CN101063686A - Probe card - Google Patents
Probe card Download PDFInfo
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- CN101063686A CN101063686A CN 200610026266 CN200610026266A CN101063686A CN 101063686 A CN101063686 A CN 101063686A CN 200610026266 CN200610026266 CN 200610026266 CN 200610026266 A CN200610026266 A CN 200610026266A CN 101063686 A CN101063686 A CN 101063686A
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- probe
- probe card
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Abstract
This invention relates to one detection needle board for semi-conductor part reliability test, which comprises one set of detection needle, detection fix device, electrical connection part and load board, wherein the detection needle is fixed on the load board by needle and is connected to outer power through connection part with each needle composed of three parts as folded type, line type or angle type.
Description
Technical field
The present invention relates to the probe card that the detection means electrical property is used in the semiconductor fabrication, particularly relate to and have the probe card that high temperature detection prevents the pin that is out of shape.
Background technology
In semiconductor devices manufacturing process, usually need the reliability of device is tested, comprise tests such as hot carrier's effect, grid oxygen punch-through effect, electromigration effect, stress migration effect.Usually adopt probe card to carry out reliability testing in this area.Shown in Figure 1A, 1B, be the overall diagram and the partial enlarged drawing of a probe card that is used for reliability testing of prior art.
Probe card comprises one group of probe, probe stationary device, electrically connects part, loading plate etc., and wherein, probe contacts with the pad of tested device, is connected with external power supply by electrically connecting part, makes device work carry out reliability testing.One group of probe normally, shown in Fig. 1 C, and probe is shown in Fig. 1 D, is that the plane with probe card is 15 degree angles, and length is that 0.45cm, section are circular straight type pin, and these pins are made by tungsten usually.
In test process, probe 4 contacts with pad 5 on the device, and under the normal temperature, pinprick shown in Fig. 2 A, can not produce special problem on pad 5.Increasing temperature 80 ℃ when doing stress test, pad 5 expanded by heating, the contact jaw of the expanded by heating part 6 extruding pins 4 of pad, the pin bend by pressure deforms, shown in Fig. 2 B.After experiment finished, temperature retrieval was to normal temperature, but pin can not be replied former state, shown in Fig. 2 C.Therefore the high temperature stress test is easy to make pin to damage.It is to occur on the pin that great majority damage.In fact the structure of these pins does not have elasticity.
In case pin damages, just must replace with new pin.These pin prices are very expensive, reach the hundreds of dollar usually.Therefore in reliability testing, often use high temperature again, because probe card often damages and not only delayed test process, and raise the cost.
Summary of the invention
The objective of the invention is to solve the problem that above-mentioned prior art exists is easy to damage at high temperature reliability test middle probe plate, the probe card of high temperature resistant test usefulness is provided.
Probe card of the present invention is used for the test of semiconductor device reliability, comprising:
One group of probe;
The probe stationary device is used for fixing one group of probe;
Electrically connect part, be used for being connected probe and external power supply;
One plate, carrying probe, probe stationary device and electric connection part;
It is characterized in that described probe comprises at least three parts, integral body is fold-type, and each part is straight type, and the part that is adjacent is an angle.
According to an aspect of the present invention, described probe comprises three parts, and it joins end to end successively, and wherein, the angle of second portion and first is 130～165 degree; Third part is parallel with first.
The angle of preferably described first and second portion, second portion and third part is 135 degree, the equal in length of three parts.
According to a further aspect in the invention, described probe comprises four parts, joins end to end successively, and wherein, first and probe card are 10～20 degree angles; Second portion and first are 125～145 degree; Third part is parallel with first; The 4th part is parallel with second portion.Wherein, described first length is 0.05～0.25cm; Described second portion length is 0.02～0.1cm; The length of described third part is 0.1～0.4cm; Described the 4th partial-length is 0.04～0.14cm.
Preferably the plane of first and probe card is 15 degree angles; Second portion and first are 135 degree; Third part is parallel with first; The 4th part is parallel with second portion.Wherein, described first length is 0.15cm; Described second portion length is 0.06cm; The length of described third part is 0.25cm; Described the 4th partial-length is 0.09cm.
Can constitute by metal material according to probe of the present invention.Preferably make by tungsten.
The present invention can increase elasticity by changing the shape of pin, prevents to produce distortion because of the pad expanded by heating causes pin to be squeezed, and prolonged the serviceable life of pin, has also avoided frequent replacing pin and the problem of the delay test process that causes and the problem that cost improves.
Description of drawings
Further describe feature of the present invention below by embodiment, wherein some embodiment is shown in the drawings.Yet it should be noted that accompanying drawing just illustrates exemplary embodiments of the present invention, therefore should not be considered to the restriction to its scope, the present invention can allow other equivalent embodiment.
Figure 1A is the whole top view of an embodiment of prior art probes plate.
Figure 1B is part 1 amplification vertical view among Figure 1A.
Fig. 1 C is the schematic top view of one group of probe 2 among Figure 1A or Figure 1B.
Fig. 1 D is the schematic side view of a probe.
Fig. 2 A～2C is the schematic side view of prior art probes variation in the course of the work.
Fig. 3 is the schematic side view of an embodiment of probe of the present invention.
Fig. 4 A～4C is the schematic side view that the probe of one embodiment of the present of invention changes in the course of the work.
Description of reference numerals
1 part
2 one groups of probes
4 probes
5 pads
The dilation of 6 pads
7 firsts
8 second portions
9 third parts
10 the 4th parts
Embodiment
More specifically probe card of the present invention is described below by embodiment.
Embodiment 1
According to one embodiment of present invention, probe card comprises one group of probe, probe stationary device, electrically connects part, loading plate, and wherein said probe comprises three parts, and integral body is fold-type, and each part is straight type, and the part that is adjacent is an angle.This probe card is used for the reliability testing of device, particularly high temperature stress test.
The probe of this embodiment comprises: first, second portion, third part, wherein the angle on first and probe card plane is 45 degree, the angle of second portion and first is 135 degree, the angle of third part and second portion is 135 degree, third part is parallel with first, the equal in length of this three part all be 0.2cm, and it is made of the tungsten material.
An end of third part contacts with the pad of device in test process, and under the normal temperature, pinprick increases temperature on pad, as more than 80 ℃, and when doing stress test, the pad expanded by heating, dilation extruding pin, deformation takes place in the pin bend by pressure.Experiment finishes, and when temperature returns to normal temperature, replys former state.
Because the fold-type that the pin of this embodiment of the present invention adopts three parts to constitute, so the raising of the elasticity of this pin can be returned to former state after high temperature deformation.
According to another embodiment of the invention, probe card comprises one group of probe, probe stationary device, electrically connects part, loading plate, and wherein said probe comprises three parts, and integral body is fold-type, and each part is straight type, and the part that is adjacent is an angle.This probe card is used for the reliability testing of device, particularly high temperature stress test.
The probe of this embodiment of the present invention comprises first 7, second portion 8, third part 9, the 4th part 10 as shown in Figure 3.Wherein first 7 is 15 degree angles with the probe card plane, second portion 8 is 135 with the angle of first, and the angle on third part 9 and probe card plane also is 15 degree, be that third part 9 is parallel with first 7, the 4th part 10 also is 135 degree with the angle of third part 9, and promptly the 4th part 10 is parallel with second portion 8.And first's length is 0.15cm, and second portion is 0.06cm, and third part is 0.25cm, and the 4th part is 0.09cm.
In test process, the tetrameric end of probe contacts with pad 5 on the device, and under the normal temperature, pinprick shown in Fig. 4 A, can not produce special problem on pad.Increasing temperature, as more than 80 ℃, when doing stress test, pad 5 expanded by heating, the part 6 extruding pins of expanded by heating, deformation takes place, shown in Fig. 4 B in the pin bend by pressure.After finishing experiment, be returned to normal temperature, pin is replied former state, shown in Fig. 4 C.
Because pin of the present invention adopts the fold-type structure, elasticity improves, and therefore still can reply former state after high temperature deformation.
Straight type pin originally then is roughly 1 year serviceable life if carry out high temperature test, have in addition just needed in 15 days to repair, repair continuously more than 3 times, then pin just need be scrapped.And the high temperature test of fold-type pin of the present invention can reach more than 5 years serviceable life.
The present invention is by changing the shape of pin, can increase elasticity, prevent to produce distortion, prolonged the serviceable life of pin, also avoided frequent replacing pin and the problem of the delay test process that causes and the problem that cost improves because of the pad expanded by heating causes probe to be squeezed.
Though noted earlier is at embodiments of the invention, under the situation that does not deviate from its base region, can design other and further embodiment of the present invention, and its protection domain is the scope decision by claim.
Claims (8)
1. a probe card is used for the test of semiconductor device reliability, comprising:
One group of probe;
The probe stationary device is used for fixing one group of probe on loading plate;
Electrically connect part, be used for probe is connected with external power supply;
One plate, carrying probe, probe stationary device and electric connection part;
It is characterized in that described each probe comprises three parts at least, its integral body is fold-type, and each part is straight type, and the part that is adjacent is an angle.
2. probe card according to claim 1 is characterized in that described probe comprises three parts, joins end to end successively, wherein,
The angle of second portion and first is 130～165 degree;
Third part is parallel with first.
3. probe card according to claim 2 is characterized in that, the angle of described first and second portion, second portion and third part is 135 degree, the equal in length of three parts.
4. probe card according to claim 1 is characterized in that described probe comprises four parts, joins end to end successively, wherein,
First and probe card are 10～20 degree angles;
Second portion and first are 125～145 degree;
Third part is parallel with first;
The 4th part is parallel with second portion.
5. probe card according to claim 1 is characterized in that,
Described first length is 0.05～0.25cm;
Described second portion length is 0.02～0.1cm;
The length of described third part is 0.1～0.4cm;
Described the 4th partial-length is 0.04～0.14cm.
6. probe card according to claim 1 is characterized in that, described probe is to be made by the tungsten material.
7. probe card according to claim 1 is characterized in that,
First and probe card are 15 degree angles;
Second portion and first are 135 degree;
Third part is parallel with first;
The 4th part is parallel with second portion;
Described first length is 0.15cm;
Described second portion length is 0.06cm;
The length of described third part is 0.25cm;
Described the 4th partial-length is 0.09cm.
8. probe card according to claim 1 is characterized in that, the section of described probe is circular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610026266 CN101063686A (en) | 2006-04-29 | 2006-04-29 | Probe card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610026266 CN101063686A (en) | 2006-04-29 | 2006-04-29 | Probe card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101063686A true CN101063686A (en) | 2007-10-31 |
Family
ID=38964843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610026266 Pending CN101063686A (en) | 2006-04-29 | 2006-04-29 | Probe card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101063686A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105092909A (en) * | 2015-08-11 | 2015-11-25 | 上海华力微电子有限公司 | Bent probe and jig thereof |
| CN110519916A (en) * | 2019-08-14 | 2019-11-29 | 云谷（固安）科技有限公司 | A kind of flexible circuit board and compression bonding apparatus |
-
2006
- 2006-04-29 CN CN 200610026266 patent/CN101063686A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105092909A (en) * | 2015-08-11 | 2015-11-25 | 上海华力微电子有限公司 | Bent probe and jig thereof |
| CN105092909B (en) * | 2015-08-11 | 2018-01-26 | 上海华力微电子有限公司 | Bend probe and its tool |
| CN110519916A (en) * | 2019-08-14 | 2019-11-29 | 云谷（固安）科技有限公司 | A kind of flexible circuit board and compression bonding apparatus |
| CN110519916B (en) * | 2019-08-14 | 2022-03-01 | 云谷（固安）科技有限公司 | Flexible circuit board and crimping device |
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| PB01 | Publication | ||
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| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Open date: 20071031 |