CN101032013B - 基于有效测量量程而动态调整测量采样的方法及系统 - Google Patents

基于有效测量量程而动态调整测量采样的方法及系统 Download PDF

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Publication number
CN101032013B
CN101032013B CN2005800332932A CN200580033293A CN101032013B CN 101032013 B CN101032013 B CN 101032013B CN 2005800332932 A CN2005800332932 A CN 2005800332932A CN 200580033293 A CN200580033293 A CN 200580033293A CN 101032013 B CN101032013 B CN 101032013B
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China
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measurement
rate
tools
sampling rate
job
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Expired - Fee Related
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Chinese (zh)
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CN101032013A (zh
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M·A·普尔迪
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GlobalFoundries Inc
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GlobalFoundries Inc
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • General Factory Administration (AREA)
  • Apparatus For Radiation Diagnosis (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
CN2005800332932A 2004-10-05 2005-06-23 基于有效测量量程而动态调整测量采样的方法及系统 Expired - Fee Related CN101032013B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/958,891 US7076321B2 (en) 2004-10-05 2004-10-05 Method and system for dynamically adjusting metrology sampling based upon available metrology capacity
US10/958,891 2004-10-05
PCT/US2005/022424 WO2006041543A1 (en) 2004-10-05 2005-06-23 Method and system for dynamically adjusting metrology sampling based upon available metrology capacity

Publications (2)

Publication Number Publication Date
CN101032013A CN101032013A (zh) 2007-09-05
CN101032013B true CN101032013B (zh) 2011-07-06

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CN2005800332932A Expired - Fee Related CN101032013B (zh) 2004-10-05 2005-06-23 基于有效测量量程而动态调整测量采样的方法及系统

Country Status (8)

Country Link
US (1) US7076321B2 (https=)
JP (1) JP2008516447A (https=)
KR (1) KR20070061868A (https=)
CN (1) CN101032013B (https=)
DE (1) DE112005002474B4 (https=)
GB (1) GB2434882B (https=)
TW (1) TWI369749B (https=)
WO (1) WO2006041543A1 (https=)

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US7257502B1 (en) * 2006-02-28 2007-08-14 Advanced Micro Devices, Inc. Determining metrology sampling decisions based on fabrication simulation
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US8170704B2 (en) 2008-03-31 2012-05-01 Globalfoundries Inc. Method and system for automatic generation of throughput models for semiconductor tools
US8559001B2 (en) * 2010-01-11 2013-10-15 Kla-Tencor Corporation Inspection guided overlay metrology
US9228943B2 (en) 2011-10-27 2016-01-05 Kla-Tencor Corporation Dynamically adjustable semiconductor metrology system
NL2009853A (en) 2011-12-23 2013-06-26 Asml Netherlands Bv Methods and apparatus for measuring a property of a substrate.
DE102012200066B4 (de) * 2012-01-03 2020-09-03 Endress + Hauser Process Solutions Ag Verfahren und Einrichtung zur Visualisierung von Informationen in einer Prozessanlage
US9816370B2 (en) * 2012-09-19 2017-11-14 Honeywell International Inc. System and method for optimizing an operation of a sensor used with wellbore equipment
CN102945030B (zh) * 2012-11-02 2015-04-01 上海华力微电子有限公司 一种有效控制晶圆生产过程中生产周期失控的方法
US9760020B2 (en) 2012-11-21 2017-09-12 Kla-Tencor Corporation In-situ metrology
US10133263B1 (en) 2014-08-18 2018-11-20 Kla-Tencor Corporation Process condition based dynamic defect inspection
TWI539298B (zh) * 2015-05-27 2016-06-21 國立成功大學 具取樣率決定機制的量測抽樣方法 與其電腦程式產品
US10754260B2 (en) 2015-06-18 2020-08-25 Kla-Tencor Corporation Method and system for process control with flexible sampling
WO2017053150A1 (en) * 2015-09-21 2017-03-30 Kla-Tencor Corporation Method and system for process control with flexible sampling
WO2017080727A1 (en) * 2015-11-11 2017-05-18 Asml Netherlands B.V. Method and apparatus for predicting performance of a metrology system
CN108931336A (zh) * 2017-05-23 2018-12-04 北京航天计量测试技术研究所 一种高稳定性压力控制算法
KR101995112B1 (ko) * 2017-06-14 2019-09-30 에스케이 주식회사 장비신뢰지수에 기초한 Lot 리스크 스코어 기반의 동적 Lot 계측 제어방법 및 시스템
CN115083936B (zh) * 2021-03-10 2025-01-10 长鑫存储技术有限公司 采样量测方法、系统、计算机设备及存储介质
US12000882B2 (en) 2021-03-10 2024-06-04 Changxin Memory Technologies, Inc. Sampling measurement method, system, computer device and storage medium

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Also Published As

Publication number Publication date
CN101032013A (zh) 2007-09-05
GB0705693D0 (en) 2007-05-02
DE112005002474T5 (de) 2007-09-06
US20060074503A1 (en) 2006-04-06
GB2434882B (en) 2009-01-21
JP2008516447A (ja) 2008-05-15
US7076321B2 (en) 2006-07-11
KR20070061868A (ko) 2007-06-14
TW200623300A (en) 2006-07-01
TWI369749B (en) 2012-08-01
WO2006041543A1 (en) 2006-04-20
DE112005002474B4 (de) 2017-02-09
GB2434882A (en) 2007-08-08

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