluminium pads around in described image sensing district, by the number of metal line the described chip conductive section on the shaped as frame support body end face of described some aluminium pads and described lead platform is interconnected, its described image sensing chip and described lead platform are conducted.Coat on the shaped as frame support body end face of described lead platform with described sealing again; and contain some septs by described sealing; can utilize the described predetermined particle diameter of described sept to support as the interval of described lead platform and transparent cover plate; and because the predetermined particle diameter of described sept more can be protected the not extrusion of described metal wire; simultaneously, described by this transparent cover plate engages with described lead platform.
The present invention also provides a kind of multidirection conductive electric enhanced type CCM method for packing, may further comprise the steps: a lead platform is provided, and described lead platform is in the mode of irritating mould or ejaculation one insulation division and a conductive metal frames to be pressed into concavity shaped as frame support body; One non-start face of one image sensing chip is incorporated into a concavity place of described lead platform, and is bonding on the metal-cored bar of conductive metal frames of described lead platform; Some aluminium pads on described image sensing chip, the chip conductive section on a mode by stamping the number of metal line and the shaped as frame support body end face of described lead platform conducts; Being coated with the described shaped as frame support body end face of a sealing in described lead platform, wherein, is a plurality of septs that include the tool predetermined particle diameter in described sealing, protects the not extrusion of described metal wire; Before described sealing is still unhardened, one transparent cover plate is covered on the top of described sealing, and give the stickiness pressing, utilize the predetermined particle diameter of the described sept that is included in the described sealing to make to be parallel to each other between described transparent cover plate and the described image sensing chip and be maintained fixed spacing; Wherein, described sealing is made its curing with hot curing or according to ultraviolet light, described transparent cover plate can be fixed on the described lead platform by described sealing.
The present invention also provides a kind of lead platform structure of multidirection conductive electric enhanced type CCM, includes: a conductive metal frames more comprises a metal-cored bar and number of metal lead foot on the described conductive metal frames; One insulation division is to have certain thickness concavity shaped as frame support body, and a concavity place that makes the described metal-cored bar on the described conductive metal frames can expose and be attached to described lead platform; Wherein, described insulation division is to irritate the mode of mould or ejaculation; described conductive metal frames is pressed into concavity shaped as frame support body; described metal-cored bar on the described conductive metal frames is exposed and be attached to described insulation division concavity place; and described metal lead foot all around stretches out along described metal-cored bar in equidistant mode; and each other described metal lead foot branch has four conductive sections; wherein being connected in a conductive section of described metal-cored bar is the concavity place lower inner that is embedded in described insulation division; other conductive section of described metal lead foot then runs through the outside, described insulation division bottom surface, respectively conductive section out of the ordinary is attached to the bottom surface of described insulation division in the bending mode; in the described open groove on the side; and shaped as frame support body end face.
The present invention is the mode of utilization being irritated mould or ejaculation; described insulation division and described conductive metal frames are pressed into a lead platform; and be concavity shaped as frame support body; adjacent four side in described lead platform is provided with some open grooves; make its formation can be, and then the CCM module (Socket Type CCM) that makes described CCM encapsulating structure become a runners kenel be its main purpose for the lead platform of the runners kenel (Socket Type) of corresponding stitch pin position.
Description of drawings
Fig. 1 is the cross section view of existing CCM encapsulating structure;
Fig. 2 is the multidirection conductive electric enhanced type CCM packaging structure first preferred embodiment isometric exploded view of the present invention;
Fig. 3 A and Fig. 3 B are respectively the conductive metal frames vertical view and the end view of the multidirection conductive electric enhanced type CCM packaging structure first preferable enforcement of the present invention;
Fig. 3 C and Fig. 3 D are the processing procedure schematic diagram of the lead platform of the multidirection conductive electric enhanced type CCM packaging structure first preferable enforcement of the present invention;
Fig. 4 is the lead platform three-dimensional view of the multidirection conductive electric enhanced type CCM packaging structure first preferable enforcement of the present invention;
Fig. 5 is the A-A cross section view of the lead platform of Fig. 4;
Fig. 6 combines vertical view for the lead platform of the multidirection conductive electric enhanced type CCM packaging structure first preferable enforcement of the present invention with image sensing chip;
Fig. 7 is the cross sectional side view of multidirection conductive electric enhanced type CCM packaging structure first preferred embodiment of the present invention;
Fig. 8 is the user mode cutaway view of multidirection conductive electric enhanced type CCM packaging structure first preferred embodiment of the present invention;
Fig. 9 is the lead platform vertical view of multidirection conductive electric enhanced type CCM packaging structure second preferred embodiment of the present invention;
Figure 10 A to Figure 10 D is the steps flow chart schematic diagram of multidirection conductive electric enhanced type CCM method for packing of the present invention.
Description of reference numerals; 1～existing C CM encapsulating structure; 10～substrate; 11～image sensing chip; 12～ring dike; 13～number of metal line; 14～glass cover-plate; 15～tin ball; 20～multidirection conductive electric enhanced type CCM module; 30～lead platform; 301～concavity place; 302～side; 303～open groove; 31～conductive metal frames; 311～metal-cored bar; 312～metal lead foot; 3121～ground connection conductive section; 3122～down connect conductive section; 3123～side joint conductive section; 3124～chip conductive section; 32～insulation division; 321～bottom surface; 322～shaped as frame support body end face; 40～image sensing chip; 41～start face; 411～image sensing district; 412～aluminium pad; 42～non-start face; 50～metal wire; 60～sealing; 61～sept; 70～transparent cover plate; 80～stitch pin position.
Embodiment
In order more clearly to describe multidirection conductive electric enhanced type CCM packaging structure proposed by the invention and method for packing, below will cooperate diagram to describe in detail.
See also shown in Figure 2ly, it is the multidirection conductive electric enhanced type CCM packaging structure first preferred embodiment isometric exploded view of the present invention.Wherein, multidirection conductive electric enhanced type CCM module 20 mainly is made of jointly: a lead platform 30, an image sensing chip 40, number of metal line 50 (being shown in figure six and figure seven in addition), a sealing 60 (being shown in figure seven in addition) and 70 of transparent cover plates.Described lead platform 30 is to include a conductive metal frames 31 and an insulation division 32.
See also shown in Fig. 3 A to 3D, wherein, Fig. 3 A and 3B are respectively the half-finished vertical view of conductive metal frames and the end view of the multidirection conductive electric enhanced type CCM packaging structure first preferable enforcement of the present invention.Fig. 3 C and 3D then are the processing procedure schematic diagram of the lead platform 30 of the multidirection conductive electric enhanced type CCM packaging structure first preferable enforcement of the present invention.
Shown in Fig. 3 A and 3B, described conductive metal frames 31 is more to include a metal-cored bar 311 and number of metal lead foot 312.In the end view shown in Fig. 3 B, can understand described conductive metal frames 31 is roughly to present a flat foil shape structure, and the position is the metal lead foots 312 a little more than its periphery in the position of the described metal-cored bar 311 of conductive metal frames 31 middle sections.In described number of metal lead foot 312, some be connected in described metal-cored bar 311 go up, have in addition some then not link to each other all around with metal-cored bar 311, and these metal lead foots 312 all are to extend outward with radial.The material of described conductive metal frames 31 can be that copper, aluminium, alloy or other conductive metallic material or its alloy constitute.
See also shown in Fig. 3 C; described lead platform 30 is to irritate the mode of mould or ejaculation; described conductive metal frames 31 and insulation division 32 are pressed into concavity shaped as frame support body, and make described metal-cored bar 311 on the described conductive metal frames 31 exposed and be attached to the surface at a concavity place 301 of described lead platform 30.As for 312 of more described metal lead foots is level protrude out insulation division 32 bottoms around outside the edge, and the position of each metal lead foot 312 is corresponding to the set some open groove 303 in insulation division 32 4 sides 302.In present embodiment, the material of described insulation division 32 can be epoxy resin or plastic material.Afterwards, shown in Fig. 3 D, by the punching press processing procedure the more described metal lead foot 312 that protrudes out is bent, the interlude of metal lead foot 312 is bent in the pairing groove 303 of embedding, the end of metal lead foot 312 is then bent the end face 322 that is pressed in insulation division 32.
See also Fig. 4 and shown in Figure 5, it is respectively the three-dimensional view and the A-A cross section view of the lead platform of the multidirection conductive electric enhanced type CCM packaging structure first preferable enforcement of the present invention.On four adjacent sides 302 of described lead platform 30 (four adjacent sides of the outside of insulation division 32 just), be provided with some open grooves 303 in equidistant mode, 303 of described some open grooves are through between the bottom surface 321 and a shaped as frame support body end face 322 of described insulation division 32.
As shown in Figure 5, each metal lead foot 312 of described conductive metal frames 31 is roughly can be distinguished into four conductive sections, includes in regular turn: an earth lead section 3121, connect conductive section 3122, a side joint conductive section 3123 and a chip conductive section 3124 once.
Described earth lead section 3121, the one end is can be connected (but or also divergence) around described metal-cored bar 311, and described earth lead section 3121 is the inside that is embedded in described insulation division 32, and the bottom surface 321 directions extension of past described insulation division 32, make other each conductive section that is connected after described earth lead section 3121 can run through described insulation division 32.Connecing conductive section 3122 under described, is to be connected after described earth lead section 3121, and runs through the bottom surface 321 of described insulation division 32, and bends and be attached to the bottom surface 321 of described insulation division 32 toward described insulation division 32 lateral surface directions.Described side joint conductive section 3123, be to be connected under described to connect after the lead section 3122, and bend and be attached in the described open groove 303 of adjacent side, described insulation division 32 outsides (adjacent side 302, the outside of lead platform 30 just) toward described insulation division 32 end face directions.Described chip conductive section 3124 is to be connected after described side joint lead section 3123, and also is attached on the shaped as frame support body end face 322 of described insulation division 31 toward described image sensing chip 40 directions bending.
See also shown in Figure 6ly, it combines vertical view with image sensing chip for the lead platform of the multidirection conductive electric enhanced type CCM packaging structure first preferable enforcement of the present invention.Described image sensing chip 40 is to be used for capturing extraneous image, charge coupled device (charge coupled device normally, CCD) or complementary metal oxide semiconductor (complementary metal oxide semiconductor, CMOS) Image sensor apparatus, and described image sensing chip 40 has a start face 41 and a non-start face 42 (being shown in Fig. 7 in addition), and so-called start face 41 is meant the side with the extraneous imaging function of acquisition.In the present invention first good embodiment, described image sensing chip 40 is in conjunction with the concavity place 301 that is arranged on the described lead platform 30 with described non-start face 42 (not shown), and be bonding on the described metal-cored bar 311, the start face 41 that makes image sensing chip 40 up, and be provided with an image sensing district 411 in order to pick-up image, and in being provided with some aluminium pads 412 near the outer rim around the described image sensing district 411 in described start face 41 top center.
See also shown in Figure 7ly, it is for the cross sectional side view of multidirection conductive electric enhanced type CCM packaging structure first preferred embodiment of the present invention.Wherein, the non-start face 42 of described image sensing chip 40 is incorporated into the concavity place 301 of described lead platform 30, and be bonding on the described metal-cored bar 311, and vertical depth delta H at the concavity place 301 of described lead platform 30 at least must be more than or equal to the chip thickness Δ h of described image sensing chip 40.By described number of metal line 50 the described chip conductive section 3124 on the shaped as frame support body end face 322 of some aluminium pads on the described image sensing chip 40 412 and described lead platform 30 is interconnected, both can conduct to make its described image sensing chip 40 and described lead platform 30.More make its described transparent cover plate 70 be able to be pressed on the shaped as frame support body end face 322 of described lead platform 30, and described transparent cover plate 70 can be infrared ray filter glass, plain glass, anti-reflective glass or smalt with stickiness in evenly being coated with sealing 60 on the shaped as frame support body end face 322 of described lead platform 30.
In the present invention's first preferred embodiment, described sealing 60 is constituted by containing the sept 61 of most tool predetermined particle diameter by Δ d.Described sept 61 can be that glass marble, silica spheres, Metal Ball, baton round or other composite material are made, and the predetermined particle diameter Δ d that utilizes described sept 61 is (in the present invention's first preferred embodiment, described predetermined particle diameter Δ d can be preferable between 0.1～1000um) support as the described lead platform 30 and the interval of described transparent cover plate 70, and can be used to control the gap length of described transparent cover plate 70 and lead platform 30, keep the depth of parallelism of transparent cover plate 70 simultaneously.In addition, described metal wire 50 also is simultaneously packaged by described sealing 60, also can protect described metal wire 50 not extrusions.
See also Fig. 8 and arrange in pairs or groups shown in Figure 6ly, wherein, Fig. 8 is the user mode cutaway view of multidirection conductive electric enhanced type CCM packaging structure first preferred embodiment of the present invention.It in four sides, 302 grooves 303 of the lead platform 30 of described multidirection conductive electric enhanced type CCM module 20 the side joint conductive section 3123 that distinctly is embedded with corresponding metal lead foot 312, make described multidirection conductive electric enhanced type CCM module 20 become the CCM module (Socket Type CCM) of a runners kenel (Socket Type), and the associated electrical product that is connected with other provides a corresponding stitch pin position 80 to engage (grafting), described stitch pin position 80 is adhered to mutually with the side joint conductive section 3123 of described metal lead foot 312 contacted, reach the purpose that conducts.
Because metal-cored bar 311 on described conductive metal frames 31 and the earth lead section 3121 that extends described metal lead foot 312 all around, the effect of one barrier can be provided substantially to described image sensing chip 40, and the effect of preventing electromagnetic interference (EMI) can further be provided, and, be directly to be fixed in to have the function that promotes heat radiation on the described metal-cored bar 311 simultaneously more because of image sensing chip 40.
In addition, more because in the multidirection conductive electric enhanced type CCM module 20 of the present invention, it runs through described insulation division 30 bottom surfaces 321 and paste to pay under the outer rim of described insulation division 32 bottom surfaces 321 more described and connects conductive section 3122, be to provide other difference except that aforesaid contact pin to conduct pattern (for example follow technology SMT or connect or the like) to be connected, and reach the purpose that another different directions conducting links with the associated electrical product with the tin ball bonding with the surface.
See also shown in Figure 9ly, it is for the lead platform vertical view of multidirection conductive electric enhanced type CCM packaging structure second preferred embodiment of the present invention.Since the lead platform of multidirection conductive electric enhanced type CCM packaging structure of the present invention second preferred embodiment of Fig. 9 its substantially with the lead platform class of the first preferable enforcement shown in Figure 4 seemingly, so identical assembly and will repeating no more below the structure.
As shown in Figure 9, the second preferred embodiment difference of the present invention is that the more described open groove 303 that is positioned on described lead platform 30 adjacent four sides 302 can be arc groove or square groove on structure.
See also shown in Figure 10 A to Figure 10 D, it is the steps flow chart schematic diagram of multidirection conductive electric enhanced type CCM method for packing of the present invention.
Shown in Figure 10 A, at first make a lead platform 30 by the processing procedure shown in Fig. 3 B to 3D, after the more non-start face 42 of described image sensing chip 40 is bonding on described lead platform 30 concavity places 301, and be bonding on the metal-cored bar 311 of described conductive metal frames 31.
Shown in Figure 10 B, on some aluminium pads 412 of described image sensing chip 40, the described chip conductive section 3124 of the mode by stamping number of metal line 50 and the shaped as frame support body end face 322 of described lead platform 30 conducts.
Shown in Figure 10 C, evenly be coated with a sealing 60 on the shaped as frame support body end face 322 of described lead platform 30, wherein, in described sealing 60, be a plurality of septs 61 that include the tool predetermined particle diameter, more protect described metal wire 50 not extrusions.
Shown in Figure 10 D, before described sealing 60 is still unhardened, described transparent cover plate 70 is covered on the top of described sealing 60, and give the stickiness pressing, can utilize 61 predetermined particle diameter of a plurality of septs that included in the described sealing 60 to make to be parallel to each other between its described transparent cover plate 70 and the described image sensing chip 40 and be maintained fixed spacing, and then with described sealing 60 with hot curing or according to ultraviolet light (UV) make its curing, described transparent cover plate 70 can be fixed on the described lead platform 30 by described sealing 60.
In sum; multidirection conductive electric enhanced type CCM packaging structure of the present invention and method for packing; wherein; described multidirection conductive electric enhanced type CCM package module 20 is the lead platforms 30 that described conductive metal frames 31 and described insulation division 32 are pressed into a runners kenel (Socket Type) in the mode of irritating mould or ejaculation; and can conduct by mode and the described lead platform 30 of stamping metal wire 50 with described image sensing chip 40; and encapsulate bonding with described transparent cover plate 70 with the described sealing 60 that contains some septs 61, form the CCM module (Socket Type CCM) of a runners kenel (Socket Type).
The above is to utilize preferred embodiment to describe the present invention in detail, but not limits the scope of the invention.Generally those skilled in the art all can understand, suitably do slightly change and adjustment, will not lose main idea of the present invention place, also do not break away from the spirit and scope of the present invention.
Claims (10)
1. a multidirection conductive electric enhanced type CCM packaging structure is characterized in that, includes:
One lead platform is a concavity shaped as frame support body, and it is to include a conductive metal frames and an insulation division;
One image sensing chip, it is to have a start face and a non-start face, and is incorporated into described non-start face on the conductive metal frames at concavity place of described lead platform;
The number of metal line by stamping the mode of number of metal line, conducts described lead platform and described image sensing chip;
One sealing includes a plurality of septs of tool predetermined particle diameter, and it is that filling is between a shaped as frame support body end face of described transparent cover plate and described lead platform; And
One transparent cover plate is covered in the image sensing district of described image sensing chip, and is fixed in by described sealing on the shaped as frame support body end face of described lead platform;
Wherein, the spacing of described transparent cover plate and described image sensing chip is determined by the predetermined particle diameter of described sept.
2. multidirection conductive electric enhanced type CCM packaging structure as claimed in claim 1, it is characterized in that, the described start face of described image sensing chip is provided with an image sensing district, and be provided with some aluminium pads around in described image sensing district, and, described transparent cover plate is infrared ray filter glass, plain glass, anti-reflective glass or smalt, and described insulation division is epoxy resin or plastic material, and described conductive metal frames is copper, aluminium, alloy or other conductive metallic material.
3. multidirection conductive electric enhanced type CCM packaging structure as claimed in claim 1, it is characterized in that, the predetermined particle diameter of described sept is between 0.1～1000um, the described predetermined particle diameter of described sept supports as the interval of described lead platform and transparent cover plate, and the material of sept is glass, silicon dioxide, metal, plastics, macromolecular material or composite material.
4. multidirection conductive electric enhanced type CCM packaging structure as claimed in claim 1; it is characterized in that; described lead platform is to irritate the mode of mould or ejaculation; described insulation division and described conductive metal frames are pressed into concavity shaped as frame support body; metal-cored bar on the described conductive metal frames is exposed and be attached to described lead platform concavity place; engage with the non-start face of described image sensing chip; on four adjacent sides of described lead platform; be provided with some open grooves in equidistant mode, described some open grooves are then through between the bottom surface and a shaped as frame support body end face of described insulation division.
5. multidirection conductive electric enhanced type CCM packaging structure as claimed in claim 4, it is characterized in that, described conductive metal frames more includes the number of metal lead foot, described number of metal lead foot all around stretches out along described metal-cored bar in equidistant mode, and each other described metal lead foot branch has four conductive sections, wherein being connected in a conductive section of described metal-cored bar is the concavity place lower inner that is embedded in described insulation division, other conductive section then runs through the outside, described insulation division bottom surface, respectively conductive section out of the ordinary is attached to the bottom surface of described insulation division in the bending mode, in the described open groove on the side, and shaped as frame end face.
6. multidirection conductive electric enhanced type CCM packaging structure as claimed in claim 5 is characterized in that, four conductive sections of described metal lead foot include in regular turn:
One earth lead section, the one end is to be connected around described metal-cored bar, and described earth lead section is the inside that is embedded in described insulation division, and extend toward the bottom surface direction of described insulation division, make other be connected and run through described insulation division in each conductive section of the other end of described earth lead section;
Connecing conductive section once, is to be connected after described earth lead section, and runs through described insulation division bottom surface, and bends and be attached to the bottom surface of described insulation division toward described insulation division lateral surface direction;
One side joint conductive section is to be connected under described to connect after the lead section, and bends and be attached in the described open groove of described insulation division side toward described insulation division end face direction; And
One chip conductive section is to be connected after described side joint lead section, and also is attached to the shaped as frame end face of described insulation division toward described image sensing chip direction bending.
7. a multidirection conductive electric enhanced type CCM method for packing is characterized in that, may further comprise the steps:
One lead platform is provided, and described lead platform is in the mode of irritating mould or ejaculation one insulation division and a conductive metal frames to be pressed into concavity shaped as frame support body;
One non-start face of one image sensing chip is incorporated into a concavity place of described lead platform, and is bonding on the metal-cored bar of conductive metal frames of described lead platform;
Some aluminium pads on described image sensing chip, the chip conductive section on a mode by stamping the number of metal line and the shaped as frame support body end face of described lead platform conducts;
Being coated with the described shaped as frame support body end face of a sealing in described lead platform, wherein, is a plurality of septs that include the tool predetermined particle diameter in described sealing, protects the not extrusion of described metal wire;
Before described sealing is still unhardened, one transparent cover plate is covered on the top of described sealing, and give the stickiness pressing, utilize the predetermined particle diameter of the described sept that is included in the described sealing to make to be parallel to each other between described transparent cover plate and the described image sensing chip and be maintained fixed spacing;
Wherein, described sealing is made its curing with hot curing or according to ultraviolet light, described transparent cover plate can be fixed on the described lead platform by described sealing.
8. the lead platform structure of a multidirection conductive electric enhanced type CCM is characterized in that, includes:
One conductive metal frames more comprises a metal-cored bar and number of metal lead foot on the described conductive metal frames;
One insulation division is to have certain thickness concavity shaped as frame support body, and a concavity place that makes the described metal-cored bar on the described conductive metal frames can expose and be attached to described lead platform;
Wherein, described insulation division is to irritate the mode of mould or ejaculation; described conductive metal frames is pressed into concavity shaped as frame support body; described metal-cored bar on the described conductive metal frames is exposed and be attached to described insulation division concavity place; and described metal lead foot all around stretches out along described metal-cored bar in equidistant mode; and each other described metal lead foot branch has four conductive sections; wherein being connected in a conductive section of described metal-cored bar is the concavity place lower inner that is embedded in described insulation division; other conductive section of described metal lead foot then runs through the outside, described insulation division bottom surface, respectively conductive section out of the ordinary is attached to the bottom surface of described insulation division in the bending mode; in the described open groove on the side; and shaped as frame support body end face.
9. the lead platform structure of multidirection conductive electric enhanced type CCM as claimed in claim 8 is characterized in that, four conductive sections of described metal lead foot include in regular turn:
One earth lead section, the one end is to be connected around described metal-cored bar, and described earth lead section is the inside that is embedded in described insulation division, and extend toward the bottom surface direction of described insulation division, make other be connected and run through described insulation division in each conductive section of the other end of described earth lead section;
Connecing conductive section once, is to be connected after described earth lead section, and runs through described insulation division bottom surface, and bends and be attached to the bottom surface of described insulation division toward described insulation division lateral surface direction;
One side joint conductive section is to be connected under described to connect after the lead section, and bends and be attached in the described open groove of described insulation division side toward described insulation division end face direction; And
One chip conductive section is to be connected after described side joint lead section, and also is attached to the shaped as frame end face of described insulation division toward described image sensing chip direction bending.
10. the lead platform structure of multidirection conductive electric enhanced type CCM as claimed in claim 9 is characterized in that, described multidirection conductive electric enhanced type CCM module more includes:
One image sensing chip, it is to have a start face and a non-start face, and is incorporated into described non-start face on the metal-cored bar of described conductive metal frames at concavity place of described lead platform;
The number of metal line by stamping the mode of number of metal line, conducts described lead platform and described image sensing chip;
One sealing, include a plurality of septs of tool particle diameter between 0.1～1000um, it is the shaped as frame support body end face of filling in described transparent cover plate and described lead platform, and the material of described sept is glass, silicon dioxide, metal, plastics, macromolecular material or composite material;
One transparent cover plate is covered in the image sensing district of described image sensing chip, and is fixed in by described sealing on the shaped as frame support body end face of described lead platform;
Wherein, the spacing of described transparent cover plate and described image sensing chip is determined by the predetermined particle diameter of described sept.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006101382418A CN101179088A (en) | 2006-11-08 | 2006-11-08 | Multidirection conductive electric enhanced type CCM packaging structure and encapsulation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CNA2006101382418A CN101179088A (en) | 2006-11-08 | 2006-11-08 | Multidirection conductive electric enhanced type CCM packaging structure and encapsulation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103151362A (en) * | 2011-12-07 | 2013-06-12 | 原相科技股份有限公司 | Wafer level image chip package and optical structure comprising same |
| CN110364477A (en) * | 2018-03-26 | 2019-10-22 | 中芯国际集成电路制造(上海)有限公司 | Chip structure and forming method thereof |
-
2006
- 2006-11-08 CN CNA2006101382418A patent/CN101179088A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103151362A (en) * | 2011-12-07 | 2013-06-12 | 原相科技股份有限公司 | Wafer level image chip package and optical structure comprising same |
| CN110364477A (en) * | 2018-03-26 | 2019-10-22 | 中芯国际集成电路制造(上海)有限公司 | Chip structure and forming method thereof |
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