CN101014237A - 具有层压结构的透气导电屏蔽 - Google Patents

具有层压结构的透气导电屏蔽 Download PDF

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Publication number
CN101014237A
CN101014237A CNA2007100043702A CN200710004370A CN101014237A CN 101014237 A CN101014237 A CN 101014237A CN A2007100043702 A CNA2007100043702 A CN A2007100043702A CN 200710004370 A CN200710004370 A CN 200710004370A CN 101014237 A CN101014237 A CN 101014237A
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CN
China
Prior art keywords
insulating
conductive shield
permeable conductive
conducting strip
shield according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2007100043702A
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English (en)
Chinese (zh)
Inventor
D·A·吉利兰
R·T·弗雷德里克森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
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International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of CN101014237A publication Critical patent/CN101014237A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0067—Devices for protecting against damage from electrostatic discharge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
CNA2007100043702A 2006-02-01 2007-01-24 具有层压结构的透气导电屏蔽 Pending CN101014237A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/344,929 US7135644B1 (en) 2006-02-01 2006-02-01 Permeable conductive shield having a laminated structure
US11/344,929 2006-02-01

Publications (1)

Publication Number Publication Date
CN101014237A true CN101014237A (zh) 2007-08-08

Family

ID=37397656

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2007100043702A Pending CN101014237A (zh) 2006-02-01 2007-01-24 具有层压结构的透气导电屏蔽

Country Status (3)

Country Link
US (1) US7135644B1 (https=)
JP (1) JP4226041B2 (https=)
CN (1) CN101014237A (https=)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101803477B (zh) * 2007-09-21 2011-11-16 松下电器产业株式会社 电子部件封装体及其制造方法
CN102724857A (zh) * 2012-06-06 2012-10-10 电子科技大学 电磁波吸波结构
CN103781327A (zh) * 2012-10-24 2014-05-07 鸿富锦精密工业（深圳）有限公司 散热板及封装壳体
WO2014082529A1 (en) * 2012-11-28 2014-06-05 Esd Technology Consulting & Licensing Co., Ltd. Air stream controller and system for static charge reduction
CN105403278A (zh) * 2015-12-29 2016-03-16 成都兴联宜科技有限公司 光电直读远传干式水表
CN105424129A (zh) * 2015-12-29 2016-03-23 成都兴联宜科技有限公司 电磁兼容性良好的光电直读远传干式水表
CN115003014A (zh) * 2022-07-18 2022-09-02 武汉芯宝科技有限公司 一种esd全防护电路板及其制作方法

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070221440A1 (en) * 2006-03-24 2007-09-27 Gilliland Don A Air exhaust/inlet sound attenuation mechanism
US8513875B2 (en) 2006-04-18 2013-08-20 Cree, Inc. Lighting device and lighting method
TWI460880B (zh) 2006-04-18 2014-11-11 Cree Inc 照明裝置及照明方法
US7902475B2 (en) * 2006-09-11 2011-03-08 Apple Inc. Flushness shims
US8029155B2 (en) 2006-11-07 2011-10-04 Cree, Inc. Lighting device and lighting method
CN101711325B (zh) 2007-05-08 2013-07-10 科锐公司 照明装置和照明方法
CN101821544B (zh) 2007-10-10 2012-11-28 科锐公司 照明装置及制造方法
CN102036519B (zh) * 2009-09-29 2014-10-15 鸿富锦精密工业（深圳）有限公司 电子装置
TWI378766B (en) * 2010-01-07 2012-12-01 Transcend Information Inc Electronic device and emi/esd protection module thereof
CN102686012B (zh) * 2011-03-18 2017-03-15 爱立信(中国)通信有限公司 静电屏蔽装置、电子设备及制作该静电屏蔽装置的方法
US8804374B2 (en) 2011-10-12 2014-08-12 International Business Machines Corporation Electromagnetic interference shield
TWI491347B (zh) * 2012-10-24 2015-07-01 Hon Hai Prec Ind Co Ltd 散熱板及封裝殼體
US9153886B2 (en) * 2012-10-26 2015-10-06 Continental Automotive Systems, Inc. Pin header assembly and method of forming the same
US10356964B2 (en) 2016-07-21 2019-07-16 Hewlett Packard Enterprise Development Lp Waveguide structures
CN107360707A (zh) * 2017-07-19 2017-11-17 深圳源广安智能科技有限公司 一种包含石墨烯材料的吸波体结构
CN107272260B (zh) * 2017-07-19 2020-04-21 京东方科技集团股份有限公司 背光灯条、背光模组及显示装置
CN109321159A (zh) * 2018-10-24 2019-02-12 苏州益邦电子材料有限公司 超薄防变形多功能键盘胶带
US12328856B2 (en) 2022-10-03 2025-06-10 Google Llc Component shielding

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5928076C1 (en) * 1997-09-25 2001-04-24 Hewlett Packard Co Emi-attenuating air ventilation panel
US6351394B1 (en) * 1999-02-12 2002-02-26 Tyco Electronics Corporation Conductive frame for receiving an electronic module
US6297446B1 (en) * 1999-02-26 2001-10-02 Hewlett Packard Company High performance EMC vent panel
ATE366510T1 (de) * 1999-08-17 2007-07-15 Parker Hannifin Corp Elektromagnetisch abgeschirmte lüftungsplatte und deren herstellungsverfahren
US6483719B1 (en) 2000-03-21 2002-11-19 Spraylat Corporation Conforming shielded form for electronic component assemblies
US6496386B2 (en) * 2000-12-22 2002-12-17 Hewlett-Packard Company Method and system for shielding an externally mounted circuit board from electrostatic discharge and mechanical damage while allowing for heat exchange from heat-producing components of the circuit board through the circuit board shield into an external environment
KR100394151B1 (ko) 2001-04-25 2003-08-09 주성숙 무선이동통신단말기용 도전성 액정화면쿠션 및 그 제조방법
EP1386527A1 (en) 2001-05-10 2004-02-04 Parker Hannifin Corporation Manufacture of electronics enclosure having a metallized shielding layer
US6563198B1 (en) 2001-08-01 2003-05-13 Lsi Logic Corporation Adhesive pad having EMC shielding characteristics
US20030091777A1 (en) 2001-08-14 2003-05-15 Peter Jones Clean release tape for EMI shielding
US6784363B2 (en) 2001-10-02 2004-08-31 Parker-Hannifin Corporation EMI shielding gasket construction
US7208192B2 (en) 2002-05-31 2007-04-24 Parker-Hannifin Corporation Thermally or electrically-conductive form-in-place gap filter
US7005573B2 (en) 2003-02-13 2006-02-28 Parker-Hannifin Corporation Composite EMI shield
US7114961B2 (en) * 2003-04-11 2006-10-03 Neoconix, Inc. Electrical connector on a flexible carrier
TWM241965U (en) * 2003-05-23 2004-08-21 Hon Hai Prec Ind Co Ltd EMI-Attenuating air ventilation panel
US6884937B1 (en) 2003-10-08 2005-04-26 Nortel Networks Limited Electromagnetic compliant shield having electrostatic discharge protection

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101803477B (zh) * 2007-09-21 2011-11-16 松下电器产业株式会社 电子部件封装体及其制造方法
CN102724857A (zh) * 2012-06-06 2012-10-10 电子科技大学 电磁波吸波结构
CN102724857B (zh) * 2012-06-06 2016-09-14 电子科技大学 电磁波吸波结构
CN103781327A (zh) * 2012-10-24 2014-05-07 鸿富锦精密工业（深圳）有限公司 散热板及封装壳体
CN103781327B (zh) * 2012-10-24 2016-08-03 鸿富锦精密工业（深圳）有限公司 散热板及封装壳体
WO2014082529A1 (en) * 2012-11-28 2014-06-05 Esd Technology Consulting & Licensing Co., Ltd. Air stream controller and system for static charge reduction
CN105403278A (zh) * 2015-12-29 2016-03-16 成都兴联宜科技有限公司 光电直读远传干式水表
CN105424129A (zh) * 2015-12-29 2016-03-23 成都兴联宜科技有限公司 电磁兼容性良好的光电直读远传干式水表
CN115003014A (zh) * 2022-07-18 2022-09-02 武汉芯宝科技有限公司 一种esd全防护电路板及其制作方法
CN115003014B (zh) * 2022-07-18 2022-11-11 武汉芯宝科技有限公司 一种esd全防护电路板及其制作方法

Also Published As

Publication number Publication date
US7135644B1 (en) 2006-11-14
JP4226041B2 (ja) 2009-02-18
JP2007208261A (ja) 2007-08-16

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