CN101107702A - Processing system and its operation method - Google Patents
Processing system and its operation method Download PDFInfo
- Publication number
- CN101107702A CN101107702A CNA2006800028138A CN200680002813A CN101107702A CN 101107702 A CN101107702 A CN 101107702A CN A2006800028138 A CNA2006800028138 A CN A2006800028138A CN 200680002813 A CN200680002813 A CN 200680002813A CN 101107702 A CN101107702 A CN 101107702A
- Authority
- CN
- China
- Prior art keywords
- processing module
- processing
- module
- conveyance
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Disclosed is a method for running a treatment system provided with a plurality of process modules for subjecting substrates to mutually identical treatments. When each process module is conditioned for preparing the execution of a predetermined process recipe, at each completion of the conditioning of one process module, the sequential transfers of untreated substrates are started on a substrate transfer route from a cassette for housing the untreated substrates to that process module, and the sequential processes on the untreated substrates by using that process module are started. Even if the conditioning time periods are uneven between the process modules of identical specifications, the treatment system can be efficiently run.
Description
Technical field
The present invention relates to integrated inline process type (inline-type) treatment system that is provided with a plurality of processing modules (processmodule) around the conveying unit, particularly at many or organize more and carry out the treatment system of same treatment in fact in the processing module side by side.
Background technology
For example integrated equipment (cluster tool) is the treatment system that adopts following structure: it is configured in a plurality of processing modules around the main carrying room, make it possible to carry out identical or different processing continuously or simultaneously, be typically by semiconductor-fabricating device and adopted (for example with reference to JP2000-127069A).
In the treatment system of this integrated equipment, each processing module comprises the each several part action that is used in the control module and state and to handling the processing module controller of carrying out control, and the transport mechanism in the main carrying room comprises the conveyance module controller of the action that is used to control its conveyance order and carrying arm.And, master controller that the unified control system of exchange on one side is all and the scheme information control signal between the module controller etc., on one side carry out the regulation of being undertaken repeatedly with some cycles and certain conveyance mode by each processing module the monolithic substrate transferring handling and undertaken by transport mechanism.Particularly ought or organize under the situation of the processing of carrying out same scheme in the processing module side by side more, can make the production efficiency multiplication of single or Combined Processing at many.
Above-mentioned treatment system in long-time operation continuously down, can obtain high productivity usually thus, and has the so-called flexibility (reply) that can the alignment processing scheme realizes varied processing.In this case, at the place etc. at intermittence that make to handle in batches, intrasystem substrate transferring all stops, and manages throughout in the module, because new processing scheme need be used to the adjusting (conditioning) that the inside modules condition is consistent with set point the suitable time of cost.The representative of this condition has, the temperature in the process chamber of processing module or the chamber, inwall state etc.As the temperature in the chamber, particularly keep substrate and be important the temperature of its pedestal that heats (susceptor).
But even at many or organize the processing of carrying out same approach in the processing module, because of the difference of machine difference, also there is deviation in the time that reaches each condition enactment value between processing module more.For example, as treatment temperature, though the design temperature in the scheme is 600 ℃, about the set point of base-plate temp, some processing modules are 590 ℃, and other processing module set point then is 610 ℃.In addition, even the set point of base-plate temp is identical, manage throughout in the module, its sensitivity of temperature sensor is also different because of the machine difference, and thus, the time that its judgement reaches set point also can produce deviation.In this case, the moment that adjusting finishes has nothing in common with each other for each processing module and has deviation, and the maximum of many more these times of platform number of processing module and the difference of minimum value are just big more.
In existing integrated equipment, even if the processing module that the adjusting of the processing scheme that is used for newly beginning is not finished has only one, other all processing module also all can be placed in holding state, regulates all processing modules of the moment of finishing in last processing module and brings into operation together.But system is not operation in fact fully during above-mentioned holding state, therefore, also has room for improvement aspect productivity.
Summary of the invention
The present invention proposes in view of above-mentioned prior art problems, its purpose is to provide a kind of treatment system, even there is deviation in each processing module for its adjusting time of processing of expectation, also can effectively utilize all resources of system as much as possible to boost productivity.
To achieve these goals, first aspect present invention provides a kind of treatment system, it is characterized in that, comprising: a plurality of processing modules constitute each substrate are implemented identical in fact processing; Conveyer, be connected with around it above-mentioned a plurality of processing module and within it portion comprise first transfer module with first transport mechanism, this conveyer constitutes from the box body of taking in a plurality of substrates each substrate transferring any to above-mentioned a plurality of processing modules; And controller, control the action of above-mentioned conveyer and above-mentioned a plurality of processing modules, wherein, above-mentioned controller is controlled above-mentioned conveyer and above-mentioned a plurality of processing module, make and be used to that respectively above-mentioned a plurality of processing module is become under the situation of the adjusting that can implement above-mentioned treatment state, finish when regulating for one in above-mentioned a plurality of processing modules, above-mentioned handling system begins conveyance substrate one by one from above-mentioned box body in the conveyance path of having finished the processing module of adjusting towards above-mentioned, and begins the substrate in above-mentioned one processing module of having finished adjusting is handled one by one.
Junior one substrate when beginning one by one the conveyance substrate and even the conveyance starting point of a plurality of substrates there is no need in box body.The starting point of conveyance can be in the arbitrary position on from box body to the conveyance path of handling module.That is, till conveyance zero hour, can make the optional position standby of substrate in the conveyance path.
In addition, the invention provides a kind of treatment system, it is characterized in that, comprise: a plurality of processing modules, these a plurality of processing modules comprise multiple and every kind have a plurality of, make it possible to set many group processing module groups, this processing module group is made up of multiple processing module, can carry out the Combined Processing that is made of a series of a plurality of processing; Conveyer, be connected with around it above-mentioned a plurality of processing module and within it portion comprise first transfer module with first transport mechanism, this conveyer constitutes from the box body of taking in a plurality of substrates each substrate transferring any to above-mentioned a plurality of processing modules; And controller, control the action of above-mentioned conveyer and above-mentioned a plurality of processing modules, wherein, above-mentioned controller is controlled above-mentioned conveyer and above-mentioned a plurality of processing module, make under the situation of the adjusting that is used to make above-mentioned a plurality of processing module become the above-mentioned treatment state that to implement to be assigned with respectively, whenever being combined into immediately of the processing module that in the completed processing module of adjusting, can implement above-mentioned Combined Processing, set this combination as above-mentioned processing module group, above-mentioned conveyer begins on the conveyance path of the above-mentioned processing module group of setting substrate is one by one being carried out conveyance from above-mentioned box body, and begins the substrate in the processing module group of setting is handled one by one.
Second aspect present invention provides a kind of method of operation of treatment system, it is characterized in that: above-mentioned treatment system comprises: a plurality of processing modules constitute each substrate are implemented identical in fact processing; And conveyer, from the box body of taking in a plurality of substrates with each substrate transferring any to above-mentioned a plurality of processing modules, wherein, be used to that respectively above-mentioned a plurality of processing module is become under the situation of the adjusting that can implement above-mentioned treatment state, finish when regulating for one in above-mentioned a plurality of processing modules, above-mentioned handling system begins conveyance substrate one by one from above-mentioned box body in the conveyance path of having finished the processing module of adjusting towards above-mentioned, and begins the substrate in above-mentioned one processing module of having finished adjusting is handled one by one.
In addition, the invention provides a kind of method of operation of treatment system, it is characterized in that, comprise: above-mentioned treatment system comprises: a plurality of processing modules, these a plurality of processing modules comprise multiple and every kind have a plurality of, make it possible to set many group processing module groups, this processing module group is made up of multiple processing module, can carry out the Combined Processing that is made of a series of a plurality of processing; And conveyer, this conveyer from the box body of taking in a plurality of substrates with each substrate transferring to above-mentioned a plurality of processing modules, wherein, under the situation of the adjusting that is used to make above-mentioned a plurality of processing module become the above-mentioned treatment state that to implement to be assigned with respectively, whenever being combined into immediately of the processing module that in the completed processing module of adjusting, can implement above-mentioned Combined Processing, set this combination as above-mentioned processing module group, above-mentioned conveyer begins on the conveyance path of the above-mentioned processing module group of setting substrate is one by one being carried out conveyance from above-mentioned box body, and begins the substrate in the processing module group of setting is handled one by one.
Description of drawings
Fig. 1 is the general view of the treatment system structure of expression one embodiment of the present invention.
Fig. 2 be used to illustrate vacuum conveyance machine shown in Figure 1 pick up the push action ideograph.
Fig. 3 be explanation in the treatment system shown in Figure 1 control and the block diagram in conveyance path.
Fig. 4 is the figure that a stage of effect when carrying out single the processing in treatment system is described.
Fig. 5 is the figure that another stage of effect when carrying out single the processing in treatment system is described.
Fig. 6 is the figure in a stage again that effect when carrying out single the processing in treatment system is described.
Fig. 7 is the figure that first example of its effect when carrying out Combined Processing in treatment system is described.
Fig. 8 is the figure that second example of its effect when carrying out Combined Processing in treatment system is described.
Fig. 9 is the key diagram in a stage of the effect in expression first example shown in Figure 7.
Figure 10 is the key diagram in a stage of the effect in expression second example shown in Figure 8.
Figure 11 is the general view of the formation of the treatment system of other execution modes among the present invention.
Embodiment
Fig. 1 is the pie graph of the treatment system of the integrated equipment (cluster tool) in expression one embodiment of the present invention.This treatment system is to dispose many (for example four) processing module (processmodule) PM around delivery module (transfermodule) TM that constitutes central carrying room annularly
1, PM
2, PM
3, PM
4With two load-lock modules (loadlock module) LLM
1, LLM
2The multi-cavity chamber system.Each module has the vacuum chamber or the process chamber that can form pressure reduction space under the vacuum degree of hope respectively.The delivery module TM of central part is by the gate valve GV that opens and closes according to need and each module PM of periphery
1, PM
2, PM
3, PM
4, LLM
1, LLM
2Be connected.
Indoor at delivery module TM is provided with and has a pair of rotatable flexible carrying arm F
A, F
BVacuum conveyance machine (robot) RB
1This conveyance machine RB
1At vacuum conveyance module controller MC
TControl (Fig. 3) is running down, each carrying arm F
A, F
BCan go up keep for example semiconductor wafer (hereinafter to be referred as (wafer)) of a handled object at its forked end actuator (end effector), gate valve GV that can be by being in open mode is selectively with carrying arm F
A, F
BThe either party with respect to around each module PM
1, PM
2, PM
3, PM
4, LLM
1, LLM
2Insert or extract, wafer is moved into (loading: load)/take out of (unloading: unloading).Two carrying arm F
A, F
BLift-launch can rotatablely move on the mutually opposite both direction of machine body integratedly, and carrying arm constitute can be in situ and telescopic moving between the progressive position (in the module).
Processing module PM
1, PM
2, PM
3, PM
4Have mounting table or the pedestal that keeps wafer to use in separately chamber interior, respectively at the module controller MC of processing separately
1, MC
2, MC
3, MC
4Under the control (Fig. 3), use firmly (means) (handling gas, electric power etc.) of regulation to come the indoor temperature of control chamber, pressure, electric field, magnetic field, processing gas concentration etc., the monolithic of stipulating is thus handled, for example film forming such as CVD or sputter processing, heat treatment, dry ecthing processing etc.
At load-lock module LLM
1, LLM
2Inside, can be provided with heating part or cooling end as required.Load-lock module LLM
1, LLM
2Be connected with loading module (loader module) LM that normal atmosphere is depressed by gate valve (the perhaps family of power and influence (door valve)) GV in an opposite side with delivery module TM.And, with adjacent load port LP and detent mechanism (orientor) ORT of being provided with of this loading module LM.Load port LP be used for and outside conveyance car between put into or take out wafer case CR.Detent mechanism ORT is used for the plane of orientation (orientation flat) of wafer W or makes groove (notch) be positioned at assigned position or direction.In addition, in illustrative execution mode, delivery module TM and loading attachment LM constitute the conveyer of treatment system inside.
Be arranged on the atmosphere conveyance machine RB in the loading module LM
2Have telescopic carrying arm, can the last along continuous straight runs of straight-line guidance body (linear guide) LA move and can lifting, rotation, it is at atmosphere conveyance module controller MC
LControl (Fig. 3) is action down, at load port LP, detent mechanism ORT and load-lock module LLM
1, LLM
2Between move back and forth wafer with the one or more units of conveyance.Wherein, straight-line guidance body LA is made of with magnet exciting coil and gage outfit (Scale head) permanet magnet, driving, implements conveyance machine RB according to the order that comes autonomous controller
2Linear drives control.
Herein, to being used to utilize any processing module in this integrated equipment (cluster tool) (PM for example
1) the basic wafer transfer that makes the wafer of the wafer case CR that puts into load port LP accept single processing describes in proper order.In this system during the conveyance wafer, in order to make each several part program run according to the rules, device controller (equipmentcontroller) EC and conveyance (atmosphere conveyance, vacuum conveyance) module controller MC in all systems of unified control
T, MC
LHandle module controller MC with each
1, MC
2, MC
3, MC
4Between carry out the exchange (Fig. 3) of data necessary and control signal.In addition, the structure of the control system in this integrated equipment (cluster tool) is only represented in Fig. 3, will omit diagram in other figure.
The conveyance machine RB of loading module LM
2Take out a wafer W the wafer case CR from load port LP
i, and with this wafer W
iConveyance makes it towards assigned position to detent mechanism ORT, is transferred to load-lock module LLM after finishing above-mentioned action again
1, LLM
2In either party (LLM for example
1).Under atmospheric pressure state with wafer W
iConveyance is to the load-lock module LLM as the handover target
1In.Then, utilization is schemed unshowned exhaust apparatus and is evacuated indoor, and under decompression state with wafer W
iBe handed off to the vacuum conveyance machine RB of transfer module TM
1
Conveyance machine RB
1Use carrying arm F
A, F
BOne of them is from load-lock module LLM
1Take out wafer W
i, then make its rotation predetermined angular aim at this processing module PM
1, will be from load-lock module LLM
1The wafer W of taking out
iConveyance is to processing module PM
1Processing module PM
1Implementing monolithic according to predefined scheme down in the condition (gas, pressure, High frequency power, time etc.) of defined handles.
After this monolithic processing finishes, conveyance machine RB
1From processing module PM
1Take out of wafer W
i, and turn back to load-lock module LLM
1, LLM
2Either party (LLM for example
2).This load-lock module LLM
2If move into the wafer W of finishing dealing with
i, then indoorly switch to atmospheric pressure state from decompression state.After this, the conveyance machine RB of loading module LM
2Load-lock module LLM from atmospheric pressure state
2The middle wafer W of taking out
iAnd it is turned back in the corresponding wafer case CR.Wherein, can also be at load-lock module LLM
1, LLM
2In under the atmosphere of expectation wafer W to being detained
iImplement heating or cooling processing.
(the PM for example of any group processing module in utilizing this integrated equipment (cluster tool)
1, PM
2) to a wafer W
iImplement under the situation of Combined Processing, by the first processing module PM
1Carrying out the monolithic of first operation handles.After this first processing finishes, conveyance machine RB
1Will be from processing module PM
1The wafer W of taking out of
iThen move into second processing module (PM for example
2).At the second processing module PM
2In, under defined terms, implement the monolithic of second operation according to predefined scheme and handle.
When this second when finishing dealing with, conveyance machine RB
1With wafer W
iFrom the second processing module PM
2Take out of, and then move into load-lock module LLM
1, LLM
2The either party.At load-lock module LLM
1, LLM
2Situation during with wafer transfer between the load port LP and above-mentioned single the processing is identical.
In this embodiment, the conveyance machine RB of transfer module TM
1Has aforesaid a pair of carrying arm F
A, F
B, can be with respect to each the processing module PM around it
1, PM
2, PM
3, PM
4Carry out replacing wafer that this processing module handled and then should moving by placements (pick-and-place) of picking up that this processing module is accepted the wafer handled by sequence of operations.
Herein, describe picking up to place to move with reference to Fig. 2.Conveyance machine RB
1Shown in Fig. 2 (A), should move into target processing module PM
n(the handle before) wafer W that is untreated
jRemain on for example F of single carrying arm
AOn, make the opposing party's carrying arm F
BBe in the vacant state that does not have wafer and aim at this processing module PM
nThen, shown in Fig. 2 (B), (C), be in the carrying arm F of vacant state
BBe inserted into this processing module PM
nChamber in, and therefrom with the wafer W of handling
iTake out (picking up (pick) action).Secondly, shown in Fig. 2 (D), make carrying arm F
A, F
BThe Rotate 180 degree will maintain untreated wafer W
jCarrying arm F
APlace processing module PM
nThe front.Then, shown in Fig. 2 (E), (F), carrying arm F
ABe inserted into this processing module PM
nChamber in this wafer W
jBe handed off on the inner mounting table or supporting pin, and extract the carrying arm F that is in vacant state out
A(placing (place) action).Wherein, during this picks up the placement action, be arranged on this processing module PM
nThe wafer gateway on gate valve GV (Fig. 1) be in open mode all the time.
And, conveyance machine RB
1Can be with respect to each load-lock module LLM
1, LLM
2Place action by same as described above picking up and carry out the replacing of wafer.In addition, once pick up when placing action, can behind picking action, carry out at once and place action when carrying out, in addition, also can be behind picking action at interval shorter stand-by time carry out and place action.And, conveyance machine RB
1Also can carry out wafer W separately
iThe picking action of taking out of or with wafer W
jThe placement action of moving into.
In the treatment system of this integrated equipment, processing module PM
1, PM
2, PM
3, PM
4In many by constituting with a kind of machine, at this moment, can be in these many processing modules carry out the same treatment scheme simultaneously side by side.As an example, at processing module PM
1, PM
2, PM
3, PM
4When all being made of the CVD device of same machine, these four machines can carry out the film forming of same scheme simultaneously side by side to be handled.In this case, as shown in Figure 3, in internal system, at the wafer case CR and each the processing module PM that are arranged on the load port LP
1, PM
2, PM
3, PM
4Between be set with wafer W toward multiplexing conveyance path.Wherein, in illustrated conveyance path, omit the expression of detent mechanism ORT.
In more detail, at load port LP and each load-lock module LLM
1, LLM
2Between to be provided with atmosphere be conveyance path S
A, this atmosphere is conveyance path S
AVia loading module LM, promptly by atmosphere conveyance machine RB
2With one is the reciprocal conveyance wafer W of unit.This conveyance path S
ABe all co-channels of process of all wafers W.In addition, at load-lock module (LLM
1, LLM
2) and each processing module PM
1, PM
2, PM
3, PM
4Between to be provided with vacuum be conveyance path S
B, S
1, S
2, S
3, S
4, these vacuum are conveyance path S
B, S
1, S
2, S
3, S
4Via delivery module TM, promptly utilize vacuum conveyance machine RB
1With one is the reciprocal conveyance wafer W of unit.At this, S
BBe at load-lock module (LLM
1, LLM
2) and vacuum conveyance machine RB
1Between the common conveyance path all passed through of all wafers W.On the other hand, S
1, S
2, S
3, S
4Be to be arranged on vacuum conveyance machine RB side by side
1With each processing module PM
1, PM
2, PM
3, PM
4Between the conveyance path, on each conveyance path, respectively by belong to be divided into four groups wafer W each the group wafer.
At this, that Fig. 3 illustrates is whole processing module PM
1, PM
2, PM
3, PM
4The conveyance of internal system order during running.As an example, four substrate W in the wafer case CR
i, W
I+1, W
I+2, W
I+3According to W
i, W
I+1, W
I+2, W
I+3Order respectively at processing module PM
1, PM
2, PM
3, PM
4The middle film forming of accepting same scheme is handled.In this case, first wafer W
iBegin via progress path (outlet) S from load port LP
A→ S
B→ S
1Moved into and handled module PM
1Then, second wafer W
I+1Begin via outlet S from load port LP
A→ S
B→ S
2Moved into and handled module PM
2Then, the 3rd wafer W
I+2Begin via outlet S from load port LP
A→ S
B→ S
3Moved into and handled module PM
3At last, the 4th wafer W
I+3Begin via outlet S from load port LP
A→ S
B→ S
4Moved into and handled module PM
4
Then, finish the wafer W of above-mentioned processing at first
iFrom processing module PM
1Beginning is via return path (loop) S
1→ S
B→ S
AAnd turn back to the wafer case CR of load port LP.Secondly, second wafer W of finishing above-mentioned processing
I+1From processing module PM
2Beginning is via loop S
2→ S
B→ S
ATurn back to the wafer case CR of load port LP.Once more, the 3rd wafer W of finishing above-mentioned processing
I+2From processing module PM
3Beginning is via loop S
3→ S
B→ S
ATurn back to the wafer case CR of load port LP.At last, the 4th wafer W of finishing described processing
I+3From processing module PM
4Beginning is via loop S
4→ S
B→ S
ATurn back to the wafer case CR of load port LP.
Wherein, when from processing module PM
1Take out of first wafer W
iThe time, make from load port LP via outlet S
A→ S
B→ S
1And the 5th wafer W of coming
I+4Place operation and this first wafer W by above-mentioned picking up
iExchange and it is moved into handle module PM mutually
1Then, when from processing module PM
2Take out of second wafer W
I+1The time, make from load port LP via outlet S
A→ S
B→ S
2And the 6th wafer W of coming
I+5Place operation and this second wafer W by above-mentioned picking up
I+1Exchange and it is moved into processing module PM mutually
2Then, when from processing module PM
3Take out of the 3rd wafer W
I+2The time, make from load port LP via outlet S
A→ S
B→ S
3And the 7th wafer W of coming
I+6Place operation and the 3rd wafer W by above-mentioned picking up
I+2Exchange and it is moved into processing module PM mutually
3At last, when from processing module PM
4Take out of the 4th wafer W
I+3The time, make from load port LP via outlet S
A→ S
B→ S
4And the 8th wafer W of coming
I+7Place operation and the 4th wafer W by above-mentioned picking up
I+3Exchange and it is moved into processing module PM mutually
4
But in this treatment system, when the change processing sequence, at the place at intermittence that handles in batches, the conveyance action of internal system substrate all stops, and manages module PM throughout
1, PM
2, PM
3, PM
4In, because of needing cost, new processing sequence is used to make inside modules condition (for example the state of the temperature of pedestal, chamber inner wall etc.) and fiducial value or the corresponding to adjusting of normal condition the suitable time.Usually, there is difference in the required time of this adjusting in each module.That is, as described in the explanation of prior art, even the processing module of same size, there is deviation in (for example the temperature of pedestal rises to temperature from standby and handles with the required time of temperature) also can to regulate the needed time owing to the machine difference makes.
This treatment system begins actual processing according to following order when implementing this adjusting.For example, establish each processing module PM
1, PM
2, PM
3, PM
4Middle PM
2Finish adjusting at first.At this moment, processing module PM
2Module controller MC
2Notice is regulated the specified states shows signal of finishing (ready (ready) signal) be sent to device controller EC.Thus, device controller EC is to conveyance (atmosphere conveyance, vacuum conveyance) module controller MC
T, MC
LThe notice foregoing.Then, at these module controllers MC
2, MC
T, MC
LControl under, processing module PM
2, atmosphere conveyance machine RB
2, load-lock module (LLM
1, LLM
2) and vacuum conveyance machine RB
1Begin action respectively, as shown in Figure 4, at conveyance path S
A→ S
B→ S
2Middle beginning conveyance substrate.That is, with untreated substrate W
1, W
2, W
3, W
4... according to some cycles from the wafer case CR of load port LP via outlet S
A→ S
B→ S
2One by one be sent to processing module PM in turn
2Then, with the substrate W that finishes dealing with
1, W
2, W
3, W
4... according to some cycles from processing module PM
2Via loop S
2→ S
B→ S
AOne by one return to the wafer case CR of load port LP in turn.At this moment, at processing module PM
2In, by conveyance machine RB
1Pick up and place operation, with next substrate W
I+1Move into the substrate W that the quilt of handling with replacement is taken out of
i
And then, establish processing module PM
4Make second wafer finish adjusting.At this moment, from processing module PM
4Module controller MC
4To device controller EC transmitter ready signal, and to transfer module controller MC
T, MC
LAlso notify this information.Thus, processing module PM
4Come into operation conveyance path S shown in Figure 5
A→ S
B→ S
4Set up.That is, hereto from by processing module PM
2The independent running of carrying out begins, to being converted to by PM
2, PM
4Two when operating side by side till, not only at conveyance path S
A→ S
B→ S
2On carry out substrate transferring, at conveyance path S
A→ S
B→ S
4On also carry out substrate transferring.In this case, as a certain substrate W
iUtilize processing module PM
2During accept handling from processing module PM
4When sending standby ready signal, next substrate W
I+1Can be from outlet S
A→ S
B→ S
2Move to conveyance path S
A→ S
B→ S
4Handled module PM and move into
4At this moment, substrate W
I+1Next substrate W
I+2Arrived conveyance path S by conveyance
A→ S
B→ S
2, substrate W
I+2Next substrate W
I+3Arrived conveyance path S by conveyance
A→ S
B→ S
4The substrate of back and the like.Wherein, conveyance path S
A→ S
B→ S
4On conveyance with respect to conveyance path S
A→ S
B→ S
2On conveyance have the official hour error, and periodically the circulation carry out.When set up in new conveyance path, also there was the official hour error in the conveyance on this new conveyance path with respect to the conveyance on this conveyance path of having set up before afterwards, and circulation is carried out periodically.
Then, establish processing module PM
1Make the 3rd wafer finish adjusting.At this moment, remain from processing module PM
1Module controller MC
1Standby ready signal is sent to device controller EC, and to transfer module controller MC
T, MC
LAlso notify this information.Thus, processing module PM
1Also come into operation, as shown in Figure 6, conveyance path S
A→ S
B→ S
1Set up.That is, hereto from by PM
2, PM
4Two paired runnings begin, and are converted to by PM
2, PM
4, PM
1Till three paired runnings, except at conveyance path S
A→ S
B→ S
2, S
A→ S
B→ S
4Outside the conveyance substrate, moving path S
A→ S
B→ S
1Also begin the conveyance substrate.In this case, at any substrate W
i, W
I+1Respectively by processing module PM
2, PM
4During accept handling from processing module PM
1When sending standby ready signal, next substrate W
I+2Can be from outlet S
A→ S
B→ S
2Move to conveyance path S
A→ S
B→ S
1And quilt is moved into processing module PM
1In this case, substrate W
I+2Next substrate W
I+3At S
A→ S
B→ S
2Go up by conveyance substrate W
I+3Next substrate W
I+4At S
A→ S
B→ S
4Go up by conveyance substrate W
I+4Next substrate W
I+5At S
A→ S
B→ S
1Go up by conveyance.
Then, last if processing module PM
3Finish adjusting, then afterwards identical with Fig. 3, four runnings side by side together become at the conveyance path of four systems S
A→ S
B→ S
2, S
A→ S
B→ S
4, S
A→ S
B→ S
1, S
A→ S
B→ S
3On carry out the conveyance of substrate.And, in this example with PM
2, PM
4, PM
1, PM
3Reiteration carry out the conveyance of substrate or move into/take out of.
Like this, in the present embodiment, in the adjusting before actual treatment begins, when at processing module PM
1, PM
2, PM
3, PM
4In arbitrary in when finishing, even at intrasystem conveyance path S
A→ S
B→ S
1, S
A→ S
B→ S
2, S
A→ S
B→ S
3, S
A→ S
B→ S
4In any establishment, then on this conveyance path, begin substrate transferring immediately, and in this processing module PM, carry out monolithic repeatedly and handle action with some cycles, therefore, can in system, effectively utilize movable resource, productivity is improved.
In addition, in this embodiment, so-called be meant: the processing module on this conveyance path relatively at beginning substrate transferring on each conveyance path, after adjusting has been finished, begin to be used for the conveyance action that initial substrate W is moved into, before this zero hour, substrate W can be in the optional position in the conveyance zone, be load port LP, loading module LM, load-lock module (LLM
1, LLM
2) and the interior optional position standby of transfer module TM.Therefore, for example, in above-mentioned example, at processing module PM
4When finishing second wafer adjusting, untreated next substrate W
I+1In delivery module TM, promptly at vacuum conveyance machine RB
1Carrying arm on during standby, beginning conveyance path S
A→ S
B→ S
4On substrate transferring, with this substrate W
I+1Move into and handle module PM
4
The treatment system of this integrated equipment can be carried out the Combined Processing of same scheme side by side in two groups of processing modules.For example, handling by a row formula (in line) continuous film forming in the application that forms the employed Ti/TiN laminated film of metallic bulkhead in the Si processing, can be at processing module PM
1, PM
3The middle CVD device that is used to form the Ti of lower floor film is at processing module PM
2, PM
4The middle CVD device that is used to form upper strata TiN film.In this case, the compound mode of processing module has two kinds, [PM just shown in Figure 7
1→ PM
2], [PM
3→ PM
4] compound mode and [PM shown in Figure 8
1→ PM
4], [PM
3→ PM
2] compound mode.Also can select wherein any one compound mode regularly, in the present embodiment, can select a kind of in these two kinds arbitrarily, select wherein a kind of compound mode conditionally according to the order of adjusting described later deadline.
Wherein, under the situation of Fig. 7, at load-lock module (LLM
1, LLM
2) and wherein one group (being called [A group] for the purpose of convenient) processing module [PM
1→ PM
2] between be provided with folk prescription to conveyance path S
1→ S
a→ S
2, on this conveyance path, utilize the vacuum conveyance machine RB of transfer module TM
1With one is unit conveyance wafer W.Here, S
1Be from load-lock module (LLM
1, LLM
2) to first operation processing module PM
1The conveyance path, S
aBe from processing module PM
1To second operation processing module PM
2The conveyance path, S
2Be from processing module PM
2Get back to load-lock module (LLM
1, LLM
2) the conveyance path.
Untreated wafer W
iFrom load-lock module (LLM
1, LLM
2) via conveyance path S
1Arrived processing module PM by conveyance
1, and accept the processing (processing of Ti film forming) of first operation at this.If the processing of this first conveyance operation finishes, wafer W and then then
iFrom processing module PM
1Via conveyance path S
aMoved into and handled module PM
2, and accept the processing (processing of TiN film forming) of second operation at this.If the processing of this second operation finishes, wafer W and then then
iFrom processing module PM
1Via conveyance path S
2Returned load-lock module (LLM by conveyance
1, LLM
2).Manage module PM throughout
1, PM
2In, place action by picking up of conveyance machine wafer is taken out of/moved into.
And, in Fig. 7, at load-lock module (LLM
1, LLM
2) and another group (being called [B group] for the purpose of convenient) processing module [PM
3→ PM
4] between, be provided with folk prescription to conveyance path S
3→ S
b→ S
4, on this conveyance path, utilize the vacuum conveyance machine RB of transfer module TM
1With one is unit conveyance wafer W.Here, S
3Be from load-lock module (LLM
1, LLM
2) to first operation processing module PM
3The conveyance path, S
bBe from processing module PM
3To second operation processing module PM
4The conveyance path, S
4Be from processing module PM
4Get back to load-lock module (LLM
1, LLM
2) the conveyance path.
Untreated wafer W
jFrom load-lock module (LLM
1, LLM
2) via conveyance path S
3Moved into and handled module PM
3, and accept the processing (processing of Ti film forming) of first operation at this.Then, if the processing of this first conveyance operation finishes, wafer W and then then
iFrom processing module PM
3Via conveyance path S
bMoved into and handled module PM
4, and accept the processing (processing of TiN film forming) of second operation at this.If the processing of this second operation finishes, wafer W and then then
jFrom processing module PM
4Via conveyance path S
4Returned load-lock module (LLM by conveyance
1, LLM
2).Manage module PM throughout
3, PM
4In, place action wafer is taken out of/moved into by a series of picking up.
In Fig. 7, as all conveyance modes, from the wafer case CR of load port LP via atmosphere conveyance path S
A-S
BPut into load-lock module (LLM
1, LLM
2) substrate W, in the vacuum space, via conveyance path S
1→ S
a→ S
2By A group processing module [PM
1→ PM
2] accept the situation of first and second treatment process continuously and via conveyance path S with a row formula (in line)
3→ S
b→ S
4By B group processing module [PM
3→ PM
4] accept the situation of first and second treatment process continuously with a row formula, be spaced apart certain hour difference one by one alternately separately.Then, be recycled to load-lock module (LLM
1, LLM
2) each substrate from here via atmosphere conveyance path S
A-S
BBe back to the wafer case CR of load port LP.
In Fig. 8, at load-lock module (LLM
1, LLM
2) and another group (being called [C group] for the purpose of convenient) processing module [PM
1→ PM
4] between, be provided with folk prescription to conveyance path S
1→ S
c→ S
2, on this conveyance path, utilize the vacuum conveyance machine RB of transfer module TM
1With one is unit conveyance wafer W.Here, S
1Be from load-lock module (LLM
1, LLM
2) to first operation processing module PM
1The conveyance path, S
cBe from processing module PM
1To second operation processing module PM
4The conveyance path, S
4Be from processing module PM
4Get back to load-lock module (LLM
1, LLM
2) the conveyance path.
And, in Fig. 8, at load-lock module (LLM
1, LLM
2) and another group (being called [D group] for the purpose of convenient) processing module [PM
3→ PM
2] between, be provided with folk prescription to conveyance path S
3→ S
d→ S
2, on this conveyance path, utilize the vacuum conveyance machine RB of transfer module TM
1With one is unit conveyance wafer W.Here, S
3Be from load-lock module (LLM
1, LLM
2) to first operation processing module PM
3The conveyance path, S
dBe from processing module PM
3To second operation processing module PM
2The conveyance path, S
2Be from processing module PM
2Get back to load-lock module (LLM
1, LLM
2) the conveyance path.
The compound mode of Fig. 8 is equivalent to replace mutually second operation processing module PM in the compound mode of Fig. 7
2, PM
4Therefore, the conveyance mode of Fig. 8 is equivalent to mutual alternate process module PM in the conveyance mode of Fig. 7
2, PM
4
So, when in many group processing modules, carrying out the Combined Processing of same scheme side by side, in each module, carry out separately respectively, have deviation so regulate the time that finishes owing to regulate.In this treatment system, begin actual treatment in the following order.
For example, at processing module PM
1, PM
2, PM
3, PM
4In, PM
1Finish adjusting at first.At this constantly, second operation processing module PM
2, PM
4In any all be in the adjustment state, so PM
1Can only former state keep in the holding state.Then, wherein at PM
2, PM
4In any PM for example
2Finish the moment of adjusting, as shown in Figure 9, A group processing module [PM
1→ PM
2] set up, begin to carry out conveyance path S
A-S
B-(S
1→ S
a→ S
2) on substrate transferring.Thus, in this treatment system, can one by one implement to utilize the processing module [PM of A group to the wafer W among the wafer case CR
1→ PM
2] the row formula Combined Processing (formation of the laminated film of Ti/TiN) of carrying out.
Afterwards, even remaining processing module PM
3, PM
4In one finish adjusting, also have only the processing module PM of A group
1, PM
2This system keeps the operating condition of work, and is last, at processing module PM
3, PM
4In another also finish and regulate constantly conveyance path S
A-S
B-(S
3→ S
b→ S
4) on substrate transferring also begin the processing module [PM of B group
3→ PM
4] come into operation.But, as processing module PM
3Than processing module PM
4Fulfil ahead of schedule under the situation of adjusting, if predict at processing module PM
3Carry out one time first operation and handle processing module PM during (processing of Ti film forming)
4Adjusting can finish the time, at processing module PM
4Adjusting finish before, can regard processing module PM as
4Finish adjusting, and can begin processing module PM
3Running and conveyance path S
A-S
B-(S
3→ S
b→ S
4) on substrate transferring.So, after all be the processing module [PM of A group
1→ PM
2] with the processing module [PM of B group
3→ PM
4] all operating modes of these two systems, all carry out repeatedly periodically about the conveyance of various piece in the described conveyance mode of Fig. 7.
Above-mentioned prediction is by processing module PM
4Module controller MC
4Carry out by device controller EC.That is module controller MC,
4Scheme (preorder scheme (prologue recipe), pre-treatment scheme etc.) information according to the contents processing of stipulating to regulate is held processing module PM according to step unit
4In adjusting progress situation, calculate to regulate T remaining time that finishes
R, and one by one it is upgraded.Device controller EC is from module controller MC
4T remaining time that change the real-time time of reception
RData, with T remaining time that receives
RFiducial value or setting T with defined
SCompare, at T remaining time
RLess than setting T
sThe moment begin to carry out conveyance path S
A-S
B-(S
3→ S
b→ S
4) on substrate transferring.
When carrying out prediction, device controller EC is by transfer module controller MC
T, MC
LSupervision is load port LP, loading module LM, load-lock module (LLM in the conveyance field
1, LLM
2) and delivery module TM in be in the position of the untreatment base W of holding state, and calculate and from this position of readiness this substrate W moved into first of B group and handle and use processing module PM
3In the first required conveyance time T
aThen, in this first conveyance time T
aOn add that this substrate W handles and at processing module PM in order to accept first
3The interior scheme time T of stagnating
bWith processing module PM
3This substrate W after interior stagnation finishes is from processing module PM
3Taken out of the second required conveyance time T
cThereby, calculate minimum required time (T
a+ T
b+ T
c).Then, determine the above setting T of this minimum required time
sUsually, can will should the decision of minimum required time be setting T
sThus, at processing module PM
3In only finish the substrate W that handles for one time first, can not need to waste the stand-by period that there is no need, at processing module PM
4Adjusting directly moved into after finishing and handled module PM
4In.
Wherein, move if in conveyance zone (load port LP～delivery module TM), be in the untreatment base W of holding state, then the first conveyance time T
aChange the setting T that it is each accordingly with its position
sAlso can upgrade thereupon.In addition, if being in the untreated substrate W of holding state in conveyance zone (load port LP～delivery module TM) has a plurality of, then both can selected reference according to the rules select a substrate W, and perhaps also can select a plurality of substrate W and calculate separately setting T respectively as above-mentioned prediction judgment standard
sAfter, Rule of judgment according to the rules adopts a setting T
s
T remaining time in the processing module in the adjusting
RReduce along with the process of time.On the other hand, in the conveyance field, be in the substrate W of holding state, be positioned at upstream one side, its first conveyance time T
aLong more, setting T
sBig more.Therefore, because remaining time T
RUsually when initial at the setting T of the substrate that is positioned at the upstream-most position standby
sBelow, so can use this substrate W as above-mentioned judgment standard.But, for regulating uncompleted remaining processing module PM
4, at beginning T remaining time
RMoment of monitoring, this remaining time T
RMight be at the setting T of the substrate W of upstream position standby
sBelow.Under these circumstances, should get than this remaining time of T
RBecome the judgment standard of peaked downstream substrate W in the little setting as above-mentioned prediction.
Wherein, above-mentioned prediction is for the processing module [PM of the A group that brings into operation earlier and work
1→ PM
2], at the conveyance path S corresponding with it
A-S
B-(S
1→ S
a→ S
2) on substrate transferring situation about beginning under also be suitable for.That is, described in above-mentioned example, at the first processing processing module PM
1Be that the junior one is finished under the situation of adjusting, device controller EC is by module controller MC
2, MC
4To two processing module PM
2, PM
4T remaining time separately
RCompare, select short side (the processing module PM in the above-mentioned example
2) T remaining time
RThen, the setting T of the untreatment base in downstream position standby in the conveyance zone
SLess than this remaining time of T
RThe time, can begin conveyance path S
A-S
B-(S
1→ S
a→ S
2) on substrate transferring.
In above-mentioned example, the order of finishing in adjusting for example is PM
3, PM
2, PM
1, PM
4Situation under, as shown in figure 10, at PM
3, PM
2Adjusting moment of finishing, the processing module [PM of D group
3→ PM
2] set up, can begin conveyance path S
A-S
B-(S
3→ S
d→ S
2) on substrate transferring.Afterwards, from PM
1, PM
4Adjusting moment of finishing, can begin S
A-S
B-(S
1→ S
c→ S
4) on substrate transferring, the processing module [PM of C group
1→ PM
4] come into operation, consequently according to compound mode among Fig. 8 and conveyance mode, whole module and whole transport mechanisms all come into operation in the system.
In addition, in above-mentioned example, be PM if regulate the order of finishing
3, PM
1, PM
4, PM
2, then at PM
4Adjusting finish constantly PM
3, PM
1In any and PM
4Combination makes B organize processing module [PM
3→ PM
4] or C group processing module [PM
1→ PM
4] set up, thereby can begin conveyance path S
A-S
B-(S
3→ S
b→ S
4) or conveyance path S
A-S
B-(S
1→ S
c→ S
4) on substrate transferring.Herein, as B group processing module [PM
3→ PM
4] set up conveyance path S
A-S
B-(S
3→ S
b→ S
4) on substrate transferring when beginning, afterwards at PM
2Adjusting finish constantly A group processing module [PM
1→ PM
2] set up, from this moment, conveyance path S
A-S
B-(S
1→ S
a→ S
2) on substrate transferring also begin to add, the result, according to compound mode among Fig. 7 and conveyance mode, whole module and whole transport mechanisms come into operation in the system.In addition, at PM
4Adjusting finish constantly C group processing module [PM
1→ PM
4] set up conveyance path S
A-S
B-(S
1→ S
c→ S
4) on substrate transferring situation about beginning under, afterwards at PM
2Adjusting finish constantly D group processing module [PM
3→ PM
2] set up, from this moment, conveyance path S
A-S
B-(S
3→ S
d→ S
2) on substrate transferring also begin to add, the result is according to as compound mode among Fig. 8 and conveyance mode, whole module and whole transport mechanisms come into operation in the system.
Under other situation, at processing module PM
1, PM
2, PM
3, PM
4Between regulate the order finish multiple situation arranged, the processing module of finishing adjusting under any situation is at first operation processing module PM
1, PM
3With second operation processing module PM
2, PM
4The moment of finishing adjusting more than one is arranged respectively, can work out and to carry out one group of processing module that a row formula combined type is handled, the conveyance of beginning substrate on the conveyance path corresponding with it.Then, in the end one (the 4th) processing module is finished the moment of adjusting, and remaining one group of processing module comes into operation, and also begins to carry out the conveyance of substrate on the conveyance path corresponding with it.Thus, can in system, effective utilization can operate resource, thereby increase productivity.
Be applicable to that the device that integrated equipment of the present invention is not limited in above-mentioned execution mode constitutes (Fig. 1), in the formation of planning and designing, each several part etc., various variations can be arranged.For example, two machines in the above-mentioned execution mode and put the load-lock module (LLM of type
1, LLM
2), be to be that the wafer W of staying advance (being untreated) is put by unit with one, be that unit puts and stays the wafer W of returning (handling) with one, and also can make the wafer W and return wafer W and put simultaneously and stay of advancing.But, at atmosphere is that conveyance path and vacuum are that the mode that the load-lock module is set between the conveyance path is arbitrarily, for example, both can be designed to the structure of the shared load-lock module in whole conveyances path, also can be designed to the structure of the load-lock module of each conveyance path special use.
In addition, as shown in figure 11, transfer module TM is extended in the horizontal direction, the structure (being 6 in the example of Figure 11) that the platform number of the processing module that allows to be connected with transfer module TM, promptly can operate in integrated equipment increases.In the example of this formation, in transfer module TM, lay two tracks 10 that extend in the longitudinal direction, conveyance machine RB
1Have can straight line moves on track 10 slide block (slider) 12.In addition, this conveyance machine RB
1Have a pair of on two directions that are in acute angle (for example 60 degree) telescopic carrying arm F
A, F
B, have at these two carrying arm F
A, F
BUtilization is picked up and is placed action can be rotated smaller angle when each module is inserted in turn relatively speciality.
In the integrated equipment of Figure 11, if can make whole 6 processing module PM
1～PM
6Implement single processing side by side with part or all common scheme, then can weave into two groups or three groups of processing modules being used for implementing side by side Combined Processing with part or all common processing scheme.In any arranged mode, all be suitable for the method that begins the substrate transferring on the substrate transferring path in above-mentioned prediction (supposition) mode.
Particularly, constitute under the situation of one group of Combined Processing by first processing module of handling continuously in turn, second processing module and the 3rd processing module, from remaining the moment that last does not finish the 3rd processing module of adjusting, monitor T remaining time of the 3rd processing module in real time
R, in the conveyance zone, be in the setting T of the regulation untreatment base of holding state
SAt this remaining time of T
RWhen following, can begin the substrate transferring on this conveyance path.
Under such situation, for setting T
s; this substrate is handled the first conveyance time of using processing module from position of readiness to moving into first; this substrate W handles the first scheme time of being detained in order to accept first in this first processing module; this substrate W after delay in this first processing module finishes is taken out of and is moved into second from here and handled with the second conveyance time in the processing module; this substrate W handles the alternative plan time of being detained in order to accept second in this second processing module; the 3rd conveyance time that this substrate W after finishing with delay in this second processing module is taken out of from here adds obtains minimum required time, decision setting T in this scope more than minimum required time together
S
Wherein, in the above-described embodiment, the vacuum conveyance machine RB in the transfer module TM
1With the atmosphere conveyance machine RB in the loading module LM
2Separately respectively by module controller MC
T, MC
LControl.But, also can or control vacuum conveyance machine RB side by side by a controller while
1With atmosphere conveyance machine RB
2Similarly, also can make whole processing module controller MC
1, MC
2, MC
3, MC
4By a controller control.
Treatment system of the present invention is not limited in the treatment system that the such vacuum of above-mentioned execution mode is, the treatment system that part or all of treatment system has the processing section of atmosphere system also can be suitable for.Handled object also is not limited only to semiconductor wafer, and the various substrates that plasma display is used, shadow mask, CD substrate, printed base plate etc. all can be suitable for.
Claims (12)
1. a treatment system is characterized in that, comprising:
A plurality of processing modules constitute each substrate are implemented identical in fact processing;
Conveyer, be connected with around it described a plurality of processing module and within it portion comprise first transfer module with first transport mechanism, this conveyer constitutes from the box body of taking in a plurality of substrates each substrate transferring any to described a plurality of processing modules; And
Controller is controlled the action of described conveyer and described a plurality of processing modules, wherein,
Described controller is controlled described conveyer and described a plurality of processing module, make and be used to that respectively described a plurality of processing module is become under the situation of the adjusting that can implement described treatment state, finish when regulating for one in described a plurality of processing modules, described handling system begins conveyance substrate one by one from described box body in the conveyance path of having finished the processing module of adjusting towards described, and begins the substrate in described one processing module of having finished adjusting is handled one by one.
2. treatment system according to claim 1 is characterized in that:
Described controller, described conveyer and described a plurality of processing module are controlled, make after the adjusting of two above processing modules finishes, in a certain order and certain cycle along the conveyance path corresponding untreatment base is moved into the processing module of finishing adjusting with each processing module, and take out of towards the conveyance path corresponding with it from the substrate that the processing module that finishes described processing one by one will be finished processing.
3. a treatment system is characterized in that, comprising:
A plurality of processing modules, these a plurality of processing modules comprise multiple and every kind have a plurality ofly, make it possible to set many group processing module groups, this processing module group is made up of multiple processing module, can carry out the Combined Processing that is made of a series of a plurality of processing;
Conveyer, be connected with around it described a plurality of processing module and within it portion comprise first transfer module with first transport mechanism, this conveyer constitutes from the box body of taking in a plurality of substrates each substrate transferring any to described a plurality of processing modules; And
Controller is controlled the action of described conveyer and described a plurality of processing modules, wherein,
Described controller is controlled described conveyer and described a plurality of processing module, make under the situation of the adjusting that is used to make described a plurality of processing module become the described treatment state that to implement to be assigned with respectively, whenever being combined into immediately of the processing module that in the completed processing module of adjusting, can implement described Combined Processing, set this combination as described processing module group, described conveyer begins on the conveyance path of the described processing module group of setting substrate is one by one being carried out conveyance from described box body, and begins the substrate in the processing module group of setting is handled one by one.
4. treatment system according to claim 3 is characterized in that:
Described controller is controlled described conveyer and described a plurality of processing module, make and setting more than two groups after the processing module group,, from the processing module of the group of finishing described Combined Processing, will finish the substrate of processing one by one and take out of along untreatment base being moved into each processing module group of having set according to a definite sequence and some cycles towards the conveyance path corresponding with it with the corresponding conveyance of each processing module path.
5. treatment system according to claim 3 is characterized in that:
Described Combined Processing comprises that first of last operation is handled and second processing of back one operation,
Each is organized processing module and comprises any that is used for carrying out described first first group of processing module handling and be used for carrying out any of described second second group of processing module handling.
6. treatment system according to claim 3 is characterized in that:
Described controller is controlled described conveyer, make in belonging to described first group a plurality of first processing modules one to fulfil ahead of schedule under the situation of described adjusting than any that belongs in described second group a plurality of second processing modules, described second processing module that described adjusting is being carried out in prediction is finished described adjusting required remaining time separately respectively, when the shortest remaining time during less than the stipulated standard value, can think that the processing module combination that comprises first processing module of finishing the described adjusting that can realize described Combined Processing sets up, begin to carry out the substrate transferring on the conveyance path corresponding with first processing module of finishing described adjusting.
7. treatment system according to claim 6 is characterized in that:
Described controller according to the first conveyance time and the scheme time and the second conveyance time and decide described fiducial value, wherein, the described first conveyance time is that the untreatment base that should move in first processing module of having finished described adjusting is extremely moved into the required time of this first processing module from present location, the described scheme time is the time that described substrate is detained in described first processing module in order to accept described first processing, and the described second conveyance time is that the described substrate that has finished the delay in described first processing module is taken out of the required time from described first processing module.
8. treatment system according to claim 5 is characterized in that:
Described controller is set at the first processing module group with finishing the processing module of finishing described adjusting in the processing module of described adjusting and the described second group of processing module at first in described first group of processing module at first, and second processing module of finishing described adjusting in second processing module of finishing described adjusting and the described second group of processing module in described first group of processing module is set at the second processing module group.
9. according to each described treatment system in the claim 1～8, it is characterized in that:
Described processing module has respectively and is used to keep described substrate and to its pedestal that heats, and when described controller becomes the signal of setting in the temperature that receives the described pedestal of expression from described processing module, judges to regulate and finishes.
10. according to each described treatment system in the claim 1～8, it is characterized in that:
Described processing module has the vacuum chamber that is used for carrying out described processing under decompression state respectively,
Described first transfer module is the vacuum transfer module with the vacuum transfer chamber that is used for conveyance substrate under decompression state, and described first transport mechanism is configured in the described vacuum carrying room, wherein,
Described treatment system also comprises:
Under atmospheric pressure support the load port of described box body;
Atmospheric pressure transfer module, this atmospheric pressure transfer module be connected with described load port and within it portion have second transport mechanism; With
At least one load-lock module, this load-lock module is set between described atmospheric pressure transfer module and the described vacuum transfer module, constitute for the substrate that makes conveyance between these atmospheric pressure transfer modules and described vacuum transfer module temporarily rests on its inside and can selectively its inside be switched to atmospheric pressure state or decompression state
Described conveyance path between described box body and the described processing module is via described atmospheric pressure transfer module, described load-lock module and described vacuum transfer module.
11. the method for operation of a treatment system is characterized in that:
Described treatment system comprises: a plurality of processing modules constitute each substrate are implemented identical in fact processing; With
Conveyer, from the box body of taking in a plurality of substrates with each substrate transferring any to described a plurality of processing modules, wherein,
Be used to that respectively described a plurality of processing module is become under the situation of the adjusting that can implement described treatment state, finish when regulating for one in described a plurality of processing modules, described handling system begins conveyance substrate one by one from described box body in the conveyance path of having finished the processing module of adjusting towards described, and begins the substrate in described one processing module of having finished adjusting is handled one by one.
12. the method for operation of a treatment system is characterized in that:
Described treatment system comprises: a plurality of processing modules, these a plurality of processing modules comprise multiple and every kind have a plurality of, make it possible to set many group processing module groups, this processing module group is made up of multiple processing module, can carry out the Combined Processing that is made of a series of a plurality of processing; With
Conveyer, this conveyer from the box body of taking in a plurality of substrates with each substrate transferring to described a plurality of processing modules, wherein,
Under the situation of the adjusting that is used to make described a plurality of processing module become the described treatment state that to implement to be assigned with respectively, whenever being combined into immediately of the processing module that in the completed processing module of adjusting, can implement described Combined Processing, set this combination as described processing module group, described conveyer begins on the conveyance path of the described processing module group of setting substrate is one by one being carried out conveyance from described box body, and begins the substrate in the processing module group of setting is handled one by one.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005293726 | 2005-10-06 | ||
| JP293726/2005 | 2005-10-06 | ||
| JP057592/2006 | 2006-03-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101107702A true CN101107702A (en) | 2008-01-16 |
| CN100511629C CN100511629C (en) | 2009-07-08 |
Family
ID=39000618
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006800028138A Active CN100511629C (en) | 2005-10-06 | 2006-10-06 | Processing system and operation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100511629C (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101930906B (en) * | 2009-06-23 | 2012-09-26 | 东京毅力科创株式会社 | Vacuum interlocking chamber with in-built adapter unit |
| CN109729737A (en) * | 2016-09-09 | 2019-05-07 | 东京毅力科创株式会社 | The adjusting method of inspection system and its additional device used |
| CN111213227A (en) * | 2017-10-19 | 2020-05-29 | 瑞士艾发科技 | Method and apparatus for processing a substrate |
-
2006
- 2006-10-06 CN CNB2006800028138A patent/CN100511629C/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101930906B (en) * | 2009-06-23 | 2012-09-26 | 东京毅力科创株式会社 | Vacuum interlocking chamber with in-built adapter unit |
| CN109729737A (en) * | 2016-09-09 | 2019-05-07 | 东京毅力科创株式会社 | The adjusting method of inspection system and its additional device used |
| CN109729737B (en) * | 2016-09-09 | 2023-08-25 | 东京毅力科创株式会社 | Method for adjusting inspection system and auxiliary device used in same |
| CN111213227A (en) * | 2017-10-19 | 2020-05-29 | 瑞士艾发科技 | Method and apparatus for processing a substrate |
| CN111213227B (en) * | 2017-10-19 | 2023-10-13 | 瑞士艾发科技 | Method and apparatus for processing a substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100511629C (en) | 2009-07-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4884801B2 (en) | Processing system | |
| JP5492553B2 (en) | Substrate processing equipment | |
| KR101876577B1 (en) | Wafer-processing apparatus | |
| US9632499B2 (en) | Work-in-progress substrate processing methods and systems for use in the fabrication of integrated circuits | |
| US20090003825A1 (en) | Substrate processing system | |
| JP6017134B2 (en) | Production efficiency system, production efficiency device, and production efficiency method | |
| KR101840578B1 (en) | Substrate processing method and substrate processing device | |
| CN105551998A (en) | Buffer station for thermal control of semiconductor substrates and method of transferring semiconductor substrates | |
| TWI557524B (en) | A production processing system, a control device for production processing, a control method for production processing, and a control program for production processing | |
| KR20100129211A (en) | Substrate processing apparatus, substrate processing method, and storage medium | |
| CN100511629C (en) | Processing system and operation method thereof | |
| KR20150100532A (en) | Substrate processing method and substrate processing apparatus | |
| US9250623B2 (en) | Methods and systems for fabricating integrated circuits utilizing universal and local processing management | |
| CN107731710A (en) | For improving the platform architecture of system productivity | |
| TWI770598B (en) | Substrate processing method, substrate processing apparatus, and computer readable recording medium | |
| JP2000091401A (en) | Cassette carrying system, semiconductor aligner, and reticle-carrying method | |
| KR101079487B1 (en) | Method and apparatus for enhanced operation of substrate carrier handlers | |
| KR101817216B1 (en) | Apparatus and method for treating a substrate | |
| JP6293845B2 (en) | Production efficiency system, production efficiency device, and production efficiency method | |
| US20130226325A1 (en) | Methods and systems for fabricating integrated circuits with local processing management | |
| JP6294427B2 (en) | Production processing system and production efficiency improvement method | |
| JP2013125839A (en) | Productivity improvement system, productivity improvement device, and productivity improvement method | |
| KR20190127317A (en) | Apparatus for processing substrate | |
| JPH1017142A (en) | Part transfer system to manufacture semiconductor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |