CN101163440A

CN101163440A - A three-dimensional adhesive device having a microelectronic system embedded therein

Info

Publication number: CN101163440A
Application number: CNA2006800137188A
Authority: CN
Inventors: 苏塞尼·霍尔姆·法尔贝克; 卡斯坦·霍普; 比德·伯曼·萨缪尔森; 简斯·布兰尼布杰格
Original assignee: DELTA; Coloplast AS
Current assignee: Delta Dansk Elektronik Lys og Akustik
Priority date: 2005-03-09
Filing date: 2006-03-09
Publication date: 2008-04-16
Anticipated expiration: 2026-03-09
Also published as: CN101163440B

Abstract

Accordingly, the present invention relates to a three-dimensional adhesive device to be attached to the body surface of a mammal comprising a microelectronic sensing system 5 characterized by (a) a three-dimensional adhesive body made of a pressure sensitive adhesive having an upper surface and a bottom surface; (b) a microelectronic system embedded in the body of the pressure sensitive adhesive; 10 (c) one or more cover layer(s) attached to the upper surface; and (d) optionally a release liner releasable attached to the bottom surface of the adhesive device. Suitably the microelectronic system is a microelectronic sensing system capable of 15 sensing physical input such as pressure, vibration, sound, electrical activity (e.g. from muscle activity), tension, blood-flow, moisture, temperature, enzyme activity, bacteria, pH, blood sugar, conductivity, resistance, capacitance, inductance or other chemical, biochemical, biological, mechanical or electrical properties.

Description

Embedding has the three-dimensional adhesive device of microelectronics system

Technical field

The present invention relates to be mainly used in the microelectronics system of monitoring physiological or neural condition.More particularly, the present invention relates to be embedded into intrusive mood and non-intrusion type microelectronics system in the three-dimensional adhesive device, this three-dimensional adhesive device can be attached on the mammiferous surface, and this surface suitably is a skin.This microelectronics system suitably utilizes radio communication and can be used for measuring ECG (electrocardiogram), EMG (electromyogram), EEG (electroencephalogram), blood glucose, pulse, blood pressure, pH value and oxygen.

Background technology

Sensing system is set up to adhering to of skin well by contact adhesive.Therefore, AMBU A/S, DK have the product that ECG is measured in a large amount of being used to, and these products are attached on the skin by foam glue, micropore binding agent or hydrogel adhesive.These pick offs generally are wired on the surveillance equipment.

In WO03/065926A2, people such as Ozgus disclose the wearable biological monitor of the integrated circuit that has softness and approach.This patent application proposes by using thin layer of adhesive or binding agent bedding and padding to be attached to the mode that realizes on the skin that high degree of comfort is worn.But the binding agent of use is occlusion.This application also illustrated and has been used for the sensor assembly that wireless data is collected, and this sensor assembly has the thin silicon plate that comprises circuit and is embedded into flexible power supplys in the sensor assembly as a plurality of layers.

In US5054488, people such as Mus disclose the photoelectronic sensor that is used to produce the signal of telecommunication of representing physiological condition.Pick off can be attached on the health by the bilateral contact adhesive on the polyester lining.

In US5458124, people such as Stanko disclose by the bilateral contact adhesive and have been attached to ECG electrode on the health.

In US6372951, people such as Ter-Ovanesyan disclose and have been connected in the operation by the pick off on patches of adhesive and the disposable that the wearer cooperates.The bonding composition of various healths can be used.

In US6385473, people such as Haines disclose two bands with the hydrocolloid binding agent and have been attached to stacked sensor component on the mammalian object health.Stepped construction also comprises the hydrogel that contacts with the hydrocolloid binding agent.The life-span of device is defined as 24 hours.

In WO99/59465, people such as Feierbach disclose the device of the physiological condition that is used to monitor patient.This device comprises the sticking patch that has for attachment to patient distal side on one's body.This device also can comprise can with the coupled electronic shell of described sticking patch.In one embodiment, the surface of device can be pre-formed to meeting the profile of body part.The sticking patch of carrying electronic shell can be softer and the sensation of nature is provided, and can be made by latex, silicon or other gummed fabric.As Fig. 2 B of this patent and shown in Figure 8, the upper surface with sticking patch of electronic shell can have level and smooth convex shape.Sticking patch is by binding agent and patient's skin coupling.This binding agent can be the hydrocolloid skin care binding agent of being made by 3M.Thus, this patent application instruction is used for the hydrocolloid binding agent lining of attached sensors, and this pick off has randomly the level and smooth and softer backing with preformed form fit body contours.

In U. S. application 2003/0009097A1, people such as Sheraton disclose a kind of like this pick off, promptly, this pick off has hydrogel conductive center contact skin part and centers on the hydrocolloid binding agent part that is used for bonding pick off of this core, and, on the dish of described combination, conducting terminal is connected with lead.This structure further is adhered to the periphery protection of lamination rete on the terminal and binding agent.This patent application instruction is used for aspect that pick off is attached to the hydrocolloid binding agent on the skin and emphasizes to make extremely thin and softish electrode.On the meaning that is used in combination hydrocolloid binding agent and hydrogel, this patent application is unique.For any actual purpose, disclosed structure will be useless, because will move in the hydrocolloid binding agent and along with the time is destroyed it from the moisture of hydrogel.

In the up-to-date progress aspect the surveillance device of physiological condition is wireless type.Except can be invading or non-invasive mode monitoring physiological condition and potentially with benchmark is compared, they can deal with data and they are sent to portable device.In fact, the device that can adhere to itself also can be for example by using light emission, audio alarm or other caution signals to be used as siren.

When physiology that monitors human body or neural condition, it is crucial that the microelectronics system that adheres to is worn comfortable as far as possible, particularly is not bedfast and represents normal body movement or even similar especially true during the excessive body movement of expression in motion or sports medical science as the people who carries device.Preferred, users should the imperceptible microelectronics system that adheres to, and preferred supervision should keep secret.But in this respect, known microelectronics system is as described below to exist several main shortcomings.

Contact adhesive by occlusion is attached on the skin the normal because occlusion of moisture and because such as from the pressure-sensitive adhesive polymers system, for example the monomeric stimulus object from for example acryloid cement causes skin irritation.Stimulation can be for itching and the form of erythema, and, when being adhered to for a long time, adhesive device may develop especially.Occlusion also can increase the risk of generation for the anaphylactic reaction of adhesive ingredients.The mode a kind of commonly used that solves the negative effect of occlusion is to use the micropore band, but this micropore tape base originally is two dimension and thin and does not protect microelectronics system to avoid because the shearing force that causes with friction such as clothes.

In above reference literature, device is attached on the skin as the thin planar adhesive layer of bulk part by the carrying microelectronics system, thereby cause carrying the patient of device or other people owing to hard or feel under the weather, and increase the risk of throwing off from skin unintentionally with the clothes friction.When this device will be used for a long time, reduce because the skin irritation or the discomfort of carrying any kind of being inconvenient to cause of bulk device are crucial.And it is crucial that adhesive device remains fixed on the skin up to deliberately being taken off for signal detection.

The suitable bonding quite thick layer that needs planar adhesive of device.But quite thick layer can show in the trend that is adhered on the edge on clothes or the linen, and, by doing like this, can produce the tendency of rolling and throwing off.

Many pick offs are connected with surveillance by lead.The disadvantage of this system is, be connected because lead is attached on the pick off on the health and with surveillance, so patient can not move freely.Whenever patient wishes when mobile, he must be very carefully avoiding removing any in the lead that is attached on the pick off, and he must further pick up surveillance and carry it.

Mold pressing all is not described in the above-mentioned list of references as the present invention or is cast as the body sensor device three-dimensional adhesive body that wherein embeds microelectronics system, that form by the optional hydrocolloid that comprises thermoplasticity contact adhesive and/or chemosetting contact adhesive.

About the binding agent part of device, overcome some known pick off in the above-mentioned shortcoming and manufacture that not resemble adhesive device of the present invention like that simple and cheap.

The adhesive device of the present invention that wherein embeds microelectronics system manufactures relatively easily, and except cover layer and optional releasing layer, device is without any need for other layer, therefore commercial be very attractive.

When embedding microelectronic component, also can avoid the infiltration of mechanical damage and moisture better from surrounding.

And the electronic device of current many types is attached on the different surfaces temporarily.Particularly in medical treatment and nursing, in order for example to detect different biomedicine signals or to fetch sample, be attached on the zones of different of skin such as the dissimilar medical device of probe and pick off from patient.These medical devices often only are attached the limited time and are diagnosed or patient's health improves up to disease.But some chronic diseases may need regular supervision, for example when patient is in dormancy, perhaps, in some cases, wish day and night to carry out constant supervision.Be attached to the signal that medical device on patient's the skin can be suitable for detecting many types, it for example is that one or more that be used for detecting such as electromyogram (EMG) signal, electrocardiogram (ECG) signal, electroencephalogram (EEG) signal are planted the pick off of signals.

These medical devices can be divided at least three kinds of general elements: be used to measure the microelectronic element such as the value of the hope of bio signal; Be used for microelectronic element is attached to lip-deep binding agent; With the power supply that is used at least a portion power supply of microelectronic circuit.

Different elements has the different life-spans, and still, because element generally is assembled in the inseparable unit, therefore they are disposed together after use.But, when watching each element individually, be appreciated that they have the different life-spans.Therefore, adhesive element generally only is disposable use.Power supply can be in some cases re-used several times according to the application and the size of battery.But microelectronic element can be re-used many times, just disposes thus to make it become expensive element after only using once.

Therefore, in order to improve the cost efficiency of medical device, need to reuse the element that after use, still can work.

US2002/0180605 discloses a kind of method of monitoring physiological characteristic.Disclosed method can comprise following successive step: remove the binding agent pad from sensor assembly, and, after data are transferred to receiver module from sensor assembly, be used for disinfectant autoclave heating sensor module.

Summary of the invention

Therefore, the present invention relates to a kind of three-dimensional adhesive device that comprises the microelectronics sensing system, it is characterized in that,

(a) has the three-dimensional adhesive body of making by contact adhesive of upper surface and basal surface;

(b) be embedded into microelectronics system in the body of contact adhesive;

(c) be attached to one or more cover layer on the upper surface; With

(d) randomly, be releasably attached to release liner on the basal surface of adhesive device.

Suitably, microelectronics system is the microelectronics sensing system.This microelectronics sensing system suitably can sensing such as pressure, the physics input of vibration, sound, electrical activity (for example, from musculation), tension force, blood flow, moisture, temperature, enzymatic activity, antibacterial, pH value, blood glucose, conductivity, resistance, electric capacity, inductance or other chemistry, biochemistry, biology, machinery or electric input.

Description of drawings

Fig. 1 represents the mould section according to the shape of the canonical representation of adhesive device of the present invention.CT is the maximum ga(u)ge of device, and PT is the thickness of the periphery of device.

Fig. 2 illustrates and embeds/be integrated into the microelectronics system in three-dimensional (3D) binding agent.The part of size box presentation graphs 3, Fig. 4, Fig. 5, Fig. 6, Fig. 7, Fig. 8, Fig. 9, Figure 10, Figure 11 and adhesive device shown in Figure 12.

Fig. 3 illustrates and is fully integratible into the intravital microelectronics system of binding agent (hachure frame).

A plurality of parts that Fig. 4 illustrates microelectronics system can be integrated in the adhesive device in different positions, make to have suitable machinery or electric interconnection between these parts.

Fig. 5 illustrates the microelectronics system that is applied in the intravital groove of binding agent.Groove is the far-end of skin fixed area.Microelectronics system can randomly interchangeablely maybe can re-use.

Fig. 6 illustrates that top is interchangeable maybe can be re-used and the bottom forever is integrated into the intravital microelectronics system of binding agent.

A plurality of parts that Fig. 7 illustrates microelectronics system can be positioned at adhesive device in different positions, make to have suitable machinery or electric interconnection between these parts.

Fig. 8 illustrates and is embedded into/be applied to the microelectronics system in the groove of binder side of binding agent body.

Fig. 9 illustrates has that the bottom is interchangeable maybe can be re-used and top forever is integrated into the device of the intravital microelectronics system of binding agent.

Figure 10 illustrates some microelectronic components (snapshot of oneself wire frame) and is integrated in the binding agent body in manufacture process and some microelectronic components are applied in thus the system that necessary mechanical/electrical connects that sets up afterwards.

Figure 11 illustrates the microelectronics system that is embedded in the binding agent, and this system all is can apply with accessible from the distal side and the skin fixation side of binding agent body.

Figure 12 illustrates the systems of microelectronics system by two part assemblings, and in these two parts one or each can interchangeablely maybe can re-use.

In all above structures of the present invention, no matter whether there are the parts of microelectronics system on the upper surface, it is level and smooth that upper surface all keeps.Suitable structure that can be by microelectronic component, encapsulation etc. realize this point.

Fig. 8, Fig. 9, Figure 10, Figure 11 and structure shown in Figure 12 are particularly suitable for comprising the microelectronics system of the element of the electrode that for example should have the skin contact.

Figure 13～18 illustrate embodiments of the invention, and here, antenna, CPU, battery and electrode are embedded in the adhesive device.Figure 13 illustrates the two-dimensional shapes of device, by A-A indication section.In Figure 15, the third dimension is illustrated as section A-A.Further amplified among Figure 16 from the round B at the edge of device, and the round C at center is exaggerated in Figure 17 similarly.Figure 14 illustrates the position of the antenna that is positioned at the outside of adhesive device and is connected with the core of microelectronics system.Figure 16 represents to be kept flat the structure that embeds the antenna in the binding agent in more detail.Figure 17 represents to have battery, CPU and the position of core of microelectronics system of stretching out the electrode of binding agent.Battery and CPU are encapsulated in the transparent silicone rubber.At last, Figure 18 illustrates adhesive device with tridimensional model.

Figure 19 is illustrated in an embodiment according to sensor cluster of the present invention who sees in the perspective exploded view.

Figure 20 represents along the embodiment of the sensor cluster in the sectional drawing of the line XX-XX among Figure 19.

Figure 21 represents the embodiment of the sensor cluster seen from the bottom.

Figure 22 a and Figure 22 b represent another embodiment according to device of the present invention, and wherein, Figure 22 b is with the part of enlarged drawing presentation graphs 22a.

Figure 23 is illustrated in another embodiment according to device of the present invention that sees in the perspective view.

Figure 24 represents along the embodiment according to device of the present invention in the sectional drawing of the line XXIV-XXIV among Figure 23.

The specific embodiment

The present invention relates to have the adhesive device that is embedded into the microelectronics system in the binding agent body of making by contact adhesive.

Below, the term " three-dimensional " that uses when limiting the element of binding agent body for example or device is meant the sizable element of profile variations when observing in section.Therefore, for example, the three-dimensional adhesive body will have maximum ga(u)ge and minimum thickness.According to the present invention, maximum ga(u)ge will be the twice at least of minimum thickness.In a preferred embodiment, the thickness of the outward flange of adhesive device or periphery is less than half of the thickness of the thick (being generally core) of pick off.

Opposite with term " three-dimensional ", the term " two dimension " that uses when limiting element is meant the element with general even curface.Therefore, the maximum ga(u)ge of two-dimentional binding agent body is less than the twice of the minimum thickness of binding agent body.

As used herein, about microelectronics system or its parts, term " embedding " means that the contact adhesive of binding agent body partly or entirely surrounds the whole of microelectronics system or some parts.Therefore, term " embedding " comprises all limits of system or parts by the situation of the adhesive coverage of binding agent body, and comprise such a case, promptly, not all each limit of article that embeds is all by the adhesive coverage of binding agent body, for example, article are placed in groove in the binding agent body or the cavity and can arrive from the outside.

" embedding " is to be used to illustrate that microelectronics system is positioned at the general terms of the intravital mode of binding agent, and term " integrated " means that microelectronics system or its specific features are all covered by binding agent on all each limits, and, when microelectronics system is only partly covered, use term " to apply ".

Integrated and cover and also to comprise such a case on all each limits, that is, integrated parts for example are connected to electric or other mode and embed on intravital another parts of binding agent.

As used herein, microelectronics " sensing " system means the microelectronics system that comprises the transducer with the element that can detect physiology or neural condition.

As used herein, through hole means to have opening on the upper surface of binding agent body and have the hole of passing the binding agent body of opening on the basal surface of binding agent body.Preferably, through hole has an opening and have an opening on basal surface on the upper surface of binding agent body.Through hole can have suitable shape arbitrarily.

" thickness " of adhesive device means can be in line of shortest length that draws between the lip-deep on earth point of the specified point on the upper surface or the geodesic length that can draw between the point of the specified point on the basal surface to the upper surface.

For the present invention, express " skin " and be used to indicate mammiferous outer surface.

As mentioned above, be surprised to find very much, microelectronics partly is embedded into the problem that wireless microelectronics system in the contact adhesive body of 3D shape solves known sensor component.

Because the performance of three-dimensional contact adhesive produces the best protection to microelectronics system.Binding agent provides sealing to skin surface, and, because the vertical polymer covering of adhesive device, so the liquid that adhesive device is protected outside avoiding influences.And the microelectronics that the binding agent protection embeds is partly avoided mechanical damage.

Binding agent body according to the present invention is made by the contact adhesive of 3D shape, has the thickness of variation to the edge from the center of binding agent body, and suitably has the intravital microelectronics sensing system of the binding agent of embedding in the thickest position of binding agent body.

The device that has this shape and suitably have a bevel edge provides the smooth interface with skin.Adhesive device will provide soft sensation and will not be tending towards rubbing with clothes and linen.Special advantage is that adhesive device will be not easy because the viscosity at heavy and edge comes off unintentionally.This real function for device is crucial.

And because the binding agent body has as the salvo of the means that device are fixed to skin, microelectronics system and be used for device is configured as the triple functions of the means of shape easily, so the structure of adhesive device is very easy.This structure needs less parts and processing step in the assembling of three-dimension device, so cost is not high and be easier to make.

According to one embodiment of present invention, the three-dimensional adhesive body has smooth basically basal surface and the smooth upper surface that is suitable for being adhered on the mammiferous surface.The adhesive device suitably core at body is the thickest and the thinnest at the edge of body.

Preferably, upper surface has level and smooth convex surface, but it can take any form in principle.

The outward flange of adhesive device or periphery must be shaped as thickness less than half of the thickness of the thick (being generally core) of pick off.

Therefore, in another embodiment of the present invention, the thickness of adhesive device on the edge less than adhesive device its thickest locational thickness 50%, suitably, the thickness on the edge less than adhesive device its thickest locational thickness 25%, preferably, thickness on the edge less than adhesive device its thickest locational thickness 10%, and, most preferably, the thickness on the edge less than adhesive device its thickest locational thickness 5%.

The thickness of adhesive device on the edge is generally less than 0.4mm.In one embodiment, this thickness can be 0.01～0.4mm.Suitably, the thickness of adhesive device on the edge is preferably 0.05～0.4mm greater than 0.05mm.

Usually, the thickness of adhesive device is 0.5～15mm, more suitably, general but needn't ground under the thickest situation in the center of binding agent body, be 1～5mm.

Suitably, the angle the basal surface of adhesive device and the line that draws from the arbitrfary point of the periphery of basal surface to the thickest locational point of upper surface binding agent body is less than 60 degree, preferably less than 45 degree, and most preferably less than 30 degree.

The outward flange of binding agent body can suitably be shaped as has or does not have the circular or oval of lobe or projection, and perhaps it can be shaped as rectangle or triangle to obtain the device of convenient as far as possible and safety.

Usually, the periphery of binding agent body will comprise the binding agent of binding agent body.But, can exist microelectronics system or its parts be placed in the periphery/or on embodiment, thus, periphery not only comprises the binding agent of binding agent body.

The contact adhesive of making the three-dimensional adhesive body suitably is the contact adhesive of mouldable thermoplasticity or chemosetting, even this contact adhesive has the curvature that makes adhesive device can meet body part also keeps its bond properties simultaneously under mobile condition flexibility.

Suitably, the contact adhesive of making the binding agent body is based on the binding agent of polymer, and these polymer are selected from the group such as the block copolymer of styrene block copolymer and hydrogenated styrene block copolymers, amorphous polyalphaolefin (APAO), polyacrylic acid, polyvinylether, polyurethane, polyvinyl acetate, silicone or hydrogel contact adhesive.

Contact adhesive based on these polymer is known, and those skilled in the art will know that the binding agent that how to prepare based on these polymer.

Block copolymer such as styrene block copolymer and hydrogenated styrene block copolymers can suitably be selected from styrene/ethylene-butylene/styrene (SEBS), styrene/isoprene/styrene (SIS) and styrene/ethylene-propylene/styrene (SEPS).

Binding agent also can be based on PDMS (polydimethylsiloxane), and can suitably be the PDMS gel.

Hydrogel adhesive also can based on or comprise amfifilic polymer, polyvinylpyrrolidone, polyvinyl alcohol, poly(ethylene oxide), gelatin, natural gum and cellulose derivative or their combination in any.

Contact adhesive can be according to these principles and based on the handbook at Donatas Satas: Handbook of pressure sensitive adhesive technology, list among the Third edition with disclosed polymer and prepared.

In a certain embodiments of the present invention, the contact adhesive of making the binding agent body comprises hydrocolloid.The contact adhesive that comprises hydrocolloid can be any or any other contact adhesive well known in the art in the contact adhesive of the above-mentioned type.

Therefore, U.S. Patent No. 3339549 discloses such as the rubber elastomer of polyisobutylene with such as one or more of the pulverulent mixture of pectin, gelatin and carboxymethyl cellulose and has planted the mixing of water solublity or the expandable hydrocolloid of water.The binding agent piece has and is applied to a lip-deep water-fast film.Such composition can be commercial from E.R.Squibb﹠amp; Sons Inc. obtains by trade mark " Stomahesive ", and the skin blocking agent that is used as around the pore damages skin with the corrosive fluid that prevents to be discharged by pore.

In such adhesive ingredients, polyisobutylene is responsible for providing bond properties, and dispersive hydrocolloid powder absorption fluids and make binding agent can also be adhered on the wet skin (wet viscosity).These compositions are also more and more accepted as the wound dressing that is used for skin ulcer, burn and other the wound that exosmoses.

In a large amount of embodiment, disclosed styrol copolymer is added in a large amount of patent documentations.

Therefore, people's such as Sorensen U.S. Patent No. 4231369 discloses and has been included in the styrol copolymer that wherein disperseed water solublity hydrocolloid natural gum and the neostomy skin blocking agent of viscosifier.

In U.S. Patent No. 4367732, people such as Poulsen disclose the neostomy skin blocking agent that comprises the water solublity hydrocolloid, antioxidant and the oily extender that are scattered in the continuous phase that comprises styrol copolymer, Hydrocarbon viscosifier and plasticizer.

U.S. Patent No. 4551490 people such as () Doyle disclose comprise one or more content of planting polyisobutylene, two blocks (diblock) copolymer of 3～20% of 5～30% be lower than 20% one or more plant the medical grade contact adhesive composition of the homogeneous mixture of styrene groups or block copolymer, mineral oil, one or more kind water solublity hydrocolloid natural gum and viscosifier.One or more are planted the expandable viscosity-increasing agent of water, antioxidant and various other optional ingredients and also can be contained in the adhesive ingredients.

U.S. Patent No. 5492943 discloses and has comprised two kinds of avisco-elastic binder elastomers, particularly is the contact adhesive composition of the mixture of high molecular weight polyisobutylene and styrene block copolymer, and this mixture forms the continuous phase of wherein having disperseed such as the hydrocolloid of sodium carboxymethyl cellulose and pectin with plasticizer (being preferably vaseline) and suitable viscosifier and antioxidant.

In U.S. Patent No. 4867748, Samuelsen discloses geometry and the processing thereof by the sealing gasket made from the hydrocolloid binding agent of backing film combination.

Disclosed adhesive ingredients is described for the neostomy apparatus is adhered to wafer on the skin in U.S. Patent No. 5492943, and be different with known composition, thereby avoid using low-molecular-weight polyisobutylene fully and preferably do not comprise gelatin by comprising styrene block copolymer with more high-load diblock copolymer.

The contact adhesive that comprises hydrocolloid is characterised in that to have the microgranule phase that is scattered in the hydrocolloid of binding agent in mutually, and it is specially suitable a group of binding agent.The binding agent that comprises hydrocolloid can be avoided the obstruction of skin from skin absorbs moisture, keeps its bond properties to skin simultaneously.And the binding agent body that comprises hydrocolloid can have arbitrarily thickness and still have the performance of not occlusion.The hydrocolloid binding agent is because hot melt can be processed and be easy to mold pressing is specific shape.

This means, make the thickness of binding agent body to carry out the transition to core gradually with the hot melt of easy moldability combination, thereby level and smooth incoherent outstanding profile that do not have is provided from the edge of the adhesive device that comprises microelectronics system.

Below describe in detail and be used to make the prescription that can be used for the contact adhesive of binding agent body according to of the present invention.

Therefore, typical contact adhesive composition comprise 10～60wt.% based on the gross weight of composition one or more plant rubber-like elastic body compositions, 5～60% one or more plant the mixture uniformly basically of the nonpolar oily extender of superabsorbent particles, 0～50% tackifier resins, 0～10% plasticizer and 0～60%.

The optional self-contained physically crosslinked elastomer of rubber-like elastic body basis (suitably for comprising the block copolymer of polystyrene block), the natural or synthetic rubber shape elastomer of chemical crosslinking or the group of rubber-like homopolymer.

Being selected from styrene and one or more, to plant the elastomer of physical crosslinking of the block copolymer of butadiene can be styrene butadiene styrene block copolymer (SBS), styrene-isoprene copolymer, and the mixture of styrene-isoprene-phenylethene and styrene-isoprene block copolymer preferably.

The rubber-like elastic body of chemical crosslinking can be for example butyl rubber or natural rubber.

The rubber-like homopolymer can be such as the polymer of the low alkene of low density polyethylene (LDPE) or propylene, preferred random polypropylene (APP) or polyisobutylene.

The optional tackifying resin that the uses hydrogenated tackifier resin preferably according to the present invention, and more preferably be selected from the polymer that comprises cyclopentadiene, bicyclopentadiene, α pinene or beta pinene and the group of copolymer.

When the elastomer of physical crosslinking is styrene butadiene styrene block copolymer (SBS) or styrene isoprene styrene block copolymer (SIS), binding agent suitably comprise 0～10% plasticizer (for example, citrofol BII, DOA).

Expansion hydrocolloid particle preferably comprises one or more and plants water solublity or water expansion hydrocolloid polymer or natural gum.

Suitable hydrocolloid comprises can be linearity or crosslinked synthetic polymer, such as the hydrocolloid from lactams or polyvinylpyrrolidone preparation.Other monomer that can be used for preparing synthetic hydrocolloid comprises acrylates, methacrylate and water solublity amide.

According to the present invention, other hydrocolloid polymer of natural appearance or synthetic preparation is available.These materials comprise polyvinyl alcohol, polyoxyalkylene and such as the cellulosic natural appearance of polysaccharide, natural gum and modification or the hydrocolloid of modification synthetically.

Representational polysaccharide comprises starch, glycogen, hemicellulose, pentosan, cellulose, pectin, chitosan and chitin.Representational natural gum comprises Arabic, Locust Bean, Guar, Agar, Carrageenan, Xanthan, Karaya, Alginates, Tragacanth, Ghatti and Furcelleran natural gum.Representational modified cellulose comprises methylcellulose, hydroxypropyl emthylcellulose, carboxymethyl cellulose and hydroxypropyl cellulose.

Preferred hydrocolloid comprises the polysaccharide such as starch, glycogen, hemicellulose, pentosan, gelatin, cellulose, modified cellulose, pectin, chitosan and chitin.The cellulose of modification comprises methylcellulose, hydroxypropyl emthylcellulose, carboxymethyl cellulose and hydroxypropyl cellulose.Most preferred hydrocolloid is water solublity or the expansion hydrocolloid that is selected from the group that comprises polyvinyl alcohol, powdery pectin, gelatin, methylcellulose, hydroxypropyl emthylcellulose, carboxymethyl cellulose, hydroxypropyl cellulose and their mixture.In a preferred embodiment, hydrocolloid is carboxymethyl cellulose (CMC).

Suitable expansion colloid is based on the pellet shapes particle of crosslinked acrylic acid polymer.In U.S. Patent No. 4867748, EP0122344 and U.S. Patent application No.2004065232, can find these examples of material.

Sometimes the skin that is used for adhesive bonding agent device can be humidity or or even wet.In these cases, common binding agent can not provide enough strong and permanent the adhering to of adhesive device.Useful in these cases adhesive specially is a hydrogel adhesive.These adhesive groups are in hydrophilic polymer and make it possible on the skin contact surface completely at binding agent the steadily extender of intake water.There is this widely hydrophile adhesive mass of composition range.Having high-load is main representative in this binding agent group by the hydrophilic polypropylene acid esters of the neutral acidic group of part randomly.These binding agents can be inherent binding agents, perhaps can be configured to the binder performance of hope under drying condition with viscosifier and extender.Because the picked-up of water converts binding agent to more be added with plasticity state, therefore, when obtaining moisture, viscosity will increase greatly according to prescription.Substituting adhesive group is in the polymer such as polyvinylpyrrolidone, polyvinyl alcohol, poly(ethylene oxide) etc.Amphiphilic polymers maybe can be added improving the viscosity of binding agent by the crosslinked polymer of group polymeric chemical, and general preferred extender such as Polyethylene Glycol, polypropylene glycol and glycerol.

Adhesive ingredients based on polydimethylsiloxane (PDMS) was familiar with by people from the seventies in 19th century.Recently, the contact adhesive based on PDMS of new subclass is that soft silicone adhesive agent is developed.Soft silicone adhesive agent (SSA) is based on the two-part not dissolved adhesive of crosslinked silicone elastomer structure.Crosslinked is to have the polydimethylsiloxane of vinyl and the result of the additive reaction between the hydrogen functional siloxane.Curing reaction also can at room temperature be taken place by platinum complex catalysis, perhaps can be accelerated the feasible by-product that do not form under high temperature (80 ℃～145 ℃).These binding agents are characterised in that softer and meet the surface texture of skin, realize the moistening of skin thus rapidly.Because the viscosity composition is minimum, so material is mobile, and only occurs less energy dissipation when applying rock deformation pressure.The result peels off rapidly, and this peeling off under lower peeling force or shearing force taken place, and this may be favourable for certain situation.

Owing to can clean and can be applied to again on the skin with tap water based on the contact adhesive of PDMS, therefore, except being the excellent surgical appliance adhesive, they also have the performance that can re-use.

The contact adhesive that is used to make binding agent body of the present invention also can be the PDMS gel that often is described to viscogel.The example of these commercial system is the Dow Corning 7-9800 A﹠amp from Dow CorningHealthCare US; B or from Wacker-ChemieGmbH, Burghausen, the SilGel 612 of Germany and, Carpinteria, the MED-6340 of USA from NuSil Technology.

Above-mentioned contact adhesive can be used with the non-foam type or with foam type.When bubble in manufacture process was introduced in the contact adhesive, lightweight cell structure was manufactured.This contact adhesive is more soft than non-foam type.(referring to U.S. Patent No. 6326524 and U.S. Patent application No.2004065232).

Usually, binding agent body of the present invention has elasticity, viscosity, moisture transmission and/or the absorbent properties of hope and higher comfortableness and flexibility.Even flexibility provides the curvature that can meet body part also to keep the synthetic of its bond properties simultaneously under mobile condition.Higher initial viscosity under the room temperature is convenient to applying of adhesive device.

Binding agent of the present invention has one or more cover layer of any character, preferred cover layer only on upper surface, to prevent bonding for linen, clothes and other environment.

As cladding material, preferably use film or the braiding or the non-braid of thermoplastic polymer film form.Cover layer is preferably made by elastomeric material.Cover layer suitably can transmit moisture, and can for example make these polymer such as polyethylene for example by any lamination of polymer and polymer, the TPO of polypropylene or polybutene, polyamide such as nylon, polyurethane, polyvinyl acetate, polrvinyl chloride, the fluorinated polyethylene chemical compound, polyvinylidene chloride, polyvinyl alcohol, ethylene vinyl acetate (ethylene vinyl acetate), cellulose acetate or other thermoplasticity polysaccharide, polyether block amide such as PEBAX, block copolymer such as styrene isoprene styrene block copolymer (SIS) or salts of acrylic acid-ethylene block copolymer, polyester such as polyethylene terephthalate (PET) or derivatives thereof.Cover layer can suitably be thin froth bed of being made by polyurethane, polyethylene or polyvinyl acetate etc.

The microelectronic component and the binding agent body of integrated/embedding that cover layer or film are protected are avoided environmental effect.

In a certain embodiments of the present invention, antenna can be directly printed onto on the cover layer by conductive ink or type metal.

Before being applied on the skin, in order just to guarantee to keep the performance of binding agent and in order to make adhesive surface be spread out before use, protectiveness discharges the contact skin side that lining covers the contact adhesive body.Discharge lining suitably for silication or fluoridize the release lining, such as silication or fluoridize kraft paper, polyethylene, polypropylene or polyethylene terephthalate film.Suitably, discharging lining is the siliconized polyethylene film, such as the medium density polyethylene from the Huhtamaki of company.

Microelectronics system comprises a large amount of parts, and these parts can be assembled in the unit that randomly encapsulates, and this unit is added in the adhesive device of the present invention.The parts of microelectronics sensing system also can be the one randomly assemblies of the parts of encapsulation that is arranged in the diverse location of adhesive device.This embodiment of the present invention comprise that each all single parts that adhesive device makes microelectronic component are arranged in the situation of diverse location and parts one or more be positioned at the situation of the position different with other position component that is positioned at same position.

When the parts of microelectronic component were arranged in the diverse location of adhesive device, adhesive device also had been integrated into the machinery that has necessity between the intravital parts of binding agent or is being electrically connected.

Therefore, according to one embodiment of present invention, whole microelectronics system is integrated in the binding agent body, and is covered fully by the binding agent body on all each limits.

According to another embodiment of the present invention, whole microelectronics system is contained in and is arranged in the face of in the groove in the upper surface of tectal binding agent body.

According to another embodiment of the present invention, whole microelectronics system is contained in the groove in the binding agent basal surface that is arranged on the binding agent body.In another embodiment of the present invention, microelectronics system is contained in the through hole in the binding agent body and from all arriving in the face of tectal upper surface and from the binding agent basal surface.

In substituting embodiment of the present invention, one or more parts of microelectronics system are integrated in the binding agent body, and covered by the binding agent body on all each limits, and, other parts of microelectronics system are positioned at other position of binding agent body, and the parts of microelectronics sensing system have necessary machinery mutually and are electrically connected.

According to the abovementioned embodiments of the present invention, one or more parts of microelectronics system can be integrated in the binding agent body and be covered by the binding agent body on all each limits, and the remainder of microelectronics system is contained in and is arranged in the face of in one or more groove (suitably being a groove) in the upper surface of tectal binding agent body.

Scheme as an alternative, one or more parts of microelectronics system are integrated in the binding agent body and are covered by the binding agent body on all each limits, and the remainder of microelectronics system is contained in one or more groove (suitably being a groove) in the binding agent basal surface that is arranged on the binding agent body.

In another alternate embodiment, one or more parts of microelectronics system are integrated in the binding agent body and by the binding agent body and cover, and the remainder of microelectronics system is contained in one or more through hole (suitably being a through hole) in the binding agent body, and from all arriving in the face of tectal upper surface and binding agent basal surface.

In another alternate embodiment, one or more parts of microelectronics system are integrated in the binding agent body and by the binding agent body and cover, simultaneously, other parts of microelectronics system are contained in one or more through hole (suitably being a through hole) in the binding agent body, and all can arrive from facing tectal upper surface and binding agent basal surface, and, the remainder of microelectronics system be contained in be arranged on the binding agent body go up and/or basal surface in one or more groove (suitably being a groove) in.

In another alternate embodiment, one or more parts of microelectronics system are contained in one or more through hole (suitably being a through hole) in the binding agent body, and all can arrive from facing tectal upper surface or binding agent basal surface, and, the remainder of microelectronics system be contained in be arranged on the binding agent body go up and/or basal surface in one or more groove (suitably being a groove) in.

In another suitable embodiment, one or more parts of microelectronics system are contained in one or more groove in the upper surface of binding agent body (suitably in a groove), and the remainder of microelectronics system is contained in one or more groove (suitably being a groove) in the basal surface of binding agent body.

Under microelectronics system or its parts were placed in situation in the upper surface of binding agent body, they were suitably followed profile and form with upper surface, perhaps are shaped as the upper surface that cooperates the binding agent body.Can realize this point by suitable component packages.

As mentioned above, a plurality of groups of the single parts of each of microelectronics system, each single parts or all parts can be packed before they are embedded into the binding agent body.When wishing that guard block is avoided environmental effect and/or protected environment to avoid the supplementary protection of component affects, for example, when in being present in the binding agent body or in manufacture process, causing being integrated in the binding agent body, select encapsulation.The parts of the encapsulation of microelectronics system interconnect by the electric and/or mechanical connection of necessity.

In some cases, because dampness and/or exudate in the binding agent will cause corrosion, therefore claimed microelectronics system or its parts are avoided its influence, and perhaps the reason for other need shield external action.In these cases, microelectronics system or its parts are packed.

A large amount of encapsulation technologies is known, and comprises coating, hot melt encapsulation, ceramic package and glass-encapsulated.Other method that is used to encapsulate electric component is well known in the art.

Microelectronics system or its parts suitably are encapsulated in polymeric film, polymer foil or the polymer coating, perhaps, microelectronics system or its parts be embossed in the polymeric material be packaged into glass or ceramic material in.

The encapsulation of being undertaken by coating generally comprises the material coating member of using such as epoxy resin, PDMS (silicone), acrylates, polyurethane or UV hardening resin.

Because silicone surface is released from the binding agent of binding agent body easily, therefore, when microelectronic component will be placed in through hole in the binding agent body or the groove, perhaps under hope makes the situation of the microelectronic component of removing or change encapsulation easily, preferred especially such as the encapsulation in the silicone of PDMS.Other material that can discharge from binding agent at an easy rate also can be used for encapsulation.

The hot melt encapsulation generally comprises by injection molding and add microelectronics system or its parts in thermoplastic.The thermoplastic that uses can be selected from styrene block copolymer, polyurethane, ABS (acrylonitrile-butadiene-styrene copolymer), SAN (SAN), polrvinyl chloride, PDMS, POM (polyoxymethylenes), polystyrene, polyester, polyacrylate, polyolefin, for example polyethylene or polypropylene.

The parts of microelectronics system need interconnection.Each system can comprise need be mechanically or assembled one or more discrete parts on the electricity.Can set up machinery or electricity connects by PCB (printed circuit board (PCB)), springlock, thin flexible PCB, glue etc.

In an above-mentioned embodiment, all parts of microelectronics sensing system all are integrated in the binding agent body in the mill, this means that the adhesive device with microelectronics system has disposable character.

Also can be fabricated by this way according to adhesive device of the present invention, that is, the parts of microelectronics system can be replaced at the life period of adhesive device, perhaps can be reused in new adhesive device.

Some parts of microelectronics system are integrated in the binding agent body in the mill, and remaining parts after, be close to be attached on the skin before or be attached on the skin after be applied on the adhesive device of the present invention.The parts that are applied to after the manufacturing of binding agent body on the binding agent body generally are interchangeable or reusable.

The parts that can be replaced for example are the energy, for example battery.

In certain embodiments of the invention, whole microelectronics system is interchangeable or reusable, and can be close to adhere to before or be applied on the skin after be applied on the adhesive device.

Suitably, but interchangeable part or reuse parts are packed as described above and form to cooperate groove in the binding agent body or the packaging part in hole.

But under the situation of interchangeable or reuse parts, they must have in the use of some types the perfect adherence means to the binding agent body.These attachment means can be provided by binding agent, for example, are provided by the contact adhesive that is present in the binding agent body in the indenture, and this indenture is the cavity in the hole in the binding agent body.

In this case, the preferred package material is the material that is adhered to not too doughtily on the binding agent of binding agent body, sees above.

Scheme as an alternative, but the packaging part of the interchangeable or reuse parts of encapsulation is attached on the binding agent body by the mechanical couplings to the binding agent body.But the packaging part of the above-mentioned encapsulation that comprises replaceable or reuse parts can be allocated in the binding agent body by snap-lock mechanism thus.

Encapsulation is as the shell of microelectronics system or its parts, and suitably formed by the polymeric material of injection molding, but can be any material and any structure haply.

The packaging part of the microelectronic component of encapsulation can have suitable shape arbitrarily, suitably is the groove in the cooperation binding agent body or the 3D shape of through hole.In one embodiment, the electronic unit of encapsulation will have the bar-shaped capsular shape of nose circle.

As mentioned above, the present invention is used to obtain the intrusive mood and the non-intrusion type technology of physiological data.Under the situation of non-intrusion measurement, one or more metal electrode can be used to the skin contact.But any conductive material all can be used to the skin contact, such as the polymer of conduction, the hydrogel and the electrolyte of conduction.Under the situation that intrusive mood is measured, conventional pin or microscopic needle can be used.Current this intrusive mood technology has been the known technology that for example is used to measure oxygen or blood glucose.

By the parts that combination describes in detail, the microelectronics sensing system of all categories all can be designed and join in the adhesive device of the present invention.The example that is suitable for embedding the system in the adhesive device is the system that is suitable for measuring bio-sensor signal, EKG, EMG, EEG, blood glucose, pulse, blood pressure, pH value and oxygen.

Add the following parts of the general needs of microelectronics system in the adhesive device of the present invention: communication component, CPU (CPU), power supply, memory unit, transducer element, interconnection, and randomly comprise actuator component.

CPU (CPU) controls the parts of microelectronics system and communicates by letter with them.CPU handle application software, decision data (handling), A/D conversion, DSP (Digital Signal Processing), Route Selection such as data signal, regularly, the execution of electrical management, sleep mode, interruption.

CPU is other parts of control of microelectronics system and the parts that carry out suitable data analysis.Usually, the speed and the data analysis that need are many more, and the electric power that then needs is many more.Therefore, in order to save electric power, sleep mode often is used.In some time, if perhaps certain part incident takes place (being triggered by the low-down watchdog subsystem of power), CPU is waken up so, carries out necessary calculating, communicates by letter with relevant parts and returns park mode.According to the present invention, can use as required from very basic CPU to powerful microcontroller.

Communication component control is sent to and is communicated by letter from all of microelectronics system.Suitably, microelectronics system is the system that makes it possible to and leave the acceptor unit radio communication of a certain distance of adhesive device.But, the invention is not restricted to radio communication such as the RF radio communication.Other means of communication can be audio frequency or optical communication means.Parts comprise the necessary electronic unit that is used to realize this radio communication, also comprise antenna and necessary hardware and software.

Antenna can be taked different shapes and form according to frequency, power and signal form.Some antennas are used for uploading carry information several centimetres scope, and the scope of other antennas is several meters.The example of antenna is: around the coil of little FERRITE CORE (for example, diameter is less than 4mm), have the flatwise coil (diameter is generally 10mm or bigger) of multi-turn, such as the list and the two-conductor line antenna for radio astronomy of one pole or dipole antenna be integrated into antenna in the binding agent.

Only having the large diameter antenna of several circles and for example 50mm can be stacked and be integrated in the binding agent body or be printed to or be placed directly on the cover layer of adhesive device.Antenna is generally by making such as the metal of copper or aluminum, but also can be conductive ink.

Power supply comprises the power adjustments electronic unit, recharge electronic unit and be generally the energy of inner or interchangeable battery.But other the means that obtain electric power for microelectronics system can be suggested, such as kinetic energy conversion, fuel cell, isotope radiation, solaode, perhaps by radio frequency (RF) link.And antenna can be used to energy is loaded in the microelectronics system.

Preferably, power supply is a battery, and can maybe can be for chargeable for disposable use.

The data that the operation that memory unit is used for storing the systems soft ware of embedding and/or be stored in device is obtained.Memory unit can be the part of CPU, the interchangeable memorizer such as FLASH RAM that himself parts maybe can be removed and change.

Transducer element is the parts that are designed to energy is become from a kind of formal transformation another kind of form.Transducer is generally but is not limited to the pick off or the sensing part of microelectronics system.Transducer for example can be changed the physics input thus, and transducer will be generally but will this power conversion do not become the electrical form that will be explained by CPU etc.

The example of the convertible physics input of transducer is acceleration, chemicals/gas, flow, humidity, inertia, electric capacity, conductivity, conductivity, electric current, impedance, inductance, pH value, resistance, resistivity, voltage, light detection, light, magnetic, pressure, angle, linear position, speed, temperature, sound and mechanical force.

The practical representative of transducer is a detection part.Detection part generally is selected from electrode (polarity, bipolar), pressure transducer, the pin with electrode, accelerometer, photodetector, mike, ion-sensitive field effect transistor (ISFET), NTC (negative temperature coefficient) resistor, band-gap detector, ionic membrane, enzyme reactor or capacitor.

In one embodiment of the invention, transducer comprises and is used for the detector that non-intruding detects, such as electrode.

In another embodiment of the present invention, transducer comprises the intrusive mood detector, such as the pin that comprises electrode.

Actuator is opposite with transducer.It is in the mode substantially the same with transducer but with opposite order energy is become another kind of form from a kind of formal transformation.Usually it converts the electrical signal to physical signalling.The practical representative of actuator is for example electrode (for example being used for nervous system or nerve stimulation), pump, entry needle, light emitting diode (LED) or another light source, speaker, current feedback circuit or chemical analyzer.By the CPU decision, to activate the alarm in the microelectronics system, such as speaker or LED, perhaps the pilot cell electric weight is low in some incident for the possible purposes of actuator.

Therefore, actuator can be used as the parts that the input to obtaining from the transducer element such as alarm (visual and can listen), syringe pump, valve etc. in the system is made a response.It can be the actuator that once uses, repeatedly uses or use continuously.

Many sensing systems only are the intelligence channels that transmits about the information of mammiferous physical qualification, and do not need actuator in this case.

Microelectronics system will may only need on some the meaning in the parts by built modular at the device that is used for given application.Some application will utilize parts seldom, and some application can be used all parts.These parts can be allocated into identical physics ASIC (special IC), electrical system or subsystem, and such as, but not limited to PCB (printed circuit board (PCB)), flexible PCB, thick film, thin film or ceramic technology, perhaps, system or its parts can be encapsulated individually.

RFID (RF identification) label can obtain on market on various sizes, scope and function.When the RFID reader applied suitable field (for example, induction field), basic RFID label returned a bit sequence.This sequence was programmed before using.The RFID scope for from 1cm to be used for passive label (not comprising power supply) about 2 meters to be used for active label (comprising power supply) above 100 meters.Available more complicated RFID label has the memory unit that can read or store data.

The RFID label can be used as independent parts or is added in the binding agent body with other microelectronic component combination.Can under the condition of the complexity of not obvious increase system and price, make that at an easy rate complicated microelectronics system comprises various forms of RFID labels.In the system of complexity, label can be used as simple tracking unit with the identification product, such as shelf-life, the life-span, but it also can be used to the identification to other system in the sensor network.

For scheme independently, the RFID label comprises RF chip and coil basically.The RFID label of suitable form be packaged into RFID label in the glass shell, be packaged into RFID label in plastics/epoxy resin (being generally the pill shape), have be layered in 2 between the polyimide layer the coil and the plane RFID label of RF chip or under the situation of protection/encapsulation, have without any other be printed on the binding agent body or the number of turns in the binding agent body seldom large-scale coil antenna and have the plane RFID label of the RF chip that interconnects with antenna.

These systems can be fully integrated in in the binding agent body in the manufacturing of binding agent body.

Above-mentioned plane RFID label can be sandwiched in manufacture process between the 2 lamination sensitive adhesives.(1mm * 1mm) and coil are comparatively soft, therefore do not need inflexible encapsulation because the RF chip is very little.The RFID label of glass-encapsulated has extraordinary chemical resistance and less size does not have discomfort with assurance.The RFID label that is encapsulated in plastics or the epoxy resin can be more complicated design, and all can be added in the manufacture process of binding agent body of the present invention or after making.

The RFID label of encapsulation is the parts that can be re-used in one or more binding agent body.The RFID label of encapsulation is transferred to another binding agent body from a binding agent body, and is re-used again and again thus, and is very good for the individual particular data of storage.

The general microelectronics system that embeds comprises certain type pick off in its system, but this point is not all to be necessary for all application.

Adhesive device of the present invention also can be a part that is placed on the network of the binding agent sensor component on the diverse location of body.The complexity of these single adhesive devices can be according to position and sensing performance from less pedestal sensor system change to more complicated system.Some adhesive devices of network have the function of simplification, be called RFD (simplification functional device), and other device are FFD (global function devices).

The FFD device can work in any topologies, and is the coordinator of network, perhaps it can be can with the coordinator of any other device dialogue.The RFD device is limited to Star topology, and it can not become network coordinator, and it is only with network coordinator dialogue and have very simple implementation.

FFD can be as communication network hub, gateway or router in the body Local Area Network (BAN) and handle the dedicated network coordinator of communicating by letter with external unit.Communication network hub or gateway can have bigger memory capacity, and store the data from sensor network, and, these data of wireless transmission when near external unit or under other suitable condition.

Owing to do not need skin contact or actuator, so these hub are integrated in the binding agent body at an easy rate, and can be placed on the key position in the body.Because the general big and position of hub is more near the body center, thus the microelectronic network hub can be fully integrated in in the binding agent body be very favourable because can reduce discomfort and observability like this.

Under artificial situation about monitoring, microelectronics system can comprise the GPS technology.This system data record is used for the position data of post analysis or can transmits (for example, for example passing through the mobile network) position.This system in the binding agent can be positioned on the body can not be approaching the position on.

Add the intravital GPS device of binding agent of the present invention and itself need not be individual devices, and can add in addition on the adhesive device that comprises other microelectronics system, the system that makes can transmit GPS in some incident such as alarm.

Therefore, adhesive device also can comprise the microelectronics system that the physics contact must not arranged between detector and mammalian skin.The system that needn't use the transducer with detecting element is hub, network coordinator, gateway and GPS (global positioning system).

Therefore, the microelectronics system that can be used for adhesive device of the present invention can be:

The RFID label that comprises the glass-encapsulated of communication component and CPU.The parts of glass-encapsulated can suitably be embedded in as shown in Figure 1 the adhesive device.

Comprise the epoxy resin of communication component and CPU or the RFID label of Plastic Package.The parts of epoxy resin/Plastic Package can for example be embedded in the binding agent body shown in Fig. 1 or 2.

Be layered in two coil antennas between the aramid layer and the RFID label that comprises communication component and CPU.This system can be embedded in the binding agent body shown in Figure 1A.

Number of turns coil seldom and the passive read/write RFID label of non-encapsulation that comprises storage and communication component and CPU.This system can be embedded in the binding agent body shown in Figure 1A.

Be encapsulated in the passive read/write RFID label that comprises storage and communication component and CPU in epoxy resin or the plastic pellets.This system can be embedded in the binding agent body shown in Figure 2.

The active read/write RFID label in epoxy resin/plastic pellets of being encapsulated in that comprises storage and communication component, CPU and battery.This system can be embedded in the binding agent body shown in Figure 1.

The RFID label of the above-mentioned type is commercial available.

Microelectronics system also can be to comprise to be encapsulated in to act on the gateway that transmits the dedicated network coordinator of data to central location (CU) comprising storage and communication component, CPU and battery and using in the plastics.This microelectronics system can for example be embedded in as shown in Figure 1 the binding agent body.

Microelectronics system also can be randomly be encapsulated in the plastics comprise storage and communication component, CPU, battery, GPS, be used for the data record gps data real-time clock wireless synchronizationization parts system or randomly be encapsulated in the plastics comprise storage and communication component, CPU, battery, GPS, be used for the data record gps data real-time clock wireless synchronizationization parts, be used for data record and transmit the mobile network's of data and position system to mobile phone.These systems also can be embedded in the binding agent body shown in Figure 1.

Also can be used to pass skin barrier (to pass the mode of skin) according to adhesive device of the present invention and apply the application that electrical power is communicated by letter with electric data to the health implant by wireless means.In these cases, for the people who carries device, bother or bother with minimum that to be fixed on the skin surface really adhesive device on the point of contact for a long time be crucial.

The wireless power transmission of passing skin and the exemplary of EDC are the nerve stimulators in the people's of the muscle that is used for uncontrollable lower limb bottom (drop foot syndrome) implantation.Have direct the contact in the implanted lower limb of drop foot stimulator and with the nerve of control related muscles.Implant is generally by coil in the lower limb or antenna with nearby be powered wirelessly at external coil or the electromagnetic coupled between the antenna on the skin surface.

Coil or antenna are connected with the required electric power and the electronic unit of control signal are provided.The timing that is used for analogue signal is generally by on people's the heel or the control of the pressure sensitive switch of its shoes.It usually is wireless transmitting signal from the simulator of switch on the skin that is positioned at lower limb.

By using the adhesive device of explanation in the present invention, these drop foot simulators can improved greatly.Because the outside of simulator highly stablely is fixed on the skin surface for a long time with minimum trouble, so it makes it possible to provide reliable power and data to transmit.And it can also make it possible to be fixed in for a long time better the switch on the foot.

Therefore, in one embodiment, microelectronics system can be used for nerve stimulation and comprises storage and communication component, CPU, power supply, be used for transmitting to the implant that is used for nerve stimulation the transducer of data and power.This system can suitably be embedded in the binding agent body shown in Figure 3.

In another embodiment, the microelectronics system of embedding can be used for surface electromyography and traces (sEMG) or intrusive mood electromyogram graphy.In both cases, transducer all is simple relatively 2～3 electrode devices.The signal of measuring is the DC voltage that is produced by muscle or muscle groups.In order to understand this signal, it must be analyzed or be stored for analysis in the future by microelectronics system.

The data of collecting are when relevant, be transmitted to central location (CU) when some incident of generation or with some interval.CU is suitably for having the portable hardware of wireless receiving/transmitting capacity, such as, but not limited to PDA (personal digital assistant), mobile phone or other specialized hardware.

Transducer suitably is designed to overcome or ignore the time difference of the sheet resistance of skin.The resistance of exsiccant skin is for example 500 kilo-ohms, and wet skin can be low to moderate 500 Europe.Can overcome this problem greater than the high-impedance amplifier of 500 megaohms by utilizing impedance.Transducer can be designed to activate other system unit on the first skin contact, guarantees the longer life-span thus.

CPU (CPU) is generally handled the amplification (x30～x1000) for example of transducer signal by differential measuring amplifier under the situation that suppresses the filtering common mode of analog or digital (two undesirable signal/noises that electrode often has).CPU control simulation signal is to the conversion of digital signal.Be used to realize data judging such as the signal analysis of rms (root-mean-square), FFT (fast fourier transform) with the digital filter of combination of software some incident.

Therefore and CPU can use intervalometer or park mode, only measures in some incident or only in the part of per second or carry out in other time period, saves electric power thus.

Microelectronics system also comprises the memorizer that is used for storing software and is used in only wireless some data of transmission of data acquisition or does not transmit the memorizer of the EMG data storage under the data conditions.These data can be transmitted afterwards.

Because CPU is because the power of inertia in the cycle descend to guarantee the long life-span, so power supply is considered disposable battery, and perhaps, it is considered rechargeable battery.Rechargeable battery is recharged by microelectronics system is placed in the charging bracket by the RF link or when system does not use.Use a battery or when being full of electricity, can be arranged the life-span in several weeks after activation.

Data are by guaranteeing do not have the agreement of corrupted data or method to be transmitted to central location.And after activation, in order to confirm the mode of operation of system, battery life condition and/or data burst are transmitted.Once request, system just will transmit the storage data.

Be used for electromyographic microelectronics system and can randomly be included in the actuator that activates the alarm in the microelectronics system by some incident of CPU decision, this alarm such as speaker or LED.The incident that activates actuator also can be that battery electric quantity is too low.

According to this embodiment of the invention, various parts mechanically or on electricity are interconnected, and can be packaged in the module.But various parts also can be integrated in the binding agent body individually.These parts can be but be not limited to battery, antenna and actuator.

Various parts also can be installed on PCB (printed circuit board (PCB)) or the flexible PCB and be coated with protective layer and directly be embedded in the binding agent.

Therefore, in certain embodiments of the invention, microelectronics system is to be used for electromyographic system and to comprise transducer (2～3 electrode and measuring amplifier), CPU (microcontroller, for example, ATMEGA 128L), power supply (for example, battery), communication (for example, to CU) and memory unit and actuator (LED).This system can be embedded in the binding agent body shown in Fig. 3 and Fig. 3 A.

In motion or adaptive training, the use that can be combined of different or several identical microelectronics systems.And several transducers can be used in the identical adhesive device.

Therefore the adaptability sensor network can comprise:

Adhesive device with musculation (sEMG) pick off, one of health both sides (arm, lower limb an etc.) side.Microelectronics system can be designed to determine the tired of muscle by this way and indicate muscle growth when to be best or when to take exercise and be no advantage.The frequency analysis of sEMG signal can be used for realizing the measurement output wished.Usually, adhesive device is placed on the muscle groups of being taken exercise energetically.

Two or three adhesive devices of the present invention that comprise heart rate (ECG) sensing system of monitor cardiac activity and cardiac pulses shape.

The adhesive device of microelectronics system that comprises the level of the kenotoxin that is used for determining muscle.

Be used for storage signal and send it to central location or the sensor network hub/gateway that is positioned at the body center of direct and adaptability hardware communications.

By the replacing or the charging of battery, can be re-used in the stage at another adaptability at the microelectronics system that an adaptability used in the stage.

Therefore, can suitably be used to measure with disease, health care supervision, rehabilitation, sports medicine according to adhesive device of the present invention or generally be monitored relevant physiological condition.Usually, application for example will be used for patient on the line when suffering from heart weakness, epilepsy, fever and hyperpyrexia spasm, diabetes, apoplexy, arteriosclerosis and muscular dystrophy.Application can with the optimization Drug therapy, be used for the registration of disease or the general supervision that is used to report to the police relevant.Other application will be used for rehabilitation about the supervision of physical work, muscle strength, vital capacity, perhaps be used for the work of determining and repetition, acceleration, heart rate, muscle stress and intensity, orientation etc. in sports medical science.Other application will be used for the object or the mammal of monitor motion.Noxious patient or individuality such as the old people who suffers from dementia will be typical for these application.

Adhesive device according to the present invention will be preferably wireless, because this is obtaining level and smooth as far as possible device shape and surperficial and realize that still aspect the protection of microelectronics system be significant.But in some cases, it may be important can making device interconnection by lead.When microelectronics system is divided into two parts that are present in respectively in the adhesive device that the present invention limits, this especially a kind of option.

Microelectronics sensing system or its parts can be in the manufacture processes of binding agent body or after the manufacturing of binding agent body, for example be close to adhesive device to being added in the binding agent body after the applying of skin before the applying of skin or at adhesive device.

As mentioned above, a plurality of parts such as the adhesive device of a plurality of parts of whole microelectronics system can interchangeablely maybe can re-use.

Therefore, in one aspect of the invention, the invention discloses the device that comprises adhesive element and source element at least, described device is suitable for the electronic circuit such as microelectronics system is attached on the surface and to described power electronics, wherein, at least one in the device element may be releasably attached on the electronic circuit; Source element can be electrically connected with electronic circuit; And binding agent has at least and is used to be adhered to lip-deep first area.

Described this device can be attached to electronic circuit such as on the surface of mammalian skin and to its power supply for specific purpose.When specific purpose was implemented, device and electronic circuit were removed from the surface, and device and circuit separate and processedly fall.Therefore, compare with electronic circuit that the element of comparatively cheap formation device is processed to be fallen, and electronic circuit can be with being used for that electronic circuit is attached to that the surface is gone up and the new unit according to the present invention of circuit supply being re-used.Advantageously, owing to re-used with comparing more parts in the past, so this allows to reduce cost greatly, also protects environment simultaneously.

" can adhere to releasedly " and " can be connected releasedly " by term, should be appreciated that device and electronic circuit can temporarily be adhered to so that separate the mode of their risk minimization unintentionally.But device and electronic circuit should be attached so that can separate their mode when wishing.

And, " can be electrically connected " by term, should be appreciated that source element and circuit and be configured so that can between them, transmit the mode of electric current.Can be for example by using the standard electric contact that generally becomes to finish that this is a kind of by gold-plated or silver plated copper, perhaps be electrically connected and can be set up with power supply faradic wireless mode in circuit.

Usually, circuit is the microelectronics system that is formed by a large amount of microelectronics digital unit that connects with suitable wiring and/or analog component.Parts generally are configured on the printed circuit board (PCB), and on this printed circuit board (PCB), suitable trace and track be etched, electroplate or be set up in other mode.Digital unit can for example be microprocessor, such as the memory component of RAM piece, and analog component can for example be arranged on resistor and capacitor on the printed panel.

In one embodiment, source element is attached on the adhesive element, and adhesive element has the second area that is used to be adhered on the electronic circuit.

By source element and adhesive element are adhered to mutually, only there is a physical piece to be provided, thereby avoids the user must be careful source element and adhesive element simultaneously and applying spended time on these two kinds of elements.Therefore, user friendly less and discrete device is provided.And electronic circuit can be adhered on the adhesive element, is used to improve operability, because will only must handle a unit when electronic circuit being applied to surperficial going up.

Advantageously, first peeling force between second area and the electronic circuit is littler than second peeling force between source element and the adhesive element.This makes it possible to separate microelectronic circuit from device at an easy rate after use.

In order to guarantee that further source element and adhesive element are not separated from each other, source element can be contained in the adhesive element to small part.

By " comprising ", should be appreciated that power supply can be embedded in the binding agent wholly or in part.When being embedded fully, only there is electric contact to pass binding agent and exposes, perhaps Bao flexible wire is embedded into from power supply and extends in the binding agent of outer surface of binding agent, and it can contact with electronic circuit at the outer surface of binding agent.And in the meaning that term " comprises ", power supply also can be partially submerged in the binding agent, passes binding agent thus and exposes bigger part.This allows between the electronic circuit and power supply bigger contact surface to be arranged when being attached on the binding agent safely.

In order to protect the different piece of electronic circuit, generally for example it encapsulates it by coating in silicone or hot-melt polymer.Encapsulation can for example form the shell of at least a portion that comprises electronic circuit.In one embodiment, shell can partly be formed by near-end housing parts and distal housing.Device is suitable for being connected with described shell releasedly.

A large amount of encapsulation technologies is known, and comprises coating, two parts polymer, hot-melt polymer encapsulation, ceramic package and glass-encapsulated.Other the method that is used to encapsulate electric component is known in the art.

Microelectronics system or its parts suitably are encapsulated in polymeric film, polymer foil or the polymer coating, and perhaps microelectronics system or its parts are embossed in the polymeric material, perhaps are packaged in glass or the ceramic material.

Because silicone surface is released from the binding agent of binding agent body easily, therefore, when microelectronic component will be placed in through hole in the binding agent body or the groove, perhaps make and remove easily or change under the situation of the microelectronic component that encapsulates in hope, preferred especially such as the encapsulation in the silicone of PDMS.Other material that can discharge from binding agent at an easy rate also can be used for encapsulation.

In order to remove adhesive element at an easy rate from shell after use, this material be made or be coated with to shell can advantageously by the material that allows shell to discharge at an easy rate.This material can for example be to be everlasting to be used to discharge the silicone of lining in the different adhesive application.

In another embodiment, at least one source element is suitable for being formed on the groove reception in the distal housing part.At least one electric contact is set in the distal housing, thereby provides electrical connection between source element and circuit.

By groove is set as mentioned above, can avoids source element displacement and lose thus and the electrically contacting of circuit.Groove also produces concordant assembly when power supply is placed in wherein, thereby makes it have level and smooth surface, and this surface will not resemble easy being booked the outstanding surface of power supply.

The electronic circuit that has many different application and be powered and be attached to lip-deep many types can use with device according to the present invention.Device can be processed after use but electronic circuit can be re-used.In one embodiment, device is suitable for being releasably connected on the electronic circuit as sensor circuit thus, and described sensor circuit will be attached on the mammiferous body surface that is generally skin.

By term " pick off " or " sensing ", should be appreciated that the parameter of the surrounding of electronic circuit is detected by sensor circuit.These parameters can comprise for example temperature, humidity, the signal of telecommunication, electric field, light, noise, bio signal and magnetic field.

Therefore, the invention still further relates to the sensor cluster that is suitable for being attached on the mammiferous body surface, this sensor cluster comprises: sensor circuit comprises a large amount of electric components; Be used at least one source element at least one power supply of electric component; Be used for sensor cluster is attached at least one adhesive element on the mammiferous body surface; And at least one in source element and the adhesive element is releasably connected on the sensor circuit.

Therefore, when the different element such as the device that comprises power supply and adhesive element was disposable and is re-used such as other element of electronic circuit, sensor cluster provided top disclosed advantage.

In an embodiment of sensor cluster, sensor circuit to small part is contained in the shell, and here, shell is partly formed by near-end housing parts and distal housing.Advantageously, sensor cluster can be provided at the first peeling force specific viscosity mixture between binding agent and the shell and the little place of second peeling force between the battery.This makes it possible at an easy rate from binding agent and source element separation sensor circuit.

Usually, sensor cluster will comprise at least one transducer on the proximal end face that is attached to proximal part.As mentioned above, proximal part is configured for protecting the shell of at least a portion of sensor circuit with distal portions.This transducer converts different physiological signals to the signal of telecommunication.These transducers can for example be potential determination, caliometric, conduction be that measure, chemical machinery or optical.

In order to prevent that the power supply accident from shifting out the electric contact with sensor circuit, can in the distal housing part, form groove, this groove is suitable for holding at least one power supply, and this at least one electric contact is set in the distal housing, thereby provides electrical connection between at least one power supply and electric component.For example when binding agent because during the surface of attached sensors assembly mobile and mobile, groove protects power supply to avoid the moving influence of outside thus.In addition, avoid the moving influence of outside by protecting power supply, the electrical connection between power supply and the microelectronic circuit is also protected to avoid disconnection.

In another aspect, the present invention relates to comprise adhesive element and source element and be used for that electronic circuit is attached to that the surface is gone up and to the use of the device of described power electronics, wherein, described electronic circuit is releasably connected on adhesive element and the source element.

Many pick offs are connected with surveillance by lead.The shortcoming of this system is, be connected because lead is attached on the pick off on the health and with surveillance, so patient can not move freely.Whenever patient wishes when mobile, he must be very carefully avoiding removing any in the lead that is attached on the pick off, and he must further pick up surveillance and carry it always.

And, preferably do not need the outside independent power supply that connects up such as battery.This independent source element that preferably uses with the present invention is well known in the art.

Usually, can be divided into can disposable one-shot battery and rechargeable secondary cell for battery.

Various types of one-shot batteries are manufactured based on the different combination of anode, negative electrode and electrolyte.The general chemicals of one-shot battery comprises the lithium in zinc-carbon, zinc chloride, alkaline manganese dioxide, silver oxide, zinc/air and the following combination: lithium/sulfur dioxide (Li-SO2), lithium/thionyl chloride (Li-SoCL2), lithium/manganese dioxide (Li-MnO2), lithium/carbon monofluoride (Li-(CF) n), lithium/copper oxide (Li-CuO) and lithium/iodine (Li-I2).

Secondary cell is chargeable, and generally based on NI-G (NiCd), nickel metal hydride (NiMH) or lithium-ion technology.Secondary cell has the active chemicals that has more that needs special operation and processing usually.

There are many battery sizes and battery case, comprise standard cylindrical battery, multi-unit battery, coin battery, bag shape battery and hull cell.

Standard cylindrical battery and multi-unit battery are familiar with by people from the average family apparatus of for example flash lamp and remote controller.This group comprises known size AA, D, C and 9V rectangle.

Coin or button cell are generally less, rounded and high several millimeters.This group is everlasting found in wrist-watch, sonifer and the memory backup.Because they are based on solid state cathode, so these systems are considered to as safe as a house.

Duracell, Panasonic, Sony and Energizer are some main manufacturers of standard and coin element cell.

Scheme uses bag shape shell that the battery of another type can be provided with the lithium polymer battery with solid electrolyte as an alternative.This provides bendable structure cheaply.Except rechargeable, this battery is characterised in that high energy density.Solid electrolyte allows the anti-leak battery that provides safer.Foil construction allows the battery design that provides extremely thin and light.

Bullith Batteries makes flexible battery based on this technology.

The battery of another type is based on the hull cell that solid-state lighium polymer chemicals prints on various substrates.They can be directly printed onto on plastics, thin metal foil or the paper, thereby obtain ultrafine flexible power supply.Battery can be manufactured with Any shape or size, but generally limited on energy storage and current capacity.Since they do not contain corrosive chemicals, can not be overheated, explode or cause electric shock, so these batteries are very safe.

The Powerpaper of Israel company is selling the product of based thin film technology.Other the company that makes such battery is Oak Ridge Micro Energy Inc. and InfinitePower Solutions.

In one embodiment, adhesive element forms the three-dimensional adhesive body as mentioned above, that is, adhesive element has sizable thickness, and is general than several times of the backing bed thickness that applies it.

The contact adhesive of making the three-dimensional adhesive body suitably is a moldable thermoplasticity or at chemically solidified contact adhesive, even this contact adhesive has flexible its bond properties that also keeps simultaneously of the curvature that makes adhesive device can meet body part under mobile condition.

Backing layer can further be used as cover layer, and backing/cover layer described here is set to for example prevent the bonding or dampness to linen, clothes as applying the substrate of binding agent and protecting binding agent to avoid external environment influence.

And the motor machine display system can be applied on the cover layer.This display system can allow the user will the power supply binding agent add on the microelectronics system before or the charging of test battery in use.

Simple battery indicator known in the art can be used thus.For example, comprising two contact electrodes can be used with the paper tinsel that is generally the conductive thermochromic inks of liquid crystal or leuco dye.

When for example using common coin battery, an electrode contacts with the anode of battery, and another electrode contacts with the negative electrode of battery.By pushing the vertical contact devices of battery, battery test circuit is closed and thermochromic inks will brighten, thus the pilot cell state.

As following detailed description the in detail, adhesive device of the present invention can be fabricated in many ways.The something in common of all structures is that three-dimensional geometrical structure provides good protection for microelectronic component, makes device have level and smooth as far as possible surface simultaneously.Especially, the shape at the edge of device need arouse attention, otherwise linen will be easy to cling them and cause rolling.Therefore, the periphery that has embedded the adhesive device of microelectronics system must be shaped as the thickness that has less than half of the thickness of the thick of device, and this thick generally is the core that comprises microelectronics system.

Fig. 1 represents the mould section according to the shape of the canonical representation of adhesive device of the present invention.CT is the maximum ga(u)ge of device, and PT is the thickness of the periphery of device.Device needn't be taked symmetric shape.

Fig. 2 has the frame of the part that is illustrated in the adhesive device shown in Fig. 3～12.As shown in Figure 2, electronic section 101 is embedded in binding agent 102 bodies with cover layer 103 and release liner 104.

In one embodiment of the invention, all electric components all are assembled in the unit, and this unit is embedded in the binding agent body and on all each limits and is all covered by contact adhesive, thereby makes it become disposable pad basically.As shown in Figure 3, the assembly of electronic section 101 is embedded in the binding agent body 102 with cover layer 103 and release liner 104.

The parts that Fig. 4 illustrates the microelectronics sensing system can be integrated in different positions in the binding agent body, and condition is to have required machinery or be electrically connected between parts.All parts are embedded fully in the binding agent body and on all each limits and are all covered by the contact adhesive of binding agent body.

Intravital integrated to throw away device for a cheap usefulness one be useful to all microelectronic components at binding agent.Because the short service time of adhesive device, so electronic unit needs seldom or need be such as the extra protection of encapsulation.Binding agent body itself is as the protection of microelectronic component.

Even all parts of microelectronics system are covered by the binding agent body on all each limits, several sensings are used (humidity, optics or chemistry/gas) and are remained possible.

The system that can be capped on the limit also can be RFID label, hub, network coordinator, gateway and other system that can collect, transmit and/or send data.These systems often need be used for start-up system such as certain activation of pressure contact or magnetic contact, to overcome for the bigger needs of comparing with activity cycle of shelf-lifeing.

Fig. 5 illustrates microelectronics system of the present invention and is embedded into/is applied to embodiment in the intravital groove of binding agent.Groove is positioned in the upper surface of binding agent body.Microelectronics system can be in the manufacturing of binding agent body, be close to adhesive device is embedded into/adheres to before or after being attached on the skin.According to this embodiment of the invention, microelectronics system can be re-used.

Fig. 6 represents microelectronics system like the system class with Fig. 5, and still, system comprises two parts in Fig. 6.Above a part be interchangeablely maybe can re-use, following part is embedded into the groove of binding agent from beginning.Top can for example be power supply.

Fig. 7 illustrates such an embodiment, that is, some parts of microelectronics system are embedded in the adhesive device in the mill and some parts are applied in the groove in the upper surface of binding agent body, promptly interchangeablely maybe can re-use.According to the present invention, one or more parts can be embedded in the binding agent body and one or more parts can be present in the lip-deep groove of binding agent body.The machinery of the necessity between the parts or be electrically connected and also be embedded in the binding agent body.Though this figure only illustrates one,, in the upper surface of binding agent body, can there be two or more grooves, and can exist and be integrated into intravital two or more parts of binding agent.

Interchangeable part in the groove can be locked in groove by the binder performance of the contact adhesive in the groove.In replacement scheme, the microelectronic component in the groove be encapsulated in be designed to allocate into be present in the groove such as in the coupling or plug in the lock of springlock.

Fig. 8 illustrates the embodiment in the groove in the binding agent bottom surface that microelectronics system of the present invention was embedded into/was applied to the binding agent body.Microelectronics system is in the manufacturing of adhesive device or be close to and be embedded into/apply before being attached to adhesive device on the skin.This system generally is used under the situation of some in requiring the parts of system with the mode of non-invasive mode or intrusion and contact skin.

Fig. 9 illustrates a kind of like this embodiment, that is, some parts of microelectronics system are integrated in the adhesive device in the mill and some parts are applied in the groove in the lower surface of binding agent body, promptly are interchangeable.According to the present invention, one or more parts can be integrated in the binding agent body and one or more parts can be present in the lip-deep groove of binding agent body.The machinery of the necessity between the parts or be electrically connected and also be integrated in the binding agent body.Though this figure only illustrates one,, in the basal surface of binding agent body, can there be two or more grooves, and can exist in different positions and be integrated into intravital two or more parts of binding agent.

Figure 10 illustrates a kind of like this embodiment, that is, some parts of microelectronics sensing system are integrated in the adhesive device in the mill and some parts are applied in the groove in the basal surface of binding agent body, promptly interchangeablely maybe can re-use.According to the present invention, one or more parts can are integrated in the binding agent body individually and one or more parts can be present in the lip-deep groove of binding agent body.Though this figure only illustrates one,, in the basal surface of binding agent body, can there be two or more grooves.

Utilize contact skin or skin penetration (for example, electrode and pin) and the remainder (battery, antenna, electrode, A/D converter, amplifier) of microelectronics system can be embedded under the intravital situation of binding agent at transducer or actuator, this structure is suitable.This structure also has several manufacturing advantages.

Therefore, Fig. 8, Fig. 9 and Figure 10 illustrate the interchangeable parts of battery for example and are attached in the face of the structure on patient's the binding agent part.Before being installed to the binding agent sensor component on the mammiferous corium, the protectiveness release liner is removed, the remainder coupling of interchangeable battery and microelectronics system, thus make electronic system work.Then, the binding agent of device part and total are installed on patient's the corium.

After use, for example the interchangeable parts of battery is replaced and adhesive device can be used under the situation of patient's new supervision.

In order to remove battery after taking adhesive device apart, the part of the inside of the groove in the adhesive device can be coated with PDMS curable coating or other non-stick coating; This operation will help the replacing of battery.

Battery and can being present in such as other interchangeable part of chip in the groove in the basal surface of binding agent body.According to this embodiment, it may be favourable having the interchangeable microelectronics part that is contained in the capsule that in the capsule, for example is embedded into injection molding.

Be close to install comprise the capsule of microelectronic component before, release liner is removed and interchangeable capsule is attached on the binding agent body in the groove of adhesive construction.In order to help interchangeable capsular taking apart, microelectronic component can be coated with curable PDMS or other non-stick coating.

When microelectronic component has long life-span of specific viscosity mixture body, before using, can be integrated in the binding agent body such as the cheap parts of transducer, antenna or power supply, and the parts that can be re-used are placed in the groove.

Another Application is to finish the preparation and the programming of the customization of system before using.

Feature and application about Fig. 3 explanation are suitable for embodiment shown in Figure 5 equally well, and vice versa.

Figure 11 is illustrated in integrated micro system in the through hole in the binding agent body, thereby all can arrive microelectronics system from the upper surface and the basal surface of binding agent body.In the production/manufacturing of binding agent or be close to be applied on the skin before and/or applying on the skin after, applying of microelectronics system all is possible.

Figure 12 illustrates the connected in some way system of assembly of two parts or the parts of microelectronics system.One in the parts can be integrated in the mill, and another is applied in the back.

Scheme as an alternative, the assembly of parts or parts is applied in the back.This makes it possible under the different situation of time replacing such as the electronic unit of battery or transducer in the different life-spans is useful.Machinery and/or electric interconnection scheme such as springlock or plug are favourable in this configuration.

System shown in Figure 4 needs contact skin at the same time and is useful under the situation of upper surface visit electronic unit.One or two subsystem can be re-used.

Feature and application about Fig. 5 and Fig. 8 explanation are suitable for embodiment shown in Figure 11 equally well, and vice versa.

Figure 13～18 illustrate antenna of the present invention, CPU, battery and electrode and are embedded into embodiment in the adhesive device.

Figure 13 illustrates the two-dimensional shapes of the shape of device, by A-A indication section.

Figure 14 illustrates the position of the antenna 109 that is positioned at the outside of adhesive device and is connected with the core of microelectronics system.

Among Figure 15, the third dimension is along being illustrated in the section of the line A-A among Figure 13.Further amplified among Figure 16 from the round B at the edge of device, and the round C at center is exaggerated in Figure 17 similarly.

Figure 16 represents to be kept flat the structure that embeds the antenna in the binding agent in more detail.This figure clearly represents to be used for the coverlay 103 and the release liner 104 of binding agent 102.

Figure 17 represents the position of core of the microelectronics system 1 of the electrode 107 that has battery 105, CPU106 and stretch out binding agent.Battery and CPU are encapsulated in the transparent silicone rubber 108.

At last, Figure 18 illustrates adhesive device with perspective view.

Exist many structures to satisfy the alternate manner of adhesive device of microelectronics system of the basic demand of three dimensional structure, so accompanying drawing can not be interpreted as restriction with embedding.

A special advantage of the present invention is simple, cheap to have the mode of the binding agent body of 3D shape from the contact adhesive preparation.

As mentioned above, contact adhesive is the thermoplasticity contact adhesive, and perhaps it is the chemically curable binding agent that can be moulded to 3D shape.

The thermoplasticity contact adhesive generally can enter fluid state and realize moderate viscosity under the temperature that is higher than the glass transformation temperature that promptly is being higher than composition under 100～120 ℃ the temperature, and this makes and at an easy rate adhesive ingredients is molded into desirable shape.An example can be direct mold pressing.In first step, cover layer is set up with desirable shape under the temperature of the glass transformation temperature that just is lower than coverlay, and then, the binding agent of essential amount is filled in the mold to be full of mold.Suitably under the situation, the filling of mold can be divided into two steps.This will allow partially filled with fused binding agent in second step, in third step, place electronic section, and final in the 4th step the remainder with binding agent fill and the overlay electronic part.As last step, release liner is applied in, then the adhesive device mold that is stamped out.

Scheme as an alternative, with the stacked binding agent of coverlay can be higher but be lower than geometry or the shape that is processed into hope under the temperature of glass transformation temperature of binding agent by compression, extruding or mold pressing slightly.Randomly, microelectronics system can be placed between two layers of binding agent and be molded then.Be embossed under the high temperature extruding condition and be performed, and microelectronics system is placed in the mold if desired, and preferably be placed in the center of mold.

Maybe can re-use in the specific embodiment of a part that parts are adhesive devices interchangeable, need the former part and the formpiston part of mold shape.

In another embodiment of the present invention, curable contact adhesive is cast desirable shape.Casting can be followed the principle identical with above-mentioned principle: allowing the partially filled step of coverlay to mold, apply electronic unit and finish the filling of binding agent in mold then, is to place release liner, sclerosis in case of necessity and die-cut at last.

Other method is to cast by the compression of the binding agent with higher or very high viscosity.As first step, one sublevel of the contact adhesive that comprises the hydrocolloid that for example comprises block copolymer on the coverlay that takes off from cylinder enters treatment facility, in second step, the microelectronic component of pre-assembled randomly encapsulation is placed with suitable distance, in third step, quadratic-layer same or another contact adhesive is laminated on the ground floor of contact adhesive, thereby between two-layer, surround the microelectronics part, in the 4th step, described being stacked in forms the shape that comprises a plurality of projections of center on the microelectronics part in the hydraulic press, in the 5th step, each single projection is punched to final devices.

Can make the contact adhesive device according to the described continuous processing of US6726791.

Figure 19, Figure 20 and Figure 21 represent an embodiment 1 according to sensor cluster of the present invention.Figure 19 represents the sensor cluster in the exploded view.Figure 20 represents when sensor cluster is assembled along the assembly of seeing in the section of the line XX-XX among Figure 19.Figure 21 represents promptly will be attached to the sensor cluster that sensor cluster one side on the skin is seen from the skin side that is also referred to as the proximal lateral.

Sensor cluster 1 comprises sensor component 2 and comprises the crust component 3 of microelectronic circuit 4.Sensor component 2 is made of the source element of adhesive element 5 and coin element cell 6 shapes.Crust component 3 is made of distal portions 7 and proximal part 8.Groove 9 forms in distal portions.Groove has the circumference bigger slightly than the circumference of coin element cell, thereby allows to hold in groove the coin element cell.

Be electrically connected two

electric contact

10a, 10b of microelectronic circuit 4 and battery 6 when in groove, being provided in battery is placed in groove.Microelectronic circuit is made of a large amount of parts that are configured on the printed panel 11.Because circuit is as known in the art so each parts here will not be illustrated, so itself is not a part of the present invention.Usually, can mention, circuit comprises the antenna 12 that is formed by a large amount of windings that are printed on the conductive material on the printed panel.Antenna transmits and receive data from the central location that is positioned at communication range.Central location can for example be a personal computer of collecting data from sensor cluster.Data are processed according to known processing and algorithm then.

Antenna 12 be connected from the microprocessor 13 of first transducer 14 with second transducer, 15 received signals.First and second transducers extend and stop in the proximal end face of proximal part from printed panel by proximal part.Therefore, when shell is placed on the skin, first and second transducers contact skin surface.In order to reduce the interference between first and second transducers, stopper element 16 is placed on the proximal end face of two proximal parts between the transducer.The stopper element is formed by dielectric substance, and is the known measure that generally causes the undesirable interferential what is called between two electronic units to be crosstalked of being used to avoid.

When using, battery is placed in the groove, and battery contacts with

electric contact

10a, 10b and thus microelectronic circuit powered thus.Adhesive element is applied to the distal side of distal portions of shell and the distal side of battery then.This guarantees that battery is connected in the sensor cluster in groove and with adhesive element, source element and crust component.As can be seen, adhesive element has the circumference bigger than the circumference of shell, and this provides and can be applied to people or the lip-deep binding agent proximal end face 17 of other mammalian skin.

When sensor cluster was removed afterwards, adhesive element was separated with crust component, and because the distal surface adhesive attachment of battery is on adhesive element, so battery is removed with adhesive element.Adhesive element and battery can be processed then, and crust component can be cleaned and store for future use.

On being adhered to undesirable surface of inboard such as the clothes article of dress for fear of adhesive element, adhesive element lining cap rock 18 covers.Cover layer 18 is also as the backing layer that adhesive material 19 is set in the mill.

Figure 22 a represents another embodiment 30 according to device of the present invention.Figure 22 b represents the section of Figure 22 a in the enlarged drawing.Device is made of two-dimentional adhesive element 31 and the power supply that is adhered to coin element cell 32 shapes on the adhesive element.

Adhesive element is formed by backing layer 33.First adhesive phase 34 that is covered by first release liner 35 is set in the proximal lateral of backing layer.Second adhesive phase 36 of bonding battery is set in the distal side of backing layer.Second release liner 37 covers the remainder that does not have attached battery of the distal side of binding agent.

In the time of on being applied to such as the surface of people's skin surface, first release liner 35 is removed.Can expose first adhesive phase like this, this first adhesive phase can be adhered on the skin surface, thus device 30 is attached on the skin surface.Second release liner is removed then, thereby exposes second adhesive phase.Though do not illustrate among the figure, the shell that comprises microelectronics system is attached on the adhesive phase then, and the electric contact on the shell is electrically connected with battery 32 simultaneously.

Do not have surface contacts though above-mentioned this shell does not resemble with reference to the shell of Figure 19 explanation, shell still can comprise sensor technology.This pick off is measures ambient temperature simply, and perhaps device can be applied to below the nose, and is used for can being applied to device by the pick off of nose measurement breath rhythm.Scheme as an alternative, pick off can apply the contact skin transducer in device circumference outside, still is adhered on it simultaneously.

Figure 23 represents another embodiment 40 according to two-dimensional device of the present invention, and Figure 24 represents along the sectional drawing of the 3rd embodiment of the line XXIV-XXIV among Figure 23.Here, source element forms the hull cell 41 as the integration section of backing layer 42.

Apply first adhesive layer 43 that is covered by first release liner 44 in the proximal lateral of backing layer.Second adhesive phase 45 that the distal side of backing layer is covered by second release liner 46 covers.Second adhesive phase interrupts in zone 47, thereby allows to arrive the contact 48a and the 48b that are electrically connected that provides with hull cell.

When using, be applied in the mode identical with the device 30 of reference Figure 22 explanation with reference to the device 40 of Figure 23 explanation.

Should be appreciated that in the proximal lateral of backing layer and the distal side of backing layer and can use dissimilar binding agents respectively.Though the proximal lateral is attached on the skin surface and is preferably thus skin-friendly, the binding agent on the distal side should be preferably provides best adhering to still to allow device type isolating with it after use simultaneously to electronic circuit or the shell that comprises sort circuit.

Though but above embodiment has illustrated the attachment means that discharges that is used to make adhesive attachment shape that device is connected with electronic circuit, but the release attachment means of other type can be used.But this attachment means that discharges can for example be that here, groove is with forming with the coupled outstanding fin of battery such as the mechanism of the configuration of the springlock between the groove in battery and the shell.Scheme as an alternative, additional coupling device can be set on the device with electronic circuit or comprise additional coupling device coupling on the shell of electronic circuit, and can for example take the shape of bayonet coupling, crotch, friction coupling or screw thread couple.

Experimental section

Example 1

Make three batches of binding agents.Composition by mixed elastomer (Kraton) under 130 ℃ temperature, 1/3rd plasticizer (DOA) and resin (Arkon) prepares binding agent by the standard reflow process up to realizing uniform mixture (30～50 minutes) in Herman Linden z blade mixer (Machine typeLK 110.5).Remaining plasticizer and hydrocolloid extender (CMC) are added, and mixed 20 minutes of mixture.

	Prescription 1	Prescription 2	Prescription 3
	Prescription 1	Prescription 2	Prescription 3	Kraton 1161 (Shell)	18,0	19,0	15,0
Arkon P90 (Arakawa)	32,0	36,0		Kraton 1161 (Shell)	18,0	19,0	15,0
Arkon P90 (Arakawa)	32,0	36,0		DOA (Diocyl adipate)	5,6	7,5
Vistanex LM-MH (Exxon)			45,0	DOA (Diocyl adipate)	5,6	7,5
Vistanex LM-MH (Exxon)			45,0	CMC：Blanose 9H4XF (Hercules)	44,4	37,5	40,0

Example 2

The moulded body of the binding agent of example 1:

Be applied on the poly 35 micron thickness coverlays according in the binding agent of claim 1 each, and the siliconized polyethylene lining is applied to the offside of patches of adhesive, and, under 90 ℃ temperature at the mold of the shape that is used for designing, keep mold providing the shape of groove by changing non-cavity, be extruded according in Fig. 1～3 any and be desirable shape.The center of adhesive device is 3.4mm, and the thickness of periphery is 0.4mm.

Example 3

The silicone pressure-sensitive adhesive body of mold pressing:

Dow Corning 7-9800 A﹠amp; B (the weight mixing ratio between A and the B is 1: 1) is used to make the binding agent body based on PDMS.Mold with triangular shaped (each limit of triangle mold has the distance of 300mm, and core thickness is 0.5mm, and edge thickness is 0.1mm) is used.Composition is mixed fully and is applied on the 50 μ m cover layers of the silicone rubber lining in the former part of triangle mold, and the formpiston mould portion is applied to the top, and described part is arranged along the low density polyethylene (LDPE) release liner.Binding agent solidified 15 minutes under 100 ℃ temperature in stove.After curing, the binding agent mold that is stamped out, and the indenture at center that is used to embed the binding agent body device of sense electronics examining system is stamped out.

Example 4

The thermoplasticity PSA binding agent body of mold pressing:

The composition of the prescription 2 in the example 1 is mixed in Herman Linden blender, and, under the condition that still keeps heat and soft state, the dough material piece that obtains is removed from blender, and be placed on the thermoplastic polyurethane coverlay of the cavity of putting into die cavity, and release liner is placed in the top.The second portion of mold is flat.Binding agent about 90 ℃ temperature and 100 the crust conditions under by compression moulding.Release liner is removed, and the microelectronics sensing system of encapsulation is placed in the center of the binding agent body in the mold, and release liner is applied again and the mold pressing step is repeated.At last, the sensor mat that obtains is stamped out.

Example 5

Thermoplasticity PSA binding agent body with mold pressing of integrated RFID label:

Contact adhesive according to the prescription in the example 12 is mixed in Herman Linden blender, and, under the condition that still keeps heat and soft state, the very little part of material is removed from blender and partly is placed on the coverlay towards the former of mold, and release liner is placed in the top, then, the formpiston that has the mold of smaller projection on the zone corresponding with the microelectronics system of product partly is applied in.Total about 90 ℃ temperature and 100 the crust conditions under by compression moulding.Then, release liner is removed, and the RFID label that is encapsulated in the polypropylene is placed in the groove of contact adhesive, and mold is filled full by remaining binding agent.Release liner is adhered to again, and total is by compression moulding again.The pad that obtains is stamped out.Week, edge thickness was 0.2mm, and center thickness is 2.5mm, and shape is that diameter is the circle of 40mm.

Example 6

In the present example, the microelectronics system that embeds in the binding agent body comprises the RFID label simultaneously and communicates by letter and memory unit.In order to protect microelectronics system, parts are encapsulated in the polyethylene.Parts are integrated among the PSA in successive technology as US6726791 is described.One sublevel comprises the coverlay with contact adhesive, and quadratic-layer is the microelectronics part of encapsulation; The 3rd layer is moldable lamination sensitive adhesive; Total is combined in the shaping cavity.

Example 7

The preparation of hydrogel adhesive composition:

3.5 the PEG 400 of the Pemulen TR2 of the PVP K-25 of the PVP K-90 of gram, 17.5 grams, 3.5 grams and 28 grams is mixed as premix.At first, plasticising ethylene glycol, PVP and crosslinked polyacrylic premix are added and under 100 ℃ the temperature in the Brabender blender mixed 10 minutes.Then, in order to guarantee the mixing fully of composition, the amphotenic polkyurethanes (Tecogel 2000) of 17.5 grams is added lentamente.After 20 minutes mixing, obtain macroscopic view and go up uniform mixture.Be moulded to from the binding agent of the heat of mixing chamber and have the circular binding agent body (diameter 4cm) that is used for the indenture of after-applied microelectronics system.The center thickness of pad is 3mm, and thickness is reduced to the 0.3mm on the edge of pad gradually.Adhesive device between silicone cardboard and 30 μ m PU coverlays by compression moulding.

Example 8

The microelectronics sensing system that is used for the intrusive mood measurement of oxygen:

Binding agent according to example 1 prescription 2 is used to embed the microelectronics system that comprises oxygen electrode, CPU, emitter and battery.Being shaped as of binding agent body is avette, and (70 * 30mm), this avette center thickness is 5mm, and the edge is 0.3mm, and thickness increases to the center substantial linear from the edge that fills up.The binding agent body has through hole and the indenture that is positioned at the center in the contact skin part on the surface of binding agent body, be used for little electric component that silicone covers.

Explanation is the same in CPU, battery and emitter and the example 11.Oxygen electrode is oxygen electrode production number 723 (from Diamond General, Development Corp.US).

CPU, emitter and battery are electrically connected, and the thin layer of the silicone that is aggregated then covers, and only have the electric contact of CPU and electrode to keep not coated.

The tip of the electrode in the sensing device is the medical needle encirclement of 0.7mm by external diameter.

In use, electrode and pin are positioned with the electric contact of CPU and the corresponding contact ways of connecting of electrode.

Applying in the process of measuring element, the microelectronics system that the part silicone covers at first is applied on the binding agent body in the indenture on the contact skin side of device.Device is applied on the skin.Then, in second step, pin is positioned by the hole in the binding agent from the outside by thrusting skin, and, as third step, the electrode that is encapsulated in the plug of part passes the center of the hollow of pin, thus produce with the uncoated of microelectronics system be connected electrically contact.The plug portion of electrode cooperates the smooth curvature of the coverlay of not introducing groove.

In use, electrode can realize that the needs of correct signal are cleaned again and applied again according to being used to.

Example 9

Embedding is according to the microelectronic network hub in the binding agent sensor component of the present invention:

Binding agent according to example 1 prescription 1 is configured as ground floor, thereby forms the oval shell (50 * 80mm) that a side has smooth surface.This surface tilts and is coated with 30 μ m thin film of polyurethane to periphery, that is, be placed between mold and the binding agent.The offside of binding agent body is formed with the groove of the soft-hearted shape of about 2 * 10 * 15mm that is used for applying microelectronics system.Poly silication release liner is placed on the surface with groove.In second step, release liner is removed, and antenna is placed on the periphery of binding agent body, and CPU and battery are placed in the central recess.In last step, second layer binding agent is applied in built in items in the groove at the center at the peripheral edge margin flush antenna but not.Release liner is applied in, and obtains being die-cut to the structure of finishing of final size.Antenna is connected with the microelectronic component at center by electric contacts, makes it possible to the part at the center that re-uses.Antenna is packaged in thin polyethylene terephthalate (PET)-plastics, and the microelectronics at center partly is packaged in the silicone rubber.

Example 10

The microelectronic network hub:

Has the structure that antenna and battery are fully integrated in to the microelectronic network hub in the contact adhesive of example 1 of front.The adhesive coverage antenna by making the final step in the example 9 and the microelectronics at center are partly finished this point.

Example 11

Embedding does not have the adhesive device of the microelectronics system that is used for body temperature sensing and warning of telecommunication

Binding agent according to example 1 prescription 2 is used to embed the microelectronics system that comprises temperature sensor, CPU, emitter, battery and OLED (Organic Light Emitting Diode).The shape of binding agent body is circular (30mm), and its center thickness is 5mm, and periphery is 0.2mm, and thickness increases to the center substantial linear from the edge that fills up.The binding agent body has indenture in the contact skin part on surface, be used for the microelectronic component that silicone covers.

CPU is little Controller ATMEGA 128L, and it is 8 risc processors of AVR from ATML.Battery is Panasonic Coin battery CR3202.The flexible color display of OLED is from OSD (One Stop Display) part #OSCC 130-0.Temperature sensor is from Pasport Ps-2125.

In use, temperature sensor continuous monitoring application on human skin temperature.When some incident of being determined by microcontroller that the thermograde that the time occurs being subjected to, compare with the data of storage influences, system will provide the text of relevant information or the visual alarm of light form on flexible display.

System is integrated in the binding agent and is activated when peelling off release liner and will plays a role and finishes up to battery.

Example 12

The adhesive device that has embedded the microelectronics system that is used for human body temperature sensing and warning that does not have telecommunication is fabricated according to example 11.

Except in the surface of device, use EL (electroluminescent lamp) as the display part with the flexible color display of OLED that replaces being used for displays temperature and change, the structure of adhesive device is identical with the structure of example 11.This part is the ELLamp Part#:300210KIT from Being Seen Technologies.

In use, temperature sensor continuous monitoring application on human skin temperature.When some incident of being determined by microcontroller that the thermograde that the time occurs being subjected to, compare with the data of storage influences, system will provide visual alarm with the form of light.

Example 13

In an embodiment of reference Figure 19～21 explanations, adhesive material 19 is the contact adhesives (PSA) that comprise the accessible styrene block copolymer of the hot melt with hydrocolloid, battery is a metal-back coin element cell, and shell is coated with polydimethylsiloxane (PolyDiMethylSiloxane) layer.

In following example 13, the peeling force between PSA and surface, battery and the shell is determined:

PSA is the accessible Styrenic block copolymer with hot melt of hydrocolloid, and it is thermoformed into desirable shape.The PSA that is called A has following composition: 25% KratonD1107 (Kraton Polymer), 35% Arkon P90 (from the hydrogenation dicyclopentadiene of Arkawa Ltd.), 8% dioctyl adipate (DiOctylAdipate) and 32% sodium carboxymethyl cellulose.

For the peeling force between the different piece is shown, determine peeling force by using FINAT; FTM2,25mm sample be wide, 90 degree peel angle, the test speed of 300mm/min and quiescent times of 30 minutes.

About the peeling force from skin, use following test method: cut the wide strip of glue of 25mm from the plate of PSA composition A.In order to prevent the elongation of sample, adhesive strings (TESA4124) is attached.Sample is by the anchor clamps clamping.Before adhering to PSA, cleaned the upside of forearm and drying at least 2 hours by suds with dilution, prepare volunteer's skin.The binder side of sample is placed on the ready skin.Be 30 minutes the quiescent time of binding agent.Anchor clamps are attached on the hook of testing equipment Instron Tensile testing machine model 5564.Forearm is placed on the movable supporting frame of testing equipment, in order to keep 90 degree peel angles, notices that the end with sample remains under the anchor clamps.Forearm is held, and instron is activated with the speed with 300mm/min and pulls up binding agent simultaneously.The peel value of the stable state part of the figure that obtains is recorded, and confirms do not have residue to stay on the skin of forearm.

Battery is the metal-back Manganese Dioxide Lithium coin element cell CR2330 from Panasonic, and the microelectronics shell is coated with polydimethylsiloxane (PDMS) layer; MED-1137 from NuSil Technology.

Determine peeling force between binding agent and the following part with following result and three repeated trials, here, s represents standard deviation.

Peeling force 0.1N/25mm between the shell of A and PDMS coating

Peeling force 22.5N/25mm between A and the steel (s=2.3)

Peeling force 2.5N/25mm between A and the application on human skin (s=0.25)

And dissimilar materials can be used for the different part of device and microelectronic circuit and/or shell, can provide different peeling forces thus.Therefore, can between PSA and skin, realize being in the peeling force in the general range of 1～5N/25mm, and realization is generally less than the peeling force of 1N/25mm between PSA and shell, and between the metal shell of PSA and battery, realize general peeling force greater than 20N/25mm.

Therefore, be appreciated that when assembly in the sensing 1 is applied on user's the skin, can at an easy rate it be being peelled off by using after the use greater than the peeling force drawing adhesive element between PSA and the skin.Thereby adhesive element 5 can be separated with the crust component 3 that comprises microelectronic circuit 4 at an easy rate.Because the peeling force between adhesive element and the battery 6 is much larger than the peeling force between binding agent and the shell, so in fact battery can not separate with adhesive element, and therefore battery will be attached on the binding agent when binding agent separates with shell.

Claims

1. the three-dimensional adhesive device on the mammiferous body surface of will being attached to that comprises microelectronics system is characterized in that,

(b) be embedded into microelectronics system in the body of contact adhesive;

(c) be attached to one or more cover layer on the upper surface; With

2. according to the adhesive device of claim 1, wherein, microelectronics system is the microelectronics sensing system.

3. according to each adhesive device in the claim 1～2, wherein, the three-dimensional adhesive body has smooth basically basal surface and the smooth upper surface that is suitable for being adhered on the mammiferous body surface, and is the thinnest on this adhesive device and the edge at body the thickest at the core of body.

4. according to each adhesive device in the claim 1～3, wherein, the thickness of adhesive device on the edge less than adhesive device its thickest locational thickness 50%, suitably, the thickness on the edge less than adhesive device its thickest locational thickness 25%, preferably, thickness on the edge less than adhesive device its thickest locational thickness 10%, and, most preferably, the thickness on the edge less than adhesive device its thickest locational thickness 5%.

5. according to the adhesive device of claim 4, wherein, the thickness of adhesive device on the edge suitably be 0.05～0.4mm, and the thickness that adhesive device is the thickest is 0.5～15mm greater than 0.05mm, suitably is 1～5mm.

6. according to each adhesive device in the claim 1～5, wherein, the basal surface of adhesive device and from the arbitrfary point of the periphery of basal surface to the angle the line that draws at the thickest locational point of upper surface binding agent body less than 60 degree, preferably less than 45 degree, and most preferably less than 30 degree.

7. according to each adhesive device in the claim 1～6, wherein, the contact adhesive of making the three-dimensional adhesive body is moldable thermoplastic contact adhesive, even this contact adhesive has the curvature that makes adhesive device can meet body part also keeps its bond properties simultaneously under mobile condition flexibility.

8. according to each adhesive device in the claim 1～7, wherein, contact adhesive is based on the binding agent of polymer, and these polymer are selected from the group such as the block copolymer of styrene block copolymer and hydrogenated styrene block copolymers, amorphous polyalphaolefin (APAO), polyacrylic acid, polyvinylether, polyurethane, polyvinyl acetate, silicone or hydrogel contact adhesive.

9. adhesive device according to Claim 8, wherein, the block copolymer such as styrene block copolymer and hydrogenated styrene block copolymers is selected from styrene/ethylene-butylene/styrene (SEBS), styrene/isoprene/styrene (SIS) and styrene/ethylene-propylene/styrene (SEPS).

10. adhesive device according to Claim 8, wherein, binding agent is based on the binding agent of polydimethylsiloxane, such as the polydimethylsiloxane gel.

11. according to each adhesive device in the claim 1～10, wherein, the contact adhesive that constitutes the binding agent body comprises hydrocolloid.

12. according to each adhesive device in the claim 1～10, wherein, the contact adhesive that constitutes the binding agent body is a foamed adhesive.

13. according to each adhesive device in the claim 1～12, wherein, whole microelectronics system is integrated in the binding agent body, and is covered fully by the binding agent body on all each limits.

14. according to each adhesive device in the claim 1～12, wherein, one or more parts of microelectronics system are integrated in the binding agent body, and covered by the binding agent body on all each limits, and, other parts of microelectronics system are positioned at other position of binding agent body, and the parts of microelectronics sensing system have necessary machinery mutually and are electrically connected.

15. according to each adhesive device in the claim 1～12, wherein, whole microelectronics system is contained in and is arranged in the face of in one or more groove in the upper surface of tectal binding agent body.

16. adhesive device according to claim 14, wherein, one or more parts of microelectronics sensing system are integrated in the binding agent body and are covered by the binding agent body on all each limits, and the remainder of microelectronics system is contained in and is arranged in the face of in one or more groove in the upper surface of tectal binding agent body.

17. according to each adhesive device in the claim 1～12, wherein, whole microelectronics system is contained in one or more groove in the binding agent basal surface that is set at the binding agent body.

18. adhesive device according to claim 14, wherein, one or more parts of microelectronics system are integrated in the binding agent body and are covered by the binding agent body on all each limits, and the remainder of microelectronics sensing system is contained in one or more groove in the binding agent basal surface that is arranged on the binding agent body.

19. according to each adhesive device in the claim 1～12, wherein, whole microelectronics system is contained in one or more through hole in the binding agent body, and from all arriving in the face of tectal upper surface and binding agent basal surface.

20. adhesive device according to claim 14, wherein, one or more parts of microelectronics sensing system are integrated in the binding agent body and by the binding agent body and cover, and, the other parts of microelectronics system are contained in one or more through hole in the binding agent body, and from all arriving in the face of tectal upper surface and binding agent basal surface.

21. adhesive device according to claim 14, wherein, one or more parts of microelectronics system are integrated in the binding agent body and by the binding agent body and cover, other parts of microelectronics system are contained in one or more through hole in the binding agent body, and all can arrive from facing tectal upper surface and binding agent basal surface, and, the remainder of microelectronics system be contained in be arranged on the binding agent body go up and/or basal surface in one or more groove in.

22. according to each adhesive device in the claim 1～12, wherein, one or more parts of microelectronics system are contained in intravital one or more through hole of binding agent, and all can arrive from facing tectal upper surface or binding agent basal surface, and, the remainder of microelectronics system be contained in be arranged on the binding agent body go up and/or basal surface in one or more groove in.

23. according to each adhesive device in the claim 1～12, wherein, one or more parts of microelectronics system are contained in one or more groove in the upper surface of binding agent body, and the remainder of microelectronics system is contained in one or more groove in the basal surface of binding agent body.

24. according to each adhesive device in the claim 1～23, wherein, microelectronics system or its one or more parts are packaged in the material different with the binding agent body.

25. adhesive device according to claim 24, wherein, microelectronics system or its parts are packaged in polymeric film, polymer foil or the polymer coating, perhaps, microelectronics system or its parts be embossed in the polymeric material be packaged into glass or ceramic material in.

26. according to the adhesive device of claim 25, wherein, the polymer that is used to encapsulate is a silicone rubber.

27. according to the adhesive device of claim 1～26, wherein, one or more parts of microelectronics system can arrive from the binding agent outside and can be substituted by similar parts at the life period of adhesive device.

28. according to the adhesive device of claim 27, wherein, the parts that can be replaced are the energy of battery for example.

29. according to the adhesive device of claim 1～26, wherein, one or more parts of microelectronics system can arrive from the binding agent outside, and parts can be re-used.

30. according to each adhesive device in the claim 27～29, wherein, it is packed and form the groove that cooperates in the binding agent or the packaging part of through hole that alternative parts maybe can re-use parts.

31. according to the adhesive device of claim 30, wherein, the alternative packaging part of parts that maybe can re-use of encapsulation is by suitably being fixed in the binding agent body for the mechanical protection plate of snap-lock mechanism.

32. according to the adhesive device of claim 30, wherein, the packaging part that encapsulation replaceable maybe can re-use parts is fixed on the surface of binding agent in the groove of binding agent body or through hole.

33. according to the adhesive device of claim 30, wherein, the alternative packaging part that maybe can re-use parts of encapsulation is fixed in the groove or through hole in the binding agent body, here, described groove or through hole have the inside non-sticky surface such as the PDMS coating.

34. according to each adhesive device in the claim of right1, wherein, microelectronics system comprises the machinery that is selected between communication component, CPU, power supply, memory unit, transducer element, actuator component and the parts and/or the parts of electric interconnection.

35. according to each adhesive device in the claim 1～34, wherein, microelectronics system is the system that makes it possible to carry out radio communication.

36. adhesive device according to claim 34, wherein, transducer has the detecting element that is selected from electrode (polarity, bipolar), pressure transducer, the pin with electrode, accelerometer, photodetector, mike, ISFET, NTC resistor, band-gap detector, ionic membrane, enzyme reactor or capacitor.

37. according to the adhesive device of claim 36, wherein, transducer has the non-intrusion type detecting element such as the electrode of for example steel electrode.

38. according to the adhesive device of claim 36, wherein, transducer has the intrusive mood detecting element such as the pin that comprises electrode.

39., wherein, between detector and mammalian skin, do not have the physics contact according to the adhesive device of claim 34～36.

40. according to the adhesive device of claim 34, wherein, microelectronics system comprises hub, gateway and coordinator system.

41. according to the adhesive device of claim 34, wherein, microelectronics system comprises GPS.

42. according to the adhesive device of claim 34, wherein, microelectronics system comprises the RFID label.

43. according to the adhesive device of claim 40, wherein, microelectronics system is to comprise to be encapsulated in to act on the gateway that transmits the dedicated network coordinator of data to central location (CU) comprising storage and communication component, CPU and battery and using in the plastics.

44. according to the adhesive device of claim 41, wherein, microelectronics system is the system that is selected from following system:

Randomly be encapsulated in comprising storage and communication component, CPU, battery, GPS, be used for the system of parts of wireless synchronizationization of the real-time clock of data record gps data in the plastics; With

Randomly be encapsulated in the plastics comprise storage and communication component, CPU, battery, GPS, be used for the data record gps data real-time clock wireless synchronizationization parts, be used for data record and transmit the mobile network's of data and position system to mobile phone.

45. according to the adhesive device of claim 34, wherein, microelectronics system can be used for nerve stimulation and comprises storage and communication component, CPU, power supply, be used for transmitting to the implant that is used for nerve stimulation the transducer of data and power.

46. according to the adhesive device of claim 34, wherein, microelectronics system is to can be used for electromyographic system and comprise transducer, CPU, power supply, communication and memory unit, and randomly comprises actuator.

47. according to the adhesive device of claim 1～46, wherein, this device comprises the source element that is used for to described microelectronics system power supply, wherein,

The binding agent body is releasably attached in the parts of microelectronics system one or more;

The binding agent body has the first area that is used to be adhered on the body surface at least.

48. according to the adhesive device of claim 47, wherein, source element is attached on the binding agent body, and the binding agent body has the second area on one or more of the parts that are used for being adhered to microelectronics system at least.

49. according to the adhesive device of claim 47 or 48, wherein, first peeling force between second area and the microelectronic circuit is littler than second peeling force between power supply and the binding agent body.

50. according to claim 47,48 or 49 adhesive device, wherein, source element to small part is contained in the binding agent body.

51. according to claim 47,48,49 or 50 adhesive device, wherein, adhesive device is suitable for being releasably connected on the shell that comprises microelectronics system, and shell is partly formed by near-end housing parts and distal housing.

52. according to the adhesive device of claim 51, wherein, at least one power supply is suitable for being accommodated in the groove, this groove forms in the distal housing part, and at least one electric contact is set in the distal housing, thereby provides electrical connection between power supply and microelectronic circuit.

53. a sensor cluster that is suitable for being attached on the mammiferous body surface comprises:

Sensor circuit comprises many electric components;

Be used at least one power supply at least one power supply of electric component;

Be used for sensor cluster is attached at least one binding agent on the mammiferous body surface; And,

In power supply and the binding agent at least one is releasably connected on the sensor circuit.

54. according to the sensor cluster of claim 53, wherein, sensor circuit to small part is contained in the shell, and shell is partly formed by near-end housing parts and distal housing.

55. according to the sensor cluster of claim 54, wherein, the first peeling force specific viscosity mixture and second peeling force between the battery between binding agent and the shell are little.

56. according to the sensor cluster of claim 54 or 55, wherein, at least one transducer is attached on the proximal end face of proximal part.

57. according to claim 54,55 or 56 sensor cluster, wherein,

Groove is formed in the distal housing part, and this groove is suitable for holding at least one power supply; And

At least one electric terminal is set in the distal housing, thereby provides electrical connection between this at least one power supply and electric component.

58. a multisensor network comprises one or more adhesive device according to claim 1～52.

59. the multisensor network according to claim 58 comprises: the adhesive device that comprises network coordinator; Comprise and be used for electromyogram graphy and comprise at least two adhesive devices that transducer, CPU, power supply, communication and memory unit also randomly comprise the microelectronics system of actuator; With the adhesive device that comprises the microelectronics system that is suitable for measuring heart rate.

60. the manufacture method according to the adhesive device of claim 1 that has embedded microelectronics system in binding agent, described device has coverlay and release liner, it is characterized in that, the binding agent body is by compression moulding.

61. the manufacture method according to the adhesive device of claim 1 that has embedded microelectronics system in binding agent, described device has coverlay and release liner, it is characterized in that, the binding agent body is injection moulded.

62. the manufacture method according to the adhesive device of claim 1 that has embedded microelectronics system in binding agent, described device has coverlay and release liner, it is characterized in that, the binding agent body forms by the reaction mold pressing.

63., in adhesive device, embedded microelectronics system and also be connected with other electronic system by wiring according to the adhesive device of claim 1.

64. a purposes that comprises the device of adhesive element and source element, wherein, device is used to be attached to electronic circuit upward surperficial and to described power electronics, wherein, described electronic circuit is releasably connected on adhesive element and the source element.