CN101026690A - Image pickup apparatus - Google Patents
Image pickup apparatus Download PDFInfo
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- CN101026690A CN101026690A CNA2007100070875A CN200710007087A CN101026690A CN 101026690 A CN101026690 A CN 101026690A CN A2007100070875 A CNA2007100070875 A CN A2007100070875A CN 200710007087 A CN200710007087 A CN 200710007087A CN 101026690 A CN101026690 A CN 101026690A
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Abstract
The invention provides an imaging apparatus to secure enough the adhesive strength of the adhesive portion interposed between the FPC and the imaging element. The image apparatus comprises: an imaging element comprising a pixel region and an electrode disposed in the portion adjacent to the pixel region; an electric board including the image pickup device arranged to cover an opening and a connection pattern arranged in the vicinity of an edge portion of the opening, in which a first adhesive is applied between the image pickup device and the electric board from the outer edge of the image pickup device at least to an electric connection portion between the connection pattern and the electrode and applied annularly with a first band along an outer edge of the image pickup device; and a protective cover fixed by a second adhesive so as to cover the opening on the reverse surface of the imaging element fixing surface of the electric board to protect the imaging area of the imaging element, wherein the second adhesive is applied annularly with a second band around the opening so that the first band width overlaps within the second one when viewed in a direction orthogonal with the opening plane.
Description
Technical field
The present invention relates to camera head, in detail, relate to and have that the imaging apparatus that will be made of bare chip and cover glass are adhesively fixed on the electric substrate and the camera head of the image unit that forms.
Background technology
In the past, adopt the electronic equipment of the digital camera etc. of following structure generally to obtain practicability and extensively popularize, that is: make according to inciding the formed shot object image of the light beam from subject on the photographic optical system and be imaged on the imaging apparatus that constitutes by bare chip that is disposed at assigned position (charge coupled cell (CCD for example; Charge Coupled Device) etc. on the sensitive surface), this shot object image can be waited record as the view data of prescribed form.
As the form of the image unit in the camera head of the digital camera of packing into etc., for example image unit (with reference to this communique Fig. 2) of disclosed bare chip mounting structure such as TOHKEMY 2002-218293 communique is arranged.
That is, flexible printing substrate (FPC) uses bonding agent to be bonded on the cover glass.The imaging apparatus that is made of bare chip is connected with the face of projection with the opposition side of the bonding plane that is bonded with cover glass on this flexible printing substrate via electrode pad.In this case, the sensitive surface of imaging apparatus is configured to cover glass opposed.
Then, bonding agent being coated on this electrode pad and projection goes up with its covering.Thus, flexible printing substrate and imaging apparatus adhesive bond, and the hermetically-sealed construction of the sensitive surface (pixel region) of formation imaging apparatus.
As mentioned above, the image unit in the existing general camera head adopts the bare chip mounting structure, and the bare chip (imaging apparatus) that this structure uses bonding agent to be made of the tabular component of hard is bonded on the flexible printing substrate of the soft tabular component of conduct.
And, in the common imaging apparatus that constitutes by bare chip, generally be designed to make pixel region big as far as possible with respect to chip form.Therefore, have following tendency, that is: be arranged on and the same one side of the face that is formed with pixel region of bare chip (imaging apparatus) and and the circumference of the electrode at the position of this pixel region adjacency and this pixel region between be short interval.
Yet, in the image unit of the bare chip mounting structure of the above-mentioned form of employing in existing camera head, can not guarantee the abundant adhesive strength of adhesive portion sometimes.
For example the flexible printing substrate is being applied under the situation of external force, during near this external force is delivered to the bonding position of this flexible printing substrate and imaging apparatus bonding agent, considering that bonding agent can be stripped from, perhaps can crack.
And, in other example, for example as shown in figure 12, in camera head with the image unit that adopts the bare chip mounting structure, wherein, this bare chip mounting structure uses bonding agent 131 that the imaging apparatus 121 that is made of bare chip is connected with flexible printing substrate 117, under the interval of the medial end of the circumference of pixel region 121a and electrode 130 is set shortly situation, can not fully guarantee the inside part of the electrode 130 among the bonding scope C of the bonding agent 131 between this imaging apparatus 121 and the flexible printing substrate 117, i.e. the bonding scope B ' of the part between electrode 130 and the pixel region 121a.Therefore, in this case, existence can not be guaranteed sufficient bonding reliability problems.
Summary of the invention
The purpose of this invention is to provide a kind ofly in having camera head, fully guarantee the adhesive strength at bonding position of electric substrate and bare chip (imaging apparatus) and camera head with reliability with the image unit that bare chip (imaging apparatus) is installed in the bare chip mounting structure on the electric substrate.
Camera head of the present invention is the camera head that imaging apparatus is installed on electric substrate, it is characterized in that, this camera head has: imaging apparatus, it is made of bare chip, this bare chip have pixel region and be arranged on this pixel region with one side and with the electrode of this pixel region on the position; Electric substrate, it has and is used for the connection figure that is connected with above-mentioned electrode near opening and the edge portion that is configured in this opening, for this electric substrate and above-mentioned imaging apparatus are fixed, first bonding agent is coated between above-mentioned imaging apparatus and this electric substrate at least to the electrical connections of above-mentioned connection figure and above-mentioned electrode and is coated in the form of a ring in first zone along the periphery of above-mentioned imaging apparatus from the outer rim of above-mentioned imaging apparatus; And protective cover, it is made of transparent component, in order to protect the camera watch region of above-mentioned imaging apparatus, on the face of the opposition side of the face that is fixed with above-mentioned imaging apparatus of above-mentioned electric substrate, use second bonding agent be fixed in the form of a ring above-mentioned opening around second zone in to cover above-mentioned opening; Above-mentioned second bonding agent is coated with when above-mentioned first zone being overlapped in above-mentioned second zone when observing with the direction of above-mentioned plane of the opening quadrature.
And, camera head of the present invention is equipped with imaging apparatus on electric substrate, it is characterized in that, this camera head has: imaging apparatus, it is made of bare chip, this bare chip have pixel region and be arranged on this pixel region with one side and with the electrode of this pixel region on the position; And electric substrate, it has opening and disposes above-mentioned imaging apparatus and be used for the connection figure that is connected with above-mentioned electrode near the edge portion of this opening to cover this opening and to be configured in, and is separating the opening inner edge that position more than the 0.3mm is formed with above-mentioned opening from above-mentioned electrode to above-mentioned pixel region.
And camera head of the present invention is characterised in that this camera head has: imaging apparatus, it is made of bare chip, this bare chip have pixel region and be arranged on this pixel region with one side and with the electrode of this pixel region on the position; And electric substrate, it has opening and disposes above-mentioned imaging apparatus and be used for the connection figure that is connected with above-mentioned electrode near the edge portion of this opening to cover this opening and to be configured in, fix in order to make this electric substrate and above-mentioned imaging apparatus, bonding agent is banded coating along the periphery of above-mentioned imaging apparatus, so that coat the electrical connections of above-mentioned connection figure and above-mentioned electrode at least, separating the opening inner edge that position more than the 0.3mm is formed with above-mentioned opening from the end of above-mentioned electrode to above-mentioned pixel region from the outer rim of above-mentioned imaging apparatus.
And camera head of the present invention has: electric substrate, and it has opening and a plurality of figures that are connected on every side that are arranged on this opening; And imaging apparatus, it is made of bare chip, this bare chip have pixel region with in order to be electrically connected and to be arranged on this pixel region and to separate the electrode at the interval more than the 0.3mm from this pixel region with one side and along the periphery of this pixel region with above-mentioned the connection with figure, and be installed on the above-mentioned electric substrate to cover the above-mentioned opening of above-mentioned electric substrate.
These purposes of the present invention and interests will be clearer from following detailed description.
According to the present invention, can provide a kind of in having camera head, fully guarantee the adhesive strength at bonding position of electric substrate and bare chip (imaging apparatus) and camera head with reliability with the image unit that bare chip (imaging apparatus) is installed in the bare chip mounting structure on the electric substrate.
Description of drawings
Fig. 1 is the perspective view that the part taking-up of the camera head of the 1st execution mode of the present invention is illustrated;
Fig. 2 is along the profile of Fig. 1 [II]-[II] line;
Fig. 3 is the front view of structure that the image unit of present embodiment is shown;
Fig. 4 is the decomposition diagram of structure that the image unit of present embodiment is shown from the front side;
Fig. 5 is the perspective view from the assembled state of the image unit of front side observation present embodiment;
Fig. 6 is the decomposition diagram of structure that the image unit of present embodiment is shown from rear side;
Fig. 7 is the decomposition diagram of assembled state that the image unit of present embodiment is shown from rear side;
Fig. 8 is illustrated in the image unit of present embodiment, imaging apparatus and cover glass is adhesively fixed on the profile of the state on the flexible printing substrate;
Fig. 9 be the part of Fig. 8 is amplified and illustrate want portion's amplification profile;
Figure 10 is illustrated in the camera head of the 2nd execution mode of the present invention, portion's amplification profile to what imaging apparatus was adhesively fixed on state on the flexible printing substrate;
Figure 11 wants portion's amplification view when the arrow directions X of Figure 10 is observed;
Figure 12 is the profile that the summary of the bare chip mounting structure in the existing camera head is shown.
Embodiment
Below, the present invention will be described to use illustrated execution mode.
Fig. 1 and Fig. 2 partly take out the reflector box as the single-lens reflex digital camera (being designated hereinafter simply as digital camera) of the camera head of the image unit of using the 1st execution mode of the present invention and the figure that illustrates.Wherein, Fig. 1 has removed fuselage fixture (body mount) and other perspective view to this reflector box part that portion of unwanted mechanism is described.Fig. 2 is along the profile of Fig. 1 [II]-[II] line.And Fig. 3 is the front view of structure that the image unit of present embodiment is shown.
Fig. 4 and Fig. 6 are the decomposition diagrams of structure that the image unit of present embodiment is shown.Wherein, Fig. 4 is the figure that observes from the front side.Fig. 6 is the figure that observes from rear side.Fig. 5 and Fig. 7 are the perspective views of assembled state of the image unit of present embodiment.Wherein, Fig. 5 is the figure that observes from the front side.Fig. 7 is the figure that observes from rear side.Fig. 8 is illustrated in the image unit of present embodiment, imaging apparatus and cover glass is adhesively fixed on the profile of the state on the flexible printing substrate.Fig. 9 be the part of Fig. 8 is amplified and illustrate want portion's amplification profile.
As shown in Figure 1, (Fig. 1 illustrates to have the fuselage of placement fixture 13 at the front surface of the main part 11 of reflector box 10.With reference to Fig. 2) fixture placed side 13a.This fuselage fixture 13 is provided with in order to make photographing lens barrel (the not illustrating) disassembled and assembled freely on main part 11 with photographic optical system.Therefore, in the time of on this fuselage fixture 13 being installed in lens barrel (not illustrating), the optical axis O (with reference to Fig. 2) of the photographic optical system of lens barrel is configured to the approximate centre portion by fuselage fixture 13, and the fixture face of fuselage fixture 13 is set to the face with the optical axis O quadrature of photographic optical system.
At the rear of main part 11, be set with respect to this main part 11 and comprise the image unit of imaging apparatus 21 grades described later in the camera head of the interior present embodiment that waits formations by fixed component 15, protection member 16, flexible printing substrate 17 (FPC).
The image unit of the camera head of present embodiment as Fig. 2～shown in Figure 5, mainly is made of fixed component 15, protection member 16, flexible printing substrate 17, radiating component 20, imaging apparatus 21, cover glass 24 etc.
Fixed component 15 is to become the member of this image unit with respect to the positioning reference of reflector box 10.In addition, fixed component 15 uses tabular hardened member, for example waits and forms as the aluminum of hardware, stainless steel material etc. and pottery, moulding part.
It is bigger and be arranged on the opposed position of sensitive surface (camera watch region) with imaging apparatus 21 than imaging apparatus 21 that cover glass 24 is configured to profile, from but the protective cover that is provided with for the camera watch region of protecting imaging apparatus 21.This cover glass 24 uses the transparent component of glass of writing board shape for example etc. to wait and forms.
In addition, as shown in Figure 2, the front surface side at cover glass 24 is equipped with successively: optics low pass filter (the Low Pass Filter that eliminates high fdrequency component from seeing through photographic optical system (not illustrating) the light beam from subject (hereinafter referred to as the subject light beam) of incident; Be designated hereinafter simply as optics LPF) 26, and control is to the shutter 27 of the irradiation time of the subject light beam of the sensitive surface incident of imaging apparatus 21 etc.
The member configuration of each member of formation of the image unit in the camera head of present embodiment is as described below.
At a face of flexible printing substrate 17, promptly rear side disposes imaging apparatus 21, to cover opening 17a.In this case, flexible printing substrate 17 and imaging apparatus 21 use first bonding agent 31 to come mechanical fixation at least.
That is the circumference of the rear side of flexible printing substrate 17 and opening 17a and to be sensitive surface (pixel region 21a) with a face of imaging apparatus 21 use first bonding agent 31 bonding except the bossing of electrode 30 (with reference to Fig. 8) with the outer peripheral edges portion of one side side.
In more detail, first bonding agent 31 is from the outer rim of imaging apparatus 21 electrical connections at least to the electrode 30 of the connection figure of flexible printing substrate 17 and imaging apparatus 21, is coated in the form of a ring in first zone between imaging apparatus 21 and flexible printing substrate 17 and along the periphery of imaging apparatus 21.That is, first bonding agent 31 be coated on flexible printing substrate 17 opening 17a around.
Then, first bonding agent 31 is banded coating along the periphery of imaging apparatus 21, around coated electrode 30, in detail, coats the connection figure of flexible printing substrate 17 and the electrical connections of electrode 30 from the outer rim 21b of imaging apparatus 21.Thus, imaging apparatus 21 is configured under the state at the regulation position of the rear side that is fixed in flexible printing substrate 17, and the pixel region 21a of imaging apparatus 21 is exposed from opening 17a.
At the another side of flexible printing substrate 17 is that the outer peripheral edges portion of the rear side of the circumference of face side and opening 17a and cover glass 24 uses second bonding agent 25 bonding.
In more detail, second bonding agent 25 be coated in the form of a ring flexible printing substrate 17 opening 17a around second zone in.In addition, second bonding agent 25 that uses in this part uses the bonding agent of ultraviolet hardening for example etc.
By making this cover glass 24 and flexible printing substrate 17 bonding, make near the sensitive surface of imaging apparatus 21 space with respect to outside seal, form hermetically-sealed construction from this sensitive surface of outer protection.
On the other hand, be on the face of sensitive surface opposition side of imaging apparatus 21 in the rear side of imaging apparatus 21, use bonding agent (with reference to Fig. 2) to be bonded with radiating component 20.
And, in the rear side of this radiating component 20,, use bonding agent 32 to be adhesively fixed with fixed component 15 via the hole 15a that is arranged in the fixed component 15.And hole 15b uses when making radiating component 20 be bonded on the fixed component 15.In addition, about making details that thermal component 20 is bonded in the method on the fixed component 15, thereby omit its explanation owing to do not have relatedly with the present invention.
Then, this fixed component 15 uses the method for tightening Screw etc. to be fixed on the regulation position of main part 11.Therefore, imaging apparatus 21 is fixedly installed on the regulation position of main part 11 of reflector box 10.
Below, the flexible printing substrate 17 and the bonding position of cover glass 24 and imaging apparatus 21 are described in detail.
As mentioned above, the circumference of the rear side of the outer peripheral edges portion of the sensitive surface side of imaging apparatus 21 and flexible printing substrate 17 and opening 17a is adhesively fixed by first bonding agent 31 on every side that spreads to electrode 30.This first bonding agent 31 uses the particularly bonding agent of insulating properties.Then, first bonding agent 31 be scattered in coated electrode 30 around, thereby guarantee near the electrode 30 insulating properties.
Here, suppose representing by symbol B in the bonding scope (coating scope) of imaging apparatus 21 and first bonding agent 31 of flexible printing substrate 17 from the center of electrode 30 to apposition in the scope at the position shown in the symbol A of Fig. 8 of the outer most edge of the bonding agent 31 of the periphery outside of imaging apparatus 21 and Fig. 9.Scope shown in this symbol B is above-mentioned first zone.
On the other hand, it is bonding that the outer peripheral edges portion of the back of the body face side of the circumference of the face side of flexible printing substrate 17 and opening 17a and cover glass 24 uses second bonding agent 25.This second bonding agent 25 uses bonding agent of ultraviolet hardening for example etc.
Here; suppose the bonding scope (the coating scope of second bonding agent 25) of second bonding agent 25 of flexible printing substrate 17 and cover glass 24, promptly represent by symbol C as shown in Figure 9 to the scope of the opening 17a side at the center of electrode 30 from the outside of the outer most edge of bonding agent 31.The scope that this symbol C represents is above-mentioned second zone.
Like this; suppose and using first bonding agent 31 and second bonding agent 25 imaging apparatus 21 and cover glass 24 to be adhesively fixed under the situation on the flexible printing substrate 17 respectively; for example flexible printing substrate 17 has been applied the court for example during the external force of the arrow F1 direction of Fig. 9 that makes its bending, and consequent stress becomes the stress that flexible printing substrate 17 is peeled off at the bonding position that this schematic symbol A represents.
And, suppose under equal state, applied pressing force to the back of the body surface of for example imaging apparatus 21, during promptly towards the external force of the arrow F2 direction of Fig. 9, consequent stress becomes from carrying on the back the stress of surface pushing imaging apparatus 21, and becomes the stress that flexible printing substrate 17 is peeled off at the bonding position that this schematic symbol A represents.
Therefore, in the camera head of present embodiment, as shown in Figure 9, the bonding scope C of second bonding agent 25 comprises the regulation coating scope in the bonding scope of first bonding agent 31, promptly from the center of electrode 30 to the scope B at the position that the symbol A of Fig. 8 and Fig. 9 represents.
That is, when when observing with the direction of the planar quadrature of the opening 17a of flexible printing substrate 17 (with reference to Fig. 8 and Fig. 9), the first zone B of first bonding agent 31 is applied second bonding agent 25, so that overlap in the second zone C of second bonding agent 25.
As described above such, according to above-mentioned the 1st execution mode, because the bonding scope C (second zone) of second bonding agent 25 comprises the regulation coating scope B (first zone) in the bonding scope of first bonding agent 31, thereby can adopt with respect to the structure that the pressing force on the back of the body surface of for example imaging apparatus 21 (towards the external force of the arrow F2 direction of Fig. 9) and the stress that flexible printing substrate 17 is peeled off at the bonding position that this schematic symbol A represents is also had abundant intensity.
Below the camera head of the 2nd execution mode of the present invention is described.
Figure 10 is illustrated in the camera head of the 2nd execution mode of the present invention, imaging apparatus is adhesively fixed on the profile of the state on the flexible printing substrate.Figure 11 amplifies the part of Figure 10 and illustrates, and is to want portion's amplification view when arrow directions X shown in Figure 10 is observed.
In above-mentioned the 1st execution mode; when the camera head as assembly has been applied external force; consider the patience of the bonding fissility between flexible printing substrate 17 and cover glass 24 and the imaging apparatus 21; be bonded in the bonding scope at the bonding position of cover glass 24 on the flexible printing substrate 17 and imaging apparatus 21 by regulation, realize the camera head that has abundant intensity and have high reliability.
By contrast; in the present embodiment; consider the adhesive strength between flexible printing substrate 17 and cover glass 24 and the imaging apparatus 21; be bonded in the bonding scope at the bonding position of the imaging apparatus 21 on the flexible printing substrate 17 by regulation; fully guarantee the bonding scope of bonding agent 31 between the two, the camera head of realizing having required and sufficient adhesion strength and having high reliability.
The camera head of present embodiment adopts the roughly the same structure of camera head with above-mentioned the 1st execution mode.Therefore, omit explanation, below only different piece is described in detail about the structure identical with above-mentioned the 1st execution mode.
As illustrated in above-mentioned the 1st execution mode, first bonding agent 31 is banded coating along the periphery of imaging apparatus 21, so that coat the connection figure of flexible printing substrate 17 and the electrical connections of electrode 30 from the outer rim 21b of imaging apparatus 21.Thus, imaging apparatus 21 is configured under the state at the regulation position of the back of the body face side that is fixed in flexible printing substrate 17, and the pixel region 21a of imaging apparatus 21 is exposed from opening 17a.
The flexible printing substrate 17 of the image unit in the camera head of present embodiment is pressed formation as follows with the bonding position of imaging apparatus 21.
That is, as mentioned above, the circumference of the outer peripheral edges portion of the sensitive surface side of imaging apparatus 21 and the back of the body face side of flexible printing substrate 17 and opening 17a is adhesively fixed by first bonding agent 31 on every side that spreads to electrode 30.
This first bonding agent 31 uses the particularly bonding agent of insulating properties.Then, first bonding agent 31 is zonal distribution along the periphery of imaging apparatus 21, so as the electrical connections of the connection figure that coats flexible printing substrate 17 from the outer rim 21b of imaging apparatus 21 and electrode 30 around, thereby guarantee near the insulating properties that electrode 30 is.
Here, suppose that the end from electrode 30 in the bonding scope (coating scope) of imaging apparatus 21 and first bonding agent 31 of flexible printing substrate 17 is that the bonding scope of direction of the circumference of pixel region 21a is represented (with reference to Figure 10 and Figure 11) by symbol X towards the inboard.
And, suppose from the end of electrode 30 inwards to the interval of the inner edge end 17b of the opening 17a of flexible printing substrate 17 and represent (with reference to Figure 10 and Figure 11) by symbol Y.
In the camera head of present embodiment, as Fig. 8 and shown in Figure 9, the inner edge end 17b of the opening 17a of flexible printing substrate 17 is set to circumference from the medial end of electrode 30 towards pixel region 21a and separates position more than the 0.3mm (Y 〉=0.3mm).
Then, the bonding scope X towards the direction of the circumference of pixel region 21a from the end of electrode 30 in the bonding scope of first bonding agent 31 is configured to be accommodated in the inner edge end 17b of the opening 17a from electrode 30 to flexible printing substrate 17, promptly in the scope of above-mentioned size of space Y.That is, bonding scope A is configured to the medial end 0.3mm (Y 〉=0.3mm＞X) less than distance electrode 30.
And, under the situation of the dimensional tolerance of the opening 17a that considers flexible printing substrate 17, be necessary to consider that opening 17a reduces other situation of this difference in size.For example, the dimensional tolerance of opening 17a is being set at ± situation of 0.05mm under, more preferably, the above-mentioned size of space is set to:
Y≥0.3mm+0.05mm×2
≥0.4mm
In other words, can be from the distance of the end of the outer thoughtful electrode 30 of pixel region 21a more than or equal to 0.4mm.
In addition, when the incident angle of the light D (with reference to Fig. 9) that considers to incide pixel region 21a, it is not overlapping and size opening 17a is bigger than the peripheral dimension of pixel region 21a with the inner edge end 17b of opening 17a to be necessary that above-mentioned size of space Y is set for the circumference that makes pixel region 21a.
As described above such, according to above-mentioned the 2nd execution mode, separate the position more than the 0.3mm or separate position more than the 0.4mm owing to set for the inner edge end 17b of the opening 17a of flexible printing substrate 17 is formed on from the end of electrode 30 towards pixel region 21a, thereby can fully guarantee the bonding scope of first bonding agent 31 between flexible printing substrate 17 and the imaging apparatus 21, thereby can realize the camera head guaranteeing sufficient adhesion strength and have reliability.
In addition, in the respective embodiments described above,, adopted the transparent component etc. of the glass etc. of writing board shape, yet be not limited thereto as the application examples of cover glass 24.As the example of cover glass 24, can also be low pass filter for example in addition, also can be applied to infrared ray cut filter etc. equally.
And, in the respective embodiments described above,, use flexible printing substrate 17 to be described, yet be not limited thereto as the example of electric substrate.As the application examples of electric substrate, the thin base of application examples such as hard etc. too.
And, in the respective embodiments described above, use first bonding agent 31 that imaging apparatus 21 and flexible printing substrate 17 as electric substrate are bonded together, yet be not limited thereto with insulating properties.For example, imaging apparatus 21 and flexible printing substrate 17 can certainly use and comprise by pushing the bonding agent of the conducting particles with conductivity.
Obviously, in the present invention, under the situation of the spirit and scope that do not deviate from invention, can be formed in interior different execution mode on a large scale according to the present invention.The present invention is defined by the following claims, and not restricted by its specific implementations.
Claims (7)
1. camera head, it is equipped with imaging apparatus on electric substrate, it is characterized in that, and this camera head has:
Above-mentioned imaging apparatus, it is made of bare chip, this bare chip have pixel region and be arranged on this pixel region with one side and with the electrode of this pixel region on the position;
Above-mentioned electric substrate, it has and is used for the connection figure that is connected with above-mentioned electrode near opening and the edge portion that is configured in this opening, for this electric substrate and above-mentioned imaging apparatus are fixed, first bonding agent is coated between above-mentioned imaging apparatus and this electric substrate at least to the electrical connections of above-mentioned connection figure and above-mentioned electrode and is coated in the form of a ring in first zone along the periphery of above-mentioned imaging apparatus from the outer rim of above-mentioned imaging apparatus; And
Protective cover; it is made of transparent component; in order to protect the camera watch region of above-mentioned imaging apparatus; on the face of the opposition side of the face that is fixed with above-mentioned imaging apparatus of above-mentioned electric substrate; use second bonding agent be fixed in the form of a ring above-mentioned opening around second zone in to cover above-mentioned opening; and, above-mentioned second bonding agent is coated on above-mentioned around openings, above-mentioned first zone is overlapped in above-mentioned second zone with box lunch when observing with the direction of above-mentioned plane of the opening quadrature.
2. camera head according to claim 1 is characterized in that above-mentioned electric substrate is made of the flexible printing substrate.
3. camera head according to claim 1 is characterized in that, above-mentioned electrode is equipped with a plurality of around above-mentioned pixel region;
Above-mentioned first bonding agent is coated on above-mentioned around openings.
4. camera head, it is equipped with imaging apparatus on electric substrate, it is characterized in that, and this camera head has:
Imaging apparatus, it is made of bare chip, this bare chip have pixel region and be arranged on this pixel region with one side and with the electrode of this pixel region on the position; And
Electric substrate, it has opening and disposes above-mentioned imaging apparatus and be used for the connection figure that is connected with above-mentioned electrode near the edge portion of this opening to cover this opening and to be configured in, and is separating the opening inner edge that position more than the 0.3mm is formed with above-mentioned opening from above-mentioned electrode to above-mentioned pixel region.
5. a camera head is characterized in that, this camera head has:
Imaging apparatus, it is made of bare chip, this bare chip have pixel region and be arranged on this pixel region with one side and with the electrode of this pixel region on the position; And
Electric substrate, it has opening and disposes above-mentioned imaging apparatus and be used for the connection figure that is connected with above-mentioned electrode near the edge portion of this opening to cover this opening and to be configured in, fix in order to make this electric substrate and above-mentioned imaging apparatus, bonding agent is banded coating along the periphery of above-mentioned imaging apparatus, so that coat the electrical connections of above-mentioned connection figure and above-mentioned electrode at least, separating the opening inner edge that position more than the 0.3mm is formed with above-mentioned opening from the end of above-mentioned electrode to above-mentioned pixel region from the outer rim of above-mentioned imaging apparatus.
6. camera head according to claim 4 is characterized in that above-mentioned electric substrate is made of the flexible printing substrate.
7. a camera head is characterized in that, this camera head has:
Electric substrate, it has opening and a plurality of figures that are connected on every side that are arranged on this opening; And
Imaging apparatus, it is made of bare chip, this bare chip have pixel region with in order to be electrically connected and to be arranged on this pixel region and to separate the electrode at the interval more than the 0.3mm from this pixel region with one side and along the periphery of this pixel region with above-mentioned the connection with figure, and be installed on the above-mentioned electric substrate to cover the above-mentioned opening of above-mentioned electric substrate.
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006047368A JP2007227674A (en) | 2006-02-23 | 2006-02-23 | Photographing apparatus |
| JP2006047368 | 2006-02-23 | ||
| JP2006-047366 | 2006-02-23 | ||
| JP2006047366A JP2007227672A (en) | 2006-02-23 | 2006-02-23 | Imaging apparatus |
| JP2006-047368 | 2006-02-23 | ||
| JP2006047366 | 2006-02-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101026690A true CN101026690A (en) | 2007-08-29 |
| CN101026690B CN101026690B (en) | 2012-01-18 |
Family
ID=38549176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007100070875A Expired - Fee Related CN101026690B (en) | 2006-02-23 | 2007-02-08 | Image pickup apparatus |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2007227672A (en) |
| CN (1) | CN101026690B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102779825A (en) * | 2011-05-11 | 2012-11-14 | 索尼公司 | Semiconductor package, semiconductor device manufacturing method, and solid-state imaging device |
| CN101971088B (en) * | 2008-02-15 | 2013-11-20 | Opto电子有限公司 | System and method for coupling a lens to a printed circuit |
| CN107547778A (en) * | 2016-06-23 | 2018-01-05 | 宁波舜宇光电信息有限公司 | Photosensory assembly and camera module and its manufacture method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5416291B2 (en) * | 2013-02-05 | 2014-02-12 | 株式会社オプトエレクトロニクス | Method for connecting lens to flexible printed circuit and optical assembly |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3607160B2 (en) * | 2000-04-07 | 2005-01-05 | 三菱電機株式会社 | Imaging device |
| TWI264224B (en) * | 2004-07-28 | 2006-10-11 | Fujitsu Ltd | Imaging apparatus |
-
2006
- 2006-02-23 JP JP2006047366A patent/JP2007227672A/en active Pending
-
2007
- 2007-02-08 CN CN2007100070875A patent/CN101026690B/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101971088B (en) * | 2008-02-15 | 2013-11-20 | Opto电子有限公司 | System and method for coupling a lens to a printed circuit |
| CN102779825A (en) * | 2011-05-11 | 2012-11-14 | 索尼公司 | Semiconductor package, semiconductor device manufacturing method, and solid-state imaging device |
| CN107547778A (en) * | 2016-06-23 | 2018-01-05 | 宁波舜宇光电信息有限公司 | Photosensory assembly and camera module and its manufacture method |
| CN107547778B (en) * | 2016-06-23 | 2020-12-18 | 宁波舜宇光电信息有限公司 | Photosensitive assembly and camera module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101026690B (en) | 2012-01-18 |
| JP2007227672A (en) | 2007-09-06 |
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