CN101015101A - Surge absorber - Google Patents
Surge absorber Download PDFInfo
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- CN101015101A CN101015101A CNA2005800299239A CN200580029923A CN101015101A CN 101015101 A CN101015101 A CN 101015101A CN A2005800299239 A CNA2005800299239 A CN A2005800299239A CN 200580029923 A CN200580029923 A CN 200580029923A CN 101015101 A CN101015101 A CN 101015101A
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- main discharge
- surge absorber
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- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 2
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Abstract
A surge absorber having a longer life by being coated with an oxide layer excellent in chemical stability in a high-temperature region during a sealing step and at main discharging and also excellent in bonding force to a main discharge surface. The absorber comprises a cylindrical ceramics (4) having conductive coatings (3) dividedly formed via a discharge gap (2), a pair of main discharge electrode members (5) disposed facing each other and contacting the conductive coatings (3), and a tubular ceramics (8) filled with the cylindrical ceramics (4) along with a sealing gas (7) thereinside, wherein a glass member is sealed inside the tubular ceramics (8).
Description
Technical field
The present invention relates to be used for protecting various device not to be subjected to surge to damage, accident is prevented terminating in the surge absorber of possible trouble.
Background technology
Part, power line, antenna or CRT drive circuit etc. that the electronic equipment that the communication equipment of telephone set, facsimile machine, modulator-demodulator etc. is used is connected with order wire be subjected to easily that thunder and lightning gushes and the part of the electric shock of the abnormal current (surge current) of static etc. or abnormal voltage (surge voltage) on, fire damage or the destruction of bringing such as on fire in order to prevent the electronic equipment that brings because of abnormal voltage or to carry the printed base plate of this equipment are connected with surge absorber.
In the past, proposed for example to use the surge absorber of surge absorber with microgap.This surge absorber is to be formed with the surge absorber that has a pair of cap electrode on so-called microgap, the two ends at ceramic component is closed with the enclosed-electrode with lead by heat in confining gas is housed in glass tube, at the two ends of glass tube cylindraceous discharge-type surge absorber on the side face of the columned ceramic component that is coated by conductive film covering.
In recent years, in the surge absorber of such discharge-type, long lifetime is constantly development also.As the example that is adapted to above-mentioned surge absorber, the low SnO of fluidization property in the time of will comparing discharge with cap electrode on the face that carries out main discharge of cap electrode is arranged
2Structure as coating layer.By like this, the metal ingredient that has suppressed cap electrode when main discharge disperses to the inwall of microgap and glass tube and has realized long lifetime (for example with reference to Patent Document 1).
In addition, along with the miniaturization of equipment, mounted on surfaceization constantly develops.As the example that is adapted to above-mentioned surge absorber, as surface installation type (metal electrode interface type, the MELF type), the structure (for example with reference to Patent Document 2) that does not have lead on enclosed-electrode, when mounted enclosed-electrode and substrate-side are connected and fixed by soldering is arranged.
This surge absorber 300 as shown in figure 30, possess cut apart via discharging gap 151 on the face be formed with conductive film covering 152 tabular ceramic 153, be configured in a pair of enclosed-electrode 155 on these tabular two ends of ceramic 153 and these enclosed-electrodes 155 be provided in two ends and tabular ceramic 153 cartridge type potteries 157 with confining gas 156 sealings.
This enclosed-electrode 155 by terminal electrode parts 158, electrically be connected with these terminal electrode parts 158 and the flat spring conductor 159 that contacts with conductive film covering 152 constitutes.
Patent Document 1: the spy open flat 10-106712 communique (the 5th page, Fig. 1)
Patent Document 2: the spy opens 2000-268934 communique (Fig. 1)
But, in above-mentioned surge absorber in the past, leave following problem.That is, in above-mentioned surge absorber in the past, the film forming method by for example chemical vapor deposition (CVD) method etc. forms SnO
2Overlay film, but because SnO
2Overlay film to the adhesive force of cap electrode a little less than, so because the SnO during main discharge
2Peeling off of overlay film and can not give full play to SnO
2The characteristic of overlay film.
Summary of the invention
The present invention makes in view of above-mentioned problem, purpose provide a kind of when being coated on closing step and main discharge in high-temperature area chemical stability good and to the good oxide skin(coating) of the adhesive force of main discharge face and the surge absorber of long lifetime.
The present invention has adopted following structure in order to solve above-mentioned problem.Promptly, about surge absorber of the present invention comprises: cut apart the insulating properties parts that are formed with conductive film covering, arranged opposite and be enclosed in insulating properties pipe in the inside with a pair of main discharge electrode parts of above-mentioned conductive film covering contact with above-mentioned insulating properties parts and confining gas via discharging gap, it is characterized in that enclosing has glass component in the inside of above-mentioned insulating properties pipe.
According to the present invention, the abnormal current of the surge of invading etc. and abnormal voltage from the outside by the discharge with discharging gap be trigger, opposed of a pair of main discharge electrode parts, be to carry out main discharge between the main discharge face to be absorbed.Here, when the insulating properties parts being enclosed in closing step in the insulating properties pipe and main discharge with confining gas, the glass component heating and melting.Thus, play a role as covering, the glass component of main discharge face with fusion coated by glass component.In addition, play a role as oxidant by glass component, the oxide skin(coating) of using the metal ingredient by the main discharge face to form in the main discharge face coats.Like this, coated by glass component or oxide skin(coating) by the main discharge face, the metal ingredient that has suppressed main discharge face when main discharge disperses, attached to the situation on the inwall of discharging gap or insulating properties pipe etc.
And then even under the situation of glass component that makes coating main discharge face by main discharge or oxide skin(coating) damage, the glass component of other parts of heating and melting also can coat the position of damage.
Thus, dispersing of the metal ingredient by suppressing the main discharge face realizes the long lifetime of surge absorber.
In addition, owing to do not need the metal of the costliness that chemical stability in high-temperature area is good to use as the main discharge electrode parts, so can in the main discharge electrode parts, use cheap metal material.
In addition, relevant surge absorber of the present invention is preferably, and above-mentioned glass component is coating the inwall of above-mentioned insulating properties pipe.
According to the present invention, when closing step and main discharge, coating the glass component heating and melting of the inwall of insulating properties pipe, main discharge bread is covered.In addition, play a role as oxidant by glass component, the main discharge face is coated by the oxide skin(coating) that the metal ingredient by the main discharge face forms.
In addition, relevant surge absorber of the present invention is preferably, opposed of above-mentioned a pair of main discharge electrode parts, be on the main discharge face, be formed with the oxide-film that forms by oxidation processes.
According to the present invention, can be formed in the good main discharge electrode parts of chemical stability in the high-temperature area.And, because the adhesive force of this oxide-film and main discharge face is good, so can bring into play the characteristic of oxide-film.
About surge absorber of the present invention comprises: cut apart the insulating properties parts that are formed with conductive film covering, arranged opposite and be enclosed in insulating properties pipe in the inside with a pair of main discharge electrode parts of above-mentioned conductive film covering contact with above-mentioned insulating properties parts and confining gas via discharging gap, it is characterized in that, in the inside of above-mentioned insulating properties pipe, spread all over from one of above-mentioned a pair of main discharge electrode parts to these a pair of main discharge electrode parts another and be filled with glass component.
In addition, relevant surge absorber of the present invention is preferably, and above-mentioned glass component is granular.
In addition, relevant surge absorber of the present invention is preferably, and above-mentioned glass component is a foamed glass.
According to the present invention, granular glass component or foamed glass are seated in the inside of insulating properties pipe.
In addition, relevant surge absorber of the present invention is preferably, opposed of above-mentioned a pair of main discharge electrode parts, be on the main discharge face, be formed with the oxide-film that forms by oxidation processes.According to the present invention, can be formed in the good main discharge electrode parts of chemical stability in the high-temperature area.And, because the adhesive force of this oxide-film and main discharge face is good, so can bring into play the characteristic of oxide-film.
About surge absorber of the present invention comprises: cut apart the insulating properties parts that are formed with conductive film covering, arranged opposite and be enclosed in insulating properties pipe in the inside with a pair of main discharge electrode parts of above-mentioned conductive film covering contact with above-mentioned insulating properties parts and confining gas via discharging gap, it is characterized in that opposed of above-mentioned a pair of main discharge electrode parts, be that the main discharge face is coated by glass component.
In addition, relevant surge absorber of the present invention is preferably, and on above-mentioned main discharge face, is formed with the oxide-film that forms by oxidation processes.
According to the present invention, can be formed in the good main discharge electrode parts of chemical stability in the high-temperature area.And, because the adhesive force of this oxide-film and main discharge face is good, so can bring into play the characteristic of oxide-film.
Description of drawings
Fig. 1 is the cutaway view of the surge absorber of expression the 1st execution mode of the present invention.
Fig. 2 is the figure of the main discharge electrode parts in the presentation graphs 1, and Fig. 2 (a) is a vertical view, and Fig. 2 (b) is that the X-X alignment of Fig. 2 (a) is looked cutaway view.
Fig. 3 is the cutaway view of the surge absorber with Fig. 1 when being installed on the substrate.
Fig. 4 is the cutaway view of the surge absorber of expression the 2nd execution mode of the present invention.
Fig. 5 is the cutaway view of the surge absorber of expression the 3rd execution mode of the present invention.
Fig. 6 is the cutaway view of the surge absorber of expression the 4th execution mode of the present invention.
Fig. 7 is the cutaway view of the surge absorber of expression the 5th execution mode of the present invention.
Fig. 8 is the cutaway view of surge absorber of the modification 1 of expression the 5th execution mode of the present invention.
Fig. 9 is the cutaway view of surge absorber of the modification 2 of expression the 5th execution mode of the present invention.
Figure 10 is the cutaway view of surge absorber of the modification 3 of expression the 5th execution mode of the present invention.
Figure 11 is the figure of the surge absorber of expression the 6th execution mode of the present invention, and Figure 11 (a) is a cutaway view, and Figure 11 (b) is the enlarged drawing of the contact portion of main discharge electrode parts and cylindrical ceramic.
Figure 12 is the figure of surge absorber of the modification 1 of expression the 6th execution mode of the present invention, and Figure 12 (a) is a cutaway view, and Figure 12 (b) is the enlarged drawing of the contact portion of main discharge electrode parts and cylindrical ceramic.
Figure 13 is the figure of surge absorber of the modification 2 of expression the 6th execution mode of the present invention, and Figure 13 (a) is a cutaway view, and Figure 13 (b) is the enlarged drawing of the contact portion of terminal electrode parts and cap electrode.
Figure 14 is the figure of the surge absorber of expression the 7th execution mode of the present invention, and Figure 14 (a) is a cutaway view, and Figure 14 (b) is the enlarged drawing of the contact portion of terminal electrode parts and cap electrode.
Figure 15 is the figure of surge absorber of the modification 1 of expression the 7th execution mode of the present invention, and Figure 15 (a) is a cutaway view, and Figure 15 (b) is the enlarged drawing of the contact portion of terminal electrode parts and cap electrode.
Figure 16 is the figure of surge absorber of the modification 2 of expression the 7th execution mode of the present invention, and Figure 16 (a) is a cutaway view, and Figure 16 (b) is the enlarged drawing of the contact portion of terminal electrode parts and cap electrode.
Figure 17 is the figure of surge absorber of the modification 3 of expression the 7th execution mode of the present invention, and Figure 17 (a) is a cutaway view, and Figure 17 (b) is the enlarged drawing of the contact portion of terminal electrode parts and cap electrode.
Figure 18 is the cutaway view of the surge absorber of expression the 8th execution mode of the present invention.
Figure 19 is the cutaway view of surge absorber of the modification 1 of expression the 8th execution mode of the present invention.
Figure 20 is the cutaway view of surge absorber of the modification 2 of expression the 8th execution mode of the present invention.
Figure 21 is the cutaway view of surge absorber of the modification 3 of expression the 8th execution mode of the present invention.
Figure 22 is the curve chart of the relation of time of the surge current of expression in the relevant embodiments of the invention and current value.
Figure 23 is the curve chart of the relation of the discharge time of the surge absorber among the embodiment of the 5th execution mode of the present invention and discharge ionization voltage.
Figure 24 is the curve chart of the relation of the discharge time of the surge absorber in the modification 2 of embodiment of the 5th execution mode of the present invention and discharge ionization voltage.
Figure 25 is the curve chart of the relation of the discharge time of the surge absorber in the modification 3 of embodiment of the 5th execution mode of the present invention and discharge ionization voltage.
Figure 26 is a cutaway view beyond the expression embodiments of the present invention, that can use surge absorber of the present invention.
Figure 27 is cutaway view beyond the expression embodiments of the present invention, that can use surge absorber of the present invention equally.
Figure 28 is a cutaway view beyond the expression embodiments of the present invention, that can use surge absorber of the present invention.
Figure 29 is a cutaway view beyond the expression embodiments of the present invention, that can use surge absorber of the present invention.
Figure 30 is a cutaway view of representing surge absorber in the past.
Description of reference numerals
1,20,30,40,50,60,70,80,90,100,110,120,130,140,150,160,170,180,190,200,210,220,230,300 surge absorbers
2,151 discharging gaps
3,152 conductive film coverings
4 cylindrical ceramics (insulating properties material)
5,31,51,71,91,155 main discharge electrode parts
The 5A circumference
6 cylindric glass components
7,156 confining gases
8,157 cartridge type potteries (insulating properties pipe)
10A, 33A, 159A main discharge face
10B, 33B, 92C, 159B oxide-film
21 glass films (glass component)
11,25,43,110 glass films (glass component)
92A bottom surface (main discharge face)
106 bead glass parts
111 plate glass parts
153 tabular potteries (insulating properties parts)
155 enclosed-electrodes (main discharge electrode parts)
Embodiment
Below, the 1st execution mode of relevant surge absorber of the present invention is described referring to figs. 1 through Fig. 3.
The surge absorber 1 of present embodiment is to use the discharge-type surge absorber of so-called microgap as shown in Figure 1, possesses: cylindrical ceramic (insulating properties parts) 4, and on side face, cut apart and be formed with conductive film covering 3 via discharging gap 2; A pair of main discharge electrode parts 5, arranged opposite contact with conductive film covering 3 on the two ends of this cylindrical ceramic 4; Cartridge type pottery (insulating properties pipe) 8, a pair of main discharge electrode parts 5 are provided in two ends, cylindrical ceramic 4 and cylindric glass component 6 are enclosed in the inside with the confining gas 7 of having regulated for example Ar (argon gas) that forms etc. etc. for the electrical characteristic that obtains expecting.
Cylindrical ceramic 4 is made of the ceramic material of mullite sintered body etc., the film of the TiN (titanium nitride) that the film formation technology by physical vapor deposition (PVD) method, chemical vapor deposition (CVD) method that is formed with as conductive film covering 3 from the teeth outwards forms etc.
Discharging gap 2 is formed with 1 to 100 by the processing of laser cutting, stripping and slicing, etching etc. with the width from 0.01 to 1.5mm, but has formed the discharging gap 2 of 1 150 μ m in the present embodiment.
A pair of main discharge electrode parts 5 are by the Kovar alloy (KOVAR: registered trade mark) constitute as the alloy of Fe (iron), Ni (nickel) and Co (cobalt).
These a pair of main discharge electrode parts 5 as shown in Figure 2, possess respectively by the bonding aspect ratio of the brazing material 9 and the end face of cartridge type pottery 8 be 1 below OBL circumference 5A and to the inboard of cartridge type pottery 8 and to the axial outstanding support portion 10 of outstanding and support cylinder shape pottery 4, be opposite to being subjected to 10 encirclements of outstanding support portion on the position of end of cylindrical ceramic 4 and be formed with middle section 5B.
Here, on the main discharge face 10A of main discharge electrode parts 5, form the oxide-film 10B of average film thickness 0.6 μ m by in atmosphere, carrying out 500 ℃, 300 minutes oxidation processes.
Then, the manufacture method to the surge absorber 1 of the present embodiment that is made of above structure describes.
At first, by Punching Technology a pair of main discharge electrode parts 5 are integrally formed as the shape of expectation.And,, form the oxide-film 10B of average film thickness 0.6 μ m by main discharge face 10A is carried out 500 ℃, 30 minutes oxidation processes in atmosphere.
Then, on the both ends of the surface of cartridge type pottery 8, possesses for example coat of metal of Mo (molybdenum)-W (tungsten) and Ni layer of each one deck respectively in order to improve to form with the wettability of brazing material 9.
Then, mounting cylindrical ceramic 4 on the middle section 5B of main discharge electrode parts 5 makes the radially inner side face contact with the end face of cylindrical ceramic 4.In addition, cylindric glass component 6 is positioned on the main discharge face 10A.Then, under the state between the end face that brazing material 9 is clipped in circumference 5A and cartridge type pottery 8, cartridge type pottery 8 is positioned on the circumference 5A of another main discharge electrode parts 5.
And then mounting main discharge electrode parts 5 make the radially inner side face contact with main discharge electrode parts 5 so that the top of cylindrical ceramic 4 and middle section 5B are opposed.Then, become brazing material 9 is clipped in state between the end face of circumference 5A and cartridge type pottery 8.
After vacuumizing fully under the state of above-mentioned such interim assembling, as the confining gas environment, heat up to brazing material 9 fusions, by the fusion of brazing material 9 cylindrical ceramic 4 is sealed, cool off hastily then.More than make like this surge absorber 1.
With the surge absorber 1 made like this for example as shown in Figure 3, to be positioned on the substrate B of printed base plate etc. as the installed surface 8A of a side of cartridge type pottery 8, by adhesive the outer surface of substrate B and a pair of main discharge electrode parts 5 is adhesively fixed and uses.
In addition, owing to do not need the metal of the costliness that chemical stability in high-temperature area is good to use as main discharge electrode parts 5, so can in main discharge electrode parts 5, use cheap metal material in the present invention.
Then, with reference to Fig. 4 the 2nd execution mode is described.
In addition, the basic structure of Shuo Ming execution mode and above-mentioned the 1st execution mode are same here, are the key elements that above-mentioned the 1st execution mode has been added other.Thereby, in Fig. 4, give identical label and omit its explanation for the structural element identical with Fig. 1.
The difference of the 2nd execution mode and the 1st execution mode is, cylindric glass component 6 is configured between a pair of main discharge face 10A in the 1st execution mode, and in the 2nd execution mode, the inwall of the cartridge type pottery 8 of surge absorber 20 is coated by glass film (glass component) 21.
Like this surge absorber 20 of Gou Chenging have with above-mentioned the 1st execution mode in same effect, the effect of surge absorber 1.
Then, with reference to Fig. 5 the 3rd execution mode is described.
In addition, same with above-mentioned the 2nd embodiment, the basic structure of Shuo Ming execution mode and above-mentioned the 1st execution mode are same here, so, in Fig. 5, also give identical label and omit its explanation for the structural element identical with Fig. 1.
The difference of the 3rd execution mode and the 1st execution mode is that cylindric glass component 6 is configured between a pair of main discharge face 10A in the 1st execution mode, and in the surge absorber 30 of the 3rd execution mode, contains SiO
2The bead glass parts 106 of (silica) spread all over from a pair of main discharge electrode parts 5 one and are seated in to another by in main discharge electrode parts 5 and cartridge type pottery 8 discharge spaces that form.
Like this surge absorber 30 of Gou Chenging have with above-mentioned the 1st execution mode in same effect, the effect of surge absorber 1, and, by filling bead glass parts 106 in the inside of cartridge type pottery 8, can make surge absorber with higher discharge ionization voltage.
Then, with reference to Fig. 6 the 4th execution mode is described.
In addition, same with above-mentioned the 2nd embodiment, the basic structure of Shuo Ming execution mode and above-mentioned the 1st execution mode are same here, so, in Fig. 6, also give identical label and omit its explanation for the structural element identical with Fig. 1.
The difference of the 4th execution mode and the 1st execution mode is, cylindric glass component 6 is configured between a pair of main discharge face 10A in the 1st execution mode, and in the surge absorber 40 of the 4th execution mode, on the surface of main discharge face 10A, be coated with and contain SiO by printing, burning glass paste
2The glass film of (silica) (glass component) 11.In addition, as method, use physical vapor deposition (PVD) method and printing, fire method etc. glass film.
In addition, same with above-mentioned the 1st execution mode, owing to do not need the metal of the costliness that chemical stability in high-temperature area is good to use as main discharge electrode parts 5, so can in main discharge electrode parts 5, use cheap metal material in the present invention.
Then, with reference to Fig. 7 the 5th execution mode is described.
In addition, the basic structure of Shuo Ming execution mode and above-mentioned the 1st execution mode are same here, are the key elements that above-mentioned the 1st execution mode has been added other.Thereby, in Fig. 7, give identical label and omit its explanation for the structural element identical with Fig. 1.
The difference of the 5th execution mode and the 1st execution mode is, it in the 1st execution mode structure by the outstanding support portion 10 support cylinder shape potteries 4 of main discharge electrode parts 5, relative therewith, in the surge absorber 50 of the 5th execution mode, main discharge electrode parts 31 have as with the 1st execution mode in the terminal electrode parts 32 and the cap electrode 33 of the same structure of main discharge electrode parts 5, cylindrical ceramic 4 supports via the outstanding support portion 34 that cap electrode 33 is located on the terminal electrode parts 32.
A pair of cap electrode 33 is by lower than cylindrical ceramic 4 hardness, the metal of for example stainless steel that can plastic deformation etc. constitutes, peripheral part forms roughly U word shape of cross section than the axially inboard extension of the front end of the outstanding support portion 34 of terminal electrode parts 32, becomes main discharge face 33A.
The surface of this a pair of cap electrode 33 forms the oxide-film 33B of 0.6 μ m by carry out 700 ℃, 40 minutes oxidation processes in the reducing gas environment of the oxygen concentration that is controlled as regulation.
Then, the manufacture method to the surge absorber 50 of the present embodiment that is made of above structure describes.
At first, after pair of terminal electrod assembly 32 enforcement annealing in process, integrally formed by Punching Technology.
Then, on the surface of a pair of cap electrode 33,, form oxide-film 33B by in the reducing gas environment of the oxygen concentration that is controlled as regulation, carrying out 700 ℃, 40 minutes oxidation processes.
Then, a pair of cap electrode 33 is fastened on the two ends of cylindrical ceramic 4, by the method manufacturing surge absorber 50 same with the 1st execution mode.
The surge absorber 50 of Gou Chenging has effect, the effect same with the surge absorber 1 of relevant above-mentioned the 1st execution mode like this, and the cap electrode 33 lower than cylindrical ceramic 4 hardness connects airtight on the two sides of cylindrical ceramic 4 and outstanding support portion 34, can obtain the excellent contact face.Thus, can access sufficient ohmic contact, the electrical characteristic of the discharge ionization voltage of surge absorber 50 etc. is more stable.
In addition, as the modification 1 of present embodiment, same with above-mentioned the 2nd execution mode, as shown in Figure 8, also can be the surge absorber 60 that is provided with the glass film 21 that the inwall of cartridge type pottery 8 is coated, if such structure also can access and above-mentioned same effect.
In addition, as the modification 2 of present embodiment, same with above-mentioned the 3rd execution mode, as shown in Figure 9, also can be the surge absorber 70 that in the inside of cartridge type pottery 8, is filled with glass component 106, if such structure also can access and above-mentioned same effect.
In addition, modification 3 as present embodiment, same with above-mentioned the 4th execution mode, as shown in figure 10, it also can be the surge absorber 80 that on the surface of main discharge face 33A, is coated with glass film 25 by physical vapor deposition (PVD) method, if such structure also can access and above-mentioned same effect.
Then, with reference to Figure 11 the 6th execution mode is described.
In addition, the basic structure of Shuo Ming execution mode and above-mentioned the 1st execution mode are same here, are the key elements that above-mentioned the 1st execution mode has been added other.Thereby, in Figure 11, give identical label and omit its explanation for the structural element identical with Fig. 1.
The difference of the 6th execution mode and the 1st execution mode is, main discharge electrode parts 5 have the outstanding support portion 10 that forms in the 1st execution mode, and are relative therewith, in the surge absorber 90 of the 6th execution mode, shown in Figure 11 (a), main discharge electrode parts 51 are tabular.
And, on the mutual opposed inner surface of these a pair of main discharge electrode parts 51, be coated with brazing material 53.
This brazing material 53 possesses the filling part 55 in the gap 54 on the contact-making surface that landfill is formed on a pair of main discharge electrode parts 51 and cylindrical ceramic 4 and keeps the maintaining part 56 of the outer peripheral face of cylindrical ceramic 4 at the two ends of cylindrical ceramic 4 shown in Figure 11 (b).In addition, this gap 54 is by being formed on because of dimensional accuracy, scar, generations such as distortion concavo-convex etc. that add man-hour on a pair of main discharge electrode parts 51 and the cylindrical ceramic 4.
Maintaining part 56 is that the outer peripheral face lifting that covers cylindrical ceramic 4 when main discharge electrode parts 51 are contacted with cylindrical ceramic 4, by brazing material 53 forms.
In addition, the bump height h of this maintaining part 56 is the sizes from the end face of main discharge electrode parts 51 to the protuberance topmost, is to be main discharge portion and according to the rules life-span regulation in order to make this topmost.
Then, the manufacture method to the surge absorber 90 that is made of above structure describes.
At first, coating enough forms the brazing material 53 of the amount of maintaining part 56 on the one side of main discharge electrode parts 51, cylindrical ceramic 4 is positioned on the middle section of main discharge electrode parts 51, and main discharge electrode parts 51 are contacted with cylindrical ceramic 4.Then, the cylindric glass component 6 of mounting, the end face of mounting cartridge type pottery 8.
And then main discharge electrode parts 51 that have been coated with brazing material 53 by mounting on another end face of cartridge type pottery 8 become interim assembled state.
Then, closing step is described.By element heat treated in the confining gas environment with the state of above-mentioned such interim assembling, brazing material 53 fusions, main discharge electrode parts 51 connect airtight with cylindrical ceramic 4.At this moment, by fusion, the filling part 55 of brazing material 53 will be present in gap 54 landfills between cylindrical ceramic 4 and the main discharge electrode parts 51.In addition, the maintaining part 56 that forms of the surface tension by brazing material 53 both ends of imbedding cylindrical ceramic 4 keep.
Then, carry out refrigerating work procedure equally, make surge absorber 90 with above-mentioned the 1st execution mode.
This surge absorber 90 has effect, the effect same with the surge absorber 1 of relevant above-mentioned the 1st execution mode, to be formed on gap 54 landfills on the contact-making surface of main discharge electrode parts 51 and cylindrical ceramic 4 because of dimensional accuracy, scar, the distortion etc. that adds man-hour by brazing material 53, main discharge electrode parts 51 increase with the contact area of cylindrical ceramic 4.Thus, can access sufficient ohmic contact, the electrical characteristic of the discharge ionization voltage of surge absorber 90 etc. is stable.
In addition, as the modification 1 of present embodiment, same with above-mentioned the 2nd execution mode, as shown in figure 12, also can be the surge absorber 100 that is provided with the glass film 21 that the inwall of cartridge type pottery 8 is coated, if such structure also can access and above-mentioned same effect.
In addition, as the modification 2 of present embodiment, same with above-mentioned the 3rd execution mode, as shown in figure 13, also can be the surge absorber 110 that in the inside of cartridge type pottery 8, is filled with glass component 106, if such structure also can access and above-mentioned same effect.
In addition, in the present embodiment, form maintaining part 56 and filling part 55 by the parts identical with brazing material 53, but filling part 55 also can be formed by the material different with brazing material 53, for example also can be the bonding agent of conductivity that can cylindrical ceramic 4 and main discharge electrode parts 51 are bonding as active silver brazing.By like this, cylindrical ceramic 4 is bonding with main discharge electrode parts 51, can access the ohmic contact more fully of main discharge electrode parts 51 and conductive film covering 3.Thereby the electrical characteristic of the discharge ionization voltage of surge absorber 50 etc. is stable.
In addition, maintaining part 56 is also same with filling part 55, also can be formed by the material different with brazing material 53, for example also can use brazing material 53 and the difficult glass material that soaks into of active silver brazing.By like this, cylindrical ceramic 4 is fixed on more reliably near central or its periphery of main discharge electrode parts 51.
Then, with reference to Figure 14 the 7th execution mode is described.
In addition, the basic structure of Shuo Ming execution mode and above-mentioned the 6th execution mode are same here, are the key elements that above-mentioned the 6th execution mode has been added other.Thereby, in Figure 14, give identical label and omit its explanation for the structural element identical with Figure 11.
The difference of the 7th execution mode and the 6th execution mode is, only constitute in the 6th execution mode by flat main discharge electrode parts 51, with respect to this, in the surge absorber 120 in the 7th execution mode, shown in Figure 14 (a), main discharge electrode parts 71 are made of with cap electrode 33 flat terminal electrode parts 72.
In addition, the height h of maintaining part 56 forms lowlyer than the height of cap electrode 33.Thus, the mutual opposed face of cap electrode 33 becomes main discharge face 33A.
Then, the manufacture method to the surge absorber 120 that is made of above structure describes.
At first, same with above-mentioned the 5th execution mode, on the surface of a pair of cap electrode 33, form oxide-film 33B, be fastened on the two ends of cylindrical ceramic 4.
Then, a pair of cap electrode 33 is fastened on the two ends of cylindrical ceramic 4, by the method manufacturing surge absorber 120 same with the 4th execution mode.
This surge absorber 120 has effect, the effect same with the surge absorber 90 of relevant above-mentioned the 6th execution mode.
In addition, as the modification 1 of present embodiment, same with above-mentioned the 6th execution mode, as shown in figure 15, also can be the surge absorber 130 that is provided with the glass film 21 that the inwall of cartridge type pottery 8 is coated, if such structure also can access and above-mentioned same effect.
In addition, as the modification 2 of present embodiment, same with above-mentioned the 6th execution mode, as shown in figure 16, also can be the surge absorber 140 that in the inside of cartridge type pottery 8, is filled with glass component 106, if such structure also can access and above-mentioned same effect.
In addition, same with the 6th execution mode, filling part 55 also can be formed by the material different with brazing material 53, for example also can be the bonding agent of conductivity that can oxide-film 33B and terminal electrode parts 72 are bonding as active silver brazing.
And then maintaining part 56 is also same with filling part 55, also can be formed by the material different with brazing material 53, for example also can use brazing material 53 and the difficult glass material that soaks into of active silver brazing.
And then, with reference to Figure 17 the modification 3 of present embodiment is described.
In addition, the modification 3 of the basic structure of Shuo Ming execution mode and above-mentioned the 5th execution mode is same here, is the key element of the modification 3 of above-mentioned the 5th execution mode having been added other.Thereby, in Figure 17, give identical label and omit its explanation for the structural element identical with Figure 10.
The difference of the modification 3 of the 7th execution mode and the modification 3 of the 5th execution mode is, terminal electrode parts 32 have integrally formed outstanding support portion 34 in the modification 3 of the 5th execution mode, with respect to this, in the surge absorber 150 of the modification 3 of the 7th execution mode, shown in Figure 17 (a), main discharge electrode parts 71 are made of terminal electrode parts 72 and cap electrode 33.
And, on these pair of terminal electrod assembly 72 mutual opposed inner surfaces, be coated with brazing material 53.
This brazing material 53 possesses the filling part 55 in the gap 54 on the contact-making surface that landfill is formed on pair of terminal electrod assembly 72 and cap electrode 33 and keeps the maintaining part 56 of the outer peripheral face of cap electrode 33 at the two ends of cap electrode 33 shown in Figure 17 (b).
In addition, the height h of maintaining part 56 forms lowlyer than the height of cap electrode 33.Thus, the mutual opposed face of cap electrode 33 becomes main discharge face 33A.
Then, the manufacture method to the surge absorber 150 that is made of above structure describes.
At first, same with above-mentioned the 2nd execution mode, on the surface of a pair of cap electrode 33, form oxide-film 33B, main discharge face 33A is coated with glass film 25 by physical vapor deposition (PVD) method.And be fastened on the two ends of cylindrical ceramic 4.
Then, coating enough forms the brazing material 53 of the amount of maintaining part 56 on the one side of terminal electrode parts 72, the cylindrical ceramic 4 that is engaging cap electrode 33 is positioned on the middle section of terminal electrode parts 72, terminal electrode parts 72 are contacted with cap electrode 33.Then, the end face of mounting cartridge type pottery 8.
And then another terminal electrode parts 72 that have been coated with brazing material 53 by mounting on another end face of cartridge type pottery 8 become interim assembled state.
After vacuumizing fully under the state of above-mentioned such interim assembling, by as the confining gas environment and heat treated, brazing material 53 fusions, terminal electrode parts 72 connect airtight with cap electrode 33.At this moment, by fusion, the filling part 55 of brazing material 53 will be present in gap 54 landfills between cap electrode 33 and the terminal electrode parts 72.In addition, the maintaining part 56 that forms of the surface tension by brazing material 53 both ends of imbedding cap electrode 33 keep.
Then, carry out refrigerating work procedure equally, make surge absorber 150 with above-mentioned the 1st execution mode.
This surge absorber 150 has effect, the effect same with the surge absorber 40 of relevant above-mentioned the 4th execution mode, to be formed on gap 54 landfills on the contact-making surface of terminal electrode parts 72 and cap electrode 33 because of dimensional accuracy, scar, the distortion etc. that adds man-hour by brazing material 53, terminal electrode parts 72 increase with the contact area of cap electrode 33.Thus, can access sufficient ohmic contact, the electrical characteristic of the discharge ionization voltage of surge absorber 150 etc. is stable.
In addition, in the present embodiment, form maintaining part 56 and filling part 55 by the parts identical with brazing material 53, but filling part 55 also can be formed by the material different with brazing material 53, for example also can be the bonding agent of conductivity that can oxide-film 33B and terminal electrode parts 72 are bonding as active silver brazing.Make such structure, cap electrode 33 is bonding with terminal electrode parts 72, also can access the ohmic contact more fully of main discharge electrode parts 71 and conductive film covering 3.
In addition, maintaining part 56 is also same with filling part 55, also can be formed by the material different with brazing material 53, for example also can use brazing material 53 and the difficult glass material that soaks into of active silver brazing.By like this, cylindrical ceramic 4 is fixed on more reliably near central or its periphery of terminal electrode parts 72.
Then, with reference to Figure 18 the 8th execution mode is described.
In addition, the basic structure of Shuo Ming execution mode and above-mentioned the 1st execution mode are same here, are the key elements that above-mentioned the 1st execution mode has been added other.Thereby, in Figure 18, give identical label and omit its explanation for the structural element identical with Fig. 1.
The difference of the 8th execution mode and the 1st execution mode is, main discharge electrode parts 5 have integrally formed outstanding support portion 10 in the 1st execution mode, cylindrical ceramic 4 is pressed into or is fitted in this outstanding support portion 10, with respect to this, in the surge absorber 160 in the 8th execution mode, main discharge electrode parts 91 are made of terminal electrode parts 72 and outstanding support component 92.
In addition, the surface of this a pair of outstanding support component 92 is by being formed with the oxide-film 92C of 0.6 μ m with the same oxidation processes of above-mentioned the 1st execution mode, becomes the main discharge face as opposed bottom surface 92A mutually.
This surge absorber 160 have with above-mentioned the 1st execution mode in same effect, the effect of surge absorber 1.
In addition, as the modification 1 of present embodiment, same with above-mentioned the 2nd execution mode, as shown in figure 19, also can be the surge absorber 170 that is provided with the glass film 21 that the inwall of cartridge type pottery 8 is coated, if such structure also can access and above-mentioned same effect.
In addition, as the modification 2 of present embodiment, same with above-mentioned the 3rd execution mode, as shown in figure 20, also can be the surge absorber 180 that in the inside of cartridge type pottery 8, is filled with glass component 106, if such structure also can access and above-mentioned same effect.
In addition, modification 3 as present embodiment, same with above-mentioned the 4th execution mode, as shown in figure 21, it also can be the surge absorber 190 that on the bottom surface of main discharge face 92A, is coated with glass film 25 by printing, the method for firing of glass paste, if such structure also can access and above-mentioned same effect.
Then, according to embodiment, specifically describe relevant surge absorber of the present invention with reference to Figure 22 and Figure 23.
Relatively with about the surge absorber 50 of above-mentioned the 3rd execution mode with do not have oxide-film 33B and the life-span of the surge absorber in the past of cylindric glass component 6 when being installed in substrate etc. respectively and going up.
Particularly,, repeatedly surge current is as shown in Figure 22 applied stipulated number to surge absorber, measure the discharge ionization voltage (V) between gap at this moment, the result is represented in Figure 23 as embodiment.
If surge absorber is in the past applied surge current repeatedly, then the composition of the metal electrode of main discharge electrode parts disperses morely, in the relatively shorter time, in microgap, pile up these metal ingredients, reached the life-span so the discharge ionization voltage between the gap reduces.On the other hand, relevant surge absorber 50 of the present invention is by coating with glass component cylindric glass component 6 heating and meltings in closing step with main discharge face 33A.In addition, play a role as oxidant by glass component, the main discharge face is coated by the oxide skin(coating) that the metal ingredient by the main discharge face forms.And then even under the situation of glass component that makes coating main discharge face 33A by main discharge or oxide-film 33B damage, the cylindric glass component 6 that also passes through other parts of heating and melting coats the position of damaging.Therefore, the dispersing of the metal ingredient of the cap electrode 33 when having suppressed main discharge is so seldom there is the accumulation of the metal ingredient in the discharging gap 2.Thus, the discharge ionization voltage between the gap is stable, has realized the long lifetime of surge absorber.
In addition, the present invention is not limited to above-mentioned execution mode, can carry out various changes in the scope that does not break away from purport of the present invention.
For example, as shown in figure 26, also can be mutual opposed of a pair of flat spring conductor 159, be on the main discharge face 159A by and the same oxidation processes of above-mentioned the 1st execution mode be formed with oxide-film 159B, between this a pair of main discharge face 159A, dispose the surge absorber 200 of glass component 111.If such structure also has and above-mentioned same effect, effect.
In addition, as shown in figure 27, also can be the surge absorber 210 that is provided with the glass film 21 that the inwall of cartridge type pottery 157 is coated.If such structure also has and above-mentioned same effect, effect.
Then, according to another embodiment 2, specifically describe relevant surge absorber of the present invention with reference to Figure 22 and Figure 24.
Relatively with about the surge absorber 70 of the modification 2 of above-mentioned the 5th execution mode with do not have oxide-film 33B and the life-span of the surge absorber in the past of bead glass parts 106 when being installed in substrate etc. respectively and going up.
Particularly,, repeatedly surge current is as shown in Figure 22 applied stipulated number to surge absorber, measure the discharge ionization voltage (V) between gap at this moment, the result is represented in Figure 24 as embodiment.
If surge absorber is in the past applied surge current repeatedly, then the composition of the metal electrode of main discharge electrode parts disperses morely, in the relatively shorter time, in microgap, pile up these metal ingredients, reached the life-span so the discharge ionization voltage between the gap reduces.On the other hand, relevant surge absorber 70 of the present invention is by coating with glass component bead glass parts 106 heating and meltings with main discharge face 33A.In addition, play a role the oxide skin(coating) coating that the main discharge face is formed by the metal ingredient by the main discharge face as oxidant by bead glass parts 106.Therefore, the dispersing of the metal ingredient of the cap electrode 33 when having suppressed main discharge is so seldom there is the accumulation of the metal ingredient in the discharging gap 2.Thus, the discharge ionization voltage between the gap is stable, has realized the long lifetime of surge absorber.
In addition, the present invention is not limited to above-mentioned execution mode, can carry out various changes in the scope that does not break away from purport of the present invention.
For example, the shape of bead glass parts is not limited to granular, also can be cylinder or cylinder, irregularly shaped etc.
In addition, as shown in figure 28, also can be mutual opposed of a pair of flat spring conductor 159, be by being formed with oxide-film 159B with the same oxidation processes of above-mentioned the 1st execution mode and being filled with the surge absorber 220 of bead glass parts 106 on the main discharge face 159A.Like this, also have and above-mentioned same effect, effect.
Then, according to embodiment, specifically describe relevant surge absorber of the present invention with reference to Figure 22 and Figure 25.
Relatively with about the surge absorber 80 of the modification 3 of above-mentioned the 5th execution mode with do not have oxide-film 33B and the life-span of the surge absorber in the past of glass film 25 when being installed in substrate etc. respectively and going up.
Particularly,, repeatedly surge current is as shown in Figure 22 applied stipulated number to surge absorber, measure the discharge ionization voltage (V) between gap at this moment, the result is represented in Figure 25 as embodiment.
If surge absorber is in the past applied surge current repeatedly, then the composition of the metal electrode of main discharge electrode parts disperses morely, in the relatively shorter time, in microgap, pile up these metal ingredients, reached the life-span so the discharge ionization voltage between the gap reduces.On the other hand, relevant surge absorber 80 of the present invention has suppressed the dispersing of metal ingredient of cap electrode 33 by glass film 25 and oxide-film 33B, so the accumulation of the metal ingredient in the discharging gap 2 is seldom arranged.Thus, the discharge ionization voltage between the gap is more stable as can be known.
In addition, the present invention is not limited to above-mentioned execution mode, can carry out various changes in the scope that does not break away from purport of the present invention.
For example, as shown in figure 29, also can be that at a pair of flat spring conductor 159 mutual opposed is the surge absorber 230 by being formed with oxide-film 159B, this main discharge face 159A is coated with glass film 110 with the same oxidation processes of above-mentioned the 1st execution mode on the main discharge face 159A.Like this, also have and above-mentioned same effect, effect.
General in above-mentioned 3 embodiment, conductive film covering also can be Ag (silver), Ag (silver)/Pd (palladium) alloy, SnO
2(tin oxide), Al (aluminium), Ni (nickel), Cu (copper), Ti (titanium), Ta (tantalum), W (tungsten), SiC (carborundum), BaAl (barium aluminium), C (carbon), Ag (silver)/Pt (platinum) alloy, TiO (titanium oxide), TiC (titanium carbide), TiCN (titanium carbonitride) etc.
In addition, the main discharge electrode parts also can be the alloys of Cu or Ni class.
In addition, as long as it is just passable that the cylindric glass component among the embodiment 1 is present in the inside of cartridge type pottery, also can be plate glass parts or other shapes, in embodiment 2, the bead glass parts are seated in the inside of cartridge type pottery, but also can load foamed glass, in embodiment 3, glass film is not limited to coat the main discharge face, also can be the structure that coats the whole surface of main discharge electrode parts.
In addition, be not limited to contain SiO
2, also can be the parts that contain the glass of crystalline phase.
In addition, the coat of metal of cartridge type pottery both ends of the surface also can be Ag (silver), Cu (copper), Au (gold), in addition, also can not use the coat of metal and only usefulness active metal brazing material sealing.
In addition, confining gas is regulated composition etc. for the electrical characteristic that obtains expecting, for example also can not be atmosphere (air), but Ar (argon gas), N
2(nitrogen), He (helium), Xe (xenon), H
2(hydrogen), SF
6, CF
4, C
2F
6, C
3F
8, CO
2(carbon dioxide) etc. and their mist.
Industrial applicibility
According to surge absorber of the present invention, glass component melting when closing step and main discharge And play a role as covering or oxidant, the main discharge face is by glass component or by the main discharge face The oxide layer that forms of metal composition coat. Thus, the metal composition that has suppressed the main discharge face Disperse. In addition, even in the glass component of coating main discharge face or the feelings of oxide layer damage Under the condition, also by the glass component heating and melting of other parts damage location is coated.
And then, according to surge absorber of the present invention, by with main discharge face glass component bag Cover, suppressed the dispersing of metal composition of main discharge face. In addition, even coat the main discharge face Glass component damage, also the glass component of other parts by heating and melting as covering or Oxidant plays a role to suppress the dispersing of metal composition of main discharge face. Thereby, can make electricity Gush the absorber long lifetime.
Claims (9)
1. surge absorber, comprise: cut apart the insulating properties parts that are formed with conductive film covering, arranged opposite and be enclosed in insulating properties pipe in the inside with a pair of main discharge electrode parts of above-mentioned conductive film covering contact with above-mentioned insulating properties parts and confining gas via discharging gap, it is characterized in that
In the inside of above-mentioned insulating properties pipe, enclose glass component is arranged.
2. surge absorber as claimed in claim 1 is characterized in that above-mentioned glass component is coating the inwall of above-mentioned insulating properties pipe.
3. surge absorber as claimed in claim 1 or 2 is characterized in that, opposed of above-mentioned a pair of main discharge electrode parts, be on the main discharge face, be formed with the oxide-film that forms by oxidation processes.
4. surge absorber, comprise: cut apart the insulating properties parts that are formed with conductive film covering, arranged opposite and be enclosed in insulating properties pipe in the inside with a pair of main discharge electrode parts of above-mentioned conductive film covering contact with above-mentioned insulating properties parts and confining gas via discharging gap, it is characterized in that
In the inside of above-mentioned insulating properties pipe, spread all over from one of above-mentioned a pair of main discharge electrode parts to these a pair of main discharge electrode parts another and be filled with glass component.
5. surge absorber as claimed in claim 4 is characterized in that above-mentioned glass component is granular.
6. surge absorber as claimed in claim 5 is characterized in that above-mentioned glass component is a foamed glass.
7. as each described surge absorber in the claim 4 to 6, it is characterized in that, opposed of above-mentioned a pair of main discharge electrode parts, be on the main discharge face, be formed with the oxide-film that forms by oxidation processes.
8. surge absorber, comprise: cut apart the insulating properties parts that are formed with conductive film covering, arranged opposite and be enclosed in insulating properties pipe in the inside with a pair of main discharge electrode parts of above-mentioned conductive film covering contact with above-mentioned insulating properties parts and confining gas via discharging gap, it is characterized in that
Opposed of above-mentioned a pair of main discharge electrode parts, be that the main discharge face is coated by glass component.
9. surge absorber as claimed in claim 8 is characterized in that, on above-mentioned main discharge face, is formed with the oxide-film that forms by oxidation processes.
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP208467/2004 | 2004-07-15 | ||
| JP2004208467A JP2006032090A (en) | 2004-07-15 | 2004-07-15 | Surge absorber |
| JP2004227773A JP2006049064A (en) | 2004-08-04 | 2004-08-04 | Surge absorber |
| JP227774/2004 | 2004-08-04 | ||
| JP227773/2004 | 2004-08-04 | ||
| JP2004227774A JP2006049065A (en) | 2004-08-04 | 2004-08-04 | Surge absorber |
| PCT/JP2005/012993 WO2006009055A1 (en) | 2004-07-15 | 2005-07-14 | Surge absorber |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101015101A true CN101015101A (en) | 2007-08-08 |
| CN101015101B CN101015101B (en) | 2010-12-08 |
Family
ID=35898191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2005800299239A Expired - Fee Related CN101015101B (en) | 2004-07-15 | 2005-07-14 | Surge absorber |
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| Country | Link |
|---|---|
| JP (1) | JP2006032090A (en) |
| CN (1) | CN101015101B (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010083727A1 (en) * | 2009-01-23 | 2010-07-29 | Shang-Yo Lee | Surge arrester |
| CN102611004A (en) * | 2011-12-27 | 2012-07-25 | 百圳君耀电子（深圳）有限公司 | Surge absorption tube and manufacturing method thereof |
| CN103069671A (en) * | 2010-08-10 | 2013-04-24 | 三菱综合材料株式会社 | Surge absorber and method for manufacturing same |
| CN103875142A (en) * | 2011-10-14 | 2014-06-18 | Tdk株式会社 | Electrostatic surger suppressor |
| CN101933204B (en) * | 2008-02-05 | 2015-06-03 | 株式会社村田制作所 | ESD protection device |
| TWI488393B (en) * | 2012-11-09 | 2015-06-11 | Smart Electronics Inc | Surge absorber and manufacturing method thereof |
| CN105229876B (en) * | 2013-03-15 | 2017-02-22 | Tdk株式会社 | Countermeasure element against static electricity |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0443584A (en) * | 1990-06-08 | 1992-02-13 | Aibetsukusu Kk | Gas-tight structure of surge absorbing element |
| JP2860335B2 (en) * | 1990-09-25 | 1999-02-24 | 矢崎総業株式会社 | Discharge tube |
| JPH10106712A (en) * | 1996-09-26 | 1998-04-24 | Mitsubishi Materials Corp | Discharge tube |
| CN2383211Y (en) * | 1998-02-11 | 2000-06-14 | 金坛市晨辉电子有限公司 | Horizontal glass sealed gas groove discharge tube |
-
2004
- 2004-07-15 JP JP2004208467A patent/JP2006032090A/en active Pending
-
2005
- 2005-07-14 CN CN2005800299239A patent/CN101015101B/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101933204B (en) * | 2008-02-05 | 2015-06-03 | 株式会社村田制作所 | ESD protection device |
| WO2010083727A1 (en) * | 2009-01-23 | 2010-07-29 | Shang-Yo Lee | Surge arrester |
| CN103069671A (en) * | 2010-08-10 | 2013-04-24 | 三菱综合材料株式会社 | Surge absorber and method for manufacturing same |
| CN103875142A (en) * | 2011-10-14 | 2014-06-18 | Tdk株式会社 | Electrostatic surger suppressor |
| CN103875142B (en) * | 2011-10-14 | 2016-05-04 | Tdk株式会社 | Static reply element |
| CN102611004A (en) * | 2011-12-27 | 2012-07-25 | 百圳君耀电子（深圳）有限公司 | Surge absorption tube and manufacturing method thereof |
| CN102611004B (en) * | 2011-12-27 | 2013-09-11 | 广东百圳君耀电子有限公司 | Surge absorption tube and manufacturing method thereof |
| TWI488393B (en) * | 2012-11-09 | 2015-06-11 | Smart Electronics Inc | Surge absorber and manufacturing method thereof |
| CN104769793A (en) * | 2012-11-09 | 2015-07-08 | 斯玛特电子公司 | Surge absorber and method for manufacturing same |
| US9735551B2 (en) | 2012-11-09 | 2017-08-15 | Smart Electronics Inc. | Surge absorber and manufacturing method thereof |
| CN105229876B (en) * | 2013-03-15 | 2017-02-22 | Tdk株式会社 | Countermeasure element against static electricity |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101015101B (en) | 2010-12-08 |
| JP2006032090A (en) | 2006-02-02 |
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