CN103528408A - Platform machining method of heat radiator - Google Patents
Platform machining method of heat radiator Download PDFInfo
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- CN103528408A CN103528408A CN201310470140.0A CN201310470140A CN103528408A CN 103528408 A CN103528408 A CN 103528408A CN 201310470140 A CN201310470140 A CN 201310470140A CN 103528408 A CN103528408 A CN 103528408A
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- radiator
- heat pipe
- groove
- platform
- heat
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Abstract
The invention discloses a platform machining method of a heat radiator. The platform machining method of the heat radiator comprises the following steps that solder paste which is not heated and melted is placed in a concave groove of the heat radiator; the heated end of a heat conduction pipe is arranged in the concave groove of the heat radiator; a heat conduction piece is arranged on an embedding groove of the heat radiator; a platform is heated continuously, the solder paste is heated and softened, the heat conduction pipe makes effective contact with the heat radiator, the heat conduction pipe makes effective contact with the heat conduction piece, the heat conduction pipe is fixedly arranged in the concave groove of the heat radiator, and the heat conduction piece is fixedly arranged in the embedding groove of the heat radiator; a screw rod and a nut are locked through a separation piece, a positioning screw rod on a fixed plate is connected with a movable plate, and high-temperature molten copper or molten aluminum is injected into a pouring cavity through a pouring pipeline glue inlet; fins higher than the separation piece are melted through the high-temperature molten copper or the molten aluminum, a runner is cut through a glue cutting port, and after cooling is performed, a screw is loosened and the separation piece is detached.
Description
Technical field
The invention belongs to heat sink technology field, particularly a kind of hardware and software platform processing method of radiator.
Background technology
Radiator mainly contains general radiator, heat-pipe radiator and water-filled radiator now.Heat-pipe radiator is comprised of substrate, heat pipe and fin; Water-filled radiator is comprised of substrate and cover plate.General radiator is comprised of substrate, fin; Heat-pipe radiator is comprised of substrate, heat pipe and fin; Water-filled radiator is comprised of substrate and cover plate.
The processing method of known various radiators has two kinds at present, and the one, stretch forming method, a kind of is machine-tooled method.Stretch forming method efficiency is high, and cost is low, but more than cannot processing fin height 50mm, below the following 0.4mm of thickness, the radiator below spacing 4mm, because under this requirement, cannot moulding.Present many high-power components are to more than the requirement height 50mm of radiator, below the following 0.4mm of thickness, below spacing 4mm, stretch forming method is not accomplished, so produced machine-tooled method, mach method also has two kinds, and a kind of is punch press processing, a kind of is planer processing, although these two kinds of methods can be processed the radiator of above-mentioned requirements, have following shortcoming, the one, yield rate is low, as long as a slice scraps, wholely just scrap.The 2nd, to equipment, fixture, cutter requires high, and some places require error to be no more than several silks, and conventional equipment cannot be accomplished.The 3rd, efficiency is very low, cannot large-scale production.
For heat-pipe radiator, its processing especially needs detailed-oriented processing.Because it is cylindric that heat pipe is generally, heat pipe heating end need coordinate the shape of radiator conventionally, and by its pressing, the radiator so that heat pipe can be fitted more, thereby increase the contact area of heat pipe and radiator, and add tin cream between heat pipe and radiator contact-making surface, and can reduce the space between heat pipe and radiator contact-making surface, increase integral heat sink efficiency.But heat pipe is done to flatten, process and add normally two different disposal steps of tin cream, thereby having reduced the operating efficiency of producing radiator.
Summary of the invention
The hardware and software platform processing method that the object of this invention is to provide a kind of radiator, to solve the processing problems of existing heat-pipe radiator.
Technical scheme of the present invention is that a kind of hardware and software platform processing method of radiator, comprises the following steps:
Storing without the tin cream of heat fused in the groove of radiator;
The heating end of heat pipe is placed in to the groove of radiator;
Conducting strip is placed in to being embedded on groove of radiator;
Drive platform movement on radiator time the drive rod of platform, platform makes conducting strip pressurized and enters being embedded in groove of radiator, and the heating end of circular heat pipe is because being subject to conducting strip pressurization, and in groove compressive deformation, increase and the contact area of radiator;
By described platform continuous heating, institute adds tin cream and is heated and softens, and makes effectively to contact between heat pipe and radiator, heat pipe and conducting strip, and heat pipe is fixedly arranged in the groove of radiator, and conducting strip is fixedly arranged on to being embedded on groove of radiator;
By screw rod and nut locking for partition, the positioning screw on fixed head is connected with portable plate, by cast pipeline glue-feeder, high temperature copper water or aluminium water is injected to cast chamber;
Exceed high temperature copper water or the aluminium aqueous fusion for fin of partition part, then cut off runner by cutting Jiao Kou, cooling after, Unscrewed screw, the partition of dismantling;
By the substrate of radiator and heat pipe, be with binding agent/fluid sealant, adopt technique for sticking to be bonded together;
To on described substrate, process the hole matching with heat pipe, and leave certain gap, heat pipe is inserted in the hole processing on substrate;
With binding agent/fluid sealant by heat pipe together with substrate bonding.
The present invention efficiently solves a difficult problem for the work in-process complex procedures of heat-pipe radiator, has improved production efficiency, has reduced production cost.
The specific embodiment
The hardware and software platform processing method of a kind of radiator of the present invention, comprises the following steps:
Storing without the tin cream of heat fused in the groove of radiator;
The heating end of heat pipe is placed in to the groove of radiator;
Conducting strip is placed in to being embedded on groove of radiator;
Drive platform movement on radiator time the drive rod of platform, platform makes conducting strip pressurized and enters being embedded in groove of radiator, and the heating end of circular heat pipe is because being subject to conducting strip pressurization, and in groove compressive deformation, increase and the contact area of radiator; By described platform continuous heating, institute adds tin cream and is heated and softens, and makes effectively to contact between heat pipe and radiator, heat pipe and conducting strip, and heat pipe is fixedly arranged in the groove of radiator, and conducting strip is fixedly arranged on to being embedded on groove of radiator;
By screw rod and nut locking for partition, the positioning screw on fixed head is connected with portable plate, by cast pipeline glue-feeder, high temperature copper water or aluminium water is injected to cast chamber; Exceed high temperature copper water or the aluminium aqueous fusion for fin of partition part, then cut off runner by cutting Jiao Kou, cooling after, Unscrewed screw, the partition of dismantling;
By the substrate of radiator and heat pipe, be with binding agent/fluid sealant, adopt technique for sticking to be bonded together;
To on described substrate, process the hole matching with heat pipe, and leave certain gap, heat pipe is inserted in the hole processing on substrate; With binding agent/fluid sealant by heat pipe together with substrate bonding.
Should be noted that and understand, in the situation that do not depart from the spirit and scope of accompanying claim the present invention for required protection, can make various modifications and improvement to the present invention of foregoing detailed description.Therefore, the scope of claimed technical scheme is not subject to the restriction of given any specific exemplary teachings.
Applicant's statement, the present invention illustrates detailed process equipment and process flow process of the present invention by above-described embodiment, but the present invention is not limited to above-mentioned detailed process equipment and process flow process, do not mean that the present invention must rely on above-mentioned detailed process equipment and process flow process and could implement.Person of ordinary skill in the field should understand, any improvement in the present invention, to the selection of the interpolation of the equivalence replacement of each raw material of product of the present invention and auxiliary element, concrete mode etc., within all dropping on protection scope of the present invention and open scope.
Claims (1)
1. a hardware and software platform processing method for radiator, is characterized in that, comprises the following steps:
Storing without the tin cream of heat fused in the groove of radiator;
The heating end of heat pipe is placed in to the groove of radiator;
Conducting strip is placed in to being embedded on groove of radiator;
Drive platform movement on radiator time the drive rod of platform, platform makes conducting strip pressurized and enters being embedded in groove of radiator, and the heating end of circular heat pipe is because being subject to conducting strip pressurization, and in groove compressive deformation, increase and the contact area of radiator;
By described platform continuous heating, institute adds tin cream and is heated and softens, and makes effectively to contact between heat pipe and radiator, heat pipe and conducting strip, and heat pipe is fixedly arranged in the groove of radiator, and conducting strip is fixedly arranged on to being embedded on groove of radiator;
By screw rod and nut locking for partition, the positioning screw on fixed head is connected with portable plate, by cast pipeline glue-feeder, high temperature copper water or aluminium water is injected to cast chamber;
Exceed high temperature copper water or the aluminium aqueous fusion for fin of partition part, then cut off runner by cutting Jiao Kou, cooling after, Unscrewed screw, the partition of dismantling;
By the substrate of radiator and heat pipe, be with binding agent/fluid sealant, adopt technique for sticking to be bonded together;
To on described substrate, process the hole matching with heat pipe, and leave certain gap, heat pipe is inserted in the hole processing on substrate;
With binding agent/fluid sealant by heat pipe together with substrate bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310470140.0A CN103528408A (en) | 2013-10-10 | 2013-10-10 | Platform machining method of heat radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310470140.0A CN103528408A (en) | 2013-10-10 | 2013-10-10 | Platform machining method of heat radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103528408A true CN103528408A (en) | 2014-01-22 |
Family
ID=49930619
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310470140.0A Pending CN103528408A (en) | 2013-10-10 | 2013-10-10 | Platform machining method of heat radiator |
Country Status (1)
| Country | Link |
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| CN (1) | CN103528408A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105798410A (en) * | 2016-05-10 | 2016-07-27 | 太仓市华盈电子材料有限公司 | Novel glue welding technology |
| CN105945374A (en) * | 2016-05-10 | 2016-09-21 | 太仓市华盈电子材料有限公司 | Glue welding process |
| CN112992685A (en) * | 2019-12-13 | 2021-06-18 | 上海超路自动化设备有限公司 | Fusion welding and liquid injection integrated production platform for heat conducting strip of mobile phone communication chip |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5931222A (en) * | 1995-11-30 | 1999-08-03 | International Business Machines Coporation | Adhesion promoting layer for bonding polymeric adhesive to metal and a heat sink assembly using same |
| JP2001319999A (en) * | 2000-05-12 | 2001-11-16 | Tokyo Daiichi Shoko:Kk | Manufacturing method of radiator |
| CN1526504A (en) * | 2003-03-04 | 2004-09-08 | 奇f科技股份有限公司 | Heat sink machining process |
| CN1589993A (en) * | 2003-08-26 | 2005-03-09 | 徐展鹏 | Processing method of heat radiator |
| CN101137280A (en) * | 2007-07-17 | 2008-03-05 | 中国南车集团株洲电力机车研究所 | High-power element heat radiator manufacturing method |
-
2013
- 2013-10-10 CN CN201310470140.0A patent/CN103528408A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5931222A (en) * | 1995-11-30 | 1999-08-03 | International Business Machines Coporation | Adhesion promoting layer for bonding polymeric adhesive to metal and a heat sink assembly using same |
| JP2001319999A (en) * | 2000-05-12 | 2001-11-16 | Tokyo Daiichi Shoko:Kk | Manufacturing method of radiator |
| CN1526504A (en) * | 2003-03-04 | 2004-09-08 | 奇f科技股份有限公司 | Heat sink machining process |
| CN1589993A (en) * | 2003-08-26 | 2005-03-09 | 徐展鹏 | Processing method of heat radiator |
| CN101137280A (en) * | 2007-07-17 | 2008-03-05 | 中国南车集团株洲电力机车研究所 | High-power element heat radiator manufacturing method |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105798410A (en) * | 2016-05-10 | 2016-07-27 | 太仓市华盈电子材料有限公司 | Novel glue welding technology |
| CN105945374A (en) * | 2016-05-10 | 2016-09-21 | 太仓市华盈电子材料有限公司 | Glue welding process |
| CN112992685A (en) * | 2019-12-13 | 2021-06-18 | 上海超路自动化设备有限公司 | Fusion welding and liquid injection integrated production platform for heat conducting strip of mobile phone communication chip |
| CN112992685B (en) * | 2019-12-13 | 2023-09-26 | 上海超路自动化设备有限公司 | Fusion welding and liquid injection integrated production platform for heat conducting fin of mobile phone communication chip |
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| PB01 | Publication | ||
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140122 |