CN101157788B - Phase-separation-controlled polybutadiene resin composition and printed wiring board using the resin composition - Google Patents
Phase-separation-controlled polybutadiene resin composition and printed wiring board using the resin composition Download PDFInfo
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- CN101157788B CN101157788B CN2007101620209A CN200710162020A CN101157788B CN 101157788 B CN101157788 B CN 101157788B CN 2007101620209 A CN2007101620209 A CN 2007101620209A CN 200710162020 A CN200710162020 A CN 200710162020A CN 101157788 B CN101157788 B CN 101157788B
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- 239000005062 Polybutadiene Substances 0.000 title claims abstract description 41
- 229920002857 polybutadiene Polymers 0.000 title claims abstract description 41
- 239000011342 resin composition Substances 0.000 title abstract description 5
- 238000005191 phase separation Methods 0.000 title abstract description 3
- 239000000203 mixture Substances 0.000 claims abstract description 136
- 239000007870 radical polymerization initiator Substances 0.000 claims abstract description 16
- 239000004020 conductor Substances 0.000 claims description 24
- 238000012545 processing Methods 0.000 claims description 24
- 239000003063 flame retardant Substances 0.000 claims description 14
- 239000011888 foil Substances 0.000 claims description 14
- -1 t-butyl peroxy Chemical group 0.000 claims description 13
- 230000008878 coupling Effects 0.000 claims description 12
- 238000010168 coupling process Methods 0.000 claims description 12
- 238000005859 coupling reaction Methods 0.000 claims description 12
- 239000004744 fabric Substances 0.000 claims description 11
- 229920003048 styrene butadiene rubber Polymers 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 10
- 239000012764 mineral filler Substances 0.000 claims description 10
- 239000003795 chemical substances by application Substances 0.000 claims description 9
- 238000001035 drying Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- 239000004745 nonwoven fabric Substances 0.000 claims description 9
- 239000000945 filler Substances 0.000 claims description 8
- 229910010272 inorganic material Inorganic materials 0.000 claims description 7
- 239000011147 inorganic material Substances 0.000 claims description 7
- 238000006243 chemical reaction Methods 0.000 claims description 6
- 238000005984 hydrogenation reaction Methods 0.000 claims description 6
- 238000005470 impregnation Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 125000003011 styrenyl group Chemical group [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 claims description 6
- 239000011368 organic material Substances 0.000 claims description 5
- 238000006116 polymerization reaction Methods 0.000 claims description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 4
- 229920002554 vinyl polymer Polymers 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- 239000011229 interlayer Substances 0.000 claims description 3
- 238000004132 cross linking Methods 0.000 abstract description 6
- 230000006866 deterioration Effects 0.000 abstract description 5
- 229920002589 poly(vinylethylene) polymer Polymers 0.000 abstract 1
- 239000003999 initiator Substances 0.000 description 35
- 239000002966 varnish Substances 0.000 description 28
- 239000011347 resin Substances 0.000 description 21
- 229920005989 resin Polymers 0.000 description 21
- 230000000052 comparative effect Effects 0.000 description 20
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 17
- 239000000463 material Substances 0.000 description 16
- 239000011889 copper foil Substances 0.000 description 13
- 238000005530 etching Methods 0.000 description 12
- 239000010410 layer Substances 0.000 description 11
- 239000002904 solvent Substances 0.000 description 11
- 230000007704 transition Effects 0.000 description 11
- 229920002120 photoresistant polymer Polymers 0.000 description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- 230000007306 turnover Effects 0.000 description 9
- 239000004342 Benzoyl peroxide Substances 0.000 description 7
- 235000019400 benzoyl peroxide Nutrition 0.000 description 7
- 239000011152 fibreglass Substances 0.000 description 7
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 230000005855 radiation Effects 0.000 description 5
- BZQKBFHEWDPQHD-UHFFFAOYSA-N 1,2,3,4,5-pentabromo-6-[2-(2,3,4,5,6-pentabromophenyl)ethyl]benzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1CCC1=C(Br)C(Br)=C(Br)C(Br)=C1Br BZQKBFHEWDPQHD-UHFFFAOYSA-N 0.000 description 4
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910001873 dinitrogen Inorganic materials 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 4
- 238000005502 peroxidation Methods 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 150000003254 radicals Chemical class 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 238000013517 stratification Methods 0.000 description 4
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 230000005764 inhibitory process Effects 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 229910000029 sodium carbonate Inorganic materials 0.000 description 3
- 235000017550 sodium carbonate Nutrition 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- BEQKKZICTDFVMG-UHFFFAOYSA-N 1,2,3,4,6-pentaoxepane-5,7-dione Chemical compound O=C1OOOOC(=O)O1 BEQKKZICTDFVMG-UHFFFAOYSA-N 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- OUUQCZGPVNCOIJ-UHFFFAOYSA-M Superoxide Chemical compound [O-][O] OUUQCZGPVNCOIJ-UHFFFAOYSA-M 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- IUGYQRQAERSCNH-UHFFFAOYSA-N pivalic acid Chemical compound CC(C)(C)C(O)=O IUGYQRQAERSCNH-UHFFFAOYSA-N 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000008961 swelling Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- FVQMJJQUGGVLEP-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOOC(C)(C)C FVQMJJQUGGVLEP-UHFFFAOYSA-N 0.000 description 1
- FIAXCDIQXHJNIX-UHFFFAOYSA-N 1,2,3,4,5-pentabromo-6-ethylbenzene Chemical compound CCC1=C(Br)C(Br)=C(Br)C(Br)=C1Br FIAXCDIQXHJNIX-UHFFFAOYSA-N 0.000 description 1
- OKIRBHVFJGXOIS-UHFFFAOYSA-N 1,2-di(propan-2-yl)benzene Chemical compound CC(C)C1=CC=CC=C1C(C)C OKIRBHVFJGXOIS-UHFFFAOYSA-N 0.000 description 1
- FCHGUOSEXNGSMK-UHFFFAOYSA-N 1-tert-butylperoxy-2,3-di(propan-2-yl)benzene Chemical compound CC(C)C1=CC=CC(OOC(C)(C)C)=C1C(C)C FCHGUOSEXNGSMK-UHFFFAOYSA-N 0.000 description 1
- NOSXUFXBUISMPR-UHFFFAOYSA-N 1-tert-butylperoxyhexane Chemical compound CCCCCCOOC(C)(C)C NOSXUFXBUISMPR-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- KZMAWJRXKGLWGS-UHFFFAOYSA-N 2-chloro-n-[4-(4-methoxyphenyl)-1,3-thiazol-2-yl]-n-(3-methoxypropyl)acetamide Chemical compound S1C(N(C(=O)CCl)CCCOC)=NC(C=2C=CC(OC)=CC=2)=C1 KZMAWJRXKGLWGS-UHFFFAOYSA-N 0.000 description 1
- TVWBTVJBDFTVOW-UHFFFAOYSA-N 2-methyl-1-(2-methylpropylperoxy)propane Chemical compound CC(C)COOCC(C)C TVWBTVJBDFTVOW-UHFFFAOYSA-N 0.000 description 1
- WTBPWOVBWKJVPF-UHFFFAOYSA-N 3-(2-ethylhexylperoxymethyl)heptane Chemical class CCCCC(CC)COOCC(CC)CCCC WTBPWOVBWKJVPF-UHFFFAOYSA-N 0.000 description 1
- YPIFGDQKSSMYHQ-UHFFFAOYSA-N 7,7-dimethyloctanoic acid Chemical compound CC(C)(C)CCCCCC(O)=O YPIFGDQKSSMYHQ-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- MUPIEMDDBGZNRU-UHFFFAOYSA-N C(C)(C)C(=O)O.C(C)(C)(C)OO Chemical compound C(C)(C)C(=O)O.C(C)(C)(C)OO MUPIEMDDBGZNRU-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- 206010013786 Dry skin Diseases 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002174 Styrene-butadiene Substances 0.000 description 1
- 125000000218 acetic acid group Chemical group C(C)(=O)* 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000004523 agglutinating effect Effects 0.000 description 1
- 238000007605 air drying Methods 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- XJOBOFWTZOKMOH-UHFFFAOYSA-N decanoyl decaneperoxoate Chemical compound CCCCCCCCCC(=O)OOC(=O)CCCCCCCCC XJOBOFWTZOKMOH-UHFFFAOYSA-N 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010981 drying operation Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000002779 inactivation Effects 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- RWGFKTVRMDUZSP-UHFFFAOYSA-N isopropyl-benzene Natural products CC(C)C1=CC=CC=C1 RWGFKTVRMDUZSP-UHFFFAOYSA-N 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920002959 polymer blend Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- BWJUFXUULUEGMA-UHFFFAOYSA-N propan-2-yl propan-2-yloxycarbonyloxy carbonate Chemical compound CC(C)OC(=O)OOC(=O)OC(C)C BWJUFXUULUEGMA-UHFFFAOYSA-N 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 125000003696 stearoyl group Chemical group O=C([*])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000011115 styrene butadiene Substances 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 125000005425 toluyl group Chemical group 0.000 description 1
- 239000012745 toughening agent Substances 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F36/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds
- C08F36/02—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds the radical having only two carbon-to-carbon double bonds
- C08F36/04—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds the radical having only two carbon-to-carbon double bonds conjugated
- C08F36/06—Butadiene
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
- C08L53/025—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes modified
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/012—Flame-retardant; Preventing of inflammation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31725—Of polyamide
- Y10T428/3175—Next to addition polymer from unsaturated monomer[s]
- Y10T428/31757—Polymer of monoethylenically unsaturated hydrocarbon
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
- Y10T442/2631—Coating or impregnation provides heat or fire protection
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
- Y10T442/2738—Coating or impregnation intended to function as an adhesive to solid surfaces subsequently associated therewith
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
It is an objective of this invention to obtain: a composition superior in processability, dielectric properties, heat resistance, and adhesiveness by controlling phase separation of a 1,2-polybutadiene resin composition without deterioration of dielectric properties exhibited in high-frequency regions; and a multilayer printed wiring board using the same. This invention relates to a polybutadiene resin composition, comprising: a crosslinking component (A) comprising repeating units represented by the following formula (1) and having a number average molecular weight of 1000 to 20000; a radical polymerization initiator (B), the one-minute half-life temperature of which is 80 DEG C. to 140 DEG C.; and a radical polymerization initiator (C), the one-minute half-life temperature of which is 170 DEG C. to 230 DEG C.; wherein 3 to 10 parts by weight of the component (B) and 5 to 15 parts by weight of the component (C) are contained relative to 100 parts by weight of the component (A). The invention also relates to a prepreg, a laminate, and a printed wiring board, which are produced using the same.
Description
Technical field
The present invention relates to suppress the polybutadiene composition that is separated and with its printed base plate as insulation layer.
Background technology
In the last few years, the signal area of the information communication machine of PHS, Cell phone etc., the cpu clock timing register of computer reached the GHz band, carry out high frequencyizatioies.The transmission of electrical signal loss, adopt dissipation loss and conductor losses and radiation loss and expression, following relation is arranged, promptly the frequency of electrical signal becomes high more, and it is big more that dissipation loss, conductor losses, radiation loss become.Transmission loss makes the electrical signal decay, and therefore the reliability of infringement signal must take to suppress the measure of dissipation loss, conductor losses, radiation loss increase in the circuit board of processing radio-frequency signal.Dissipation loss and form frequency long-pending proportional of square root, tangent of the dielectric loss angle and employed signal of relative permittivity of the insulating material of circuit.Therefore, can suppress the increase of dissipation loss by selected relative permittivity and the little material of tangent of the dielectric loss angle as insulating material.As such insulating material, just no heteroatomic Thermocurable polyhutadiene in the structure is studied from way back.In the public clear 47-51952 of spy number, special public clear 48-14428 number, disclose and had 1 more than the 80wt%, the number-average molecular weight of 2-butadiene unit be 1000～20000 low molecular weight polybutadiene and and then added the polybutadiene composition that vinyl monomer, silane coupling agent, filler, curing catalyst, pigment form as required, and disclose in the toughener of glass fibre etc. and made this polybutadiene composition impregnation, in the presence of organo-peroxide, the veneer sheet that heats, pressurizes and make.In addition, in special public clear 58-21925 number, special public clear 58-21926 number, disclose to contain 1 more than 50%, 2-butadiene unit, number-average molecular weight are 100000～200000 the high molecular polyhutadiene polybutadiene composition as crosslinked composition, clear and definite as its effect, have good inharmonious (tack free) property in prepreg (prepreg) stage.
Patent documentation 4 special public clear 58-21926 communiques
Summary of the invention
There is following problem essentially in aforesaid polybutadiene composition.The first, with the polyhutadiene based resin composition of low molecular weight polybutadiene as crosslinked composition, abhesiveness is low, and its prepreg has binding property, and therefore keeping and the property handled are low.Second, the high molecular polyhutadiene, be solid at normal temperatures, though therefore processing property excellence, but the viscosity of high density varnish (varnish) is very high, if be modulated into the varnish viscosity that is suitable for applying operation (≤500cP), then form the thin varnish about 10wt%, need carry out repeatedly coating, drying operation in order to regulate pickup to base material.The 3rd because the polarity of polyhutadiene is low, therefore and the consistency of other material of additive, fire retardant, polymer blend etc. low, add the existence in man-hour in pressurization and be separated, the problem of oozing out in the system of veneer sheet as the polyhutadiene of crosslinked composition.The generation that is separated, the outward appearance of disturbed zone pressing plate not only, and because of the polyhutadiene as crosslinked composition outside system, ooze out cause solidifying not enough, the reduction that brings solvent resistance thus.
The object of the present invention is to provide polybutadiene composition and the printed base plate that uses it, when described polyhutadiene composition is realized modulating high density varnish simultaneously the reduction of varnish viscosity and abhesiveness the two, suppressed simultaneously as the polyhutadiene of crosslinked composition and being separated of other matrix material.
(1) polybutadiene composition, it is characterized in that, the number-average molecular weight that contains the repeating unit with following formula (1) expression is 1000～20000 crosslinked composition (A), is 80～140 ℃ radical polymerization initiator (B) and is 170～230 ℃ radical polymerization initiator (C) at 1 minute half life temperature at 1 minute half life temperature, with (A) composition as 100 weight parts, contain 3～10 weight parts (B) composition, contain (C) compositions of 5～15 weight parts
[changing 1]
(2) (1) described polybutadiene composition is characterized in that, is present in 80～140 ℃ based on first exothermic peak of thermopolymerization, and second exothermic peak is present in 170～230 ℃.
(3) (1) or (2) described polybutadiene composition is characterized in that (C) composition is 2,5-dimethyl-2, two (t-butyl peroxy) hexins-3 of 5-.
(4) the described polybutadiene composition of each of (1)～(3) is characterized in that, also contains styrene-butadiene block copolymer or its hydrogenation thing (D), fire retardant (E) and mineral filler (F).
(5) (4) described polybutadiene composition, it is characterized in that, (A) containing ratio of the repeating unit of the formula in the composition (1) is more than the 90wt%, (D) containing ratio of the vinylbenzene residue in the composition is 10～30wt%, (E) composition is the compound of formula (2) or formula (3) expression, and (F) composition is to adopt to have implemented the surface-treated cilicon oxide filler with the coupling processing agent of vinyl reaction.
[changing 2]
[changing 3]
(6) (4) or (5) described polybutadiene composition is characterized in that, as 100 weight parts, contains (D) composition of 15～100 weight parts, (E) composition of 50～100 weight parts, (F) composition of 80～200 weight parts with (A) composition.
(7) polybutadiene composition, it is in each described polybutadiene composition of (1)～(6), makes the heat polymerization based on (B) composition finish to obtain.
(8) manufacture method of prepreg, it is characterized in that, each described polybutadiene composition of impregnation (1)～(7) on the fabric of organic or inorganic materials or non-woven fabrics carries out heat drying then under with respect to the temperature based on-10 ℃ to+10 ℃ scope of first exothermic peak temperature of the thermopolymerization of polybutadiene composition.
(9) prepreg, it is at the fabric of organic or inorganic materials or each described polybutadiene composition of non-woven fabrics impregnation (1)～(7), carries out heat drying under with respect to the temperature based on-10 ℃ to+10 ℃ scope of first exothermic peak temperature of the thermopolymerization of polybutadiene composition then and obtains.
(10) veneer sheet, it is that (9) described prepreg and conductor foil is overlapping, by pressurization and heating prepreg is solidified then, simultaneously adhesive solidification prepreg and conductor foil make.
(11) multilayer printed board, it is to press from both sides every (9) described prepreg, and a plurality of printed base plates of implementing wiring processing and obtain on the lip-deep conductor foil that is disposed at (10) described veneer sheet are carried out laminated bonding, forms interlayer wiring manufacturing then.
By the present invention, with normally used 1, the 2-polyhutadiene becomes easy as varnishization, the prepregization of the resin combination of crosslinked composition.The forming process of prepreg of the present invention is easy, do not have be separated, the oozing out of crosslinked composition.Therefore the veneer sheet of being made by prepreg of the present invention and relative permittivity, the tangent of the dielectric loss angle of multilayer printed board is low and cohesive force, the thermotolerance height of Copper Foil is suitable for the substrate material as the high frequency machine.
Description of drawings
The mode chart of the technology when Fig. 1 is the making of expression multiwiring board.
[explanation of symbol]
1... Copper Foil, 2... resin substrate, 3... photoresist material, 4... prepreg, the wiring of 5... internal layer, the outer wiring of 6..., 7... through hole, 8... plating catalyzer, 9... seed crystal film (seed layer), 10... hollow hole part, 11... electrode, 12... plated copper
Embodiment
First form of the present invention is the polybutadiene composition, it is characterized in that, the number-average molecular weight of repeating unit that contains (1) expression that has formula is 1000～20000 crosslinked composition (A), is 80～140 ℃ radical polymerization initiator (B) and is 170～230 ℃ radical polymerization initiator (C) at 1 minute half life temperature at 1 minute half life temperature, with (A) composition as 100 weight parts, contain 3～10 weight parts (B) composition, contain (C) compositions of 5～15 weight parts.
Second form of the present invention is above-mentioned polybutadiene composition, it is characterized in that, is present in 80～140 ℃ based on first exothermic peak of thermopolymerization, and second exothermic peak is present in 170～230 ℃.
To 1, free-radical polymerised (solidified nature) of 2-polyhutadiene studied, and the result distinguishes the solidified degree of carrying out and set time, the irrelevant addition that depends on radical polymerization initiator of temperature for polyhutadiene.Think thus, heating when heating when modulating by adding an amount of radical polymerization initiator and varnish or prepreg are dry can carry out 1,2-polyhutadiene crosslinked, formation has the high molecular weight material of three-dimensional crosslinking structure, can improve abhesiveness thus, prevent and being separated of other composition.
As crosslinked composition of the present invention (A), consider that from the viewpoint of the varnish viscosity that reduces high density varnish preferred number average molecular weight is 1000～20000 lower molecular weight 1, the 2-polyhutadiene.Consider that from the viewpoint of solidified nature it is unitary 1 especially preferably to contain the 1 of above formula (1) expression of 90wt%, the 2-polyhutadiene.The repeating unit except the 1 unit as containing in crosslinked composition (A) can exemplify for example cis 1,4-butadiene unit or trans 1,4-butadiene unit.
Radical polymerization initiator (B) is when varnish is modulated or the lower temperature of prepreg when dry under can make crosslinked composition (A) carry out the composition of crosslinking reaction.Below (B) composition is called low temperature initiators (B).Require low temperature initiators (B) under lower temperature, to produce free radical, the therefore preferred radical polymerization initiator that is present in 80～140 ℃ scope at 1 minute half life temperature that uses.The addition of low temperature initiators (B), with crosslinked composition (A) as 100 weight parts, the scope of preferred 3～10 weight parts.If the inhibition of less than 3 weight parts, be separated, oozing out is insufficient,, produce the flowability reduction that varnish viscosity increases, adds the resin combination in man-hour if more than 10 weight parts.Example as low temperature initiators (B); can exemplify isobutyl peroxide; α; α '-two (new decanoyl peroxide) diisopropyl benzene; peroxidation neodecanoic acid isopropyl benzene ester; the peroxy dicarbonate di-n-propyl ester; 1; 1; 3; 3-tetramethyl butyl new decanoate ester peroxide; di-isopropyl peroxydicarbonate; 1-cyclohexyl-1-methylethyl new decanoate ester peroxide; two-2-ethoxyethyl group peroxy dicarbonate; two (2-ethylhexyl peroxides), two carbonic ethers; the own ester of peroxidation neodecanoic acid uncle; dimethoxy butyl peroxy dicaprate; two (3-methyl-3-methoxyl group butyl peroxy), two carbonic ethers; new peroxide tert-butyl caprate; the own ester of peroxidation PIVALIC ACID CRUDE (25) uncle; the peroxidation PIVALIC ACID CRUDE (25) tert-butyl ester; 3; 5; 5-trimethyl acetyl base superoxide; sim peroxides; 1; 1; 3; 3-tetramethyl butyl peroxide-2-ethylhexanoate; 2; 5-dimethyl-2,5-two (2-ethyl hexanoyl base peroxide) hexane; 1-cyclohexyl-1-methylethyl peroxide-2-ethylhexanoate; uncle's hexyl peroxide-2-ethylhexanoate; t-butyl peroxy-2-ethylhexanoate; toluoyl base superoxide; the tert-butyl hydroperoxide isobutyrate.As preferred example, can exemplify benzoyl peroxide, lauroyl peroxide, stearoyl, two (4-tert-butylcyclohexyl) peroxy dicarbonate as the low temperature initiators (B) of excellent storage stability under the room temperature.Use the low temperature initiators (B) of excellent storage stability under the room temperature, security when not only improving the radical polymerization initiator storage, and because decomposition reaction is difficult to take place when keeping, therefore initiated polymerization stable performance, what prevent resin material contained in the prepreg is separated, controls flowability easily, so preferred.Wherein, the active o content height of benzoyl peroxide, so polymerization efficiency height, preferred especially.
The pressurization of radical polymerization initiator (C) when veneer sheet or multilayer printed board making adds the solidified function that has realized promoting prepreg man-hour.Can improve thermotolerance, solvent resistance of veneer sheet or multilayer printed board etc. thus.Below radical polymerization initiator (C) is called high-temperature initiator (C).Require high-temperature initiator (C) under than the also high temperature of low temperature initiators (B), to produce free radical, the preferred radical polymerization initiator that is present in 170～230 ℃ scope at 1 minute half life temperature that uses.Its addition, with crosslinked composition (A) as 100 weight parts, the scope of preferred 5～15 weight parts.If less than 5 weight parts, sometimes solidify deficiency, solvent resistance reduces.If more than 15 weight parts, over cure sometimes can not satisfy stripping strength.Example as high-temperature initiator (C), can enumerate α, α '-two (t-butyl peroxy) diisopropyl benzene, dicumyl peroxide, 2,5-dimethyl-2,5-two (t-butyl peroxy) hexane, tert-butyl peroxide cumyl, di-t-butyl peroxide, 2,5-dimethyl-2,5-two (t-butyl peroxy) hexin-3, tert-butyl peroxide trimethyl silyl.Particularly 2,5-dimethyl-2,5-two (t-butyl peroxy) hexin-3 can not cause the remarkable deterioration of dielectric characteristics, and is therefore preferred.
In the present invention, in order to obtain physical properties balance, can in the polybutadiene composition, add styrene-butadiene block copolymer or its hydrogenation thing (D), fire retardant (E), mineral filler (F).
Styrene-butadiene block copolymer or its hydrogenation thing (D), the dielectric characteristics deterioration ground with the system of not making improves the effect of the abhesiveness of prepreg.(D) the preferred 10～30wt% of vinylbenzene residue containing ratio of composition has (D) composition of the vinylbenzene residue of this scope by use, can not reduce second-order transition temperature, improves abhesiveness.On the other hand, using under the situation of vinylbenzene residue less than (D) composition of 10wt%, same with the situation of having added the high molecular polyhutadiene, cause that varnish viscosity increases, when using (D) composition of the vinylbenzene residue containing ratio also higher than 30wt%, sometimes produce micron-scale phase separation during curing, second-order transition temperature drops to about 100 ℃.
Fire retardant (E) is the composition of imparting system flame retardant resistance.As particularly preferred fire retardant, it is little that preferred use comprises tangent of the dielectric loss angle, the fire retardant of the compound of formula that decomposition temperature, melt temperature, flame retardant effect are all high (2) or formula (3) expression.The particle diameter of fire retardant (E), preferred 0.2～3.0 μ m.Fire retardant precipitation when preventing the varnish keeping thus, sedimentary redispersion become easy.
Mineral filler (F) helps to reduce the thermal expansion of system.As preferred filling kind, the little silicon oxide of numerical value of preferred tangent of the dielectric loss angle, more preferably, for the reduction effect, 1 of the tangent of the dielectric loss angle of the surface of filler performance system, the inhibition effect that is separated of 2-polyhutadiene and adopt vinyl-based coupling processing agent to implement surface treatment.(F) particle diameter of composition is from productivity, guarantee that the viewpoint of the insulativity of the finished product considers that preferred median size is the scope of 0.5～60 μ m.
The compounding ratio of each matrix material, as 100 weight parts, preferred (D) composition is 15～100 weight parts with crosslinked composition (A), and (E) composition is 50～100 weight parts, and (F) composition is 80～200 weight parts.Preferably in this scope, meet idiocratically adjusting of end article requirement.
Polybutadiene composition of the present invention modulation is through with first thermopolymerization based on low temperature initiators (B) during varnish or during dry prepreg after, can be used as prepreg and uses.The organic solvent that is used for varnishization, the good solvent of preferred crosslinked composition (A) and styrene-butadiene block copolymer as its example, can exemplify THF, toluene, hexanaphthene etc.In ratio of components of the present invention, in the solid component concentration of 30～50wt%, can obtain≤the varnish viscosity of 500cP.
The time of drying of prepreg, consider preferred about 10～30 minutes short period of time from the viewpoint of operability, so drying temperature be preferably based on low temperature initiators (B) first exothermic peak temperature ± 10 ℃ scope.Promptly produce the free radical based on low temperature initiators (B) thus, the short period of time is carried out crosslinking reaction.In addition, consider that from the viewpoint that prevents the free radical inactivation dry atmosphere is preferably carried out at nitrogen atmosphere or under stream of nitrogen gas.When the air drying prepreg, preferably when modulation varnish, under stream of nitrogen gas, finish crosslinking reaction based on low temperature initiators (B), carry out prepregization then.Thus, the unnecessary oxidation of prepreg cured article can be prevented, the deterioration of the dielectric characteristics of veneer sheet, multilayer printed board can be prevented.
Polybutadiene composition of the present invention, impregnation in the fabric of various organic or inorganic materials or non-woven fabrics, drying form prepreg and use.Particularly when fabric that uses inorganic materials or non-woven fabrics and the situation of above-mentioned mineral filler same, preferably adopt the coupling processing agent fabric or nonwoven surface are carried out modification and to use.As the fabric or the non-woven fabrics of inorganic materials, can exemplify woven fiber glass or glass non-woven fabrics.
By the conductor foil of prepreg of the present invention and electrolytic copper foil, rolled copper foil etc. is overlapping, heating and pressurizing processing, can make the veneer sheet that has conductor layer from the teeth outwards.In prepreg of the present invention, by crosslinking reaction from low temperature initiators (B), make 1,2-polyhutadiene polymer quantizes, therefore by prepreg of the present invention being used for the manufacturing of veneer sheet, but isolating generation of inhibitory phase and pressurization add 1 of man-hour thus, 2-polyhutadiene oozing out outside system.In addition, when the making of prepreg, use to adopt the coupling processing agent carry out surface treatment mineral filler (F) and/or when fabric or non-woven fabrics, 1, form the covalent linkage of appropriateness between 2-polyhutadiene and inorganic filler surface and/or fabric or the nonwoven surface, therefore generation and the pressurization that is separated adds 1 of man-hour, and the inhibition effect of oozing out of 2-polyhutadiene outside system can be further improved.
Heating and pressurizing adds the temperature condition in man-hour, so long as the condition that can solidify the polyhutadiene in the prepreg by the heat polymerization based on high-temperature initiator (C) just is not subjected to special qualification.As such condition, can exemplify for example 170～230 ℃ temperature condition.Heating and pressurizing adds the pressure condition in man-hour, so long as can make prepreg and the conductor foil agglutinating condition of having solidified, just is not subjected to special qualification.As such condition, can exemplify for example pressure condition of 1～5MPa.
Preferable shape as the conductor foil that is used for veneer sheet of the present invention, consider from the viewpoint of the working accuracy of etching etc., about preferred 9～36 μ m of the thickness of conductor foil, consider and preferred 1～3 μ m of surfaceness of the adhesive surface of the resin layer of prepreg from the viewpoint that reduces conductor losses, radiation loss.Use the little conductor foil of surfaceness,, can not use the transmission characteristics variation of excellence of multilayer printed-wiring board of the resin of low-dielectric loss angle tangent because conductor losses, radiation loss diminishes and reduced the loss of electrical signal, therefore preferred.In the present invention and the situation of above-mentioned mineral filler same, adopt the coupling processing agent that surface modification is carried out on the surface of the little conductor foil of surfaceness, can improve the cohesive force of the resin layer and the conductor foil of prepreg.By increase the little conductor layer of surfaceness cohesiveness, can prevent such problem of peeling off, break of the conductor layer in the manufacturing process of the such multilayer printed-wiring board of etching and processing described later, multiple stratification.
To prepreg of the present invention, used the making example of the multilayer printed-wiring board of veneer sheet to describe.To the processing of connecting up of the conductor layer of veneer sheet of the present invention, the veneer sheet of folder after above-mentioned prepreg is to a plurality of wirings processing carries out lamination, the multiple stratification by heating and pressurizing processing by common etching method.Then, the forming of the interlayer wiring that produces through produce the forming and adopting plating or conductive paste of through hole or blind hole (blind via hole) by boring processing or laser processing, thereby making multilayer printed-wiring board.
Embodiment
Embodiment is shown following table and comparative example specifically describes the present invention, but the present invention is not limited by it.
(1) material
Crosslinked composition (A):
The crosslinked composition of comparative example:
Low temperature initiators (B):
Benzoyl peroxide (be called for short: BPO), ア Le De リ Star チ ケ ミ カ Le カ Application パ 21 systems, purity
75wt%, 1 minute half life temperature
130 ℃
High-temperature initiator (C):
2,5-dimethyl-2,5-two (t-butyl peroxy) hexin-3 (being called for short 25B), NOF Corp's system, 1 minute half life temperature
196 ℃, purity 〉=90%
Styrene-butadiene block copolymer (D):
The hydrogenation styrene-butadiene block copolymer: the system H1031 of the ケ ミ カ of Asahi Chemical Industry Le ズ Co., Ltd., the vinylbenzene containing ratio is 30wt%
The hydrogenation styrene-butadiene block copolymer: the system H1051 of the ケ ミ カ of Asahi Chemical Industry Le ズ Co., Ltd., the vinylbenzene containing ratio is 42wt%
Fire retardant (E):
1, two (penta-bromophenyl) ethane of 2-(fire retardant of formula (2) expression), ア Le ベ マ one Le Amada Co., Ltd. system, SAYTEX8010, median size 1.5 μ m
Mineral filler (F):
Cilicon oxide filler, the ア of Co., Ltd. De マ テ Star Network ス make SO25R, median size 0.5 μ m
The coupling processing agent:
The 3-methacryloxypropyl trimethoxy silane, the system KBM503 of Shin-Etsu Chemial Co., Ltd
Conductor foil:
The Copper Foil of coupling processing, Co., Ltd.'s day ore deposit マ テ リ ア Le ズ system, thickness 18 μ m, the surfaceness of uneven surface (Rz) is 2 μ m
Woven fiber glass:
The NE woven fiber glass, eastern textile industry of day Co., Ltd. system, thickness is about 100 μ m
(2) coupling processing of filler
In the methanol solution of KBM503, add cilicon oxide filler, stirred 8 hours with ball mill.The filtering separation filler is following dry 4 hours at 120 ℃ then.Containing ratio with respect to the coupling processing agent of mineral filler is 0.8wt%.
(3) coupling processing of woven fiber glass
Woven fiber glass is dipped in the methanol solution of KBM503, left standstill 8 hours.Take out woven fiber glass then, implemented surface treatment down in dry 4 hours at 120 ℃.Containing ratio with respect to the coupling processing agent of woven fiber glass is 0.2wt%.
(4) modulation of varnish
By ball mill crosslinked composition (A), low temperature initiators (B), high-temperature initiator (C), styrene-butadiene block copolymer (D), fire retardant (E), the mineral filler (F) of predetermined amount are dissolved, are scattered in the toluene, make the varnish of polybutadiene composition thus.
(5) making method of cured article (resin board)
Above-mentioned varnish is coated on the PET film, under stream of nitrogen gas, after 140 ℃/30 minutes dryings, it is peeled off, be filled in the dividing plate that thickness made of iron is 1.5mm, pressurize, heat, obtain cured article by vacuum pressed.Condition of cure heats up with certain speed (6 ℃/minute) for to begin to be pressurized to 2MPa from room temperature, keeps 60 minutes down at 230 ℃.
(6) making method of prepreg
Impregnated glass-fiber cloth in above-mentioned varnish promotes with certain speed, and heated in following 140 ℃/10 minutes at room temperature about 1 hour, stream of nitrogen gas, drying.Containing ratio with respect to the resin combination of the weight of prepreg is 50～55wt%.
(7) making method of veneer sheet
The prepreg of making as mentioned above is cut into the size of 100 * 100mm, and 6 of overlapping this prepregs are clamped between the Copper Foil of 2 200 * 200mm.Under vacuum, forming pressure is that 2MPa, heat-up rate are 6 ℃/minute then, and keeping temperature is 230 ℃, and the hold-time is to carry out forming process under 60 minutes the condition to make veneer sheet.
(8) evaluation of plasticity
Copper Foil to the veneer sheet made as mentioned above carries out etching, observe crosslinked composition (A) be separated have or not, ooze out have or not.In addition, as the index of the flowability of all resins composition, obtain turnover rate by following formula.Not being separated, oozing out, turnover rate is that 3～30% sample is good as plasticity.
Turnover rate (%)=(size of veneer sheet (the length m m of a slice)-100mm)/100mm * 100
(9) mensuration of relative permittivity, tangent of the dielectric loss angle
By cavity method (8722ES type network analyzer, ア ジ レ Application ト テ Network ノ ロ ジ one system; Rhumbatron, Northeast electronic application exploitation system), the numerical value of mensuration 10GHz.Sample is 1.8 * 80mm, and thickness is adjusted into, and veneer sheet is about 0.5mm, and resin board is 1.5mm.
(10) mensuration of Copper Foil stripping strength
With the Copper Foil (wide 5mm) on 50mm/ minute the speed peel ply pressing plate, measure peel adhesion strength with 90 ° directions.
(11) mensuration of second-order transition temperature (Tg)
Tg is to use ア イ テ イ one instrumentation system DVA-200 type made by the emperor order determination of viscoelasticity device (DMA) and obtains.Sample uses the veneer sheet of having removed the 2mm * 30mm * 0.5mm of Copper Foil by etching.Length of support is from being 20mm.Heat-up rate is 5 ℃/minute.
(12) solvent resistance
The Copper Foil of the veneer sheet before made is carried out etching, and the size that is cut into 20 * 20mm is as sample.This sample at room temperature be impregnated in the toluene 20 hours, estimate having or not of swelling.
(13) anti-scolding tin is hot
The sample that (12) are made impregnated in 260 ℃ the solder bath 20 seconds, estimates having or not of expanding and take place.
(14) mensuration of varnish viscosity
Varnish viscosity is used E type viscometer, at sample 1ml, to measure temperature be to observe under 23 ℃ the condition.
(comparative example 1,2)
The relation of the molecular weight of crosslinked composition and varnish viscosity is shown in table 1.Being cross-linked into of comparative example 1 is divided into high-molecular weight 1, and the 2-polyhutadiene demonstrates the high viscosity of 470cP in thin 11wt% toluene solution.In addition, if varnish concentration is increased to 21wt%, polyhutadiene does not dissolve, and can not get varnish.
(embodiment 1,2)
The relation of the molecular weight of crosslinked composition and varnish viscosity is shown in table 1.Because it is low-molecular-weight 1 that the crosslinked composition of embodiment 1 uses, 2-polyhutadiene (B3000) even be 52wt% therefore, also observes the low viscosity of 18cP, can confirm the low-molecular-weight good varnish of branch formation operation that is cross-linked into.
[table 1]
Varnish viscosity
| |
|
Comparative example 1 | Comparative example 2 | |
| B3000 | 100 | 100 | ||
| RB830 | 100 | 100 | ||
| Low temperature initiators (B) | 4 | 4 | 4 | 4 |
| High-temperature initiator (C) | 5 | 5 | 5 | 5 |
| |
|
Comparative example 1 | Comparative example 2 | |
| Toluene | 900 | 100 | 900 | 400 |
| Concentration wt% | 11 | 52 | 11 | 21 |
| |
5 | 18 | 470 | Insoluble |
(comparative example 3)
Mainly studied the relation of the addition of plasticity and low temperature initiators (B).The results are shown in table 2.The addition of low temperature initiators (B) is the comparative example 3 of 1 weight part, is separated when the making layer pressing plate, observes oozing out as the B3000 of crosslinked composition.In addition, the seepage discharge of B3000 is very big, does not observe turnover rate.In addition, because the influence of oozing out of crosslinked composition, second-order transition temperature, solvent resistance are low.
(embodiment 3,4)
(comparative example 4)
Comparative example 4 contains the low temperature initiators (B) of 15 weight parts.Though by increasing the amount of low temperature initiators (B), prevent as being separated, oozing out of the B3000 of crosslinked composition, but turnover rate is 0%, formability reduces.
[table 2]
The addition of low temperature initiators composition (B)
| Comparative example 3 | |
Embodiment 4 | Comparative example 4 | |||
| The A composition | B3000 | 100 | 100 | 100 | 100 | |
| The | BPO | 1 | 4 | 10 | 15 | |
| The C composition | 25B | 7 | 7 | 7 | 7 | |
| The D composition | H1031 | 43 | 43 | 43 | 43 | |
| The | H1051 | 0 | 0 | 0 | 0 | |
| The E composition | SAYTEX8010 | 50 | 50 | 50 | 50 | |
| The F composition | SO25R | 90 | 90 | 90 | 90 | |
| What be separated has or not | Have | Do not have | Do not have | Do not have | ||
| B3000 ooze out have or not | Have | Do not have | Do not have | Do not have | ||
| Comparative example 3 | |
Embodiment 4 | Comparative example 4 | ||
| The turnover rate % of resin combination | - | 20 | 5 | 0 | |
| The plasticity comprehensive evaluation of prepreg | × | ○ | ○ | × | |
| The abhesiveness of prepreg | Do not have | Have | Have | Have | |
| The ε ' of resin board | 10GHz | 2.5 | 2.5 | 2.5 | 2.5 |
| The tan δ of resin board | 10GHz | 0.0015 | 0.0015 | 0.0016 | 0.0016 |
| The ε ' of veneer sheet | 10GHz | 3.4 | 3.3 | 3.2 | 3.2 |
| The tan δ of veneer sheet | 10GHz | 0.0025 | 0.0024 | 0.0024 | 0.0025 |
| Second-order transition temperature | ℃ | 50 | Do not have | Do not have | Do not have |
| Solvent resistance | × | ○ | ○ | ○ | |
| 260 ℃ anti-scolding tin is hot | ○ | ○ | ○ | ○ | |
(embodiment 5)
The vinylbenzene containing ratio of styrene-butadiene block copolymer (D) composition and the relation of second-order transition temperature are shown in table 3.Embodiment 3 contains the H1031 that the vinylbenzene containing ratio is 30wt%, does not observe second-order transition temperature.In containing the embodiment 5 of H1051 that the vinylbenzene containing ratio is 42wt%, observe second-order transition temperature at 100 ℃.
[table 3]
The vinylbenzene containing ratio of styrene butadiene block polymer
| |
|
|||
| The A composition | B3000 | 100 | 100 | |
| The B composition | BPO | 4 | 4 | |
| The C composition | 25B | 7 | 7 | |
| The D composition | H1031 | 43 | 0 | |
| The | H1051 | 0 | 43 | |
| The E composition | SAYTEX8010 | 50 | 50 | |
| The F composition | SO25R | 90 | 90 | |
| |
|
||
| What be separated has or not | Do not have | Do not have | |
| B3000 ooze out have or not | Do not have | Do not have | |
| The turnover rate % of resin combination | 20 | 10 | |
| The plasticity comprehensive evaluation of prepreg | ○ | ○ | |
| The abhesiveness of prepreg | Have | Have | |
| The ε ' of resin board | 10GHz | 2.5 | 2.5 |
| The tan δ of resin board | 10GHz | 0.0015 | 0.0015 |
| The ε ' of veneer sheet | 10GHz | 3.3 | 3.3 |
| The tan δ of veneer sheet | 10GHz | 0.0024 | 0.0024 |
| Second-order transition temperature | ℃ | Do not have | 100 |
| Solvent resistance | ○ | ○ | |
| 260 ℃ anti-scolding tin is hot | ○ | ○ | |
(comparative example 5)
Content to high-temperature initiator (C) composition is studied.The results are shown in table 4.The content of the high-temperature initiator of comparative example 5 (C) composition is 3 weight parts.Though plasticity, dielectric characteristics, stripping strength excellence, solvent resistance is low.
(embodiment 6,7)
Embodiment 6,7 contains high-temperature initiator (C) composition of 5 weight parts, 15 weight parts respectively.Plasticity, dielectric characteristics, solvent resistance are all excellent.Though stripping strength has the relation that reduces along with the increase of the amount of high-temperature initiator (C) composition, observes good numerical value in the scope of this research.
[table 4]
The addition of high-temperature initiator (C) composition
| Comparative example 5 | Embodiment 6 | |
Embodiment 7 | ||
| The A composition | B3000 | 100 | 100 | 100 | 100 |
| The B composition | BPO | 4 | 4 | 4 | 4 |
| Comparative example 5 | Embodiment 6 | |
Embodiment 7 | |||
| The | 25B | 3 | 5 | 7 | 15 | |
| The D composition | H1031 | 43 | 43 | 43 | 43 | |
| The E composition | SAYTEX8010 | 50 | 50 | 50 | 50 | |
| The F composition | SO25R | 90 | 90 | 90 | 90 | |
| What be separated has or not | Do not have | Do not have | Do not have | Do not have | ||
| B3000 ooze out have or not | Do not have | Do not have | Do not have | Do not have | ||
| The turnover rate % of resin combination | 20 | 20 | 20 | 20 | ||
| The plasticity comprehensive evaluation of prepreg | ○ | ○ | ○ | ○ | ||
| The abhesiveness of prepreg | Have | Have | Have | Have | ||
| The ε ' of resin board | 10GHz | 2.5 | 2.5 | 2.5 | 2.6 | |
| The tan δ of resin board | 10GHz | 0.0015 | 0.0015 | 0.0015 | 0.0016 | |
| The ε ' of veneer sheet | 10GHz | 3.3 | 3.3 | 3.3 | 3.3 | |
| The tan δ of veneer sheet | 10GHz | 0.0025 | 0.0024 | 0.0024 | 0.0024 | |
| Second-order transition temperature | ℃ | 50 | 150 | Do not have | Do not have | |
| Solvent resistance | × | ○ | ○ | ○ | ||
| 260 ℃ anti-scolding tin is hot | ○ | ○ | ○ | ○ | ||
| Stripping strength | kN/m | 0.9 | 0.8 | 0.7 | 0.6 | |
(embodiment 8)
Use double-sided copper-clad veneer sheet and the prepreg multilayer printed board of making as described below of embodiment 6.
(A) laminated photoresist material (Hitachi changes into system HS425) on the single face of double-sided copper-clad veneer sheet, blanket exposure.Laminated photoresist material (Hitachi changes into system HS425) on remaining copper surface exposes to test pattern then, and the sodium carbonate solution with 1% develops to the photoresist material of unexposed portion.
(B) remove the Copper Foil that exposes with the etching solution etching of sulfuric acid 5%, hydrogen peroxide 5%, on the single face of double-sided copper-clad veneer sheet, form conductor wiring.
(C) remove remaining photoresist material with 3% sodium hydroxide solution, obtain having on the single face circuit board of wiring.Make 2 circuit boards in the same way.
(D) face with the wiring side of 2 circuit boards lumps together, and inserts prepreg in the centre.Under the vacuum, carry out heating and pressurizing and multiple stratification.Heating condition is 230 ℃/60 minutes, and moulding pressure is 2MPa.
(E) laminated photoresist material (Hitachi changes into system HS425) on the multiple-plate two-sided outer packaging copper of making is to the test pattern exposure, with the photoresist developing of 1% sodium carbonate solution to unexposed portion.
(F) remove the Copper Foil that exposes with the etching solution etching of sulfuric acid 5%, hydrogen peroxide 5%, remove remaining photoresist material and form the outer packaging wiring with 3% sodium hydroxide solution.
(G) form the through hole that connects internal layer wiring and outer packaging wiring by boring processing.
(H) circuit board is dipped in the colloidal solution of plating catalyzer, gives in the through hole, substrate surface is with catalyzer.
(I) after the activation treatment of plating catalyzer,, the seed crystal film of about 1 μ m is set by electroless plating (Hitachi changes into system CUST2000).
(J) laminated photoresist material (Hitachi changes into system HN920) on circuit board two-sided.
(K) mask is carried out in the end of through-hole section and circuit board and after exposing, the yellow soda ash with 3% develops and aperture portion is set.
(L) in the end of circuit board electrode is set, on throughhole portions, forms the copper facing of about 18 μ m by electrolytic coating.
(M) the electrode part is removed in cut-out, removes remaining photoresist material with 5% aqueous sodium hydroxide solution.
(N) circuit board is dipped in the etching solution of sulfuric acid 5%, hydrogen peroxide 5%, the about 1 μ m of etching removes the seed crystal film and makes multiwiring board.Peeling off of the broken string of the wiring when this multiwiring board does not produce multiple stratification, wiring.In addition, relative permittivity, the tangent of the dielectric loss angle of the insulating material of this multilager base plate are low, and the circuit that therefore is suitable for the high frequency machine forms.
Claims (11)
1. polybutadiene composition, it is characterized in that, the number-average molecular weight that contains the repeating unit with following formula (1) expression is that 1000～20000 crosslinked composition is a lower molecular weight 1,2-polyhutadiene (A), be 80～140 ℃ radical polymerization initiator (B) and be 170～230 ℃ radical polymerization initiator (C) at 1 minute half life temperature at 1 minute half life temperature, with (A) composition as 100 weight parts, (B) composition that contains 3～10 weight parts, (C) composition that contains 5～15 weight parts
2. the described polybutadiene composition of claim 1 is characterized in that, is present in 80～140 ℃ based on first exothermic peak of thermopolymerization, and second exothermic peak is present in 170～230 ℃.
3. the described polybutadiene composition of claim 1 is characterized in that, (C) composition is 2,5-dimethyl-2, two (t-butyl peroxy) hexins-3 of 5-.
4. the described polybutadiene composition of claim 1 is characterized in that, also contains styrene-butadiene block copolymer or its hydrogenation thing (D), fire retardant (E) and mineral filler (F).
5. the described polybutadiene composition of claim 4, it is characterized in that, (A) containing ratio of the repeating unit of the formula in the composition (1) is more than the 90wt%, (D) containing ratio of the vinylbenzene residue in the composition is 10～30wt%, (E) composition is the compound of formula (2) or formula (3) expression, (F) composition is to adopt to have implemented the surface-treated cilicon oxide filler with the coupling processing agent of vinyl reaction
6. the described polybutadiene composition of claim 4 is characterized in that, as 100 weight parts, contains (D) composition of 15～100 weight parts, (E) composition of 50～100 weight parts, (F) composition of 80～200 weight parts with (A) composition.
7. polybutadiene composition, it is in the described polybutadiene composition of claim 1, makes the heat polymerization based on (B) composition finish to obtain.
8. the manufacture method of prepreg, it is characterized in that, the described polybutadiene composition of impregnation claim 1 in the fabric of organic or inorganic materials or non-woven fabrics carries out heat drying then under with respect to the temperature based on-10 ℃ to+10 ℃ scope of first exothermic peak temperature of the thermopolymerization of polybutadiene composition.
9. prepreg, it is the described polybutadiene composition of impregnation claim 1 in the fabric of organic or inorganic materials or non-woven fabrics, carries out heat drying under with respect to the temperature based on-10 ℃ to+10 ℃ scope of first exothermic peak temperature of the thermopolymerization of polybutadiene composition then and obtains.
10. veneer sheet, it is that described prepreg of claim 9 and conductor foil is overlapping, by pressurization and heating prepreg is solidified then, simultaneously adhering and solidifying prepreg and conductor foil make.
11. multilayer printed board, it is that folder is every the described prepreg of claim 9, a plurality of printed base plates that obtain being disposed at enforcement wiring processing on the lip-deep conductor foil of the described veneer sheet of claim 10 are carried out laminate adhesive, form interlayer wiring manufacturing then.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006275430A JP5176126B2 (en) | 2006-10-06 | 2006-10-06 | Polybutadiene resin composition with suppressed phase separation and printed circuit board using the same |
| JP2006-275430 | 2006-10-06 | ||
| JP2006275430 | 2006-10-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101157788A CN101157788A (en) | 2008-04-09 |
| CN101157788B true CN101157788B (en) | 2010-11-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101620209A Expired - Fee Related CN101157788B (en) | 2006-10-06 | 2007-09-29 | Phase-separation-controlled polybutadiene resin composition and printed wiring board using the resin composition |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8097545B2 (en) |
| JP (1) | JP5176126B2 (en) |
| KR (1) | KR100894712B1 (en) |
| CN (1) | CN101157788B (en) |
| TW (1) | TW200837135A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111867239A (en) * | 2019-04-24 | 2020-10-30 | 广东生益科技股份有限公司 | Copper-clad laminate and printed circuit board |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5181221B2 (en) | 2008-01-15 | 2013-04-10 | 日立化成株式会社 | Low thermal expansion low dielectric loss prepreg and its application |
| JP4613977B2 (en) | 2008-04-28 | 2011-01-19 | 日立化成工業株式会社 | Prepreg including thin-layer quartz glass cloth and wiring board using the same |
| KR101344790B1 (en) | 2010-06-10 | 2013-12-24 | 제일모직주식회사 | Blue color resin composition for color filter and color filter using same |
| KR101613388B1 (en) * | 2012-03-30 | 2016-04-18 | 히타치가세이가부시끼가이샤 | Multilayer wiring board |
| WO2017002227A1 (en) * | 2015-07-01 | 2017-01-05 | 株式会社日本製鋼所 | Peroxide reaction method and apparatus that use extruder |
| KR102021144B1 (en) * | 2016-11-24 | 2019-09-11 | 주식회사 아모그린텍 | Method for manufacturing circuit board and circuit board manufactured by the method |
| WO2021024680A1 (en) * | 2019-08-06 | 2021-02-11 | 日本曹達株式会社 | Resin composition for metal-clad laminates, prepreg, and metal-clad laminate |
| WO2021153455A1 (en) * | 2020-01-29 | 2021-08-05 | 日本曹達株式会社 | Thermosetting composition containing styrene-butadiene-styrene block polymer, and method for curing same |
| CN112592554B (en) * | 2020-12-15 | 2022-11-29 | 广东生益科技股份有限公司 | Circuit material and printed circuit board |
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| FR2439219A1 (en) * | 1978-10-16 | 1980-05-16 | Inst Francais Du Petrole | IMPROVED SYNTACTIC FOAM COMPOSITIONS FOR USE IN THE MANUFACTURE OF FLOATING OBJECTS |
| JPS57177025A (en) * | 1981-04-24 | 1982-10-30 | Hitachi Ltd | Mica prepreg |
| JPS5821925A (en) | 1981-07-31 | 1983-02-09 | Sharp Corp | Alternating current switch circuit |
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| KR970006388A (en) * | 1995-07-19 | 1997-02-19 | 조규향 | Thermoplastic Elastomer Compositions and Methods for Making the Same |
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- 2007-09-29 CN CN2007101620209A patent/CN101157788B/en not_active Expired - Fee Related
- 2007-10-02 TW TW96136944A patent/TW200837135A/en not_active IP Right Cessation
- 2007-10-04 US US11/867,091 patent/US8097545B2/en not_active Expired - Fee Related
- 2007-10-04 KR KR1020070099686A patent/KR100894712B1/en active IP Right Grant
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| CN87100741A (en) * | 1986-02-19 | 1987-12-16 | 株式会社日立制作所 | Thermosetting resin and use the prepreg and the laminated material of this resins |
| CN1478824A (en) * | 2002-08-26 | 2004-03-03 | 株式会社日立制作所 | Electronic element for high frequency using low-dielectric loss angle tangent insulating material |
| CN1478831A (en) * | 2002-08-26 | 2004-03-03 | 株式会社日立制作所 | Low dielectric loss tangent film and distributing film |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111867239A (en) * | 2019-04-24 | 2020-10-30 | 广东生益科技股份有限公司 | Copper-clad laminate and printed circuit board |
| CN111867239B (en) * | 2019-04-24 | 2021-08-27 | 广东生益科技股份有限公司 | Copper-clad laminate and printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| US20080090478A1 (en) | 2008-04-17 |
| KR100894712B1 (en) | 2009-04-24 |
| TWI356077B (en) | 2012-01-11 |
| CN101157788A (en) | 2008-04-09 |
| TW200837135A (en) | 2008-09-16 |
| KR20080031793A (en) | 2008-04-11 |
| JP2008094889A (en) | 2008-04-24 |
| US8097545B2 (en) | 2012-01-17 |
| JP5176126B2 (en) | 2013-04-03 |
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