CN101106865A - Double side flexible circuit board - Google Patents
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- CN101106865A CN101106865A CNA200710142160XA CN200710142160A CN101106865A CN 101106865 A CN101106865 A CN 101106865A CN A200710142160X A CNA200710142160X A CN A200710142160XA CN 200710142160 A CN200710142160 A CN 200710142160A CN 101106865 A CN101106865 A CN 101106865A
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Abstract
The invention provides a double side flexible circuit board, which is a double side conductor laminated plate. A single side non-adhesive conductor laminated plate is provided with a conductor layer at one side. At other side, the adhesive layer adheres to other conductor layers. A bending portion is arranged between the terminals in the length direction. The double side flexible circuit board is characterized in that the bending portion removes the other conductor layer to expose the adhesive layer on the other side in the bending portion and has the conductor layer of the single side non-adhesive conductor laminated plate only at one side. The longitudinal elastic module of the adhesive layer is lower than the longitudinal elastic module of the base material. The invention can be worked on the resin split flexibly without damage.
Description
Technical field
The present invention relates to double side flexible circuit board, crooked double side flexible circuit board repeatedly especially slides under installment state.
Background technology
Because flexible circuit board is very thin, can be crooked, therefore help miniaturization, the slimming of electronic equipment, be loaded in portable phone or digital camera, the hard disk drive etc.And in recent years, in order also to be adapted at narrow and small position assembling easily etc., the requirement to flexibility compared with the past has uprised.
Particularly, for the movable part that connects light picker and fixed part and use under the situation of flexible circuit board, for bending point relatively moves by making, so-called slip bending and this flexible circuit board of alternating bending, naturally require high bendability, speed improves and the reducing of motor power consumption when searching for the low thicknessization that is adapted to the optical drive main body or light picker, also requires higher flexibility.
In Japanese patent application 2005-160260 application documents (the open 2006-339295 communique of Japan Patent), corresponding therewith, a kind of product is provided, it has stipulated the balance relevant with thickness with the modulus of elasticity of cladding material and basis material, in addition, have one-sided that to become inboard material when crooked be that the mean value of the longitudinal modulus of elasticity below the 13 μ m, when using in the temperature range is the main stor(e)y more than the 6.4GPa apart from the thickness of conductor wiring laminar surface.
In addition, in No. 2753740 communique of Japan Patent, a kind of manufacture method of flexible circuit board has been proposed, promptly, engage other conductor layer on one-sided nothing bonding conductor layer lamination by binding agent, the part of using as the crooked flexible portion of flexible circuit board is removed the conductor layer (must have stable on heating installation portion uses single face not have the conductor layer of bonding conductor layer lamination side) of adhesive side.
In addition, in No. 2753740 communique of Japan Patent, there is not record about flexibility.
As light picker with, cable portion is only at one-sided wiring and the flexible circuit board that uses in one-sided crooked back, perhaps around the liquid crystal of portable phone etc., use and only in one-sided wiring and the folding crooked flexible circuit board that uses, also not only require the flexible circuit board of single face wiring sometimes, also can require the flexible circuit board of two sides wiring.
This double side flexible circuit board requires flexibility and flexural property too, but about being used to make the basis material of this flexible circuit board, at basis material is that two sides below the thick 13 μ m of insulating resin does not have under the situation of bonding conductor layer lamination, in the operation that forms circuit, owing to be accompanied by the effect of the such soup of tension force, development and the etching of conveyance between roller, the angle of bend when batching etc., and can cause the problem that insulating resin layer breaks, the finished product rate descends.Particularly, be accompanied by the two sides wiring, pad is concentrated in the peripheral stress of the part of positive and negative unanimity, can break easily.
As the countermeasure that this insulating resin layer breaks, can exemplify out the countermeasure on the such production technology of device that improvement uses and the structural countermeasure of insulating resin improvement or thick filmization when circuit forms.
At first, as the countermeasure on the production technology, though Tension Control is arranged, but will spended time when realizing the taking into account of expulsion pressure when circuit forms and insulating resin characteristic, in addition, further corresponding flexibility and performance difficulty in reality such as also be necessary to adjust again when carrying out filming.
Secondly, for structural countermeasure, also there is variety of issue.At first, about the improvement of insulating resin, it is very difficult not only having had the characteristic of flexible circuit board but also improved anti-end check (perhaps expansion is split in stretch-proof).In addition, in order to improve anti-end check (perhaps expansion is split in stretch-proof), to improve the rate of finished products of breaking and influencing when forming,, can not guarantee the flexibility of market demands during thickening resin though the thick filmization of insulating resin is the easiest owing to circuit.
On the other hand, in No. 2753740 communique of Japan Patent, disclosing at single face does not have the both-sided conductor plywood that forms by binding agent stickup conductor layer on the bonding conductor layer lamination.By using this method, can improve because the anti-end check (perhaps expansion is split in stretch-proof) of resin thick film.
But, owing to having manifested bendability, so need the bend of flexibility to become the structure of the conductor that uses adhesive side as cladding material and symmetrical structure.In this structure, even use thin single face not have bonding conductor layer lamination, flexibility is also insufficient.
Summary of the invention
The present invention has considered the premises and has carried out that its purpose is, a kind of flexible circuit board is provided, and it can be implemented in resin on the operation countermeasure of breaking with not damaging flexibility.
To achieve these goals, in the present invention, a kind of double side flexible circuit board is provided, it is the both-sided conductor plywood, forming the single face that conductor layer forms in the one side of basis material does not have on the another side of bonding conductor layer lamination, paste other conductor layer by adhesive layer, between the end of length direction, has bend, it is characterized in that, above-mentioned bend remove above-mentioned other conductor layer and the above-mentioned adhesive layer of the another side in the above-mentioned bend is exposed, only have a conductor layer that above-mentioned single face does not have bonding conductor layer lamination one-sided, the longitudinal modulus of elasticity of above-mentioned adhesive layer is lower than the longitudinal modulus of elasticity of above-mentioned basis material.
According to the present invention, owing to use the conductor layer of single face copper plating film plywood, being formed in single face does not have on the bonding conductor layer lamination by binding agent and pastes bend in the double side flexible circuit board that conductor layer forms, and the binding agent that makes the longitudinal modulus of elasticity of the regulation with double side flexible circuit board exposes and constitutes another side, do not damage flexibility and is difficult to produce the flexible circuit board that the resin of operation in flowing breaks so can provide a kind of.
Description of drawings
Fig. 1 is the sectional side view that the flexible circuit board of the crooked usefulness of slip of the present invention is used in expression.
Fig. 2 is the key diagram of the expression insulating resin assess sample of breaking.
Fig. 3 is the key diagram of the expression insulating resin evaluation method of breaking.
Fig. 4 is the assess sample confirmed of the expression resin boundary of breaking and the key diagram of evaluation method.
Fig. 5 is the key diagram of expression as the angular force assay method of flexible appraisal.
Description of reference numerals
1: conductor layer
2: the conductor layer of on adhesive layer, pasting
3: base material layer
4: adhesive layer
5: cover and use adhesive layer
6: coverlay
10: sample
20: electronic balance
30: rod
Embodiment
In the present invention, use does not have the both-sided conductor plywood of the basis material side of bonding conductor layer lamination by tack coat laminated conductor layer at single face, structure only connects up at no adhesive surface for the flexibility of the flexible circuit board that uses this both-sided conductor plywood and the part that bendability all needs, by removal tack coat sides such as etchings, do not have bonding conductor layer lamination at single face and implement wiring.And, there be not the adhesive layer of the basis material side of bonding conductor layer lamination at single face by coating or the stacked regulation modulus of elasticity that adheres to, become the countermeasure that resin breaks.The longitudinal modulus of elasticity of this adhesive layer is more soft than the insulating resin layer that single face does not have bonding conductor layer lamination.
In addition, preferably the longitudinal modulus of elasticity of this adhesive layer is below half of longitudinal modulus of elasticity of basis material.
Here, do not have bonding conductor layer lamination and be meant the nothing bonding conductor layer lamination that constitutes by casting, laminating and metalikon, as the flexible circuit board material that uses Copper Foil, for example, for casting, the commodity that use Nippon Steel Chemical Co., Ltd to sell are called the product of ESPANEX, for laminating, the trailing cable (NEOFLEX) that uses Mitsui Chemicals, Inc to sell, the ユ ピ セ Le N (trade name) that also has Ube Industries Ltd. to sell.
The nothing bonding copper plating film plywood of these 3 companies disposes thermoplastic polyimide as tack coat between polyimide resin and Copper Foil, being known as does not have bonding copper plating film plywood or 2 layer materials, and being included in single face of the present invention does not have among the bonding conductor layer lamination.
In addition, as the nothing bonding copper plating film plywood that does not use thermoplastic polyimide, as the metallising manufactured casting manufacturing of Co., Ltd. Makato Koito's system, that AZOTEK company makes, that constitute by sputter and plating, the Meta Royal (メ ロ イ ヤ Le) that has S ' PERFLEX that Sumitomo Metal Mining Co., Ltd makes, eastern beautiful processing film Co., Ltd. to make, all being known as does not have bonding copper plating film plywood or 2 layer materials, can be with in the present invention.
In the present invention, structure is: the basis material side of not having bonding conductor layer lamination at single face, use is by the both-sided conductor plywood of the tack coat laminated conductor layer of the countermeasure that is used for resin and breaks, used the flexibility of flexible circuit board of this both-sided conductor plywood and the only one-sided wiring of part that bendability all needs, another side is by removals such as etchings.
In addition, requiring under the situation of bendability, as long as consideration sandwiches the longitudinal modulus of elasticity and the thickness of the insulating resin of conductor layer.That is, the first flexible insulation resin bed that is made of cladding material and the layer of attaching it is set,, second flexible insulating layer that is made of basis material and above-mentioned binding agent is set, so that the another side of covering conductor layer so that cover the one side of conductor layer.And, if constitute the first flexible insulation resin bed each layer (thickness of the longitudinal modulus of elasticity mean value under the temperature when using * first flexible insulation resin bed) and be A, constitute the second flexible insulation resin bed each layer (thickness of the longitudinal modulus of elasticity mean value under the temperature when using * second flexible insulation resin bed) and during as B, first insulating resin layer is positioned under the situation of conductor inboard, A/B=0.66～2.06, second insulating resin layer is positioned under the situation of conductor inboard, B/A=0.66～2.06.
Below, with reference to the description of drawings embodiments of the present invention.
Embodiment
Fig. 1 shows the side of the flexible circuit board that uses the crooked usefulness of slip of the present invention and cuts open structure.This flexible circuit board is installed in the slip bend of application apparatus, use both-sided conductor plywood (not having in the bonding conductor layer lamination and basis material 3 one sides of the face of conductor layer 1 opposition side are pasted conductor layers 2 by adhesive layer 4 and formed) at single face, the slip bend, remove conductor layer 2 from this two sides copper plating film plywood, not laminated cover film and covering binding agent at this position by the etching of wiring during composition etc.
This flexible circuit board is, an end relatively and is point-blank moved with respect to the other end, and the crooked flexible circuit board that slides is promptly identical with degree of crook and bend mode that bending point is moved is used.And this flexible circuit board needs at first to confirm can not produce breaking of insulating resin layer whether during fabrication in addition, whether needs assessment has the flexibility and the bendability of appropriateness when installing.That is, need that test is broken, flexibility and these 3 projects of bendability.
The front elevation and the side view of the sample that uses in the burst test method of Fig. 2 (a) and (b) for the expression insulating resin layer.As sample, shown in Fig. 2 (a) and (b), prepare the flexible substrate material 3 that positive and negative figure 1,2 with same shape forms in the position of correspondence.
In example shown in Figure 2, form copper clad patterns at the tow sides of the flexible substrate material 3 of the rectangle of wide 20mm and constitute sample 10.Figure 1,2 is the rectangle of vertical length of wide 10mm, and diagram is to constitute leg-of-mutton shape in the mode on summits that the upper end becomes 90 degree.
Fig. 3 (a) and (b) show the test method that resin breaks, shown in Fig. 3 (a), and sample 10 shown in Figure 2, the state that makes progress as the triangular apex of figure vertically is wound on around the rod of diameter 10mm more longways.And shown in Fig. 3 (b), when pulling down the upper end of flexible substrate material 3, the stress that applies by the triangular apex at the figure 1,2 of sample 10 carries out the test whether flexible substrate material 3 breaks.
Fig. 4 shows another test method(s) that resin breaks.In this is estimated, in the sample 10 shown in Fig. 4 (a), shown in Fig. 4 (b), apply by signature power with the stick end of diameter 10mm, measure the size of the power that generation breaks.
Fig. 5 shows the flexible appraisal method of flexible circuit board.Repulsion when making sample 10 bend to specified states by electronic balance 20 mensuration here.Bending radius is 3.75mm.
In addition, though pliability test is not shown among the figure, can test by general bend test method, the method for promptly measuring its number of bends by the bending of stipulating repeatedly.
Below, these each evaluation methods are described.
Effect is confirmed
In order to confirm effect of the present invention, the affirmation that the insulating resin of 1 below implementing, flexible circuit board breaks, 2, flexible appraisal and 3, bendability evaluation.
1, the resin of the flexible circuit board evaluation (with reference to Fig. 2, Fig. 3) of breaking
1) evaluation method
On flexible circuit board, make the figures that toe angle is 90 degree with the 10mm width at the correspondence position on two sides, cut from the part of this Graph Distance left and right sides 5mm, obtain sample.Then, this sample of reeling on the rod of diameter 10mm stretches to the 180 degree directions (diagram below) of opposition side, is to peel off on the diagram of acid imide (basis material) of front of 90 degree so that make angle by each figure ground.Thus, confirm with the figure to be whether the beginning acid imide breaks.
2, flexible appraisal (with reference to Fig. 4)
1) structure of assess sample
Sample is to make like this, promptly, one-sided surface at the both-sided conductor plywood, implement conductor width=0.1mm, direct (straight) wiring of conductor separation=0.1mm, removed at another side on (behind the whole facet etch) substrate of conductor layer, the cladding material of polyimide adhesive tape (Kapton) 50H (modulus of elasticity 3.0GPa) that stickup is made by the Dupont company of 13 μ m and the epoxy resin binding agent formation of modulus of elasticity 2.3GPa is made, this sample is that the length of wiring direction (length direction) is 50mm, and the length of Width is the flexible circuit board of 10mm.In addition, the thickness of conductor is 18 μ m, and the covering adhesive thickness on the conductor is 6 μ m.
2) evaluation method
As shown in Figure 5, crooked above-mentioned flexible circuit board utilizes electronic balance, measures the repulsion of flexible circuit board.The bending radius of flexible circuit board is set at 3.75mm and estimates at this moment.
3, bendability evaluation
As the slip bend test, implement the IPC bend test.
1) experimental condition
Bending radius=1.35mm
Rate of bending=1000rpm
Stroke=30mm
Experimental enviroment=80 ℃
Detect broken string=resistance value and rise 50%
2) structure of test piece
Sample is to make like this, promptly, one-sided surface at the both-sided conductor plywood, implement the direct wiring of conductor width=0.1mm, conductor separation=0.1mm, do not have at another side on (behind the whole facet etch) substrate of conductor layer, the polyimide adhesive tape 50H that stickup is made by the Dupont company of 13 μ m ((below 80 ℃: make, and the number that connects up is 10 for modulus of elasticity 3.0GPa (below 80 ℃: 2.7GPa)) and modulus of elasticity 2.3GPa by the cladding material that epoxy resin binding agent 2.0GPa) constitutes.In addition, the thickness of conductor is 18 μ m, and the covering adhesive thickness on the conductor is 6 μ m.
4, evaluating material
The sample that uses in effect is confirmed is 3 of embodiment and comparative example 3 points as follows.
Table 1
| No. | Single face does not have the insulating resin layer of bonding conductor layer lamination | Binding agent | Conductor forms face (annotating 1) | ||||||
| Kind | Thickness (μ m) | Modulus of elasticity [GPa] | Kind | Thickness (μ m) | Modulus of elasticity [GPa] | ||||
| Room temperature | 80℃ | Room temperature | 80℃ | ||||||
| Embodiment 1 | Nippon Steel's chemistry (strain) system ESPANEX S | 13 | 4.8 | 3.9 | Epoxy resin binding |
5 | 1.2 | 0.5 | No |
| Embodiment | |||||||||
| 2 | Nippon Steel's chemistry (strain) system ESPANEX S | 13 | 4.8 | 3.9 | Epoxy resin binding agent A | 12 | 1.2 | 0.5 | No |
| Embodiment | |||||||||
| 3 | Nippon Steel's chemistry (strain) system ESPANEX S | 13 | 4.8 | 3.9 | Epoxy resin binding agent B | 12 | 2.3 | 0.5 | No adherent side |
| Comparative example 1 | Nippon Steel's chemistry (strain) system ESPANEX S | 13 | 4.8 | 3.9 | Do not have | - | - | - | No adherent side |
| Comparative example 2 | Nippon Steel's chemistry (strain) system ESPANEX S | 13 | 4.8 | 3.9 | Epoxy resin binding agent A | 12 | 1.2 | 0.5 | Adhesive side |
| Comparative example 3 | Nippon Steel's chemistry (strain) system ESPANEX S | 25 | 4.8 | 3.9 | Do not have | - | - | - | No adherent side |
Annotate 1: the conductor that conductor formation face refers in flexibility test and the bend test forms face.
Annotate 2: upward no adherent side is the wiring that single face does not have bonding conductor layer lamination side in the table.
Elastic modulus detection
The modulus of elasticity of last table is measured according to following condition.
Test method: the gimmick of quoting IPC-TM-650 2.4.19 is tested.
Sample size: 10mm * 150mm
Distance between anchor clamps (chuck): 100mm
Crosshead (cross head) speed: 50mm/min
Modulus of elasticity: the Hookean region by distortion less than 1.5% is calculated
Measure environment: room temperature
Wherein, about the mensuration of binding agent,, calculate by following formula by the sample of above-mentioned determination of test method in the two sides adhesive stripe-coating of (strain) カ ネ カ system Apical12.5NPI.
E
1＝EV/V
1-E
2V
2/V
1
Here,
E: the modulus of elasticity of composite material (film after the adhesive stripe-coating)
V: the thickness of composite material (film after the adhesive stripe-coating)
E
1: the elastic modulus E of binding agent
2: the modulus of elasticity of Apical NPI
V
1: the thickness V of binding agent
2: the thickness of Apical NPI
5, evaluation result
The resin of the foregoing description 1-3 and comparative example 1-3 breaks, the evaluation result of flexibility and bend test is as follows.
Table 2
| No. | The basis material total thickness | The evaluation that resin breaks | Flexibility (g) | Bend test result | ||
| Repulsion when becoming bent cladding material side to the inside | Repulsion during crooked to the inside basis material side | Inside bend cladding material side | Inside bend basis material side | |||
| Embodiment 1 | 18μm | OK (crack-free) | 1.87 | 1.83 | 470,000 times | 5,190,000 |
| Embodiment | ||||||
| 2 | 25μm | OK (crack-free) | 2.26 | 2.25 | Free of data | Free of |
| Embodiment | ||||||
| 3 | 25μm | OK (crack-free) | 2.91 | 3.06 | Free of data | Free of data |
| Comparative example 1 | 13μm | NG (generation is broken) | 1.72 | 1.60 | 630,000 times | 4,240,000 times |
| Comparative example 2 | 18μm | OK (crack-free) | 2.13 | 2.24 | 120,000 times | 150,000 times |
| Comparative example 3 | 25μm | OK (crack-free) | 3.38 | 3.25 | Free of data | Free of data |
The basis material gross thickness of last table be the single face adhesive thickness of not having the insulating resin layer of bonding conductor layer lamination and the coating of basis material side and.
Reference:
In embodiment 1, though apply the thick binding agent of 5 μ m, even apply the sample of 2 μ m thickness of filming more, insulating resin can not take place yet break.
In last table, during with comparative example 1 and embodiment 1 comparison, though flexibility (repulsion) and bendability are in peer-level (embodiment 1 increases by about 10% degree than comparative example 1), can find has difference about the evaluation that resin breaks.That is, comparative example 1 breaks, but embodiment 1 does not break.Therefore, compare with comparative example 1, embodiment 1 is better.
On the other hand, by this evaluation, distinguish that comparative example 3 is the hardest.Promptly, though considered the thick filmization of basis material as can be known in order to realize the countermeasure that difficulty is broken, but considered under the situation of flexibility, do not have the insulating resin layer of bonding conductor layer lamination than thickening, forming coating as the present invention, do not have the layer of binding agent of insulating resin softness of bonding conductor layer lamination than single face more effective.
Here, the modulus of elasticity of the insulating resin of the nothing bonding conductor layer lamination of comparative example 3 is 4.8GPa, embodiment 2 constitutes for the binding agent of coating modulus of elasticity 1.2GPa on the insulating resin layer of the nothing of modulus of elasticity 4.8GPa bonding conductor layer lamination, and embodiment 3 constitutes for the binding agent by coating modulus of elasticity 2.3GPa on the insulating resin layer of the nothing bonding conductor layer lamination of modulus of elasticity 4.8GPa.
That is, embodiment 2 and 3 all coating tool the binding agent of half following modulus of elasticity of modulus of elasticity of the insulating resin of coated nothing bonding conductor layer lamination is arranged.In addition, when embodiment 2 and 3 compared, embodiment 2 was more soft.When observing applied thickness, embodiment 2 and 3 is all 12 μ m mutually, different just modulus of elasticity.That is, think coated binding agent, a soft side is little to the harmful effect of flexibility.
When comparing embodiment 1 and comparative example 2, though the both is that the modulus of elasticity of coating 5 μ m on 2 layer materials of modulus of elasticity 4.8GPa is the structure of the binding agent of 1.2GPa, but conductor formation face is not have bonding conductor layer lamination side in embodiment 1 during than flexibility and bend test, and then comparative example 2 is adhesive side (the comprehensive etching of the conductor at the back side).Because the difference of this structure, about flexibility, embodiment 1 is more soft and good than comparative example 2, about bendability, also is that embodiment 1 is better than comparative example 2.
According to The above results,, we can say that the thickening insulating resin layer is resultful about the easness that resin breaks.About the binding agent applied thickness, break owing to become easier, therefore need be adjusted into suitable thickness according to the hardness (stiffness) of the thickness of the insulating resin that does not have bonding conductor layer lamination, physical property (expansion that break in anti-end or stretch-proof is broken), Copper Foil.As the index that applied thickness is adjusted, carry out the evaluation that this insulating resin breaks, if confirm not break, then can say so to be suppressed at the rate of finished products of breaking and influencing owing to resin in the operation.
As mentioned above, the part that resin breaks is based on the part of the positive and negative unanimity of conductor wiring, during especially operation flows because breaking of causing of the variation of deflection influences such as (during composition during the hitting power of liquid coiling) angle of bend.Estimate by this, in the figure of positive and negative unanimity, owing to estimated the easness that breaks when deflection takes place, in this test, if do not break, short of burst was unusual during then operation flowed, and just can not break.
About flexibility, when the binding agent of the insulating resin softness that applies ratio nothing bonding conductor layer lamination, by this adhesive layer being configured in the outermost layer of flexible circuit board when crooked, compare with making the insulating resin layer thickening (being used for the countermeasure that resin breaks) of not having bonding conductor layer lamination, can reduce harmful effect flexibility.
At this moment, can confirm,, then compare with making the insulating resin thickening of not having bonding conductor layer lamination if the modulus of elasticity of binding agent is below half of modulus of elasticity of basis material according to above-mentioned experiment, more soft.In addition, do not have at the outermost layer of flexible circuit board to compare with some situation under the situation of binding agent (situation of comparative example 2 etc.), it is big that repulsion becomes.
The boundary that resin breaks is confirmed (with reference to Fig. 4)
For the boundary of confirming that resin breaks, the test below implementing.As shown in Figure 4, on the wide two sides copper facing lamina membranacea of 15mm, make the figure (1mm is wide in PI portion) of the positive and negative unanimity of diameter 10mm, (use Shimadzu Seisakusho Ltd.'s system: Tianjin, island Auto Graph AGS-50D) sample is set, at cupping machine with the mode of the pressure that on sample, applies 0.1MPa stretch (applying tension force).
Then, by the rod of diameter 10mm the positive and negative consistent figure portion of diameter 10mm is applied load, record produces the value of breaking.The intensity that getting breaks produces and the difference of initial value (applying the intensity of tension force) are obtained the pressure that breaks and produce divided by the area of rod.
Can obtain the result of following table by this test.
Table 3
| No. | The basis material total thickness | The pressure that generation is broken (MPa) |
| Embodiment 1 | 18μm | 0.55 |
| Comparative example 1 | 13μm | 0.25 |
| Comparative example 3 | 25μm | 0.52 |
Among the embodiment 1, producing the pressure break is 0.55MPa, is the difficulty of breaking more than 2 times of the comparative example 1 of 0.25MPa as can be known, in addition, distinguishes than thickness is thicker and breaks that to produce pressure be that the comparative example 3 of 0.52MPa is also better.
About bendability, though in No. 2753740 communique of Japan Patent, because conductor layer is positioned at adhesive side, become at the thickness direction symmetrical structure, therefore bendability is good, but as Japanese patent application 2005-160260 application text (Japan Patent open 2006-339295 communique), if the ratio that constitutes by the modulus of elasticity and the thickness of basis material and cladding material in prescribed limit, then the wiring of binder free side is good.
Promptly, though in No. 2753740 communique of Japan Patent, owing to be the shape that is symmetrical structure at thickness direction, so form the shape of binding agent polyimides coverlay in the mode of clamping conductor, but in Japanese patent application 2005-160260 application text (Japan Patent open 2006-339295 communique), for the ratio in the power of so-called modulus of elasticity and thickness becomes symmetrical structure.
Here, so-called prescribed limit is meant: " a kind of flexible circuit board; comprise conductor wiring layer; on above-mentioned first of this conductor wiring layer, the first flexible insulation resin bed is arranged; the second flexible insulation resin bed is also arranged on above-mentioned second with first and second; and have with the above-mentioned first flexible insulation resin bed and become inboard mode and crooked bend; wherein, (thickness of the longitudinal modulus of elasticity mean value when using under the temperature * first flexible insulation resin bed) of the above-mentioned first flexible insulation resin bed is A in establishing above-mentioned bend, when (thickness of the longitudinal modulus of elasticity mean value when using under the temperature * second flexible insulation resin bed) of the above-mentioned second flexible insulation resin is as B in the above-mentioned bend, A/B=0.66～2.06 ".Here, so-called above-mentioned longitudinal modulus of elasticity mean value, for (modulus of elasticity * thickness of each layer/gross thickness) and.
Promptly, among the embodiment 1, by cover layer PI is the Dupont corporate system polyimide adhesive tape 50H (modulus of elasticity under 80 ℃: 2.7GPa) of 13 μ m, binding agent is modulus of elasticity 80 ℃ under: the thickness of epoxy resin binding agent on conductor of 2.0GPa is 6 μ m, and the value of (thickness of longitudinal modulus of elasticity mean value under the temperature during use * first flexible insulation resin bed) A of the first flexible insulation resin bed in the time of can calculating bending in the cover layer is:
" modulus of elasticity: 2.7 (GPa) * thickness: 13 (μ m)/gross thickness: 13+6=19 (μ m) " is 47.1 (GPa μ m) with product " modulus of elasticity 2.0 (GPa) * thickness: 6 (μ m)/gross thickness: 13+6=19 (μ m) " and that be 2.47 (GPa) * thickness 18 (μ m).
And, by basis material is the SC18-12-00FR (modulus of elasticity under 80 ℃: 3.9GPa) of Nippon Steel's chemistry (strain) system of 13 μ m, binding agent is that the epoxy resin binding agent of the modulus of elasticity that is used under 80 ℃: 0.5GPa applies 5 μ m, and the value that can calculate (thickness of longitudinal modulus of elasticity mean value under the temperature during use * first flexible insulation resin bed) B of the second flexible insulation resin bed is:
" modulus of elasticity: 3.9 (GPa) * thickness: 13 (μ m)/gross thickness: 13+5=18 (μ m) " is 53.2 (GPa μ m) with product " modulus of elasticity 0.5 (GPa) * thickness: 5 (μ m)/gross thickness: 13+5=18 (μ m) " and that be 2.96 (GPa) * thickness 18 (μ m)
A/B=0.88 has entered in the scope of afore mentioned rules.
Cladding material is under the situation in the outside, and A/B=1.13 has also entered in the afore mentioned rules scope.If owing to entered in the scope of regulation, then the material that contact with conductor is with regard to the development in the crack that has the hard material of inhibition and produce because of the flexural fatigue of Copper Foil, so be favourable.
Especially, it is hard (shown in Japanese patent application 2005-160260 application text (the open 2006-339295 communique of Japan Patent) to become inboard material, being the above structure of modulus of elasticity 6.4GPa) this is more favourable to bendability, when the basis material cladding material all approaches, in the reality when being assembled into the framework of light picker etc., compare with thick flexible circuit board, because it is actual bending radius is big, therefore more favourable.
As implied above, in the present invention, in the flexible circuit board that requires the film flexibility, can provide a kind of substrate that possesses the thick filmization and the flexibility of the countermeasure of breaking as resin.In addition, about requiring the purposes of bendability, also can be average and the product of thickness by the modulus of elasticity that uses cladding material or basis material, obtain desirable characteristic.
Claims (5)
1. double side flexible circuit board, it is the both-sided conductor plywood, forming the single face that conductor layer forms in the one side of basis material does not have on the another side of bonding conductor layer lamination, paste other conductor layer by adhesive layer, between the end of length direction, have bend, it is characterized in that
Above-mentioned bend remove above-mentioned other conductor layer and the above-mentioned adhesive layer of the another side in the above-mentioned bend is exposed, only have a conductor layer that above-mentioned single face does not have bonding conductor layer lamination one-sided,
The longitudinal modulus of elasticity of above-mentioned adhesive layer is lower than the longitudinal modulus of elasticity of above-mentioned basis material.
2. double side flexible circuit board according to claim 1 is characterized in that, the longitudinal modulus of elasticity of described binding agent is half following modulus of elasticity of the longitudinal modulus of elasticity of described basis material.
3. double side flexible circuit board according to claim 1 is characterized in that possessing:
The first flexible insulation resin bed is made of cladding material and the layer of attaching it, is arranged to cover the one side of the above-mentioned conductor layer in the above-mentioned bend; And
Second flexible insulating layer is made of above-mentioned basis material and above-mentioned binding agent, is arranged on the another side of the above-mentioned conductor layer in the above-mentioned bend,
When (thickness of the longitudinal modulus of elasticity mean value under the temperature when using * first flexible insulation resin bed) of establishing each layer that constitutes the described first flexible insulation resin bed and be A,
Constitute described second flexible insulating layer each layer (thickness of the longitudinal modulus of elasticity mean value under the temperature when using * second flexible insulation resin bed) and during as B,
Be positioned under the situation of conductor inboard at the described first flexible insulation resin bed, A/B=0.66～2.06, and
Be positioned under the situation of conductor inboard B/A=0.66～2.06 at the described second flexible insulation resin bed.
4. double side flexible circuit board according to claim 1 is characterized in that, described bend is when use electronic equipment assembling back, and it is crooked to slide.
5. double side flexible circuit board according to claim 1 is characterized in that, the described adhesive layer that exposes in described bend is towards medial surface one side.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006135539 | 2006-05-15 | ||
| JP2006-135539 | 2006-05-15 | ||
| JP2006135539A JP4642693B2 (en) | 2006-05-15 | 2006-05-15 | Double-sided flexible circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101106865A true CN101106865A (en) | 2008-01-16 |
| CN101106865B CN101106865B (en) | 2012-08-08 |
Family
ID=38839581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200710142160XA Expired - Fee Related CN101106865B (en) | 2006-05-15 | 2007-05-15 | Double side flexible circuit board |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4642693B2 (en) |
| CN (1) | CN101106865B (en) |
| TW (1) | TWI384924B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102310642A (en) * | 2010-06-07 | 2012-01-11 | 施乐公司 | Utilize the electrical interconnection of the relief contact on the flexible circuit |
| CN107230429A (en) * | 2017-06-08 | 2017-10-03 | 武汉天马微电子有限公司 | Flexible module and flexible display panels |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200936004A (en) * | 2008-02-01 | 2009-08-16 | Hitachi Chemical Co Ltd | Optoelectrical hybrid substrate and electrical machine |
| US9069128B2 (en) | 2008-11-21 | 2015-06-30 | Hitachi Chemical Company, Ltd. | Opto-electric combined circuit board and electronic devices |
| JP2011230308A (en) * | 2010-04-23 | 2011-11-17 | Panasonic Electric Works Co Ltd | Flexible copper-clad laminated sheet and flexible printed wiring board |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0673391B2 (en) * | 1987-08-12 | 1994-09-14 | 住友電気工業株式会社 | Flexible double-sided circuit board manufacturing method |
| JP2753740B2 (en) * | 1989-08-31 | 1998-05-20 | 日本メクトロン株式会社 | Method of manufacturing flexible circuit board |
| JP4860185B2 (en) * | 2005-05-31 | 2012-01-25 | 日本メクトロン株式会社 | Flexible circuit board |
-
2006
- 2006-05-15 JP JP2006135539A patent/JP4642693B2/en not_active Expired - Fee Related
-
2007
- 2007-05-09 TW TW96116522A patent/TWI384924B/en active
- 2007-05-15 CN CN200710142160XA patent/CN101106865B/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102310642A (en) * | 2010-06-07 | 2012-01-11 | 施乐公司 | Utilize the electrical interconnection of the relief contact on the flexible circuit |
| CN107230429A (en) * | 2017-06-08 | 2017-10-03 | 武汉天马微电子有限公司 | Flexible module and flexible display panels |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007305936A (en) | 2007-11-22 |
| CN101106865B (en) | 2012-08-08 |
| TWI384924B (en) | 2013-02-01 |
| TW200814895A (en) | 2008-03-16 |
| JP4642693B2 (en) | 2011-03-02 |
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