CN101110461A - 利用衍射效应的表面微柱阵列结构高效率发光二极管 - Google Patents
利用衍射效应的表面微柱阵列结构高效率发光二极管 Download PDFInfo
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- CN101110461A CN101110461A CNA2007100754403A CN200710075440A CN101110461A CN 101110461 A CN101110461 A CN 101110461A CN A2007100754403 A CNA2007100754403 A CN A2007100754403A CN 200710075440 A CN200710075440 A CN 200710075440A CN 101110461 A CN101110461 A CN 101110461A
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- light
- emitting diode
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- 230000000694 effects Effects 0.000 title claims abstract description 10
- 239000000758 substrate Substances 0.000 claims abstract description 8
- 229910052594 sapphire Inorganic materials 0.000 claims abstract description 7
- 239000010980 sapphire Substances 0.000 claims abstract description 7
- 230000000737 periodic effect Effects 0.000 claims description 9
- 239000013078 crystal Substances 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000009792 diffusion process Methods 0.000 abstract 1
- 239000004038 photonic crystal Substances 0.000 abstract 1
- 238000000605 extraction Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000000576 coating method Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000009795 derivation Methods 0.000 description 2
- 125000002015 acyclic group Chemical group 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000001427 coherent effect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/10—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a light reflecting structure, e.g. semiconductor Bragg reflector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/22—Roughened surfaces, e.g. at the interface between epitaxial layers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
Abstract
Description
Claims (7)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNA2007100754403A CN101110461A (zh) | 2007-07-31 | 2007-07-31 | 利用衍射效应的表面微柱阵列结构高效率发光二极管 |
US12/174,059 US20090032834A1 (en) | 2007-07-31 | 2008-07-16 | Highly efficient led with microcolumn array emitting surface |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNA2007100754403A CN101110461A (zh) | 2007-07-31 | 2007-07-31 | 利用衍射效应的表面微柱阵列结构高效率发光二极管 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN101110461A true CN101110461A (zh) | 2008-01-23 |
Family
ID=39042416
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNA2007100754403A Pending CN101110461A (zh) | 2007-07-31 | 2007-07-31 | 利用衍射效应的表面微柱阵列结构高效率发光二极管 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20090032834A1 (zh) |
CN (1) | CN101110461A (zh) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102157632A (zh) * | 2011-01-12 | 2011-08-17 | 山东大学 | 一种利用ZnO纳米锥阵列提高LED发光效率的方法 |
CN102263183A (zh) * | 2011-08-23 | 2011-11-30 | 苏州大学 | 一种偏振出光发光二极管 |
CN102711303A (zh) * | 2009-05-12 | 2012-10-03 | 松下电器产业株式会社 | 板、发光装置及板的制造方法 |
CN102751417A (zh) * | 2012-07-24 | 2012-10-24 | 山东大学 | 带有ZnO微米图形阵列的LED管芯及其制备方法 |
WO2014048014A1 (zh) * | 2012-09-29 | 2014-04-03 | 海迪科(苏州)光电科技有限公司 | 高效高压led芯片 |
CN106025020A (zh) * | 2016-06-24 | 2016-10-12 | 闽南师范大学 | 具有高反射欧姆接触电极的短波紫外led芯片制造方法 |
CN106129208A (zh) * | 2016-07-07 | 2016-11-16 | 南京大学 | 紫外发光二极管芯片及其制造方法 |
CN109980058A (zh) * | 2019-02-28 | 2019-07-05 | 江苏大学 | 一种具有空气孔光子晶体结构的高出光效率二极管 |
CN111864120A (zh) * | 2020-09-11 | 2020-10-30 | 合肥福纳科技有限公司 | 一种qled及其制作和提高其出光率的方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10355163B1 (en) * | 2018-01-30 | 2019-07-16 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Flexible LED device and method for manufacturing same |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5779924A (en) * | 1996-03-22 | 1998-07-14 | Hewlett-Packard Company | Ordered interface texturing for a light emitting device |
US7083993B2 (en) * | 2003-04-15 | 2006-08-01 | Luminus Devices, Inc. | Methods of making multi-layer light emitting devices |
AU2003257713A1 (en) * | 2003-08-08 | 2005-02-25 | Vichel Inc. | Nitride micro light emitting diode with high brightness and method of manufacturing the same |
-
2007
- 2007-07-31 CN CNA2007100754403A patent/CN101110461A/zh active Pending
-
2008
- 2008-07-16 US US12/174,059 patent/US20090032834A1/en not_active Abandoned
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102711303A (zh) * | 2009-05-12 | 2012-10-03 | 松下电器产业株式会社 | 板、发光装置及板的制造方法 |
CN102711303B (zh) * | 2009-05-12 | 2015-02-25 | 松下电器产业株式会社 | 板、发光装置及板的制造方法 |
CN102157632A (zh) * | 2011-01-12 | 2011-08-17 | 山东大学 | 一种利用ZnO纳米锥阵列提高LED发光效率的方法 |
CN102157632B (zh) * | 2011-01-12 | 2012-07-04 | 山东大学 | 一种利用ZnO纳米锥阵列提高LED发光效率的方法 |
CN102263183A (zh) * | 2011-08-23 | 2011-11-30 | 苏州大学 | 一种偏振出光发光二极管 |
CN102751417A (zh) * | 2012-07-24 | 2012-10-24 | 山东大学 | 带有ZnO微米图形阵列的LED管芯及其制备方法 |
CN102751417B (zh) * | 2012-07-24 | 2015-04-08 | 山东大学 | 带有ZnO微米图形阵列的LED管芯及其制备方法 |
WO2014048014A1 (zh) * | 2012-09-29 | 2014-04-03 | 海迪科(苏州)光电科技有限公司 | 高效高压led芯片 |
CN106025020A (zh) * | 2016-06-24 | 2016-10-12 | 闽南师范大学 | 具有高反射欧姆接触电极的短波紫外led芯片制造方法 |
CN106129208A (zh) * | 2016-07-07 | 2016-11-16 | 南京大学 | 紫外发光二极管芯片及其制造方法 |
CN109980058A (zh) * | 2019-02-28 | 2019-07-05 | 江苏大学 | 一种具有空气孔光子晶体结构的高出光效率二极管 |
CN111864120A (zh) * | 2020-09-11 | 2020-10-30 | 合肥福纳科技有限公司 | 一种qled及其制作和提高其出光率的方法 |
Also Published As
Publication number | Publication date |
---|---|
US20090032834A1 (en) | 2009-02-05 |
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Owner name: SHENZHEN UNIVERSITY; APPLICANT Free format text: FORMER OWNER: OUYANG ZHENGBIAO; APPLICANT Effective date: 20080912 |
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C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20080912 Address after: 3688, Nanhai Avenue, Guangdong, Shenzhen, Shenzhen University, Nanshan District 518060, China Applicant after: Shenzhen University Co-applicant after: Ouyang Zhengbiao Address before: 3688, Nanhai Avenue, Guangdong, Shenzhen, Shenzhen University, Nanshan District 518060, China Applicant before: Zheng-Biao Ouyang Co-applicant before: Xu Guiwen |