CN101179067A - Light source assembly and light emitting chip package - Google Patents

Light source assembly and light emitting chip package Download PDF

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Publication number
CN101179067A
CN101179067A CN200610146451.1A CN200610146451A CN101179067A CN 101179067 A CN101179067 A CN 101179067A CN 200610146451 A CN200610146451 A CN 200610146451A CN 101179067 A CN101179067 A CN 101179067A
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China
Prior art keywords
metal layer
light
heat dissipation
emitting chip
flexible carrier
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Granted
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CN200610146451.1A
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Chinese (zh)
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CN100511669C (en
Inventor
刘孟学
潘玉堂
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Chipmos Technologies Inc
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Chipmos Technologies Inc
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Priority to CN200610146451.1A priority Critical patent/CN100511669C/en
Publication of CN101179067A publication Critical patent/CN101179067A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

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  • Planar Illumination Modules (AREA)

Abstract

The invention discloses a light source assembly, which comprises a heat dissipation plate, a film circuit layer and a plurality of light emitting chip packaging bodies, wherein the film circuit layer is arranged on the heat dissipation plate. The light-emitting chip packages are arranged on the thin film circuit layer and are electrically connected with the thin film circuit layer. In addition, each light emitting chip package comprises a flexible carrier, at least one light emitting chip and a primer, wherein the flexible carrier has a first surface and a second surface, and the light emitting chip is disposed on the first surface of the flexible carrier. The light-emitting chip is provided with a plurality of bumps and is electrically connected with the flexible loader through the bumps. The bottom glue is arranged between the soft loader and the light-emitting chip to cover the bump. Therefore, the light source component has longer service life.

Description

Light source assembly and luminous chip encapsulation body
Technical field
The present invention is relevant for a kind of light source assembly and chip packing-body, and is particularly to a kind of light source assembly and luminous chip encapsulation body.
Background technology
In recent years, utilize the compound semiconductor of nitrogen gallium, (light emitting diode, LED) element gets most of the attention as the light-emitting diode of gallium nitride (GaN), aluminium gallium nitride alloy (AlGaN), InGaN (InGaN) etc.III-nitride is the material of a broadband energy gap, and its emission wavelength can be contained to ruddiness from ultraviolet light always, therefore can say so and almost contain the wave band of whole visible light.In addition, compared to conventional bulb, light-emitting diode has absolute advantage, for example volume is little, life-span length, low-voltage/current drives, be difficult for breaking, do not contain mercury (not having pollution problem) and the good characteristics such as (power savings) of luminous efficiency, so the application of light-emitting diode on industry is very extensive.
Because the luminescence phenomenon of light-emitting diode does not belong to thermoluminescence or Discharge illuminating, but it is luminous to belong to cold property, thus light-emitting diode assembly under the good situation of heat radiation, the life-span was more than 100,000 hours, and need not warm up the lamp time (idling time).In addition, light-emitting diode assembly has reaction speed and (is about 10 soon -9Second), volume is little, power-saving, pollute low (not containing mercury), high-reliability, be fit to advantages such as volume production, so the field of its application is very extensive.Therefore, light-emitting diode is regarded as most important light source of 21 century.
Yet, because the light-emitting diode running time can produce a large amount of heat energy, and the brightness of light-emitting diode and life-span all can be subjected to Temperature Influence, therefore when the power of light-emitting diode increased, the demand of heat radiation is just increase gradually also.Prior art is to use complicated cooling system, yet complicated cooling system also can cause problems such as the excessive and cost increase of volume.
Summary of the invention
In view of this, the purpose of this invention is to provide a kind of light source assembly, to increase useful life.
In addition, another object of the present invention provides a kind of luminous chip encapsulation body, to improve radiating efficiency.
For reaching above-mentioned or other purposes, the present invention proposes a kind of light source assembly, and it comprises a heating panel, a wiring thin film layer and a plurality of luminous chip encapsulation body, and wherein the wiring thin film layer is disposed on the heating panel.These luminous chip encapsulation bodies are disposed on the wiring thin film layer, and electrically connect with the wiring thin film layer.In addition, each luminous chip encapsulation body comprises a soft carrier, at least one luminescence chip and a primer, and wherein soft carrier has a first surface and a second surface, and luminescence chip is disposed on the first surface of soft carrier.Luminescence chip has a plurality of projections, and luminescence chip electrically connects by these projections and soft carrier.Primer is disposed between soft carrier and the luminescence chip, to coat projection.
In an embodiment of the present invention, each luminous chip encapsulation body also comprises a reflector, and it is disposed on the soft carrier, and the reflector has an opening, and it exposes luminescence chip.
In an embodiment of the present invention, each luminous chip encapsulation body also comprises a reflector, and it is disposed on the soft carrier, and the partial reflection cover is positioned at the top of luminescence chip.
In an embodiment of the present invention, each soft carrier has one first patterned metal layer, one second patterned metal layer and a plurality of conductive through hole, wherein first patterned metal layer and second patterned metal layer lay respectively on first surface and the second surface, and first patterned metal layer and second patterned metal layer electrically connect by these conductive through holes.The projection and first patterned metal layer electrically connect, and second patterned metal layer and the electric connection of wiring thin film layer.
In an embodiment of the present invention, each soft carrier also has one first heat radiating metallic layer, one second heat radiating metallic layer and a plurality of heat radiation perforation, wherein first heat radiating metallic layer and second heat radiating metallic layer lay respectively on first surface and the second surface, and first heat radiating metallic layer is connected by the heat radiation perforation with second heat radiating metallic layer.
In an embodiment of the present invention, the wiring thin film layer comprises a line layer and a welding cover layer that is disposed on the line layer.
In an embodiment of the present invention, light source assembly also comprises an insulation glue-line, and it is disposed between wiring thin film layer and the heating panel.
In an embodiment of the present invention, these luminescence chips comprise light-emitting diode or Organic Light Emitting Diode.
For reaching above-mentioned or other purposes, the present invention proposes a kind of light source assembly, it comprises a soft carrier, a plurality of luminescence chip and a primer, and wherein soft carrier has a first surface and a second surface, and these luminescence chips are disposed on the first surface of soft carrier.Each luminescence chip has a plurality of projections, and these luminescence chips electrically connect by projection and soft carrier.Primer is disposed between soft carrier and these luminescence chips, to coat projection.
In an embodiment of the present invention, light source assembly also comprises a reflector, and it is disposed on the soft carrier, and the reflector has a plurality of openings, and it exposes these luminescence chips respectively.
In an embodiment of the present invention, light source assembly also comprises a plurality of reflectors, and it is disposed on the soft carrier, and the part of each reflector is positioned at the top of corresponding luminescence chip.
In an embodiment of the present invention, soft carrier has one first patterned metal layer, one second patterned metal layer and a plurality of conductive through hole, wherein first patterned metal layer and second patterned metal layer lay respectively on first surface and the second surface, and first patterned metal layer and second patterned metal layer electrically connect by these conductive through holes, and these projections and first patterned metal layer electrically connect.
In an embodiment of the present invention, each soft carrier also has one first heat radiating metallic layer, one second heat radiating metallic layer and a plurality of heat radiation perforation, wherein first heat radiating metallic layer and second heat radiating metallic layer lay respectively on first surface and the second surface, and first heat radiating metallic layer is connected by the heat radiation perforation with second heat radiating metallic layer.
In an embodiment of the present invention, second heat radiating metallic layer of each soft carrier has a plurality of grooves.
For reaching above-mentioned or other purposes, the present invention proposes a kind of luminous chip encapsulation body, and it comprises a soft carrier, at least one luminescence chip and a primer.Soft carrier has one first heat radiating metallic layer, one second heat radiating metallic layer and a plurality of heat radiation perforation, and wherein first heat radiating metallic layer and second heat radiating metallic layer lay respectively on the second surface of first surface of soft carrier and soft carrier.First heat radiating metallic layer is connected by the heat radiation perforation with second heat radiating metallic layer, and second heat radiating metallic layer has a plurality of grooves.Luminescence chip has a plurality of projections, and luminescence chip electrically connects by these projections and soft carrier.Primer is disposed between soft carrier and the luminescence chip, to coat projection.
In an embodiment of the present invention, luminous chip encapsulation body also comprises a reflector, and it is disposed on the soft carrier, and the reflector has at least one opening, and it exposes luminescence chip.
In an embodiment of the present invention, luminous chip encapsulation body also comprises a reflector, and it is disposed on the soft carrier, and the part of reflector is positioned at the top of luminescence chip.
In an embodiment of the present invention, soft carrier also has one first patterned metal layer, one second patterned metal layer and a plurality of conductive through hole, wherein first patterned metal layer and second patterned metal layer lay respectively on first surface and the second surface, and first patterned metal layer and second patterned metal layer electrically connect by conductive through hole, and the projection and first patterned metal layer electrically connect.
Based on above-mentioned, because the present invention engages the wiring thin film layer with heating panel, with the carrying luminescence chip, therefore light source assembly of the present invention has preferable radiating efficiency and long useful life.In addition, the present invention adopts soft carrier, and therefore light source assembly of the present invention can bend, to improve ease of use.Moreover the present invention forms groove at the heat radiating metallic layer of soft carrier, to improve radiating efficiency.
For above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, preferred embodiment cited below particularly, and conjunction with figs. is described in detail below.
Description of drawings
Fig. 1 is the profile according to a kind of light source assembly of first embodiment of the invention.
Fig. 2 is the profile according to a kind of light source assembly of second embodiment of the invention.
Fig. 3 is the profile according to a kind of light source assembly of third embodiment of the invention.
Fig. 4 is the profile according to a kind of light source assembly of fourth embodiment of the invention.
Embodiment
[first embodiment]
Fig. 1 is the profile according to a kind of light source assembly of first embodiment of the invention.Please refer to Fig. 1, the light source assembly 100 of present embodiment comprises a heating panel 110, a wiring thin film layer 120 and a plurality of luminous chip encapsulation bodies 130, and wherein wiring thin film layer 120 is disposed on the heating panel 110.In the present embodiment, wiring thin film layer 120 comprises a line layer 122 and a welding cover layer 124 that is disposed on the line layer 122.In addition, the light source assembly 100 of present embodiment also comprises an insulation glue-line 140, and it is disposed between wiring thin film layer 120 and the heating panel 110.Insulation glue-line 140 also can have thermal conduction characteristic, in order to conducting the heat that luminous chip encapsulation body 130 is produced.Yet present embodiment does not limit wiring thin film layer 120 and has the individual layer circuit, and wiring thin film layer 120 also can be to have multilayer line.Moreover when the bottom of wiring thin film layer 120 was dielectric layer, wiring thin film layer 120 also can directly be disposed on the heating panel 110.
These luminous chip encapsulation bodies 130 are disposed on the wiring thin film layer 120, and electrically connect with wiring thin film layer 120.More specifically, in the present embodiment, these luminous chip encapsulation bodies 130 electrically connect via a scolder 150, anisotropic conductive (ACP) or anisotropy conducting film (ACF) line layer 122 with wiring thin film layer 120.
Please continue with reference to figure 1, each luminous chip encapsulation body 130 comprises a soft carrier 132, at least one luminescence chip 134 and a primer 136.In the present embodiment, soft carrier 132 for example be flexible printed wiring board (flexible printed circuit board, FPC).In addition, soft carrier 132 has a first surface 132a and a second surface 132b, and luminescence chip 134 is disposed on the first surface 132a of soft carrier 132.Luminescence chip 134 has a plurality of projection 134a, and luminescence chip 134 electrically connects by these projections 134a and soft carrier 132.Primer 136 is disposed between soft carrier 132 and the luminescence chip 134, to coat projection 134a.
More specifically, soft carrier 132 has one first patterned metal layer 1322a, one second patterned metal layer 1324a and a plurality of conductive through hole 1326a, wherein the first patterned metal layer 1322a and the second patterned metal layer 1324a lay respectively on first surface 132a and the second surface 132b, and the first patterned metal layer 1322a and the second patterned metal layer 1324a electrically connect by these conductive through holes 1326a.In addition, the projection 134a and the first patterned metal layer 1322a electrically connect, and the second patterned metal layer 1324a and 120 electric connection of wiring thin film layer.In the present embodiment, soft carrier 132 also can have a welding cover layer 1328, and it is disposed on the first patterned metal layer 1322a.In addition, luminescence chip 134 comprises light-emitting diode or Organic Light Emitting Diode.Only have single luminescence chip 134 though it should be noted that the luminous chip encapsulation body 130 of present embodiment, yet in another embodiment, luminous chip encapsulation body 130 also can comprise a plurality of luminescence chips 134.
In the present embodiment, for the light that makes luminescence chip 134 be sent can be more concentrated, luminous chip encapsulation body 130 also comprises a reflector 1382, and it is disposed on the soft carrier 132, and the reflector has an opening 1382a, and it exposes luminescence chip 134.In addition, the width of opening 1382a increases toward the direction away from soft carrier 132 gradually from soft carrier 132.Moreover, in order to increase the reflectivity of opening 1382a, also can on the inwall of opening 1382a, be coated with reflecting material.
In the present embodiment, in order to improve radiating efficiency, each soft carrier 132 also has one first heat radiating metallic layer 1322b, one second heat radiating metallic layer 1324b and a plurality of heat radiation perforation 1326b, wherein the first heat radiating metallic layer 1322b and the second heat radiating metallic layer 1324b lay respectively at 132b on first surface 132a and the second surface, and the first heat radiating metallic layer 1322b is connected by heat radiation perforation 1326b with the second heat radiating metallic layer 1324b.
Because luminous chip encapsulation body 130 is disposed on the wiring thin film layer 120, and wiring thin film layer 120 engages with heating panel 110, the heat that is produced when therefore luminous chip encapsulation body 130 operates can conduct to the external world via heating panel 110, to improve the useful life and the luminous efficiency of luminous chip encapsulation body 130.In addition, if luminous chip encapsulation body 130 is arranged in line, then this light source assembly 100 can be used as line source.If luminous chip encapsulation body 130 is arranged in array, then this light source assembly 100 can be used as area source.
[second embodiment]
Fig. 2 is the profile according to a kind of light source assembly of second embodiment of the invention.Please refer to Fig. 2, present embodiment is similar to first embodiment, and its difference is: in the light source assembly 200 of present embodiment, luminous chip encapsulation body 130 also comprises a reflector 1384, it is disposed on the soft carrier 132, and partial reflection cover 1384 is positioned at the top of luminescence chip 134.Therefore, reflector 1384 can change the light direction of light source assembly 200.In other words, light source assembly 200 is the side bright dipping.In addition, in order to increase the reflectivity of reflector 1384, also can on the inwall of reflector 1384, be coated with reflecting material.Perhaps, the material of reflector 1384 is a metal.
[the 3rd embodiment]
Fig. 3 is the profile according to a kind of light source assembly of third embodiment of the invention.Please refer to Fig. 3, the light source assembly 300 of present embodiment comprises a soft carrier 310, a plurality of luminescence chip 320 and a primer 330.Wherein, soft carrier 310 for example is flexible printed wiring board (FPC).In addition, soft carrier 310 has a first surface 310a and a second surface 310b, and these luminescence chips 320 are disposed on the first surface 310a of soft carrier 310.Each luminescence chip 320 has a plurality of projection 320a, and these luminescence chips 320 electrically connect by projection 320a and soft carrier 310.In addition, luminescence chip 320 comprises light-emitting diode or Organic Light Emitting Diode.Moreover primer 330 is disposed between soft carrier 310 and these luminescence chips 320, to coat projection 320a.
More specifically, soft carrier 310 has one first patterned metal layer 312a, one second patterned metal layer 314a and a plurality of conductive through hole 316a, wherein the first patterned metal layer 312a and the second patterned metal layer 314a lay respectively on first surface 310a and the second surface 310b, and the first patterned metal layer 312a and the second patterned metal layer 314a electrically connect by these conductive through holes 316a.In addition, the projection 320a and the first patterned metal layer 312a electrically connect.In the present embodiment, soft carrier 310 also can have a welding cover layer 318, and it is disposed on the first patterned metal layer 312a.
In the present embodiment, for the light that makes luminescence chip 320 be sent can be more concentrated, light source assembly 300 also comprises a reflector 340, and it is disposed on the soft carrier 310, and the reflector has a plurality of opening 340a, and it exposes each luminescence chip 134.In addition, the width of each opening 340a increases toward the direction away from soft carrier 310 gradually from soft carrier 310.Moreover, in order to increase the reflectivity of opening 340a, also can on the inwall of opening 340a, be coated with reflecting material.
In order to improve the radiating efficiency of light source assembly 300, soft carrier 310 also has one first heat radiating metallic layer 312b, one second heat radiating metallic layer 314b and a plurality of heat radiation perforation 316b, wherein the first heat radiating metallic layer 312b and the second heat radiating metallic layer 314b lay respectively at 310b on first surface 310a and the second surface, and the first heat radiating metallic layer 312b is connected by heat radiation perforation 316b with the second heat radiating metallic layer 314b.In addition, the second heat radiating metallic layer 314b also can have a plurality of groove 3142a.More specifically, groove 3142a is formed by etch process, to increase area of dissipation.
In addition, if luminous chip encapsulation body 320 is arranged in line, then this light source assembly 300 can be used as line source.If luminous chip encapsulation body 320 is arranged in array, then this light source assembly 300 can be used as area source.
[the 4th embodiment]
Fig. 4 is the profile according to a kind of light source assembly of fourth embodiment of the invention.Please refer to Fig. 4, present embodiment is similar to the 3rd embodiment, and its difference is: the light source assembly 400 of present embodiment also comprises a reflector 350, and it is disposed on the soft carrier 310, and partial reflection cover 350 is positioned at the top of luminescence chip 320.Therefore, reflector 350 can change the light direction of light source assembly 400.In other words, light source assembly 400 is the side bright dipping.In addition, in order to increase the reflectivity of reflector 350, also can on the inwall of reflector 350, be coated with reflecting material.Perhaps, the material of reflector 350 is a metal.In addition, the light source assembly 400 of present embodiment does not limit yet and need have radiator structure 3142.
In sum, light source assembly of the present invention has following advantage at least:
One, the present invention adopt heating panel and the wiring thin film layer of arranging in pairs or groups as carrier, so the heat energy that the luminescence chip running time is produced reaches the external world by extremely short path, to improve the useful life and the luminous efficiency of luminescence chip.
Two, the present invention adopts soft carrier, and therefore light source assembly of the present invention can bend, to improve ease of use.
Three, owing to luminescence chip electrically connects with chip bonding mode and soft carrier, so the light that luminescence chip sent more is not subject to the interference of other members.
Though the present invention discloses as above with preferred embodiment; right its is not in order to qualification the present invention, any those of ordinary skills, without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is when with being as the criterion that claim was defined.

Claims (18)

1.一种光源组件，包括：1. A light source assembly, comprising: 一散热板；a cooling plate; 一薄膜线路层，配置于该散热板上；a thin film circuit layer configured on the heat dissipation plate; 多个发光芯片封装体，配置于该薄膜线路层上，并与该薄膜线路层电性连接，而各该发光芯片封装体包括：A plurality of light-emitting chip packages are arranged on the thin-film circuit layer and electrically connected to the thin-film circuit layer, and each light-emitting chip package includes: 一软性承载器，具有一第一表面与一第二表面；A flexible carrier has a first surface and a second surface; 至少一发光芯片，配置于该软性承载器之该第一表面上，而该发光芯片具有多个凸块，且该发光芯片通过该些凸块与该软性承载器电性连接；以及At least one light-emitting chip is disposed on the first surface of the flexible carrier, and the light-emitting chip has a plurality of bumps, and the light-emitting chip is electrically connected to the flexible carrier through the bumps; and 一底胶，配置于该软性承载器与该发光芯片之间，以包覆该些凸块。A primer is disposed between the flexible carrier and the light-emitting chip to cover the bumps. 2.如权利要求1所述的光源组件，其特征在于，各该发光芯片封装体还包括一反射层，配置于该软性承载器上，且该反射层具有一开口，暴露出该发光芯片。2. The light source assembly according to claim 1, wherein each of the light-emitting chip packages further comprises a reflective layer disposed on the flexible carrier, and the reflective layer has an opening exposing the light-emitting chip . 3.如权利要求1所述的光源组件，其特征在于，各该发光芯片封装体还包括一反射罩，配置于该软性承载器上，且部分该反射罩位于该发光芯片的上方。3 . The light source assembly according to claim 1 , wherein each of the light-emitting chip packages further comprises a reflector disposed on the flexible carrier, and part of the reflector is located above the light-emitting chip. 4.如权利要求1所述的光源组件，其特征在于，各该软性承载器具有一第一图案化金属层、一第二图案化金属层与多个导电贯孔，其中该第一图案化金属层与该第二图案化金属层分别位于该第一表面与该第二表面上，而该第一图案化金属层与该第二图案化金属层通过该些导电贯孔电性连接，该些凸块与该第一图案化金属层电性连接，且该第二图案化金属层与该薄膜线路层电性连接。4. The light source assembly according to claim 1, wherein each of the flexible carriers has a first patterned metal layer, a second patterned metal layer and a plurality of conductive vias, wherein the first patterned The metal layer and the second patterned metal layer are located on the first surface and the second surface respectively, and the first patterned metal layer and the second patterned metal layer are electrically connected through the conductive vias. The bumps are electrically connected to the first patterned metal layer, and the second patterned metal layer is electrically connected to the thin film circuit layer. 5.如权利要求1所述的光源组件，其特征在于，各该软性承载器还具有一第一散热金属层、一第二散热金属层与多个散热贯孔，其中该第一散热金属层与该第二散热金属层分别位于该第一表面与该第二表面上，而该第一散热金属层与该第二散热金属层通过该些散热贯孔连接。5. The light source assembly according to claim 1, wherein each of the flexible carriers further has a first heat dissipation metal layer, a second heat dissipation metal layer and a plurality of heat dissipation through holes, wherein the first heat dissipation metal The first heat dissipation metal layer and the second heat dissipation metal layer are located on the first surface and the second surface respectively, and the first heat dissipation metal layer and the second heat dissipation metal layer are connected through the heat dissipation through holes. 6.如权利要求1所述的光源组件，其特征在于，该薄膜线路层包括一线路层与配置于该线路层上的一焊罩层。6. The light source assembly according to claim 1, wherein the thin film circuit layer comprises a circuit layer and a solder mask layer disposed on the circuit layer. 7.如权利要求1所述的光源组件，其特征在于，还包括一绝缘胶层，配置于该薄膜线路层与该散热板之间。7. The light source assembly as claimed in claim 1, further comprising an insulating adhesive layer disposed between the thin film circuit layer and the heat dissipation plate. 8.如权利要求1所述的光源组件，其特征在于，该些发光芯片包括发光二极管或有机发光二极管。8. The light source assembly according to claim 1, wherein the light emitting chips comprise light emitting diodes or organic light emitting diodes. 9.一种光源组件，包括：9. A light source assembly, comprising: 一软性承载器，具有一第一表面与一第二表面；A flexible carrier has a first surface and a second surface; 多个发光芯片，配置于该软性承载器的该第一表面上，而各该发光芯片具有多个凸块，且该些发光芯片通过该些凸块与该软性承载器电性连接；以及A plurality of light-emitting chips are arranged on the first surface of the flexible carrier, and each of the light-emitting chips has a plurality of bumps, and the light-emitting chips are electrically connected to the flexible carrier through the bumps; as well as 一底胶，配置于该软性承载器与该些发光芯片之间，以包覆该些凸块。A primer is disposed between the flexible carrier and the light-emitting chips to cover the bumps. 10.如权利要求9所述的光源组件，其特征在于，还包括一反射层，配置于该软性承载器上，且该反射层具有多个开口，分别暴露出该些发光芯片。10. The light source assembly according to claim 9, further comprising a reflective layer disposed on the flexible carrier, and the reflective layer has a plurality of openings exposing the light-emitting chips respectively. 11.如权利要求9所述的光源组件，其特征在于，还包括多个反射罩，配置于该软性承载器上，且各该反射罩的部分位于相对应的该发光芯片的上方。11. The light source assembly according to claim 9, further comprising a plurality of reflectors disposed on the flexible carrier, and a part of each reflector is located above the corresponding light-emitting chip. 12.如权利要求9所述的光源组件，其特征在于，该软性承载器具有一第一图案化金属层、一第二图案化金属层与多个导电贯孔，其中该第一图案化金属层与该第二图案化金属层分别位于该第一表面与该第二表面上，而该第一图案化金属层与该第二图案化金属层通过该些导电贯孔电性连接，该些凸块与该第一图案化金属层电性连接。12. The light source module according to claim 9, wherein the flexible carrier has a first patterned metal layer, a second patterned metal layer and a plurality of conductive vias, wherein the first patterned metal layer and the second patterned metal layer are located on the first surface and the second surface respectively, and the first patterned metal layer and the second patterned metal layer are electrically connected through the conductive vias, the The bump is electrically connected to the first patterned metal layer. 13.如权利要求9所述的光源组件，其特征在于，各该软性承载器还具有一第一散热金属层、一第二散热金属层与多个散热贯孔，其中该第一散热金属层与该第二散热金属层分别位于该第一表面与该第二表面上，而该第一散热金属层与该第二散热金属层通过该些散热贯孔连接。13. The light source assembly according to claim 9, wherein each of the flexible carriers further has a first heat dissipation metal layer, a second heat dissipation metal layer and a plurality of heat dissipation through holes, wherein the first heat dissipation metal The first heat dissipation metal layer and the second heat dissipation metal layer are located on the first surface and the second surface respectively, and the first heat dissipation metal layer and the second heat dissipation metal layer are connected through the heat dissipation through holes. 14.如权利要求13所述的光源组件，其特征在于，各该软性承载器的该第二散热金属层具有多个凹槽。14. The light source assembly according to claim 13, wherein the second heat dissipation metal layer of each flexible carrier has a plurality of grooves. 15.一种发光芯片封装体，包括：15. A light-emitting chip package, comprising: 一软性承载器，具有一第一散热金属层、一第二散热金属层与多个散热贯孔，其中该第一散热金属层与该第二散热金属层分别位于该软性承载器的一第一表面与该软性承载器的一第二表面上，而该第一散热金属层与该第二散热金属层通过该些散热贯孔连接，且该第二散热金属层具有多个凹槽；A flexible carrier has a first heat dissipation metal layer, a second heat dissipation metal layer and a plurality of heat dissipation through holes, wherein the first heat dissipation metal layer and the second heat dissipation metal layer are respectively located on one side of the flexible carrier On the first surface and a second surface of the flexible carrier, the first heat dissipation metal layer and the second heat dissipation metal layer are connected through the heat dissipation through holes, and the second heat dissipation metal layer has a plurality of grooves ; 至少一发光芯片，配置于该软性承载器的该第一表面上，而该发光芯片具有多个凸块，且该发光芯片通过该些凸块与该软性承载器电性连接；以及At least one light-emitting chip is disposed on the first surface of the flexible carrier, and the light-emitting chip has a plurality of bumps, and the light-emitting chip is electrically connected to the flexible carrier through the bumps; and 一底胶，配置于该软性承载器与该发光芯片之间，以包覆该些凸块。A primer is disposed between the flexible carrier and the light-emitting chip to cover the bumps. 16.如权利要求15所述的发光芯片封装体，其特征在于，还包括一反射层，配置于该软性承载器上，且该反射层具有至少一开口，暴露出该发光芯片。16. The light-emitting chip package as claimed in claim 15, further comprising a reflective layer disposed on the flexible carrier, and the reflective layer has at least one opening exposing the light-emitting chip. 17.如权利要求15所述的发光芯片封装体，其特征在于，还包括一反射罩，配置于该软性承载器上，且该反射罩的部分位于该发光芯片的上方。17 . The light-emitting chip package as claimed in claim 15 , further comprising a reflector disposed on the flexible carrier, and a part of the reflector is located above the light-emitting chip. 18.如权利要求15所述的发光芯片封装体，其特征在于，该软性承载器还具有一第一图案化金属层、一第二图案化金属层与多个导电贯孔，其中该第一图案化金属层与该第二图案化金属层分别位于该第一表面与该第二表面上，而该第一图案化金属层与该第二图案化金属层通过该些导电贯孔电性连接，该些凸块与该第一图案化金属层电性连接。18. The light-emitting chip package according to claim 15, wherein the flexible carrier further has a first patterned metal layer, a second patterned metal layer and a plurality of conductive vias, wherein the first patterned metal layer A patterned metal layer and the second patterned metal layer are located on the first surface and the second surface respectively, and the first patterned metal layer and the second patterned metal layer are electrically connected through the conductive vias connected, the bumps are electrically connected to the first patterned metal layer.
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CN103456861A (en) * 2012-05-31 2013-12-18 展晶科技(深圳)有限公司 Manufacturing method of light emitting diode
CN104124237A (en) * 2013-04-26 2014-10-29 光明半导体（天津）有限公司 Light-emitting diode packaging piece and manufacturing method thereof
CN106105412A (en) * 2014-03-20 2016-11-09 高通股份有限公司 Multi-layer heat radiator for electronic equipment
CN112180128A (en) * 2020-09-29 2021-01-05 西安微电子技术研究所 Interconnection substrate with elastic conductive micro-bumps and KGD socket based on interconnection substrate
CN113097187A (en) * 2019-12-23 2021-07-09 中强光电股份有限公司 Light source module and method for manufacturing the same

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MY112145A (en) * 1994-07-11 2001-04-30 Ibm Direct attachment of heat sink attached directly to flip chip using flexible epoxy
CN100375300C (en) * 2003-11-25 2008-03-12 葛世潮 High power LED

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Publication number Priority date Publication date Assignee Title
CN103456861A (en) * 2012-05-31 2013-12-18 展晶科技(深圳)有限公司 Manufacturing method of light emitting diode
CN104124237A (en) * 2013-04-26 2014-10-29 光明半导体（天津）有限公司 Light-emitting diode packaging piece and manufacturing method thereof
CN106105412A (en) * 2014-03-20 2016-11-09 高通股份有限公司 Multi-layer heat radiator for electronic equipment
CN106105412B (en) * 2014-03-20 2020-04-21 高通股份有限公司 Multilayer heat sink for electronic device
CN113097187A (en) * 2019-12-23 2021-07-09 中强光电股份有限公司 Light source module and method for manufacturing the same
CN112180128A (en) * 2020-09-29 2021-01-05 西安微电子技术研究所 Interconnection substrate with elastic conductive micro-bumps and KGD socket based on interconnection substrate
CN112180128B (en) * 2020-09-29 2023-08-01 珠海天成先进半导体科技有限公司 Interconnection substrate with elastic conductive micro-bumps and KGD socket based on interconnection substrate

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