CN101172768A - Lining system and method thereof - Google Patents
Lining system and method thereof Download PDFInfo
- Publication number
- CN101172768A CN101172768A CNA2007101673013A CN200710167301A CN101172768A CN 101172768 A CN101172768 A CN 101172768A CN A2007101673013 A CNA2007101673013 A CN A2007101673013A CN 200710167301 A CN200710167301 A CN 200710167301A CN 101172768 A CN101172768 A CN 101172768A
- Authority
- CN
- China
- Prior art keywords
- substrate
- wheel
- line
- white space
- taking turns
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention provides a line-marking system and a method for making lines on a substrate through the use of a wheel arranged on a head. The line-marking method includes: a first procedure, in which a line is marked on a first direction of the substrate; a second procedure, in which the direction of the wheel is converted into a second direction different from the first direction in a blank area of the substrate and then the wheel is moved for a certain distance; a third procedure, in which direction of the wheel is converted into a third direction opposite to the first direction in the blank area of the substrate and then a line is marked; and a fourth procedure, the direction of the wheel is converted into the second direction in the blank area of the substrate and then wheel is moved for a certain distance. The first to four procedures are performed continuously. The line-marking method of the invention can reduce the operation time of line marking.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
The application requires the rights and interests of the korean patent application submitted on August 9th, 2007 2007-0079943 number, and its disclosure integral body is hereby expressly incorporated by reference.
Technical field
The present invention relates to a kind of scoring system and method, specifically, relate to a kind of like this scoring system, this scoring system uses the wheel that is installed on the head, so that on the substrate that display unit adopted that uses panel display board, form line continuously, also relate to a kind of scribble method that uses this scoring system.
Background technology
In the display unit of using panel display board (such as display panels, Plasmia indicating panel, organic electroluminescent (EL) display panel etc.), two brittle glasses are bonded together so that constitute panel.When making this panel, female glass substrate (below, be called " substrate ") is cut into predetermined shape.In this cutting process, form line along waiting to draw the line on substrate.Then, predetermined stress in bending is put on substrate around formed line, thereby along this line cutting substrate.
That is, have large-area substrate and be cut into a plurality of panels, and these panels are as employed panel in the flat-panel monitor as display unit with predetermined size.
Recently, because flat-panel monitor has increasing size, also trend towards increasing on the area attenuate on thickness so be used for the glass of panel.Therefore, use glass with 0.5mm thickness.In addition, also use glass with 1500mm * 1800mm big area and 0.7mm thickness.
In the method that forms this line, substrate is fixed on the support table, and uses wheel on substrate, to form line.Replacedly, on substrate, be pre-formed crackle, and with laser beam irradiation to the front end of crackle, make substrate pass through heat and be out of shape.Simultaneously, the position that mobile laser beam shone makes crack growth.Then, form line, this line is made of the vertical crackle along the substrate thickness direction.
An example of the method for cutting substrate is disclosed in the Taiwan patent application No. 094131244 (submission on September 12nd, 2005).
Shown in Fig. 1 a and Fig. 1 b, the Taiwan patent application discloses the laser cutting device that is used for cutting substrate 13 No. 094131244.This laser cutting device comprises laser system 10, first scriber 11, first refrigerant 111, second scriber 12 and second refrigerant 122.
First scriber 11 or second scriber 12 of this laser cutting device comprise laser, aciculiform bar or cutting wheel.As first refrigerant 111 or second refrigerant 122, use liquid or gas, such as the mixture of water, liquid nitrogen, liquid helium etc. or these liquids and gases.
With reference to Fig. 1 a and Fig. 1 b, when cutting substrate 13, scriber is to substrate 13 line, so that form tiny crack on substrate 13, and laser system 10 produces laser (such as CO2 laser), and this laser is put on substrate 13 so that heated substrates 13 along tiny crack.In this state, be lower than in the temperature of the substrate after the heating 13 by the substrate 13 of the energy of laser heating under the condition of fusing point of substrate 13 and expand, and produce stress.Then, come cooling base 13, make substrate 13 can have tensile stress by the refrigerant in laser system 10 rear sides.Then, cutting substrate 13.
That is, disclosed this laser cutting device comes cutting substrate along the first cut direction B and the second cut direction C opposite with the first cut direction B in No. the 094131244th, the Taiwan patent application.Therefore, first scriber 11, second refrigerant 122, laser system 10, first refrigerant 111 and second scriber 12 sequentially are provided with along the second cut direction C.When along the first cut direction B cutting substrate 13, first scriber 11 at first produces predetermined tiny crack on substrate 13, and laser system 10 produces the laser that is used for coming along predetermined tiny crack heated substrates 13, and first refrigerant 111 cools down the hot spots that is arranged in laser system 10 rear portions of substrate 13.So, form first line of cut.In this process, second scriber 12 and second refrigerant 122 are not worked.In addition, along the first cut direction B cutting substrate 13 once, and the preparation of this laser cutting device moves along the portable cord that is formed on the substrate outside, is used for second line of cut.Afterwards, second scriber 12, laser system 10 and second refrigerant 122 are along the second cut direction C cutting substrate 13 opposite with the first cut direction B.First scriber 11 and first refrigerant 111 are not worked.
As shown in Figure 2, Japanese unexamined patent application publication 2001-135836 number (announcement on May 18 calendar year 2001) discloses a kind of method of using laser with the band shape with preset width the film that is formed on the substrate to be rule, and this substrate constitutes solar module.
That is, as shown in Figure 2, be formed at that nesa coating 3 on the substrate 1 is divided into the effective area 3a that wherein is formed with circuit and, and shine the laser scioptics on the substrate 1 and focus on around the fringe region 3b of effective area 3a.
In this method, the A place, position of edge region 3b drives the X worktable, and with laser radiation to first line, 31 substrates that move 1 on substrate 1 longitudinal direction (that is, at directions X).And, when the X worktable arrives the B place, position of fringe region 3b, do not stop the irradiation of laser, and the Y worktable moves along second line 32.When the Y movable workbench make to arrive the C place, position of fringe region 3b, the X worktable was mobile in the opposite direction along line 33.Like this, the operation of ruling continuously at the effective area of nesa coating 3 3a and on the fringe region 3b of effective area 3a.
But, in No. the 094131244th, Taiwan patent application and Japanese unexamined patent application publication 2001-135836 number, uses two scribers, perhaps form line by laser, therefore the cost increase of scriber is installed.
In addition, in Japanese unexamined patent application publication 2001-135836 number, when substrate by XY worktable (or platform) on the XY direction when mobile, this method can be applied to be used to make the small size substrate or the wafer of semi-conductor chip.But, be used for the aforesaid method of the substrate of flat-panel monitor in cutting, need be at the mobile space on the XY direction.Therefore, when substrate size increased, the operating space also should enlarge.
Summary of the invention
The object of the present invention is to provide a kind of scoring system, this scoring system uses the wheel that is installed on the head with eccentric structure can carry out crossed process continuously, and can not increase installation cost or enlarge operating area, a kind of scribble method that uses this scoring system also is provided.
Another object of the present invention is to provide a kind of scoring system, this scoring system uses the head of wheel is installed, and can match with large-size substrate at an easy rate and operating area is enlarged, and a kind of scribble method that uses this scoring system also is provided.
An aspect of of the present present invention provides a kind of use to be installed in the wheel on the head and formed the scribble method of ruling on substrate, and this method comprises: first operation forms line on the first direction of substrate; Second operation, the direction with wheel in blank (dummy) zone of substrate converts the second direction that is different from first direction to, will take turns subsequently and move predetermined distance; The 3rd operation, the direction with wheel in the white space of substrate converts the third direction opposite with first direction to, forms line subsequently; And the 4th operation, the direction with wheel in the white space of substrate converts second direction to, will take turns subsequently and move the distance of being scheduled to, and wherein, first to fourth operation is carried out continuously.
First to fourth operation can repeatedly be carried out.
This scribble method may further include: the 5th operation, and the direction with wheel in the white space of substrate converts second direction to, moves this and takes turns, and converts the direction of taking turns to first direction, will take turns subsequently and move predetermined distance; The 6th operation, in the white space of substrate, the direction of wheel converted to the vertical four directions of first direction to, form line subsequently; The 7th operation, the direction with wheel in the white space of substrate converts first direction to, will take turns subsequently and move predetermined distance; And the 8th operation, in the white space of substrate, the direction of wheel converted to the four directions to the 5th opposite direction, form line subsequently, wherein, the 5th to the 8th operation is carried out continuously.
The the 5th to the 8th operation can repeatedly be carried out.
The first and the 3rd operation can be carried out on Y direction, and the 6th and the 8th operation can be carried out on X-direction.
The direction of wheel can only be changed in white space.
Another aspect of the present invention provides a kind of scoring system, and this scoring system comprises: head unit; Wheel is installed on the head unit, so that form line on substrate; Pressurizing device is used for head unit is pressurizeed; Running gear is used for the slip-on head unit; And control unit, be used to control the miles of relative movement of the pressure and the running gear of pressurizing device, wherein, when running gear makes wheel move to the nominal region of substrate, the direction of control unit conversioning wheel.
The center of head unit and the center of wheel can not overlap each other.
The direction of wheel can only be changed in white space.
Pressurizing device polishing head unit not in white space.
Description of drawings
From the detailed description below in conjunction with accompanying drawing, above-mentioned purpose, feature and advantage with other of the present invention will be more apparent, in the accompanying drawing:
Fig. 1 a and Fig. 1 b are the synoptic diagram of conventional laser cutting unit;
Fig. 2 shows the synoptic diagram of the method for cutting the substrate that constitutes solar module;
Fig. 3 shows the synoptic diagram of traditional scribble method;
Fig. 4 is the employed in the present invention synoptic diagram with scriber of eccentric structure;
Fig. 5 is the synoptic diagram of the motion track of scriber, shows according to scribble method of the present invention; And
Fig. 6 shows the schema according to scribble method of the present invention.
Embodiment
At first, notion of the present invention will be described.
In scoring system according to the present invention and method, a kind of technology is provided, in this technology, can under the situation of not raising wheel, carry out crossed process in the opposite direction.
That is, in line formation method shown in Figure 3, the wheel that is installed on the head is operated along first line that dotted line 201 carries out from position a to position b, and this dotted line is to rule along the Y that the Y direction shown in the solid line 211 is set in advance on the substrate.Then, in order to carry out the second line operation along dotted line 202, raise wheel, and head moves to position c along the direction shown in the long and short dash line 221 from position b.Then, wheel carries out the second line operation from position c to position d on the Y direction shown in the solid line 212.
When wheel when repeating after this operation in-position h, the head that wheel is installed on it is raised, and moves to position i along the direction shown in the long and short dash line 222 subsequently, so that rule operation on directions X.
Then, the wheel that is installed on the head is operated along the 3rd line that dotted line 203 carries out from position i to position j, and this dotted line is to rule along the X that the directions X shown in the solid line 213 is set in advance on the substrate.Then, in order to carry out the 4th line operation along dotted line 204, wheel is raised, and head moves to position k along the direction shown in the long and short dash line 223 from position j.Then, wheel carries out 1 the 4th line operation to the position from position k on the directions X shown in the solid line 214.
But the line shown in Fig. 3 is the solid wire that is made of discontinuous straight line.Therefore, for the operation of ruling along each bar line, wheel should be raised at the line destination county, moves to the line initial point subsequently.Therefore, when substrate size increased, the wheel amount of movement further increased.In addition, because vertically moving of wheel makes additional (tack) time increase.
Below, with reference to Fig. 4 structure of the present invention is described.
Fig. 4 is the employed in the present invention synoptic diagram with scriber of eccentric structure.
As shown in Figure 4, employed scriber comprises among the present invention: wheel keeper 60, and this takes turns the wheel 62 that keeper is kept for forming line; And head 50, wheel keeper 60 is installed on this head.
Shown in the dotted line among Fig. 4, this scriber has eccentric structure, makes the center of head unit 54 and the center of wheel 62 not overlap each other.Therefore, when wheel 62 direction conversion 180 is spent, because the feature of tracing head unit 54 working direction of eccentric structure, have difficulties so move along the last direction of operating of head.Therefore, when wheel 62 direction conversion 180 is spent, not only each every length change and the broad space that need be used to change.
In the present invention, for the above reasons, the direction of wheel 62 conversion 90 degree.
That is, when mobile unit made wheel 62 move to the white space of substrate, control unit 75 was controlled, and made the direction of wheel 62 change about 90 degree.That is, control unit 75 has length, direction and the information of aspect, interval, the positional information on the white space etc. about the line on substrate to be formed.These information store as preset value.When judging that according to these values wheel 62 is arranged in white space, control unit 75 is controlled, with the direction of conversioning wheel 62.According to the function of scriber, can take turns 62 direction conversion in the direction or the mode of the direction of conversion head unit 54 only of conversion head 50.
The present invention is characterized in that the direction of (that is, under the non-stop state of scriber) wheel 62 is changed about 90 degree in the scriber action.Direction of travel conversion in the white space of substrate.
Then, with reference to Fig. 5 and Fig. 6 operation according to scoring system of the present invention is described.
Fig. 5 shows the synoptic diagram according to scribble method of the present invention, represented the motion track of scriber, and Fig. 6 is the schema according to scribble method of the present invention.
As shown in Figure 5 and Figure 6, scribble method according to the present invention is that scriber shown in Figure 4 uses the wheel 62 that is installed on the head to form line on substrate 300.
At first, head 50 is positioned on the pending substrate 300.Then, for the predetermined position of the effective area that is formed with circuit 310 in the substrate is rule, the white space 320 that never has Presentation Function along default line 301 carries out crossed process at first direction (from position a to position b).That is, form the line of representing by solid line 311 (step S10) along the line 301 that is illustrated by the broken lines on the first direction of Y-axis shown in Figure 5.But the line that is illustrated by the broken lines 301 shown in Fig. 5 is to show for convenience, rather than truly is depicted on the substrate.When forming line 311, control unit 75 judges whether wheel 62 arrives white space 320 (step S20).
When wheel 62 in step S20 when being arranged in white space 320, in the white space 320 of substrate 300, control unit 75 will be taken turns 62 direction and be converted the second direction that is different from first direction (from position b to position c) (step S30) to.Then, wheel 62 moves predetermined distance, for example corresponding to the distance of each panel width, so that form line 321 (step S40).Therefore, line 321 can form straight line or curve.But,, preferably use the straight line shown in Fig. 5 in order to obtain accurate correction value when the direction of conversioning wheel 62.As mentioned above, the present invention is characterized in: wheel 62 is not raised, is taken turns 62 direction and change 90 degree and take turns 62 mobile continuously in white space 320.When wheel 62 is mobile in white space 320, can remove the pressing force of presser unit.That is, only the direction of conversioning wheel 62 and can not form line 321 so that can move wheel 62.
Then, control unit 75 judges whether wheel 62 has moved the distance (step S50) for the treatment of substrate is divided into each panel.When wheel during 62 in-position c, in the white space 320 of substrate 300, control unit 75 will be taken turns 62 direction and be converted the third direction opposite with first direction (step S60) to.Then, carry out crossed process along default line.That is, form the line 312 (step S70) shown in the solid line along the line shown in the dotted line on the third direction of Y-axis shown in Figure 5.
When taking turns 62 when being positioned in the white space 320 (step S80) in step S70, in the white space 320 of substrate 300, control unit 75 will be taken turns 62 direction and be converted the second direction that is different from third direction (from position d to position e) (step S90) to.Then, wheel 62 moves predetermined distance, that is, substrate waits to be divided into the distance of each panel, thereby forms line 322 (step S100).The operation of step S90 and S100 is carried out in the mode identical with the operation of step S30 and S40.
Then, control unit 75 judges whether wheel 62 has moved the distance (step S110) for the treatment of substrate is divided into each panel.When wheel during 62 in-position e, in the white space 320 of substrate 300, control unit 75 will be taken turns 62 direction and be converted the direction identical with first direction (from position e to position f) (step S120) to.Then, carry out crossed process along default line.That is, the first direction along the Y-axis shown in Fig. 5 forms the line shown in the solid line.Each operation can be carried out continuously.
In structure shown in Figure 5, form line in the mode that glass substrate 300 is divided into 4 * 4 panels.But this is an example for convenience of description, and the present invention is not limited to this.
Therefore, when forming m * n bar line, repeatedly carry out above-mentioned operation.That is, in step S130, control unit 75 moves as mentioned above, so that can judge whether to finish the line on the Y-axis.During line on not finishing Y-axis, operation turns back to step S10, thereby repeats above-mentioned operation.
During line on finishing Y-axis, carry out on X-axis, forming the operation of line.
That is, when wheel 62 arrives position h shown in Fig. 5, in the white space 320 of substrate 300, control unit 75 will be taken turns 62 direction and be converted the second direction (step S140) that is different from third direction to.Then, wheel 62 for example moves predetermined distance in wheel 62 does not depart from the scope of white space 320.Then, convert wheel 62 direction to first direction, and will take turns 62 and move to position i.
When judging wheel 62 in-position i, in the white space 320 of substrate 300, control unit 75 will take turns 62 direction convert to the vertical four directions of first direction to (from position i to position j).Then, form the operation of line 313.
When the crossed process finished from position i to position j, in white space 320, control unit 75 will be taken turns 62 direction and be converted first direction to, will take turns 62 subsequently and move predetermined distance, make wheel 62 move to position k from position j.
Afterwards, when wheel during 62 in-position k, in white space 320, control unit 75 will take turns 62 direction convert to the four directions to the 5th opposite direction (from position k to position l).Then, form the operation of line.
The operation that forms the X-axis line is carried out continuously and repeatedly, thereby finishes the operation that forms line on X-axis.
According to scoring system of the present invention and method, can reduce when making the display unit of using panel display board, forming the required operating time of line.
In addition, because the operating time reduces, can reduce manufacturing cost.
According to the present invention, this scoring system and method can be applied to use the display unit of panel display board, thereby reduce manufacturing time.
Although described the present invention with reference to exemplary embodiment of the present invention, but for a person skilled in the art obviously, under the prerequisite that does not deviate from claims and the spirit and scope of the invention that equivalent limited thereof, can carry out various modifications to described embodiment.
Claims (10)
1. a use is installed in the wheel on the head and forms the scribble method of ruling on substrate, and described method comprises:
First operation forms line on the first direction of described substrate;
Second operation in the white space of described substrate, converts described direction of taking turns to be different from described first direction second direction, subsequently described the wheel is moved predetermined distance;
The 3rd operation in the white space of described substrate, converts described direction of taking turns to the third direction opposite with described first direction, forms line subsequently; And
The 4th operation in the white space of described substrate, converts described direction of taking turns to described second direction, subsequently described the wheel is moved predetermined distance,
Wherein, described first to fourth operation is carried out continuously.
2. scribble method according to claim 1, wherein, described first to fourth operation is repeatedly carried out.
3. scribble method according to claim 2 further comprises:
The 5th operation in the white space of described substrate, converts described direction of taking turns to described second direction, moves described the wheel, converts described direction of taking turns to described first direction, subsequently described the wheel is moved predetermined distance;
The 6th operation, in the white space of described substrate, with described direction of taking turns convert to the vertical four directions of described first direction to, form line subsequently;
The 7th operation in the white space of described substrate, converts described direction of taking turns to described first direction, subsequently described the wheel is moved predetermined distance; And
The 8th operation, in the white space of described substrate, with described direction of taking turns convert to described four directions to the 5th opposite direction, form line subsequently,
Wherein, described the 5th to the 8th operation is carried out continuously.
4. scribble method according to claim 3, wherein, described the 5th to the 8th operation is repeatedly carried out.
5. scribble method according to claim 4, wherein, the described first and the 3rd operation is carried out on Y direction, and the described the 6th and the 8th operation is carried out on X-direction.
6. scribble method according to claim 5, wherein, described direction of taking turns is only changed in described white space.
7. scoring system comprises:
Head unit;
Wheel is installed on the described head unit, so that form line on substrate;
Pressurizing device is used for described head unit pressurization;
Running gear is used for moving described head unit; And
Control unit is used to control the miles of relative movement of the pressure and the described running gear of described pressurizing device,
Wherein, when described running gear make described when taking turns the white space that moves to described substrate, the described direction of taking turns of described control unit conversion.
8. scoring system according to claim 7, wherein, the center of described head unit and described center of taking turns do not overlap each other.
9. scoring system according to claim 8, wherein, described direction of taking turns is only changed in described white space.
10. scoring system according to claim 9, wherein, the described pressurizing device described head unit that in described white space, do not pressurize.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020070079943 | 2007-08-09 | ||
| KR1020070079943A KR100904381B1 (en) | 2007-08-09 | 2007-08-09 | Scribing method and scribing apparatus |
| KR10-2007-0079943 | 2007-08-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101172768A true CN101172768A (en) | 2008-05-07 |
| CN101172768B CN101172768B (en) | 2011-02-23 |
Family
ID=39421560
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101673013A Active CN101172768B (en) | 2007-08-09 | 2007-10-22 | Lining system and method thereof |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR100904381B1 (en) |
| CN (1) | CN101172768B (en) |
| TW (1) | TW200819402A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI481576B (en) * | 2012-05-02 | 2015-04-21 | Taiwan Mitsuboshi Diamond Ind Co Ltd | Method of cutting glasses and cutting apparatus |
| CN109574485A (en) * | 2017-09-29 | 2019-04-05 | 塔工程有限公司 | Dicing method and scribing equipment |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001135836A (en) * | 1999-11-02 | 2001-05-18 | Kanegafuchi Chem Ind Co Ltd | Thin film scribing method, device thereof and solar cell module |
| US6455347B1 (en) * | 1999-06-14 | 2002-09-24 | Kaneka Corporation | Method of fabricating thin-film photovoltaic module |
| KR100626983B1 (en) * | 1999-06-18 | 2006-09-22 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | Scribing method by use of laser |
| TWI286232B (en) * | 2002-10-29 | 2007-09-01 | Mitsuboshi Diamond Ind Co Ltd | Method and device for scribing fragile material substrate |
| CN2658774Y (en) * | 2003-11-21 | 2004-11-24 | 太原风华信息装备股份有限公司 | Liquid crystal glass line marking-off machine |
| CN1906002B (en) * | 2003-12-29 | 2011-08-31 | 三星钻石工业株式会社 | Scribe forming structure, scribe head and scribe device |
-
2007
- 2007-08-09 KR KR1020070079943A patent/KR100904381B1/en active IP Right Grant
- 2007-10-15 TW TW096138559A patent/TW200819402A/en unknown
- 2007-10-22 CN CN2007101673013A patent/CN101172768B/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI481576B (en) * | 2012-05-02 | 2015-04-21 | Taiwan Mitsuboshi Diamond Ind Co Ltd | Method of cutting glasses and cutting apparatus |
| CN109574485A (en) * | 2017-09-29 | 2019-04-05 | 塔工程有限公司 | Dicing method and scribing equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100904381B1 (en) | 2009-06-25 |
| TW200819402A (en) | 2008-05-01 |
| KR20090015547A (en) | 2009-02-12 |
| CN101172768B (en) | 2011-02-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4666391B2 (en) | Glass substrate cutting method | |
| CN100507647C (en) | Substrate conveyance device for fabrication of liquid crystal display device | |
| CN101296787B (en) | Method of forming scribe line on substrate of brittle material and scribe line forming apparatus | |
| KR101651557B1 (en) | Glass plate scribing device | |
| EP1630140A1 (en) | Brittle board dividing system and brittle board dividing method | |
| JP5102846B2 (en) | Method and apparatus for chamfering a brittle material substrate | |
| JP2013043808A (en) | Holder for tempered glass plate cutting, and method for cutting tempered glass plate | |
| KR20160123345A (en) | Methods and apparatus for cutting radii in flexible thin glass | |
| CN100581709C (en) | Laser cutting system and cutting method | |
| CN102264659A (en) | Method and device for cutting brittle-material plate, and window glass for vehicle | |
| JP4080484B2 (en) | Scribing method and scribing apparatus for brittle material substrate | |
| CN1264768C (en) | Device and method for scribing fragile material substrate | |
| CN1958490B (en) | Apparatus and method for substrate marking by synchronous multi-shaft | |
| KR101350012B1 (en) | Laser scribe device | |
| CN101172768B (en) | Lining system and method thereof | |
| CN108395089A (en) | A kind of apparatus and method of quick precision laser cutting three-dimensional arc glass | |
| TWI297295B (en) | ||
| CN101134263A (en) | Laser processing method and corresponding laser machining apparatus | |
| JP2013049606A (en) | Method and device for taking out tempered glass panel | |
| KR20120129761A (en) | Method for processing brittle material substrate | |
| CN101025572A (en) | Supporting body of plate | |
| CN113185107A (en) | Glass punching equipment and glass punching method | |
| KR102624039B1 (en) | Laser Processing Method for Cover Glass | |
| WO2005099980A1 (en) | Method of cutting nonmetal | |
| KR20140022983A (en) | Laser cutting apparatus and method using laser beam absorption unit |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |