CN101167414B - 热导体的方法及系统 - Google Patents
热导体的方法及系统 Download PDFInfo
- Publication number
- CN101167414B CN101167414B CN2005800495836A CN200580049583A CN101167414B CN 101167414 B CN101167414 B CN 101167414B CN 2005800495836 A CN2005800495836 A CN 2005800495836A CN 200580049583 A CN200580049583 A CN 200580049583A CN 101167414 B CN101167414 B CN 101167414B
- Authority
- CN
- China
- Prior art keywords
- heat conductor
- component
- circuit board
- described heat
- leg
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1031—Surface mounted metallic connector elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10757—Bent leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10848—Thinned leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (42)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/IB2005/051338 WO2006114665A1 (en) | 2005-04-25 | 2005-04-25 | Method and system of heat conductor |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101167414A CN101167414A (zh) | 2008-04-23 |
CN101167414B true CN101167414B (zh) | 2010-10-27 |
Family
ID=37214444
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2005800495836A Expired - Fee Related CN101167414B (zh) | 2005-04-25 | 2005-04-25 | 热导体的方法及系统 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20080190653A1 (zh) |
EP (1) | EP1875786B1 (zh) |
JP (1) | JP4913798B2 (zh) |
CN (1) | CN101167414B (zh) |
AT (1) | ATE546031T1 (zh) |
WO (1) | WO2006114665A1 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101519187B1 (ko) | 2012-09-07 | 2015-05-11 | 엘지이노텍 주식회사 | 방열부재, 방열회로기판 및 발열소자 패키지 |
US11665811B2 (en) * | 2021-10-29 | 2023-05-30 | Dell Products L.P. | Printed circuit board with signal integrity immunity to temperature |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1305198A (zh) * | 1999-11-30 | 2001-07-25 | 株式会社村田制作所 | 可变电阻器 |
CN1311899A (zh) * | 1998-04-03 | 2001-09-05 | 艾利森公司 | 将集成电路封装固定到热沉上的容性安装装置 |
US6765798B1 (en) * | 2003-06-19 | 2004-07-20 | Curtiss-Wright Controls, Inc. | Electronic thermal management utilizing device with deflectable, two-leg conductive member; and with elastic, thermally-conductive material there between |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3552630A (en) * | 1968-10-14 | 1971-01-05 | Us Air Force | Heat sink and holding device |
US4964198A (en) * | 1988-09-21 | 1990-10-23 | Avvid Engineering, Inc. | V-shaped clip for attaching a semiconductor device to a heat sink |
US5019941A (en) * | 1989-11-03 | 1991-05-28 | Motorola, Inc. | Electronic assembly having enhanced heat dissipating capabilities |
JP2723332B2 (ja) * | 1990-04-12 | 1998-03-09 | キヤノン株式会社 | 集積回路用放熱板 |
JP2782969B2 (ja) * | 1991-03-14 | 1998-08-06 | 富士通株式会社 | 集積回路装置の放熱構造 |
US5258887A (en) * | 1992-06-15 | 1993-11-02 | Eaton Corporation | Electrical device cooling system using a heat sink attached to a circuit board containing heat conductive layers and channels |
JPH0766335A (ja) * | 1993-08-27 | 1995-03-10 | Fujitsu Ltd | 電子モジュール |
JPH07221470A (ja) * | 1994-02-01 | 1995-08-18 | Fujitsu Ltd | 回路モジュール取付け構造 |
US5959350A (en) * | 1997-05-21 | 1999-09-28 | Hon Hai Precision Ind. Co., Ltd. | Fixing device for securing a heat sink to a CPU module |
TW322170U (en) * | 1997-06-13 | 1997-12-01 | Hon Hai Prec Ind Co Ltd | Fastening device of a computer component |
US6323437B1 (en) * | 1998-07-30 | 2001-11-27 | Lucent Technologies Inc. | Spring clamp adapted for coupling with a circuit board |
JP2962711B1 (ja) * | 1998-08-07 | 1999-10-12 | 北川工業株式会社 | プリント基板用スペーサ |
US6434004B1 (en) * | 2000-10-11 | 2002-08-13 | International Business Machines Corporation | Heat sink assembly |
JP2003007941A (ja) * | 2001-06-19 | 2003-01-10 | Tdk Corp | リード線ガイド及び半導体固定装置 |
JP2003218294A (ja) * | 2002-01-23 | 2003-07-31 | Mitsubishi Electric Corp | 放熱器 |
-
2005
- 2005-04-25 AT AT05718798T patent/ATE546031T1/de active
- 2005-04-25 JP JP2008507177A patent/JP4913798B2/ja not_active Expired - Fee Related
- 2005-04-25 WO PCT/IB2005/051338 patent/WO2006114665A1/en not_active Application Discontinuation
- 2005-04-25 US US11/912,607 patent/US20080190653A1/en not_active Abandoned
- 2005-04-25 CN CN2005800495836A patent/CN101167414B/zh not_active Expired - Fee Related
- 2005-04-25 EP EP05718798A patent/EP1875786B1/en not_active Not-in-force
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1311899A (zh) * | 1998-04-03 | 2001-09-05 | 艾利森公司 | 将集成电路封装固定到热沉上的容性安装装置 |
CN1305198A (zh) * | 1999-11-30 | 2001-07-25 | 株式会社村田制作所 | 可变电阻器 |
US6765798B1 (en) * | 2003-06-19 | 2004-07-20 | Curtiss-Wright Controls, Inc. | Electronic thermal management utilizing device with deflectable, two-leg conductive member; and with elastic, thermally-conductive material there between |
Also Published As
Publication number | Publication date |
---|---|
EP1875786A1 (en) | 2008-01-09 |
US20080190653A1 (en) | 2008-08-14 |
ATE546031T1 (de) | 2012-03-15 |
EP1875786B1 (en) | 2012-02-15 |
JP4913798B2 (ja) | 2012-04-11 |
JP2008538860A (ja) | 2008-11-06 |
CN101167414A (zh) | 2008-04-23 |
WO2006114665A1 (en) | 2006-11-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: CLUSTER CO., LTD. Free format text: FORMER OWNER: TELEFONAKTIEBOLAGET LM ERICSSON (SE) S-126 25 STOCKHOLM, SWEDEN Effective date: 20150122 Owner name: AOPU DISI CELLULAR TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: CLUSTER CO., LTD. Effective date: 20150122 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20150122 Address after: Texas, USA Patentee after: Telefonaktiebolaget LM Ericsson (publ) Address before: Delaware Patentee before: Clastres LLC Effective date of registration: 20150122 Address after: Delaware Patentee after: Clastres LLC Address before: Stockholm Patentee before: Telefonaktiebolaget LM Ericsson |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101027 Termination date: 20180425 |