CN101930906B - Vacuum interlocking chamber with in-built adapter unit - Google Patents

Vacuum interlocking chamber with in-built adapter unit Download PDF

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Publication number
CN101930906B
CN101930906B CN2010101053915A CN201010105391A CN101930906B CN 101930906 B CN101930906 B CN 101930906B CN 2010101053915 A CN2010101053915 A CN 2010101053915A CN 201010105391 A CN201010105391 A CN 201010105391A CN 101930906 B CN101930906 B CN 101930906B
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adapter unit
mentioned
semiconductor wafer
wafer
handled object
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CN101930906A (en
Inventor
保坂广树
秋山收司
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2009148302A priority Critical patent/JP5436949B2/en
Priority to JP2009-148302 priority
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706Mechanical details, e.g. roller, belt
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67259Position monitoring, e.g. misposition detection or presence detection
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10Measuring as part of the manufacturing process
    • H01L22/12Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Abstract

The invention provides a vacuum interlocking chamber with an in-built adapter unit. The vacuum interlocking chamber (10) comprises an adapter unit which is arranged corresponding to a rail guided vehicle(RGV) of automatically conveying semiconductor chips (W) on a buffering station configuration part (13) different with a chip box carrying part(11), and holds multiple semiconductor chips (W) to be conveyed between the RGV (40) and each detecting chamber (20). Thus, switching operation between the adapter unit and a container such as a chip box is not necessary as before, and non-automatic conveying and automatic conveying of an article to be detected are realized.

Description

Vacuum interlocking chamber with in-built adapter unit
Technical field
The process chamber that the present invention relates to and handled objects such as semiconductor wafer are implemented predetermined processing in abutting connection with and between process chamber, handle before and after the vacuum interlocking chamber of handing-over of handled object; Say in more detail, can switch the non-automatic conveyance (conveyance of the wafer case of being undertaken by the operator) of handled object and the vacuum interlocking chamber of conveyance automatically at short notice.
Background technology
In semiconductor fabrication factory, various processing unit are configured in the dust free room.Processing unit; Possess the vacuum interlocking chamber and the process chamber that adjoin each other; Its with from vacuum interlocking chamber to process chamber conveyance handled object, in process chamber, handled object implemented predetermined processing after, the handled object after will handling again constitutes from the mode that process chamber returns vacuum interlocking chamber.Below, with to handled object (below, describe as " semiconductor wafer ".) testing fixture that carries out electrical characteristics inspections is that example describes as processing unit.
Testing fixture; For example shown in Fig. 7 (a); Possess the vacuum interlocking chamber 1 and detecting chamber 2 that adjoin each other; And constitute semiconductor wafer W from vacuum interlocking chamber 1 conveyance to detecting chamber 2, in detecting chamber 2, semiconductor wafer W carried out the electrical characteristics inspection after, semiconductor wafer W is returned vacuum interlocking chamber 1.This vacuum interlocking chamber 1 possesses: carry the portion 3 of putting of carrying put the wafer case C that taken in a plurality of semiconductor wafer W; The wafer transfer mechanism 4 of conveyance semiconductor wafer W; With the pre-calibration mechanism that semiconductor wafer W is carried out pre-calibration (not expression among the figure).Detecting chamber 2 possesses: carries and to put platform 5, put the semiconductor wafer W after the pre-calibration its year, can be at X, and Y, Z direction and θ direction move; Be configured in the probe 6 of carrying the top of putting platform 5; With the correcting mechanism 7 that a plurality of electrode pads that form on a plurality of probe 6A of calibrate probe card 6 and the semiconductor wafer W are calibrated.
When checking, put portion 3 carrying of vacuum interlocking chamber 1 and to upload and put the wafer case of having taken in a plurality of semiconductor wafer W.In vacuum interlocking chamber 1, the semiconductor wafer W in the 4 conveyance wafer case one by one C of wafer transfer mechanism, carry out the pre-calibration of semiconductor wafer W through pre-calibration mechanism after, wafer transfer mechanism 4 carries this semiconductor wafer W and puts year putting on the platform 5 detecting chamber 2 in.Then, put platform 5 to X, Y carrying; Z direction and θ direction move during; Through correcting mechanism 7, carry out the calibration of a plurality of probe 6A of a plurality of electrode pads and probe 6 of semiconductor wafer W after, put platform 5 through driving to carry; Make a plurality of electrode pads of semiconductor wafer W and a plurality of probe 6A of probe 6 electrically contact the inspection of stipulating.After the inspection, wafer transfer mechanism 4 receives to carry puts the semiconductor wafer W on the platform 5, turns back to position original in the wafer case C.
According to circumstances, not in order to wafer case be unit to vacuum interlocking chamber 1 conveyance semiconductor wafer W, for example patent documentation 1,2 is said, use sometimes auto-conveying apparatus (Rail Guided Vehicle) (below be called " RGV ".) to the indoor conveyance semiconductor wafer W automatically of vacuum interlocking.At this moment, shown in Fig. 7 (b), put carrying of vacuum interlocking chamber 1 and to substitute wafer case C in the portion 3 adapter unit 8 is set, by RGV9 in adapter unit 8, move into seriatim or once many pieces of ground move into semiconductor wafer W.
Adapter unit 8 shown in Fig. 7 (b), possesses: unit main body 8A; A plurality of support member 8B, it is arranged on the interior above-below direction of this unit main body 8A, and supports semiconductor wafer W with its center; And correcting mechanism, it during to detecting chamber 2 conveyance semiconductor wafer W, is being used for revising the offset (figure is expression not) of wafer transfer mechanism 4 from these support member 8B, and adapter unit 8 is to put the mode that portion 3 can freely load and unload and constitute with respect to carrying.Support member 8B constitutes with the mode of vacuum suction semiconductor wafer W.In addition, RGV9 for example, possesses: carry and to put the carrying of wafer case C of having taken in a plurality of semiconductor wafer W and put the 9A of portion, and between wafer case C and adapter unit 8 9B of wafer transfer mechanism of conveyance semiconductor wafer W.
Then; When semiconductor wafer W is checked; Shown in Fig. 7 (b), through RGV9 with the semiconductor wafer W conveyance behind the side of the vacuum interlocking chamber 1 of testing fixture, through the 9B of wafer transfer mechanism of RGV9; If once in adapter unit 8, take in the semiconductor wafer W of regulation piece number, then semiconductor wafer W is by support member 8B vacuum suction.Between adapter unit 8 and detecting chamber 2 during the conveyance semiconductor wafer W; After the vacuum suction of removing by support member 8B, wafer transfer mechanism 4 takes out of semiconductor wafer W from support member 8B, after the pre-calibration of pre-calibration mechanism; Conveyance is to detecting chamber 2; Therefore, after semiconductor wafer being carried out electrical characteristics inspections, with the semiconductor wafer W after handling from detecting chamber 2 conveyances in wafer case C.
Patent documentation 1: TOHKEMY 2007-042994 communique
Patent documentation 2: TOHKEMY 2007-088286 communique
, vacuum interlocking chamber 1 in the past carries and to put portion 3 and can switch wafer case C and adapter unit 8; But there is following problem: when carrying out the conveyance of wafer automatically; Operating personnel come before the testing fixture, and the wafer case carrying mechanism that operating personnel are carried the portion of putting 3 is revised and to be set to adapter unit 8, and operating personnel are switched adapter unit and used program; Must revise various initial settings, the handover operation of wafer case C and adapter unit 8 needs the time long.In addition, because adapter unit 8 becomes the structure of vacuum suction semiconductor wafer W,, its inspection is also needed the time so might produce the absorption mistake to semiconductor wafer W.
Summary of the invention
The present invention makes in order to solve above-mentioned problem; Its purpose is to provide the switch operating that carries out container such as wafer case and adapter unit needn't resembling in the past, can tackle the non-automatic conveyance of handled object and the vacuum interlocking chamber with in-built adapter unit of conveyance automatically.
Technical scheme 1 described vacuum interlocking chamber with in-built adapter unit of the present invention; Possess: carry the portion of putting of carrying put the container of having taken in a plurality of handled objects; With at the transport mechanism that carries the above-mentioned handled object of conveyance between the said vesse place the portion of putting in above-mentioned year and the process chamber; It is characterized in that; Possess adapter unit, this adapter unit with above-mentioned handled object conveyance to being provided with accordingly with the auto-conveying apparatus of putting portion's different at different position and different in above-mentioned year, keep a plurality of between this adapter unit and the above-mentioned auto-conveying apparatus and between this adapter unit and the above-mentioned process chamber by the above-mentioned handled object of conveyance.
In addition, technical scheme 2 described vacuum interlocking chamber with in-built adapter unit of the present invention is characterized in that, in technical scheme 1 described invention, and put the configuration position that portion's different at different position and different is a buffer table, the above-mentioned buffer table of above-mentioned adapter unit double as in above-mentioned year.
In addition, technical scheme 3 described vacuum interlocking chamber with in-built adapter unit of the present invention is characterized in that, in technical scheme 1 or technical scheme 2 described inventions, above-mentioned adapter unit has: unit main body; With the support member of in the said units main body, supporting above-mentioned handled object with the multistage setting and with its peripheral portion at least at three places at above-below direction; The said units main body has: the 1st peristome of above-mentioned handled object and the 2nd peristome that above-mentioned handled object was moved into, taken out of to above-mentioned auto-conveying apparatus are moved into, taken out of to above-mentioned transport mechanism.
In addition; Technical scheme 4 described vacuum interlocking chamber with in-built adapter unit of the present invention; It is characterized in that, in technical scheme 3 described inventions, the above-mentioned support member at least three places; Have: in the 1st support member of above-mentioned handled object center position extension and the 2nd support member of extending in tangential direction with respect to above-mentioned handled object.
In addition; Technical scheme 5 described vacuum interlocking chamber with in-built adapter unit of the present invention is characterized in that, in technical scheme 3 or technical scheme 4 described inventions; Above-mentioned adapter unit has and in above-mentioned support member, detects the transducer that has or not above-mentioned handled object.
In addition; Technical scheme 6 described vacuum interlocking chamber with in-built adapter unit of the present invention; It is characterized in that; In technical scheme 1~technical scheme 5 in any described invention, below above-mentioned adapter unit, be provided with above-mentioned transport mechanism association moving, the mechanism that centers that above-mentioned handled object is centered.
In addition, technical scheme 7 described vacuum interlocking chamber with in-built adapter unit of the present invention is characterized in that, in technical scheme 1~technical scheme 6 in any described invention, it is used to testing fixture that the electrical characteristics of above-mentioned handled object are checked.
Through the present invention, a kind of container and adapter unit switch operating such as wafer case of carrying out needn't resembling in the past can be provided, can tackle the seized non-automatic conveyance of having a medical check-up and the vacuum interlocking chamber with in-built adapter unit of conveyance automatically.
Description of drawings
Fig. 1 (a) and (b) are respectively the figure that an execution mode of expression vacuum interlocking chamber of the present invention constitutes; (a) being the vertical view of relation of wafer transfer mechanism, adapter unit and the detecting chamber of expression vacuum interlocking chamber, (b) is the vertical view of the relation of the expression pre-calibration mechanism and the wafer transfer mechanism that are configured in the adapter unit below shown in (a).
Fig. 2 is the perspective elevation that expression is used for the adapter unit of vacuum interlocking chamber shown in Figure 1.
Fig. 3 is (a), (b) all is the side view of wanting portion of adapter unit shown in Figure 2.
Fig. 4 is the key diagram that expression is applied to the optical pickocff of adapter unit shown in Figure 2.
Fig. 5 is the stereogram of the pre-calibration portion shown in the presentation graphs 1 (b).
Fig. 6 (a)~(c) is the process chart of the operation that centers of the semiconductor wafer representing respectively in the pre-calibration portion shown in Figure 5 before pre-calibration, to carry out.
Fig. 7 (a) (b) is the vertical view of representing testing fixture in the past, (a) is the figure that the wafer case state is used in expression, (b) is the figure that the state of adapter unit is in the past used in expression.
Label declaration among the figure:
10: vacuum interlocking chamber; 11: wafer case is carried and is put the portion chamber; 12: the 1 wafer transfer mechanisms; 13: buffer table carries the portion of putting; 16: mechanism centers; 20: detecting chamber; 30: adapter unit; 31: unit main body; 32: support member; 32A: the 1st support member; 32B: the 2nd support member; 34: optical pickocff; W: semiconductor wafer.
Embodiment
Below, according to Fig. 1~execution mode shown in Figure 6, vacuum interlocking chamber with in-built adapter unit of the present invention is described.In this execution mode, to be applied to handled object (for example, semiconductor wafer) carry out electrical characteristics inspection testing fixture vacuum interlocking chamber with in-built adapter unit (below, abbreviate " vacuum interlocking chamber " as.) describe.
The vacuum interlocking chamber 10 of this execution mode is for example shown in Fig. 1 (a), with process chamber (detecting chamber) 20 setting in abutting connection with ground of testing fixture 100.This vacuum interlocking chamber 10 possesses: carry the wafer case of putting the wafer case C that has taken in a plurality of semiconductor wafer W and carry the portion of putting 11; Carry in the portion of putting 11 the 1st wafer transfer mechanism 12 of carrying conveyance semiconductor wafer W between the wafer case C that puts and the detecting chamber 20 in wafer case; The buffer table configuration part 13 of configuration buffer table (not having expression among the figure); With the pre-calibration portion 14 (with reference to Fig. 1 (b)) of the below that is configured in buffer table configuration part 13, the 1st wafer transfer mechanism 12 carries between portion of putting 11 and the buffer table configuration part 13 in wafer case.And buffer table is that the pin that is used for taking in the needle point of the probe that for example grinds probe grinds the packaging container with wafer (figure does not have to represent).
Wafer case is carried year the put portion use of the portion of putting 11 as the wafer case special use, and buffer table carries the portion of putting 13 and substitutes the private space use of buffer tables as the described adapter unit 30 in back.Adapter unit 30 is the unit that are used to take in semiconductor wafer W, but for example its underpart becomes and takes in pin and grind the space with wafer (not having among the figure to represent), double as buffer table in the past.This adapter unit 30 is with respect to testing fixture 100, and the RGV40 that tackles automatic conveyance semiconductor wafer W is provided with.Therefore, before explanation adapter unit 30, the 1st wafer transfer mechanism 12 that is arranged in the vacuum interlocking chamber 10 is simply explained with RGV40.
The 1st wafer transfer mechanism 12 shown in Fig. 1 (a), possesses: keep the arm 12A of semiconductor wafer W and disposed the rotary body 12B that directly advances driving mechanism that makes this arm 12A on a direction, advance and retreat and move.Arm 12A is connected with vacuum pumping hardware (not expression among the figure), constitutes the vacuum suction semiconductor wafer W, and is as shown in the drawing, constitutes through directly advancing driving mechanism, on rotary body 12B, directly advances.Rotary body 12B has rotary drive mechanism and lift drive mechanism, and is as shown in the drawing, moves when constituting positive and negative rotation and at above-below direction.Therefore, arm 12A is through when directly advancing driving mechanism and on rotary body 12B, directly advance and through the positive and negative rotation of rotary body 12B, conveyance semiconductor wafer W between wafer case C or adapter unit 30 and detecting chamber 20.
In addition, the substantial middle in pre-calibration portion 14 like Fig. 1 (b) and shown in Figure 5, disposes pre-calibration mechanism 15.This pre-calibration mechanism 15 possesses: the rotary body 15A of vacuum suction semiconductor wafer W; With make by rotary body 15A semiconductor wafer W rotation during detect the optical pickocff 15B of mark such as otch; Use the 1st wafer transfer mechanism 12 with semiconductor wafer W from wafer case C or adapter unit 30 during detecting chamber 20 conveyances; Make rotary body 15A rotation, semiconductor wafer W is carried out pre-calibration through optical pickocff 15B.In addition, as shown in the drawing, (inside of looking sideways from the 1st wafer transfer mechanism 12) is provided with correcting mechanism 16 in the inside of pre-calibration mechanism 15.
In addition, RGV40 shown in Fig. 1 (a), possesses: RGV main body 41; Be configured in end on the RGV main body 41 (with left end among the figure) and take in the buffering wafer case 42 of a plurality of (for example, 25 pieces) wafer W; Rotating mechanism (not expression among the figure) with buffering wafer case 42 adjacency; The 2nd wafer transfer mechanism 43 that in this rotating mechanism, disposes with the arm (not expression among the figure) that can stretch; Be installed in the matched sensors (not expression among the figure) of the semiconductor wafer W in this wafer transfer mechanism 43; With prevent the anti-member that flies out that semiconductor wafer W flies out the wafer case 42 from buffering (not expression among the figure).The leading section of arm has for example been installed the hand 43A of multistage up and down (for example up and down two sections).These hands 43A is connected with vacuum pumping hardware (not expression among the figure), constitutes the vacuum suction semiconductor wafer W.In addition, arm for example can go up and down to constitute through ball screw framework with the rotating mechanism one.Buffering wafer case 42 has the slit of slit same structure with the FOBS wafer case that is used for the conveyance semiconductor wafer W, and two sections hand 43A up and down have the interval of the slit of coupling FOBS wafer case, are installed in the leading section of arm.The slit separation of FOBS wafer case for example is set at 10mm.
Below, the adapter unit 30 of the vacuum interlocking chamber 10 that is used for this execution mode is described.Adapter unit 30 in this execution mode, as stated, the RGV40 of corresponding conveyance semiconductor wafer W automatically and being provided with.This adapter unit 30 like Fig. 1 (a) and shown in Figure 2, has: the unit main body 31 that is made up of the rectangle framework that is configured on the buffer table configuration part 13; Unit main body 31 inherent above-below directions support many pieces of semiconductor wafer W and many pieces of pins to grind the support member 32 with semiconductor wafer (not having expression among the figure) by peripheral portion separately in three place's levels.
Unit main body 31 has: the 1st peristome 31A that the arm 12A vacuum suction semiconductor wafer W of the 1st wafer transfer mechanism 12 is moved into, taken out of; The 2nd peristome 31B that moves into, takes out of with the hand 43A vacuum suction semiconductor wafer W of the 2nd wafer transfer mechanism 43 of RGV40.Therefore, semiconductor wafer W is moved into, taken out of to adapter unit 30 through the 1st wafer transfer mechanism 12 and the 2nd wafer transfer mechanism 43, from mutual vertical direction.
Be disposed at the support member 32 at three places; Like Fig. 1 (a), shown in Figure 2; By: be configured in a pair of the 1st support member 32A of the left and right sides of the 2nd peristome 31B of unit main body 31, and be configured in opposed of the 2nd peristome 31B near the 2nd support member 32B constitute.A pair of the 1st support member 32A shown in Fig. 2, Fig. 3 (a), has: the pair of posts 32A that erects the bottom surface that is arranged on unit main body 31 1With from these pillars 32A 1Separate predetermined distance at above-below direction respectively and form slit, the support plate 32A of a plurality of (for example, the 25 pieces) elongated shape that extends to the central horizontal of unit main body 31 2, any support plate 32A 2All with respect to pillar 32A 1Form the broach shape.A pair of support member 32A, as shown in Figure 1, intersect with the peripheral portion of semiconductor wafer W, dispose radially to central part.
The 2nd support member 32B shown in Fig. 2, Fig. 3 (b), has: erect the bottom surface that is arranged on unit main body 31, and the board member 32B of the rectangle parallel with the opposed faces of the 2nd peristome 31B 1With separate predetermined distance at above-below direction, from board member 32B 1To unit main body 31 inboard support plate 32B along horizontally extending a plurality of (for example, 25 pieces) rectangle 2, these support plates 32B 2Be configured on the tangential direction of semiconductor wafer W.The support plate 32B of these rectangles 2, corresponding to a plurality of support plate 32A of the 1st support member 32A 2And be provided with, by the 1st, the 2nd support member 32A, 32B, separate predetermined distance at above-below direction and flatly support semiconductor wafer W.
In addition, as shown in Figure 4, at each support plate 32B of the 2nd support member 32B 2Between, form the slit S that the semiconductor wafer W by the hand 43A conveyance of the 2nd wafer transfer mechanism 43 gets into respectively.Be respectively arranged with among each slit S to detect and have or not semiconductor wafer W or pin to grind optical pickocff 34, can confirm to be accommodated in semiconductor wafer W among each slit S etc. respectively by these optical pickocffs 34 with wafer etc.Optical pickocff 34 is made up of light-emitting component 34A and photo detector 34B, and the wiring 34C through separately is installed on the circuit board 35.Support plate 32B at the downside of slit S 2The last space 32C take in light-emitting component 34A that forms is at the support plate 32B of the upside of slit S 2The last space 32D that takes in photo detector 34B that forms.The optical pickocff 34 of each slit S whenever alternately disposes at a distance from one at the fore-and-aft direction of slit S respectively, so that the optical pickocff up and down 34 of adjacency is not overlapping.The light of light-emitting component 34A sees through hole 32E through being positioned at above the 32C of space, is detected by photo detector 34B.
Thus, detect among a slit S by the optical pickocff of this section 34 and to have or not semiconductor wafer W etc., need not detect thus among the epimere slit S and have or not semiconductor wafer W etc.That is, make the light mutually noninterfere of optical pickocff 34 up and down.Be arranged on optical pickocff 34 among each slit S like this and can detect semiconductor wafer W among the slit S separately etc. reliably, also can confirm the wafer variety that slit S thus keeps.
In addition, be provided with the optical pickocff that flies out (not expression among the figure) that detects semiconductor wafer W in the unit main body 31.In adapter unit 30, during the conveyance semiconductor wafer W, when the conveyance position deviation, detect the semiconductor wafer W that flies out by optical pickocff, by RGV40 to give the alarm.
Shown in Fig. 1 (b), pre-calibration portion 14 is configured in the downside of buffer table configuration part 13.This pre-calibration portion 14 for example like Fig. 1 (b) and shown in Figure 5, has: pre-calibration mechanism 15; With the mechanism 16 that centers that constitutes by near a pair of bar-shaped member 16A that center that are configured in the pre-calibration mechanism 15.And, arrow in Fig. 5, the expression semiconductor wafer W is with respect to the approach axis of pre-calibration portion 14.
The a pair of member 16A that centers; Like Fig. 1 (b) and shown in Figure 5; Look sideways from the 1st wafer transfer mechanism 12, be positioned at the inboard of the rotary body 15A of pre-calibration mechanism 16, and be the configuration of benchmark left and right symmetrically with the extended line at the center of center through arm 12A and rotary body 15A.These member 16A that center also can constitute the size of coupling semiconductor wafer W, are benchmark with the center of rotary body 15A, on diametric(al), move, and in addition, also can fix.When the member 16A that centers was fixed, the maximum semiconductor wafer W of coupling was configured, in semiconductor wafer W hour, through extending the displacement of the 1st wafer transfer mechanism 12, even little semiconductor wafer W also can center.Before the pre-calibration of carrying out semiconductor wafer W, carrying out this centers.
Below, describe using RGV40 automatic conveyance semiconductor wafer W and situation about checking to the vacuum interlocking chamber 10 of this execution mode in.
Before testing fixture 100, can carry out the inspection of the semiconductor wafer W in the wafer case C, then, switch to adapter unit 30, directly carry out the inspection of semiconductor wafer W.When using adapter unit 30 inspections, at first RGV40 behind certain position near the adapter unit 30 of vacuum interlocking chamber 10, drives the 2nd wafer transfer mechanism 43 of RGV40 shown in Fig. 1 (a).The 2nd wafer transfer mechanism 43 makes the front end of hand 43A towards buffering wafer case 42 through rotating mechanism; Make arm with than after the low slightly position consistency of the height of semiconductor wafer W; Cantilever arm; Arm is risen a little, and hand 43A up and down loads onto 2 pieces of semiconductor wafer W in the buffering wafer case 42 at every turn, and arms is taken out of semiconductor wafer W in the outside of buffering wafer case 42.
Then; Through the rotating mechanism of the 2nd wafer transfer mechanism 43, with arm to the counter clockwise direction half-twist, after adapter unit 30 directions of vacuum interlocking chamber 10; Cantilever arm, make hand 43A with at pair of right and left the 1st support member 32A of adapter unit 30 32A of support plate up and down separately 2, 32A 2Between the height unanimity of slit after, hand 43A is got in this slit, semiconductor wafer W is moved in the unit main body 31, let hand 43A descend a little, semiconductor wafer W is carried puts at pair of right and left support plate 32A 2Support plate 32B with the 2nd support member 32B of inside 2On, after flatly supporting semiconductor wafer W at three places, arms, hand 43A withdraws from from unit main body 31.Optical pickocff 34 work detect semiconductor wafer W in the 2nd support member 32B.At this moment, if there is skew in the conveyance of semiconductor wafer W, the semiconductor wafer W after the sensor that the flies out offset, notice is unusual.
The 2nd wafer transfer mechanism 43 is repeated above-mentioned action by semiconductor wafer W before filling up at adapter unit 30, and after adapter unit 30 in, being filled up by semiconductor wafer W, RGV40 prepares following action.
If semiconductor wafer W is received in the adapter unit 30, then drive the inspection of testing fixture 100 beginning semiconductor wafer W.That is, in vacuum interlocking chamber 10, drive the 1st wafer transfer mechanism 12, take out of semiconductor wafer W from adapter unit 30.Use the 1st wafer transfer mechanism 12 to take out of semiconductor wafer W from adapter unit 30.
In adapter unit 30, supporting semiconductor wafer W by the 1st, the 2nd support member 32A, 32B.After driving the 1st wafer transfer mechanism 12, the front end that makes arm 12A makes the height of arm 12A consistent with the height of aimed semiconductor wafer W towards adapter unit 30 rear flank.That is the height that, makes arm 12A with than the support plate 32A that supports the aimed semiconductor wafer W 2The low slightly height unanimity of height after, arm 12A gets in the unit main body 31, keeps semiconductor wafer W by arm 12A absorption.Then, arm 12A retreats from unit main body 31, descend consistent with pre-calibration portion 14 after, in the entering pre-calibration portion 14, in the operation shown in Fig. 6 (a)~(c), carry out the pre-calibration of semiconductor wafer W.And, omitted optical pickocff 15B among Fig. 6.
Shown in Fig. 6 (a), arm 12A, in pre-calibration portion 14, if semiconductor wafer W arrives the rotary body 15A top of pre-calibration mechanism 15, then arm 12A temporarily stops, and removes the vacuum suction of semiconductor wafer W with the semiconductor wafer W conveyance.Under this state, the center O of the semiconductor wafer W on the arm 12A 1Center O with respect to rotary body 15A 2Δ x, Δ y have been departed from respectively at directions X and Y direction.Therefore; Under the state of arm 12A, to enter into the mechanism 16 that centers, a pair of member 16A that centers of semiconductor wafer W and correcting mechanism 16,16A butt when getting into the vacuum suction of removing semiconductor wafer W with comparing low speed; And if then arm 12A gets into; Then semiconductor wafer W is slided on arm 12A, carries out centering of Y direction, revises the offset of Δ y.At this moment, shown in this figure (b), arm 12A keeps the center of semiconductor wafer W and the center O of semiconductor wafer W 1The size Δ x ' that departs from prior setting.Therefore, arm 12A is the vacuum suction semiconductor wafer W once more, with ease astern Δ x ', when descending, removes vacuum suction, on the other hand, and rotary body 15A absorption, fixing semiconductor wafer W.At this moment, the center O of semiconductor wafer 1Center O with rotary body 15A 2Consistent.Under this state, during rotary body 15A rotation once in through optical pickocff 15B, finish pre-calibration to semiconductor wafer W.
Then, between the arm 12A rising stage, when removing the vacuum suction by rotary body 15A, arm 12A vacuum suction semiconductor wafer W receives semiconductor wafer W from rotary body 15A.Then; Arm 12A takes out of semiconductor wafer W with the state of vacuum suction semiconductor wafer W from pre-calibration portion 14; To the counter clockwise direction half-twist, the front end that makes arm 12A is towards detecting chamber 20 rear flank through rotary body 12B, and arm 12A carrying in detecting chamber 20 put platform 21 and submitted semiconductor wafer W to.
In detecting chamber 20, with the same electrical characteristics inspection of carrying out semiconductor wafer W in the past, after the inspection of semiconductor wafer W, drive the 1st wafer transfer mechanism 12, put platform 21 reception semiconductor wafer W by arm 12A from carrying.Then, to the clockwise direction half-twist, along path opposite when taking out of semiconductor W, 30 former slit returns semiconductor wafer W to arm 12A from arm 12A to adapter unit through rotary body 12B.Also repeat above-mentioned a series of actions for follow-up semiconductor wafer W, carry out the electrical characteristics inspection of semiconductor wafer W.
The inspection of the whole semiconductor wafer W if be through with in the adapter unit 30 then drives RGV40 and takes out of semiconductor wafer W from adapter unit 30, turns back in the buffering wafer case 42.
As described above; Through this execution mode; Owing to possess adapter unit; This adapter unit with the automatic conveyance of semiconductor wafer W is provided with to the RGV40 that carries the different buffer table configuration part 13 of the portion of putting 11 with wafer case accordingly; Keep a plurality of between this adapter unit and the RGV40 and between this adapter unit and the detecting chamber 20 by the semiconductor wafer W of conveyance, so carry out the handover operation of wafer case C and adapter unit 30 needn't resembling in the past, can tackle the non-automatic conveyance and conveyance automatically of semiconductor wafer W.In addition, owing to adapter unit 30 is arranged in the buffer table configuration part 13, so also there is no need to enlarge vacuum interlocking chamber 10.
In addition, through this execution mode, because adapter unit 30 has: unit main body 31; In unit main body 31, support the 1st, the 2nd support member 32A, the 32B of semiconductor wafer W with the multistage setting and by its peripheral portion three places at above-below direction; Unit main body 31 has the 1st wafer transfer mechanism and moves into, takes out of the 1st peristome 31A of semiconductor wafer W and the 2nd peristome 31B that RGV40 moved into, took out of semiconductor wafer W; When supporting semiconductor wafer W; Needn't vacuum suction, can simplified structure, cut down cost and maintenance cost are set.
In addition, according to this execution mode,, can hold the situation of taking in of the semiconductor wafer W in the adapter unit 30 reliably in the 2nd support member 32B because adapter unit 30 has and detects the optical pickocff 34 that has or not semiconductor wafer W.
In addition; According to this execution mode, because pre-calibration mechanism 15 is arranged on adapter unit 30 belows, near the setting mechanism 16 that centers this pre-calibration mechanism 15; So before the pre-calibration of carrying out semiconductor wafer W; Can center by the 16 pairs of semiconductor wafer W of mechanism that center, can prevent to shorten the pre-calibration time by the damage of the semiconductor wafer W of absorption mistake in the pre-calibration mechanism 15 and offset generation.
And, in the above-described embodiment, to supporting the situation of semiconductor wafer W to be illustrated by three places in the adapter unit 30, also can be by keeping more than three places.In addition, the member that centers also is not limited to the member of above-mentioned execution mode.The adapter unit that is provided with in the vacuum interlocking chamber of the present invention only otherwise break away from purport of the present invention, just comprises in the present invention.
The present invention can be widely used in the various processing unit in the dust free room that is configured in semiconductor fabrication factory.

Claims (7)

1. vacuum interlocking chamber with in-built adapter unit possesses: carries the portion of putting of putting the container of having taken in a plurality of handled objects, and, it is characterized in that at the transport mechanism that carries the above-mentioned handled object of conveyance between the said vesse that places the portion of putting in above-mentioned year and the process chamber,
Possesses adapter unit; This adapter unit with above-mentioned handled object conveyance to being provided with accordingly with the auto-conveying apparatus of putting portion's different at different position and different in above-mentioned year, keep a plurality of between this adapter unit and the above-mentioned auto-conveying apparatus and between this adapter unit and the above-mentioned process chamber by the above-mentioned handled object of conveyance.
2. vacuum interlocking chamber with in-built adapter unit according to claim 1 is characterized in that,
With put the configuration position that portion's different at different position and different is a buffer table, the above-mentioned buffer table of above-mentioned adapter unit double as in above-mentioned year.
3. vacuum interlocking chamber with in-built adapter unit according to claim 1 and 2 is characterized in that,
Above-mentioned adapter unit has: unit main body; With in the said units main body, support the support member of above-mentioned handled object at least at three places with the multistage setting and with its peripheral portion at above-below direction,
The said units main body has: the 1st peristome of above-mentioned handled object and the 2nd peristome that above-mentioned handled object was moved into, taken out of to above-mentioned auto-conveying apparatus are moved into, taken out of to above-mentioned transport mechanism.
4. vacuum interlocking chamber with in-built adapter unit according to claim 3 is characterized in that,
The above-mentioned support member at least three places has: in the 1st support member of above-mentioned handled object center position extension and the 2nd support member of extending in tangential direction with respect to above-mentioned handled object.
5. vacuum interlocking chamber with in-built adapter unit according to claim 3 is characterized in that,
Above-mentioned adapter unit has in above-mentioned support member and detects the transducer that has or not above-mentioned handled object.
6. vacuum interlocking chamber with in-built adapter unit according to claim 1 and 2 is characterized in that,
Below above-mentioned adapter unit, be provided with above-mentioned transport mechanism association moving, the mechanism that centers that above-mentioned handled object is centered.
7. vacuum interlocking chamber with in-built adapter unit according to claim 1 and 2 is characterized in that,
It is used to testing fixture that the electrical characteristics of above-mentioned handled object are checked.
CN2010101053915A 2009-06-23 2010-01-28 Vacuum interlocking chamber with in-built adapter unit Active CN101930906B (en)

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