CN101115326B - Microphone case and condenser microphone - Google Patents
Microphone case and condenser microphone Download PDFInfo
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- CN101115326B CN101115326B CN2007101296455A CN200710129645A CN101115326B CN 101115326 B CN101115326 B CN 101115326B CN 2007101296455 A CN2007101296455 A CN 2007101296455A CN 200710129645 A CN200710129645 A CN 200710129645A CN 101115326 B CN101115326 B CN 101115326B
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Abstract
A microphone case includes; a plastic basic frame including a space for housing an electro-acoustic transducing unit; a plastic substrate for closing an opening of the space, the plastic substrate being bonded to the basic frame; conductive layers provided on the bonding surfaces of the basic frame and the substrate respectively, the conductive layers being electrically connected to each other; and exposed portions where the surfaces of the basic frame and the substrate are exposed, wherein the basic frame and the substrate are bonded to each other in the exposed portions.
Description
Technical field
The framework and the condenser microphone of the microphone that the present invention relates to use in the various devices such as mobile phone, video camera, personal computer.
Background technology
Current, an example of condenser microphone is for example disclosed in the patent documentation 1.Promptly; The condenser microphone of this existing structure; Stack gradually the liner of the circuit substrate that has fixedly mounted parts of electric, the liner of lower side, backplate substrate, upper side from bottom to top and open the vibrating membrane bracing frame of having established vibrating membrane with backplate; Constitute the unit, with this unit housing in metal shell.
Patent documentation 1: the spy opens the 2002-345092 communique
Summary of the invention
In this condenser microphone, range upon range of fixedly time the at aforementioned circuit substrate and backplate substrate etc. makes bonding agent between the faying face of these parts.In the case, between the faying face of each parts, for example connect, must make between the conductive pattern that is arranged on each parts to be electrically connected in order to ensure ground connection.Therefore, the bond layer between conductive pattern is formed as thin as a wafer, or use the conductive adhesive that comprises conducting resinl in order not hinder conduction.
Yet, if set bond layer as thin as a wafer, can't guarantee good adhesive strength, there is the problem of the intensity decreases of microphone.In addition; Comprise in use under the situation of conductive adhesive of conducting resinl; Owing to this bonding agent not only costs an arm and a leg production cost is risen; And because the heat during reflow soldering can produce gas from binding agent, this gas can become the major reason that the electret layer electric charge that makes backplate substrate etc. leaks, the performance of condenser microphone significantly descends.
In addition; In the condenser microphone of the lit-par-lit structure that mainly constitutes by three laminar substrates (circuit substrate, framework substrate, upper substrate); In the time of on the upper and lower surface that circuit substrate and upper substrate is bonded to the framework substrate respectively, bonding agent can not show a candle to the cementability of the core (for example glass epoxy board) with respect to substrate with respect to the cementability of aforementioned metal layer.This is because because the smoothness of layer on surface of metal is better than substrate core, thereby the adhesive strength of bonding agent descends.
In addition; When being installed to this condenser microphone on the substrate, carrying out reflow soldering like this; Under the situation of condenser microphone heating; Because the coefficient of thermal expansion of the core (for example glass epoxy board) of framework substrate is compared with the coefficient of thermal expansion of metal level (for example Copper Foil), the core of framework substrate greatly, thereby aforementioned core can boost metal level.In the case, when heating, the metal level of the framework substrate positive and negative that links to each other with through hole (access opening) can apply power to the direction that comes off because of pressing in the expansion of core.Therefore, under the situation of through hole undercapacity, crackle might occur on the metal of positive and negative, conducting is interrupted.
The problem that the present invention is conceived to exist in the above-mentioned prior art just puts forward.Its purpose is, as the framework of condenser microphone, can obtain high strength, can low-costly make simultaneously, and realizes high-performance as condenser microphone.
Another object of the present invention is to; A kind of manufacturing approach and condenser microphone of condenser microphone are provided; It can improve core and the core of circuit substrate and framework substrate and the cementability between upper substrate of framework substrate on the positive and negative that circuit substrate and upper substrate is bonded to the framework substrate respectively with bonding agent the time.
To achieve these goals, the invention of the technical scheme 1 of the framework of microphone has plastic pedestal; Penetrate the space that is provided for accommodating the electroacoustic converter unit in this pedestal; Opening for inaccessible this space engages plastic substrate with aforementioned pedestal, conductive layer is set respectively on the composition surface of pedestal and substrate; Two conductive layers are electrically connected; It is characterized in that the exposed division that surface is separately exposed is set, and pedestal and substrate are adhesively fixed on this exposed division on the composition surface of aforementioned pedestal and substrate.
Therefore, pedestal and substrate do not have to be bonded to each other on the exposed division of conductive pattern fixing, simultaneously through the electric binding of joint between conductive pattern.So, can be with a plurality of substrates of bonding and range upon range of securely fixedly formation framework under the state of guaranteeing mutual conduction.In addition, owing to needn't use the conductive adhesive that has added conducting resinl, but can carry out bondingly, thereby can reduce manufacturing cost with common bonding agent.In addition, owing to needn't use conductive adhesive, therefore can prevent the gas by the conductive adhesive generation in advance, the electric charge of avoiding being caused by gas leaks, can realize high performance microphone.
The invention of technical scheme 2 is according to technical scheme 1 described invention, it is characterized in that, constitutes pedestal and substrate by same type of material, utilizes adhering part bonding this pedestal and the substrate similar with them simultaneously.
Therefore, because can be adhesively fixed securely pedestal and substrate prevent that simultaneously difference from appearring in expansion rate, thereby can avoid bonding and come off etc.
The invention of technical scheme 3 is according to technical scheme 2 described inventions, it is characterized in that, as adhering part, uses heat-resisting adhering film.
Because this heat-resisting adhering film not only is convenient to handle, help the high efficiency of manufacturing process, even and when reflow soldering, be heated, the gas generating capacity also seldom thereby can prevent effectively that electric charge from leaking.
The invention of technical scheme 4 is according to technical scheme 2 described inventions, it is characterized in that, as adhering part, uses sclerosis shrinkage adhering part.
Therefore, utilize the sclerosis of bonding agent to shrink, pedestal and substrate are furthered each other, can improve adhesive strength, can obtain the good electrically conducting between conductive pattern simultaneously.
The invention of technical scheme 5 is according to technical scheme 3 described inventions, it is characterized in that, utilizes an opening of the inaccessible pedestal of substrate that parts of electric has been installed, and utilizes inaccessible another opening of the substrate that forms sound hole simultaneously.
Therefore, go for the condenser microphone that capacitance part has been installed in inside.
The invention of technical scheme 6 is according to technical scheme 5 described inventions, it is characterized in that, utilizes the fluxless fixation that aforementioned parts of electric is fixed on the aforesaid base plate.
Therefore, can realize preventing gas, prevent that the electric charge of electret layer from leaking, realize the high-performance microphone by the solder flux generation.
The invention of technical scheme 7 is purport with the condenser microphone; Positive and negative at the framework substrate with metal level is provided with bonding region; Utilize bonding agent respectively the circuit substrate of upper substrate, installation parts of electric to be bonded on this bonding region; Utilize bonding agent that upper substrate and the circuit substrate that parts of electric is installed are adhesively fixed respectively on whole bonding regions of aforementioned framework substrate positive and negative, and without the aforementioned metal layer.
According to the invention of technical scheme 7, when utilizing bonding agent circuit substrate and upper substrate to be bonded on the positive and negative of framework substrate respectively, there is not metal level in the bonding region.Therefore, can improve core and the core of circuit substrate and framework substrate and the cementability between upper substrate of framework substrate.
Therefore, can obtain to have the condenser microphone of aforementioned effect.
The effect of invention
As stated, according to the present invention, can guarantee under the state that conducts electricity each other that bonding and fixing securely polylith substrate can also avoid electric charge to leak simultaneously, realizes high performance microphone.
Description of drawings
Fig. 1 is the profile of the condenser microphone of expression the 1st execution mode.
Fig. 2 is the exploded perspective view of the condenser microphone of Fig. 1.
Fig. 3 is the part sectioned view with a part of enlarged and displayed of Fig. 1.
Fig. 4 is the plane graph of expression framework pedestal with respect to the bonding structure of circuit substrate.
Fig. 5 is the ground plan of expression framework pedestal with respect to the bonding structure of upper substrate.
Fig. 6 is expression vibrating membrane and the liner ground plan with respect to the bonding structure of upper substrate.
Fig. 7 is the partial plan layout of the manufacturing process of expression condenser microphone.
Fig. 8 is the partial plan layout of the manufacturing process after the presentation graphs 7.
Fig. 9 is the partial plan layout of the manufacturing process after the presentation graphs 8.
Figure 10 is the partial plan layout of the manufacturing process after the presentation graphs 9.
Figure 11 is the partial plan layout of the manufacturing process after expression Figure 10.
Figure 12 is the partial plan layout of the manufacturing process after expression Figure 11.
Figure 13 is the profile of the condenser microphone of expression the 2nd execution mode.
Figure 14 is the exploded perspective view of the condenser microphone of Figure 13.
Figure 15 is the profile of the condenser microphone of expression the 3rd execution mode.
Figure 16 is the exploded perspective view of the condenser microphone of Figure 15.
Figure 17 is the key diagram of the position relation of indication circuit substrate 123 lip-deep conductive patterns and protective layer.
Figure 18 (a) is the plane graph of circuit substrate 123 lip-deep conductive patterns, (b) is the plane graph of conductive pattern, (c) is the plane graph of the conductive pattern on circuit substrate 123 back sides.
Figure 19 is the plane graph of framework pedestal 124.
Embodiment
(execution mode)
According to Fig. 1 to Fig. 3 execution mode of the present invention is described below.
Like Fig. 1 and shown in Figure 2; Being configured to of the framework 22 of the condenser microphone 21 of this execution mode; With flat circuit substrate 23, inner being hollowed out and the whole framework pedestal 24 that forms cubic frame shape and flat upper substrate 25 range upon range of after, utilize adhesive securement.Aforementioned circuit substrate 23, framework pedestal 24 and upper substrate 25 are made up of electrical insulators such as epoxy resin, liquid crystal polymer, potteries.In this execution mode, circuit substrate 23, framework pedestal 24 and upper substrate 25 are made up of the glass epoxy resin of having sneaked into glass fiber in the epoxy resin.
Printing is made up of copper on the upper and lower surface of circuit substrate 23 conductive pattern 23b, 23c as conductive layer.And, on circuit substrate 23, parts of electric has been installed, comprise the field-effect transistor 26 that is arranged on the formation impedance inverter circuit in the framework 22 and electric capacity 27 etc.Printing is made up of copper on the upper and lower surface of aforementioned framework pedestal 24 and lateral surface mutual continuous conductive pattern 24b, 24c as conductive layer.And, parts of electric such as aforementioned field effect transistor 26 on the circuit substrate 23 and electric capacity 27 are accommodated in the inner space that is configured in this framework pedestal 24.Printing dielectric film 23e on the desired location of the upper and lower surface of circuit substrate 23.Printing is made up of Copper Foil etc. on the upper and lower surface of aforementioned upper substrate 25 and lateral surface conductive pattern 25b, 25c as conductive layer.On upper substrate 25, be formed for picking up the sound hole 28 of sound from the outside.And, buried conductive layer 23d, the 25d that constitutes by Copper Foil underground in the inside of circuit substrate 23 and upper substrate 25.This conductive layer 23d, 25d are laminated to conductive layer 23d, 25d between a pair of resin flake of forming circuit substrate 23 and upper substrate 25 and form.
Like Fig. 1 to Fig. 3 and shown in Figure 6; In aforementioned framework pedestal 24; Lower surface at the downside conductive pattern 25c of upper substrate 25; To open the bonding vibrating membrane 29 that constitutes by the thin-film sheet of PPS (polyphenylene sulfide) of frame state, form not shown conductive layer at the golden vapor deposition of the upper surface utilization of this vibrating membrane 29.At 4 positions of the lower surface week of vibrating membrane 29 side, the scutellate liner 30 that is adhesively fixed and constitutes by the synthetic resin such as PPS similar with the material of vibrating membrane 29.In framework pedestal 24,, dispose backboard 31 relatively across liner 30 at the lower surface of vibrating membrane 29.This backboard 31 constitutes through pasting PTFE film 31b such as (polytetrafluoroethylene) at the upper surface of the substrate 31a that is made up of corrosion resistant plate.This film 31b handles through this polarization through processing of having implemented to polarize such as corona discharges, and film 31b constitutes electret layer.Therefore, because aforementioned backboard 31 constitutes backplane, thereby the condenser microphone of this execution mode is a back electret build.In addition, because aforementioned backboard 31 forms the peripheral shape roughly elliptoid flat shape littler than interior all shapes of framework pedestal 24, thereby between their inner and outer circumferential surfaces, form the gap.Central portion at backboard 31 forms through hole 32, and it is used to allow the air because of shaking of aforementioned vibrating membrane 29 causes to move.
Extremely shown in Figure 3 like Fig. 1; In aforementioned framework pedestal 24; Between backboard 31 and circuit substrate 23, clamp the holding member 33 that constitutes by the flat spring material with compressive state; Utilize the elastic force of this holding member 33, backboard 31 by from the opposition side of vibrating membrane 29 to the direction pressurization of the lower surface butt of liner 30.Like this, through between vibrating membrane 29 and backboard 31, keeping being equivalent to the predetermined distance of liner 30 thickness, between them, form the capacitance part of guaranteeing specified volume.Aforementioned holding member 33 is implemented gold-plated formation through the tow sides at corrosion resistant plate, and via this holding member 33, the terminal 44 of the impedance inverter circuit on aforementioned backboard 31 and the circuit substrate 23 is electrically connected.
As shown in Figure 1, on aforementioned circuit substrate 23 and upper substrate 25, form a plurality of through holes 34,35 respectively, be provided with conductive pattern 34a, the 35a that is connected respectively with aforementioned conductive pattern 23b, 23c and 25b, 25c at the inner peripheral surface of these through holes 34,35.In addition, difference filled conductive material 36,37 utilizes this electric conducting material 36,37 and aforementioned conductive pattern 34a, 35a to form conductive part 57,58 in through hole 34,35.And; Formation is from the conductive part 58 that comprises conductive pattern 25b, 25c and through hole 35 of upper substrate 25; Via the conductive pattern 24b～24d on the framework pedestal 24; Via the conductive part 57 that comprises conductive pattern 23b, 23c and through hole 34 on the circuit substrate 23, arrive the conductive path of not shown earth terminal.
Specify circuit substrate 23, framework pedestal 24 and the upper substrate 25 that constitutes aforementioned framework 22 below, and their range upon range of fixture construction.
To shown in Figure 5, on the inner peripheral of the lower surface of framework pedestal 24 and upper surface, form the exposed division 38,39 of the pedestal main body 24a that does not have conductive pattern 24c, 24b with integral body mode in the form of a ring like Fig. 1.Corresponding with the downside exposed division 38 of framework pedestal 24, at the upper surface of circuit substrate 23, to arrange the exposed division 40 that a plurality of modes forms the base main body 23a that does not have conductive pattern 23b along annular section.Corresponding with the upside exposed division 39 of framework pedestal 24, at the lower surface of upper substrate 25, to arrange the exposed division 41 that a plurality of modes forms the base main body 25a that does not have conductive pattern 25c along annular section.
Between the downside exposed division 38 of each exposed division 40 of aforementioned circuit substrate 23 and framework pedestal 24; Across the bonding agent 42 that constitutes by epoxy resin as adhering part; Utilize this bonding agent 42, circuit substrate 23 is adhesively fixed mutually on the exposed division 40,38 of the base main body 23a that is made up of electrical insulators, pedestal main body 24a with framework pedestal 24.In addition, on this part exposed division 40,38, the conductive pattern 24c of the conductive pattern 23b of circuit substrate 23 upper surfaces and framework pedestal 24 lower surfaces directly engages, so that circuit substrate 23 is electrically connected with framework pedestal 24.
Likewise; Between the upside exposed division 39 of each exposed division 41 of aforementioned upper substrate 25 and framework pedestal 24; Across the bonding agent 43 that constitutes by epoxy resin as adhering part; Utilize this bonding agent 43, upper substrate 25 is adhesively fixed mutually on the exposed division 41,39 of the base main body 25a that is made up of electrical insulators, pedestal main body 24a with framework pedestal 24.In addition, on this part exposed division 41,39, the conductive pattern 24b of the conductive pattern 25c of upper substrate 25 lower surfaces and framework pedestal 24 upper surfaces directly engages, so that upper substrate 25 is electrically connected with framework pedestal 24.
As aforementioned adhering part is bonding agent, the film that adopts the adhering film for example be the main body with epoxy and thermoplastic resin, is made up of heat-resisting quantity propylene class bonding agent, the heat-resisting adhering films such as adhering film that are made up of polyolefin resin.
In the condenser microphone 21 of this execution mode of above-mentioned formation, if arrive vibrating membranes 29 from the sound wave of sound source via the sound hole 28 of upper substrate 25, then this vibrating membrane 29 vibrates corresponding to frequency, amplitude and the waveform of sound.And along with the vibration of vibrating membrane 29, the interval that vibrating membrane 29 and backboard are 31 changes from set point, the impedance variations of electric capacity.The variation of this impedance is exported after utilizing impedance inverter circuit to be transformed to voltage signal.
Explanation has the manufacturing approach of the condenser microphone 21 of aforementioned structure below.
When making this condenser microphone 21; At first as shown in Figure 7; Utilize bonding agent to be adhesively fixed and be used to separate the liner formation film 47 that the vibrating membrane that forms a plurality of vibrating membranes 29 forms film 46 and is used to separate many groups liner 30 of 41 group of formation, produce vibration film assembly 48.Form a plurality of open-work 47a of arrangement formation on the film 47 at aforementioned liner, at the protuberance 47b that is provided for separating each liner 30 of 4 of formation interior week of this open-work 47a.And, under the adhering state of double- layer films 46,47, in liner forms each open-work 47a of film 47, open with the tension force degree of appropriateness and to establish vibrating membrane and form film 46.
Then, as shown in Figure 8, form the lower face side of parts 49 being used to separate the upper substrate that forms a plurality of upper substrate 25, utilize the bonding agent aforementioned vibration film assembly 48 that is adhesively fixed.In the case, form on the parts 49 conductive pattern 25b, 25c and the sound hole 28 that is formed for a plurality of upper substrate 25 across predetermined distance in upper substrate.The conductive pattern 25c of lower face side only is shown in Fig. 8.In addition, with corresponding, form the through hole 49a of four jiaos the circle that is formed for confirming each upper substrate 25 on the parts 49 in upper substrate with four jiaos of each conductive pattern 25c.And; Shown in the double dot dash line of Fig. 8 lower side; Adhesive-applying in upper substrate forms the regulation bonding region 50 inboard, on this conductive pattern 25c of the exposed division 41 on each conductive pattern 25c of parts 49 only, only bonding vibrating membrane forms film 46 and conductive pattern 25c in these bonding regions 50.
Then; Shown in the double dot dash line of Fig. 8 upper side; Form in each open-work 47a of film 47 along being set in liner; Simultaneously consistent with aforementioned bonding region 50 imaginary line of cut 51 utilizes the laser stamping-out and cutting vibrating film assembly 48, forms its size and can be housed in a plurality of vibrating membranes 29 in the framework pedestal 24 and stick on respectively 4 the scutellate liners 30 on these vibrating membranes 29.In the case; Owing to be set at and make imaginary line of cut 51 be positioned at upper substrate to form on the corresponding position of each conductive pattern 25c on the material 49 with constituting by metal material; Even thereby use laser stamping-out cutting vibrating film assembly 48, can not worry to damage upper substrate yet and form parts 49.
Then, as shown in Figure 9, the upper substrate of bonding aforementioned vibrating membrane 29 is formed parts 49, be laminated to and be used to separate the framework pedestal that forms a plurality of frame pedestals 24 and form parts 52, be adhesively fixed like the back said bonding agent that utilizes.In the case, form on the parts 52, become a plurality of open-work 52a of the medial surface of framework pedestal 24 across predetermined distance at the framework pedestal.In addition; Form on the parts 52 at the framework pedestal; Be formed for confirming the through hole 52b of circle at four angles of each framework pedestal 24, and only be formed for confirming through slot 52c, the 52d of slotted hole shape of the lateral surface of each framework pedestal 24 at a distance from small distance very with aforementioned through hole 52b.In addition, form the tow sides of parts 52, on the inner peripheral surface of the inner peripheral surface of each through hole 52b and each through slot 52c, 52d, form the conductive pattern 24b～24d of framework pedestal 24 in framework.
And; On at least one of the exposed division 39 of the top periphery of each the open-work 52a on exposed division 41 in upper substrate forms each the conductive pattern 25c on the parts 49 and the framework pedestal formation parts 52; Apply and to form parts 49 with upper substrate and similar epoxies bonding agent with pedestal formation parts 52; It is integrated on the exposed division 41,39 of base main body 25a, pedestal main body 24a with framework pedestal formation parts 52 to make upper substrate form parts 49 thus, is adhesively fixed securely.In the case, owing to form between conductive pattern 25c that parts 49 and framework pedestal form parts 52, the 24b not across bonding agent, thereby directly engage between these conductive patterns 25c, 24b and be electrically connected in upper substrate.
In addition, shown in figure 10, through being fallen respectively, backboard 31 and holding member 33 insert in each the open-work 52a that is assembled into aforementioned framework pedestal formation parts 52.Then, shown in figure 11, form the circuit substrate formation parts 53 that parts 52 laminated are used to form a plurality of circuit substrates 23 at the framework pedestal, like said being adhesively fixed in back, form microphone assembly 54.In the case, form conductive pattern 23b, 23c and the dielectric film 23e that is formed for circuit substrate 23 on the parts 53, utilize laser welding in advance, parts of electric such as erecting bed effect transistor 26 and electric capacity 27 on conductive pattern 23b simultaneously at circuit substrate.This laser welding is through carrying out the border irradiating laser between parts of electric and conductive pattern 23b, the 23c.The part of the conductive pattern 23c of lower face side only is shown among Figure 11.In addition, with four angle corresponding mode of each conductive pattern 23c, form the through hole 53a of the circle at four angles that are formed for confirming each circuit substrate 23 on the parts 53 at circuit substrate.In addition, also can replace the aforementioned laser welding, use arc welding, perhaps use fluxless welding or solder flux to clean welding.
And; The exposed division 38 and the circuit substrate that form the lower rim of each the open-work 52a on the parts 52 at the framework pedestal form at least one in the exposed division 40 on each the conductive pattern 23b on the parts 53; Apply with the framework pedestal and form the similar epoxies bonding agent of parts 52 and circuit substrate formation parts 53; Framework pedestal formation parts 52 are integrated on the exposed division 38,40 of pedestal main body 24a, 23a with circuit substrate formation parts 53 thus, are adhesively fixed securely.In the case,, thereby directly engage between these conductive patterns 24c, 23b, can obtain good electrically conducting because the framework pedestal forms between conductive pattern 24c that parts 52 and circuit substrate form parts 53, the 23b not across bonding agent.
Then, shown in figure 12, through with cast-cutting saw etc., along the imaginary in length and breadth line of cut 55,56 that passes aforementioned through hole 49a, 52b, 53a, through slot 52c, 52d etc., the aforementioned microphone assembly 54 of cutting and separating side by side forms a plurality of condenser microphones 21.Here; Each line of cut 55,56 is set at, and is positioned on the straight line of central link that through hole 49a, framework pedestal that upper substrate is formed parts 49 form the through hole 52b of parts 52 and the through hole 53a that through slot 52c, 52d and circuit substrate form parts 53.Therefore, can reduce the cutting resistance, carry out cutting operation with low load.In addition; When cutting and separating from this microphone assembly 54 goes out a plurality of condenser microphone 21; Even on four angles of condenser microphone 21, burr occurs; Also be positioned at aforementioned through hole 49a, 52b, the 53a at four angles of each condenser microphone 21, thereby it is outstanding from the lateral surface on each limit of condenser microphone 21 to suppress this burr owing to this burr.In addition, when overflowing, this bonding agent 42,43 is overflowed in through hole 49a, 52b, 53a, thereby can make the thickness and precision of framework 22 keep constant owing to bonding agent 42,43.
Like this, the condenser microphone 21 of this execution mode of above-mentioned formation has the effect shown in following.
(1) on the part on the composition surface of a plurality of substrates 23,25 of range upon range of formation framework 22 and pedestal 24; Be provided with the exposed division 38～41 that resin is showed out that does not have conductive pattern 23b, 24b, 24c, 25c, opposing substrates that on this exposed division 38～41, is adhesively fixed 23,25 and pedestal 24.Therefore, and between level and smooth metal flat such as conductive pattern, thin bond layer is set and the existing structure of the parts such as pedestal and substrate that are adhesively fixed is compared, can obtains very strong adhesive strength.
(2) because on the composition surface of each substrate 23,25 and pedestal 24; Part except exposed division 38～41; Directly engage between conductive pattern 23b, 24b, 24c, the 25c, thereby can guarantee the good electrically conducting between substrate 23,25 and the pedestal 24.In addition, owing to need not use the conductive adhesive of the high price of having added conducting resinl, but it is bonding to use common bonding agent to carry out, thereby can also reduce manufacturing cost.
(3) owing to be to use the bonding agent that does not contain conducting resinl; Simultaneously parts of electric is that to utilize laser welding, arc welding or fluxless welding and solder flux as the fluxless fixation to clean welding etc. fixing, thereby from the solder flux of conducting resinl and scolder, produces gas can prevent reflow soldering the time.Therefore, can prevent in advance that the electric charge of electret layer from leaking, can obtain high performance condenser microphone.
(4) because as being used for the bonding agent between adhesive base plate 23,25 and the pedestal 24; Use the epoxy resin similar with aforesaid substrate 23,25 and pedestal 24; Thereby not only can improve the adhesive strength of 24 of substrate 23,25 and pedestals; And because substrate 23,25 and pedestal 24 is also roughly the same with the expansion rate of bonding agent, so can prevent because the adhesive portion that the difference of expansion rate causes is peeled off etc.
(5) owing to as adhesives, use as sclerosis shrinkage bonding agent and the high epoxy resin of sclerosis shrinkage, this bonding agent can shrink along with sclerosis significantly.Therefore not only can substrate 23,25 and pedestal 24 be furthered each other through bonding agent; Raising is as the intensity of condenser microphone 21; But also can improve the contact pressure between conductive pattern 23b, 24b, 24c, 25c, and guarantee conducting more reliably, improve the sealing of framework 22 simultaneously.
(6) because framework 22 integral body constitute by three layers, be different from existing formation, do not have liner therebetween, therefore can be beneficial to the miniaturization of microphone,, thereby can produce thermal deformation hardly simultaneously because liner is separated into 4 small pieces.Therefore, can prevent vibrating membrane excessively to be tightened or overrelaxation, can make it to become the good microphone of sensitivity because of the distortion of liner.
(7) utilize electrical insulators such as epoxy resin to form base main body 23a, the 25a of circuit substrate 23 and upper substrate 25, bury conductive layer 23d, the 25d that constitutes by Copper Foil etc. underground in the substantial middle portion of its thickness direction simultaneously, become multi-ply construction.Therefore, the rigidity of circuit substrate 23 and upper substrate 25 can be improved, to improve the mechanical strength of framework 22 integral body, the electromagnetic wave shielding of framework 22 can be improved simultaneously, to improve the reliability of microphone.
(8) in the manufacturing approach of condenser microphone 21, can make the bonding agent that between the composition surface, overflows drain to through hole 49a, 52b, 53a and through slot 52c, 52d side.Therefore, can prevent that bonding agent from flowing to the private side of framework 22, with the problems such as static capacity change that prevent that this bonding agent from causing.
(9) since the burr that produces when making cutting and separating condenser microphone 21 be on the position of through hole 49a, 52b, 53a at four angles of each condenser microphone 21; Outstanding can prevent to the lateral surface on each limit; Thereby under the first-class situation of substrate that condenser microphone 21 is installed to mobile phone, break down in the time of can preventing the operations such as dismounting of condenser microphone 21 in advance.
(10), adopt the heat-resisting adhering film that constitutes by the adhering film that is the main body with epoxy and thermoplastic resin etc. as between the downside exposed division 38 of each exposed division 40 that is used for bonding circuit substrate 23 respectively and framework pedestal 24 and the adhering part between the upside exposed division 39 of each exposed division 41 of upper substrate 25 and framework pedestal 24.Because this heat-resisting adhering film not only is convenient to operation, and the gas flow that is produced by the heat of reflow soldering seldom, thereby can prevent effectively that electric charge from leaking.
(the 2nd execution mode)
Below, with aforementioned the 1st execution mode different portions be the center, the 2nd execution mode of the present invention is described.
In the 2nd execution mode; Like Figure 13 and shown in Figure 14; The base main body 23a of circuit substrate 23 upper surface, contain four angles and on interior peripheral part, form exposed division 40; Four angles that contain of the upper and lower surface in the pedestal main body 24a of framework pedestal 24 form exposed division 39 on interior peripheral part, base main body 25 lower surfaces of upper substrate 25, contain four angles and on interior peripheral part, form exposed division 41.In addition, circuit substrate 23 and framework pedestal 24, framework pedestal 24 and upper substrate 25 39,41 of 40,39 of exposed divisions and exposed divisions, utilize similar bonding agent 42,43 bonding respectively.
On the other hand, the liner 30 that is made up of stainless steel forms the frame shape, at the upper surface of this liner 30 vibrating membrane 29 that is adhesively fixed.In addition, the assembly of this vibrating membrane 29 and liner 30 is layered between upper substrate 25 and the framework pedestal 24 and is adhesively fixed.Aforementioned liner 30 forms the hypotenuse 30a of portion on its four angles, and on the position corresponding with the 30a of this hypotenuse portion, as previously mentioned, utilizes the exposed division 39 of similar bonding agent 42,43 bonding framework pedestals 24 and the exposed division 41 of upper substrate 25.
The 2nd execution mode also can obtain and the roughly the same effect of effect described in aforementioned the 1st execution mode.
In addition, in the 2nd execution mode, form golden vapor deposition face, on vibrating membrane 29, form the reflex part 30b that turns back to upside simultaneously at the lower surface of vibrating membrane 29.Therefore, on the part of reflex part 30b, guarantee the electrically conducting between the conductive pattern 25c of golden vapor deposition face and upper substrate 25 of vibrating membrane 29, guarantee the electrically conducting between the conductive pattern 24b of liner 30 and framework pedestal 24 simultaneously.
(variation)
In addition, this execution mode can be specialized like following the distortion.
Can the present invention be embodied as the electret build condenser microphone of film type electret type, it replaces backboard 31 and makes vibrating membrane 29 have the function of electret.
Can the present invention be embodied as the condenser microphone of charge-pump type, it makes backboard 31 and vibrating membrane 29 all not have the electret function, but can apply voltage through charge pump circuit toward back plate 31 and vibrating membrane 29.
Can the present invention be embodied as in so-called MEMS (the micro electro mechanicalsystems) microphone, it will be housed in the framework by the microphone that semiconductor technology is produced.
(the 3rd execution mode)
Below, with aforementioned the 1st execution mode and the 2nd execution mode different portions be the center, with reference to Figure 15～Figure 19 the 3rd execution mode of the present invention is described.
Like Figure 15 and shown in Figure 16; Being configured to of the framework 122 of the condenser microphone 121 of this execution mode; Range upon range of flat circuit substrate 123 as installation base plate, as the framework pedestal 124 of the cubic frame shape of framework substrate and as the flat upper substrate 125 of top cover plate, utilize adhering film 127A, 127B to be fixed as one.Aforementioned circuit substrate 123, framework pedestal 124 and upper substrate 125 are made up of resinous electrical insulators such as epoxy resin.In this execution mode, above-mentioned parts is made up of glass cloth base material epoxy resin, but is not limited to epoxy resin.
Shown in Figure 18 (a), on the upper surface (in addition, also being referred to as the surface of circuit substrate 123) of circuit substrate 123, form the conductive pattern 123a, 123b, the 123c that constitute by Copper Foil as conductive component.In addition, the so-called upper surface in this specification is meant circuit substrate 123 is disposed at the below, framework pedestal 124 is disposed at face middle, that make progress when upper substrate 125 is disposed at the top that lower surface is meant downward face.In Figure 17, Figure 18 (a), for the ease of explanation, conductive pattern 123a, 123b, 123c represent with hatching.
Shown in Figure 18 (a); Conductive pattern 123a, the 1st end is at circuit substrate 123 upper surfaces, is near on end of length direction and the position near a side end of Width; The 2nd end 151 is at the upper surface of circuit substrate 123, to extending near central portion simultaneously.And the 1st end of conductive pattern 123a is as conducting portion 150.
Here, at circuit substrate 123 upper surfaces, respectively will with the axle of the Width of the central shaft O of the thickness direction that runs through circuit substrate 123 (Figure 18 (a) with reference to) quadrature as the x axle, with the axle of length direction as the y axle.
And; Upper surface at circuit substrate 123; With the x axle be symmetry axis and aforementioned conducting portion 150 lines symmetry regional P1, be symmetry axis with the symmetrical regional P2 of conducting portion 150 lines and with central shaft O with the y axle be central point and conducting portion 150 point-symmetric regional P3, be comprised in the zone (hereinafter is referred to as not have conductive pattern region) that conductive pattern is not set.In addition, so-called no conductive pattern region is at circuit substrate 123 upper surfaces, by aforementioned conductive pattern 123c encirclement, simultaneously with the zone except conductive pattern 123a, the 123b.Conductive pattern 123b is provided with in this execution mode a plurality of (in this execution mode being 4).
Aforementioned conductive pattern 123c is earthy conductive pattern, and is corresponding with the framework shape of framework pedestal 124 and be set at the frame shape.Conductive pattern 123a, 123b are used for the conductive pattern that parts connect, and are used for the power supply input and extract with numerical signal.
In addition, shown in Figure 17, Figure 18 (b), at the upper surface of the part of conductive pattern 123a～123c and do not have in the conductive pattern region, comprise that the face protected seam 152 of P1～P3 covers.In addition, for the ease of explanation, in Figure 18 (b), protective layer 152 usefulness hatchings illustrate.
In addition, the perimembranous of the frame shape of conductive pattern 123c becomes the not exposed portions serve of protected seam 152 coverings, and is relative with framework pedestal 124.
In addition, shown in Figure 18 (c), on the lower surface (also being referred to as the reverse side of circuit substrate 123) of circuit substrate 123, form a plurality of conductive pattern 123d, the 123e (only illustrating 1 conductive pattern 123d among Figure 15) that constitute by Copper Foil.In addition, in Figure 18 (c), for the ease of explanation, conductive pattern 123d, 123e represent with hatching.
And, on circuit substrate 123, being provided with a plurality of through hole 123g, the while forms not shown conductive layer through hole 123g's in interior week.And via the conductive layer of certain the several through hole 123g in these a plurality of through holes, aforementioned conductive pattern 123c is connected with the conductive pattern 123d of circuit substrate 123 lower surfaces.Among the conductive pattern 123d, its part becomes earth terminal.
In addition, via the conductive layer of all the other several through holes in these a plurality of through holes, conductive pattern 123a, 123b and the conductive pattern 123e that is arranged on circuit substrate 123 lower surfaces are connected, and it is connected with signal output terminal (not shown) and power input terminal (not shown).
In addition, shown in figure 15 in circuit substrate 123, be provided with the intermediate layer 123f that constitutes by Copper Foil, itself and the through hole 123g that is electrically connected between conductive pattern 123c and the conductive pattern 123d is electrically connected.
In addition, erecting bed effect transistor 126 on circuit substrate 123, its formation is arranged on the impedance transformation element as parts of electric in the framework 122.Field-effect transistor 126 is electrically connected with the 2nd end 151 of conductive pattern 123a and the end of certain the several conductive pattern 123b among a plurality of conductive pattern 123b.
In addition, also can on framework pedestal 124, form the final stage of conductive pattern and through hole, at conductive pattern 124a, the last coat of metal that forms once more of 124b.Like this, owing to compare with the through hole of having filled resin, conductive pattern 124a, 124b give prominence to the surface, thereby can increase the gap that adhering film 127A gets into, and increase adhesive strength.In addition, the conductive pattern 124a when conductive pattern 124a, the last further formation of the 124b coat of metal, the thickness of 124b are about preferred 25 μ m～40 μ m.
In Figure 19, Q1 representes to be arranged on the interior conductive pattern 124c scope of recess 124i of framework pedestal 124.As stated, through in the recess 124i on being arranged on the outside face of framework pedestal 124 conductive pattern 124c being set, can carry out electromagnetic shielding.The position that conductive pattern 124c is set is equivalent to electromagnetic shielding portion.
In addition, shown in figure 19 on the lateral surface of framework pedestal 124, the position 154a of conductive pattern 124c is not set, be arranged on the bight C of framework pedestal 124.The position 154a of conductive pattern 124c is not set, the part of the linking part 154 shown in the manufacturing approach of stating after the formation, the lateral surface of this position 154a is equivalent to not have electromagnetic shielding portion.In Figure 19, Q2 representes not have the scope of electromagnetic shielding portion.In addition, the conductive pattern 124b of lower face side is shown in figure 15, via the aforementioned conductive pattern 123c on the circuit substrate 123, is connected with the conductive pattern 123d of circuit substrate 123 lower surfaces.
And, in framework pedestal 124, utilize the upper and lower surface of aforementioned filling part 124j and the upper and lower surface of the position 154a of conductive pattern 124c is not set, form bonding region SRa, the SRb of roughly cubic frame shape.In addition, in Figure 19, only illustrate the bonding region SRa that is arranged on framework pedestal 124 upper surfaces.Bonding region is not limited to cubic frame shape, also can be other shape, and main points are, so long as get final product with the shaped as frame shape shapes similar of framework pedestal 124.
Like Figure 15, shown in Figure 16; The peristome periphery of framework pedestal 124 bottoms, be bonding region SRb; Utilization is configured in the adhering film 127A as bonding agent that becomes four square ring shapes in the aforementioned conductive pattern 123c outside, is adhesively fixed integratedly with aforementioned circuit substrate 123.In addition, the material of adhering film 127A can use with filling part 124j in the resin filler identical materials used.And,, accommodate and be configured in this framework pedestal 124 parts of electric of the aforementioned field effect transistor 126 on the circuit substrate 123.
In addition, the material of adhering film 127A can be the identical structure of the employed resin material part of substrate with the framework pedestal 124 of adhering film 127A.Like this, if adhering film 127A and circuit substrate 123 and upper substrate 125 all are and resin material part identical materials then can obtain same effect equally.
Shown in figure 15, on the upper and lower surface of aforementioned upper substrate 125, form the conductive pattern 125a, the 125b that constitute by Copper Foil etc.On upper substrate 125, be formed for picking up the sound hole 128 of sound from the outside.
Like Figure 15, shown in Figure 16; The peristome periphery on framework pedestal 124 tops, be bonding region SRa; Utilization is configured in the adhering film 127B as bonding agent that becomes cubic ring-type in the aforementioned conductive pattern 124a outside, and aforementioned upper substrate 125 integratedly is adhesively fixed.In addition, the material of adhering film 127B, can use with filling part 124j in the resin filler identical materials used.Like this, the peristome periphery on framework pedestal 124 tops links with upper substrate 125 via liner 129, vibrating membrane 130 integratedly.
Like Figure 15 and shown in Figure 16, between aforementioned framework pedestal 124 and upper substrate 125, grip the liner 129 of the ring-type that constitutes by the insulating properties film.In addition, liner 129 utilizes conductive adhesive and conductive pattern 124a bonding.At liner 129 upper surfaces, establish by PPS (polyphenylene sulfide) film etc. through bonding and to have the vibrating membrane 130 that the film of synthetic resin of insulating properties constitutes, form the conductive layer 130a that constitutes by golden vapor deposition at these vibrating membrane 130 lower surfaces.
On vibrating membrane 130 and liner 129, be provided with not shown through hole; Conductive layer 130a can (say via conducting resinl and the liner 129 and the framework pedestal 124 that are filled in this through hole exactly; Should be liner 129 and conductive pattern 124a) between conductive adhesive (not shown), with conductive pattern 124a conducting.
Shown in figure 15; On aforementioned upper substrate 125, form a plurality of through holes 136; On the inner peripheral surface of these through holes 136, be provided with and aforementioned conductive pattern 125a, the continuous conductive pattern 125c of 125b; In addition, filled conductive property bonding agent 137a in through hole 136 utilizes this conductive adhesive 137a and aforementioned conductive pattern 125c to form conductive part 137.This conductive part 137 turns back with lower surface with aforementioned vibrating membrane 130 and the conductive layer 130a of the reflex part 130b (with reference to Figure 15) that forms is electrically connected.In addition, also conductive adhesive 137a in the filling vias 136 and form conductive pattern 125c not, in addition, and also can be under the situation of the conductive pattern 125c in not forming through hole 136, filled conductive property bonding agent 137a only.In addition, through forming conductive pattern 125c and conductive adhesive 137a simultaneously, can improve conductivity and shielding.
And; The conductive pattern 125a of upper substrate 125,125b via conductive part 137, conductive layer 130a, be arranged on conductive adhesive and the conductive pattern 124a～124c on the framework pedestal 124 between conducting resinl, liner 129 and the conductive pattern 124a in the not shown through hole on the aforementioned vibrating membrane 130, form the conducting channel of the aforementioned earth terminal on circuit substrate 123.
In framework pedestal 124, on the lower surface of vibrating membrane 130, dispose backboard 131 relatively as pole plate across liner 129.This backboard 131 is to constitute through pasting PTFE film 131b such as (polytetrafluoroethylene) at the upper surface of the back plate main body 131a that is made up of corrosion resistant plate.This film 131b has been implemented the polarization of corona discharge and so on and handled, handled through this polarization, film 131b constitutes electret layer.In this execution mode, aforementioned backboard 131 constitutes backplane, and the condenser microphone of this execution mode constitutes back electret build.
In addition, the peripheral shape of aforementioned backboard 131 is littler than interior all shapes of framework pedestal 124, forms roughly elliptoid flat shape, between their inner and outer circumferential surfaces, forms gap P.Form open-work 132 at the central part of backboard 131, its air that is used to allow the vibration by aforementioned vibrating membrane 130 to cause moves.This backboard 131 through with stamping-out cutter (not shown) from film 131b side, be Figure 16 upper side downwards side blow cut out the stainless steel materials pasted film 131b and form.
Like Figure 15, shown in Figure 16; In aforementioned framework pedestal 124; Between backboard 131 and circuit substrate 123; With compressive state the holding member 133 that is made up of elastomeric material has been installed, has been utilized the elastic force of this holding member 133, backboard 131 by from the opposition side of vibrating membrane 130 to the direction pressurization of the lower surface butt of liner 129.Like this, can form the capacitance part of guaranteeing to have between them specified volume through between vibrating membrane 130 and backboard 131, keeping the interval of regulation.
Aforementioned holding member 133, the tow sides that are formed in corrosion resistant plate through stamping-out have been implemented gold-plated sheet material and have been formed, and have the 133a of frame portion of cubic ring-type roughly and oblique 4 outstanding 133b of foot from the both sides, four angle bottoms of the 133a of this frame portion.Therefore, between the 133b of foot below the 133a of frame portion, form space S.And in this execution mode, shown in figure 15, the aforementioned field effect transistor 126 on the circuit substrate 123 is configured between each a pair of 133b of foot of S in the aforesaid space.
Upper surface at the 133a of frame portion of aforementioned holding member 133; 4 contact sites 134 of the lower surface butt of outstanding formation and backboard 131 as the dome shape protuberance; The lower surface in the end of each 133b of foot gives prominence to forming 4 contact sites 135 as the dome shape protuberance simultaneously.
A 133b of foot among a plurality of 133b of foot contacts with conducting portion 150 via contact site 135; All the other each 133b of foot are at aforementioned circuit substrate 123 upper surfaces, contact with the protective layer that is positioned at regional P1～P3 152 upper surfaces in being included in no conductive pattern region via contact site 135.
In addition, in this condenser microphone 121, if arrive vibrating membranes 130 from the sound wave of sound source via the sound hole 128 of upper substrate 125, then this vibrating membrane 130 vibrates corresponding to frequency, amplitude and the waveform of sound.And along with the vibration of vibrating membrane 130, the interval between vibrating membrane 130 and the backboard 131 changes from set point, the impedance variations of capacitance part.The variation of this resistance value is exported after being transformed to voltage signal by impedance transformation element.
The condenser microphone of this execution mode; On the positive and negative of framework pedestal 124, have bonding region SRa, SRb; Be not via metal level, but it is last to utilize bonding agent respectively upper substrate 125, circuit substrate 123 that parts of electric is installed to be bonded to whole bonding region SRa, the SRb of framework pedestal 124 positive and negatives.Its result can improve insulated substrate Kc (core) and the insulated substrate Kc (core) of circuit substrate 123 and framework pedestal 124 and the cementability between the upper substrate 125 of framework pedestal 124.
In addition, all are same materials owing to be positioned at upper and lower surface, upper substrate 125 and circuit substrate 123, filling part 124j and the bonding agent of the aforementioned filling part 124j of bonding region SRa, SRb, thereby can not damage cementability.
In addition, this execution mode can also be out of shape as follows and specialize.
Zero aforementioned embodiments is to constitute backboard 131a with corrosion resistant plate, but also can constitute with brass sheet, or with formations such as titanium plates.
Zero also can constitute in the manufacturing approach of condenser microphone of film type electret type of vibrating membrane 130 at the macromolecule membrane of being used by electret, uses the present invention.
Zero also can use the present invention in the manufacturing approach of the condenser microphone of the charge-pump type with booster circuit.Under situation about constituting like this, can replace electret layer, on vibrating membrane 130 and backboard 131, electrode respect to one another is set.
Zero in addition, and the electret capcitor microphone of back electret build has been described in aforementioned embodiments, but the electret capcitor microphone of electret build before also can applying the present invention to.
Zero impedance transformation element that is installed on the circuit substrate 123 of aforementioned embodiments is an illustration, as long as can detect the well-known device of static capacity change, can adopt any method of operating of analog/digital.
Claims (7)
1. microphone framework, it has plastic pedestal, penetrates the space that is provided for accommodating the electroacoustic converter unit in this pedestal; Opening for inaccessible this space; Plastic substrate is engaged with aforementioned pedestal, conductive layer is set respectively on the composition surface of pedestal and substrate, two conductive layers are electrically connected; It is characterized in that
The exposed division that synthetic resin is separately showed out is set on the composition surface of aforementioned pedestal and substrate, and pedestal and substrate are adhesively fixed on this exposed division.
2. microphone framework according to claim 1 is characterized in that,
Constitute pedestal and substrate by same type of material, utilize adhering part bonding this pedestal and the substrate similar simultaneously with them.
3. microphone framework according to claim 2 is characterized in that,
As adhering part, use heat-resisting adhering film.
4. microphone framework according to claim 2 is characterized in that,
As adhering part, use sclerosis shrinkage adhering part.
5. microphone framework according to claim 3 is characterized in that,
An opening of the inaccessible pedestal of substrate of parts of electric has been installed in utilization, utilizes inaccessible another opening of the substrate that forms sound hole simultaneously.
6. microphone framework according to claim 5 is characterized in that,
Utilize the fluxless fixation that aforementioned parts of electric is fixed on the aforesaid base plate.
7. microphone framework according to claim 1 is characterized in that,
In aforementioned microphone framework,
Positive and negative at the framework substrate with metal level is provided with bonding region, utilizes bonding agent respectively the circuit substrate of upper substrate, installation parts of electric to be bonded on this bonding region,
Utilize bonding agent that upper substrate and the circuit substrate that parts of electric is installed are adhesively fixed respectively on whole bonding regions of aforementioned framework substrate positive and negative, and without the aforementioned metal layer.
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006205201A JP4740059B2 (en) | 2006-07-27 | 2006-07-27 | Microphone housing and condenser microphone |
| JP2006-205201 | 2006-07-27 | ||
| JP2006205201 | 2006-07-27 | ||
| JP2006322998 | 2006-11-30 | ||
| JP2006-322998 | 2006-11-30 | ||
| JP2006322998A JP5049571B2 (en) | 2006-11-30 | 2006-11-30 | Capacitor microphone manufacturing method and capacitor microphone |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101115326A CN101115326A (en) | 2008-01-30 |
| CN101115326B true CN101115326B (en) | 2012-10-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101296455A Expired - Fee Related CN101115326B (en) | 2006-07-27 | 2007-07-27 | Microphone case and condenser microphone |
Country Status (2)
| Country | Link |
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| JP (1) | JP4740059B2 (en) |
| CN (1) | CN101115326B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010103735A (en) * | 2008-10-23 | 2010-05-06 | Star Micronics Co Ltd | Method for manufacturing microphone |
| JP2010103734A (en) * | 2008-10-23 | 2010-05-06 | Star Micronics Co Ltd | Method for manufacturing microphone and microphone |
| CN105264575B (en) * | 2013-05-31 | 2017-12-26 | 日本电产三协株式会社 | Coin detected body identification device |
| CN108141667A (en) * | 2015-07-12 | 2018-06-08 | 怀斯迪斯匹有限公司 | Adaptive SNR ultra low power ultra-low noise microphones |
| CN113055798B (en) * | 2019-12-26 | 2022-08-16 | 西人马联合测控（泉州）科技有限公司 | Electret condenser microphone and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2325944Y (en) * | 1997-10-09 | 1999-06-23 | 孙明汉 | Vibration type microphone |
| CN1510965A (en) * | 2002-12-24 | 2004-07-07 | ��ǿ�ʽ | Micruophone device and bracket for it |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09199824A (en) * | 1995-11-16 | 1997-07-31 | Matsushita Electric Ind Co Ltd | Printed wiring board and its mounting body |
| JPH1098254A (en) * | 1996-09-24 | 1998-04-14 | Matsushita Electric Works Ltd | Method for soldering electronic components |
| JP2001102875A (en) * | 1999-10-01 | 2001-04-13 | Hosiden Corp | Semiconductor amplifier circuit and semiconductor electret capacitor microphone |
| JP2002335599A (en) * | 2001-03-06 | 2002-11-22 | Sharp Corp | Microphone and its manufacturing method |
| JP4095354B2 (en) * | 2002-06-19 | 2008-06-04 | 三菱電機株式会社 | Metal substrate and manufacturing method thereof |
-
2006
- 2006-07-27 JP JP2006205201A patent/JP4740059B2/en not_active Expired - Fee Related
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2325944Y (en) * | 1997-10-09 | 1999-06-23 | 孙明汉 | Vibration type microphone |
| CN1510965A (en) * | 2002-12-24 | 2004-07-07 | ��ǿ�ʽ | Micruophone device and bracket for it |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2002－335599A 2002.11.22 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101115326A (en) | 2008-01-30 |
| JP4740059B2 (en) | 2011-08-03 |
| JP2008035109A (en) | 2008-02-14 |
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