CN101125415A - Chemical and mechanical grinding equipment and anti-splash device used for chemical and mechanical grinding equipment - Google Patents
Chemical and mechanical grinding equipment and anti-splash device used for chemical and mechanical grinding equipment Download PDFInfo
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- CN101125415A CN101125415A CNA2006100300764A CN200610030076A CN101125415A CN 101125415 A CN101125415 A CN 101125415A CN A2006100300764 A CNA2006100300764 A CN A2006100300764A CN 200610030076 A CN200610030076 A CN 200610030076A CN 101125415 A CN101125415 A CN 101125415A
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Abstract
The invention discloses a chemical mechanical grinding device and a splash proof device for the chemical mechanical grinding device. The grinding device is internally provided with a splash proof device. The splash proof device comprises a ring splash proof cover positioned in the chemical mechanical grinding device and a lifting device which is connected with the splash proof cover; the side wall of the splash proof cover is provided with a groove; the lifting device is provided with a lifting component which is inserted into the groove to lift the splash proof cover to the upper position or the lower position. The invention can prevent the grinding liquid from splashing out and enable the grinding liquid to flow back as the invention is provided with a splash proof cover in the chemical mechanical grinding device; the invention reduces the cleaning difficulty of the device and reduces the grain pollution; the invention solves the nick problem of the crystal sheet surface; and the invention is simple to be operated and can not influence the normal operation of the sheet loading and unloading.
Description
Technical field
The present invention relates to technical field of manufacturing semiconductors, particularly a kind of chemical-mechanical grinding device and the anti-splash device that is used for chemical-mechanical grinding device.
Background technology
Along with the develop rapidly of super large-scale integration ULSI (Ultra Large Scale Integration), integrated circuit fabrication process becomes and becomes increasingly complex with meticulous.In order to improve integrated level, reduce manufacturing cost, the characteristic size of element (Feature Size) constantly diminishes, number of elements in the chip unit are constantly increases, plane routing has been difficult to satisfy the requirement that the element high density distributes, can only adopt polylaminate wiring technique to utilize the vertical space of chip, further improve the integration density of device.But the application of polylaminate wiring technique can cause wafer surface uneven, and is extremely unfavorable to graphic making,, often need handle having an even surface of wafer (Planarization) for this reason.At present, chemical mechanical milling method (CMP, ChemicalMechanical Polishing) is the best approach of reaching overall planarization, this technology has that technology is simple, operating temperature is near room temperature, can take into account the advantage that local planarization and global planarization require, especially after semiconductor fabrication process entered sub-micron (sub-micron) field, it had become an indispensable manufacture craft technology.
Chemically mechanical polishing (CMP) is to utilize the chemical solution and the finished surface generation chemical reaction that are mixed with minimum abrasive particle to change its surperficial chemical bond, generate the product of mechanically removing easily, remove chemical reactant through mechanical friction again and obtain ultra-smooth undamaged planarized surface.Fig. 1 is the structural representation of existing chemical-mechanical grinding device, as shown in Figure 1, this device comprises: shell 101, the turntable (platen) 102 of grinding pad (polish pad) is posted on the surface, grinding head 103a and 103b and the lapping liquid supply pipe (tube) 104 that is used to carry lapping liquid (slurry) 105.During grinding, earlier the to be ground of wafer to be ground faced down attached on the grinding head 103,, wafer is pressed onto on the grinding pad by on grinding head 103, applying downforce; Then, the turntable 102 that grinding pad is posted on the surface rotates under the drive of motor, and grinding head 103 also rotates in the same way, realizes mechanical lapping; Simultaneously, lapping liquid 105 is transported on the grinding pad by lapping liquid supply pipe (tube) 104, and utilize the centrifugal force of turntable rotation to be evenly distributed on the grinding pad, between by grinding wafers and grinding pad, form one deck fluid film, chemical reaction takes place in the surface of this film and wafer to be ground, can generate the product of easy removal.This process is removed the material of wafer surface in conjunction with mechanism and chemical reaction.
Need in the cmp to add a large amount of lapping liquids, and revolving-turret and grinding head, lapping liquid can be evenly distributed on the grinding pad, by the method for chemistry and machinery the wafer surface material is removed.In this course; must have the part lapping liquid is thrown out of; and in the existing chemical-mechanical grinding device; though equipment integral body has been carried out close and protect; but do not have good quarantine measures for device interior; this just makes that lapping liquid can be splashed to each position in the equipment when grinding rotation, is difficult to cleaning.And these lapping liquids can come off in the device interior crystallization, form the particle contamination source, easily cause the surface scratch that grinds the back wafer.Remarkable quality problems in the cmp (CMP) are exactly surface scratches (Scratch), thin layer after CMP handles tends to there is scratch on the surface, the scratch of these little and difficult discoveries easily causes short circuit or open circuit phenomenon at intermetallic, reduces the yield rate of product greatly.Fig. 2 causes the schematic diagram of intermetallic short circuit for surface scratches is described, as shown in Figure 2, because the scratch 201 that wafer surface exists causes electrical short between connecting hole 202 and 203.
Application number is to disclose a kind of chemical and mechanical grinding method that reduces the tungsten metal of scratch in 02120608.2 the Chinese patent, this method is ground by acid tungsten lapping liquid and the oxide lapping liquid that leading portion and back segment in grinding have adopted standard respectively, has realized the minimizing of tungsten metal grinding surface scratch.But but the lapping liquid problem of splashing in the unresolved process of lapping of this invention is used the surperficial scratch after still can there be grinding in wafer surface after this method.
Summary of the invention
The invention provides a kind of chemical-mechanical grinding device and the anti-splash device that is used for chemical-mechanical grinding device, the anti-splash device that has elevating function by installation one on chemical-mechanical grinding device, having improved existing lapping liquid splashes in equipment, cause particle contamination, cause wafer surface that the problem of cut is easily arranged.
The invention provides a kind of anti-splash device of cmp, described anti-splash device comprises the ring-type splash guard and the lowering or hoisting gear that links to each other with described splash guard that is installed in the chemical-mechanical grinding device, described splash guard sidewall bottom has groove, described lowering or hoisting gear has lifting piece, and described lifting piece inserts in the described groove, and described splash guard is risen to upper shelves or drops to the next shelves.
Wherein, described splash guard comprises top and bottom, forms an angle with circular-arc or polyline shaped between described top and described bottom, and described angle is between 90 to 180 °.
Wherein, described lowering or hoisting gear comprises plural cylinder, and the lifting piece that connects described cylinder and described groove, and described cylinder is controlled described lifting piece and described splash guard and is promoted to upper shelves after receiving the lifting signal; After receiving dropping signal, control described lifting piece and described splash guard and drop to the next shelves.
Wherein, the groove on the described splash guard comprises lower groove and path, and described path is connected with lower groove; The lifting piece of described lowering or hoisting gear is the fixture that is fixed on the equipment, realize in the described lower groove described splash guard is risen to upper shelves by described fixture is placed in, and described fixture is screw, rivet or screw mandrel.
The present invention has a kind of chemical-mechanical grinding device of identical or relevant art feature, comprise shell, turntable, grinding pad, grinding head, lapping liquid supply pipe and main control computer, wherein, described milling apparatus also comprises splash guard and lowering or hoisting gear, described splash guard is mounted in the ring in the chemical-mechanical grinding device, the sidewall bottom has groove, described lowering or hoisting gear has lifting piece, and described lifting piece inserts in the described groove, and described splash guard is risen to upper shelves or drops to the next shelves.
Wherein, described splash guard comprises top and bottom, forms an angle with circular-arc or polyline shaped between described top and described bottom, and described angle is between 90 to 180 °.
Wherein, described lowering or hoisting gear comprises 2 to 8 cylinders that link to each other with the main control computer of chemical-mechanical grinding device, and the lifting piece that links to each other with described groove with described cylinder, described main control computer sends the lifting signal to described cylinder when grinding beginning, control described lifting piece of described air cylinder lifting and described splash guard to upper shelves; When grind finishing, send dropping signal, control described cylinder and descend described lifting piece and described splash guard to the next shelves to described cylinder.
Wherein, the groove on the described splash guard comprises lower groove and path, and described path is connected with lower groove; The lifting piece of described lowering or hoisting gear is the fixture that is fixed on the outer casing inner wall of described chemical-mechanical grinding device, when described fixture is placed in the described lower groove, described splash guard rises to upper shelves, and wherein, described fixture can be screw, rivet or screw mandrel.And described splash guard rises to upper shelves before described turntable and described grinding head begin rotation; After described turntable and described grinding head stop the rotation, reduce to the next shelves.
Wherein, described lifting device can also be 2 to 8 groups of escalators of being made up of motor and lifting piece.
Compared with prior art, the present invention has the following advantages:
Chemical-mechanical grinding device of the present invention and the anti-splash device that is used for chemical-mechanical grinding device, by the turntable external position in chemical-mechanical grinding device, one splash guard is installed, the lapping liquid that sputters is all stopped by it and be back to device bottom, reduced the cleaning difficulty of equipment, reduce particle contamination, improved the cut problem of wafer surface.In addition, this splash guard also has lowering or hoisting gear, only just this splash guard can be risen when grinding, and can not influence normal loading and unloading sheet operation, and have characteristics easy for installation, that descending operation is simple.
Description of drawings
Fig. 1 is the structural representation of existing chemical-mechanical grinding device;
Fig. 2 causes the schematic diagram of intermetallic short circuit for the explanation surface scratches;
Fig. 3 is the structural representation of the anti-splash device of the cmp of the present invention's first specific embodiment;
Fig. 4 is for adopting the structural representation of chemical-mechanical grinding device of the present invention;
Fig. 5 A and 5B are the structural representation of the splash guard of the cmp of the present invention's second specific embodiment.
The specific embodiment
For above-mentioned purpose of the present invention, feature and advantage can be become apparent more, the specific embodiment of the present invention is described in detail below in conjunction with accompanying drawing.
Chemical-mechanical grinding device of the present invention and the anti-splash device that is used for chemical-mechanical grinding device, the ring-type splash guard has been installed in chemical-mechanical grinding device, to be blocked in the lapping liquid that splashes in the grinding, prevent that this part lapping liquid from forming particle contamination because of crystallization, cause the cut that grinds the back wafer surface.Do not influence the carrying out of loading and unloading grinding wafers in order to ensure this splash guard, this splash guard links to each other with lowering or hoisting gear; By forming groove in splash guard sidewall bottom, and the lifting piece of lowering or hoisting gear is inserted in this groove, realize linking to each other of splash guard and liftable device.Splash guard of the present invention has two kinds of positions of upper shelves and the next shelves, and it rises to upper shelves during grinding, and stops that lapping liquid splashes, and during non-grinding, it is lowered to the next shelves, with do not influence grind before and after other operation, as loading and unloading wafer, normally carry out.
Fig. 3 is the structural representation of the anti-splash device of the cmp of the present invention's first specific embodiment.As shown in Figure 3, this anti-splash device comprises splash guard and lowering or hoisting gear two large divisions, wherein the sidewall of splash guard is divided into bottom 301 and top 302, for stopping splashing of lapping liquid better, its top 302 has been curved circular-arc, and certain angle has been formed at 301 of bottoms in the present embodiment, generally between 90 to 180 °, as be 150 °, this design can make the lapping liquid that is blocked be back to device bottom, the splashproof better effects if.Just because of the lapping liquid that this splash guard can sputter when grinding blocks and flows back to along its madial wall, reduced the particle contamination degree of milling apparatus inside, improved the grinding yield rate of product.In addition, have groove, splash guard is linked to each other with a lowering or hoisting gear, can realize the automatic lifting of splash guard by this groove in the sidewall bottom of this splash guard.
Lowering or hoisting gear in the present embodiment utilizes cylinder to realize, as shown in Figure 3, can adopt 2 to 8 cylinders simultaneously, as 3 cylinder 311a to 311c, as lowering or hoisting gear, wherein, the lifting piece of each cylinder--the screw mandrel 312a that links to each other with piston inserts to 312c in the respective grooves of splash guard and with it and fixes, the lifting piece that is implemented in cylinder promotes or when descending, this splash guard also promotes together or descends.
In addition, a plurality of cylinders of this lowering or hoisting gear can also receive control signal, and carry out descending operation by control signal, in present embodiment, with main control computer (or computer of control grinding operation) electric the link to each other (not shown) of a plurality of cylinders with chemical-mechanical grinding device, control it simultaneously by this main control computer and carry out descending operation: after wafer loads, before grinding beginning, main control computer sends the lifting signal to each cylinder simultaneously, control cylinder promotes, its lifting piece will be promoted to upper shelves together with splash guard, stop lapping liquid splashing in equipment; After grind finishing, before the unloading wafer, main control computer sends dropping signal to cylinder again, and the lifting piece of control cylinder drops to the next shelves together with splash guard, gets other operation such as sheet not influence after the grinding.
Fig. 4 is for adopting the structural representation of chemical-mechanical grinding device of the present invention.As shown in Figure 4, this equipment comprises shell 101, turntable 102, grinding pad (not shown), grinding head 103a and 103b, lapping liquid supply pipe 104 and main control computer (not shown), in addition, it also comprises the splash guard that prevents that lapping liquid from splashing, it comprises bottom and top, has curved certain circular-arc angle between top and bottom.As shown in Figure 4, the state that splash guard rises when being grinding shown in the figure, can see, after adopting this anti-splash device of present embodiment, when grinding, though turntable and grinding head are when spin finishing, the lapping liquid that still can splash everywhere, but, play the effect of shielding because of splash guard rises retaining automatically around turntable, the lapping liquid that splashes can be collected back device bottom along the madial wall of splash guard, can not be splashed to each parts of equipment again, this has reduced the cleaning difficulty of equipment on the one hand, can prevent also that on the other hand the lapping liquid that splashes from coming off after crystallization, form the particle contamination source, scratch wafer.The lowering or hoisting gear of not shown drive splash guard lifting.
In the present embodiment, the top of splash guard has been curved certain circular-arc angle; In other embodiments of the invention, this part also can still be kept upright, or directly curves the angle of certain polyline shaped.
In the present embodiment, be the automatic lifting of utilizing the main control computer control splash guard of milling apparatus, in other embodiments of the invention, can also utilize the lift of forming by micro-machine, lifting piece and switch to realize the semi-automatic lifting of splash guard.In addition, can also realize the lifting of splash guard with manual mode.
Second specific embodiment of the present invention is to adopt manual mode to realize the lifting of splash guard.Fig. 5 A and 5B are the structural representation of the splash guard of the cmp of the present invention's second specific embodiment.Fig. 5 A is the structural representation of the splash guard with " worker " font groove of the present invention's second specific embodiment, and shown in Fig. 5 A, the splash guard in the present embodiment still is divided into top and bottom, and its top has still been curved certain circular-arc angle.But the groove on the sidewall of the splash guard in the present embodiment, special shape need is but arranged, as shown in FIG., it is one " worker " font, can be divided into three parts: lower groove 501a and 501b, path 502, and go up groove 503, in the present embodiment this " worker " font groove can have 2 to 8, is the splash guard with 2 " worker " font grooves shown in this figure.
Very simple with the corresponding lowering or hoisting gear of manual splash guard in the present embodiment, only need can realize at installation on the outer casing inner wall of chemical-mechanical grinding device and the corresponding fixture in groove position on this splash guard the hand-operated lifting of splash guard, fixture can be screw, rivet or screw mandrel etc.In the time of need carrying out the loading of wafer before grinding beginning, splash guard is in the state of gear down, and the fixture on the milling apparatus shell is stuck in the horizontal position of the last groove 503 of splash guard groove.When grinding will begin, before promptly turntable and grinding head begin rotation, splash guard need be promoted, at this moment, earlier splash guard is rotated, make fixture align with the passage portion 502 of groove; Again with the lower groove part 501a and the 501b that carry on suitable this path of splash guard to groove; Then, rotate splash guard once more, this fixture is stuck in the horizontal position of lower groove, realize splash guard is promoted and be fixed to gear; Then, just spin finishing can be begun, in process of lapping,, splashing of lapping liquid can be effectively stopped because of splash guard has been raised to gear.
After turntable and grinding head stop the rotation, unload before the lower wafer, need this splash guard is fallen, at this moment, still earlier splash guard is rotated, make that the fixture on the shell aligns with the passage portion 502 of groove; And then splash guard transferred last trench portions 503 to groove along this path; Then, rotate splash guard once more, this fixture is stuck in the groove, can realize splash guard is transferred to following gear, can not influence and get other operation such as wafer after the grinding.
The lapping liquid that splash guard in the present embodiment can sputter when grinding equally blocks and flows back to along its madial wall, has reduced the particle contamination degree in the grinder, has improved the grinding yield rate of product.In addition, the lifting device structure in the present embodiment is very simple, and after load and before the unloading piece, splash guard mentioned or the operation put down also convenient and easy.
Groove on the splash guard in the present embodiment is to have made " worker " font, has the groove of upper and lower groove and path, and it matches with the fixture installed on the outer casing inner wall of milling apparatus, realizes the switching of the position of splash guard at last gear and lower gear interdigit.In other embodiments of the invention, this groove can also be made "] " font, " " font, or " " font etc.
Wherein, for "] " operation principle of font groove is similar with " worker " font, repeats no more; And for having " " font, or the groove of " " font, all only have lower groove and path two parts, Fig. 5 B is the structural representation of the splash guard with " " font groove of the present invention's second specific embodiment, shown in Fig. 5 B, this splash guard still is divided into top and bottom, and its top has still been curved certain circular-arc angle.But the groove shape on the lower sides of this splash guard is " " font, and each groove can be divided into two parts: lower groove (511a shown in the figure, 511b and 511c), and path (512a shown in the figure and 512b)." " font groove in the present embodiment can have 2 to 8 equally, is the splash guard with 3 " " font grooves shown in this figure.Its operation principle is: before grinding beginning during loaded with wafers, need make anti-splash device lower, at this moment, three fixtures of the correspondence on the milling apparatus shell are in the path 512a of splash guard groove and the top of 512b, in this structure, both can utilize fixture to block the path top splash guard had been lowered into down gear; Also can do path longer, directly splash guard be put down, and need not utilize the top of path to block fixture.For latter event, splash guard arrival device bottom is transfers to down gear.When grinding will begin, in order to prevent that lapping liquid from splashing, need splash guard is promoted: mention splash guard earlier, make fixture arrive the path 512a of groove and the bottom of 512b, and then rotation splash guard, make each fixture be stuck in the horizontal position of lower groove 511a, 511b and 511c, realize splash guard is promoted and be fixed on the gear place; Then, just can begin to grind, in process of lapping,, can stop that lapping liquid splashes because of splash guard has been raised to gear.
After grinding is finished, unload lower wafer before, need this splash guard is fallen, at this moment, still want earlier splash guard to be rotated, make fixture align with the passage portion of groove; And then splash guard is lowered into down gear along this path, prevent that its influence from getting other operations such as wafer.
Though the present invention with preferred embodiment openly as above; but it is not to be used for limiting the present invention; any those skilled in the art without departing from the spirit and scope of the present invention; can make possible change and modification, so protection scope of the present invention should be as the criterion with the scope that claim of the present invention was defined.
Claims (14)
1. the anti-splash device of a cmp, it is characterized in that: described anti-splash device comprises the ring-type splash guard and the lowering or hoisting gear that links to each other with described splash guard that is installed in the chemical-mechanical grinding device, described splash guard sidewall bottom has groove, described lowering or hoisting gear has lifting piece, and described lifting piece inserts in the described groove, and described splash guard is risen to upper shelves or drops to the next shelves.
2. anti-splash device as claimed in claim 1 is characterized in that: described splash guard comprises top and bottom, forms an angle with circular-arc or polyline shaped between described top and described bottom.
3. anti-splash device as claimed in claim 2 is characterized in that: described angle is between 90 to 180 °.
4. anti-splash device as claimed in claim 1, it is characterized in that: described lowering or hoisting gear comprises plural cylinder, and the lifting piece that connects described cylinder and described groove, described cylinder is controlled described lifting piece and described splash guard and is promoted to upper shelves after receiving the lifting signal; After receiving dropping signal, control described lifting piece and described splash guard and drop to the next shelves.
5. anti-splash device as claimed in claim 1 is characterized in that: the groove on the described splash guard comprises lower groove and path, and described path is connected with lower groove; The lifting piece of described lowering or hoisting gear is the fixture that is fixed on the equipment, realizes in the described lower groove described splash guard is risen to upper shelves by described fixture is placed in.
6. anti-splash device as claimed in claim 5 is characterized in that: described fixture is screw, rivet or screw mandrel.
7. chemical-mechanical grinding device, comprise shell, turntable, grinding pad, grinding head, lapping liquid supply pipe and main control computer, it is characterized in that: described milling apparatus also comprises splash guard and lowering or hoisting gear, described splash guard is mounted in the ring in the chemical-mechanical grinding device, the sidewall bottom has groove, described lowering or hoisting gear has lifting piece, and described lifting piece inserts in the described groove, and described splash guard is risen to upper shelves or drops to the next shelves.
8. milling apparatus as claimed in claim 7 is characterized in that: described splash guard comprises top and bottom, forms an angle with circular-arc or polyline shaped between described top and described bottom.
9. milling apparatus as claimed in claim 8 is characterized in that: described angle is between 90 to 180 °.
10. milling apparatus as claimed in claim 7, it is characterized in that: described lowering or hoisting gear comprises 2 to 8 cylinders that link to each other with the main control computer of chemical-mechanical grinding device, and the lifting piece that links to each other with described groove with described cylinder, described main control computer sends the lifting signal to described cylinder when grinding beginning, control described lifting piece of described air cylinder lifting and described splash guard to upper shelves; When grind finishing, send dropping signal, control described cylinder and descend described lifting piece and described splash guard to the next shelves to described cylinder.
11. milling apparatus as claimed in claim 7 is characterized in that: the groove on the described splash guard comprises lower groove and path, and described path is connected with lower groove; The lifting piece of described lowering or hoisting gear is the fixture that is fixed on the outer casing inner wall of described chemical-mechanical grinding device, and when described fixture was placed in the described lower groove, described splash guard rose to upper shelves.
12. milling apparatus as claimed in claim 11 is characterized in that: described fixture is screw, rivet or screw mandrel.
13. milling apparatus as claimed in claim 11 is characterized in that: described splash guard rises to upper shelves before described turntable and described grinding head begin rotation; After described turntable and described grinding head stop the rotation, reduce to the next shelves.
14. milling apparatus as claimed in claim 7 is characterized in that: described lifting device is 2 to 8 groups of lifts of being made up of motor, lifting piece and switch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100300764A CN100467221C (en) | 2006-08-14 | 2006-08-14 | Chemical and mechanical grinding equipment and anti-splash device used for chemical and mechanical grinding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100300764A CN100467221C (en) | 2006-08-14 | 2006-08-14 | Chemical and mechanical grinding equipment and anti-splash device used for chemical and mechanical grinding equipment |
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| Publication Number | Publication Date |
|---|---|
| CN101125415A true CN101125415A (en) | 2008-02-20 |
| CN100467221C CN100467221C (en) | 2009-03-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2006100300764A Active CN100467221C (en) | 2006-08-14 | 2006-08-14 | Chemical and mechanical grinding equipment and anti-splash device used for chemical and mechanical grinding equipment |
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| CN (1) | CN100467221C (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102233605A (en) * | 2010-03-27 | 2011-11-09 | 日本电产新宝株式会社 | Splash pan of a pottery wheel and pottery wheel provided with the same |
| CN102335866A (en) * | 2011-09-28 | 2012-02-01 | 清华大学 | Anti-splash device used for chemical machinery polishing machine and chemical machinery polishing machine thereof |
| CN103769995A (en) * | 2013-12-31 | 2014-05-07 | 镇江市港南电子有限公司 | Novel lower grinding disc structure |
| CN109698149A (en) * | 2018-12-27 | 2019-04-30 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Anti-splash device and etching process consersion unit |
| CN110640623A (en) * | 2019-09-27 | 2020-01-03 | 武汉新芯集成电路制造有限公司 | Splash guard and chemical mechanical polishing machine |
| CN111993433A (en) * | 2020-08-06 | 2020-11-27 | 定兴县凌诺商贸有限公司 | Polishing robot |
| CN113084708A (en) * | 2021-04-19 | 2021-07-09 | 长鑫存储技术有限公司 | Pneumatic cylinder protection architecture and chemical mechanical polishing device |
| CN113286681A (en) * | 2018-08-14 | 2021-08-20 | 伊利诺斯工具制品有限公司 | Splash guard for grinding and polishing machines and grinding and polishing machines with splash guard |
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2006
- 2006-08-14 CN CNB2006100300764A patent/CN100467221C/en active Active
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102233605A (en) * | 2010-03-27 | 2011-11-09 | 日本电产新宝株式会社 | Splash pan of a pottery wheel and pottery wheel provided with the same |
| CN102233605B (en) * | 2010-03-27 | 2013-11-13 | 日本电产新宝株式会社 | Splash pan of a pottery wheel and pottery wheel provided with the same |
| CN102335866A (en) * | 2011-09-28 | 2012-02-01 | 清华大学 | Anti-splash device used for chemical machinery polishing machine and chemical machinery polishing machine thereof |
| CN103769995A (en) * | 2013-12-31 | 2014-05-07 | 镇江市港南电子有限公司 | Novel lower grinding disc structure |
| CN103769995B (en) * | 2013-12-31 | 2017-01-25 | 于静 | Lower grinding disc structure |
| CN113286681A (en) * | 2018-08-14 | 2021-08-20 | 伊利诺斯工具制品有限公司 | Splash guard for grinding and polishing machines and grinding and polishing machines with splash guard |
| CN113286681B (en) * | 2018-08-14 | 2023-11-24 | 伊利诺斯工具制品有限公司 | Splash guard for grinding and polishing machines and grinding and polishing machine with splash guard |
| CN109698149A (en) * | 2018-12-27 | 2019-04-30 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Anti-splash device and etching process consersion unit |
| CN110640623A (en) * | 2019-09-27 | 2020-01-03 | 武汉新芯集成电路制造有限公司 | Splash guard and chemical mechanical polishing machine |
| CN111993433A (en) * | 2020-08-06 | 2020-11-27 | 定兴县凌诺商贸有限公司 | Polishing robot |
| CN113084708A (en) * | 2021-04-19 | 2021-07-09 | 长鑫存储技术有限公司 | Pneumatic cylinder protection architecture and chemical mechanical polishing device |
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|---|---|
| CN100467221C (en) | 2009-03-11 |
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20111115 Address after: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Co-patentee after: Semiconductor Manufacturing International (Beijing) Corporation Patentee after: Semiconductor Manufacturing International (Shanghai) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |