CN101035415A - Encapsulation method of dual base board electronic module for the radio communication - Google Patents
Encapsulation method of dual base board electronic module for the radio communication Download PDFInfo
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- CN101035415A CN101035415A CN 200610054751 CN200610054751A CN101035415A CN 101035415 A CN101035415 A CN 101035415A CN 200610054751 CN200610054751 CN 200610054751 CN 200610054751 A CN200610054751 A CN 200610054751A CN 101035415 A CN101035415 A CN 101035415A
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- base board
- electronic module
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- board electronic
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Abstract
The encapsulated method is apply printed stannous oilment congruence assemble upper and nether substrate, and bring to bear preconcerted press decrease total thickness of upper and nether substrate, at one time, synchronously position Scheduled setting one upper and nether substrate, and after hood the shell of protected the element, then can through once welding course simultaneous fix up each other upper and nether substrate and Electrical Connectors, multi-electronic component and filter component difference set on tip of upper and nether substrate, and shell fix up on the face of the upper substrat, and that can predigest all process of encapsulation, and gain the electromodule which have been cutted dimension.
Description
Technical field
The present invention relates to a kind of method for packing of electronic module, the method for packing of the dual base board electronic module that particularly a kind of wireless telecommunications are used.
Background technology
Consult Fig. 1, the encapsulation process of the dual base board electronic module that wireless telecommunications are at present used, be application surface mounting technology (SMT, surface mount technique), earlier tin cream 100 (solder paste) is printed on predetermined set one in regular turn and includes at least one resistance chip (Resistor/Capacitor chip, R/C chip), at least one transceiver (Transceiver IC), at least one balance/imbalance converter (Balun), the second element group 400 of at least one alteration switch a plurality of electronic components such as (switch) is on a plurality of component pads (component pad) of upper substrate 21 (main board) end face of a filter element 500 (Filter); Then each element with the second element group 400 is positioned on the component pads that is printed with tin paste layer with this filter element 500 is corresponding respectively; Carry out reflow (reflow) again and each element of the second element group 400 and filter element 500 are connected and fixed and are electrically connected with predetermined component pads via tin cream 100.
Then, on a plurality of substrate pads (ball pad) of upper substrate 21 bottom surfaces, plant tin ball 200 (solder ball), then according to similar process, tin cream 100 is printed on predetermined set one includes at least one resistance chip, at least one electricallyerasable ROM (EEROM) (EEPROM), and on a plurality of component pads of upper substrate 21 bottom surfaces of the first element group 300 of at least one chip upside-down mounting type integrated circuit electronic components such as (Flip Chip IC); Be positioned at printing and be formed with on the component pads of tin paste layer each element of the first element group 300 is corresponding respectively again; At last, through a reflow, make each electronic component of the element group 300 of winning be connected and fixed and be electrically connected with the component pads of being scheduled to, simultaneously again via tin cream 100, tin ball 200 is fixedly connected on the substrate pads of upper substrate 21, finishes the last element technology of upper substrate 21.
To be provided with the upper substrate 21 of first and second element group 300,400 and this filter element 500 then, with the bottom surface towards the end face of infrabasal plate 22 (frame board) and will be fixedly connected on a plurality of tin balls 200 on the substrate pads of upper substrate 21 and overlay accordingly on a plurality of substrate pads on these infrabasal plate 22 end faces, and finish upper and lower substrate 21,22 pile up the location relatively; Then, make each tin ball 200 counterpart substrate pad of fixedly connected upper and lower substrate 21,22 simultaneously, and finish the stacked package step of upper and lower substrate 21,22 again through a reflow.
At last; one case, 23 covers are covered each element and this filter element 500 of the first element group 400 that places upper substrate 21 end faces; and through a reflow case 23 is fixedlyed connected with the end face of upper substrate 21 again; and make the first element group 400 and this filter element 500 via case 23 protections and be hedged off from the outer world, finish the whole encapsulation process of the dual base board electronic module that wireless telecommunications use.
The encapsulation process of the dual base board electronic module of being used by above-mentioned wireless telecommunications as can be known, present encapsulation process is comparatively tediously long complicated, simultaneously must be through at least four times reflow, and it is every through a reflow, mean that each element, substrate etc. must bear the process of the cooling of once being heated, produce the probability of fault and can increase single element because of quick heating-cooling, and then the decline that causes whole dual base board electronic module encapsulation to produce yield.
In addition, the particle diameter of single tin ball 200 is between 0.3～0.5 millimeter, therefore it is highly higher to add the filter element 500 that is arranged at upper substrate 21 end faces, and the overall height dimension of the dual base board electronic module that forms of encapsulation is also more than 1.6 millimeters and can't further break through micro.
Therefore, the encapsulation process of the dual base board electronic module that wireless telecommunications are at present used must be reduced, be simplified, and to promote the yield that the dual base board electronic module encapsulation is produced, increases the gained of effective profit; By the volume size of breaking through the dual base board electronic module of finishing with the reduction encapsulation again of method for packing, satisfy the growth requirement of radio communication product simultaneously.
Summary of the invention
Therefore, an object of the present invention is to provide the method for packing of the dual base board electronic module that wireless telecommunications that a kind of step simplifies use.
In addition, another object of the present invention provides the method for packing of the dual base board electronic module that a kind of wireless telecommunications use, and the volume size of the dual base board electronic module of reduction encapsulation back gained.
Therefore, the method for packing of the dual base board electronic module used of wireless telecommunications of the present invention comprises following steps:
The one first element group correspondence that comprises a plurality of electronic components is arranged on a plurality of pads that are positioned at the bottom surface of a upper substrate;
With paste solder printing on a plurality of pads that are positioned at end face of the infrabasal plate of a plurality of pads that are positioned at end face of this upper substrate and an annular;
This upper substrate is not provided with corresponding folded the leaning against on this infrabasal plate end face on a plurality of pads that are printed with tin cream of the other a plurality of pads of this first element group with the bottom surface towards this infrabasal plate end face and with this upper substrate bottom surface, and this upper and lower substrate is located by connecting toward each other;
Be positioned at this upper substrate end face and be printed with on a plurality of pads of tin cream second an element group that comprises a plurality of electronic components is corresponding respectively;
One case is positioned on this upper substrate end face, and cover covers this second element group;
The semi-finished product that previous step is made suddenly carry out reflow, make this upper and lower substrate relative fixed and be electrically connected, this second element group is arranged on this upper substrate end face, and this case is connected with this upper substrate end face, thereby make this dual base board electronic module.
Description of drawings
The present invention is described in detail below in conjunction with drawings and Examples, in the accompanying drawing:
Fig. 1 is the schematic diagram of the encapsulation process of the dual base board electronic module used of the existing wireless telecommunications of explanation; And
Fig. 2 is the schematic diagram of a preferred embodiment of the method for packing of the dual base board electronic module used of explanation wireless telecommunications of the present invention.
Detailed Description Of The Invention
Before the present invention is described in detail, be noted that in the following description content, similar elements is represented with identical numbering.
Consult Fig. 2, a preferred embodiment of the method for packing of the dual base board electronic module that a kind of wireless telecommunications of the present invention are used is the dual base board electronic module that 9.6 millimeters * 9.6 millimeters * 1.6 millimeters wireless telecommunications are used in order to encapsulation preparation volume.
At first, the first element group 300 that will comprise a plurality of electronic components is separately positioned on a plurality of component pads of upper substrate 31 bottom surfaces; This step is similar to existing process, all be that the application surface mounting technology carries out, earlier tin cream 100 is printed on predetermined set in regular turn and includes resistance chip, electricallyerasable ROM (EEROM), and on a plurality of component pads of upper substrate 31 bottom surfaces of the first element group 300 of electronic components such as chip upside-down mounting type integrated circuit, then, be connected and fixed and be electrically connected with the component pads of being scheduled to via tin cream 100 with reflow each element then the first element group 300 with corresponding respectively being positioned on the component pads that is printed with tin cream of each element of the first element group 300.
Then, tin cream 100 is printed on predetermined set respectively includes on a plurality of component pads of upper substrate 31 end faces of the second element group 400 of a plurality of electronic components such as resistance chip, transceiver, balance/imbalance converter, alteration switch, and synchronously tin cream 100 is printed on respectively on a plurality of component pads of a plurality of substrate pads of infrabasal plate 32 end faces of an annular and this filter element 500 of predetermined set.
And then with upper substrate 31 with bottom surface corresponding folded being against on the tin paste layer that forms on a plurality of substrate pads of infrabasal plate 32 end faces of a plurality of substrate pads and on the bottom surface towards the end face of infrabasal plate 32, with on carrying out, infrabasal plate 31,32 pile up the location, specifically, pile up when being positioned on the infrabasal plate 32 at upper substrate 31, on upper substrate 31, apply the load 33 of predetermined weight, and on making, infrabasal plate 31,32 are subjected to close relatively predetermined pressure, and then make that tin cream thickness is compressed relatively, and do not protrude out under the situation of infrabasal plate 32 bottom surfaces in the first element group 300, on making, infrabasal plate 31,32 integral thickness that pile up behind the location equal in fact, infrabasal plate 31,32 thickness and, and finish, infrabasal plate 31,32 pile up the location.
After upper and lower substrate 31,32 piles up the location, can be positioned at upper substrate 31 end faces and be printed with on the component pads of tin paste layer each element of the second element group 400 is corresponding respectively, and synchronously filter element 500 correspondences are positioned at after infrabasal plate 32 end faces are printed with the component pads of tin paste layer; Synchronously case 34 is positioned on upper substrate 31 end faces again, and it is covered simultaneously cover the second element group 400 and filter element 500.
At last, to carry out a reflow through the semi-finished product that above-mentioned steps makes, can make simultaneously upper and lower substrate 31,32 relative fixed be electrically connected, the second element group 400, filter element 500 respectively with the predetermined element pad relative fixed of upper and lower substrate 31,32 be electrically connected, and make case 34 be connected with upper substrate 31 relative fixed, and finish the encapsulation preparation of dual base board electronic module.
As shown in the above description, the method for packing of the dual base board electronic module that a kind of wireless telecommunications of the present invention are used, mainly be that application of printed tin cream 100 replacement tin balls 200 pile up the upper and lower substrate 31,32 of connection, and in the upper and lower substrate 31,32 in superimposed location, on upper substrate, apply the thickness of the tin cream 100 that predetermined load 33 pressure are used to connect with reduction; Simultaneously, with originally highly higher filter element 500, change simply to change into after the part line design and be arranged on the infrabasal plate 32, and cooperate the shape that changes upper substrate 31 simultaneously, and the height of the electronic module that can particularly encapsulation be finished is reduced to and is not more than 1.6 millimeters as collocation; Simultaneously, in encapsulation process, utilize reflow process once promptly to finish the setting of upper and lower substrate 31, the 32 fixedly connected and second element group 400, filter element 500, case 34 and upper and lower substrate 31,32 each other, and significantly reduce the encapsulation integrated artistic.
The encapsulation process of the dual base board electronic module of using with existing wireless telecommunications relatively, the present invention is true To have in fact the process that must carry out at least four reflows in the encapsulation process now and effectively be reduced to only need Carry out the secondary reflow, simultaneously, also effectively reduce the implementation step of overall package, and can effectively carry Rise the yield of overall package technology; Simultaneously, by print solder paste and apply pressing pressure and carry out The means of reflow, and cooperate the setting position that changes highly higher filter element 500, and have The height that effect will encapsulate the dual base board electronic module of gained is reduced to and is not more than 1.6 millimeters, integral body Volume size is 9.6 millimeters * 9.6 millimeters * 1.6 millimeters, meets the demand of radio communication product, Really reach goal of the invention of the present invention.
Claims (10)
1, the method for packing of the dual base board electronic module used of a kind of wireless telecommunications, it is characterized in that: this method for packing comprises
(a) first an element group correspondence that comprises a plurality of electronic components is arranged on a plurality of pads that a upper substrate is positioned at the bottom surface;
(b) paste solder printing is positioned at a plurality of pads of end face at this upper substrate, and the infrabasal plate of an annular is positioned on a plurality of pads of end face;
(c) this upper substrate is not provided with corresponding folded the leaning against on this infrabasal plate end face on a plurality of pads that are printed with tin cream of the other a plurality of pads of this first element group with the bottom surface towards this infrabasal plate end face and with this upper substrate bottom surface, and this upper and lower substrate is located by connecting toward each other;
(d) corresponding respectively this upper substrate that is positioned at of second an element group that comprises a plurality of electronic components is positioned on a plurality of pads that end face is printed with tin cream;
(e) case is positioned on this upper substrate end face, and cover covers this second element group; And
(f) semi-finished product that step (e) is made carry out reflow, make this upper and lower substrate relative fixed and be electrically connected, this second element group is arranged on this upper substrate end face, and this case is connected with this upper substrate end face, thereby make this dual base board electronic module.
2, the method for packing of the dual base board electronic module used of wireless telecommunications as claimed in claim 1, it is characterized in that: this step (a) is arranged on a plurality of pads of this upper substrate bottom surface with surface mounting technology each element correspondence with this first element group.
3, the method for packing of the dual base board electronic module used of wireless telecommunications as claimed in claim 1, it is characterized in that: when this step (c) is located by connecting this upper and lower substrate toward each other, apply one and make the close relatively predetermined pressure of this upper and lower substrate, be printed on tin cream on the pad with thinning.
4, the method for packing of the dual base board electronic module used of wireless telecommunications as claimed in claim 3, it is characterized in that: this predetermined pressure forms in the load that this upper substrate end face applies predetermined weight, and makes this upper and lower substrate toward each other near the tin cream that is printed on thinning on the pad.
5, the method for packing of the dual base board electronic module used of wireless telecommunications as claimed in claim 1 is characterized in that: the integral thickness after this upper and lower substrate connects toward each other by tin cream equal in fact upper and lower substrate thickness and.
6, the method for packing of the dual base board electronic module used of wireless telecommunications as claimed in claim 1 is characterized in that: through the semi-finished product of this step (c) back gained, its first element group that is arranged on this upper substrate bottom surface does not protrude out the bottom surface of this infrabasal plate.
7, the method for packing of the dual base board electronic module used of wireless telecommunications as claimed in claim 1 is characterized in that: also a filter element synchronized positioning is printed with on the pad of tin cream in zone that this infrabasal plate end face is not covered by this upper substrate a plurality of in this step (d).
8, the method for packing of the dual base board electronic module used of wireless telecommunications as claimed in claim 7, it is characterized in that: this case cover covers this filter element.
9, the method for packing of the dual base board electronic module used of wireless telecommunications as claimed in claim 1 is characterized in that: the first element group comprises at least one resistance chip, at least one electricallyerasable ROM (EEROM), and at least one chip upside-down mounting type integrated circuit.
10, the method for packing of the dual base board electronic module used of wireless telecommunications as claimed in claim 1, it is characterized in that: the second element group comprises at least one resistance chip, at least one transceiver, at least one balance/imbalance converter, and at least one alteration switch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100547517A CN100544554C (en) | 2006-03-10 | 2006-03-10 | The method for packing of the dual base board electronic module that wireless telecommunications are used |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100547517A CN100544554C (en) | 2006-03-10 | 2006-03-10 | The method for packing of the dual base board electronic module that wireless telecommunications are used |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101035415A true CN101035415A (en) | 2007-09-12 |
| CN100544554C CN100544554C (en) | 2009-09-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100547517A Active CN100544554C (en) | 2006-03-10 | 2006-03-10 | The method for packing of the dual base board electronic module that wireless telecommunications are used |
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| CN (1) | CN100544554C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110149762A (en) * | 2019-04-28 | 2019-08-20 | 华为技术有限公司 | A kind of printed circuit board and preparation method thereof and electronic equipment |
| CN112204732A (en) * | 2018-05-31 | 2021-01-08 | 华为技术有限公司 | Circuit board and mobile terminal |
-
2006
- 2006-03-10 CN CNB2006100547517A patent/CN100544554C/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112204732A (en) * | 2018-05-31 | 2021-01-08 | 华为技术有限公司 | Circuit board and mobile terminal |
| CN110149762A (en) * | 2019-04-28 | 2019-08-20 | 华为技术有限公司 | A kind of printed circuit board and preparation method thereof and electronic equipment |
| WO2020221051A1 (en) * | 2019-04-28 | 2020-11-05 | 华为技术有限公司 | Printed circuit board and manufacturing method therefor, and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100544554C (en) | 2009-09-23 |
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Owner name: HUANXU ELECTRONICS CO., LTD. Free format text: FORMER OWNER: UNIVERSAL SCIENTIFIC INDUSTRIES CO., LTD Effective date: 20100712 |
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Free format text: CORRECT: ADDRESS; FROM: 000000 NANTOU COUNTY, TAIWAN PROVINCE, CHINA TO: 201203 NO.1558, ZHANGDONG ROAD, ZHANGJIANG HIGH-TECH PARK, SHANGHAI CITY |
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Effective date of registration: 20100712 Address after: 201203 Shanghai Zhangjiang hi tech park, Zhang Road No. 1558 Patentee after: Huanxu Electronics Co., Ltd. Address before: 000000 China Taiwan Nantou County Patentee before: Huanlong Electric Co., Ltd. |