CN100544554C - Encapsulation method of dual base board electronic module for the radio communication - Google Patents

Encapsulation method of dual base board electronic module for the radio communication Download PDF

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CN100544554C
CN100544554C CN 200610054751 CN200610054751A CN100544554C CN 100544554 C CN100544554 C CN 100544554C CN 200610054751 CN200610054751 CN 200610054751 CN 200610054751 A CN200610054751 A CN 200610054751A CN 100544554 C CN100544554 C CN 100544554C
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substrate
upper
electronic module
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lower
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CN 200610054751
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CN101035415A (en )
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张卓兴
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环隆电气股份有限公司
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Abstract

本封装方法是应用印刷的锡膏将上、下基板叠合组装,并在连接上、下基板的同时施加预定的压力以缩减叠合的厚度总和,同时,同步定位预定设置在上、下基板顶面的多个电子元件与滤波元件,以及罩覆保护所述元件的罩壳后,即可以一次的回焊过程同时将上、下基板彼此固定电连接、多个电子元件与滤波元件分别设置于上下基板顶面上,以及罩壳固定在上基板表面,而可简化整体封装过程,并同时获得体积尺寸缩减的电子模块。 This packaging method is the application of the printing paste on the lower substrate stacked assembly, and the connecting, applying a predetermined pressure while the laminated substrate to reduce the total thickness, while the synchronization is positioned at a predetermined disposed on the lower substrate after the plurality of electronic components with the top surface of the filter element, and a housing cover covering the protective element, which can simultaneously process a reflow the upper and lower substrates is fixed electrically connected to each other, a plurality of electronic components are provided with the filter element the top surface of the upper and lower substrates, and the size reduction of the volume of the electronic module housing is fixed on the substrate surface, and to simplify the overall packaging process and while obtaining.

Description

无线通讯用的双基板电子模块的封装方法 The method of packaging the electronic module two substrates used for wireless communication

技术领域 FIELD

本发明涉及一种电子模块的封装方法,特别涉及一种无线通讯用的双基板电子模块的封装方法。 The present invention relates to a method for packaging an electronic module, in particular, it relates to bis substrate packaging method of an electronic module with a wireless communication.

背景技术 Background technique

参阅图l,目前无线通讯用的双基板电子模块的封装过程,是应 Referring to Figure L, the current wireless communication with the electronic module encapsulation process two substrates is to be

用表面贴装技术(SMT, surface mount technique),依序先将锡膏100 (solder paste)印刷在预定设置一包括有至少一电阻/电容芯片(Resistor/Capacitor chip, R/Cchip)、至少一收发器(Transceiver IC)、 至少一平衡/不平衡变换器(Balun)、至少一交换开关(switch)等多个电子元件的第二元件组400,与一滤波元件500 (Filter)的上基板21 (mainboard)顶面的多个元件焊盘(componentpad)上;接着将第二元件组400的每一元件与该滤波元件500分别对应定位在印刷有锡膏层的元件焊盘上;再进行回焊(reflow)而将第二元件组400的每一元件与滤波元件500经由锡膏100与预定的元件焊盘连接固定及电连接。 Surface mount technology (SMT, surface mount technique), sequentially first paste 100 (solder paste) printed in a predetermined set comprises at least a resistor / capacitor chip (Resistor / Capacitor chip, R / Cchip), at least a the second element group transceiver (transceiver IC), at least a balanced / unbalanced transformer (balun), at least one switching exchange (switch) 400 and other electronic components, with a filter element 500 (filter) on the substrate 21 a plurality of pads on the elements (Mainboard) top surface (componentpad); then each element of the second element group 400 and 500 correspond to the filter element positioned on the printed solder paste pads element layer; then back soldering (reflow) of each element and the filter element 400 of the second element group 500 is connected paste 100 electrically connected and fixed to a predetermined member through the pad.

接着,在上基板21底面的多个基板焊盘(ballpad)上植上锡球200 (solder ball),然后依照类似的过程,将锡膏100印刷在预定设置一包括有至少一电阻/电容芯片、至少一电可擦除只读存储器(EEP ROM),及至少一倒装芯片式集成电路(Flip Chip IC)等电子元件的第一元件组300的上基板21底面的多个元件焊盘上;再将第一元件组300的每一元件分别对应定位在印刷形成有锡膏层的元件焊盘上; 最后,再经过一次回焊,使得第一元件组300的每一电子元件经由锡膏IOO与预定的元件焊盘连接固定及电连接,同时,也使锡球200固定连接在上基板21的基板銲盘上,完成上基板21的上元件工艺。 Next, on the substrate 21 on the bottom surface of the plurality of substrate pads (ballpad) planted on the solder balls 200 (solder ball), then in accordance with a similar process, solder paste 100 is printed at least a predetermined resistance is provided comprising a / capacitive chip on the bottom surface of the plurality of component pads 21 on the substrate a first set of at least one element electrically erasable read only memory (EEP ROM), and at least one flip-chip integrated circuits (flip chip IC) and other electronic components 300 ; then each element of the first element group 300 are respectively positioned on the pad member with a printed solder paste layer is formed; Finally, after a reflowing, such that each electronic component of the first element group 300 via the solder paste IOO fixed and electrically connected to a predetermined connection pad member, while leaving solder ball 200 is fixedly connected to the substrate pads on the substrate 21 to complete the process on the member 21 on the substrate. 然后将设置有第一、二元件组300、 400与该滤波元件500的上基板21,以底面朝向下基板22 (frame board)的顶面而将固定连接在上基板21的基板焊盘上的多个锡球200对应地叠放在该下基板22 顶面上的多个基板焊盘上,而完成上、下基板21、 22的相对堆叠定位;接着再经过一次回焊,使每一锡球200同时固定连接上、下基板21、 22的对应基板焊盘,而完成上、下基板21、 22的堆叠封装步骤。 It is then provided with a first and second element groups 300, 400 and the upper substrate 21 of the filter element 500, the bottom surface toward the top surface of the substrate 22 (frame board) being fixedly connected to the substrate pads on the substrate 21 a plurality of solder balls corresponding to the plurality of substrates 200 stacked on the top surface of the pad 22 of the lower substrate, and the upper completion, the lower substrate 21, the relative positioning of the stack 22; followed after one reflowing, so that each tin while ball 200 is fixedly connected to the lower substrate corresponding to the substrate pads 21, 22 is completed, the stack package in step 21, the lower substrate 22.

最后,将一罩壳23罩覆设置于上基板21顶面的第一元件组400 的每一元件以及该滤波元件500,并再经过一次回焊而使罩壳23与上基板21的顶面固定连接,而使第一元件组400与该滤波元件500 经由罩壳23保护并与外界隔绝,完成无线通讯用的双基板电子模块的整个封装过程。 Finally, a casing 23 is provided on the cover covering a top surface of the upper substrate 21 to each element of a first element group 400 and filter element 500, and then through a reflowing the housing 23 and the upper surface of the substrate 21, is fixedly connected to the first element group 400 and the filter element 500 isolated from the outside world via a protection casing 23, to complete the encapsulation process two substrates with the electronic module in wireless communication.

由上述无线通讯用的双基板电f模块的封装过程可知,目前的封装过程较为冗长繁复,同时必须经过至少四次的回焊,而每经过一次回焊,意味着各元件、基板等必须承受一次受热冷却的过程,而会增加单一元件因快速升、降温而产生故障的概率,进而导致整体双基板电子模块封装生产良率的下降。 Dual encapsulation process with the substrate electrically f module understood by the radio communication, the present encapsulation process is more complicated lengthy, and must be at least four times reflow, and each time after reflowing, mean elements, substrate or the like must withstand during the cooling a heated, but will increase the probability of a single element due to rapid heating and cooling of the failure, which led to a decline in overall electronic module package bis substrate production yields. . .

此外,单一锡球200的粒径约在0.3-0.5毫米之间,再加上设置于上基板21顶面的滤波元件500高度较高,因此封装而成的双基板电子模块的整体高度尺寸也在1.6毫米以上而无法进一步突破微縮。 In addition, a single solder ball 200 particle size between about 0.3-0.5 mm, plus 21 disposed on the surface of the filter element 500 on a substrate a higher altitude, the overall height of the package thus formed two substrates electronic module also more than 1.6 mm but not further breakthrough miniature.

因此,目前无线通讯用的双基板电子模块的封装过程必须加以縮减、简化,以提升双基板电子模块封装生产的良率,增加有效利润的所得,•同时借由封装方法的再突破以缩减封装完成的双基板电子模块的体积尺寸,满足无线通讯产品的发展需求。 Accordingly, the current encapsulation process two substrates by the wireless communication electronic module must be reduced, simplified, two substrates to enhance the production yield of the electronic module package, the resultant increase in the effective margin, • simultaneously by means of a method for packaging and then break to reduce the volumetric size of the package to complete the two substrates of the electronic module to meet the needs of wireless communication product development.

发明内容 SUMMARY

因此,本发明的一个目的是提供一种步骤简化的无线通讯用的双基板电子模块的封装方法。 It is therefore an object of the present invention is a method of packaging an electronic module bis substrate to provide a simplified step with wireless communication.

此外,本发明的另一目的是提供一种无线通讯用的双基板电子模块的封装方法,而缩减封装后所得的双基板电子模块的体积尺寸。 Further, another object of the present invention is to provide a wireless communication method using two substrates encapsulating the electronic module, and reduced package size dimensions obtained after two substrates electronic module.

5因此,本发明的无线通讯用的双基板电子模块的封装方法包含以下步骤: 5 Thus, the electronic packaging method two substrates wireless communication module according to the present invention comprises the steps of:

将一包含多个电子元件的第一元件组对应设置在一上基板的位于底面的多个焊盘上; The first element group comprising a plurality of electronic components disposed corresponding to the plurality of pads located on a bottom surface of the substrate;

将锡膏印刷在该上基板的位于顶面的多个焊盘及一环形的下基板的位于顶面的多个焊盘上; A plurality of pads on the top surface of the substrate is located under the top surface a plurality of annular lands and solder paste is printed on the upper substrate;

将该上基板以底面朝向该下基板顶面而将该上基板的底面未设置有该第一元件组的另外多个焊盘对应叠靠在该下基板的顶面上的 The bottom surface of the substrate to a bottom surface of the lower substrate facing the upper substrate and the top surface of the pads is not provided with a plurality of the first additional element group corresponding to the top surface of the stack against the lower substrate

多个印刷有锡膏的焊盘上,并使该上、下基板彼此相对定位连接; 将一包含多个电子元件的第二元件组分别对应定位在该上基板 A plurality of solder paste printed on pads, and the upper and lower substrates located opposite to each other; a second element group comprising a plurality of the electronic component on a substrate positioned in the corresponding

顶面印刷有锡膏的多个焊盘上; The top surface of the plurality of solder paste printed on pads;

将一罩壳定位在该上基板顶面上,并罩覆该第二元件组; 将上一步骤制得的半成品进行回焊,使得该上、下基板相对固定 A housing positioned on the top surface of the upper substrate, and the cover member covering the second set; and the semi-finished product obtained in step a reflowing, so that the upper and lower substrates relatively fixed

电连接、该第二元件组设置在该上基板顶面,及该罩壳与该上基板顶 Electrically connected to the second element group disposed at a top surface of the upper substrate and the upper substrate and the top casing

面连接,从而制得该双基板电子模块。 Plane connection, the two substrates to thereby produce the electronic module.

附图说明 BRIEF DESCRIPTION

下面结合附图及实施例对本发明进行详细说明,附图中: 图1是说明现有的无线通讯用的双基板电子模块的封装过程的示意图;及 In conjunction with the accompanying drawings and the following detailed description of embodiments of the present invention embodiments, the accompanying drawings in which: Figure 1 is a schematic view of a dual substrate package during conventional electronic module for explaining wireless communication; and

图2是说明本发明的无线通讯用的双基板电子模块的封装方法的一优选实施例的示意图。 FIG 2 is a schematic diagram of a preferred embodiment of the method of packaging an electronic two substrates wireless communication module according to the present invention is described.

发明详述 DETAILED DESCRIPTION

在本发明被详细描述前,要注意的是,在以下的说明内容中,类似的元件以相同的编号表示。 Before the present invention is described in detail, it should be noted that, in the following description the content, like elements are denoted by the same reference numerals.

参阅图2,本发明的一种无线通讯用的双基板电子模块的封装方法的一优选实施例,用以封装制备体积为9.6毫米X9.6毫米X1.6毫米的无线通讯用的双基板电子模块。 Referring to Figure 2, a preferred method for packaging two substrates in a wireless electronic communication module according to the present embodiment of the invention for the preparation of a volume of two substrates encapsulating electronic 9.6 mm X9.6 mm X1.6 mm wireless communication with module. 首先,将包含多个电子元件的第一元件组300分别设置在上基板31底面的多个元件焊盘上;此步骤与现有的过程相似,都是应用表面贴装技术进行,依序先将锡膏100印刷在预定设置包括有电阻/电容芯片、电可擦除只读存储器,及倒装芯片式集成电路等电子元件的第一元件组300的上基板31底面的多个元件焊盘上,接着将第一元件组300的每一元件分别对应定位在印刷有锡膏的元件焊盘上,然后以回焊将第一元件组300的每一元件经由锡膏100与预定的元件焊盘连接固定及电连接。 First, the first element group 300 comprising a plurality of electronic component elements are provided on a plurality of pads 31 on the bottom surface of the substrate; this step is similar to prior processes, are surface mount technology application, to sequentially the solder paste 100 is printed with a predetermined setting comprises a resistor / capacitor chip, a plurality of elements electrically erasable pads 31 on the bottom surface of the substrate a first electronic component element group read-only memory, and a flip-chip integrated circuit 300 on, then each of the elements of the first element group 300 are respectively positioned on the printed solder paste pads member, and then the reflow of each element of the first element group 100 and 300 via a solder paste predetermined element and an electrical connector connected to a fixed disk.

接着,将锡膏100分别印刷在预定设置包括有电阻/电容芯片、 收发器、平衡/不平衡变换器、交换开关等多个电子元件的第二元件组400的上基板31顶面的多个元件焊盘上,以及同步将锡膏100分别印刷在一环形的下基板32顶面的多个基板焊盘与预定设置该滤波元件500的多个元件焊盘上。 Next, the solder paste 100 are respectively printed on a plurality of surfaces 31 disposed on a substrate comprising a plurality of predetermined electronic components resistor / capacitor chip, a transceiver, a balance / unbalance transformer, a second switching element group and the like switches 400 a plurality of pads on the substrate with a predetermined element pads 100 and solder paste are printed synchronization in an annular surface of the lower substrate 32 of the filter element is provided a plurality of pads 500 of the elements.

然后再将上基板31以底面朝向下基板32的顶面且将底面上多个基板焊盘对应叠靠于下基板32顶面的多个基板焊盘上形成的锡膏层上,以进行上、下基板31、 32的堆叠定位,特别的是,在上基板31 堆叠定位在下基板32上时,在上基板31上施加预定重量的负载33, 而使得上、下基板31、 32受到相对靠近的预定压力,进而使得锡膏厚度被相对压縮,而在第一元件组300未凸伸出下基板32底面的情况下,使得上、下基板3K 32堆叠定位后的整体厚度实质上等于上、 下基板31、 32的厚度和,而完成上、下基板31、 32的堆叠定位。 Then the upper substrate 31 to the bottom surface toward the lower surface of the top substrate 32 and the bottom surface of the substrate pads corresponding to a plurality of solder paste layer formed on the top surface of the stack 32 against the lower substrate a plurality of substrate pads, for the stack positioning the lower substrate 31, 32, specifically, when the 31 stack positioned on a substrate on the lower substrate 32, a load is applied a predetermined weight 33 on the upper substrate 31, such that upper and lower substrates 31, 32 being relatively close a predetermined pressure, thus making the thickness of solder paste is relatively compressed, while in the absence of the bottom surface of the lower substrate 32 protrudes out of the first element group 300, so that the total thickness of the stack. 3K 32 positioned on the lower substrate is substantially equal to thickness of the lower substrate 31 and 32, the completed stack is positioned lower substrate 31, 32.

当上、下基板31、 32堆叠定位后,即可将第二元件组400的每一元件分别对应定位在上基板31顶面印刷有锡膏层的元件焊盘上, 并同步将滤波元件500对应定位在下基板32顶面印刷有锡膏层的元件焊盘后;再同步将罩壳34定位在上基板31顶面上,并使其同时罩覆第二元件组400与滤波元件500。 When the upper, 31, stack 32 is positioned under the substrate, each of the elements to the second element group 400 are respectively positioned on the pad member 31 on the substrate surface of the printed paste layer and the filter element 500 synchronous after the lower substrate 32 corresponding to the positioning surface of the printed paste layer, a pad member; resynchronizing the housing 34 is positioned on the surface of the substrate 31, and allowed to set while the cover member overlying the second member 400 and the filter 500.

最后,将经过上述步骤制得的半成品进行一次回焊,即可同时使得上、下基板31、 32相对固定与电连接、第二元件组400、滤波元件500分别与上、下基板31、 32的预定元件焊盘相对固定电连接, 以及使得罩壳34与上基板31相对固定连接,而完成双基板电子模块的封装制备。 Finally, the above steps will be obtained through a semi reflow, can at the same time such that the upper and lower substrates 31, 32 is relatively fixed and electrically connected to the second element group 400, the filter element 500, respectively upper and lower substrates 31, 32 member relative to a predetermined fixing the electrical connection pads, and so that the housing 34 and fixedly connected to the substrate 31 opposite to prepare two substrates encapsulating the electronic module is completed.

由上述说明可知,本发明的一种无线通讯用的双基板电子模块的 From the above description, the present invention is a wireless communication with the electronic module two substrates

封装方法,主要是应用印刷锡膏100取代锡球200堆叠连接上、下基板31、 32,并在叠合定位上、下基板31、 32的同时,在上基板上施加预定的负载33压力以縮减用于连接的锡膏IOO的厚度;同时,将原本高度较高的滤波元件500,简易地改变部分线路设计后改为设置在下基板32上,并同时配合改变上基板31的形状作为搭配,而可具体地将封装完成的电子模块的高度缩减至不大于1.6毫米;同时,在封装过程中,利用一次的回焊过程即完成上、下基板3K 32彼此的固定连接以及第二元件组400、滤波元件500、罩壳34与上、下基板31、 32的设置,而大幅縮减封装整体工艺。 Packaging method is the application of the printing paste solder balls 100 substituted stack 200 is connected upper and lower substrates 31, 32, and superimposed on the positioning, while the lower substrate 31, 32, a predetermined load is applied on the upper substrate 33 to the pressure reduced thickness for solder connection IOO; simultaneously, the original height of the higher filter element 500, part of the line to easily change the design is provided on the lower substrate 32, and simultaneously with changing the shape of the substrate 31 as with , and in particular can be highly finished electronic module package reduced to not more than 1.6 mm; the same time, during the packaging process, using a reflow process is complete, the lower substrate 3K 32 fixedly connected to each other and a second set of elements 400, filter element 500, the upper housing 34, 31, the lower substrate 32 is provided, sharply reducing the overall packaging process.

与现有无线通讯用的双基板电子模块的封装过程比较,本发明确实将现有封装过程中必须进行至少四次回焊的过程有效缩减至只需进行二次回焊,同时,也有效缩减整体封装的实施步骤,而可有效提升整体封装工艺的良率;同时,借由印刷锡膏以及施加压合压力进行回悍的手段,并配合改变高度较高的滤波元件500的设置位置,而有效将封装所得的双基板电子模块的高度缩减至不大于1.6毫米,整体体积尺寸为9.6毫米X 9.6毫米X 1.6毫米,符合无线通讯产品的需求, 确实达到本发明的发明目的。 Dual encapsulation process with a substrate of the electronic module comparison with the conventional wireless communications, the present invention is indeed conventional package must be at least four times during the reflow process to effectively reduce the secondary reflowing only, but also effectively reduce the overall package step embodiment, and can effectively improve the overall yield of the packaging process; the same time, return means is defended by means of the printing paste and applying a nip pressure, and change the setting position with a high height of the filter element 500, the effective double height resulting encapsulated electronic module substrate is reduced to not more than 1.6 mm, the entire volume of the X-dimension of 9.6 mm 9.6 mm 1.6 mm X-demand products conforming to the wireless communication, the invention does achieve the object of the present invention.

Claims (10)

  1. 1、一种无线通讯用的双基板电子模块的封装方法,其特征在于:该封装方法包含(a)将一包含多个电子元件的第一元件组对应设置在一上基板的位于底面的多个焊盘上;(b)将锡膏印刷在该上基板的位于顶面的多个焊盘,及一环形的下基板的位于顶面的多个焊盘上;(c)将该上基板以底面朝向该下基板顶面而将该上基板的底面未设置有该第一元件组的另外多个焊盘对应叠靠在该下基板的顶面上多个印刷有锡膏的焊盘上,并使该上、下基板彼此相对定位连接;(d)将一包含多个电子元件的第二元件组分别对应定位在该上基板位于顶面印刷有锡膏的多个焊盘上;(e)将一罩壳定位在该上基板顶面上,并罩覆该第二元件组;及(f)将步骤(e)制得的半成品进行回焊,使得该上、下基板相对固定电连接、该第二元件组设置在该上基板顶面,及该罩壳与该上基板顶面连接, 1, an electronic module packaging method bis substrate used in a wireless communication, wherein: the packaging method comprising (a) a first element comprising a set of a plurality of electronic components disposed corresponding to a plurality of bottom surface located on the substrate the pads; (b) the solder paste printed on a plurality of pads on the top surface of the plurality of pads on the top surface of the upper substrate, a lower substrate and annular; (c) the substrate a bottom surface of the bottom surface of the lower substrate facing the upper substrate and the top surface of the pads is not provided with a further plurality of the first element group corresponding to the plurality of the lower top surface of the printed substrate against a stack of pads have solder paste , and the upper and lower substrates relative to each other are connected; (d) the second element group comprises a plurality of electronic components are respectively positioned on the plurality of pads on the top surface of the upper substrate printed with solder paste; ( e) a housing positioned on the top surface of the upper substrate, and the cover member covering the second set; and (f) the semi-finished product obtained in step (e) reflowing, so that the upper and lower fixed electrode opposite the substrate connected to a second element group disposed at a top surface of the upper substrate, and said casing and connected to the top surface of the upper substrate, 从而制得该双基板电子模块。 The thus prepared two substrates electronic module.
  2. 2、 如权利要求1所述的无线通讯用的双基板电子模块的封装方法,其特征在于:该步骤(a)以表面贴装技术将该第一元件组的每一元件对应设置在该上基板底面的多个焊盘上。 Bis substrate packaging method of an electronic module as claimed in claim 1, said wireless communication use, wherein: the step (a) Each element in the SMT corresponding to a first element group disposed in the upper a plurality of pads on the bottom surface of the substrate.
  3. 3、 如权利要求1所述的无线通讯用的双基板电子模块的封装方法,其特征在于:该步骤(c)使该上、下基板彼此相对定位连接的同时,施加一使该上、下基板相对靠近的预定压力,以薄化印刷在焊盘上的锡膏。 Bis substrate packaging method of an electronic module as claimed in claim 1, said wireless communication use, wherein: the step (c) so that the upper and lower substrates relative to each other simultaneous connections, so that the application of an upper and lower predetermined pressure is relatively close to the substrate, to thin pad on the printed solder paste.
  4. 4、 如权利要求3所述的无线通讯用的双基板电子模块的封装方法,其特征在于:该预定压力在该上基板顶面施加预定重量的负载形成,而使该上、下基板彼此相对靠近以薄化印刷在焊盘上的锡膏。 Bis substrate packaging method of an electronic module 4, wireless communication as claimed in claim 3 with, wherein: the predetermined pressure is applied to the top surface of the upper substrate in a predetermined load weight is formed, so that the upper and lower substrates facing each other close to thin pad on the printed solder paste.
  5. 5、 如权利要求1所述的无线通讯用的双基板电子模块的封装方法,其特征在于:该上、下基板借助锡膏彼此相对连接后的整体厚度实质上等于上、下基板的厚度和。 The method of packaging an electronic module substrate 5 bis, as claimed in claim 1, said wireless communication use, wherein: the upper and lower substrates by means of the overall thickness of the connector relative to each other is substantially equal to the paste, the thickness of the lower substrate and .
  6. 6、 如权利要求1所述的无线通讯用的双基板电子模块的封装方法,其特征在于:经过该步骤(C)后所得的半成品,其设置在该上基板底面的第一元件组未凸伸出该下基板的底面。 6, dual-substrate packaging method of wireless communication electronic module as claimed in claim 1 with, characterized in that: after the semi-finished product obtained in Step (C), the projections are not provided in the first element group on the substrate bottom surface projecting a bottom surface of the lower substrate.
  7. 7、 如权利要求1所述的无线通讯用的双基板电子模块的封装方法,其特征在于:该步骤(d)中还将一滤波元件同步定位于该下基板顶面未被该上基板遮覆的区域的多个印刷有锡膏的焊盘上。 Bis substrate packaging method of an electronic module as claimed in claim 1, said wireless communication use, wherein: the step (d), a filter element will be positioned in the top surface of the synchronized lower substrate upper substrate not covered by the cover a plurality of print areas are coated on the solder pads.
  8. 8、 如权利要求7所述的无线通讯用的双基板电子模块的封装方法,其特征在于:该罩壳罩覆该滤波元件。 The method of packaging electronic module two substrates 8, wireless communication as claimed in claim 7, wherein the, wherein: the housing cover covering the filter element.
  9. 9、 如权利要求1所述的无线通讯用的双基板电子模块的封装方法其特征在于:第一元件组包含至少一电阻/电容芯片、至少一电可擦除只读存储器,及至少一倒装芯片式集成电路。 9, the double packaging method of wireless communication electronic module substrate according to claim 1 is used wherein: a first element group includes at least a resistor / capacitor chip, at least one electrically erasable read only memory, and at least one inverted mounted IC chip.
  10. 10、 如权利要求1所述的无线通讯用的双基板电子模块的封装方法,其特征在于:第二元件组包含至少一电阻/电容芯片、至少一收发器、至少一平衡/不平衡变换器,及至少一交换开关。 The method of packaging the electronic module 10, two substrates as claimed in claim 1, said wireless communication use, wherein: a second element group includes at least a resistor / capacitor chip, at least one transceiver, at least a balance / unbalance transformer and at least one switching exchange.
CN 200610054751 2006-03-10 2006-03-10 Encapsulation method of dual base board electronic module for the radio communication CN100544554C (en)

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JP2003218273A (en) 2002-01-23 2003-07-31 Ibiden Co Ltd Semiconductor chip-mounting circuit board and its manufacturing method, and semiconductor module
CN1574261A (en) 2003-05-27 2005-02-02 精工爱普生株式会社 Method of mounting electronic component, structure for mounting electronic component, electronic component module, and electronic apparatus
GB2412790A (en) 2004-04-02 2005-10-05 Univ City Hong Kong Process for the assembly of electronic devices

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5647121A (en) 1993-07-16 1997-07-15 Dallas Semiconductor Corporation Method of assembling electronic component
US6437990B1 (en) 2000-03-20 2002-08-20 Agere Systems Guardian Corp. Multi-chip ball grid array IC packages
JP2003218273A (en) 2002-01-23 2003-07-31 Ibiden Co Ltd Semiconductor chip-mounting circuit board and its manufacturing method, and semiconductor module
CN1574261A (en) 2003-05-27 2005-02-02 精工爱普生株式会社 Method of mounting electronic component, structure for mounting electronic component, electronic component module, and electronic apparatus
GB2412790A (en) 2004-04-02 2005-10-05 Univ City Hong Kong Process for the assembly of electronic devices

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