CN101150084B - Correction auxiliary tools - Google Patents
Correction auxiliary tools Download PDFInfo
- Publication number
- CN101150084B CN101150084B CN2007100481209A CN200710048120A CN101150084B CN 101150084 B CN101150084 B CN 101150084B CN 2007100481209 A CN2007100481209 A CN 2007100481209A CN 200710048120 A CN200710048120 A CN 200710048120A CN 101150084 B CN101150084 B CN 101150084B
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- Prior art keywords
- mechanical arm
- auxiliary tools
- correction auxiliary
- wafer
- thickness
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- 238000000034 method Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 4
- 230000000007 visual effect Effects 0.000 description 4
- 230000001915 proofreading effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000013467 fragmentation Methods 0.000 description 2
- 238000006062 fragmentation reaction Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- WYEMLYFITZORAB-UHFFFAOYSA-N boscalid Chemical compound C1=CC(Cl)=CC=C1C1=CC=CC=C1NC(=O)C1=CC=CN=C1Cl WYEMLYFITZORAB-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
This invention provides an assistant tool for correcting a position of a mechanical arm coresponding to a wafer in a loading stand, which is a hollow cuboid with the thickness greater than that of the mechanical arm, when correcting, the assistant tool is jacketed on the arm and is composed of two parts at the same structure and is installed at the front and back ends of the arm.
Description
Technical field
The present invention relates to the means for correcting of semiconductor applications, specifically, relate to the correction auxiliary tools of a kind of correction mechanical arm (Robot blade) and the interior wafer relative position of plummer (Cassette).
Background technology
In semiconductor fabrication factory, deposit wafer by plummer, generally can vertically place 25 wafer.Wafer is taken out and is deposited by mechanical arm, fragmentation takes place when taking out and deposit wafer in process of production, need proofread and correct the position of the relative wafer of mechanical arm before actual production.See also Fig. 1; the semiconductor of using Endura and Centura is made board in proofreading and correct mechanical arm 1 ' relative plummer 2 ' when wafer 3 ', 4 ' position; generally all be that mechanical arm is reached between two wafer, and judge that with visual method mechanical arm position in the process that moves forward and backward is whether suitable and must guarantee that mechanical arm can not be too near to wafer.But mechanical arm and up and down the distance of two wafer approximately have only 1.5mm, and wafer has reflection action and mechanical arm often to have a bit, whether therefore adopt visual method to be difficult to judge the position of mechanical arm in advancing suitable.Adopting visual method that mechanical arm often takes place presses close to wafer very much and thinks suitable position by mistake, the bad discovery immediately of often proofreading and correct, thereby cause board mechanical arm when actual production to take out or fragmentation takes place when putting into wafer, cause board to work as machine and damage of components when serious.
Summary of the invention
In view of this, the technical problem of the present invention's solution is to provide a kind of correction auxiliary tools to avoid mechanical arm damage to wafer in traveling process.
For solving the problems of the technologies described above, the invention provides a kind of correction auxiliary tools, be used to proofread and correct the position of wafer in the relative plummer of mechanical arm.It is rectangular-shaped that this correction auxiliary tools is hollow out, and its thickness is greater than the thickness of mechanical arm; Timing, this correction auxiliary tools is socketed on the mechanical arm.Further, this correction auxiliary tools is made up of the identical two parts of structure, is installed on the front-end and back-end of mechanical arm respectively.
Compared with prior art, correction auxiliary tools thickness provided by the invention is greater than the thickness of mechanical arm, as long as the timing correction auxiliary tools is not run into wafer, so when the board ordinary production, there is certain safe distance between mechanical arm and the wafer, played the beneficial effect that improves calibration accuracy.
Description of drawings
The part-structure schematic diagram of Fig. 1 plummer when adopting visual bearing calibration.
Fig. 2 is the front view of correction auxiliary tools of the present invention.
Fig. 3 is installed on end view on the mechanical arm for correction auxiliary tools of the present invention.
The part-structure schematic diagram of Fig. 4 plummer when adopting correction auxiliary tools of the present invention.
Embodiment
Be described below in conjunction with the preferred embodiment of accompanying drawing, in the hope of purpose, specific structural features and the advantage of further understanding its invention correction auxiliary tools of the present invention.
See also Fig. 2 to Fig. 4, the invention provides a kind of correction auxiliary tools 5, be used for the position of wafer in semiconductor is made the relative plummer of the positive mechanical arm of board colonel.In this example, the thickness of mechanical arm 1 is 3mm.Described correction auxiliary tools 5 is made up of two identical subassemblies 51,52 of structure, each subassembly 51,52 is the thickness of the rectangular-shaped and integral thickness H1 of hollow out greater than mechanical arm 1, H1 can be set to 4.5mm, and the thickness H2 of hollow hole just can pass mechanical arm 1, and H2 is set to 3mm.
Timing, two correction auxiliary tools 51,52 are enclosed within front end 11 and rear end 12 (direction of taking out and put into wafer is defined as fore-and-aft direction) of mechanical arm 1 respectively.Because the integral thickness H2 of each subassembly 51,52 is than the big 1.5mm of mechanical arm, thereby make the nearly 0.75mm of distance of wafer 3,4 in its upper and lower surface and the plummer 2.Because the motion path of mechanical arm 1 is a rectilinear motion, no matter whether mechanical arm 1 has inclination, as long as each subassembly 51,52 is not run into wafer 3,4 in the traveling process of front and back, mechanical arm 1 and between the wafer 3,4 safe distance of 0.75mm is arranged at least respectively up and down when the board ordinary production then, and do not worry mechanical arm to press close to wafer very much and do not know.Adopt correction auxiliary tools provided by the invention to proofread and correct, improved the accuracy of proofreading and correct.
Foregoing description; only being the specific descriptions to preferred embodiment of the present invention, is not to any qualification of the present invention, for the person of ordinary skill of the art; can carry out simple modification, interpolation, conversion according to above-mentioned disclosure, and all belong to the content of protecting in claims.
Claims (2)
1. correction auxiliary tools, be used to proofread and correct the position of wafer in the relative plummer of mechanical arm, it is characterized in that, it is rectangular-shaped that this correction auxiliary tools is hollow out, the thickness of described correction auxiliary tools is than the big 1.5mm of thickness of mechanical arm, timing, this correction auxiliary tools is socketed on the mechanical arm.
2. correction auxiliary tools as claimed in claim 1 is characterized in that: described correction auxiliary tools is made up of the identical two parts of structure, and timing is installed on the front-end and back-end of mechanical arm respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100481209A CN101150084B (en) | 2007-11-13 | 2007-11-13 | Correction auxiliary tools |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100481209A CN101150084B (en) | 2007-11-13 | 2007-11-13 | Correction auxiliary tools |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101150084A CN101150084A (en) | 2008-03-26 |
| CN101150084B true CN101150084B (en) | 2011-06-15 |
Family
ID=39250523
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007100481209A Active CN101150084B (en) | 2007-11-13 | 2007-11-13 | Correction auxiliary tools |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101150084B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117438356B (en) * | 2023-12-21 | 2024-04-19 | 浙江果纳半导体技术有限公司 | Self-adaptive wafer transmission method, storable medium and wafer transmission equipment |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2726109Y (en) * | 2003-11-04 | 2005-09-14 | 台湾积体电路制造股份有限公司 | Calibration wafer and calibration apparatus |
| CN1800065A (en) * | 2005-12-02 | 2006-07-12 | 友达光电股份有限公司 | Substrate-correcting means |
-
2007
- 2007-11-13 CN CN2007100481209A patent/CN101150084B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2726109Y (en) * | 2003-11-04 | 2005-09-14 | 台湾积体电路制造股份有限公司 | Calibration wafer and calibration apparatus |
| CN1800065A (en) * | 2005-12-02 | 2006-07-12 | 友达光电股份有限公司 | Substrate-correcting means |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101150084A (en) | 2008-03-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SHANGHAI MUNICIPAL ELECTRIC POWER COMPANY SHANGHAI Effective date: 20121128 Owner name: STATE GRID CORPORATION OF CHINA Free format text: FORMER OWNER: HONGLI SEMICONDUCTOR MANUFACTURE CO LTD, SHANGHAI Effective date: 20121128 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| C53 | Correction of patent for invention or patent application | ||
| CB03 | Change of inventor or designer information |
Inventor after: Sheng Fangzheng Inventor after: Zhang Zuan Inventor after: Wang Wenbin Inventor after: Wang Zhengming Inventor before: Wang Zhengming |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: WANG ZHENGMING TO: SHENG FANGZHENG ZHANG ZUAN WANG WENBIN WANG ZHENGMING Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100031 XICHENG, BEIJING |
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| TR01 | Transfer of patent right |
Effective date of registration: 20121128 Address after: 100031 Xicheng District West Chang'an Avenue, No. 86, Beijing Patentee after: State Grid Corporation of China Patentee after: Shanghai Electric Power Corporation Patentee after: Shanghai Judongjiaoneng Electric and Electronic Co., Ltd. Address before: 201203 Shanghai Zhangjiang hi tech park GuoShouJing Road No. 818 Patentee before: Hongli Semiconductor Manufacture Co., Ltd., Shanghai |