CN101137280A - High-power element heat radiator manufacturing method - Google Patents

High-power element heat radiator manufacturing method Download PDF

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Publication number
CN101137280A
CN101137280A CNA2007100353770A CN200710035377A CN101137280A CN 101137280 A CN101137280 A CN 101137280A CN A2007100353770 A CNA2007100353770 A CN A2007100353770A CN 200710035377 A CN200710035377 A CN 200710035377A CN 101137280 A CN101137280 A CN 101137280A
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Prior art keywords
radiator
substrate
groove
base plate
bonding
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CNA2007100353770A
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CN101137280B (en
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杨宏盛
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CRRC Zhuzhou Institute Co Ltd
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ZHUZHOU INST OF POWER LOCOMOTIVE CHINA NANCHE GROUP
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Abstract

A processing technique for radiators changes metal welding or extrusion processing which are used consecutively into a bonded processing technique. Adopting a bonding technique, a base plate and cooling parts are bonded of the radiator by strong glue with good heat conductivity. The processing technique has exact making method that: processing a groove or a hole which is matched with cooling parts on the base plate of the radiator, leaving a certain clearance, arranging the cooling parts in the groove or the hole processed on the base plate, the bonding the cooling parts and the base plate by strong glue which is in market currency. The method can be used for processing various radiators with high power thyristor elements. The invention has the advantages of reliable working, airtightness and strength, beautiful appearance. Comparing with the soft extrusion processing technique, the invention reduces thermal resistance, improves working reliability; has lower cost than that of metal welding processing technique, increases production efficiency.

Description

A kind of processing and fabricating method of high-power components radiator
Technical field
The present invention relates to a kind of technological method for processing of mechanical part structure, refer in particular to the technological method for processing of a kind of high-power components radiator (as the radiator of high-power thyristor), mainly be useful for manufacture and the product of high-power electronic component with radiator.Also can be useful for manufacture and the product of various electronic components of high power with radiator.
Background technology
Many high-power components are in running, and often because the consumption of power can produce a large amount of heat, this heat can make the temperature of device rise, if, then can influence the performance of product because the device temperature rise is too high, even scaling loss device or cause the inefficacy of device.Too high in order to prevent that power component from heating up, often need device to be dispelled the heat with radiator.The radiator of high-power components mainly contains general radiator, heat-pipe radiator and water-filled radiator now.Heat-pipe radiator is made up of substrate, heat pipe and fin; Water-filled radiator is made up of substrate and cover plate.General radiator is made up of substrate, fin; Heat-pipe radiator is made up of substrate, heat pipe and fin; Water-filled radiator is made up of substrate and cover plate.Along with science and technology development, the power component technology content is more and more higher, uses more and more widely, and the radiator that uses that matches has with it also proposed requirements at the higher level technically.High-power components particularly, the manufacturing of radiator in the past except that Section Bar Heat Sinks all fetch processing by extruding and metal welding, and the radiating effect of extruding is not very desirable, the contact heat resistance height, and functional reliability is poor; And the cost of welding is higher, and in order to reduce production costs and guarantee the radiating effect and the functional reliability of radiator, we must seek a kind of new manufacture method and solve above problem.
Summary of the invention
The present invention aims to provide a kind of better radiator processing and fabricating method, is guaranteeing to have the reliability height under the product quality premise according to the produced radiator of this method, and cost is low, working (machining) efficiency height, good heat dissipation effect, the characteristics of the beautiful grade of outward appearance.
Purpose of the present invention is achieved by following technical proposals: a kind of radiator processing and fabricating method is characterized in that: the substrate of radiator and thermal component are with the good super glue of thermal conductivity, adopt technique for sticking to be bonded together.Concrete manufacture method is: process the groove or the hole that match with heat sink on the substrate of radiator, and leave certain clearance, heat sink is inserted in the groove or hole that processes on the substrate, again with super glue with heat sink and substrate bonding together.Described super glue is the general super glue in market.In order to strengthen the heat-conducting effect of super glue, can also increase a certain proportion of heat-conducting metal powder in super glue, to reduce contact heat resistance.The heat-conducting metal powder can be copper powder, aluminium powder, zinc powder or stainless steel powder.
The invention has the advantages that: new technology improves production efficiency of products and reduces cost when guaranteeing its radiating effect and functional reliability.Be characterized in making substrate and fin to be bonded together securely, can bear bigger outer active force, with respect to the processing technology of extruding, the reliability of work is higher; Processing technology with respect to welding has reduced cost, has improved benefit.
Description of drawings
Fig. 1 is the bonding schematic diagram of a concrete application example of the present invention;
Fig. 2 is the bonding schematic diagram of another concrete application example of the present invention;
Fig. 3 is the bonding schematic diagram of another concrete application example of the present invention;
Fig. 4 is the bonding schematic diagram of another concrete application example of the present invention.
Embodiment
Accompanying drawing has provided the bonding schematic diagram of several embodiments of the present invention, and the invention will be further described below in conjunction with drawings and Examples.
From accompanying drawing as can be seen the substrate and the thermal component of radiator be with the good super glue of thermal conductivity, adopt technique for sticking to be bonded together.Concrete manufacture method is: process the groove or the hole that match with heat sink on the substrate of radiator, and leave certain clearance, heat sink is inserted in the groove or hole that processes on the substrate, again with super glue with heat sink and substrate bonding together.Described super glue is the general super glue in market.Can be applicable to the radiator processing and fabricating of various high-power thyristor elements, the invention will be further described below in conjunction with drawings and Examples.
Embodiment one
Fig. 1 has provided the bonding way of a kind of fin and substrate.The bonding way of described fin and substrate is: groove milling on radiator base plate 1, in fin 2 insertion grooves, carry out bonding with AB epoxy resin seccotine 5.Radiator base plate 1 processes the groove 3 that matches with fin on big plane, substrate 1 and fin 2 are cleaned up, AB epoxy resin seccotine 5 is evenly coated in the groove 3, in fin 2 insertion grooves 3, it is gapped that AB epoxy resin seccotine 5 can fill up institute by self mobile, dries then or dry.
Embodiment two
Fig. 2 has provided the bonding way of a kind of heat-pipe radiator and substrate.The heat pipe of described heat-pipe radiator and the bonding way of substrate are: boring on radiator base plate 1 in heat pipe 6 patchholes, is bonded together heat pipe 6 and radiator base plate 1 with monocomponent polyurethane binding agent/fluid sealant 7.In order to reduce contact heat resistance, in monocomponent polyurethane binding agent/fluid sealant 7, be added with the heat conductive metal powder, the heat-conducting metal powder can be copper powder, aluminium powder, zinc powder or stainless steel powder, is used to reduce contact heat resistance; The method also can be used on installing of heat pipe and fin simultaneously.
Embodiment three
Fig. 3 has provided the bonding way of a kind of fin and cover plate.The bonding way of described fin and cover plate is: bonding with cyanoacrylate binding agent 8 between radiator base plate 1 and cover plate 4, make its sealing and energy bearing certain pressure.
Embodiment four
Fig. 4 has provided the bonding way of a kind of fin and substrate.Described radiator base plate 1 and cover plate 4 plane contact places, bonding with metal adhesive 9, make its sealing and energy bearing certain pressure.
By contrast, reduced thermal resistance, improved functional reliability than extrusion-processing technology; Than the reduction of metal solder cost, enhance productivity.

Claims (6)

1. the processing technology of a high-power components radiator, its characteristics are: the substrate of radiator and radiator portion are with the good super glue of thermal conductivity, adopt technique for sticking to be bonded together.
2. the processing technology of high-power components radiator as claimed in claim 1, it is characterized in that: described technique for sticking is to process groove or the hole that matches with heat sink on the substrate of radiator, and leave certain clearance, heat sink is inserted in the groove or hole that processes on the substrate, again with heat sink and substrate bonding together with super glue.
3. the processing technology of high-power components radiator as claimed in claim 1 or 2 is characterized in that: added Heat Conduction Material in the described super glue.
4. the processing technology of high-power components radiator as claimed in claim 1 or 2 is characterized in that: groove milling on radiator base plate, in the fin insertion groove, carry out bonding with AB epoxy resin seccotine; Radiator base plate processes the groove that matches with fin on big plane, substrate and fin are cleaned up, glue is evenly coated in the groove, in the fin insertion groove, glue can by self mobile fill up gapped, dry then or dry.
5. the processing technology of high-power components radiator as claimed in claim 1 or 2 is characterized in that: hole on substrate, in the heat pipe patchhole, with monocomponent polyurethane binding agent/fluid sealant heat pipe and substrate bonding are got up.
6. the processing technology of high-power components radiator as claimed in claim 1 or 2 is characterized in that:, bonding at radiator base plate with cyanoacrylate binding agent or metal adhesive with on cover plate cooperates, make its sealing and can bearing certain pressure.
CN2007100353770A 2007-07-17 2007-07-17 High-power element heat radiator manufacturing method Active CN101137280B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
CN2007100353770A CN101137280B (en) 2007-07-17 2007-07-17 High-power element heat radiator manufacturing method

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CN101137280A true CN101137280A (en) 2008-03-05
CN101137280B CN101137280B (en) 2011-07-27

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103501584A (en) * 2013-10-10 2014-01-08 昆山纯柏精密五金有限公司 Processing method of power component radiator
CN103500627A (en) * 2013-10-17 2014-01-08 深圳市大族激光科技股份有限公司 Radiator for high-voltage transformer oil tank and power module
CN103528408A (en) * 2013-10-10 2014-01-22 昆山纯柏精密五金有限公司 Platform machining method of heat radiator
CN103923594A (en) * 2014-04-25 2014-07-16 天津五星金属制品有限公司 Assembly adhesive for preparing strip nails
CN104976916A (en) * 2015-06-01 2015-10-14 昆山优环精密机械有限公司 Manufacturing technology of gluing radiator
CN105764299A (en) * 2014-12-19 2016-07-13 富葵精密组件(深圳)有限公司 Heat dissipation structure and manufacturing method thereof
CN106061102A (en) * 2016-07-06 2016-10-26 四川海英电子科技有限公司 Production process of high-heat-conductivity circuit board

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2370463Y (en) * 1999-03-25 2000-03-22 富准精密工业(深圳)有限公司 Radiator
CN2547004Y (en) * 2002-04-15 2003-04-23 奇鋐科技股份有限公司 Radiator of CPU
CN1431707A (en) * 2003-01-11 2003-07-23 昆山迪生电子有限公司 Heat dispersion modules and their mfg. methods
CN1704458A (en) * 2004-05-28 2005-12-07 台盐实业股份有限公司 Composition of heat-conductive materials and preparation method thereof

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103501584A (en) * 2013-10-10 2014-01-08 昆山纯柏精密五金有限公司 Processing method of power component radiator
CN103528408A (en) * 2013-10-10 2014-01-22 昆山纯柏精密五金有限公司 Platform machining method of heat radiator
CN103500627A (en) * 2013-10-17 2014-01-08 深圳市大族激光科技股份有限公司 Radiator for high-voltage transformer oil tank and power module
CN103923594A (en) * 2014-04-25 2014-07-16 天津五星金属制品有限公司 Assembly adhesive for preparing strip nails
CN105764299A (en) * 2014-12-19 2016-07-13 富葵精密组件(深圳)有限公司 Heat dissipation structure and manufacturing method thereof
CN105764299B (en) * 2014-12-19 2018-09-25 鹏鼎控股(深圳)股份有限公司 Radiator structure and preparation method thereof
CN104976916A (en) * 2015-06-01 2015-10-14 昆山优环精密机械有限公司 Manufacturing technology of gluing radiator
CN106061102A (en) * 2016-07-06 2016-10-26 四川海英电子科技有限公司 Production process of high-heat-conductivity circuit board
CN106061102B (en) * 2016-07-06 2018-07-31 四川海英电子科技有限公司 A kind of production technology of high heat conduction circuit board

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