CN101163440B - A three-dimensional adhesive device having a microelectronic system embedded therein - Google Patents

A three-dimensional adhesive device having a microelectronic system embedded therein Download PDF

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Publication number
CN101163440B
CN101163440B CN 200680013718 CN200680013718A CN101163440B CN 101163440 B CN101163440 B CN 101163440B CN 200680013718 CN200680013718 CN 200680013718 CN 200680013718 A CN200680013718 A CN 200680013718A CN 101163440 B CN101163440 B CN 101163440B
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China
Prior art keywords
adhesive
body
adhesive device
microelectronic
device
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CN 200680013718
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Chinese (zh)
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CN101163440A (en
Inventor
卡斯坦·霍普
比德·伯曼·萨缪尔森
简斯·布兰尼布杰格
苏塞尼·霍尔姆·法尔贝克
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库蒂森斯股份公司
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Priority to DKPA200500354 priority Critical
Priority to DKPA200500354 priority
Priority to DK200501748A priority patent/DK176644B1/en
Priority to DKPA200501748 priority
Application filed by 库蒂森斯股份公司 filed Critical 库蒂森斯股份公司
Priority to PCT/DK2006/050006 priority patent/WO2006094513A2/en
Publication of CN101163440A publication Critical patent/CN101163440A/en
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    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00Detecting, measuring or recording for diagnostic purposes; Identification of persons
    • A61B5/68Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient
    • A61B5/6801Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be attached to or worn on the body surface
    • A61B5/683Means for maintaining contact with the body
    • A61B5/6832Means for maintaining contact with the body using adhesives
    • A61B5/6833Adhesive patches
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00Detecting, measuring or recording for diagnostic purposes; Identification of persons
    • A61B5/41Detecting, measuring or recording for evaluating the immune or lymphatic systems
    • A61B5/411Detecting or monitoring allergy or intolerance reactions to an allergenic agent or substance

Abstract

Accordingly, the present invention relates to a three-dimensional adhesive device to be attached to the body surface of a mammal comprising a microelectronic sensing system 5 characterized by (a) a three-dimensional adhesive body made of a pressure sensitive adhesive having an upper surface and a bottom surface; (b) a microelectronic system embedded in the body of the pressure sensitive adhesive;10 (c) one or more cover layer(s) attached to the upper surface; and (d) optionally a release liner releasable attached to the bottom surface of the adhesive device. Suitably the microelectronic system is a microelectronic sensing system capable of 15 sensing physical input such as pressure, vibration, sound, electrical activity (e.g. from muscle activity), tension, blood-flow, moisture, temperature, enzyme activity, bacteria, pH, blood sugar, conductivity, resistance, capacitance, inductance or other chemical, biochemical, biological, mechanical or electrical properties.

Description

嵌入有微电子系统的三维粘合剂器件 Microelectronic system embedded three-dimensional adhesive device

技术领域 FIELD

[0001] 本发明涉及主要用于监视生理或神经条件的微电子系统。 [0001] The present invention relates to a microelectronic system is mainly used for monitoring physiological or neurological conditions. 更特别地,本发明涉及 More particularly, the present invention relates to

被嵌入三维粘合剂器件中的侵入式和非侵入式微电子系统,该三维粘合剂器件可被附着到哺乳动物的表面上,该表面适当地为皮肤。 A three-dimensional adhesive device is embedded in a non-invasive and invasive microelectronic system, the three-dimensional adhesive device may be attached to the upper surface of a mammal, suitably the skin surface. 该微电子系统适当地利用无线通信并可用于测 The microelectronic system using wireless communication and can be suitably used to measure

量ECG(心电图)、EMG(肌电图)、EEG(脑电图)、血糖、脉搏、血压、pH值和氧。 The amount of the ECG (electrocardiogram), the EMG (electromyogram), the EEG (electroencephalogram), blood glucose, pulse, blood pressure, pH, and oxygen. 背景技术 Background technique

[0002] 感测系统通过压敏粘合剂向皮肤的附着被很好地建立。 [0002] The sensing system is well established adhered to the skin by pressure-sensitive adhesive. 因此,AMBU A/S, DK具有大量的用于测量ECG的产品,这些产品通过泡沫粘合剂、微孔粘合剂或水凝胶粘合剂附着到皮肤上。 Thus, AMBU A / S, DK having a large number of products for measuring ECG, these products adhering to the skin through the foam adhesive, a hydrogel adhesive or a microporous adhesive. 这些传感器一般通过导线连接到监视设备上。 These sensors are typically connected by wires to the monitoring apparatus.

[0003] 在WO 03/065926A2中,0zgus等人公开了具有柔软并且较薄的集成电路的可佩带的生物监视器。 [0003] In WO 03 / 065926A2, 0zgus et al discloses an integrated circuit having a thin and flexible wearable biological monitor. 该专利申请提出通过使用薄层粘合剂或粘合剂垫料附着到皮肤上而实现高舒适度佩带的方式。 This patent application is made by using an adhesive gasket or thin layer of adhesive attached to the skin and high wearing comfort mode. 但是,使用的粘合剂是吸留的。 However, the adhesive used is occluded. 该申请还说明了用于无线数据收集的传感器模块,该传感器模块具有包含电路的薄硅板和作为多个层被嵌入传感器模块内的柔性电源。 This application also describes a sensor module for wireless data collection, the sensor module having a thin silicon plate comprising a flexible circuit and a power source in the plurality of layers is embedded in the sensor module.

[0004] 在US 5054488中,Mus等人公开了用于产生代表生理条件的电信号的光电子传感器。 [0004] In the US 5054488, Mus et al discloses an optoelectronic sensor for generating an electrical signal representative of the physiological conditions. 传感器可通过聚酯衬里上的双侧压敏粘合剂被附着到身体上。 Sensors may be attached to the body by a double-sided pressure sensitive adhesive on the polyester backing.

[0005] 在US 5458124中,Stanko等人公开了通过双侧压敏粘合剂被附着到身体上的心电图电极。 [0005] In the US 5458124, Stanko, et al discloses the electrocardiogram electrodes are attached to the body by a double-sided pressure sensitive adhesive.

[0006] 在US 6372951中,Ter-Ovanesyan等人公开了在操作上连接到通过粘合剂补片与佩带者配合的一次性物品上的传感器。 [0006] In the US 6372951, Ter-Ovanesyan et al., Discloses a sensor operatively connected to an adhesive patch with the wearer disposable article. 各种各样的身体粘合成分可被使用。 Various body adhesive component can be used. [0007] 在US 6385473中,Haines等人公开了用水解胶体粘合剂的两个条带附着到哺乳动物对象身体上的层叠的传感器器件。 [0007] In the US 6385473, Haines et al., Discloses a sensor device with two stacked strips hydrocolloid adhesive tape attached to the body of a mammalian subject. 层叠结构也包含与水解胶体粘合剂接触的水凝胶。 A laminated structure comprising a hydrogel contact with the hydrocolloid adhesive. 器件的寿命规定为24小时。 Specified lifetime of the device was 24 hours.

[0008] 在W0 99/59465中,Feierbach等人公开了用于监视病人的生理条件的装置。 [0008] In the W0 99/59465, Feierbach et al discloses an apparatus for monitoring a patient's physiological conditions. 该装置包括具有用于附着到病人身上的远端侧的补片。 The apparatus comprises a patch having a distal end for attachment to the patient's side. 该装置还可包含可与所述补片耦合的电子外壳。 The apparatus may further comprise an electronic housing may be coupled to the patch. 在一个实施例中,装置的表面可预先形成为符合身体部位的轮廓。 In one embodiment, the surface of the device may be pre-formed to conform to the contours of the body part. 承载电子外壳的补片可以较软并提供自然的感觉,并且可由乳胶、硅或其它的涂胶的织物制成。 Patch carrying electronic enclosure can provide a softer feel and natural, and may be made of latex, silicon or other rubberized fabric. 如该专利的图2B和图8所示,具有电子外壳的补片的上表面可具有平滑的凸面形状。 Figure 2B of the patent and as shown in FIG. 8, the upper surface having the electronic enclosure patch may have a smooth convex shape. 补片通过粘合剂与病人的皮肤耦合。 Coupling adhesive patch through the skin of the patient. 这种粘合剂可以是由3M制造的水解胶体皮肤保护粘合剂。 Such adhesive may be a hydrocolloid skin adhesive manufactured by 3M of protection. 由此,该专利申请教导使用用于附着传感器的水解胶体粘合剂衬里,该传感器具有任选地以预先形成的形状配合身体的轮廓的平滑并且较软的衬背。 Thus, this patent application teaches the use of a hydrocolloid adhesive backing for attaching a sensor, the sensor has a shape to be optionally preformed smoothly contoured body fit and soft backing.

[0009] 在美国申请2003/0009097A1中,Sheraton等人公开了这样一种传感器,即,该传感器具有水凝胶导电中心皮肤接触部分和围绕该中心部分的用于粘合传感器的水解胶体粘合剂部分,并且,在所述组合的盘上,导电端子与导线连接。 [0009] In U.S. Application 2003 / 0009097A1 in, Sheraton et al discloses such a sensor, i.e., the sensor having a hydrocolloid for the adhesive of the central portion of the sensor hydrogel conductive central portion and surrounding skin contacting adhesive moiety, and, on the combined disc, the conductive terminal connected to the wire. 这种结构进一步被粘合到端子上的叠层膜层和粘合剂的周缘保护。 This structure is further bonded to the peripheral edge of the protective laminate and the adhesive layer on the terminal. 该专利申请教导使用用于将传感器附着到皮肤上的 This patent application teaches the use of a sensor attached to the skin

6水解胶体粘合剂并强调制成非常薄和柔软的电极的方面。 6 and emphasizes aspects of hydrocolloid adhesive is made very thin and flexible electrodes. 在组合使用水解胶体粘合剂和水 Use hydrocolloid adhesive compositions and water

凝胶的意义上,该专利申请是独特的。 The sense of gel, which patent application is unique. 对于任何实际的目的,所公开的结构将是没有用处 For any practical purposes, the disclosed structure would be useless

的,因为来自水凝胶的水分将迁移到水解胶体粘合剂内并随着时间破坏它。 Because the moisture from the hydrogel will migrate into the hydrocolloid adhesive with time and destroy it.

[0010] 在生理条件的监视器件方面的最新的进展是无线类型。 [0010] The latest progress in terms of physiological conditions of the monitoring device is a wireless type. 除了能够以侵入或非侵入 In addition to invasive or non-invasive

的方式监视生理条件并潜在地与基准相比较以外,它们能够处理数据并将它们发送给便携 Way to monitor physiological conditions and compared with the reference potential than they can process data and transmits them to the mobile

式器件。 Type device. 事实上,可附着的器件本身也可例如通过使用光发射、音频报警或另外的警告信号 In fact, the device itself can be attached, for example, by using a light emission, a further audio alert, or warning signal

用作警报器。 As a siren.

[0011] 当监视人体的生理或神经条件时,附着的微电子系统配戴起来尽可能舒适是十分重要的,特别是当携带器件的人不是卧床不起的并表示正常的身体活动或者甚至类似在运动或运动医学中表示过量的身体活动时尤其如此。 [0011] When monitoring the body's physiological or neurological conditions, microelectronic systems attached to wear them as comfortable as possible is very important, regular physical activity is similar to or even especially when carrying the device and that people are not bedridden This is especially true when represents an excess of physical activity in sports or sports medicine. 优选用户应感觉不到附着的微电子系统,并且优选监视应保持秘密的。 The user should feel the microelectronic system is preferably not attached, and preferably should be kept secret monitoring. 但是,在这方面,已知的微电子系统如下所述存在几种主要的缺点。 However, in this regard, as known in the microelectronic system several major drawback.

[0012] 通过吸留的压敏粘合剂附着到皮肤上常由于水分的吸留并由于诸如来自压敏粘合剂聚合物系统、例如来自例如丙烯酸粘合剂的单体的剌激物导致皮肤剌激。 [0012] By adhering the pressure-sensitive adhesive to the skin is occluded often due to moisture absorption since the left and from the pressure-sensitive adhesive polymer systems such as, for example, irritants such as from an acrylic adhesive monomer results skin irritation. 剌激可以为发痒和红斑的形式,并且,当粘合剂器件被长时间附着时特别可能发展。 Stimulation may be in the form of itching and erythema, and, when the adhesive device is attached particular time may develop. 吸留还可增加产生对于粘合剂成分的过敏性反应的风险。 Storage also increases the risk of allergic reactions to the binder component. 解决吸留的负面影响的一种常用的方式是使用微孔带,但这种微孔带基本是二维的并且较薄并且不保护微电子系统免受由于与衣服等摩擦导致的剪切力。 A common way to address the negative effects of occlusion is the use of a microporous tape, but the tape is substantially two-dimensional microporous and thin and does not protect the microelectronic system from damage due to shearing forces caused by friction with the clothes .

[0013] 在以上的参照文献中,器件作为大块部分通过承载微电子系统的薄的平面粘合剂层被附着到皮肤上,从而导致携带器件的病人或其他人由于坚硬或与衣服摩擦而感觉不舒服,并增加无意中从皮肤脱开的风险。 [0013] In the above reference documents, as the bulk portion of the device is attached to the skin by a thin adhesive layer bearing a planar microelectronic system, leading to a patient or other person carrying the device due to friction of clothes or hard feel uncomfortable and increase the risk of inadvertently disengaged from the skin. 当这种器件要被长时间使用时,减小由于皮肤剌激或携带大块器件的不方便导致的任何类型的不适是十分重要的。 When such a device is to be used for a long time, since the reduced skin irritation or inconvenient to carry any type of discomfort due to bulk devices is very important. 并且,粘合剂器件保持固定到皮肤上直到被故意取下对于信号检测来说是关键的。 And, adhesive retaining means secured to the skin until it is intentionally removed for signal detection is critical.

[0014] 器件的适当的粘合需要平面粘合剂的相当厚的层。 A relatively thick layer of [0014] suitable adhesive device needs to be planarized adhesive. 但是,相当厚的层可表现出在边缘上粘合到衣服或亚麻布上的趋势,并且,通过这样做,会产生滚动和脱开的倾向。 However, relatively thick layer may exhibit an upper edge of the adhesive to the clothes or linen trend, and, by doing so, a rolling tendency will and disengaged. [0015] 许多传感器通过导线与监视系统连接。 [0015] Many sensors are connected by wires to the monitoring system. 这种系统的不利之处在于,由于导线被附着到身体上的传感器上并与监视系统连接,因此病人不能自由移动。 The disadvantage of this system is that, since the wires are attached to the sensor body and connected to the monitoring system, so the patient can not move freely. 每当病人希望移动时, 他必须非常仔细以避免移去附着到传感器上的导线中的任一个,并且他必须进一步拾取监视系统并随身携带它。 Whenever the patient wishes to move he must be removed very carefully in order to avoid a lead attached to any of the sensors, and he must further pick up the monitoring system and carry it.

[0016] 上述参考文献中都没有如本发明那样说明模压或铸造成其中嵌入微电子系统的三维粘合剂体的、由任选包含热塑性压敏粘合剂和/或化学固化压敏粘合剂的水解胶体组成的身体传感器器件。 [0016] The above references are not as described above according to the present invention is molded or cast into a microelectronic system embedded in a three-dimensional adhesive body, the pressure-sensitive adhesive optionally containing a thermoplastic and / or chemical curing pressure-sensitive adhesive body sensor device hydrocolloid agent composition.

[0017] 关于器件的粘合剂部分,克服上述缺点中的一些的已知的传感器制造起来不象本发明的粘合剂器件那样简单和便宜。 [0017] About the adhesive portion of the device, to overcome the above disadvantages of some known sensor manufacture is not as simple and inexpensive as the adhesive device of the present invention.

[0018] 其中嵌入微电子系统的本发明的粘合剂器件制造起来相对容易,并且,除了覆盖 [0018] The microelectronic system embedded in the adhesive device of the present invention is relatively easy to manufacture, and, in addition to covering

层和任选的释放层以外,器件不需要任何其它的层,因此在商业上是十分有吸引力的。 Outside layer and optionally a release layer, the device does not require any other layer, thus commercially very attractive.

[0019] 嵌入微电子部件时,还可更好地避免机械损伤和水分从周围环境的渗透。 [0019] When embedded microelectronic components, and also to better prevent water penetration and mechanical damage from the surrounding environment.

[0020] 并且,当前许多类型的电子器件被临时附着到不同的表面上。 [0020] Further, many current types of electronic devices are temporarily attached to different surfaces. 特别是在医疗护理 Especially in health care

中,为了例如检测不同的生物医学信号或从病人取回样品,诸如探针和传感器的不同类型的医疗器件被附着到皮肤的不同区域上。 In order to detect different e.g. biomedical signal or retrieved from a patient sample, such as probes and sensors of different types of medical devices are attached to different areas of the skin. 这些医疗器件常仅被附着有限的时间直到疾病被诊断或病人的健康得到改善。 These medical devices often attached only a limited period of time until the disease is diagnosed or to improve the health of the patient. 但是,一些慢性疾病可能需要定期监视,例如当病人在休眠中时,或者,在一些情况下,希望日夜进行恒定的监视。 However, some chronic diseases may require periodic monitoring, such as when a patient in hibernation, or, in some cases, it is desirable for constant monitoring of day and night. 被附着到病人的皮肤上的医疗器件可适于检测许多类型的信号,它例如是用于检测诸如肌电图(EMG)信号、心电图(ECG)信号、脑电图(EEG)信号的一种或更多种信号的传感器。 Is attached to the medical device on the patient's skin may be adapted to detect many types of signals, such that for example, a method of detecting electromyography (EMG) signals, electrocardiogram (ECG) signals, electroencephalogram (EEG) signals for or more sensor signals.

[0021] 这些医疗器件可被分成至少三种一般的元件:用于测量诸如生物信号的希望的值的微电子元件;用于将微电子元件附着到表面上的粘合剂;和用于向微电子电路的至少一部分供电的电源。 [0021] The medical devices may be divided into at least three general components: a microelectronic element such as a desired biological measurement signal; means for microelectronic element attached to the adhesive on the surface; and means for the at least a portion of the power supply to the microelectronic circuit.

[0022] 不同的元件具有不同的寿命,但是,由于元件一般被组装到一个不可分的单元中,因此在使用后它们被一起处理掉。 [0022] The different elements having different life, however, since the elements are generally assembled into one inseparable unit, so after use they are disposed of together. 但是,当单独地察看各元件时,可以理解,它们具有不同的寿命。 However, when viewing each element individually, it is understood that they have different lifetimes. 因此,粘合剂元件一般仅为一次性使用。 Thus, the adhesive member is generally only one-time use. 电源可在一些情况下根据电池的应用和尺寸被再使用几次。 Power source may be reused several times in some cases, depending on the application and the size of the battery. 但是,微电子元件可被再使用许多次,由此在仅使用一次后就处理掉使其成为昂贵的元件。 However, the microelectronic element may be re-used many times, thereby disposed of after one use only makes it expensive components.

[0023] 因此,为了提高医疗器件的成本效率,需要能够重新使用在使用后仍可工作的元件。 [0023] Accordingly, in order to improve the cost efficiency of the medical device, the need still work element can be reused after use.

[0024] US 2002/0180605公开了一种监视生理特性的方法。 [0024] US 2002/0180605 discloses a method of monitoring physiological characteristics. 所公开的方法可包含以下的连续的步骤:从传感器模块去除粘合剂垫,以及,在数据已从传感器模块被转移到接收器模块后,在用于消毒的高压灭菌器中加热传感器模块。 The method disclosed may comprise the following successive steps: removing the adhesive pad, and, after the data is transferred from the sensor module to the receiver module, is heated in an autoclave for sterilization sensor module from the sensor module .

发明内容 SUMMARY

[0025] 因此,本发明涉及一种包含微电子感测系统的三维粘合剂器件,其特征在于, [0025] Accordingly, the present invention relates to a three-dimensional adhesive device comprising a microelectronic sensing system, wherein,

[0026] (a)具有上表面和底表面的由压敏粘合剂制成的三维粘合剂体; [0026] (a) a three-dimensional adhesive body made of a pressure sensitive adhesive surface and a bottom surface;

[0027] (b)被嵌入压敏粘合剂的体部中的微电子系统; [0027] (b) a microelectronic system embedded in the body portion of the pressure-sensitive adhesive;

[0028] (c)被附着到上表面上的一个或更多个覆盖层;禾口 [0028] (c) is attached to one or more of the upper surface of the cover layer; Wo port

[0029] (d)任选地,可释放地附着到粘合剂器件的底表面上的释放衬里。 [0029] (d) optionally can be releasably attached to the release liner on the bottom surface of the adhesive device.

[0030] 适当地,微电子系统是微电子感测系统。 [0030] Suitably, the microelectronic system is a microelectronic sensing system. 该微电子感测系统适当地能够感测诸如 The microelectronic sensing system capable of sensing, such as a suitably

压力、振动、声音、电活动(例如,从肌肉活动)、张力、血流、水分、温度、酶活性、细菌、pH值、 Pressure, vibration, sound, electrical activity (e.g., from muscle activity), tension, blood flow, moisture, temperature, enzyme activity, bacteria, pH,

血糖、导电率、电阻、电容、电感或其它化学、生物化学、生物学、机械或电气输入的物理输入。 Blood glucose, physical input electrical conductivity, resistance, capacitance, inductance or other chemical, biochemical, biological, mechanical or electrical input.

附图说明 BRIEF DESCRIPTION

[0031] 图l表示根据本发明的粘合剂器件的典型表示的形状的模具断面。 [0031] Figure l showing the shape of the mold according to an exemplary representation of the device of the present invention the adhesive section. CT是器件的最大厚度,PT是器件的周缘的厚度。 CT is the maximum thickness of the device, PT is the thickness of the periphery of the device.

[0032] 图2示出嵌入/集成到三维(3D)粘合剂中的微电子系统。 [0032] FIG. 2 shows embedded / integrated into a three-dimensional (3D) binder microelectronic system. 縮放框表示图3、图4、图5、图6、图7、图8、图9、图10、图11和图12所示的粘合剂器件的一部分。 Zoom box said, a portion of FIG. 3, 4, 5 6, 7, 8, 9, 10 and 11 of the adhesive device 12 shown in FIG. [0033] 图3示出完全集成到粘合剂体内的微电子系统(影线框)。 [0033] Figure 3 shows a fully integrated into the adhesive body of the microelectronic system (hatched box).

[0034] 图4示出微电子系统的多个部分可在不同的位置被集成到粘合剂器件内,使得这些部分之间具有适当的机械或电气互连。 A plurality of [0034] FIG. 4 shows a portion of the microelectronic system may be integrated into different locations within the adhesive device, so as to have a suitable mechanical or electrical interconnection between the parts.

[0035] 图5示出被施加到粘合剂体内的凹槽中的微电子系统。 [0035] Figure 5 illustrates a microelectronic system is applied to the recess in the adhesive body. 凹槽是皮肤固定区的远端。 Groove distal the fixed area of ​​skin. 微电子系统可任选地是可互换的或可再使用的。 The microelectronic system may optionally be exchangeable or reusable.

[0036] 图6示出上部可互换或可再使用并且下部被永久集成到粘合剂体内的微电子系统。 [0036] FIG. 6 illustrates a reusable or interchangeable upper portion and the lower portion is permanently integrated into the adhesive body of the microelectronic system.

[0037] 图7示出微电子系统的多个部分可在不同的位置位于粘合剂器件内,使得这些部分之间具有适当的机械或电气互连。 A plurality portions [0037] FIG. 7 illustrates a microelectronic system may be located within the adhesive device at different positions, so as to have a suitable mechanical or electrical interconnection between the parts.

[0038] 图8示出被嵌入/施加到粘合剂体的粘合剂侧的凹槽内的微电子系统。 [0038] FIG. 8 illustrates embedded / applied into a recess in the microelectronic system adhesive side of the adhesive body.

[0039] 图9示出具有下部可互换或可再使用并且上部被永久集成到粘合剂体内的微电 [0039] FIG. 9 shows a reusable or interchangeable lower portion and the upper portion is permanently integrated into the adhesive body Microelectronics

子系统的器件。 Devices subsystem.

[0040] 图10示出一些微电子部件(小影线框)在制造过程中被集成到粘合剂体内并且一些微电子部件在以后被施加由此建立必要的机械/电气连接的系统。 [0040] FIG. 10 illustrates some microelectronic components (small hatched box) are integrated into the adhesive body during the manufacturing process and some of the microelectronic components are applied to create a system whereby the necessary mechanical / electrical connection in the future.

[0041] 图11示出被嵌入粘合剂内的微电子系统,该系统从粘合剂体的远端侧和皮肤固定侧均是可施加和可达到的。 [0041] FIG. 11 illustrates a microelectronic system embedded within the adhesive, the system can be applied and are achievable from the distal end side and fixed-side skin adhesive body.

[0042] 图12示出微电子系统由两个部分组装的系统,这两个部分中的一个或每一个可以是可互换的或可再使用的。 [0042] FIG. 12 illustrates a microelectronic system consists of two parts assembled system, one of the two portions or each may be exchangeable or reusable.

[0043] 在本发明的所有以上结构中,不管上表面上是否存在微电子系统的部件,上表面均保持平滑。 [0043] In all the above structure of the present invention, the presence or absence of components of the microelectronic system regardless of the upper surface, the upper surface remain smooth. 可以通过微电子部件的适当构建、封装等实现这一点。 Can be constructed by suitable microelectronic components, packaging and the like to achieve this.

[0044] 图8、图9、图10、图ll和图12所示的结构特别适于包含例如应具有皮肤接点的电极的元件的微电子系统。 [0044] FIG. 8, FIG. 9, FIG. 10, the structure shown in FIG. 12 and FIG ll particularly suitable system comprises a microelectronic element, for example, should have a skin contact electrode.

[0045] 图13〜18示出本发明的实施例,这里,天线、中央处理单元、电池和电极被嵌入粘合剂器件内。 [0045] FIG. 13~18 shows an embodiment of the present invention, here, an antenna, a central processing unit, a battery and electrodes are embedded within the adhesive device. 图13示出器件的二维形状,由AA指示断面。 Figure 13 shows a two-dimensional shape of the device, indicated by the cross-section AA. 在图15中,第三维被示为断面AA。 In Figure 15, the third dimension is shown as a cross section AA. 从器件的边缘的圆B在图16中被进一步放大,并且中心的圆C类似地在图17中被放大。 From the circular edge of the device B is further enlarged in FIG. 16, and the center of the circle C is enlarged similarly in FIG. 17. 图14示出位于粘合剂器件的外部并与微电子系统的中心部分连接的天线的位置。 FIG 14 shows the position of the antenna is located outside of the adhesive device and connected to the center portion of the microelectronic system. 图16更详细地表示被平放嵌入粘合剂内的天线的构建。 FIG 16 is shown in greater detail in the flat antenna embedded in the adhesive construct. 图l 7表示具有电池、CPU和伸出粘合剂的电极的微电子系统的中心部分的位置。 FIG. L 7 denotes a battery, and the position of the central portion of the microelectronic system CPU projecting electrode binder. 电池和CPU被包封在透明的硅酮橡胶内。 CPU and a battery encapsulated in a transparent silicone rubber. 最后,图18以三维模式示出粘合剂器件。 Finally, FIG. 18 shows a three-dimensional adhesive device mode.

[0046] 图19表示在透视分解图中看到的根据本发明的传感器组件的一个实施例。 [0046] FIG. 19 shows an exploded perspective view seen in the figures, according to one embodiment of the sensor assembly of the present invention. [0047] 图20表示沿图19中的线XX-XX的断面图中的传感器组件的实施例。 [0047] FIG. 20 shows an embodiment of a sectional view of the sensor assembly line XX-XX in FIG. 19 along. [0048] 图21表示从底端看到的传感器组件的实施例。 [0048] FIG. 21 shows an embodiment of a sensor assembly seen from the bottom.

[0049] 图22a和图22b表示根据本发明的器件的另一实施例,其中,图22b以放大图表示图22a的一部分。 [0049] Figures 22a and 22b showing another embodiment of a device according to the present invention, wherein FIG. 22b showing an enlarged portion of FIG. 22a, FIG.

[0050] 图23表示在透视图中看到的根据本发明的器件的另一实施例。 [0050] FIG. 23 shows in a perspective view seen according to another embodiment of the device of the present invention.

[0051] 图24表示沿图23中的线XXIV-XXIV的断面图中的根据本发明的器件的实施例。 [0051] FIG. 24 shows an embodiment sectional view of the line XXIV-XXIV in FIG. 23 along the device according to the present invention.

具体实施方式 Detailed ways

[0052] 本发明涉及具有被嵌入由压敏粘合剂制成的粘合剂体中的微电子系统的粘合剂器件。 [0052] The present invention relates to adhesive device having a microelectronic system is embedded in the adhesive body made of a pressure sensitive adhesive.

[0053] 以下,当限定例如粘合剂体或器件的元件时使用的术语"三维"是指当在断面中观察时轮廓变化相当大的元件。 [0053] Here, the term "three-dimensional" when defining elements such as an adhesive or device refers change in profile when viewed in cross-section in a considerable element. 因此,例如,三维粘合剂体将具有最大厚度和最小厚度。 Thus, for example, a three-dimensional adhesive body having a maximum thickness and a minimum thickness. 根据本发明,最大厚度将为最小厚度的至少两倍。 According to the present invention, the maximum thickness will be at least twice the minimum thickness. 在优选实施例中,粘合剂器件的外边缘或周缘 Embodiment, the outer edge or periphery of the adhesive device of the preferred embodiment

9的厚度小于传感器的最厚部分(一般为中心部分)的厚度的一半。 Thickness of less than half the thickness of the thickest part of the sensor 9 (generally central portion).

[0054] 与术语"三维"相反,当限定元件时使用的术语"二维"是指具有一般平整的表面 [0054] The term "three-dimensional" Conversely, the term "two-dimensional" when used herein refers to defining member having a general planar surface

的元件。 Elements. 因此,二维粘合剂体的最大厚度小于粘合剂体的最小厚度的两倍。 Thus, the maximum thickness of the two-dimensional adhesive body is less than twice the minimum thickness of the adhesive body.

[0055] 如这里使用的那样,关于微电子系统或其部件,术语"嵌入"意味着粘合剂体的压 [0055] As used herein, as, on the microelectronic system or components thereof, the term "embedded" means that the pressure adhesive body

敏粘合剂部分或全部包围微电子系统的全部或一些部件。 All or some of the components sensitive adhesive partially or fully surround the microelectronic system. 因此,术语"嵌入"包含系统或部 Thus, the term "embedded" system or unit comprising

件的所有边被粘合剂体的粘合剂覆盖的情况,并且还包含这样一种情况,即,嵌入的物品不 All edges where the adhesive is covered by the adhesive body member, and further comprising a case, i.e., the article is not embedded

是所有各边都被粘合剂体的粘合剂覆盖,例如,物品被放在粘合剂体中的凹槽或空腔中并 All the sides are covered with an adhesive of the adhesive body, e.g., the adhesive article is placed in a recess or cavity in the body and

且是可从外面到达的。 And it is reachable from the outside.

[0056]"嵌入"是用于说明微电子系统位于粘合剂体内的方式的一般术语,而术语"集成" 意味着微电子系统或其特定部件在所有各边上都被粘合剂覆盖,并且,当微电子系统仅被部分覆盖时使用术语"施加"。 [0056] "embedded" is located in the microelectronic system for explaining a general term of the embodiment of the adhesive body, and the term "integrated" means that the microelectronic system or specific components of the adhesive are each covered on all sides, Also, the term "applied" when used microelectronic system is covered only partially.

[0057] 在所有各边上集成和覆盖还包含这样一种情况,S卩,集成的部件例如以电气或其它的方式连接到嵌入粘合剂体内的另一部件上。 [0057] Integrated further comprising a cover and the case where all the respective sides, S Jie, integrated components, such as electrically or otherwise connected to the other member embedded in the adhesive body.

[0058] 如这里使用的那样,微电子"感测"系统意味着包含具有能够检测生理或神经条件的元件的换能器的微电子系统。 [0058] As used herein as a microelectronic "sensing" system means comprises a transducer capable of detecting element having a physiological or neurological conditions of the microelectronic system.

[0059] 如这里使用的那样,通孔意味着在粘合剂体的上表面上具有开口并且在粘合剂体的底表面上具有开口的穿过粘合剂体的孔。 [0059] As used herein, the through-hole means having an opening on the upper surface of the adhesive body and the adhesive body having a hole opened on the bottom surface of the adhesive body. 优选地,通孔在粘合剂体的上表面上具有一个开口并在底表面上具有一个开口。 Preferably, a through hole having an opening and having an opening in the bottom surface of the upper surface of the adhesive body. 通孔可具有任意适当的形状。 Through-holes may have any suitable shape.

[0060] 粘合剂器件的"厚度"意味着可在上表面上的特定点到底表面上的点之间画出的 [0060] "thickness" means that a particular point of the adhesive device on the upper surface in the end drawn between the points on the surface of the

最短线或可在底表面上的特定点到上表面上的点之间画出的最短线的长度。 Specific point or shortest line length shortest line drawn between the points on the surface to the surface on the bottom.

[0061 ] 对于本发明,表达"皮肤"被用于表示哺乳动物的外表面。 [0061] For the present invention, the expression "skin" is used to denote the outer surface of the mammal.

[0062] 如上所述,很惊奇地发现,微电子部分被嵌入三维形状的压敏粘合剂体中的无线微电子系统解决已知的传感器器件的问题。 [0062] As described above, it is surprisingly found that a three-dimensional shape of the microelectronic portion is embedded in the pressure-sensitive adhesive body of a radio system to solve the problem known in the microelectronic sensor device.

[0063] 由于三维压敏粘合剂的性能,产生对微电子系统的最佳保护。 [0063] Since the three-dimensional properties of the pressure-sensitive adhesive, resulting in optimal protection of the microelectronic system. 粘合剂向皮肤表面提供密封,并且,由于粘合剂器件顶端的聚合物覆盖层,因此粘合剂器件得到保护免受外面的液体影响。 Adhesive provides a seal to the skin surface, and, since the polymer cover layer to the top of the adhesive device, and therefore be protected from the liquid adhesive device outside influence. 并且,粘合剂保护嵌入的微电子部分免受机械损伤。 And, embedded in the adhesive protected from mechanical damage microelectronic portion.

[0064] 根据本发明的粘合剂体由三维形状的压敏粘合剂制成,从粘合剂体的中心到边缘具有变化的厚度,并适当地在粘合剂体最厚的位置具有嵌入粘合剂体内的微电子感测系统。 [0064] The adhesive of the present invention is made of a three-dimensional shape of the pressure-sensitive adhesive having a pressure-sensitive adhesive body varies from the center to the edge thickness, and suitably has body adhesive thickest location embedded in the adhesive body of the microelectronic sensing system.

[0065] 具有这种形状并适当地具有斜面边缘的器件提供与皮肤的平滑界面。 [0065] and suitably has such a shape provided with a device having a bevel edge smoothing skin interface. 粘合剂器件将提供柔和的感觉并且将不趋于与衣服和亚麻布发生摩擦。 The adhesive device will provide a soft feel and does not tend to friction with the clothes and linen occur. 特殊的优点在于,粘合剂器件将不容易由于笨重和边缘的粘性无意中脱落。 Particular advantage is that the adhesive device bulky and not easy due to the viscosity of unintentionally falling edge. 这对于器件的真正功能是十分重要的。 This is the real function of the device is very important. [0066] 并且,由于粘合剂体具有作为将器件固定到皮肤的手段、微电子系统的保护手段和用于将器件成形为方便的形状的手段的三重功能,因此粘合剂器件的结构十分简便。 [0066] Further, since the adhesive has as a means of fixing the device to the skin, the microelectronic system and means of protection for the device as a means of forming a triple convenient shape function, the structure of the adhesive device is easy. 该结构在三维器件的组装中需要较少的部件和工艺步骤,因此成本不高并且更易于制造。 The three-dimensional structure in the assembly of the device requires fewer parts and process steps, and therefore inexpensive and easier to manufacture. [0067] 根据本发明的一个实施例,三维粘合剂体具有适于粘合到哺乳动物的体表面上的基本上平整的底表面和平滑的上表面。 [0067] According to an embodiment of the present invention, adapted to a three-dimensional adhesive body bonded to a mammal having a substantially planar bottom surface and the surface of the smooth upper surface. 粘合剂器件适当地在体部的中心部分最厚并在体部的边缘最薄。 Suitably the adhesive device at the edge of the thickest and thinnest at the central portion of the body portion of the body portion.

[0068] 优选地,上表面具有平滑的凸形表面,但它原则上可采取任何形式。 [0068] Preferably, the upper surface having a smooth convex surface, but it may in principle take any form. [0069] 粘合剂器件的外边缘或周缘必须被成形为厚度小于传感器的最厚部分( 一般为中心部分)的厚度的一半。 [0069] The outer edge or periphery of the adhesive device must be formed in the thickest part of the sensor is smaller than a thickness (generally a central portion) of the half of the thickness.

[0070] 因此,在本发明的另一实施例中,粘合剂器件在边缘上的厚度小于粘合剂器件在其最厚位置上的厚度的50% ,适当地,边缘上的厚度小于粘合剂器件在其最厚位置上的厚度的25%,优选地,边缘上的厚度小于粘合剂器件在其最厚位置上的厚度的10%,并且,最优选地,边缘上的厚度小于粘合剂器件在其最厚位置上的厚度的5%。 [0070] Thus, in another embodiment of the present invention, the thickness of the adhesive device on the edge is less than 50% of the thickness of the adhesive device at its location on the thickest, suitably, less than the thickness of the adhesive on the edge 25% of the thickness of the adhesive device at its thickest location, preferably, the edge thickness of less than 10% of the thickness of the adhesive device at its thickest location, and, most preferably, less than the thickness of the edge 5% of the thickness of the adhesive device at its thickest position.

[0071] 粘合剂器件在边缘上的厚度一般小于0.4mm。 [0071] The thickness of the adhesive device on the edge is typically less than 0.4mm. 在一个实施例中,该厚度可以为0. 01〜0. 4mm。 In one embodiment, the thickness may be 0. 01~0. 4mm. 适当地,粘合剂器件在边缘上的厚度大于0. 05mm,优选为0. 05〜0. 4mm。 Suitably, the thickness of the adhesive device on the rim is greater than 0. 05mm, preferably 0. 05~0. 4mm. [0072] —般地,粘合剂器件的厚度为0. 5〜15mm,更适当地,在一般但不必地在粘合剂体的中心处最厚的情况下为1〜5mm。 [0072] - the thickness of the camel, the adhesive device is 0. 5~15mm, more suitably, in general but not necessarily at the center of the adhesive body is thickest case 1~5mm.

[0073] 适当地,粘合剂器件的底表面和从底表面的周边的任意点到上表面处粘合剂体最厚位置上的点画出的线之间的角度小于60度,优选小于45度,并且最优选小于30度。 [0073] Suitably, the angle between the bottom surface of the adhesive device and from any point of the periphery of the bottom surface to the thickest point on the adhesive surface at a line drawn less than 60 degrees, preferably less than 45 degrees, and most preferably less than 30 degrees. [0074] 粘合剂体的外边缘可适当被成形为具有或没有瓣或凸起的圆形或椭圆形,或者它可以成形为矩形或三角形以获得尽可能方便和安全的器件。 [0074] The outer edge of the adhesive body may be suitably shaped to have projections or lobes or without a circular or elliptical, or it may be rectangular or triangular shaped devices are possible to obtain a convenient and safe.

[0075] —般地,粘合剂体的周缘将包含粘合剂体的粘合剂。 [0075] - the peripheral edge of the camel, the adhesive body comprising an adhesive of the adhesive body. 但是,可存在微电子系统或其 However, there may be the microelectronic system or

部件被放在周缘内/或上的实施例,由此,周缘不只包含粘合剂体的粘合剂。 Example member is placed in the inner periphery / or on, whereby the adhesive binder contains not only the peripheral edge thereof.

[0076] 制成三维粘合剂体的压敏粘合剂适当地为可塑的热塑性或化学固化的压敏粘合 [0076] The three-dimensional adhesive body made of a pressure-sensitive adhesive suitably mouldable thermoplastic or chemically curing pressure-sensitive adhesive

剂,该压敏粘合剂具有使得粘合剂器件能够符合身体部位的曲率同时即使在移动条件下也 Is used, the pressure sensitive adhesive has such an adhesive means can be in line with the curvature of body parts while also moving even under conditions

保持其粘合性能的柔性。 Retain the flexibility of the adhesive properties.

[0077] 适当地,制成粘合剂体的压敏粘合剂是基于聚合物的粘合剂,这些聚合物选自诸 [0077] Suitably, the pressure sensitive adhesive made of the adhesive body is an adhesive based on a polymer, which polymer is selected from various

如苯乙烯嵌段共聚物和氢化苯乙烯嵌段共聚物的嵌段共聚物、无定形聚a烯烃(APAO)、聚 Block copolymers such as styrene block copolymers and hydrogenated styrene block copolymer, amorphous poly-a-olefins (APAO), poly

丙烯酸、聚乙烯醚、聚氨酯、聚乙烯基乙酸酯、硅酮或水凝胶压敏粘合剂的组。 Acrylic acid, polyvinyl ether group, a polyurethane, polyvinyl acetate, silicone pressure sensitive adhesive or gel water.

[0078] 基于这些聚合物的压敏粘合剂是公知的,并且本领域技术人员知道如何制备基于 [0078] These pressure-sensitive adhesives based on polymers are well known, and those skilled in the art will know how to prepare based

这些聚合物的粘合剂。 These adhesive polymers.

[0079] 诸如苯乙烯嵌段共聚物和氢化苯乙烯嵌段共聚物的嵌段共聚物可适当地选自苯乙烯/乙烯-丁烯/苯乙烯(SEBS)、苯乙烯/异戊二烯/苯乙烯(SIS)和苯乙烯/乙烯-丙烯/苯乙烯(SEPS)。 [0079] block copolymers such as styrene block copolymers and hydrogenated styrene block copolymer may suitably be selected from styrene / ethylene - butene / styrene (SEBS), styrene / isoprene / styrene (SIS) and styrene / ethylene - propylene / styrene (SEPS).

[0080] 粘合剂也可基于P匿S(聚二甲基硅氧烷),并可适当地为PDMS凝胶。 [0080] The adhesive may also be based anonymous P S (polydimethylsiloxane), and may be suitably PDMS gel.

[0081] 水凝胶粘合剂也可基于或包含amfifilic聚合物、聚乙烯吡咯烷酮、聚乙烯醇、聚 [0081] The hydrogel adhesive may also be based on or comprise amfifilic polymers, polyvinylpyrrolidone, polyvinyl alcohol, poly

环氧乙烷、明胶、天然树胶和纤维素衍生物或它们的任意组合。 Ethylene oxide, gelatin, natural gums and cellulose derivatives or any combination thereof.

[0082] 压敏粘合剂可根据这些原理并基于在Donatas Satas的手册:Handbook of pressure sensitive adhesive technology, Third edition中列出禾口公开的聚合物被配制。 [0082] The pressure sensitive adhesive may be in accordance with these principles and based on manual Donatas Satas: Handbook of pressure sensitive adhesive technology, Third edition listed polymers disclosed in Wo port are formulated.

[0083] 在本发明的一个特定的实施例中,制成粘合剂体的压敏粘合剂包含水解胶体。 [0083] In a particular embodiment of the present invention, the pressure sensitive adhesive made of the adhesive body comprises hydrocolloids. 包含水解胶体的压敏粘合剂可以是上述类型的压敏粘合剂中的任一种或本领域公知的任何其它压敏粘合剂。 The pressure-sensitive adhesive comprising hydrocolloids may be any type of the above-mentioned pressure-sensitive adhesive known in the art, or any other pressure sensitive adhesive.

[0084] 因此,美国专利No. 3339549公开了诸如聚异丁烯的橡胶弹性体和诸如果胶、明胶和羧甲基纤维素的粉状混合物的一种或更多种水溶性或水可膨胀的水解胶体的混合。 [0084] Thus, U.S. Patent No. 3339549 discloses a rubber such as polyisobutylene and the elastomer, such as a powdery mixture of pectin, gelatin and carboxymethylcellulose or more water soluble or water swellable hydrolysis of mixed colloid. 粘合剂块具有施加到一个表面上的不溶于水的膜。 Is applied to the adhesive mass has a water-insoluble film on the surface. 这种类型的成分可在商业上从ER Squibb & This type of composition may be commercially from ER Squibb &

11Sons Inc.按商标"Stomahesive"得到,并被用作气孔周围的皮肤阻挡剂以防止由气孔排出的腐蚀性流体损坏皮肤。 11Sons Inc. under the trademark "Stomahesive" obtained, and is used as a skin barrier around the stoma agent to prevent corrosive fluids discharged by the stoma skin damage.

[0085] 在这种类型的粘合剂成分中,聚异丁烯负责提供粘合性能,并且分散的水解胶体 [0085] In this type of the binder component, the polyisobutylene is responsible for providing adhesive properties and the dispersed hydrocolloid

粉末吸收流体并使得粘合剂还能够粘合到湿的皮肤上(湿粘性)。 Powders absorb fluid and such that the adhesive can also be bonded to the wet skin (wet tack). 这些成分作为用于皮肤 As these ingredients to the skin

溃疡、烧伤和其它的外渗伤口的创伤敷料也得到越来越多的接受。 Ulcers, burns and other wounds extravasation wound dressing also been more and more accepted.

[0086] 在大量的实施例中,在大量的专利文献中公开的苯乙烯共聚物被加入。 [0086] In a large number of embodiments, styrene copolymers disclosed in numerous patent literature is added.

[0087] 因此,Sorensen等人的美国专利No. 4231369公开了包含在其中分散了水溶性水 [0087] Thus, Sorensen et al U.S. Patent No. 4231369 discloses a composition comprising water having dispersed therein a water-soluble

解胶体树胶的苯乙烯共聚物和增粘剂的造口术皮肤阻挡剂。 Styrene hydrocolloid gum and a tackifier agent ostomy skin barrier.

[0088] 在美国专利No. 4367732中,Poulsen等人公开了包含分散于包含苯乙烯共聚物、 碳氢化合物增粘剂和增塑剂的连续相中的水溶性水解胶体、抗氧化剂和油质增充剂的造口术皮肤阻挡剂。 [0088] In the U.S. Pat. No. 4367732, Poulsen, et al., Discloses a styrene copolymer comprising dispersed in the water-soluble hydrocolloid discontinuous phase a hydrocarbon tackifier and a plasticizer, an antioxidant, and an oily extenders ostomy skin barrier agent.

[0089] 美国专利No. 4551490 (Doyle等人)公开了包含5〜30%的一种或更多种聚异丁烯、3〜20%的双嵌段(diblock)共聚物的含量低于20%的一种或更多种苯乙烯基团或嵌段共聚物、矿物油、一种或更多种水溶性水解胶体树胶和增粘剂的均匀混合物的医疗级压敏粘合剂成分。 [0089] U.S. Patent No. 4551490 (Doyle et al.) Discloses a composition comprising 5~30% or more of polyisobutylene, diblock content of 3~20% (Diblock) copolymer is less than 20% one or more block copolymers or styrene group, a mineral oil, one or more medical grade pressure sensitive adhesive component soluble hydrocolloid gum and a tackifier homogeneous mixture of. 一种或更多种水可膨胀的粘性增强剂、抗氧化剂和各种其它任选的成分也可被包含于粘合剂成分内。 One or more water-swellable viscosity enhancing agents, antioxidants, and a variety of other optional ingredients may also be included in the binder component.

[0090] 美国专利No. 5492943公开了包含两种粘弹性粘合剂弹性体、具体而言为高分子量聚异丁烯和苯乙烯嵌段共聚物的混合物的压敏粘合剂成分,该混合物与增塑剂(优选为矿脂)和适当的增粘剂和抗氧化剂一起形成其中分散了诸如羧甲基纤维素钠和果胶的水解胶体的连续相。 [0090] U.S. Patent No. 5492943 discloses comprising two viscoelastic adhesive elastomers, specifically, a mixture of poly-isobutylene-styrene block copolymer and the high molecular weight pressure sensitive adhesive component, and the mixture was increased plasticizer (preferably petrolatum) and a suitable tackifier and antioxidant together form a continuous phase wherein the dispersed hydrocolloids such as sodium carboxymethylcellulose and pectin.

[0091] 在美国专利No. 4867748中,Samuelsen公开了由与背衬膜组合的水解胶体粘合剂制成的密封垫的几何结构及其处理。 [0091] In the U.S. Pat. No. 4867748, Samuelsen disclosed geometric structure made of the backing film composition hydrocolloid adhesive and seal process.

[0092] 在美国专利No. 5492943中公开的粘合剂成分被描述为用于将造口术用具粘合到 [0092] disclosed in U.S. Patent No. 5492943 in the binder component is described for the ostomy appliance adhered to

皮肤上的晶片,并且通过包含具有更高含量的双嵌段共聚物的苯乙烯嵌段共聚物与已知的 Wafer on the skin, and by double-styrene block copolymer comprising a block copolymer having a higher content of the known

成分不同,从而完全避免使用低分子量聚异丁烯并优选地不包含明胶。 Different components, thereby completely avoiding the use of low molecular weight polyisobutylene and preferably does not contain a gelatin.

[0093] 包含水解胶体的压敏粘合剂的特征在于具有分散于粘合剂相中的水解胶体的微 [0093] wherein the pressure-sensitive adhesive comprising hydrocolloids that have a micro hydrocolloid dispersed in a binder phase of

粒相,它是粘合剂的特别合适的组。 Particulate, which is particularly suitable group of adhesives. 包含水解胶体的粘合剂可从皮肤吸收水分,避免皮肤的 Adhesive comprises hydrocolloids capable of absorbing moisture from the skin to prevent skin

阻塞,同时维持其对皮肤的粘合性能。 Blocking, while maintaining its adhesive property to the skin. 并且,包含水解胶体的粘合剂体可具有任意的厚度并 Further, the adhesive comprises hydrocolloids may have any thickness and

仍具有不吸留的性能。 Still has not occluded performance. 水解胶体粘合剂由于热熔性可被处理并且很容易模压为特定的形状。 Because hydrocolloid adhesives can be hot melt processed and easily molded into a particular shape.

[0094] 这意味着,与易模压性组合的热熔性使得粘合剂体的厚度能够从包含微电子系统的粘合剂器件的边缘逐渐过渡到中心部分,从而提供平滑的没有不连贯的突出的外形。 [0094] This means that the thickness of the hot melt adhesive so that the body can be easily moldable composition of a gradual transition from the edge of the adhesive device comprising a microelectronic system to the central portion, thereby providing a smooth coherent No outstanding appearance. [0095] 以下详细说明用于制造根据本发明的可用于粘合剂体的压敏粘合剂的配方。 [0095] The following detailed description for manufacturing a pressure-sensitive adhesive binder precursor formulations according to the present invention may be used. [0096] 因此,典型的压敏粘合剂成分基于成分的总重量包含10〜60wt. %的一种或更多种橡胶状弹性体成分、5〜60%的一种或更多种吸收剂粒子、0〜50%的增粘剂树脂、0〜 10%的增塑剂和0〜60%的非极性油质增充剂的基本上均匀的混合物。 One or more rubber-like elastomer component [0096] Thus, a typical pressure sensitive adhesive component based on total weight of the composition comprises 10~60wt.%, And 5 to 60% of one or more absorbents particles, 0~50% of a tackifier resin, 0~ 10% of a plasticizer and 0 to 60% non-polar oily extender is a substantially homogeneous mixture. [0097] 橡胶状弹性体基本成分可选自包含物理上交联的弹性体(适当地为包含聚苯乙烯嵌段的嵌段共聚物)、化学交联的天然或合成橡胶状弹性体或橡胶状均聚物的组。 [0097] The basic component of the rubber-like elastic body selected from the group comprising physically cross-linked elastomer (suitably a block copolymer comprising polystyrene blocks), chemically cross-linked natural or synthetic rubbery elastomer or rubber like homopolymers group. [0098] 选自苯乙烯和一种或更多种丁二烯的嵌段共聚物的物理交联的弹性体可以是苯 [0098] is selected from one or more of styrene and butadiene elastomer physically crosslinked block copolymers may be benzene

12乙烯_ 丁二烯_苯乙烯嵌段共聚物、苯乙烯_异戊二烯共聚物,并优选是苯乙烯_异戊二 _ _ Butadiene 12 ethylene-styrene block copolymer, styrene-isoprene copolymers _, _ and is preferably styrene-isoprene

烯_苯乙烯和苯乙烯_异戊二烯嵌段共聚物的混合物。 _ _ Alkenyl styrene and styrene-isoprene block copolymer mixture.

[0099] 化学交联的橡胶状弹性体可以是例如丁基橡胶或天然橡胶。 [0099] chemically cross-linked rubbery elastomer may be, for example, butyl rubber or natural rubber.

[0100] 橡胶状均聚物可以是诸如低密度聚乙烯或丙烯的低烯烃的聚合物、优选无规聚丙烯(APP)或聚异丁烯。 [0100] rubbery homopolymer may be a polymer with a low density polyethylene or an olefin such as propylene, preferably atactic polypropylene (APP) or polyisobutylene.

[0101] 根据本发明任选使用的增粘树脂优选是氢化增粘剂树脂,并且更优选选自包含环戊二烯、二环戊二烯、a蒎烯或|3蒎烯的聚合物和共聚物的组。 [0101] According to the present invention, optionally used is preferably a tackifying resin is a hydrogenated tackifier resin, and more preferably selected from the group comprising cyclopentadiene, dicyclopentadiene, or pinene A | 3 pinene polymer and groups of the copolymer.

[0102] 当物理交联的弹性体是苯乙烯_ 丁二烯_苯乙烯嵌段共聚物或苯乙烯_异戊二烯-苯乙烯嵌段共聚物时,粘合剂适当地包含0〜10%的增塑剂(例如,citrofol BII,D0A)。 [0102] When physical crosslinking elastomer is a styrene-butadiene _ _ _ styrene block copolymers or styrene isoprene - styrene block copolymer, the binder suitably comprises 0 ~ 10 % of a plasticizer (e.g., citrofol BII, D0A).

[0103] 膨胀水解胶体粒子优选包含一种或更多种水溶性或水膨胀水解胶体聚合物或树胶。 [0103] expansion hydrocolloid particles preferably comprises one or more water-soluble or water-swellable hydrocolloid polymers or gums.

[0104] 适当的水解胶体包含可以为线性的或交联的合成聚合物,诸如从内酰胺或聚乙烯吡咯烷酮制备的水解胶体。 [0104] can be suitably comprises hydrocolloids, hydrocolloid such as polyvinylpyrrolidone prepared from lactams or linear polyethylene or crosslinked synthetic polymers. 可用于制备合成的水解胶体的其它单体包含丙烯酸盐、异丁烯酸盐和水溶性氨化物。 Other monomers useful in the preparation of synthetic hydrocolloids comprising acrylate, methacrylate and water soluble amides.

[0105] 根据本发明,天然出现或合成制备的其它水解胶体聚合物是可用的。 [0105] According to the present invention, other naturally occurring hydrocolloids or a polymer synthetically prepared are available. 这些材料包含聚乙烯醇、聚氧化烯和诸如聚糖、树胶和改性的纤维素的天然出现或合成地改性的水解胶体。 These materials contain polyvinyl alcohol, polyoxyalkylene and a natural cellulose such as polysaccharides, gums and modified or synthetically modified occurrence hydrocolloid.

[0106] 代表性的聚糖包含淀粉、糖原、半纤维素、戊聚糖、纤维素、果胶、壳聚糖和壳多糖。 [0106] Representative polysaccharides comprise starch, glycogen, hemicelluloses, pentosans, celluloses, pectin, chitosan and chitin. 代表性的树胶包含Arabic、 Locust Bean、 Guar、 Agar、 Carrageenan、 Xanthan、 Karaya、Alginates、Tragacanth、Ghatti和Furcelleran树胶。 Representative gums include Arabic, Locust Bean, Guar, Agar, Carrageenan, Xanthan, Karaya, Alginates, Tragacanth, Ghatti and Furcelleran gum. 代表性的改性纤维素包含甲基纤维素、羟丙基甲基纤维素、羧甲基纤维素和羟丙基纤维素。 Representative modified celluloses comprising cellulose, hydroxypropyl methyl cellulose, carboxymethyl cellulose and hydroxypropyl cellulose.

[0107] 优选的水解胶体包含诸如淀粉、糖原、半纤维素、戊聚糖、明胶、纤维素、改性纤维 [0107] Preferred hydrocolloids comprising such as starch, glycogen, hemicelluloses, pentosans, gelatin, cellulose, modified cellulose

素、果胶、壳聚糖和壳多糖的聚糖。 Su, pectin, chitosan, chitin, and polysaccharides. 改性的纤维素包含甲基纤维素、羟丙基甲基纤维素、羧甲 Modified cellulose comprises methyl cellulose, hydroxypropyl methyl cellulose, carboxymethyl

基纤维素和羟丙基纤维素。 Cellulose and hydroxypropyl cellulose. 最优选的水解胶体是选自包含聚乙烯醇、粉状果胶、明胶、甲基 The most preferred hydrocolloid is selected from the group comprising polyvinyl alcohol, powdered pectin, gelatin, methyl

纤维素、羟丙基甲基纤维素、羧甲基纤维素、羟丙基纤维素和它们的混合物的组的水溶性或 The water-soluble cellulose, hydroxypropyl methyl cellulose, carboxymethyl cellulose, hydroxypropyl cellulose, and mixtures thereof or

膨胀水解胶体。 Swelling hydrocolloid. 在一个优选实施例中,水解胶体是羧甲基纤维素(CMC)。 In a preferred embodiment, the hydrocolloid is carboxymethyl cellulose (CMC).

[0108] 适当的膨胀胶体是基于交联的聚丙烯酸聚合物的小球形粒子。 [0108] an appropriate expansion colloid is small spherical particles based on polyacrylic acid polymer crosslinked. 在美国专利 In the United States Patent

No. 4867748、 EP 0122344和美国专利申请No. 2004065232中可找到这些材料的例子。 No. 4867748, EP 0122344 and U.S. Patent Application No. 2004065232 in the Examples of these materials can be found.

[0109] 有时用于附着粘合剂器件的皮肤可以是潮湿的或者甚至是湿的。 [0109] Sometimes the adhesive device for attaching the skin may be moist or even wet. 在这些情况下, In these cases,

普通的粘合剂不能提供粘合剂器件的足够强和永久的附着。 Common adhesive binder device does not provide a strong enough and permanent attachment. 在这些情况下有用的专用粘合 In these cases special adhesive useful

剂是水凝胶粘合剂。 Agent is a hydrogel adhesive. 这些粘合剂基于亲水聚合物和使得能够在粘合剂的完全的皮肤接触表 These adhesives are based on hydrophilic polymer and makes it possible to complete the skin contact adhesive table

面上平稳摄取水分的增充剂。 Smooth surface moisture uptake extenders. 存在成分范围广泛的这种亲水粘合剂。 This component is present in a wide range of hydrophilic binder. 具有高含量的任选地 Optionally having a high content

被部分中和的酸基的亲水聚丙烯酸酯是该粘合剂组中的主要代表。 Hydrophilic polyacrylates are neutralized acid group-part adhesive is the main representative of the group. 这些粘合剂可以是固有 These adhesives may be inherent

的粘合剂,或者可在干燥条件下用增粘剂和增充剂被配制为希望的粘合剂性能。 Adhesive, or it may be formulated as a desired adhesive properties with a tackifier and extender under dry conditions. 由于水的 Because water

摄取将粘合剂转换成更加有塑性的状态,因此,当得到水分时,粘性将根据配方大大增加。 Uptake convert into more plastic adhesive state, when the obtained water, will greatly increase the viscosity depending on the formulation.

替代性的粘合剂基于诸如聚乙烯吡咯烷酮、聚乙烯醇、聚环氧乙烷等的聚合物。 Alternative adhesives based on polymers such as polyvinylpyrrolidone, polyvinyl alcohol, polyethylene oxide, and the like. 两性聚合物 Amphoteric polymers

或可通过基团聚合化学交联的聚合物可被添加以提高粘合剂的粘性,并且一般优选诸如聚 Or it may be added by a radical polymerization polymer chemical crosslinking to increase viscosity of the adhesive, and is generally preferred such as poly

乙二醇、聚丙二醇和丙三醇的增充剂。 Glycol, polypropylene glycol and glycerol extenders.

13[0110] 基于聚二甲基硅氧烷(P匿S)的粘合剂成分从19世纪70年代为人们所认识。 13 [0110] Based on polydimethylsiloxane (P hide S) the binder component from the 1870s been recognized. 最近,新的子类的基于PDMS的压敏粘合剂即软硅酮粘合剂已被开发。 Recently, a new subclass PDMS based pressure-sensitive adhesive, i.e., a soft silicone adhesives have been developed. 软硅酮粘合剂(SSA)是基于交联的硅酮弹性体结构的两部分的不溶解粘合剂。 Soft silicone adhesive (SSA) is insoluble binder based on two-part silicone elastomeric structure crosslinked. 交联是具有乙烯基的聚二甲基硅氧烷和氢功能硅氧烷之间的加成反应的结果。 It is the result of having a crosslinked addition reaction between the vinyl siloxane and polydimethyl hydrogen siloxane functionality. 固化反应被铂络合物催化并可在室温下发生,或者可在高温(80°C〜145°C )下被加速使得不形成副产物。 Curing reaction catalyst is a platinum complex can occur at room temperature or may be accelerated at a high temperature such that (80 ° C~145 ° C) does not form byproducts. 这些粘合剂的特征在于较软并且符合皮肤的表面结构,由此迅速实现皮肤的湿润。 Characterized in that the adhesive is softer and conform to the surface structure of the skin, thereby quickly realize the skin moist. 由于粘性成分最少,因此材料不流动,并且当施加变形压力时仅出现较小的能量耗散。 Since the least viscous components, and therefore the material does not flow, and less energy dissipation occurs only when the deforming pressure is applied. 结果是迅速的剥离,这种剥离在较低的剥离力或剪切力下发生,这对于一些情况可能是有利的。 The result is a rapid release, such lower peel peeling strength or shear forces occurring, which for some cases may be advantageous.

[0111] 由于基于PDMS的压敏粘合剂可用自来水清洗并可被重新施加到皮肤上,因此,除了是优异的皮肤粘合剂以外,它们还具有可再使用的性能。 [0111] Since the washing water is available and can be re-applied to the PDMS based pressure-sensitive adhesive on the skin, and therefore, in addition to the pressure-sensitive adhesive is excellent in skin, they also have properties reusable.

[0112] 用于制作本发明的粘合剂体的压敏粘合剂也可以是常被描述为粘性凝胶的PDMS凝胶。 [0112] for the production of pressure-sensitive adhesive of the adhesive of the present invention may be a viscous gel is often described as PDMS gel. 这些市售系统的例子是来自Dow CorningHealth Care US的Dow Corning7-9800A&B或来自Wacker-ChemieGmbH, Burghausen, Germany的SilGel 612和来自NuSilTechnology, Carpinteria, USA的MED_6340。 Examples of such systems are commercially available from Dow Corning7-9800A of Dow CorningHealth Care US & B or from SilGel 612 and NuSilTechnology, Carpinteria, USA MED_6340 of from Wacker-ChemieGmbH, Burghausen, Germany is.

[0113] 上述压敏粘合剂可以以无泡沫型或以泡沫型被使用。 [0113] The pressure sensitive adhesive may be used no foam or foam type. 当在制造过程中气泡被弓I入压敏粘合剂中时,重量轻的胞状结构被制造。 When the bubble is in the manufacturing process I bow into pressure-sensitive adhesive, light-weight cellular structure is manufactured. 这种压敏粘合剂比无泡沫型更柔软。 This pressure sensitive adhesive is softer than no foam. (参见美国专利No. 6326524和美国专利申请No. 2004065232)。 (See US Patent No. 6326524 and US Patent Application No. 2004065232).

[0114] —般地,本发明的粘合剂体具有希望的弹性、粘性、水分传送和/或吸收性能以及较高的舒适性和柔性。 [0114] - camel, adhesives of the present invention having a desired elasticity, viscosity, moisture transport and / or absorption properties and high flexibility and comfort. 柔性提供能够符合身体部位的曲率同时即使在移动条件下也保持其粘合性能的合成。 Provide a flexible line with a curvature of body parts while moving even under conditions maintaining the synthesis adhesive properties. 室温下的较高的初始粘性便于粘合剂器件的施加。 The high initial tack at room temperature to facilitate the application of the adhesive device.

[0115] 本发明的粘合剂在上表面上具有任何性质的一个或更多个覆盖层、优选仅仅一个覆盖层,以防止对于亚麻布、衣服和其它环境的粘合。 [0115] The adhesive of the present invention, of any nature on the surface of one or more covering layers, preferably only one covering layer, to prevent adhesion to linen, clothes and other environments.

[0116] 作为覆盖材料,优选使用热塑性聚合物膜形式的膜或编织或非编织层。 [0116] As the covering material, film, or woven or non-woven layer is preferably a thermoplastic polymer film form. 覆盖层优选由弹性材料制成。 The cover layer is preferably made of an elastic material. 覆盖层适当地能够传送水分,并可例如由聚合物和聚合物的任意叠层制成,这些聚合物诸如:例如聚乙烯、聚丙烯或聚丁烯的聚烯烃类、诸如尼龙的聚酰胺、聚氨酯、聚乙酸乙烯酯、聚氯乙烯、氟化聚乙烯化合物、聚偏二氯乙烯、聚乙烯醇、乙烯醋酸乙烯酯(ethylene vinyl acetate)、醋酸纤维素或其它的热塑性聚糖、诸如PEBAX的聚醚嵌段氨化物、诸如苯乙烯_异戊二烯_苯乙烯嵌段共聚物或乙烯丙烯酸盐嵌段共聚物的嵌段共聚物、诸如聚对苯二甲酸乙二醇酯(PET)或其衍生物的聚酯。 Suitably the cover layer capable of transmitting moisture may for example be made of any polymer laminate and polymers, polymers such as these: e.g. polyethylene, polypropylene or polybutylene polyolefins, polyamides such as nylon, polyurethane, polyvinyl acetate, polyvinyl chloride, polyvinyl fluoride, polyvinylidene chloride, polyvinyl alcohol, ethylene vinyl acetate (ethylene vinyl acetate), cellulose acetate or other thermoplastic polysaccharides, such as the PEBAX polyether block amides, such as styrene _ _ isoprene-styrene block copolymer or block copolymers of ethylene acrylic acid salt of a block copolymer, such as polyethylene terephthalate (PET) or polyester derivatives thereof. 覆盖层可适当地是由聚氨酯、聚乙烯或聚乙酸乙烯酯制成的薄泡沫层等。 Cover layer may suitably be made of polyurethane, polyethylene or polyethylene vinyl acetate made of a thin layer of foam esters.

[0117] 覆盖层或膜保护集成的/嵌入的微电子部件以及粘合剂体免受环境影响。 [0117] cover layer or film for protecting the integrated / embedded microelectronic components as well as the adhesive body against the environment.

[0118] 在本发明的一个特定的实施例中,天线可通过导电墨水或印刷金属被直接印刷到 [0118] In a particular embodiment of the present invention, the antenna may be printed directly by printing a conductive ink or metal

覆盖层上。 Cover layer.

[0119] 在施加到皮肤上之前,为了保证保持粘合剂的性能并且为了使得粘合剂表面在使 [0119] prior to application to the skin, in order to ensure and maintain the performance of the adhesive such that the adhesive surface in order to make

用前才被铺开,保护性释放衬套覆盖压敏粘合剂体的皮肤接触侧。 Was only spread before use, protective release liner covering the pressure sensitive skin adhesive contact side of the body. 释放衬套适当地为硅化 Release liner appropriate for suicide

或氟化释放衬套,诸如硅化或氟化牛皮纸、聚乙烯、聚丙烯或聚对苯二甲酸乙二醇酯膜。 Or fluorinated release liner, such as fluorinated or siliconized kraft paper, polyethylene, polypropylene or polyethylene terephthalate film. suitable

当地,释放衬套是硅化聚乙烯膜,诸如来自公司Huhtamaki的中密度聚乙烯。 Local, siliconized release liner is a polyethylene film, such as a company from Huhtamaki density polyethylene.

[0120] 微电子系统包含大量的部件,这些部件可被组装到一个任选地封装的单元中,该 [0120] The microelectronic system comprises a large number of components, these components may be assembled into a unit, optionally encapsulated in the

单元被加入本发明的粘合剂器件内。 Cells are added to the adhesive device of the present invention. 微电子感测系统的部件也可以是位于粘合剂器件中的不同位置中的单个的任选地封装的部件的组件。 The components of the microelectronic sensing system may be located in different positions in the adhesive device in a single assembly member optionally encapsulated. 本发明的该实施例包含粘合剂器件使微电子器件的所有的各单个部件位于不同位置的情况以及部件中的一个或更多个位于与位于同一位置的其它部件的位置不同的位置的情况。 Of all the individual components of this embodiment of the present invention comprising the adhesive device of the microelectronic device at different positions, and one or more components located in the same position at other member of the case where a different location .

[0121] 当微电子器件的部件位于粘合剂器件中的不同位置时,粘合剂器件还在集成到粘合剂体内的部件之间具有必要的机械或电气连接。 [0121] When the components of the microelectronic devices located at different positions in the adhesive device, the adhesive device is also integrated into the adhesive between the body member having the necessary mechanical or electrical connection.

[0122] 因此,根据本发明的一个实施例,整个微电子系统被集成到粘合剂体内,并在所有各边被粘合剂体完全覆盖。 [0122] Thus, according to one embodiment of the present invention, the entire microelectronic system is integrated into the adhesive body and is completely covered by the adhesive body on all sides.

[0123] 根据本发明的另一实施例,整个微电子系统被包含于设置在面对覆盖层的粘合剂体的上表面中的凹槽内。 [0123] According to another embodiment of the present invention, the entire microelectronic system is contained in a recess provided on the surface of the adhesive body facing the cover layer in.

[0124] 根据本发明的另一实施例,整个微电子系统被包含于设置在粘合剂体的粘合剂底表面中的凹槽中。 [0124] According to another embodiment of the present invention, the entire microelectronic system is contained in a recess provided on the bottom surface of the adhesive in the adhesive body. 在本发明的另一实施例中,微电子系统被包含于粘合剂体中的通孔中并且从面对覆盖层的上表面以及从粘合剂底表面均可到达。 Embodiment, the microelectronic system is contained in the through-hole in the adhesive body and can be reached from the upper surface facing the cover layer from the adhesive and the bottom surface of another embodiment of the present invention.

[0125] 在本发明的替代性的实施例中,微电子系统的一个或更多个部件被集成到粘合剂体内,并且在所有各边被粘合剂体覆盖,并且,微电子系统的其它部件位于粘合剂体的其它位置,微电子感测系统的部件相互具有必要的机械和电气连接。 [0125] In an alternative embodiment of the present invention, one or more components of the microelectronic system is integrated into the adhesive body and is covered by the adhesive body on all sides, and the microelectronic system located at other positions other components of the adhesive body, the components of the microelectronic sensing system each having the necessary mechanical and electrical connection.

[0126] 根据本发明的上述实施例,微电子系统的一个或更多个部件可被集成到粘合剂体内并在所有各边被粘合剂体覆盖,并且微电子系统的其余部分被包含于设置在面对覆盖层的粘合剂体的上表面中的一个或更多个凹槽(适当为一个凹槽)内。 [0126] may be integrated, according to one embodiment of the present invention, the above-described embodiment, the microelectronic system or more components into the adhesive body and is covered by the adhesive body on all sides, and the rest of the microelectronic system is contained disposed in a surface of the adhesive body facing the cover layer of one or more groove (a groove appropriate).

[0127] 作为替代方案,微电子系统的一个或更多个部件被集成到粘合剂体内并在所有各边被粘合剂体覆盖,并且微电子系统的其余部分被包含于设置在粘合剂体的粘合剂底表面中的一个或更多个凹槽(适当地为一个凹槽)中。 [0127] Alternatively, a microelectronic system or more components integrated into the adhesive body and is covered by the adhesive body on all sides, and the rest of the microelectronic system is contained in an adhesive disposed the bottom surface of the adhesive agent precursor is one or more recesses (suitably one recess) in the.

[0128] 在另一替代性实施例中,微电子系统的一个或更多个部件被集成到粘合剂体内并被粘合剂体覆盖,并且微电子系统的其余部分被包含于粘合剂体中的一个或更多个通孔(适当地为一个通孔)中,并且从面对覆盖层的上表面和粘合剂底表面均可到达。 [0128] In another alternative embodiment, one or more of the microelectronic system components are integrated into the adhesive body and is covered with an adhesive material, and the rest of the microelectronic system is contained in a binder body one or more through holes (suitably one through hole) and can be reached from the upper surface facing the cover layer and the adhesive bottom surface. [0129] 在另一替代性实施例中,微电子系统的一个或更多个部件被集成到粘合剂体内并被粘合剂体覆盖,同时,微电子系统的其它部件被包含于粘合剂体中的一个或更多个通孔(适当地为一个通孔)中,并且从面对覆盖层的上表面和粘合剂底表面均可到达,并且,微电子系统的其余部分被包含于设置在粘合剂体的上和/或底表面中的一个或更多个凹槽(适当地为一个凹槽)中。 [0129] In another alternative embodiment, one or more of the microelectronic system components are integrated into the adhesive body and is covered with an adhesive material, while the other components of the microelectronic system is contained in the adhesive agent in a body or more through holes (suitably one through hole) and can be reached from the upper surface facing the cover layer and the adhesive bottom surface, and the rest of the microelectronic system is contained provided at the upper and / or a bottom surface of the adhesive or more grooves body (suitably a recess) in the.

[0130] 在另一替代性实施例中,微电子系统的一个或更多个部件被包含于粘合剂体中的一个或更多个通孔(适当地为一个通孔)中,并且从面对覆盖层的上表面或粘合剂底表面均可到达,并且,微电子系统的其余部分被包含于设置在粘合剂体的上和/或底表面中的一个或更多个凹槽(适当地为一个凹槽)中。 [0130] One or more through holes (suitably one through hole) in the embodiment, the one or more components of the microelectronic system is contained in the adhesive body in another alternative embodiment, and from the cover layer facing the adhesive surface or the bottom surface can be reached, and the rest of the microelectronic system is contained on the adhesive body and / or the bottom surface of the one or more grooves provided in the (suitably one recess) in the.

[0131] 在另一适当的实施例中,微电子系统的一个或更多个部件被包含于粘合剂体的上 On [0131] In another suitable embodiment, the one or more components of the microelectronic system is contained in the adhesive body

表面中的一个或更多个凹槽中(适当地在一个凹槽中),并且微电子系统的其余部分被包 The surface of one or more recesses (suitably one recess), and the rest of the microelectronic system is enclosed

含于粘合剂体的底表面中的一个或更多个凹槽(适当地为一个凹槽)中。 The bottom surface of the adhesive contained in the body of one or more recesses (suitably one recess) in the.

[0132] 在微电子系统或其部件被放在粘合剂体的上表面中的情况下,它们适当地遵循轮 [0132] In microelectronic system or components thereof the adhesive body is placed on the surface, the wheel follow them appropriately

廓与上表面一起形成,或者被成形为配合粘合剂体的上表面。 Form together with the upper surface of the profile or is shaped to fit on the surface of the adhesive body. 可以通过适当的部件封装实 By suitable solid component package

现这一点。 Now this.

15[0133] 如上所述,微电子系统的各单个部件、各单个部件的多个组或所有部件可在它们 15 [0133] As described above, the individual components of the microelectronic system, all components of a plurality of groups or individual components thereof may be in the

被嵌入粘合剂体之前被封装。 Before being embedded in the adhesive is encapsulated body. 当希望保护部件免受环境影响和/或保护环境免受部件影响 When it is desired protective member from the environment and / or protect the environment from the impact member

的附加保护时,例如,当已存在于粘合剂体中或在制造过程中导致集成到粘合剂体中时,选 When additional protection, for example, when it has been present in the adhesive or cause the body is integrated into the adhesive body during the manufacturing process, selected from

择封装。 Optional packages. 微电子系统的封装的部件通过必要的电气和/或机械连接相互连接。 Packaged microelectronic system components are interconnected by connecting the necessary electrical and / or mechanical.

[0134] 在一些情况下,由于粘合剂中的湿气和/或渗出物将引起腐蚀,因此要求保护微 [0134] In some cases, since the adhesive moisture and / or exudates will cause corrosion, thus requiring protective micro

电子系统或其部件免受其影响,或者出于其它的原因需要屏蔽外部影响。 The electronic system or components thereof from its effects, or for other reasons need to be shielded from external impact. 在这些情况下,微 In these cases, the micro-

电子系统或其部件被封装。 The electronic system or components thereof is encapsulated.

[0135] 大量的封装技术是已知的,并且包括涂敷、热熔封装、陶瓷封装和玻璃封装。 [0135] a large number of encapsulation techniques are known and includes coating, hot melt encapsulation, ceramic encapsulation and glass package. 用于封装电气部件的其它方法是本领域公知的。 Other methods for encapsulation of electric components are known in the art.

[0136] 微电子系统或其部件被适当地封装到聚合物膜、聚合物箔或聚合物涂层中,或者, [0136] The microelectronic system or components thereof is suitably encapsulated in a polymer film, a polymer foil or a polymer coating, or,

微电子系统或其部件被模压到聚合物材料中或被封装到玻璃或陶瓷材料中。 The microelectronic system or components thereof is molded into the polymeric material or packaged into a glass or ceramic material.

[0137] 通过涂敷进行的封装一般包含用诸如环氧树脂、P匿S(硅酮)、丙烯酸盐、聚氨酯 [0137] encapsulated by a coating typically be used, such as an epoxy resin containing, P hiding S (silicone), acrylate, urethane

或UV硬化树脂的材料涂敷部件。 Or a UV curable resin material applicator member.

[0138] 由于硅酮表面容易从粘合剂体的粘合剂被释放,因此,当微电子部件要被放入粘合剂体中的通孔或凹槽中时,或者在希望使得容易去除或更换封装的微电子部件的情况下,特别优选诸如PDMS的硅酮中的封装。 [0138] Since the silicone surface is easily released from the adhesive of the adhesive body, and therefore, when the microelectronic element to be placed in the adhesive body through holes or grooves, or readily removed such that the desired or in the case of replacement of a microelectronic component package, such as a PDMS silicone it is particularly preferred in the package. 可很容易地从粘合剂释放的其它材料也可用于封装。 Other materials can be easily released from the adhesive may also be used to encapsulate.

[0139] 热熔性封装一般包含通过注模在热塑性材料中加入微电子系统或其部件。 [0139] The hot melt encapsulation by injection molding generally comprises addition of the microelectronic system or components thereof in a thermoplastic material. 使用的热塑性材料可选自苯乙烯嵌段共聚物、聚氨酯、ABS(丙烯腈_ 丁二烯_苯乙烯共聚物)、SAN(苯乙烯-丙烯腈共聚物)、聚氯乙烯、P匿S、P0M(聚氧化甲烯)、聚苯乙烯、聚酯、聚丙烯酸盐、聚烯烃,例如聚乙烯或聚丙烯。 The thermoplastic material may be selected from styrene block copolymers, polyurethanes, ABS (acrylonitrile-butadiene _ _ styrene copolymer), a SAN (styrene - acrylonitrile copolymer), polyvinyl chloride, P hide S, P0M (polyoxymethylene), polystyrene, polyesters, polyacrylates, polyolefins such as polyethylene or polypropylene.

[0140] 微电子系统的部件需要互连。 [0140] The components of the microelectronic system need to be interconnected. 各系统可包含需要在机械上或电学上被组装的一个或更多个离散的部件。 Each system may comprise one or more discrete components to be assembled mechanically or electrically. 可通过PCB(印刷电路板)、弹簧锁、薄的柔性PCB、胶水等建立机械或电学连接。 By PCB (printed circuit board), a latch, a thin flexible PCB, glue establish a mechanical or electrical connection.

[0141] 在上述的一个实施例中,微电子感测系统的所有部分都在制造中被集成到粘合剂体内,这意味着具有微电子系统的粘合剂器件具有一次性的性质。 [0141] In one embodiment of the above-described embodiment, all portions of the microelectronic sensing system are integrated into the adhesive body during production, which means that the adhesive device having a microelectronic system having a disposable nature.

[0142] 根据本发明的粘合剂器件也可以以这种方式被构建,S卩,微电子系统的部件可在 [0142] may also be constructed in such a way the adhesive device according to the present invention, Jie member S, microelectronic system may be

粘合剂器件的寿命期间被更换,或者可在新的粘合剂器件中被重新使用。 During the lifetime of the adhesive device is replaced, or may be reused in the new binder device.

[0143] 微电子系统的某些部件在制造中被集成到粘合剂体内,而剩余的部件在之后、紧 Some member [0143] in the manufacture of microelectronic system is integrated into the adhesive body, and the remaining member after tight

挨着附着到皮肤上之前或附着到皮肤上之后被施加到本发明的粘合剂器件上。 The adhesive is applied to the device of the invention before and after adhering to the skin next to or attached to the skin. 在粘合剂体 In the adhesive body

的制造之后施加到粘合剂体上的部件一般是可互换的或可再用的。 After producing the adhesive applied to the body member is generally exchangeable or reusable.

[0144] 可被更换的部件例如为能源,例如电池。 [0144] member may be replaced, for example, energy such as a battery.

[0145] 在本发明的特定实施例中,整个微电子系统是可互换的或可再用的,并且可在紧挨着附着之前或在被施加到皮肤上之后被施加到粘合剂器件上。 [0145] In a particular embodiment of the invention, the entire microelectronic system is exchangeable or reusable, and may be applied immediately after or prior to attachment to the skin is applied to the adhesive device on.

[0146] 适当地,可互换部件或可再用部件如上面所述的那样被封装并形成配合粘合剂体中的凹槽或孔的封装件。 [0146] Suitably, the reusable interchangeable parts or components as described above and encapsulated package with the adhesive body is formed in a recess or aperture.

[0147] 在可互换或可再用部件的情况下,它们必须具有一些类型的使用中对粘合剂体的安全附着手段。 [0147] In the case of reusable or interchangeable part, they must have some type of secure attachment means of the use of the adhesive body. 这些附着手段可由粘合剂提供,例如,由已存在于凹痕中的粘合剂体的压敏粘合剂提供,该凹痕是粘合剂体中的孔的空腔。 These adhesive attachment means may be provided, e.g., by the pressure sensitive adhesive is present in the adhesive body has dents, the dent hole is a cavity in the adhesive body. [0148] 在这种情况下,优选封装材料是不太强地粘合到粘合剂体的粘合剂上的材料,见上文。 [0148] In this case, preferably the encapsulating material is less strongly adhered to the adhesive of the adhesive material on the body, supra.

[0149] 作为替代方案,封装的可互换或可再用部件的封装件通过对粘合剂体的机械耦合被附着到粘合剂体上。 [0149] Alternatively, the package or packages are interchangeable reusable mechanical coupling member through the adhesive member is attached to the adhesive body. 上述的包含可更换或可再用部件的封装的封装件可由此通过弹簧锁机构被配入粘合剂体中。 Comprising the above-described replaceable or reusable package, the package member by a spring lock mechanism can thus be formulated into the adhesive body.

[0150] 封装用作微电子系统或其部件的外壳,并适当地由注模的聚合物材料形成,但大致上可以为任何材料和任何结构。 [0150] package housing the microelectronic system or components thereof used, and is suitably formed from injection molded polymer material, but may generally be any material and any structure.

[0151] 封装的微电子部件的封装件可具有任意适当的形状,适当地为配合粘合剂体中的凹槽或通孔的三维形状。 [0151] encapsulated microelectronic component package may have any suitable shape, suitably the shape of a three-dimensional adhesive body fit in a recess or through-hole. 在一个实施例中,封装的电子部件将具有具有圆端的棒状胶囊的形状。 In one embodiment, the electronic component package having a shape of a rod-shaped capsule having rounded ends.

[0152] 如上所述,本发明使用用于获取生理数据的侵入式以及非侵入式技术。 [0152] As described above, the present invention is used for acquiring physiological data invasive and non-invasive techniques. 在非侵入式测量的情况下, 一个或更多个金属电极可被用于皮肤接点。 In the case of non-invasive measurement of one or more metal electrodes may be used for skin contacts. 但是,任何导电材料均可被用于皮肤接点,诸如导电的聚合物、导电的水凝胶和电解质。 However, any conductive material may be used for the contact of the skin, such as a conductive polymer, electrolyte and conductive hydrogels. 在侵入式测量的情况下,常规的针或显微针可被使用。 In the case of invasive measurements, conventional needles or microneedles may be used. 当前这种侵入式技术已是公知的例如用于测量氧或血糖的技术。 Current Such invasive techniques are well known, for example, oxygen or techniques for measuring blood glucose. [0153] 通过组合详细说明的部件,所有类别的微电子感测系统均可被设计和加入到本发明的粘合剂器件中。 [0153] By means of a combination of the detailed description, all categories of the microelectronic sensing system may be designed and added to the adhesive device of the present invention. 适于嵌入粘合剂器件中的系统的例子是适于测量生物传感器信号、 EKG、 EMG、 EEG、血糖、脉搏、血压、pH值和氧的系统。 Examples of embedded systems suitable adhesive device is adapted to measure the biosensor signal, EKG, EMG, EEG, blood glucose, pulse, blood pressure, pH and oxygen systems.

[0154] 加入本发明的粘合剂器件中的微电子系统一般需要以下的部件:通信部件、 CPU(中央处理单元)、电源、存储部件、换能器部件、互连,并任选地包含致动器部件。 [0154] The adhesive device of the present invention was added in microelectronic systems typically require the following components: a communication means, the CPU (Central Processing Unit), a power supply, a storage means, transducer means, interconnected, and optionally The actuator member. [0155] CPU(中央处理单元)控制微电子系统的部件并与它们通信。 [0155] CPU component (central processing unit) and controls the microelectronic system communicates with them. CPU操纵应用软件、 数据决策(诸如数据信号处理)、A/D转换、DSP(数字信号处理)、路由选择、定时、电力管理、休眠功能、中断的执行。 CPU manipulation software, the decision data (such as digital signal processing), A / D conversion, the DSP (digital signal processing), routing, timing, power management, sleep function, execution of the interrupt.

[0156] CPU是微电子系统的控制其它部件并进行适当的数据分析的部件。 [0156] CPU is controlling the other components of the microelectronic system and appropriate data analysis means. 一般地,需要的速度和数据分析越多,则需要的电力越多。 Generally, data analysis and require more speed, the more power required. 因此,为了节省电力,休眠功能常被使用。 Therefore, in order to save power, often use the sleep function. 在某些时间,或者如果某件事件发生(由功率非常低的监视子系统触发),那么CPU被唤醒,进行必要的计算,与相关的部件通信并返回休眠模式。 In certain time, or if something member occurs (triggered by very low power monitoring subsystem), the CPU wakes up, perform the necessary calculations, the communication means associated with and go back to sleep mode. 根据本发明,可根据需要使用从非常基本的CPU到功能强大的微控制器。 According to the present invention, it can be very substantially from the CPU to the powerful microcontroller used as necessary.

[0157] 通信部件控制送往和来自微电子系统的所有通信。 [0157] sent to the communication control section and all communications from the microelectronic system. 适当地,微电子系统是使得能够与离开粘合剂器件某一距离的接收器单元无线通信的系统。 Suitably, the microelectronic system is to enable the receiver with a distance away from the adhesive device in a wireless communication system units. 但是,本发明不限于诸如RF 无线通信的无线通信。 However, the present invention is not limited to wireless communication, such as the RF wireless communication. 其它的通信手段可以是音频或光学通信手段。 Other communication means may be an audio or optical communication means. 部件包含必要的用于实现这种无线通信的电子部件,还包含天线以及必要的硬件和软件。 Member contains the necessary electronic components for realizing such a wireless communication, further comprising an antenna and the necessary hardware and software.

[0158] 天线可根据频率、功率和信号形式采取不同的形状和形式。 [0158] The antenna may take different shapes and forms depending on the frequency, power and signal form. 一些天线用于在几厘米的范围上传送信息,另一些天线的范围为几米。 Some antenna for transmitting information over a range of a few centimeters, the range of a few meters of other antennas. 天线的例子是:环绕小铁氧体磁芯(例如,直径小于4mm)的线圈、具有多圈的扁平线圈(直径一般为10mm或更大)、诸如单极或双极天线的单和双导线射电天线和集成到粘合剂中的天线。 Examples of antennas is: around the ferrite core smaller (e.g., diameter less than 4mm) of the coil having a flat coil (typically 10mm in diameter or larger) a plurality of turns, such as a single dipole antenna or monopole and two-wire radio antenna and an antenna integrated into the adhesive.

[0159] 只具有几圈和例如50mm的大直径的天线可被层叠并被集成到粘合剂体中或被印刷到或直接放在粘合剂器件的覆盖层上。 [0159] and an antenna having only a few turns of large diameter, for example 50mm may be laminated and integrated into the adhesive body or printed directly on the adhesive or device cover layer. 天线一般由诸如铜或铝的金属制成,但也可以是导电墨水。 Antennas are generally made of metal such as copper or aluminum, but may be a conductive ink.

[0160] 电源包含功率调节电子部件、再充电电子部件和一般为内部或可互换电池的能 [0160] Power supply regulator comprising an electronic component, the electronic component and typically the rechargeable internal battery can be interchangeable or

17源。 17 source. 但是,其它的为微电子系统得到电力的手段可被提出,诸如动能转换、燃料电池、同位素辐射、太阳能电池,或者通过射频(RF)链路。 However, other means of power obtained microelectronic system may be presented, such as the kinetic energy conversion, fuel cells, isotope radiation, solar cells, or by a radio frequency (RF) link. 并且,天线可被用于将能量加载到微电子系统中。 Further, the antenna may be used to load the energy to the microelectronic system.

[0161] 优选地,电源是电池,并且可以为一次性使用或可以为可充电的。 [0161] Preferably, the power supply is a battery, and may be disposable or may be used as the charging.

[0162] 存储部件用于存储嵌入的系统软件和/或存储在器件的操作中获取的数据。 Software [0162] storage means for storing the embedded and / or stores the acquired data in the operation of the device. 存储 storage

部件可以是CPU的一部分、其自身的部件或可被去除和更换的诸如FLASH RAM的可互换存储器。 Member may be a part of the CPU, the member itself or may be removed and replaced, such as a FLASH RAM memory is interchangeable.

[0163] 换能器部件是被设计为将能量从一种形式转换成另一种形式的部件。 [0163] transducer means is designed to convert energy from one form to another form of the member. 换能器一般为但不限于微电子系统的传感器或感测部分。 Transducer typically but not limited to the microelectronic system or a sensor sensing portion. 换能器可由此能够转换例如物理输入,并且换能器将一般但不必将该能量转换成要被CPU等解释的电气形式。 Transducer may be possible to convert e.g. physical input, and the transducer will typically but not necessarily to convert the electrical energy into a form of a CPU to be explained.

[0164] 换能器可转换的物理输入的例子是加速度、化学品/气体、流量、湿度、惯性、电容、导电率、传导率、电流、阻抗、电感、pH值、电阻、电阻率、电压、光检领U、光、磁性、压力、角度、线性位置、速度、温度、声音和机械力。 [0164] Examples of physical input transducer may convert the acceleration, chemical / gas, flow rate, humidity, inertia, capacitance, conductivity, conductivity, current, impedance, inductance, pH, resistivity, resistivity, voltage , photodetector collar U, optical, magnetic, pressure, angular, linear position, speed, temperature, sound and mechanical forces.

[0165] 换能器的切实代表是检测部件。 [0165] Representative effective detection transducer means. 检测部件一般选自电极(极性、双极)、压力传感器、具有电极的针、加速计、光检测器、麦克风、离子敏感场效应晶体管(ISFET)、NTC(负温度系数)电阻器、带隙检测器、离子膜、酶反应器或电容器。 Detecting means is generally selected from electrodes (polar, bipolar), a pressure sensor, a needle with an electrode, an accelerometer, light detector, microphone, ion-sensitive field effect transistor (ISFET), NTC (negative temperature coefficient) resistor, with gap detector, ion-exchange membrane, an enzyme reactor or a capacitor.

[0166] 在本发明的一个实施例中,换能器包含用于非侵入检测的检测器,诸如电极。 [0166] In one embodiment of the present invention, the transducer comprises a detector for non-invasive detection of such an electrode. [0167] 在本发明的另一实施例中,换能器包含侵入式检测器,诸如包含电极的针。 [0167] In another embodiment of the present invention, the transducer comprises an invasive detector, such as a needle containing an electrode. [0168] 致动器与换能器相反。 [0168] The actuator opposite the transducer. 它以与换能器基本上相同的方式但以相反的次序将能量从一种形式转换成另一种形式。 However, it is in the reverse order to convert the energy of the transducer substantially the same manner from one form to another form. 通常它将电信号转换成物理信号。 It is generally an electrical signal into a physical signal. 致动器的切实代表是例如电极(例如用于神经系统或神经剌激)、泵、注射针、发光二极管(LED)或另一光源、扬声器、 电流发生器或化学分析仪。 Representative effective actuators are, for example, an electrode (for example for the nervous system or nerve stimulation), a pump, an injection needle, a light emitting diode (LED) or another light source, a speaker, a current generator or a chemical analyzer. 致动器的可能的用途在某些事件中由CPU决定,以激活微电子系统中的警报,诸如扬声器或LED,或者指示电池电量低。 Possible use of the actuator in certain events decided by the CPU, to activate the alarm in the microelectronic system, such as a speaker or the LED low, or indicate the battery level.

[0169] 因此,致动器可被用作系统中的对从诸如警报(可视的和可听的)、注射泵、阀等的换能器部件获得的输入做出反应的部件。 Means [0169] Thus, the actuator system may be used to respond to an input from an alarm (visible and audible), syringe pump, valves and other components such as a transducer obtained. 它可以是一次使用、多次使用或连续使用的致动器。 It may be a single use, multiple use of an actuator or sequential use.

[0170] 许多感测系统仅是传送关于哺乳动物的身体条件的信息的情报系统,并且在这种情况下不需要致动器。 [0170] Many sensing systems only transmit information about the physical condition of the mammal intelligence system, and does not require the actuator in this case.

[0171] 微电子系统将在用于给定应用的器件中可能仅需要部件中的一些的意义上被模块化构建。 [0171] The microelectronic system may be needed only for a given application device are constructed in the sense of some of the modular components. 一些应用将利用很少的部件,并且一些应用可使用所有的部件。 Some applications will use few parts, and some applications may use all components. 这些部件可被配入相同的物理ASIC(专用集成电路)、电气系统或子系统,诸如但不限于PCB(印刷电路板)、柔性PCB、厚膜、薄膜或陶瓷技术,或者,系统或其部件可被单独地封装。 These components can be formulated into the same physical ASIC (application specific integrated circuit), an electrical system or subsystem, such as, but not limited to a PCB (printed circuit board), a flexible PCB, thick, or thin-film ceramic technology, or system or part thereof They may be packaged separately. [0172] RFID(射频识别)标签在各种尺寸、范围和功能上是可在市场上得到的。 [0172] RFID (radio frequency identification) tag in a variety of sizes, ranges and functions are available in the market. 当RFID 读取器施加适当的场(例如,感应场)时,基本的RFID标签返回一个比特序列。 When applying an appropriate field (e.g., the induction field) RFID reader, RFID tag returns a basic bit sequence. 该序列在使用之前被编程。 The sequence is programmed prior to use. RFID范围为从lcm到用于无源标签(不包含电源)的约2米到用于有源标签(包含电源)的超过100米。 RFID range of more than 100 meters from lcm to about 2 meters for passive tags (no power) to active tags used (including the power supply) is. 可用的更复杂的RFID标签具有可读取或存储数据的存储部件。 Available more sophisticated RFID tags can be read, or a storage means for storing data.

[0173] RFID标签可作为独立的部分或与其它的微电子部件组合被加入粘合剂体中。 [0173] RFID tags may be used as part of a separate or combined with other microelectronic components is added to the adhesive body. 可以在不明显增加系统的复杂性和价格的条件下很容易地使得复杂的微电子系统包含各种形的系统中,标签可被用作简单的跟踪部件以识别产品,诸如搁置寿命、寿命,但它也可被用于对传感器网络中的其它系统的识别。 Such that the complex can be easily microelectronic system without significantly increasing system complexity and price conditions include various forms of a system, the label can be used as a simple tracking unit to identify the product, such as shelf life, life, but it may also be used to identify other systems in the network of sensors.

[0174] 对于独立的方案,RFID标签基本上包含RF芯片和线圈。 [0174] For standalone program, RFID tags essentially comprises an RF chip and a coil. 适当的形式的RFID标签 RFID tag suitable form

是被封装到玻璃外壳内的RFID标签、被封装到塑料/环氧树脂(一般为药丸状)中的RFID RFID tag is encapsulated in the glass housing is assembled into a plastic / epoxy (usually pellet form) in the RFID

标签、具有层叠在2个聚酰亚胺层之间的线圈和RF芯片的平面RFID标签、或在没有任何其 Tag having laminated between the two polyimide layers and the coil plane of the RFID tag of the RF chip, or in the absence of any

它的保护/封装的情况下具有印刷在粘合剂体上或粘合剂体中的圈数很少的大型线圈天 A coil having a large printing days or a few turns on the adhesive body is an adhesive body case its protective / encapsulated

线并具有与天线互连的RF芯片的平面RFID标签。 Axis and having a plane of the RFID tag and the antenna of the RF chip interconnection.

[0175] 这些系统可在粘合剂体的制造中被完全集成到粘合剂体内。 [0175] These systems can be fully integrated into the adhesive body in the production of the adhesive body.

[0176] 上述平面RFID标签可在制造过程中被夹在2层压敏粘合剂之间。 [0176] The plane of the RFID tag may be sandwiched between the pressure sensitive adhesive layer 2 during manufacture. 由于RF芯片非常小(lmmXlmm)并且线圈较为柔软,因此不需要刚性的封装。 Since the RF chip is very small (lmmXlmm) and the coil is more flexible, rigidity of the package is not required. 玻璃封装的RFID标签具有非常好的耐化学性和较小的尺寸以保证没有不舒适感。 Glass encapsulated RFID tag having excellent chemical resistance No sense and smaller size to ensure comfort. 封装在塑料或环氧树脂中的RFID标签可以为更复杂的设计,并且在本发明的粘合剂体的制造过程中或制造之后均可被添加。 Encapsulated RFID tag in a plastic or epoxy resin may be a more complex design, and can be added after the manufacturing process of the adhesive of the present invention or manufactured. [0177] 封装的RFID标签是一个或更多个粘合剂体中的可被再使用的部件。 [0177] RFID tag is encapsulated one or more components of the adhesive body may be reused. 封装的RFID 标签从一个粘合剂体被转移到另一个粘合剂体,并由此一次又一次被再使用,并且对于存储个人特定数据是十分理想的。 Encapsulated RFID tag is transferred from one body to another adhesive binder precursor, and thus is reused again and again, and for storing person-specific data is ideal.

[0178] —般嵌入的微电子系统在其系统中包含某种类型的传感器,但这一点不是对于所有的应用都是必须的。 [0178] - like embedded microelectronic systems include some type of sensors in their system, but this is not for all applications are necessary.

[0179] 本发明的粘合剂器件也可以是放在体部的不同位置上的粘合剂传感器器件的网络的一部分。 [0179] The adhesive device of the present invention may also be part of a network of adhesive sensor device at different locations on the body portion. 这些单个粘合剂器件的复杂性可根据位置和感测性能从较小的基本传感器系统变化到更复杂的系统。 Complexity can vary to more complex systems in which individual adhesive device and the position sensing performance from smaller basic sensor system. 网络的一些粘合剂器件具有简化的功能,称为RFD(简化功能器件),而其它的器件是FFD (全功能器件)。 Some adhesive device having a simplified network function, called RFD (reduced function devices), while the other device is the FFD (Full Function Device).

[0180] FFD器件可在任何拓扑技术中起作用,并且是网络的协调器,或者它可以是可与任何其它器件对话的协调器。 [0180] FFD devices may function at any topology, and is the coordinator of the network, or it may be any other device session coordinator. RFD器件限于星形拓扑,它不能变为网络协调器,它仅与网络协调器对话并具有非常简单的实现方案。 RFD device is limited to star topology, it can not become a network coordinator, it is only dialogue and network coordinator and has a very simple implementation.

[0181] FFD可以是用作体部区域网络(BAN)内的通信网络集线器、网关或路由器并操纵与外部单元的通信的专用网络协调器。 [0181] FFD may be used as a communication hub in a body area network (BAN), a gateway or router and manipulate the external unit in communication with a dedicated network coordinator. 通信网络集线器或网关可具有较大的存储容量,并存储来自传感器网络的数据,并且,当靠近外部单元时或在其它适当的条件下无线传送这些数据。 Communication network hub or gateway can have a larger storage capacity, and stores data from the sensor network, and, when close to the external unit or wireless transmission data in other appropriate conditions.

[0182] 由于不需要皮肤接点或致动器,因此这些网络集线器很容易地被集成到粘合剂体内,并且可被放在体部内的关键位置上。 [0182] Since no skin contact or actuator, so these network hub easily be integrated into the adhesive body, and may be placed in critical locations within the body portion. 由于网络集线器一般较大并且位置更加靠近体部中心,因此微电子网络集线器可被完全集成到粘合剂体内是十分有利的,因为这样可降低不舒适感和可见性。 Since the hub is generally large and a position closer to the center of the body portion, so microelectronic hub may be fully integrated into the adhesive body is very advantageous, because it can not reduce the comfort and visibility.

[0183] 在人为监视的情况下,微电子系统可包含GPS技术。 [0183] In the case of human surveillance, the microelectronic system may comprise GPS technology. 该系统数据记录用于以后分析的位置数据或者可传送(例如,例如通过移动网络)位置。 The data recording system location data for later analysis or may be transmitted (e.g., via a mobile network, for example) positions. 粘合剂内的这种系统可位于体部上的不可接近的位置上。 Such a system may be located within the binder inaccessible position on the upper body portion.

[0184] 加入本发明的粘合剂体内的GPS器件本身不需要是单个器件,而可另外添加到包含其它微电子系统的粘合剂器件上,使得系统可在诸如警报的某些事件中传送GPS。 [0184] added to the adhesive body of the present invention a GPS device itself need not be a single device, but may additionally be added to other adhesive device comprising a microelectronic system, so that the system may transmit an alert, such as in certain events GPS. [0185] 因此,粘合剂器件也可包含不必需在检测器和哺乳动物的皮肤之间有物理接触的微电子系统。 [0185] Thus, the adhesive device may comprise microelectronic system is not necessarily physical contact between the detector and the skin of a mammal. 不必使用具有检测元件的换能器的系统是网络集线器、网络协调器、网关和 Without using a transducer element having a detection system is a network hub, a network coordinator and gateway

19GPS(全球定位系统)。 19GPS (Global Positioning System).

[0186] 因此,可用于本发明的粘合剂器件的微电子系统可以是: [0186] Thus, the adhesive device can be used in a microelectronic system of the present invention may be:

[0187] 包含通信部件和CPU的玻璃封装的RFID标签。 [0187] RFID tag comprising communication components and a CPU of the glass package. 玻璃封装的部件可适当地被嵌入如图l所示的粘合剂器件内。 Glass package member may suitably be embedded in the adhesive device as shown in Figure l.

[0188] 包含通信部件和CPU的环氧树脂或塑料封装的RFID标签。 [0188] RFID tag comprising communication components and a CPU epoxy or plastic packages. 环氧树脂/塑料封装的部件可例如被嵌入图1或2所示的粘合剂体内。 Epoxy / plastic packaging, for example, the member may be embedded in the adhesive body as illustrated in FIG. 1 or 2.

[0189] 层叠在两个聚酰胺层之间的线圈天线和包含通信部件和CPU的RFID标签。 [0189] polyamide layer laminated between two coil antenna and the RFID tag comprising communication components and a CPU. 该系统可被嵌入图IA所示的粘合剂体内。 The system may be embedded in the adhesive body as illustrated in FIG IA.

[0190] 圈数很少的线圈和包含存储和通信部件和CPU的非封装无源读/写RFID标签。 [0190] The number of turns of the coil and comprising less storage and communication components and a CPU unencapsulated passive read / write RFID tag. 该系统可被嵌入图IA所示的粘合剂体内。 The system may be embedded in the adhesive body as illustrated in FIG IA.

[0191] 封装在环氧树脂或塑料丸内的包含存储和通信部件和CPU的无源读/写RFID标签。 [0191] encapsulated in a plastic or epoxy resin pellets comprising storage and communication components and a CPU passive read / write RFID tag. 该系统可被嵌入图2所示的粘合剂体内。 The system may be embedded in the adhesive body as illustrated in FIG.

[0192] 包含存储和通信部件、CPU和电池的封装在环氧树脂/塑料丸内的有源读/写RFID标签。 [0192] comprising storage and communication components, CPU, and a battery encapsulated within an epoxy resin / plastic pellets active read / write RFID tag. 该系统可被嵌入图l所示的粘合剂体内。 The system may be embedded in the adhesive body as illustrated in Figure l. [0193] 上述类型的RFID标签是商业上可得到的。 [0193] RFID tag of the type described above are commercially available.

[0194] 微电子系统也可以是包含封装在塑料内的包含存储和通信部件、CPU和电池并用作用于向中央单元(CU)传送数据的专用网络协调器的网关。 [0194] The microelectronic system may also be contained in plastic packages, CPU, and a battery and used as a dedicated network coordinator to the central unit (CU) for transmitting data gateway comprising storage and communication components. 这种微电子系统可例如被嵌入如图l所示的粘合剂体内。 Such microelectronic system may for example be embedded in the adhesive body as illustrated in Figure l.

[0195] 微电子系统也可以是任选地封装在塑料内的包含存储和通信部件、CPU、电池、 GPS、用于数据记录GPS数据的实时时钟的无线同步化的部件的系统或任选地封装在塑料内的包含存储和通信部件、CPU、电池、GPS、用于数据记录GPS数据的实时时钟的无线同步化的部件、用于数据记录和向移动电话机传送数据和位置的移动网络的系统。 System [0195] The microelectronic system may also be optionally encapsulated in a plastic comprising storage and communication components, CPU, battery, GPS, real time clock for data logging of GPS data, wireless synchronization member or optionally in a plastic package comprising storage and communication components, CPU, battery, GPS, components for wireless synchronization of real time clock data logging GPS data, data for recording and transmitting data to the mobile telephone and the position of the mobile network system. 这些系统也可被嵌入图1所示的粘合剂体内。 These systems can also be embedded in the adhesive body as illustrated in FIG.

[0196] 根据本发明的粘合剂器件也可被用于通过无线手段穿过皮肤阻挡层(以穿过皮肤的方式)向身体植入物施加电功率和电气数据通信的应用。 [0196] The adhesive device of the present invention may also be used through the skin barrier layer by means of a wireless (as to pass through the skin) was applied to a body applied electrical power and electrical data communications implant. 在这些情况下,对于携带器件的人来说以最少的烦扰或麻烦将粘合剂器件长时间固定在皮肤表面上的确切点上是十分重要的。 Under these circumstances, the device is for carrying people with minimal trouble to annoyance or adhesive device is fixed to the exact point of time on the skin surface is very important.

[0197] 无线的穿过皮肤的功率传送和电子数据通信的典型例子是在用于无法控制腿下部的肌肉(下垂足综合症)的人的植入的神经剌激器中。 [0197] Typical examples of wireless power transfer through electronic data communication and the skin is not used to control muscles (drop foot syndrome) human nerve stimulation device implanted in the lower part of the leg. 下垂足剌激器被植入腿内并与控制相关肌肉的神经具有直接的接触。 Drop foot stimulation is implanted in the leg and nerve-related muscle control has a direct contact. 植入物一般通过腿内的线圈或天线和在附近皮肤表面上位于体外的线圈或天线之间的电磁耦合以无线的方式被供电。 The implant is typically in a wireless manner powered by electromagnetic coupling between the coil or antenna positioned within the legs and in vitro on the skin surface near the coil or antenna.

[0198] 线圈或天线与提供所需的电力和控制信号的电子部件连接。 [0198] providing a coil or antenna connected to the power and control signals needed for the electronic component. 用于模拟信号的定时一般由人的脚后跟上或其鞋子中的压敏开关控制。 Timing for the analog signal is generally controlled by a person on the heel of the shoe or pressure sensitive switch. 从开关向位于腿的皮肤上的模拟器传送信号常常是无线的。 Transmitting a signal from the switch to the emulator skin located on the leg are often wireless.

[0199] 通过使用在本发明中说明的粘合剂器件,可在大大改善这些下垂足模拟器。 [0199] By using the adhesive device described in the present invention, can greatly improve the drop foot simulators. 由于模拟器的外部以最少的麻烦非常稳定地长时间固定在皮肤表面上,因此它使得能够提供可靠的功率和数据传送。 Since the external simulator is stably fixed on the surface of the skin for a long time with a minimum of trouble, so that it can provide a reliable power and data transfer. 并且,它还可以使得能够更好地长时间固定位于脚上的开关。 Further, it may enable better positioned prolonged attachment foot switch. [0200] 因此,在一个实施例中,微电子系统可用于神经剌激并包含存储和通信部件、CPU、 电源、用于向用于神经剌激的植入物传送数据和功率的换能器。 [0200] Thus, in one embodiment, the microelectronic system may be used for nerve stimulation and comprises storage and communication components, CPU, power supply to the transducer for nerve stimulation implant for transmitting data and power . 该系统可适当地被嵌入图 The system may suitably be embedded in FIG.

203所示的粘合剂体内。 203 adhesive body as illustrated.

[0201] 在另一实施例中,嵌入的微电子系统可用于表面肌电图描记(sEMG)或侵入式肌电图描记。 [0201] In another embodiment, the embedded system may be used for microelectronic surface electromyography (of sEMG) or invasive electromyography. 在两种情况下,换能器均是相对简单的2〜3电极器件。 In both cases, the transducer are relatively simple device electrodes 2 ~. 测量的信号是由肌肉或肌肉组产生的直流电压。 The measured signal is a DC voltage generated by the muscles or muscle groups. 为了理解该信号,它必须被微电子系统分析或被存储用于将来的分析。 To understand this signal, it must be analyzed microelectronic system or stored for future analysis.

[0202] 收集的数据在有关时、在发生某些事件时或以某些时间间隔被传送给中央单元(CU) 。 [0202] For data collected at, when certain events occurring in certain time intervals or transmitted to a central unit (CU). CU适当地为具有无线接收/发送能力的便携式硬件,诸如但不限于PDA (个人数字助理)、移动电话或其它的专用硬件。 CU suitably having wireless reception / transmission capabilities of the portable hardware, such as but not limited to, a PDA (personal digital assistant), mobile phone or other dedicated hardware.

[0203] 换能器被适当地设计为克服或忽略皮肤的表面电阻的时间差异。 [0203] transducer is suitably designed to overcome the time difference or ignore the surface resistance of the skin. 干燥的皮肤的电阻为例如500千欧,湿的皮肤可低至500欧。 Drying the skin resistance of 500 kilohms, for example, as low as wet skin 500 ohms. 可以通过利用阻抗大于500兆欧的高阻抗放大器克服这个问题。 This problem can be overcome by using a high-impedance amplifier impedance is greater than 500 megohms. 换能器可被设计为激活第一皮肤接点上的其它系统部件,由此保证更长的寿命。 Transducer may be designed to activate the other system components on the first skin contact, thereby ensuring a longer life.

[0204] 中央处理单元(CPU) —般在抑制模拟或数字过滤的共模(两个电极常有的不希望的信号/噪声)的情况下通过差分测量放大器操纵换能器信号的放大倍数(例如x30〜 x1000)。 [0204] a central processing unit (CPU) - the case (two signal electrodes often undesirable / noise) as the rejection of common mode filtering of the analog or digital transducer magnification manipulation signal by a differential measurement amplifier ( For example x30~ x1000). CPU操纵模拟信号向数字信号的转换。 CPU manipulating analog signals to digital signals. 诸如rms(均方根)、FFT(快速傅立叶变换) Such as rms (root mean square), FFT (Fast Fourier Transform)

的信号分析和与软件组合的数字过滤器被使用以实现对某些事件的数据判定。 Signal analysis and digital filter is used in combination with software to implement the determination of data to certain events.

[0205] 并且,CPU可使用定时器或休眠模式,因此测量仅仅在某些事件中或仅在每秒的一 [0205] and, using a timer or the CPU sleep mode, so only certain measurement events per second or only a

部分或其它的时间段中进行,由此节省电力。 For some or other periods of time, thereby saving power.

[0206] 微电子系统还包含用于存储软件的存储器和用于在数据获取过程中仅无线传送一些数据或不传送数据的情况下的EMG数据存储的存储器。 [0206] The microelectronic system further comprising a memory for storing software and data acquisition EMG for data storage in a case where only some of the data during wireless transmission or transfer data memory. 这些数据可在以后被传送。 These data may be transferred later. [0207] 由于CPU由于不活动周期中的功率下降保证较长的寿命,因此电源被考虑为一次性电池,或者,它被考虑为可再充电电池。 [0207] Since the period of inactivity since CPU power drop ensure a long lifetime, power is considered to be a disposable battery, or it may be considered as a rechargeable battery. 可再充电电池通过RF链路或者当系统未使用时通过将微电子系统放在充电支架中被再充电。 Rechargeable battery or when the RF link is not used by the system on the charging cradle microelectronic system is recharged. 使用一块电池或在充满电时,在激活后能够有几周的寿命。 When using a battery or fully charged, after activation to have the life of several weeks.

[0208] 数据通过可保证没有数据损坏的协议或方法被传送给中央单元。 [0208] Data transmitted to the central unit via the protocol or method does not guarantee data corruption. 并且,在激活后, 为了确认系统的操作状态,电池寿命条件和/或数据突发被传送。 And, after activation, in order to confirm the state of operation of the system, battery life condition and / or a data burst is transmitted. 一经请求,系统就将传送存储数据。 Upon request, the system will transmit the stored data.

[0209] 用于肌电图描记的微电子系统可任选地包含在由CPU决定的某些事件中激活微电子系统中的警报的致动器,该警报诸如扬声器或LED。 [0209] The microelectronic system for electromyography may optionally comprise activating the microelectronic actuator system alarms in certain events determined by the CPU, the alarm such as a speaker or LED. 激活致动器的事件也可以是电池电量太低。 Event activation of the actuator may be a low battery.

[0210] 根据本发明的该实施例,各种部件在机械上或在电学上被互连,并可被封装到模块内。 [0210] According to this embodiment of the present invention, the various components are mechanically or electrically interconnected, and may be encapsulated within the module. 但是,各种部件也可被单独地集成到粘合剂体内。 However, the various components may be separately integrated into the adhesive body. 这些部件可以是但不限于电池、天线和致动器。 These components may be, but is not limited to a battery, an antenna, and an actuator.

[0211] 各种部件也可被安装到PCB(印刷电路板)或柔性PCB上并涂敷有保护层并被直接嵌入粘合剂中。 [0211] various components may also be mounted on the PCB (printed circuit board) or a flexible PCB and coated with a protective layer and directly embedded in the adhesive.

[0212] 因此,在本发明的特定实施例中,微电子系统是用于肌电图描记的系统并包含换能器(2〜3个电极和测量放大器)、CPU(微控制器,例如,ATMEGA 128L)、电源(例如,电池)、通信(例如,向CU)和存储部件和致动器(LED)。 [0212] Thus, in certain embodiments of the present invention, the microelectronic system is a system electromyography and comprises a transducer (2 or 3 electrodes and measuring amplifier), the CPU (micro controller, e.g., ATMEGA 128L), power supply (e.g., battery), a communication (e.g., the CU) and the storage means and the actuator (LED). 该系统可被嵌入图3和图3A所示的粘合剂体内。 The system may be embedded in the adhesive body as illustrated in Figure 3 and Figure 3A. [0213] 在运动或适应性锻炼中,不同的或几个相同的微电子系统可被组合使用。 [0213] or adaptive motion exercise, several of the same or different microelectronic system may be used in combination. 并且,几个换能器可被用于相同的粘合剂器件中。 Further, several transducers may be used in the same adhesive device. [0214] 适应性传感器网络因此可包含: [0214] Adaptive sensor network may thus comprise:

[0215] 具有肌肉活动(sEMG)传感器的粘合剂器件,身体两侧(胳膊、腿等) 一侧一个。 [0215] adhesive device having a muscle activity (of sEMG) sensor, both sides of the body (arms, legs, etc.) a side. 微电子系统可以以这种方式被设计以确定肌肉的疲劳并指示什么时候肌肉生长是最佳的或者什么时候锻炼没有益处。 Microelectronic systems can be designed in such a way to determine muscle fatigue and muscle growth indicate when or what time is the best exercise there is no benefit. sEMG信号的频率分析可用于实现希望的测量输出。 SEMG signal frequency analysis may be used to achieve the desired output measurement. 一般地,粘合剂器件被放在被积极地锻炼的肌肉组上。 Generally, the device is placed on the adhesive is actively exercise muscle groups.

[0216] 包含监视心搏和心脏脉冲形状的心率(ECG)传感器系统的本发明的两个或三个粘合剂器件。 [0216] The present invention comprises two monitoring the heart rate of the heart beat and pulse shape (ECG) sensor system or the three adhesive device.

[0217] 包含用于确定肌肉中的疲劳毒素的水平的微电子系统的粘合剂器件。 [0217] adhesive device comprising means for determining the level of muscle fatigue toxin microelectronic system.

[0218] 用于存储信号并将其发送给中央单元或直接与适应性硬件通信的位于体部中心 [0218] for storing a signal and sends it to the central unit or adaptive hardware in communication with the central body portion positioned directly

的传感器网络集线器/网关。 The sensor network hub / gateway.

[0219] 通过电池的更换或充电,在一个适应性阶段中使用的微电子系统可在另一适应性阶段中被再使用。 [0219] or by replacing the rechargeable battery, a microelectronic system for use in an adaptive phase may be reused in a further adaptation phase.

[0220] 因此,根据本发明的粘合剂器件可被适当用于测量与疾病、健康护理监视、康复、 体育医学或一般监视有关的生理条件。 [0220] Thus, the adhesive device according to the present invention can be suitably used to measure with a disease, monitoring the health care, rehabilitation, sports medicine or physiological conditions related to the general monitoring. 一般地,应用将用于例如当患有心脏虚弱、癫痫症、 发烧和高烧痉挛、糖尿病、中风、动脉硬化和肌肉营养不良时处于危险中的病人。 In general, the application will be used for example when suffering from cardiac weakness, epilepsy, fever, cramps and fever, in patients at risk of diabetes, stroke, atherosclerosis and muscular dystrophy. 应用可与最优化药物治疗、用于疾病的登记或用于报警的一般监视有关。 For general monitoring application may optimize drug therapy, for registering a disease or for alarm. 其它应用将关于体力劳动、 肌肉强度、肺活量的监视用于康复,或者在运动医学中用于确定工作和重复、加速度、心率、 肌肉应力和强度、取向等。 Other applications on the monitored physical, muscle strength, lung capacity for rehabilitation, or to determine and repetitive work in sports medicine, acceleration, heart, muscle stress and strength, orientation and the like. 其它的应用将用于监视运动中的对象或哺乳动物。 Other applications for monitoring the motion of an object or a mammal. 诸如患有痴呆症的老年人的精神不健全的病人或个体对于这些应用将是典型的。 The spirit of the elderly with dementia, such as inadequate patient or individual for these applications will be typical.

[0221] 根据本发明的粘合剂器件将优选是无线的,因为这在获得尽可能平滑的器件形状和表面并且仍实现微电子系统的保护方面是有意义的。 [0221] The adhesive device of the invention will preferably be wireless, since it is obtained as the smooth surface and shape of the device and still achieve protection of the microelectronic system is significant. 但是,在某些情况下,能够通过导线使器件互连可能是重要的。 However, in some cases, the device can be interconnected by wires may be important. 当微电子系统被分成分别存在于本发明限定的粘合剂器件中的两个部分时,这尤其是一种选项。 When the microelectronic system is divided into two portions in the present invention as defined in the respective adhesive device, which is a particular option.

[0222] 微电子感测系统或其部件可在粘合剂体的制造过程中或在粘合剂体的制造之后、 例如紧挨着粘合剂器件向皮肤的施加之前或在粘合剂器件向皮肤的施加之后被加入粘合剂体内。 [0222] The microelectronic system or components thereof may be sensed in the production process of the adhesive body or after manufacturing the adhesive body, for example, immediately before application of the adhesive device to the skin or the adhesive means after applying the adhesive to the skin of the body are added.

[0223] 如上所述,诸如整个微电子系统的多个部分的粘合剂器件的多个部分可以是可互换的或可再使用的。 [0223] As described above, a plurality of portions of adhesive devices such as a plurality of portions of the entire microelectronic system may be exchangeable or reusable.

[0224] 因此,在本发明的一个方面中,本发明公开了至少包含粘合剂元件和电源元件的器件,所述器件适于将诸如微电子系统的电子电路附着到表面上并向所述电子电路供电, 其中,器件元件中的至少一个可以可释放地附着到电子电路上;电源元件可与电子电路电连接;并且,粘合剂至少具有用于粘合到表面上的第一区域。 [0224] Accordingly, in one aspect of the present invention, the present invention discloses a device comprising at least a binder components and power components, the electronic circuit means is adapted such microelectronic system is attached to the upper surface and the electronic circuit power supply, wherein at least one of the device elements may be releasably attached to the electronic circuit; a power supply element may be electrically connected to the electronic circuit; and a first adhesive having at least a region for bonding to a surface.

[0225] 所述的这种器件可出于特定的目的将电子电路附着到诸如哺乳动物的皮肤的表面上并向其供电。 [0225] Such a device may be an electronic circuit attached to the surface of the skin, such as a mammal and supplies power for a specific purpose. 当特定的目的被实现时,器件和电子电路从表面上被去除,并且器件与电路分开并被处理掉。 When a specific object is achieved, and the electronic circuit device is removed from the surface, and the device and disposed of separately from the circuit. 因此,与电子电路相比相对较为便宜的形成器件的元件被处理掉,而电子电路可与用于将电子电路附着到表面上并对电路供电的根据本发明的新器件一起被再使用。 Thus, as compared with the electronic circuit device is formed relatively inexpensive elements are disposed, and an electronic circuit may be used to supply the electronic circuit and attached to the surface of the circuit to be reused with the new device according to the present invention. 有利的是,由于与以前相比更多的部件被再使用,因此这允许大大降低成本,同时还 Advantageously, as compared with previous more components to be reused, this allows greatly reduce the cost, and also

22保护环境。 22 protection of the environment.

[0226] 通过术语"可释放地可附着"和"可释放地可连接",应当理解,器件和电子电路可以以使得无意中分开它们的风险最小化的方式被暂时附着。 [0226] By the term "releasably attachable" and "may be releasably connected," it should be understood that the devices and electronic circuits that may be unintentionally separated from their way that minimizes the risk is temporarily attached. 但是,器件和电子电路应以使得可在希望时分开它们的方式被附着。 However, devices and electronic circuits that should be separated when their manner desired to be attached.

[0227] 并且,通过术语"可电连接",应当理解,电源元件和电路以使得可在它们之间传送电流的方式被配置。 [0227] Further, by the term "electrically connected", it should be understood that the power supply circuit and the element can be transmitted in a manner such that the current is arranged between them. 可例如通过使用一般由镀金或镀银的铜制成的标准电接点完成这一种,或者电连接可以以电源在电路中感应电流的无线方式被设置。 For example, by using standard electrical typically made of silver-plated or gold-plated copper pads to complete this kind, or may be electrically connected in a wireless manner induction current in the power supply circuit is provided.

[0228] —般地,电路是由以适当的布线连接的大量的微电子数字部件和/或模拟部件形成的微电子系统。 [0228] - a camel, a microelectronic circuit is a system formed by a large number of microelectronic components with an appropriate number of connecting wires and / or analog components. 部件一般被配置在印刷电路板上,在该印刷电路板上,适当的迹线和轨迹被蚀刻、电镀或以其它的方式被设置。 Member is generally configured in the printed circuit board, the printed circuit board, and traces the proper track etched, plated or otherwise provided in other ways. 数字部件可例如是微处理器、诸如RAM块的存储器元件,并且模拟部件可例如是设置在印刷板上的电阻器和电容器。 Digital components may, for example, a microprocessor, memory elements such as RAM blocks and analog components may be provided, for example, resistors and capacitors on the printed board.

[0229] 在一个实施例中,电源元件被附着到粘合剂元件上,并且粘合剂元件具有用于粘合到电子电路上的第二区域。 [0229] In one embodiment, the power element is attached to the adhesive element and the adhesive element has a second area for adhering to the electronic circuit.

[0230] 通过使电源元件和粘合剂元件相互附着,仅有一个物理部分被提供,从而避免用户必须同时留意电源元件和粘合剂元件并在施加这两种元件上花费时间。 [0230] By the power supply element and the adhesive element attached to each other, only one physical part is provided, thus avoiding the user must pay attention to the power element and the adhesive element is applied and time spent on these two elements. 因此,方便用户的较小并且离散的器件被提供。 Thus, the user is small and discrete devices are provided. 并且,电子电路可被粘合到粘合剂元件上,用于改进操作性,因为当将电子电路施加到表面上时将仅必须操纵一个单元。 The electronic circuit may be adhered to the adhesive element, for improving the operability, because the electronic circuit when applied to the surface to be actuated to only one unit.

[0231] 有利的是,第二区域和电子电路之间的第一剥离力比电源元件和粘合剂元件之间 [0231] Advantageously, the peel force between the first region and the second between the electronic circuit element and the adhesive element than the power supply

的第二剥离力小。 A second small peel force. 这使得能够在使用后很容易地从器件上分离微电子电路。 This makes it possible to easily separated from the microelectronic circuit device after use.

[0232] 为了进一步保证电源元件和粘合剂元件不相互分离,电源元件可至少部分包含于 [0232] In order to further ensure the power element and the adhesive member are not separated from each other, the power element may be at least partially contained within

粘合剂元件中。 Adhesive element.

[0233] 通过"包含",应当理解,电源可被完全或部分嵌入粘合剂中。 [0233] By "comprising", it should be understood that the power supply may be completely or partially embedded in the adhesive. 当被完全嵌入时,仅有电接点穿过粘合剂露出,或者薄的柔性导线被嵌入从电源延伸到粘合剂的外表面的粘合剂内,在粘合剂的外表面它可与电子电路接触。 When fully embedded, only electrical contact through the adhesive is exposed, or embedded in a thin flexible wires are extended from the inner to the outer surface of the adhesive power of the adhesive, the outer surface of the adhesive it may be contacting the electronic circuit. 并且,在术语"包含"的意义内,电源也可被部分嵌入粘合剂内,由此穿过粘合剂露出更大的部分。 And, within the meaning of "comprising" term, power may also be partially embedded within the adhesive, whereby the adhesive is exposed through the larger portion. 这允许在被安全地附着到粘合剂上的同时电子电路和电源之间有较大的接触表面。 This allows a greater contact surface between being securely attached to the adhesive while the electronic circuitry and the power supply.

[0234] 为了保护电子电路的不同部分,一般例如通过在硅酮或热熔性聚合物中涂敷它对它进行封装。 [0234] In order to protect the different parts of the electronic circuit, for example, that it is generally encapsulated by coating a silicone polymer or a hot melt. 封装可例如形成为包含电子电路的至少一部分的外壳。 Package may be formed, for example at least a part of the housing containing the electronic circuit. 在一个实施例中,外壳可由近端外壳部分和远端外壳部分形成。 In one embodiment, the housing may be proximal housing portion and a distal housing portion is formed. 器件适于可释放地与所述外壳连接。 Means adapted to be releasably coupled to the housing. [0235] 大量的封装技术是已知的,并且包含涂敷、二部件聚合物、热熔性聚合物封装、陶瓷封装和玻璃封装。 [0235] a large number of encapsulation techniques are known, and comprises a coating, two component polymers, hot melt encapsulation polymer, a ceramic package and a glass package. 其它的用于封装电气部件的方法是本领域已知的。 Other methods for encapsulation of electric components are known in the art.

[0236] 微电子系统或其部件被适当地封装到聚合物膜、聚合物箔或聚合物涂层中,或者 [0236] The microelectronic system or components thereof is suitably encapsulated in a polymer film, a polymer foil or a polymer coating, or

微电子系统或其部件被模压到聚合物材料中,或者被封装到玻璃或陶瓷材料中。 The microelectronic system or components thereof is molded into the polymeric material, or packaged into a glass or ceramic material.

[0237] 由于硅酮表面容易从粘合剂体的粘合剂中被释放,因此,当微电子部件要被放入 [0237] Since the silicone surface is easily released from the adhesive of the adhesive body, and therefore, when the member to be placed in microelectronic

粘合剂体中的通孔或凹槽中时,或者在希望使得容易去除或更换封装的微电子部件的情况 When the binder body through holes or grooves, so desired or easily removed or replaced in the case of a microelectronic component package

下,特别优选诸如PDMS的硅酮中的封装。 Under particularly preferred silicone such as PDMS package. 可很容易地从粘合剂释放的其它材料也可用于封装。 Other materials can be easily released from the adhesive may also be used to encapsulate.

[0238] 为了在使用后很容易地从外壳中去除粘合剂元件,外壳可有利地由允许外壳很容易地释放的材料制成或涂敷有该材料。 Made [0238] In order to be easily removed from the adhesive member housing after use, the housing may advantageously allows the housing to be readily released or a material coated with the material. 这种材料可例如是常在不同的粘合剂应用中被用于释放衬套的硅酮。 Such materials may be used, for example, is often a silicone release liner in various adhesive applications.

[0239] 在另一实施例中,至少一个电源元件适于被形成于远端外壳部分中的凹槽接收。 [0239] In another embodiment, the at least one power element is adapted to be received in the recess formed in the distal housing portion.

至少一个电接点被设置在远端外壳中,从而在电源元件和电路之间提供电连接。 At least one electrical contact is provided at the distal end of the housing to provide electrical connection between the power source and the circuit element.

[0240] 通过如上所述设置凹槽,可避免电源元件移位并由此失去与电路的电接触。 [0240] By providing grooves as described above, the power element can be shifted and thus avoid the loss of contact with the electrical circuit. 当电 When electricity

源被放在其中时凹槽还产生平齐的组件,从而使其具有平滑的表面,该表面将不象电源突 Wherein the source is placed in the recess flush assembly further generated, so that it has a smooth surface, the surface will not be as power projection

出的表面那样容易被抓住。 A surface as easily caught.

[0241] 具有许多不同的应用并被供电并被附着到表面上的许多类型的电子电路可与根据本发明的器件一起使用。 [0241] have a number of different applications and supply many types and attached to the upper surface of the electronic circuit may be used with the device according to the present invention. 器件在使用后可被处理但电子电路可被再使用。 After use the device can be processed with the electronic circuit may be reused. 在一个实施例中,器件由此适于可释放地连接到作为传感器电路的电子电路上,所述传感器电路要被附着到哺乳动物的一般为皮肤的身体表面上。 In one embodiment, the device thus adapted to be releasably connected to the electronic circuit as the sensor circuit, the sensor circuit is to be generally attached to a mammal of the skin on the body surface.

[0242] 通过术语"传感器"或"感测",应当理解,电子电路的周围环境的参数被传感器电 [0242] By the term "sensor" or "sense", it will be appreciated that the parameters surrounding the sensor electronic circuitry is electrically

路检测。 Road testing. 这些参数可包含例如温度、湿度、电信号、电场、光、噪声、生物信号和磁场。 These parameters may include, for example, temperature, humidity, electrical signals, electric field, light, noise, and the magnetic field of biological signals.

[0243] 因此,本发明还涉及适于附着到哺乳动物的身体表面上的传感器组件,该传感器 [0243] Accordingly, the present invention also relates to a sensor assembly adapted to be attached on the body surface of a mammal, the sensor

组件包含:传感器电路,包含大量的电气部件;用于向电气部件中的至少一个供电的至少 Assembly comprising: a sensor circuit containing a large number of electrical components; electrical components for the at least one supply of at least

一个电源元件;用于将传感器组件附着到哺乳动物的身体表面上的至少一个粘合剂元件; A power supply element; at least one adhesive element is attached to the sensor assembly on the body surface of a mammal;

并且,电源元件和粘合剂元件中的至少一个可释放地连接到传感器电路上。 Further, the power elements and at least one binder element is releasably connected to the sensor circuit.

[0244] 因此,当诸如包含电源和粘合剂元件的器件的不同的元件是一次性的并且诸如电 [0244] Thus, when different elements of the device includes a power supply and a binder such as a disposable element such as electrical and

子电路的其它元件被再使用时,传感器组件提供上面公开的优点。 When other elements are re-used sub-circuit, the sensor assembly provides the advantages disclosed above.

[0245] 在传感器组件的一个实施例中,传感器电路至少部分包含于外壳中,这里,外壳由近端外壳部分和远端外壳部分形成。 [0245] In one embodiment the sensor assembly embodiment, the sensor circuit at least partially contained in the housing, where the housing is formed by a proximal end and a distal housing portion housing portion. 有利的是,传感器组件可被提供在粘合剂和外壳之间的第一剥离力比粘合剂和电池之间的第二剥离力小的地方。 Advantageously, the sensor assembly may be provided on a first peel force between the adhesive and the housing is smaller than a second peel force between the adhesive and place the battery. 这使得能够很容易地从粘合剂和电源元件分离传感器电路。 This makes it possible to easily separated from the adhesive and the power sensor circuit elements.

[0246] —般地,传感器组件将包含附着到近端部分的近端表面上的至少一个换能器。 [0246] - camel, comprising a sensor assembly attached to the proximal surface of the proximal portion of the at least one transducer. 如上所述,近端部分与远端部分一起构成用于保护传感器电路的至少一部分的外壳。 As described above, a proximal portion and a distal portion together form a housing for protecting at least a portion of the sensor circuit. 该换能器将不同的生理信号转换成电信号。 The transducer converts the different physiological signals into electrical signals. 这些换能器可例如是电势测定的、caliometric、传导测定的、化学机械的或光学的。 These transducers can be determined, for example, it is the potential, caliometric, conductivity measurement, chemical-mechanical or optical.

[0247] 为了防止电源意外移出与传感器电路的电接点,可以在远端外壳部分中形成凹槽,该凹槽适于容纳至少一个电源,并且该至少一个电接点被设置在远端外壳中,从而在至少一个电源和电气部件之间提供电连接。 [0247] In order to prevent accidental removal of the power sensor circuit with electrical contacts, the grooves may be formed at the distal end of the housing portion, the recess adapted to receive at least a power source, and the at least one electrical contact is provided at the distal end of the housing, thereby providing an electrical connection between the power source and the at least one electrical component. 例如当粘合剂由于附着传感器组件的表面的移动而移动时,凹槽由此保护电源免受外面的移动影响。 For example, when the adhesive surface is moved due to movement of the sensor assembly is attached, the groove thereby protect the power supply from the outside impact movement. 另外,通过保护电源免受外面的移动影响,电源和微电子电路之间的电连接也被保护以避免断开。 Further, by protecting the power supply from the outside impact movement, electrically connected between the source and the microelectronic circuit is also protected from disconnection.

[0248] 在另一方面中,本发明涉及包含粘合剂元件和电源元件并用于将电子电路附着到表面上并向所述电子电路供电的器件的使用,其中,所述电子电路可释放地连接到粘合剂元件和电源元件上。 [0248] In another aspect, the present invention relates to a power supply element and the adhesive element and for attaching the electronic circuit used to power the electronic circuits and the upper surface of the device, wherein the electronic circuit is releasably attached to the adhesive element and the power element.

[0249] 许多传感器通过导线与监视系统连接。 [0249] Many sensors are connected by wires to the monitoring system. 这种系统的缺点在于,由于导线被附着到身体上的传感器上并与监视系统连接,因此病人不能自由移动。 A disadvantage of this system is that, since the wires are attached to the sensor body and connected to the monitoring system, so the patient can not move freely. 每当病人希望移动时,他必须非常仔细以避免移去附着到传感器上的导线中的任一个,并且他必须进一步拾取监视系统并一直携带它。 Whenever the patient wishes to move he must be removed very carefully in order to avoid a lead attached to any of the sensors, and he must further pick up the monitoring system and carry it.

[0250] 并且,优选不需要外部布线的诸如电池的单独的电源。 [0250] It is preferable that no separate power supply such as a battery external wiring. 这种优选与本发明一起使 This makes the present invention preferably together with

24用的单独的电源元件是本领域公知的。 Element 24 is a separate power supply are well known in the art.

[0251] —般地,电池可被分为可一次性使用的一次电池和可再充电的二次电池。 [0251] - camel, the battery may be divided into a primary battery and a rechargeable secondary battery may be disposable. [0252] 各种类型的一次电池基于阳极、阴极和电解质材料的不同的组合被制造。 [0252] Various types of primary batteries are manufactured based on different combinations of anode, cathode and electrolyte materials. 一次电池通用的化学品包含锌_碳、氯化锌、碱性二氧化锰、氧化银、锌/空气和以下组合中的锂: 锂/ 二氧化硫(Li-S02)、锂/亚硫酰二氯(Li-SoCL2)、锂/ 二氧化锰(Li-Mn02)、锂/ 一氟化碳(Li-(CF)n)、锂/氧化铜(Li-Cu0)和锂/碘(LH2)。 Chemicals common primary battery comprising a carbon _ zinc, zinc chloride, manganese dioxide, alkaline, silver oxide, zinc / air, and the following combination of lithium: lithium / sulfur (Li-S02), lithium / thionyl chloride (Li-SoCL2), lithium / manganese dioxide (Li-Mn02), lithium / carbon monofluoride (Li- (CF) n), lithium / copper oxide (Li-Cu0) and lithium / iodine (LH2).

[0253] 二次电池是可充电的,并且一般基于镍镉(NiCd)、镍金属氢化物(NiMH)或锂离子 [0253] Secondary batteries are rechargeable and are generally based on nickel-cadmium (NiCd), nickel metal hydride (NiMH), or lithium ion

技术。 technology. 二次电池通常具有需要特殊的操作和处理的更具活性的化学品。 The secondary battery generally has a more active requires special handling and processing of chemicals.

[0254] 存在许多电池尺寸和电池外壳,包含标准圆柱电池、多单元电池、硬币电池、袋状 [0254] There are many battery size and battery housing, comprising a standard cylindrical battery, a multi-cell battery, coin cells, pouch-shaped

电池和薄膜电池。 Cells and thin film batteries.

[0255] 标准圆柱电池和多单元电池从例如闪光灯和遥控器的普通家庭用具为人们所认识。 [0255] standard cylindrical battery and multi-cell battery such as a conventional home appliance from a remote controller and the flash is recognized. 该组包含公知的尺寸AA、 D、 C和9V矩形。 This group contains AA size known, D, C, and 9V rectangular.

[0256] 硬币或钮扣电池一般较小、呈圆形并且高几毫米。 [0256] coin or button cells are typically small and rounded millimeters high. 该组常在手表、助听器和存储器 This group often watches, hearing aids and a memory

备份中被找到。 Found backup. 由于它们基于固态阴极,因此这些系统被认为非常安全。 Because they are based on solid state cathode, so these systems are considered very safe.

[0257] Duracell、Panasonic、Sony禾P Energizer是标准和硬币单元电池的一些主要的制造商。 [0257] Duracell, Panasonic, Sony Wo P Energizer are some of the major manufacturers and standard coin cell.

[0258] 作为替代方案,与具有固态电解质的锂聚合物电池一起使用袋状外壳可提供另一类型的电池。 [0258] Alternatively, the use of bag-shaped housing with a solid electrolyte having a lithium-polymer battery can provide another type of battery. 这提供低成本的可弯曲结构。 This provides a low cost bendable structure. 除了可再充电以外,该电池的特征在于较高的能量密度。 In addition to the rechargeable, battery is characterized by a higher energy density. 固态电解质允许提供更安全的防泄漏电池。 The solid electrolyte allows a more secure leak-proof batteries. 箔结构允许提供非常薄且轻的电池设计。 Foil structure allows to provide a very thin and light cell design.

[0259] Bullith Batteries基于这种技术制造柔性电池。 [0259] Bullith Batteries based on this technology for producing a flexible battery.

[0260] 另一类型的电池是基于固态锂聚合物化学品在各种基片上印刷的薄膜电池。 [0260] Another type of solid state lithium polymer battery is based on a variety of chemicals printed thin film battery substrates. 它们可被直接印刷到塑料、薄金属箔或纸上,从而得到超薄的柔性电源。 They may be printed directly onto the plastic, thin metal foils or paper, to obtain a thin flexible power source. 电池可以以任何形状或尺寸被制造,但一般在能量存储和电流容量上受限。 The battery may be manufactured in any shape or size, but generally limited in the energy storage and current capacity. 由于它们不含腐蚀性的化学品、不会过热、爆炸或导致电击,因此这些电池是非常安全的。 Since they contain no corrosive chemicals, will not overheat, explode or cause electric shocks, so these cells are very safe.

[0261] 以色列公司Powerp即er正在出售基于薄膜技术的产品。 [0261] Powerp Israeli company that is being sold er-based thin-film technology. 制造这种类型的电池的 Manufacture of this type of battery

其它的公司是0ak Ridge Micro Energy Inc.禾口InfinitePower Solutions。 Other companies are 0ak Ridge Micro Energy Inc. Hekou InfinitePower Solutions.

[0262] 在一个实施例中,粘合剂元件如上所述形成为三维粘合剂体,即,粘合剂元件具有 [0262] In one embodiment, an adhesive member as described above is formed as a three-dimensional adhesive body, i.e., having an adhesive element

相当大的厚度,一般比施加它的背衬层厚几倍。 Substantial thickness, generally higher than that of the backing layer is applied several times thicker.

[0263] 制成三维粘合剂体的压敏粘合剂适当地是可模压的热塑性或在化学上固化的压敏粘合剂,该压敏粘合剂具有使得粘合剂器件能够符合身体部位的曲率的柔性同时即使在移动条件下也保持其粘合性能。 [0263] The pressure-sensitive adhesive made of a three-dimensional adhesive body is suitably a mouldable thermoplastic or chemically curing pressure sensitive adhesive, the pressure-sensitive adhesive so that the adhesive device having a body able to meet while the curvature of the flexible portion moving even under conditions retaining its adhesive properties.

[0264] 背衬层可进一步用作覆盖层,这里所述背衬/覆盖层被设置为用作施加粘合剂的 [0264] The backing layer may further be used as a cover layer, where the backing / layer is provided to cover the adhesive is applied as

基底并保护粘合剂免受外部环境影响,例如防止对亚麻布、衣服的粘合或湿气。 Protect the adhesive and the substrate from the external environment, for example to prevent linen, clothes or moisture bonding.

[0265] 并且,电动机械显示系统可被施加到覆盖层上。 [0265] Further, the electromechanical display system may be applied to the cover layer. 这种显示系统可允许用户在将供 Such a display system may allow the user to supply the

电的粘合剂添加到微电子系统上之前或在使用中测试电池的充电。 Electrical binder added to the microelectronic system before charging the test cell or in use.

[0266] 本领域已知的简单的电池指示器可由此被使用。 [0266] known in the art simple battery indicator can thereby be used. 例如,包含两个接触电极和一般为液晶或无色染料的传导性的热变色墨水的箔可被使用。 For example, it comprises two contact electrodes and the conductive generally thermochromic liquid crystal ink or foil leuco dye may be used.

[0267] 当例如使用普通的硬币电池时,一个电极与电池的阳极接触,另一电极与电池的 [0267] When, for example using conventional coin cell, the anode electrode contact with a cell, the other electrode of the battery

25阴极接触。 25 cathode contact. 通过按压电池顶端的接触器件,电池测试电路被关闭并且热变色墨水将变亮,从而指示电池状态。 By pressing the top contact device battery, the battery test circuit is closed and thermochromic ink will light, indicating the battery status.

[0268] 覆盖层或膜保护集成的/嵌入的微电子部件以及粘合剂体免受环境影响。 [0268] cover layer or film for protecting the integrated / embedded microelectronic components as well as the adhesive body against the environment.

[0269] 如下面详细说明的那样,本发明的粘合剂器件可以以许多方式被构建。 [0269] As described in detail below, the adhesive device of the present invention may be constructed in many ways. 所有结构 All structures

的共同之处在于,三维几何结构为微电子部件提供很好的保护,同时使器件具有尽可能平 In common is that the three-dimensional geometry provides good protection for microelectronic components, while the device with as level

滑的表面。 Slippery surface. 特别地,器件的边缘的形状需要引起注意,否则亚麻布将很容易粘住它们并导致 In particular, the shape of the edge of the device requires attention, otherwise the linen will be easy to stick to them and lead

滚动。 scroll. 因此,嵌入了微电子系统的粘合剂器件的周缘必须被成形为具有小于器件的最厚部 Thus, the peripheral edge of the adhesive device is embedded a microelectronic system must be shaped as the thickest portion of the device less than

分的厚度的一半的厚度,该最厚部分一般是包含微电子系统的中心部分。 Half of the thickness of the points, the thickest part of the central portion generally comprising a microelectronic system.

[0270] 图l表示根据本发明的粘合剂器件的典型表示的形状的模具断面。 [0270] Figure l showing the shape of the mold according to an exemplary representation of the device of the present invention the adhesive section. CT是器件的最 CT is the most devices

大厚度,PT是器件的周缘的厚度。 Large thickness, PT is the thickness of the periphery of the device. 器件不必采取对称的形状。 Device need to take a symmetrical shape.

[0271] 图2具有表示在图3〜12中示出的粘合剂器件的部分的框。 [0271] FIG 2 has a block portion of the adhesive device illustrated in FIG. 3~12. 如图2所示,电子部分101被嵌入具有覆盖层103和释放衬里104的粘合剂102体内。 2, the electronic parts 101 are embedded in the adhesive body 102 having cover layer 103 and release liner 104.

[0272] 在本发明的一个实施例中,所有的电气部件均被组装到一个单元中,该单元被嵌入粘合剂体内并且在所有各边都被压敏粘合剂覆盖,从而基本上使得其成为一次性的垫。 [0272] In one embodiment of the present invention, all electrical components are assembled into a unit, the unit is embedded in the adhesive body and is covered with a pressure sensitive adhesive on all sides, so that substantially it becomes a one-time pad. 如图3所示,电子部分101的组件被嵌入具有覆盖层103和释放衬里104的粘合剂体102 内。 3, the components of the electronic part 101 is embedded in the adhesive body 102 having cover layer 103 and release liner 104.

[0273] 图4示出微电子感测系统的部件可在不同的位置被集成到粘合剂体内,条件是在部件之间存在所需的机械或电气连接。 [0273] FIG. 4 shows a microelectronic sensing system components may be integrated at different locations within the adhesive, with the proviso that the mechanical or electrical connection between the presence of components required. 所有的部件被完全嵌入粘合剂体内并在所有各边都被粘合剂体的压敏粘合剂覆盖。 All parts are completely embedded in the adhesive body and is covered with a pressure sensitive adhesive in the adhesive body on all sides.

[0274] 所有微电子部件在粘合剂体内的集成对于便宜的一用一扔器件是有用的。 [0274] All the microelectronic components integrated in the adhesive body to fling with a cheap device is useful. 由于粘合剂器件的较短的使用时间,因此电子部件需要很少或不需要诸如封装的额外的保护。 Due to the short time of the adhesive device, the electronic component and therefore it requires little or no additional protection, such as a package. 粘合剂体本身用作微电子部件的保护。 Microelectronic adhesive itself serving as a protective member.

[0275] 即使微电子系统的所有部件在所有各边被粘合剂体覆盖,几个感测应用(湿度、 光学或化学/气体)仍然是可能的。 [0275] Even if all the components of the microelectronic system is covered on all sides in the adhesive body, several sensing applications (humidity, optical or chemical / gas) is still possible.

[0276] 可在边上被覆盖的系统也可以是RFID标签、网络集线器、网络协调器、网关和能 [0276] The system may also be covered by the edge of an RFID tag, a network hub, a network coordinator, and the gateway can

够收集、传送和/或发送数据的其它系统。 Enough were collected, transferred to other systems and / or transmitting data. 这些系统常需要诸如压力接触或磁接触的某种 These systems often require some sort, such as a pressure contact or a magnetic contact

激活用于启动系统,以克服对于与活动周期相比的较大的搁置寿命的需要。 Activated for starting the system, compared to the need to overcome the period of activity for shelf life greater.

[0277] 图5示出本发明的微电子系统被嵌入/施加到粘合剂体内的凹槽中的实施例。 [0277] FIG. 5 illustrates the present invention, the microelectronic system is embedded / adhesive embodiment that the grooves applied to in vivo. concave

槽被定位在粘合剂体的上表面中。 Grooves are positioned on the surface of the adhesive body. 微电子系统可在粘合剂体的制造中、紧挨着粘合剂器件 The microelectronic system may be manufactured in the adhesive body, next to the adhesive device

被附着到皮肤上之前或之后被嵌入/附着。 It is attached to the skin before or after being embedded / attached. 根据本发明的该实施例,微电子系统可被再使用。 According to this embodiment of the present invention, the microelectronic system may be reused.

[0278] 图6表示与图5的系统类似的微电子系统,但是,在图6中系统包含两个部分。 [0278] FIG. 6 shows the system of Figure 5 is similar to a microelectronic system, however, the system in FIG. 6 consists of two parts. 上面的一个部分是可互换的或可再使用的,下面的部分从开始被嵌入粘合剂的凹槽中。 The above is a part exchangeable or reusable, beginning from the portion below the engagement groove binder. 上部可例如是电源。 It may be, for example, an upper portion of the power supply.

[0279] 图7示出这样一个实施例,S卩,微电子系统的一些部件在制造中被嵌入粘合剂器件内并且一些部件被施加到粘合剂体的上表面中的凹槽中,即是可互换的或可再使用的。 [0279] FIG. 7 shows such an embodiment, some components S Jie, the microelectronic system is embedded within the adhesive device during production and some components are applied to the surface of the adhesive in a recess in the body, That is exchangeable or reusable. 根据本发明, 一个或更多个部件可被嵌入粘合剂体内并且一个或更多个部件可存在于粘合剂体的表面上的凹槽内。 According to the present invention, one or more components may be embedded in the adhesive body and one or more components may be present in the grooves on the surface of the adhesive body. 部件之间的必要的机械或电气连接也被嵌入粘合剂体内。 The necessary mechanical or electrical connection between components are also embedded in the adhesive body. 虽然该图仅示出一个,但是,在粘合剂体的上表面中可存在两个或更多个凹槽,并且可存在被集成 Although the figure shows only one, however, there may be two or more grooves on the surface of the adhesive body, and there may be integrated

26到粘合剂体内的两个或更多个部件。 Adhesive 26 to the body of two or more components.

[0280] 凹槽中的可互换的部分可通过凹槽中的压敏粘合剂的粘合剂性能在凹槽中被锁定。 [0280] interchangeable section groove can be locked in the recess by the adhesive properties of the pressure sensitive adhesive groove. 在替代方案中,凹槽中的微电子部件被封装在被设计为配入存在于凹槽中的诸如弹簧锁的锁中的联接器或插头中。 In the alternative, microelectronic components are encapsulated in the recess is designed as a snap lock fit into the recess present in the coupling or lock plugs.

[0281] 图8示出本发明的微电子系统被嵌入/施加到粘合剂体的粘合剂底面中的凹槽内的实施例。 [0281] FIG. 8 illustrates a microelectronic system is embedded in the present invention / adhesive embodiment the bottom surface of the adhesive body is applied to the recess. 微电子系统在粘合剂器件的制造中或紧挨着将粘合剂器件附着到皮肤上之前被嵌入/施加。 In the manufacture of microelectronic system or the adhesive device are immediately embedded / applied prior to attaching the adhesive device to the skin. 该系统一般在要求系统的部件中的一些以非侵入的方式或侵入的方式与皮肤接触的情况下被使用。 The system generally used in some cases required to be non-invasive or invasive manner in contact with the skin of part of the system.

[0282] 图9示出这样一种实施例,即,微电子系统的一些部件在制造中被集成到粘合剂器件内并且一些部件被施加到粘合剂体的下表面中的凹槽中,即是可互换的。 [0282] FIG. 9 shows such an embodiment, i.e., some components of the microelectronic system is integrated into the adhesive during production and some components of the device is applied to the lower surface of the adhesive body in the recess that are interchangeable. 根据本发明, 一个或更多个部件可被集成到粘合剂体内并且一个或更多个部件可存在于粘合剂体的表面上的凹槽内。 According to the present invention, one or more components may be integrated into the adhesive body and one or more components may be present in the grooves on the surface of the adhesive body. 部件之间的必要的机械或电气连接也被集成到粘合剂体内。 The necessary mechanical or electrical connection between components are also integrated into the adhesive body. 虽然该图仅示出一个,但是,在粘合剂体的底表面中可存在两个或更多个凹槽,并且可存在在不同的位置被集成到粘合剂体内的两个或更多个部件。 Although the figure shows only one, however, there may be two or more grooves in the bottom surface of the adhesive body and there may be integrated into the adhesive body in two or more different positions parts.

[0283] 图10示出这样一种实施例,即,微电子感测系统的一些部件在制造中被集成到粘合剂器件内并且一些部件被施加到粘合剂体的底表面中的凹槽中,即是可互换的或可再使用的。 [0283] FIG. 10 shows such an embodiment, i.e., some components of the microelectronic sensing system is integrated into the adhesive during production and some components of the device is applied to the bottom surface of the recess in the adhesive body slot, i.e. are exchangeable or reusable. 根据本发明, 一个或更多个部件可被单独地集成到粘合剂体内并且一个或更多个部件可存在于粘合剂体的表面上的凹槽内。 According to the present invention, one or more components may be integrated separately into the adhesive body and one or more components may be present in the grooves on the surface of the adhesive body. 虽然该图仅示出一个,但是,在粘合剂体的底表面中可存在两个或更多个凹槽。 Although the figure shows only one, however, there may be two or more grooves in the bottom surface of the adhesive body.

[0284] 在换能器或致动器利用皮肤接触或皮肤穿透(例如,电极和针)而微电子系统的其余部分(电池、天线、电极、A/D转换器、放大器)可被嵌入粘合剂体内的情况下,这种结构是合适的。 [0284] In the transducer or actuator using a skin contact or skin penetration (e.g., pin and electrode) while the rest of the microelectronic system (battery, an antenna, electrode, A / D converter, an amplifier) ​​may be embedded a case where the adhesive body, this structure is suitable. 这种结构还具有几种制造优点。 This configuration also has several manufacturing advantages.

[0285] 因此,图8、图9和图IO示出例如电池的可互换部分被附着到面对病人的粘合剂部分上的结构。 [0285] Thus, FIGS. 8, 9, and illustrates, for example interchangeable IO portion of the battery structure is attached to the face of the adhesive portion of the patient. 在将粘合剂传感器器件安装到哺乳动物的真皮上之前,保护性释放衬里被去除,可互换电池与微电子系统的其余部分耦合,从而使得电子系统起作用。 Before the adhesive sensor device mounted to the dermis of the mammal, a protective release liner is removed, the rest of the microelectronic system is coupled interchangeably with the battery, so that the electronic system to function. 然后,器件的粘合剂部分和整个结构被安装到病人的真皮上。 Then, the adhesive part and the entire structure of the device is attached to the patient's dermis.

[0286] 在使用后,例如电池的可互换部分被更换并且粘合剂器件可在病人的新的监视的情况下被使用。 [0286] After use, e.g. interchangeable portion of the battery is replaced and the adhesive means may be used in case of a new patient monitoring.

[0287] 为了能够在拆开粘合剂器件后去除电池,粘合剂器件中的凹槽的里面的部分可涂 [0287] In order to remove the battery inside the recess, the adhesive portion of the device after the device can be disassembled adhesive coating

敷有PDMS可固化涂层或其它的非粘性涂层;该操作将有利于电池的更换。 PDMS coated with a curable coating or other non-stick coating; This operation will facilitate the replacement of the battery.

[0288] 电池以及诸如芯片的其它的可互换部件可存在于粘合剂体的底表面中的凹槽中。 [0288] batteries and other interchangeable parts such as a chip may be present in the bottom surface of the adhesive body in the recess.

根据该实施例,具有包含于胶囊中、例如被嵌入注模的胶囊中的可互换微电子部分可能是 According to this embodiment, contained in capsules having, for example, the microelectronics portion of the capsule interchangeably embedded in the injection mold may be

有利的。 advantageous.

[0289] 在紧挨着安装包含微电子部件的胶囊之前,释放衬里被去除并且可互换胶囊被附着到粘合剂结构的凹槽中的粘合剂体上。 [0289] Capsules immediately before mounting a microelectronic component comprising a release liner is removed and the capsule is interchangeably attached to the recess structure adhesive binder precursor. 为了有利于可互换胶囊的拆开,微电子部件可涂敷有可固化PDMS或其它的非粘性涂层。 To facilitate capsule interchangeable disassembled, microelectronic parts may be coated with a curable PDMS or other non-stick coating.

[0290] 当微电子部件具有比粘合剂体长的寿命时,在使用之前,诸如换能器、天线或电源的便宜的部件可被集成到粘合剂体内,并且可被再使用的部件被放在凹槽中。 [0290] When a microelectronic component having a longer life than the adhesive body, prior to use, such as a transducer, inexpensive components or the power supply antenna may be integrated into the adhesive body, and may be re-used member It is placed in the recess. [0291] 另一应用是在应用之前完成系统的定制的制备和编程。 [0291] Another application is prepared to complete the programming and customized system prior to application. [0292] 关于图3说明的特征和应用同样很好地适于图5所示的实施例,反之亦然。 [0292] For features and applications described in FIG. 3 equally well suited for the embodiment shown in FIG. 5, and vice versa. [0293] 图11示出在粘合剂体中的通孔中集成微电子系统,从而从粘合剂体的上表面和底表面均可到达微电子系统。 [0293] FIG. 11 shows a through hole in the adhesive body of the microelectronic system is integrated, so that the upper surface and the bottom surface of the adhesive body can be reached microelectronic system. 在粘合剂的生产/制造中或紧挨着施加到皮肤上之前和/或在施加皮肤上之后,微电子系统的施加均是可能的。 In the production / manufacture of adhesive applied to or next to and / or after application to the skin, the microelectronic system are possible before applying on the skin.

[0294] 图12示出微电子系统的两个部件或部件的组件以某种方式被连接的系统。 [0294] FIG. 12 shows the system assembly of two components of the microelectronic system or components are connected in some way. 部件中的一个可在制造中被集成,而另一个在后面被施加。 Components may be integrated in a manufacturing, while the other is applied later.

[0295] 作为替代方案,部件或部件的组件在后面被施加。 [0295] Alternatively, part or component is applied to the back member. 这在不同的寿命使得能够在不同的时间更换诸如电池或换能器的电子部件的情况下是有用的。 This enables the replacement of the battery at different times, such as a transducer or an electronic component in a different life is useful in situations. 诸如弹簧锁或插头的机械和/或电气互连方案在这种配置中是有利的。 Such as a latch or plug mechanical and / or electrical interconnection scheme in this configuration is advantageous.

[0296] 图4所示的系统在同时需要皮肤接触和从上表面访问电子部件的情况下是有用的。 The system shown in [0296] Figure 4 also need skin contact and accessed from the upper surface of the electronic component is useful. 一个或两个子系统可被再使用。 One or two subsystems can be reused.

[0297] 关于图5和图8说明的特征和应用同样很好地适于图\所示的实施例,反之亦然。 [0297] With regard to Figures 5 and 8 illustrate features and applications equally well suited FIG \ embodiment illustrated embodiment, and vice versa. [0298] 图13〜18示出本发明的天线、中央处理单元、电池和电极被嵌入粘合剂器件中的实施例。 [0298] FIG 13~18 showing an antenna according to the present invention, the central processing unit, a battery and electrodes are embedded in the adhesive device embodiment.

[0299] 图13示出器件的形状的二维形状,通过AA指示断面。 [0299] FIG. 13 shows a two-dimensional shape of the device, through the cross section AA indicated.

[0300] 图14示出位于粘合剂器件的外部并与微电子系统的中心部分连接的天线109的位置。 [0300] FIG. 14 illustrates the adhesive device is located outside and connected to the center portion of the microelectronic system antenna 109.

[0301] 图15中,第三维在沿图13中的线AA的断面中被示出。 In [0301] FIG. 15, a third cross-sectional dimension along the line AA in FIG. 13 are shown. 从器件的边缘的圆B在图16中被进一步放大,并且中心的圆C类似地在图17中被放大。 From the circular edge of the device B is further enlarged in FIG. 16, and the center of the circle C is enlarged similarly in FIG. 17.

[0302] 图16更详细地表示被平放嵌入粘合剂内的天线的构建。 [0302] FIG. 16 is shown in greater detail in the flat antenna embedded in the adhesive construct. 该图清楚地表示用于粘合剂102的覆盖膜103和释放衬里104。 This figure clearly shows adhesive 102 for the cover film 103 and release liner 104.

[0303] 图17表示具有电池105、 CPU 106和伸出粘合剂的电极107的微电子系统1的中心部分的位置。 [0303] FIG. 17 shows a battery 105, the position of the central portion of the CPU 106 and the electrode 107 projecting adhesive microelectronic system 1. 电池和CPU被包封在透明的硅酮橡胶108内。 CPU and a battery encapsulated in a transparent silicone rubber 108. [0304] 最后,图18以透视图示出粘合剂器件。 [0304] Finally, FIG 18 illustrates a perspective view of the adhesive device.

[0305] 存在许多构建满足三维结构的基本要求的具有嵌入的微电子系统的粘合剂器件的其它方式,因此附图不能被解释为限制。 [0305] There are many other ways of constructing the adhesive device meet the basic requirements of the three-dimensional structure having a microelectronic system embedded, thus the drawings should not be construed as limiting.

[0306] 本发明的一个特殊的优点是简单、便宜的从压敏粘合剂制备具有三维形状的粘合剂体的方式。 A particular advantage of [0306] the present invention is a simple, inexpensive way of adhesive body having a three-dimensional shape of the pressure-sensitive adhesive prepared from.

[0307] 如上所述,压敏粘合剂为热塑性压敏粘合剂,或者它是能够被模压成三维形状的化学上可固化的粘合剂。 [0307] As described above, the pressure-sensitive adhesive a pressure-sensitive adhesive is a thermoplastic, or it can be molded into a three-dimensional shape of a chemically curable adhesive.

[0308] 热塑性压敏粘合剂一般可在高于100〜12(TC的温度下即在高于成分的玻璃转变 [0308] The pressure-sensitive adhesive may be generally higher than the thermoplastic 100~12 (i.e., above the glass transition temperature of component in TC

温度的温度下进入流体状态并实现适中的粘度,这使得很容易地将粘合剂成分模压成希望 Temperature of the fluid entering a state and achieve a moderate viscosity, which makes it easy to mold into a desired binder component

的形状。 shape. 一个例子可以是直接模压。 One example may be directly molded. 在第一步骤中,覆盖层在刚刚低于覆盖膜的玻璃转变温 In a first step, the cover glass transition temperature just below the cover film layer

度的温度下以希望的形状被设置,然后,必需的量的粘合剂被填充到铸模中以充满铸模。 They are arranged in the shape of a desired temperature, and then the necessary amount of adhesive is filled into the mold to fill the mold. suitable

当情况下,铸模的填充可分为两个步骤。 In the case where, filling the mold can be divided into two steps. 这将允许在第二步骤中用熔融的粘合剂部分填充、 This would allow a second step of partially filled with molten adhesive,

在第三步骤中放置电子部分、并最终在第四步骤中用粘合剂的剩余部分填充和覆盖电子部 Electronic parts disposed in the third step, and finally the remaining portion is filled with adhesive and a fourth step of covering the electronic unit

分。 Minute. 作为最后的步骤,释放衬里被施加,然后粘合剂器件被冲压出铸模。 As a final step, the release liner is applied, then the adhesive device is punched out of the mold.

[0309] 作为替代方案,与覆盖膜层叠的粘合剂可以在较高但稍低于粘合剂的玻璃转变温 [0309] Alternatively, the adhesive may cover film stacked in slightly higher but below the glass transition temperature of the binder

度的温度下通过压縮、挤压或模压被处理成希望的几何结构或形状。 At a temperature of degrees by compression, extrusion or compression molding is processed into a desired shape or geometry. 任选地,微电子系统可24/29页 Optionally, the microelectronic system may page 24/29

被放在粘合剂的两个层之间并然后被模压。 And then is molded between two layers of adhesive are placed. 模压在高温挤压条件下被执行,并且如果希望的话微电子系统被放在铸模中,并优选被放在铸模的中心。 Molding is performed at high temperature extrusion conditions, and, if desired, the microelectronic system is placed in the mold, and preferably is placed in the center of the mold.

[0310] 在可互换或可再使用部件是粘合剂器件的一部分的特定实施例中,需要铸模形状的阴模部分和阳模部分。 [0310] In reusable or interchangeable part is in the embodiment, the shape of the mold required female part and the male mold portion particular embodiment of a portion of the adhesive device.

[0311] 在本发明的另一实施例中,可固化的压敏粘合剂被铸成希望的形状。 [0311] In another embodiment of the present invention, the curable pressure sensitive adhesive is cast into a desired shape. 铸造可遵循与上述原理相同的原理:允许覆盖膜对铸模的部分填充步骤,施加电子部件并然后完成粘合剂在铸模中的填充,最后是放置释放衬里、必要时的硬化和模具切割。 Casting may follow the same principle as the principle described above: part of the cover film allows the mold filling step, the electronic component is applied and then filled with the adhesive is completed in the mold, and finally placing the release liner, and cured, if necessary, die cutting.

[0312] 另一方法是通过具有较高或非常高的粘度的粘合剂的压縮进行铸造。 [0312] Another method is by compression casting binder having high or very high viscosity. 作为第一步 As a first step

骤,从滚筒上取下的覆盖膜上的包含例如包含嵌段共聚物的水解胶体的压敏粘合剂的一次 Step, a cover film is removed from the drum, for example, a pressure sensitive adhesive comprising a block copolymer comprising a hydrocolloid

层进入处理设备,在第二步骤中,预组装的任选地封装的微电子部件被以适当的距离放置, Layer into the processing apparatus, in a second step, optionally a pre-assembled encapsulated microelectronic component is placed at an appropriate distance,

在第三步骤中,同一或另一压敏粘合剂的二次层被层叠在压敏粘合剂的第一层上,从而在 In the third step, the same or another second pressure-sensitive adhesive layer is laminated on the first layer of pressure sensitive adhesive so that

两层之间包围微电子部分,在第四步骤中,所述叠层在液压机中形成为包含中心在微电子 Between the two layers surrounding the microelectronics sector, the stack is formed in a hydraulic press in a fourth step, the center comprising a microelectronic

部分上的多个突起的形状,在第五步骤中,各单个突起被冲切为最终的器件。 A plurality of projections on the shape of a portion, in the fifth step, each individual projection is punched into the final device.

[0313] 可根据US 6726791所述的连续工艺制造压敏粘合剂器件。 [0313] According to US continuous process for producing a pressure-sensitive adhesive device according 6,726,791.

[0314] 图19、图20和图21表示根据本发明的传感器组件的一个实施例1。 [0314] FIG. 19, FIG. 20 and FIG. 21 shows an embodiment of a sensor assembly 1 according to the present invention. 图19表示分解图中的传感器组件。 19 shows an exploded view of the sensor assembly. 图20表示当传感器组件被组装时在沿图19中的线XX-XX的断面中看到的组件。 20 shows the sensor assembly when the component is assembled sectional line XX-XX in FIG. 19 along seen. 图21表示从也被称为近端侧的皮肤侧即要被附着到皮肤上的传感器组件一侧看到的传感器组件。 21 shows the proximal end side is also referred to as the skin side, i.e., the sensor assembly is to be attached to the skin on the sensor assembly seen from the side.

[0315] 传感器组件1包含传感器器件2和包含微电子电路4的外壳元件3。 [0315] The sensor assembly 1 comprises a housing 2 and a sensor device comprising a microelectronic circuit element 4 is 3. 传感器器件2由粘合剂元件5和硬币单元电池6形状的电源元件构成。 The sensor device 2 is constituted by an adhesive member 5 and the power supply member 6 coin cell shape. 外壳元件3由远端部分7和近端部分8构成。 A housing member 3 is constituted by a distal portion 7 and the proximal portion 8. 凹槽9在远端部分中形成。 Groove 9 is formed in the distal end portion. 凹槽具有比硬币单元电池的圆周稍大的圆周, 从而允许在凹槽中容纳硬币单元电池。 Circumferential groove having a slightly larger than the circumference of a coin cell, allowing the cell to accommodate the coin in the recess.

[0316] 在凹槽中设置用于当电池被放在凹槽内时电连接微电子电路4和电池6的两个电接点10a、10b。 [0316] disposed in the recess for electrically when the battery is placed within the recess and a battery connected to a microelectronic circuit 4 two electrical contacts 10a, 10b 6 in. 微电子电路由被配置在印刷板ll上的大量的部件构成。 The microelectronic circuit is constituted by a large number of members are arranged on the printed board ll. 由于电路是本领域中公知的因此各部件在这里将不被说明,因此其本身不是本发明的一部分。 Since the circuit is well known in the art and therefore the components will not be explained here, and therefore is not itself part of the present invention. 一般地,可以提到,电路包含由印刷在印刷板上的导电材料的大量绕组形成的天线12。 Generally, mention may be made, formed by a printed circuit antenna comprising a large number of windings of the conductive material in the printed board 12. 天线从位于通信范围内的中央单元发送和接收数据。 The central unit transmits and receives data from the antenna located within the communication range. 中央单元可例如是从传感器组件收集数据的个人计算机。 The central unit may collect data from the sensor assembly, for example, a personal computer. 数据然后根据已知的处理和算法被处理。 Data is then processed in accordance with known algorithms and processes.

[0317] 天线12与从第一换能器14和第二换能器15接收信号的微处理器13连接。 [0317] The antenna 12 is connected to the microprocessor receiving signals from the first transducer 14 and second transducer 1513. 第一和第二换能器通过近端部分从印刷板延伸并在近端部分的近端表面上终止。 The first and second transducer extends and terminates on the proximal surface of the proximal portion from the proximal portion through the printed board. 因此,当外壳被放在皮肤上时,第一和第二换能器接触皮肤表面。 Thus, when the housing is placed on the skin, the first and second transducer contact with the skin surface. 为了减少第一和第二换能器之间的干扰,阻挡器元件16被放在两个换能器之间的近端部分的近端表面上。 To reduce interference between the first and second transducers, the blocking element 16 is placed on the proximal surface of the proximal portion between the two transducers. 阻挡器元件由电介质材料形成,并且是公知的用于避免一般导致两个电子部件之间的不希望的干扰的所谓串扰的措施。 A stopper member formed of a dielectric material, and are well-known measures for avoiding a so-called general cause undesired crosstalk interference between the two electronic components.

[0318] 当使用时,电池被放在凹槽中,由此电池与电接点10a、10b接触并由此对微电子电路供电。 [0318] When used, the battery is placed in the recess, whereby the battery contacts with the electrical contacts 10a, 10b and thereby microelectronic circuits. 粘合剂元件然后被施加到外壳的远端部分的远端侧和电池的远端侧。 Adhesive is then applied to the distal end member-side end side and the distal end portion of the battery housing. 这保证电池在凹槽中并将粘合剂元件、电源元件和外壳元件连入传感器组件中。 This ensures that the battery in the recess and the adhesive element, the power supply element and the housing element connected to the sensor assembly. 可以看出,粘合剂元件具有比外壳的圆周大的圆周,这提供可被施加到人或其它哺乳动物的皮肤表面上的粘合剂近端表面17。 As can be seen, the adhesive member having a circumference larger than the circumference of the housing, which can be applied to provide an adhesive proximal surface 17 on the skin surface of a human or other mammal.

29[0319] 当传感器组件在以后被去除时,粘合剂元件与外壳元件分开,并且,由于电池的远端表面粘性附着到粘合剂元件上,因此电池与粘合剂元件一起被去除。 29 [0319] When the sensor assembly is removed after the adhesive element from the housing member, and, since the distal end surface tack adhesive is attached to the battery element, the battery element is removed together with the adhesive. 粘合剂元件和电池可然后被处理,并且外壳元件可被清洗和贮存以备后用。 Adhesive element and the battery can then be processed, and the housing member may be cleaned and stored for later use.

[0320] 为了避免粘合剂元件粘合到诸如穿着的衣服物品的内侧的不希望的表面上,粘合剂元件被覆盖层18覆盖。 [0320] In order to avoid the undesirable adhesion to the inner surface of such an article of clothing worn by an adhesive element, the adhesive layer 18 is covered by cover member. 覆盖层18还用作在制造中设置粘合剂材料19的背衬层。 The cover layer 18 also functions as a binder material provided in the manufacture of the backing layer 19. [0321] 图22a表示根据本发明的器件的另一实施例30。 [0321] FIG. 22a shows an example of the device 30 according to another embodiment of the present invention. 图22b表示放大图中的图22a的断面。 Figure 22b showing an enlarged cross-sectional view 22a of FIG. 器件由二维粘合剂元件31和粘合到粘合剂元件上的硬币单元电池32形状的电源构成。 The power supply device 32 is constituted by a two-dimensional shape of the adhesive member 31 adhered to the adhesive element and the coin cell.

[0322] 粘合剂元件由背衬层33形成。 [0322] element 33 formed of pressure-sensitive adhesive backing layer. 在背衬层的近端侧设置被第一释放衬里35覆盖的第一粘合剂层34。 The proximal side of the backing layer is provided by a first release liner 35 covers the first adhesive layer 34. 在背衬层的远端侧设置粘合电池的第二粘合剂层36。 Cell adhesion is provided at the distal end side of the second pressure-sensitive adhesive backing layer 36. 第二释放衬里37 覆盖粘合剂的远端侧的没有附着电池的剩余部分。 The second release liner 37 covering the remaining portion of the battery is not attached to the distal side of the adhesive.

[0323] 当被施加到诸如人的皮肤表面的表面上时,第一释放衬里35被去除。 [0323] When the upper surface is applied to the surface of the skin, such as a human, a first release liner 35 is removed. 这样会露出第一粘合剂层,该第一粘合剂层可被粘合到皮肤表面上,由此将器件30附着到皮肤表面上。 This will expose the first adhesive layer, the first adhesive layer may be adhered to the skin surface, whereby the device 30 is attached to the skin surface. 第二释放衬里然后被去除,从而露出第二粘合剂层。 The second release liner is then removed, thereby exposing the second adhesive layer. 虽然图中没有示出,但包含微电子系统的外壳然后被附着到粘合剂层上,同时外壳上的电接点与电池32电连接。 Although not shown, the housing comprising a microelectronic system is then attached to the adhesive layer, while the battery electrical contacts 32 is electrically connected to the housing. [0324] 虽然上述的这种外壳不象参照图19说明的外壳那样具有表面接点,但外壳仍可包含传感器技术。 [0324] Although not described above such as the housing shell 19 as described with reference to FIG surface having a contact point, but still includes a sensor housing art. 这种传感器可简单地测量环境温度,或者器件可被施加到鼻子下面,并且用于通过鼻子测量呼吸节奏的传感器可被施加到器件上。 Such a sensor may simply measure the ambient temperature, or the device may be applied to the nose, and for measuring the breathing rhythm of the sensor through the nose may be applied to the device. 作为替代方案,传感器可在器件圆周外面施加皮肤接触换能器,同时仍粘合到其上。 Alternatively, the sensor may be applied in skin contact transducer device outside circumference, while still adhered thereto.

[0325] 图23表示根据本发明的二维器件的另一实施例40,图24表示沿图23中的线XXIV-XXIV的第三实施例的断面图。 [0325] FIG. 23 shows an example of two-dimensional device 40 according to another embodiment of the present invention, FIG 24 shows a cross-sectional view of a third embodiment of the embodiment in FIG. 23 along the line XXIV-XXIV. 这里,电源元件形成为作为背衬层42的集成部分的薄膜电池41。 Here, the power supply element is formed as an integral part of the backing layer 42 of the thin film battery 41.

[0326] 在背衬层的近端侧施加被第一释放衬里44覆盖的第一粘合层43。 [0326] applying the first adhesive layer 43 is covered by a first release liner 44 on the proximal side of the backing layer. 背衬层的远端侧被由第二释放衬里46覆盖的第二粘合剂层45覆盖。 The second adhesive layer covering the distal end side of the backing layer is covered by a second release liner 4645. 第二粘合剂层在区域47中中断,从而允许到达提供与薄膜电池的电连接的接点48a和48b。 The second adhesive layer is interrupted in the area 47, thereby allowing the film from reaching the contacts provide electrical connection to the battery 48a and 48b.

[0327] 当使用时,参照图23说明的器件40以与参照图22说明的器件30相同的方式被施加。 [0327] When used, 22 are applied in the same manner described with reference to the device 23 of the device 30 described with reference to FIG. 40 and FIG.

[0328] 应当理解,在背衬层的近端侧和背衬层的远端侧可分别使用不同类型的粘合剂。 [0328] It should be appreciated that different types of adhesives may be used in the backing layer of the proximal and distal sides of the backing layer, respectively. 虽然近端侧被附着到皮肤表面上并由此优选为是对皮肤友好的,但远端侧上的粘合剂应优选为对电子电路或包含这种电路的外壳提供最佳的附着同时仍允许器件在使用后与其分离的类型。 While the proximal end side is attached to the skin surface, and thus preferably is skin friendly, but the adhesive should preferably be on the distal side of the housing to provide the best adhesion to an electronic circuit comprising such a circuit or while still type allows use of the device after its separation.

[0329] 虽然以上实施例说明了用于使器件与电子电路连接的粘合剂附着形状的可释放可附着手段,但其它类型的释放可附着手段可被使用。 [0329] While the above described embodiments for the adhesive device connected to the electronic circuit attached may form a releasable attachment means, other types of release attachment means may be used. 这种可释放可附着手段可例如是诸如电池和外壳中的凹槽之间的弹簧锁配置的机构,这里,凹槽与与电池耦合的突出的肋片一起形成。 Such releasable attachment means may be, for example, a snap lock mechanism is disposed between the housing and a recess such as a battery, where the battery is formed together with the coupling groove and the projecting rib. 作为替代方案,附加的耦合装置可被设置在器件上以与电子电路或包含电子电路的外壳上的补充耦合装置耦合,并可例如采取剌刀耦合、弯钩、摩擦耦合或螺纹耦合的形状。 Alternatively, additional coupling means may be provided on the device to couple the complementary coupling means comprising a housing and an electronic circuit or electronic circuit, and may for example take the shape of bayonets coupling hook, a friction coupling or a threaded coupling.

[0330] 实验部分[0331] 例子l[0332] 制造三批粘合剂。 [0330] Experimental Part [0331] Examples of l [0332] Three batches of manufacturing adhesive. 通过在13(TC的温度下混合弹性体(Kraton)、三分之一的增塑剂(DOA)和树脂(Arkon)的成分直到实现均匀的混合物(30〜50分钟),在Herman Linden z刀片混合器(Machine typeLK 110.5)中通过标准热熔过程制备粘合剂。剩余的增塑剂和水解胶体增充剂(CMC)被添加,并且混合物被混合20分钟。 [0333] By 13 (the temperature TC of the elastomer mixture (of Kraton), one third of the plasticizer component (DOA) and the resin (of Arkon) until a uniform mixture (30 ~ 50 minutes), the blade Herman Linden z mixer (Machine typeLK 110.5) was prepared in a standard procedure by a hot melt adhesive. the remaining plasticizers and extenders hydrocolloid (CMC) is added, and the mixture was mixed for 20 minutes. [0333]

<table>table see original document page 31</column></row> <table>[0334] 例子2 <Table> table see original document page 31 </ column> </ row> <table> [0334] Example 2

[0335] 例子1的粘合剂的模压体: [0335] Examples of the binder of the molded body 1:

[0336] 根据权利要求1的粘合剂中的每一种被施加到聚乙烯的35微米厚覆盖膜上,并且硅化聚乙烯衬里被施加到粘合剂补片的对侧,并且,在9(TC的温度下在用于设计的形状的铸模中,通过改变非空腔保持铸模以给出凹槽的形状,根据图1〜3中的任一个被挤压为希望的形状。粘合剂器件的中心为3. 4mm,并且周缘的厚度为0. 4mm。 [0337] 例子3 [0336] Each of claim 1 the adhesive is applied to the cover 35 micron thick polyethylene film, and a siliconized polyethylene liner is applied to the opposite side of the adhesive patch, and 9 (TC at a temperature in the mold for the designed shape, by changing the non-holding cavity mold to give shape of the groove, is extruded into a desired shape according to any of FIG. 1 ~ 3. adhesive the center of the device 3. 4mm, and the thickness of the peripheral edge of 0. 4mm. [0337] example 3

[0338] 模压的硅酮压敏粘合剂体: [0338] molding a silicone pressure sensitive adhesive body:

[0339] Dow Corning 7-9800A&B(A和B之间的重量混合比为1 : 1)被用于制造基于PDMS 的粘合剂体。 [0339] Dow Corning 7-9800A & B (the weight ratio between the A and B mixing ratio of 1: 1) was used in the manufacture of PDMS-based adhesive body. 具有三角形形状(三角形铸模的每个边具有300mm的距离,中心部分厚度为0.5mm,边缘厚度为0. lmm)的铸模被使用。 It has a triangular shape (isosceles triangle of each mold having a 300mm distance, a central portion having a thickness of 0.5mm, the edge thickness of 0. lmm) mold is used. 成分被完全混合并被施加到三角形铸模的阴模部分中的硅酮橡胶衬套的50 ii m覆盖层上,并且阳模铸模部分被施加到顶端,所述部分沿着低密度聚乙烯释放衬里排列。 Ingredients are thoroughly mixed and applied to the cover layer 50 ii m silicone rubber bushing triangular female part of the mold, and the male mold portion is applied to the top of the mold, the release liner along a part of a low density polyethylene arrangement. 粘合剂在炉中在10(TC的温度下固化15分钟。在固化后,粘 Adhesive cured for 15 minutes at a temperature (TC of 10 in an oven. After curing, adhesive

合剂被冲压出铸模,并且用于嵌入电子感测系统的粘合剂体器件的中心的凹痕被冲压出。 Mixture was punched out of the mold, and the center dimple for embedding an electronic device binder precursor sensing system is punched out. [0340] 例子4 [0340] Example 4

[0341] 模压的热塑性PSA粘合剂体: [0341] Molded thermoplastic PSA adhesive body:

[0342] 例子1中的配方2的成分在Herman Linden混合器中被混合,并且,在仍保持热和软的状态的条件下,得到的面团状材料块从混合器中被取出,并被放在放入模腔的空腔中 Component of [0342] Example 1 Formulation 2 are mixed in a Herman Linden mixer and under conditions of heat and remain soft state, the resulting dough-like material blocks are removed from the mixer, and the discharge placed in the cavity of the mold cavity

31的热塑性聚氨酯覆盖膜上,并且释放衬里被放在顶端。 Thermoplastic polyurethane film cover 31, and release liner was placed on top. 铸模的第二部分是平的。 The second part of the mold is flat. 粘合剂在约9(TC的温度和100巴的条件下被压塑。释放衬里被去除,并且封装的微电子感测系统被放在铸模内的粘合剂体的中心,释放衬里被重新施加并且模压步骤被重复。最后,得到的传感器垫被冲压出。 [0343] 例子5 Adhesive is compression molded at about 9 (TC temperature conditions of 100 bar and The release liner is removed, and the encapsulated microelectronic sensing system is placed at the center of the adhesive body in the mold, the release liner is re [0343] examples of embossing and applying steps are repeated. Finally, the resulting sensor pad is punched out. 5

[0344] 具有集成的RFID标签的模压的热塑性PSA粘合剂体: [0344] RFID tag having an integrated molded thermoplastic PSA adhesive body:

[0345] 根据例子1中的配方2的压敏粘合剂在Herman Linden混合器中被混合,并且,在仍保持热和软的状态的条件下,材料的很小的一部分从混合器中被取出并向着铸模的阴模部分被放在覆盖膜上,并且释放衬里被放在顶端,然后,在与产品的微电子系统对应的区域上具有较小的突起的铸模的阳模部分被施加。 [0345] The pressure-sensitive adhesive formulation of example 1 is mixed in a 2 Herman Linden mixer and under conditions of heat and remain soft state, a small portion of material from the mixer is remove the mold and toward the female mold portion is placed on the cover film and the release liner is placed on top, and then, the smaller male part having a projection of the mold is applied to the region corresponding to the product of the microelectronic system. 整个结构在约9(TC的温度和100巴的条件下被压塑。然后,释放衬里被去除,并且封装在聚丙烯中的RFID标签被放入压敏粘合剂的凹槽中,并且铸模被剩余的粘合剂填充满。释放衬里被重新附着,并且整个结构被重新压塑。 得到的垫被冲压出。周缘厚度为0. 2mm,中心厚度为2. 5mm,并且形状是直径为40mm的圆。 [0346] 例子6 The entire structure was press-molded at about 9 (TC temperature conditions of 100 bar and then the release liner is removed, and the RFID tag encapsulated in a polypropylene pressure sensitive adhesive is placed in the recess, and the mold the remaining adhesive is filled up. the release liner to be reattached, and the entire structure is compression-molded again. the resulting mat is punched out. peripheral edge thickness of 0. 2mm, a center thickness of 2. 5mm, 40mm in diameter and shape circle. [0346] example 6

[0347] 在本例子中,嵌入粘合剂体中的微电子系统同时包含RFID标签和通信和存储部件。 [0347] In the present example, the microelectronic system is embedded in the adhesive body contains an RFID tag and a communication and storage components. 为了保护微电子系统,部件被封装入聚乙烯中。 To protect the microelectronic system components are packed into polyethylene. 部件如US 6726791所述的那样在连续的工艺中被集成到PSA中。 Member as described in US 6,726,791 as being integrated into the PSA in a continuous process. 一次层包含具有压敏粘合剂的覆盖膜,二次层是封装的微电子部分;第三层是可模压层压敏粘合剂;整个结构在成形空腔中被组合。 The cover film having a layer comprising a pressure sensitive adhesive, the second layer is a part of the microelectronic package; third layer is a pressure-sensitive adhesive layer molded; the entire structure are combined in the mold cavity. [0348] 例子7 [0348] Example 7

[0349] 水凝胶粘合剂成分的制备: [0349] Preparation of aqueous gel adhesive composition:

[0350] 3. 5克的PVP K-90、17. 5克的PVP K_25、3. 5克的Pemulen TR2和28克的PEG 400 作为预混合料被混合。 [0350] 3.5 g of PVP K-90,17. 5 g PVP K_25,3. 5 g Pemulen TR2 and 28 grams of PEG 400 were mixed as a premix. 最初,增塑乙二醇、PVP和交联的聚丙烯酸的预混合料被添加并在IO(TC的温度下在Brabender混合器中被混合10分钟。然后,为了保证成分的完全混合, 17.5克的两性聚氨酯(Tecogel 2000)被缓慢地添加。在20分钟的混合之后,获得宏观上均匀的混合物。来自混合室的热的粘合剂被模压成具有用于以后施加的微电子系统的凹痕的圆形粘合剂体(直径4cm)。垫的中心厚度为3mm,并且厚度逐渐减小到垫的边缘上的0. 3mm。粘合剂器件在硅酮纸板和30 ii m PU覆盖膜之间被压塑。 [0351] 例子8 Initially, plasticized ethylene glycol, PVP and crosslinked polyacrylic acid premix is ​​added and mixed in a Brabender mixer at (at a temperature of TC IO 10 minutes, and then, in order to ensure complete mixing of the components, 17.5 g amphiphilic polyurethane (Tecogel 2000) were slowly added. after mixing for 20 minutes to obtain a homogeneous mixture macroscopically the hot adhesive from the mixing chamber is molded into dimples having a microelectronic system for later applied the adhesive device of the silicone coating film and cardboard circle 30 ii m PU adhesive (4cm in diameter). the thickness of the center pad of 3mm, and tapers to a thickness of 0. 3mm the edges of the pad body Room was press-molded. [0351] example 8

[0352] 用于氧的侵入式测量的微电子感测系统: [0352] invasive measurement of oxygen for microelectronic sensing system:

[0353] 根据例子1配方2的粘合剂被用于嵌入包含氧电极、中央处理单元、发射器和电池的微电子系统。 [0353] The adhesive formulation 2 of Example 1 is used for the oxygen electrode contains an embedded central processing unit, a transmitter and a battery microelectronic system. 粘合剂体的形状为卵形(70x30mm),该卵形的中心厚度为5mm,边缘为0. 3mm,并且厚度从垫的边缘到中心基本上线性增加。 Oval shape of the adhesive body (70x30mm), a thickness of the center oval is 5mm, the edge is 0. 3mm, and the thickness increases substantially linearly from the center to the edges of the pad. 粘合剂体在粘合剂体的表面的皮肤接触部分中具有位于中心的通孔和凹痕,用于硅酮覆盖的微电气部件。 Adhesive having a centrally located through hole and dents in the skin contacting adhesive surface of the body portion, the member for the silicone covered micro electrical.

[0354] CPU、电池和发射器与例子11说明的一样。 [0354] CPU, a battery and a transmitter as described in the example 11. 氧电极是氧电极产品号723(来自Diamond General, Development Corp. US). Product oxygen electrode is an oxygen electrode 723 (from Diamond General, Development Corp. US).

[0355] CPU、发射器和电池被电连接,然后被聚合的硅酮的薄层覆盖,仅有CPU与电极的电接点保持不被涂敷。 [0355] CPU, a transmitter and a battery are electrically connected, and then covering the thin layer of silicone to be polymerized, and only CPU electrode electrical contacts remain coated.

[0356] 感测器件中的电极的尖端被外径为0. 7mm的医疗针包围。 [0356] The sensing device tip electrode is an outer diameter of 0. 7mm surrounded by medical needles.

[0357] 在使用中,电极和针以CPU的电接点与电极的相应接点连接的方式被定位。 [0357] In use, the electrode and the needle is positioned so as to contact and electrically contacts a respective electrode connected to a CPU.

32[0358] 在测量器件的施加过程中,部分硅酮覆盖的微电子系统首先被施加到器件的皮肤接触侧上的凹痕中的粘合剂体上。 32 [0358] measurement device during application, the portion of the microelectronic system is first covered with silicone is applied to the indentations on the skin contacting side of the device in the binder precursor. 器件被施加到皮肤上。 Device is applied to the skin. 然后,在第二步骤中,针通过剌入皮肤通过粘合剂中的孔从外面被定位,并且,作为第三步骤,部分封装入插头中的电极穿过针的中空的中心,从而产生与微电子系统的未涂敷的连接的电接触。 Then, in a second step, the needle is positioned through the puncture into the skin from the outside through a hole in the adhesive, and, as a third step, the plug part of the package through the center of the hollow needle electrode, thereby generating electrical contacts connected to the uncoated microelectronic system. 电极的插头部分配合没有引入凹槽的覆盖膜的平滑曲率。 Mating plug portion of the electrode is not introduced into the smooth curvature of the recess of the cover film.

[0359] 在使用中,电极可根据用于实现正确的信号的需要被重新清洗并被重新施加。 [0359] In use, the electrode may be re-cleaned and re-applied as necessary to achieve the correct signal. [0360] 例子9 [0360] Example 9

[0361] 嵌入根据本发明的粘合剂传感器器件中的微电子网络集线器: [0361] embedding a microelectronic sensor device hub binder according to the present invention:

[0362] 根据例子1配方1的粘合剂成形为第一层,从而形成一侧具有平滑表面的卵形壳体(50x80mm)。 [0362] The adhesive formulation of Example 1 a first layer 1 is formed, thereby forming a side surface having a smooth oval housing (50x80mm). 该表面向周缘倾斜并覆盖有聚氨酯的30 ym薄膜,S卩,被放在铸模和粘合剂之间。 The inclined surface of the circumferential edge and covered with a polyurethane film of 30 ym, S Jie, is placed between the mold and the binder. 粘合剂体的对侧形成有用于施加微电子系统的约2xl0xl5mm的中心软的形状的凹槽。 Soft center of the groove shape is approximately 2xl0xl5mm microelectronic system for applying the opposite side of the adhesive body is formed. 聚乙烯的硅化释放衬里被放在具有凹槽的表面上。 Polyethylene siliconized release liner is placed on an upper surface of the recess. 在第二步骤中,释放衬里被去除,天线被放在粘合剂体的周缘上,并且CPU和电池被放在中心凹槽中。 In a second step, the release liner is removed, the antenna is placed on the periphery of the adhesive body, and the CPU and the battery is placed in the central recess. 在最后的步骤中,第二层粘合剂被施加以在周缘区域嵌入天线但不在中心的凹槽中嵌入部件。 In the final step, the second layer of adhesive is applied to the embedded antenna but not the center groove in the peripheral region of the insert member. 释放衬里被施加,并且得到被冲切到最终尺寸的完成的结构。 Release liner is applied and punched to obtain the final dimensions of the structure is completed. 天线通过电接触元件与中心的微电子部件连接, 使得能够再使用中心的部分。 The antenna is electrically connected by contacting the microelectronic element and the center member, so that the center portion can be reused. 天线被封装到薄的聚对苯二甲酸乙二醇酯(PET)-塑料中,并且中心的微电子部分被封装到硅酮橡胶中。 The antenna is encapsulated in a thin polyethylene terephthalate (PET) - plastic, and the central portion of the microelectronic encapsulated into silicone rubber. [0363] 例子10 [0364] 微电子网络集线器: [0363] Example 10 [0364] The microelectronic hub:

[0365] 具有天线以及电池被完全集成到前面的例子1的压敏粘合剂中的微电子网络集线器的结构。 [0365] with an antenna and a battery is fully integrated into the structure of a microelectronic hubs previous example in a pressure-sensitive adhesive. 通过使例子9中的最终步骤的粘合剂覆盖天线以及中心的微电子部分完成这一点。 This is done by an adhesive so that the final step of the example 9 and covering the microelectronics portion of the antenna center. [0366] 例子ll [0366] Examples ll

[0367] 嵌入没有远程通信的用于人体体温感测和报警的微电子系统的粘合剂器件[0368] 根据例子1配方2的粘合剂被用于嵌入包含温度传感器、中央处理单元、发射器、 电池和OLED(有机发光二极管)的微电子系统。 [0367] No adhesive device embedded microelectronic system for human temperature sensing and alarm remote communication [0368] is used to embed a temperature sensor comprising a binder according to example 1 Formulation 2, the central processing unit, a transmitter , a battery, and an OLED (organic Light emitting diode) a microelectronic system. 粘合剂体的形状是圆形的(30mm),其中心厚度为5mm,周缘为0. 2mm,并且厚度从垫的边缘到中心基本上线性增加。 The shape of the adhesive body is circular (30mm), the center thickness of 5mm, the peripheral edge of 0. 2mm, and the thickness increases substantially linearly from the center to the edges of the pad. 粘合剂体在表面的皮肤接触部分中具有凹痕,用于硅酮覆盖的微电子部件。 Adhesive body portion having a dent in the skin-contacting surface, the silicone covering for microelectronic components.

[0369] CPU是微Controller ATMEGA 128L,它是来自ATML的AVR 8位RISC处理器。 [0369] CPU is a micro-Controller ATMEGA 128L, which is derived from ATML AVR 8-bit RISC processor. 电池是Panasonic Coin电池CR3202。 Battery is Panasonic Coin battery CR3202. OLED柔性彩色显示器来自0SD(0ne Stop Display)零件恥SCC 130-0。 OLED flexible color display from 0SD (0ne Stop Display) Part shame SCC 130-0. 温度传感器来自Pasport Ps_2125。 The temperature sensor from Pasport Ps_2125.

[0370] 在使用中,温度传感器连续监视人皮肤温度。 [0370] In use, the temperature sensor continuously monitors human skin temperature. 当出现受时间、与存储的数据相比的温度梯度影响的由微控制器确定的某些事件时,系统将在柔性显示器上给出相关信息的文本或光形式的可视报警。 As appears by the time when certain events determined by the microcontroller Gradient temperature compared to stored data, the system will be given in the form of text or information related to light a visual alarm on the flexible display.

[0371] 系统被集成到粘合剂中并在剥去释放衬里时被激活并将发挥作用直到电池结束。 [0371] system is integrated into the adhesive is activated and play until the end of the battery and when peeling the release liner. [0372] 例子12 [0372] Example 12

[0373] 嵌入了没有远程通信的用于人体温度感测和报警的微电子系统的粘合剂器件根据例子ll被构建。 [0373] adhesive device embedded microelectronic system for human temperature sensing and alarm with no remote communication is constructed according to Example ll.

[0374] 除了在器件的表面中使用EL(场致发光灯)作为显示部分以代替用于显示温度变化的OLED柔性彩色显示器以外,粘合剂器件的结构与例子11的结构相同。 [0374] except for using EL (electroluminescent lamps) in the outside surface of the device as a display portion in place of the flexible OLED display for displaying a color temperature change, an example of configuration of the adhesive device 11 of the same configuration. 该零件是来自Being Seen Technologies的Eliamp Part# :300210KIT。 The parts from Being Seen Technologies of Eliamp Part #: 300210KIT.

[0375] 在使用中,温度传感器连续监视人皮肤温度。 [0375] In use, the temperature sensor continuously monitors human skin temperature. 当出现受时间、与存储的数据相比的温度梯度影响的由微控制器确定的某些事件时,系统将以光的形式给出可视报警。 As appears by the time when certain events determined by the microcontroller Gradient temperature compared to stored data, the system will give a visual alarm in the form of light. [0376] 例子13 [0376] Example 13

[0377] 在参照图19〜21说明的一个实施例中,粘合剂材料19是包含具有水解胶体的热熔的可处理的苯乙烯嵌段共聚物的压敏粘合剂(PSA),电池是金属壳硬币单元电池,并且外壳涂敷有聚二甲基硅氧烷(PolyDiMethylSiloxane)层。 [0377] Referring to FIG 19~21 described in one embodiment, the adhesive material 19 comprising a pressure sensitive adhesive (PSA) styrene block copolymer having a melt processable hydrocolloid, a battery a metal shell coin cell, and the housing is coated with polydimethylsiloxane (polydimethylsiloxane) layer.

[0378] 在以下的例子13中,PSA和表面、电池和外壳之间的剥离力被确定: [0379] PSA是具有水解胶体的热熔的可处理的Styrenic嵌段共聚物,它被热成形为希望的形状。 [0378] In the following example 13, the peel force between the PSA and the surface, the battery and the casing are determined: [0379] PSA is Styrenic block copolymers have a melt processable hydrocolloid, which is thermoformed into a desired shape. 称为A的PSA具有以下的成分:25X的KratonD1107(Kraton Polymer) 、35%的Arkon P90(来自Arkawa Ltd.的氢化聚环戊二烯)、8%的己二酸二辛酯(DiOctylAdipate) 和32%的羧甲基纤维素钠。 A called PSA has the following components: 25X of KratonD1107 (Kraton Polymer), 35% of Arkon P90 (hydrogenated polycyclopentadiene from the Arkawa Ltd.), 8% Dioctyl adipate (DiOctylAdipate) and 32% sodium carboxymethylcellulose.

[0380] 为了示出不同部分之间的剥离力,通过使用FINAT确定剥离力;FTM2、25mm试样宽、90度剥离角、300mm/min的试验速度和30分钟的静止时间。 [0380] To illustrate the peel force between the different parts, the peel force determined by using FINAT; FTM2,25mm sample width, the 90 degree peel angle and test speed of 300mm / min and a rest time of 30 minutes.

[0381] 关于从皮肤上的剥离力,使用以下的试验方法:从PSA成分A的板上切取25mm宽的粘合剂条。 [0381] From the peel force on the skin, using the following test method: 25mm wide cut out from the plate component A PSA adhesive strip. 为了防止样品的伸长,粘合剂条带(TESA 4124)被附着。 To prevent the elongation of the sample, adhesive tape (TESA 4124) is attached. 样品被夹具夹持。 Samples were gripped with clips. 在附着PSA之前,通过用稀释的肥皂水清洗前臂的上侧并干燥至少2小时,准备志愿者的皮肤。 Before attaching the PSA, the forearm by washing with dilute soapy water and dried at least 2 hours, to prepare the skin of volunteers. 样品的粘合剂侧被放在准备好的皮肤上。 Adhesive side of the sample is placed on the prepared skin. 粘合剂的静止时间为30分钟。 Rest time of the adhesive was 30 minutes. 夹具被附着到试验设备Instron Tensile试验机型号5564的钩子上。 Clamp device is attached to the Instron Tensile Tester test model 5564 on the hook. 前臂被放在试验设备的可移动支架上,为了保持90度剥离角,注意将样品的端部保持在夹具正下方。 Test apparatus is placed on the forearm movable support, in order to maintain a 90 degree peel angle, note that the end of the sample was maintained at just below the clip. 前臂被保持,同时拉伸强度试验机被启动以以300mm/min的速度拔起粘合剂。 Forearm is maintained, while the tensile strength tester is activated at a speed of 300mm / min uprooted adhesive. 得到的图形的稳态部分的剥离值被记录,并确认没有残留物留在前臂的皮肤上。 Peel value of the steady-state portion of the resulting pattern is recorded, and confirmed that no residue left on the skin of the forearm.

[0382] 电池是来自Panasonic的金属壳Manganese Dioxide Lithium硬币单元电池CR2330,并且微电子外壳涂敷有聚二甲基硅氧烷(PDMS)层;来自NuSil Technology的MED-1137。 [0382] the battery case is a metal Manganese Dioxide Lithium coin cell CR2330 from Panasonic and microelectronic housing coated with polydimethylsiloxane (PDMS) layer; MED-1137 from NuSil Technology of.

[0383] 用以下的结果以及三次重复试验确定粘合剂和以下的部分之间的剥离力,这里,s 表示标准偏差。 [0383] with the following results were determined and triplicate peel force between the adhesive and the following section, where, s represents the standard deviation.

[O384] A和PDMS涂敷的外壳之间的剥离力0. lN/25mm [O384] A peel force between the housing and PDMS coated 0. lN / 25mm

[0385] A和钢之间的剥离力22. 5N/25mm(s = 2. 3) [0385] A peel force between the steel and 22. 5N / 25mm (s = 2. 3)

[O386] A和人皮肤之间的剥离力2. 5N/25mm(s = 0. 25) [O386] A peel force between human skin and 2. 5N / 25mm (s = 0. 25)

[0387] 并且,不同类型的材料可用于器件和微电子电路和/或外壳的不同的部分,由此可提供不同的剥离力。 [0387] Further, different types of materials may be used for different parts of the device and a microelectronic circuit and / or the housing, thereby providing different peel force. 因此,能够在PSA和皮肤之间实现处于1〜5N/25mm的一般范围中的剥离力,并在PSA和外壳之间实现一般小于1N/25mm的剥离力,并在PSA和电池的金属外壳之间实现一般大于20N/25mm的剥离力。 Thus, PSA can be achieved between the skin and the peel force in the range of generally 1~5N / 25mm of, and generally to achieve peel force less than 1N / 25mm between the PSA and the housing, and the metal shell of the battery and PSA peel force achieved is generally greater than between 20N / 25mm to.

[0388] 因此,可以理解,当传感中组件1被施加到用户的皮肤上时,可以在使用后通过用大于PSA和皮肤之间的剥离力拉拔粘合剂元件很容易地将其剥去。 [0388] Thus, it is understood that when the sensor assembly is applied to the skin of the user, after use can be greater than by using the peel force between the PSA and the skin adhesive pulling element which is easily stripped go with. 粘合剂元件5从而可很容易地与包含微电子电路4的外壳元件3分开。 Housing member 5 so that the adhesive member can be easily microelectronic circuit 4 comprising 3 separately. 由于粘合剂元件和电池6之间的剥离力远大于粘合剂和外壳之间的剥离力,因此电池实际上不可与粘合剂元件分开,因此当粘合剂与外壳分开时电池将被附着到粘合剂上。 Since the peel force between the adhesive element and the battery 6 is much greater than the release force between the adhesive and the housing, so the battery can not be practically separated from the adhesive element, so that when the adhesive separated from the housing of the battery will be attached to the adhesive.

Claims (70)

  1. 一种包含微电子系统的要被附着到哺乳动物的身体表面上的三维粘合剂器件,其特征在于,(a)具有上表面和底表面的由压敏粘合剂制成的三维粘合剂体;(b)被嵌入压敏粘合剂的体部中的微电子系统;(c)被附着到上表面上的一个或更多个覆盖层。 To microelectronic system comprising a three-dimensional adhesive device is attached to the upper surface of the body of a mammal, characterized in that, (A) having an adhesive made of a three-dimensional pressure sensitive adhesive surface and a bottom surface agent precursors; (b) a microelectronic system embedded in the body portion of the pressure sensitive adhesive; (c) is attached to one or more of the upper surface of the cover layer.
  2. 2. 根据权利要求l的粘合剂器件,其中,还具有可释放地附着到粘合剂器件的底表面上的释放衬里。 The adhesive device of claim l, wherein, further comprising a release liner releasably adhered to the bottom surface of the adhesive device.
  3. 3. 根据权利要求l的粘合剂器件,其中,三维粘合剂体具有适于粘合到哺乳动物的身体表面上的基本上平整的底表面和平滑的上表面,该粘合剂器件在体部的中心部分最厚并在体部的边缘上最薄。 The adhesive device according to claim l, wherein the three-dimensional body having the adhesive suitable for bonding to a substantially flat surface on the bottom surface of a mammalian body and smooth on the surface, in which the adhesive device the central portion of the body and thinnest at the thickest upper edge of the body portion.
  4. 4. 根据权利要求l的粘合剂器件,其中,粘合剂器件在边缘上的厚度小于粘合剂器件在其最厚位置上的厚度的50%。 4. The adhesive device of claim l, wherein a thickness of the adhesive device on the edge is less than 50% of the thickness of the adhesive device at its thickest position.
  5. 5. 根据权利要求4的粘合剂器件,其中,边缘上的厚度小于粘合剂器件在其最厚位置上的厚度的25%。 Adhesive device according to claim 4, wherein a thickness of less than 25% of the thickness of the edge of the adhesive device at its thickest position.
  6. 6. 根据权利要求5的粘合剂器件,其中,边缘上的厚度小于粘合剂器件在其最厚位置上的厚度的10%。 Adhesive device according to claim 5, wherein a thickness of less than 10% of the thickness of the edge of the adhesive device at its thickest position.
  7. 7. 根据权利要求6的粘合剂器件,其中,边缘上的厚度小于粘合剂器件在其最厚位置上的厚度的5%。 7. The adhesive device according to claim 6, wherein a thickness of less than 5% of the thickness of the edge of the adhesive device at its thickest position.
  8. 8. 根据权利要求l的粘合剂器件,其中,粘合剂器件在边缘上的厚度大于0.05mm,并且,粘合剂器件最厚的厚度为0. 5〜15mm。 The adhesive device according to claim l, wherein a thickness of the adhesive device on the rim is greater than 0.05mm, and, the adhesive device thickest thickness of 0. 5~15mm.
  9. 9. 根据权利要求8的粘合剂器件,其中,粘合剂器件在边缘上的厚度为0. 05〜0. 4mm, 并且,粘合剂器件最厚的厚度为1〜5mm。 Adhesive device according to claim 8, wherein the thickness of the adhesive device on the edge of 0. 05~0. 4mm, and, a thickness of the adhesive device is thickest 1~5mm.
  10. 10. 根据权利要求l的粘合剂器件,其中,粘合剂器件的底表面和从底表面的周边的任意点到在上表面处粘合剂体最厚位置上的点画出的线之间的角度小于60度。 10. The adhesive device as claimed in claim l, wherein the bottom surface of the adhesive device and from any point to the periphery of the bottom surface at a point on the adhesive surface at a thickest line drawn in the an angle less than 60 degrees between.
  11. 11. 根据权利要求10的粘合剂器件,其中,所述角度小于45度。 11. The adhesive device according to claim 10, wherein said angle is less than 45 degrees.
  12. 12. 根据权利要求11的粘合剂器件,其中,所述角度小于30度。 12. The adhesive device according to claim 11, wherein said angle is less than 30 degrees.
  13. 13. 根据权利要求1〜12中任一项的粘合剂器件,其中,制成三维粘合剂体的压敏粘合剂为可模压的热塑性的压敏粘合剂,该压敏粘合剂具有使得粘合剂器件能够符合身体部位的曲率同时即使在移动条件下也保持其粘合性能的柔性。 Claim 13. The adhesive device according to any one of 1~12, wherein the three-dimensional adhesive body made of a pressure sensitive adhesive is a moldable thermoplastic pressure-sensitive adhesive, the pressure-sensitive adhesive such that the adhesive agent has a device able to meet the curvature of body parts while retaining its adhesive properties even flexibility in movement conditions.
  14. 14. 根据权利要求1〜12中任一项的粘合剂器件,其中,压敏粘合剂是基于聚合物的粘合剂,这些聚合物选自嵌段共聚物、无定形聚a烯烃、聚丙烯酸、聚乙烯醚、聚氨酯、聚乙烯基乙酸酯、硅酮或水凝胶压敏粘合剂的组。 14. The adhesive device according to any one of claims 1~12, wherein the pressure sensitive adhesive is based on polymeric binder, the polymer is selected from block copolymers, amorphous poly-a-olefin, polyacrylic acid, polyvinyl ether group, a polyurethane, polyvinyl acetate, silicone pressure sensitive adhesive or gel water.
  15. 15. 根据权利要求14的粘合剂器件,其中,所述嵌段共聚物是苯乙烯嵌段共聚物或氢化苯乙烯嵌段共聚物。 15. The adhesive device as claimed in claim 14, wherein the block copolymer is a styrene block copolymer or a hydrogenated styrene block copolymer.
  16. 16. 根据权利要求14的粘合剂器件,其中,嵌段共聚物选自苯乙烯/乙烯_ 丁烯/苯乙烯、苯乙烯/异戊二烯/苯乙烯和苯乙烯/乙烯_丙烯/苯乙烯。 16. The adhesive device as claimed in claim 14, wherein the block copolymer is selected from styrene / ethylene _ butylene / styrene, styrene / isoprene / styrene and styrene / ethylene propylene _ / benzene ethylene.
  17. 17. 根据权利要求16的粘合剂器件,其中,所述嵌段共聚物是苯乙烯嵌段共聚物或氢化苯乙烯嵌段共聚物。 17. The adhesive device as claimed in claim 16, wherein the block copolymer is a styrene block copolymer or a hydrogenated styrene block copolymer.
  18. 18. 根据权利要求14的粘合剂器件,其中,粘合剂是基于聚二甲基硅氧烷的粘合剂。 18. The adhesive device as claimed in claim 14, wherein the binder is based on a polydimethylsiloxane adhesive.
  19. 19. 根据权利要求18的粘合剂器件,其中,所述基于聚二甲基硅氧烷的粘合剂是聚二甲基硅氧烷凝胶。 19. The adhesive device according to claim 18, wherein said polydimethylsiloxane based adhesive is polydimethylsiloxane gel.
  20. 20. 根据权利要求1〜12中任一项的粘合剂器件,其中,构成粘合剂体的压敏粘合剂包含水解胶体。 20. The adhesive device according to any one of claims 1~12, wherein the pressure-sensitive adhesive constituting the adhesive body comprises hydrocolloids.
  21. 21. 根据权利要求1〜12中任一项的粘合剂器件,其中,构成粘合剂体的压敏粘合剂是发泡粘合剂。 21. The adhesive device according to any one of claims 1~12, wherein the adhesive constituting the pressure-sensitive adhesive body is a foamed adhesive.
  22. 22. 根据权利要求1〜12中任一项的粘合剂器件,其中,整个微电子系统被集成到粘合剂体内,并在所有各边被粘合剂体完全覆盖。 22. The adhesive device according to any one of claims 1~12, wherein the entire microelectronic system is integrated into the adhesive body and is completely covered by the adhesive body on all sides.
  23. 23. 根据权利要求l的粘合剂器件,其中,微电子系统的一个或更多个部件被集成到粘合剂体内,并且在所有各边被粘合剂体覆盖,并且,微电子系统的其它部件位于粘合剂体的其它位置,微电子系统的部件相互具有必要的机械和电气连接。 23. The adhesive device of claim l, wherein the one or more components of the microelectronic system is integrated into the adhesive body and is covered by the adhesive body on all sides, and the microelectronic system other locations of the other components of the adhesive body is located, each having components of the microelectronic system is the necessary mechanical and electrical connection.
  24. 24. 根据权利要求1〜12中任一项的粘合剂器件,其中,整个微电子系统被包含于设置在面对覆盖层的粘合剂体的上表面中的一个或更多个凹槽内。 24. The adhesive device according to any of 1~12 claims, wherein the entire microelectronic system is contained in one or more grooves provided on the surface of the adhesive body facing the cover layer in the Inside.
  25. 25. 根据权利要求23的粘合剂器件,其中,微电子系统的一个或更多个部件被集成到粘合剂体内并在所有各边被粘合剂体覆盖,并且微电子系统的其余部分被包含于设置在面对覆盖层的粘合剂体的上表面中的一个或更多个凹槽内。 25. The adhesive device as claimed in claim 23, wherein one or more of the microelectronic system components are integrated into the adhesive body and is covered by the adhesive body on all sides, and the rest of the microelectronic system It is included in the pressure-sensitive adhesive disposed on the body facing surface of the cover layer of one or more grooves within.
  26. 26. 根据权利要求1〜12中任一项的粘合剂器件,其中,整个微电子系统被包含于被设置在粘合剂体的粘合剂底表面中的一个或更多个凹槽中。 Claim 26. The adhesive device according to any one of 1~12, wherein the entire microelectronic system is contained in one or more grooves are disposed on the bottom surface of the adhesive in the adhesive body .
  27. 27. 根据权利要求23的粘合剂器件,其中,微电子系统的一个或更多个部件被集成到粘合剂体内并在所有各边被粘合剂体覆盖,并且微电子系统的其余部分被包含于设置在粘合剂体的粘合剂底表面中的一个或更多个凹槽内。 27. The adhesive device as claimed in claim 23, wherein one or more of the microelectronic system components are integrated into the adhesive body and is covered by the adhesive body on all sides, and the rest of the microelectronic system It is included in a bottom surface of the adhesive provided in the adhesive body or the more grooves.
  28. 28. 根据权利要求1〜12中任一项的粘合剂器件,其中,整个微电子系统包含于粘合剂体中的一个或更多个通孔中,并且从面对覆盖层的上表面和粘合剂底表面均可到达。 Claim 28. The adhesive device according to any one of 1~12, wherein the entire microelectronic system is contained in the adhesive body of the one or more through holes, and from the upper surface facing the cover layer and the bottom surface of the adhesive can be reached.
  29. 29. 根据权利要求23的粘合剂器件,其中,微电子系统的一个或更多个部件被集成到粘合剂体内并被粘合剂体覆盖,并且,微电子系统的其它部分被包含于粘合剂体中的一个或更多个通孔中,并且从面对覆盖层的上表面和粘合剂底表面均可到达。 29. The adhesive device as claimed in claim 23, wherein the one or more components of the microelectronic system is integrated into the adhesive body and is covered with an adhesive material, and other parts of the microelectronic system is contained in a body adhesive or more through holes, and can be reached from the upper surface facing the cover layer and the adhesive bottom surface.
  30. 30. 根据权利要求1〜12中任一项的粘合剂器件,其中,微电子系统的一个或更多个部件被包含于粘合剂体内的一个或更多个通孔中,并且从面对覆盖层的上表面或粘合剂底表面均可到达,并且,微电子系统的其余部分被包含于设置在粘合剂体的上和/或底表面中的一个或更多个凹槽中。 30. The adhesive device according to any one of claims 1~12, wherein the one or more components of the microelectronic system is contained in a body of adhesive or more through holes, and the surface the upper surface of the bottom surface of the cover or an adhesive layer can be reached, and the rest of the microelectronic system is contained in one or more grooves provided at the upper and / or bottom surface of the adhesive body in .
  31. 31. 根据权利要求1〜12中任一项的粘合剂器件,其中,微电子系统的一个或更多个部件被包含于粘合剂体的上表面中的一个或更多个凹槽中,并且微电子系统的其余部分被包含于粘合剂体的底表面中的一个或更多个凹槽中。 One or more grooves 31. The adhesive device according to any 1~12 claims, wherein one or more of the microelectronic system is contained on the surface of the components of the adhesive body in and the remainder of the microelectronic system is contained in a bottom surface of the adhesive body in one or more grooves.
  32. 32. 根据权利要求1〜12中任一项的粘合剂器件,其中,微电子系统或其一个或更多个部件被封装到与粘合剂体不同的材料中。 32. The adhesive device according to any one of claims 1~12, wherein the microelectronic system or one or more components are encapsulated into the adhesive body of different materials.
  33. 33. 根据权利要求32的粘合剂器件,其中,微电子系统或其部件被封装到聚合物膜、聚合物箔或聚合物涂层中,或者,微电子系统或其部件被模压到聚合物材料中或被封装到玻璃或陶瓷材料中。 33. The adhesive device according to claim 32, wherein the microelectronic system or components thereof is encapsulated in a polymer film, a polymer foil or a polymer coating or the microelectronic system or components thereof is molded into a polymer material or packaged into a glass or ceramic material.
  34. 34. 根据权利要求33的粘合剂器件,其中,用于封装的聚合物是硅酮橡胶。 34. The adhesive device according to claim 33, wherein the polymer is a silicone rubber for encapsulation.
  35. 35. 根据权利要求1的粘合剂器件,其中,微电子系统的一个或更多个部件可从粘合剂外面到达并可在粘合剂器件的寿命期间被类似的部件替代。 35. The adhesive device as claimed in claim 1, wherein the one or more components of the microelectronic system is accessible and can be replaced by similar means during the lifetime of the device from the outside adhesive binder.
  36. 36. 根据权利要求35的粘合剂器件,其中,可被替代的部件是能量源。 36. The adhesive device as claimed in claim 35, wherein the member can be replaced energy source.
  37. 37. 根据权利要求36的粘合剂器件,其中,所述能量源是电池。 37. The adhesive device as claimed in claim 36, wherein the energy source is a battery.
  38. 38. 根据权利要求1的粘合剂器件,其中,微电子系统的一个或更多个部件可从粘合剂外面到达,并且部件可被再使用。 38. The adhesive device as claimed in claim 1, wherein the one or more components of the microelectronic system is accessible from the outside of the pressure-sensitive adhesive, and the component can be reused.
  39. 39. 根据权利要求35或38的粘合剂器件,其中,可替代部件或可再使用部件被封装并形成配合粘合剂中的凹槽或通孔的封装件。 39. The adhesive device as claimed in claim 35 or 38, wherein the member or alternatively reusable components are encapsulated with the binder and forming the package in a recess or through-hole.
  40. 40. 根据权利要求39的粘合剂器件,其中,封装的可替代或可再使用部件的封装件通过机械防护板被固定到粘合剂体中。 40. The adhesive device as claimed in claim 39, wherein the package may replace or reusable package member by mechanical shielding plate is secured to the adhesive body.
  41. 41. 根据权利要求39的粘合剂器件,其中,封装的可更换或可再使用部件的封装件在粘合剂体的凹槽或通孔中被固定到粘合剂的表面上。 41. The adhesive device according to claim 39, wherein the package may be replaceable or reusable package member is fixed to the upper surface of the adhesive in the recess or through hole of the adhesive body.
  42. 42. 根据权利要求39的粘合剂器件,其中,封装的可替代或可再使用部件的封装件被固定到粘合剂体中的凹槽或通孔中,这里,所述凹槽或通孔具有内部非粘性表面。 42. The adhesive device as claimed in claim 39, wherein alternatively or reusable package encapsulation member is fixed to the adhesive body in a recess or through-hole, where the recesses or through hole having an inner non-stick surface.
  43. 43. 根据权利要求42的粘合剂器件,其中,所述内部非粘性表面是聚二甲基硅氧烷涂层。 43. The adhesive device as claimed in claim 42, wherein said inner surface is non-tacky coating polydimethylsiloxane.
  44. 44. 根据权利要求1〜12中任一项的粘合剂器件,其中,微电子系统包含选自通信部件、CPU、电源、存储部件、换能器部件、致动器部件的部件和所选择的部件之间的机械和/或电气互连。 44. The adhesive device according to any one of claims 1~12, wherein the microelectronic system comprises a member selected from the group communication, CPU, power source, storage means, transducer means, the actuator means and the selected member mechanical and / or electrical interconnections between the components.
  45. 45. 根据权利要求1〜12中任一项的粘合剂器件,其中,微电子系统是使得能够进行无线通信的系统。 45. The adhesive device according to any one of claims 1~12, wherein the microelectronic system is a system enabling wireless communication.
  46. 46. 根据权利要求44的粘合剂器件,其中,换能器具有选自极性电极、压力传感器、具有电极的针、加速计、光检测器、麦克风、离子敏感场效应晶体管、负温度系数电阻器、带隙检测器、离子膜、酶反应器或电容器的检测元件。 46. ​​The adhesive device as claimed in claim 44, wherein the transducer has a selected polarity of the electrodes, a pressure sensor, a needle with an electrode, an accelerometer, light detector, microphone, ion-sensitive field effect transistors, a negative temperature coefficient resistor, the bandgap detector element detects membrane, enzyme reactor or a capacitor.
  47. 47. 根据权利要求46的粘合剂器件,其中,换能器具有非侵入式检测元件。 47. The adhesive device as claimed in claim 46, wherein the transducer has a non-invasive detecting element.
  48. 48. 根据权利要求46的粘合剂器件,其中,换能器具有侵入式检测元件。 48. The adhesive device as claimed in claim 46, wherein the transducer has an invasive detecting element.
  49. 49. 根据权利要求48的粘合剂器件,其中,所述侵入式检测元件是包含电极的针。 49. The adhesive device as claimed in claim 48, wherein the intrusion detection element is a needle containing an electrode.
  50. 50. 根据权利要求44的粘合剂器件,其中,微电子系统包含网络集线器、网关和协调器系统。 50. The adhesive device as claimed in claim 44, wherein the microelectronic system comprises a network hub, gateway and coordinate systems.
  51. 51. 根据权利要求44的粘合剂器件,其中,微电子系统包含GPS。 51. The adhesive device as claimed in claim 44, wherein the microelectronic system comprises GPS.
  52. 52. 根据权利要求44的粘合剂器件,其中,微电子系统包含RFID标签。 52. The adhesive device according to claim 44, wherein the microelectronic system comprises an RFID tag.
  53. 53. 根据权利要求50的粘合剂器件,其中,微电子系统是包含封装在塑料内的包含存储和通信部件、CPU和电池并用作用于向中央单元传送数据的专用网络协调器的网关。 53. The adhesive device according to claim 50, wherein the microelectronic system comprising a gateway comprising storage and communication package section, CPU, and a battery and serving as a central unit for transferring data to a dedicated network coordinator within the plastic.
  54. 54. 根据权利要求51的粘合剂器件,其中,微电子系统是选自以下系统的系统:封装在塑料内的包含存储和通信部件、CPU、电池、GPS、用于数据记录GPS数据的实时时钟的无线同步化的部件的系统;禾口封装在塑料内的包含存储和通信部件、CPU、电池、GPS、用于数据记录GPS数据的实时时钟的无线同步化的部件、用于数据记录和向移动电话机传送数据和位置的移动网络的系统。 54. The adhesive device as claimed in claim 51, wherein the microelectronic system is a system selected from the following systems: a package comprising storage and communication components, CPU, battery, GPS in plastic, for real-time data logging of GPS data wireless system components synchronized clock; Wo port encapsulated within plastic comprising storage and communication components, CPU, battery, GPS, components for wireless synchronization of real time clock data logging GPS data, data for recording and transmitting data to the mobile telephone system and the position of the mobile network.
  55. 55. 根据权利要求44的粘合剂器件,其中,微电子系统可用于神经剌激并包含存储和通信部件、CPU、电源、用于向用于神经剌激的植入物传送数据和功率的换能器。 55. The adhesive device as claimed in claim 44, wherein the microelectronic system may be used for nerve stimulation and comprises storage and communication components, CPU, power source, for transmitting data to the implant for nerve stimulation and power transducer.
  56. 56. 根据权利要求44的粘合剂器件,其中,微电子系统是可用于肌电图描记的系统并包含换能器、CPU、电源、通信和存储部件,以及致动器。 56. The adhesive device as claimed in claim 44, wherein the microelectronic system is a system electromyography and comprises a transducer, CPU, power source, communication and storage components, and an actuator.
  57. 57. 根据权利要求1〜12中任一项的粘合剂器件,其中,该器件包含用于向所述微电子系统供电的电源元件,其中,粘合剂体可释放地附着到微电子系统的部件中的一个或更多个上; 粘合剂体至少具有用于粘合到身体表面上的第一区域。 Claim 57. The adhesive device according to any one of 1~12, wherein the device comprises a power source supplying power to the microelectronic device system, wherein the binder precursor may be releasably attached to the microelectronic system one or more of the components; at least a first region having an adhesive for adhering to the body surface.
  58. 58. 根据权利要求57的粘合剂器件,其中,电源元件被附着到粘合剂体上,并且粘合剂体至少具有用于粘合到微电子系统的部件中的一个或更多个上的第二区域。 58. The adhesive device as claimed in claim 57, wherein the power source element is attached to the body adhesive, and the adhesive has bonded to at least one of the components of the microelectronic system or more of the the second region.
  59. 59. 根据权利要求58的粘合剂器件,其中,第二区域和微电子电路之间的第一剥离力比电源和粘合剂体之间的第二剥离力小。 59. The adhesive device as claimed in claim 58, wherein a first peel force between the second region and the microelectronic circuit is smaller than the second peel force between the power supply and the binder precursor.
  60. 60. 根据权利要求57的粘合剂器件,其中,电源元件至少部分包含于粘合剂体内。 60. The adhesive device according to claim 57, wherein the power supply element is at least partially contained within the adhesive body.
  61. 61. 根据权利要求57的粘合剂器件,其中,粘合剂器件适于可释放地连接到包含微电子系统的外壳上,并且外壳由近端外壳部分和远端外壳部分形成。 61. The adhesive device as claimed in claim 57, wherein the adhesive device is adapted to be releasably connected to the microelectronic system comprises a housing, and the housing is formed by a proximal end and a distal housing portion housing portion.
  62. 62. 根据权利要求61的粘合剂器件,其中,至少一个电源适于被容纳在凹槽中,该凹槽在远端外壳部分中形成,并且,至少一个电接点被设置在远端外壳中,从而在电源和微电子电路之间提供电连接。 62. The adhesive device as claimed in claim 61, wherein the at least one power supply adapted to be received, the recess portion is formed at a distal end of the housing in the recess, and the at least one electrical contact is provided at the distal end of the housing , thereby providing between the source and the microelectronic circuit is electrically connected.
  63. 63. 根据权利要求1-12中任一项的粘合剂器件,其中,微电子系统是微电子感测系统。 63. The adhesive of any of claims 1 to 12 in a device, wherein the microelectronic system is a microelectronic sensing system.
  64. 64. 根据权利要求1的粘合剂器件,在粘合剂器件中嵌入了微电子系统并通过布线与其它的电子系统连接。 64. The adhesive device as claimed in claim 1, the microelectronic system is embedded in the adhesive device and connected to other electronic systems via the wiring.
  65. 65. 根据权利要求46的粘合剂器件,其中所述极性电极是双极电极。 65. The adhesive device according to claim 46, wherein said electrode is a bipolar electrode polarity.
  66. 66. —种多传感器网络,包括一个或多个根据权利要求1〜65中任意一项的粘合剂器件。 66. - kind of multi-sensor network, comprising one or more adhesive device according to any one of claims 1~65 claims.
  67. 67. 根据权利要求66的多传感器网络,包括:包含网络协调器的粘合剂器件;包含用于肌电图描记并包含换能器、CPU、电源、通信和存储部件以及致动器的微电子系统的至少两个粘合剂器件;和包含适于测量心率的微电子系统的粘合剂器件。 67. The multi-sensor network 66, including claim: adhesive devices comprising a network coordinator; comprises means for electromyography and comprises a transducer, CPU, power source, communication and storage components and the micro-actuator at least two adhesive device electronic system; and comprising a microelectronic system adapted to measure the heart rate of the adhesive device.
  68. 68. —种具有在粘合剂中嵌入的微电子系统的根据权利要求l的粘合剂器件的制造方法,其特征在于,粘合剂体被压塑。 68. - Method for producing an adhesive device according to claim l seed embedded in a binder having a microelectronic system, characterized in that the adhesive body is press molded.
  69. 69. —种具有在粘合剂中嵌入的微电子系统的根据权利要求l的粘合剂器件的制造方法,其特征在于,粘合剂体被注模。 69. - Method for producing an adhesive device according to claim l seed embedded in a binder having a microelectronic system, characterized in that the adhesive body is injection molded.
  70. 70. —种具有在粘合剂中嵌入了微电子系统的根据权利要求l的粘合剂器件的制造方法,其特征在于,粘合剂体通过反应模压形成。 70. - A method for producing seed having embedded a microelectronic system according to claim l requirements of the adhesive device in a binder, wherein the binder precursor is formed by reaction molding.
CN 200680013718 2005-03-09 2006-03-09 A three-dimensional adhesive device having a microelectronic system embedded therein CN101163440B (en)

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