CN101009973B - 树脂复合铜箔、印刷线路板和它们的制造方法 - Google Patents

树脂复合铜箔、印刷线路板和它们的制造方法 Download PDF

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Publication number
CN101009973B
CN101009973B CN2007100082213A CN200710008221A CN101009973B CN 101009973 B CN101009973 B CN 101009973B CN 2007100082213 A CN2007100082213 A CN 2007100082213A CN 200710008221 A CN200710008221 A CN 200710008221A CN 101009973 B CN101009973 B CN 101009973B
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China
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resin
copper
copper foil
printed substrate
electrolytic copper
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CN2007100082213A
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Chinese (zh)
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CN101009973A (zh
Inventor
野崎充
岳杜夫
田中泰夫
永田英史
菊地靖雄
矢野真司
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PI R&D Co Ltd
Mitsubishi Gas Chemical Co Inc
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PI R&D Co Ltd
Mitsubishi Gas Chemical Co Inc
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Priority claimed from JP2006065010A external-priority patent/JP4829647B2/ja
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  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
CN2007100082213A 2006-01-25 2007-01-25 树脂复合铜箔、印刷线路板和它们的制造方法 Active CN101009973B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2006016081A JP4896533B2 (ja) 2006-01-25 2006-01-25 樹脂複合銅箔およびその製造方法
JP2006016081 2006-01-25
JP2006-016081 2006-01-25
JP2006065010 2006-03-10
JP2006065010A JP4829647B2 (ja) 2006-03-10 2006-03-10 プリント配線板及びその製造方法
JP2006-065010 2006-03-10

Publications (2)

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CN101009973A CN101009973A (zh) 2007-08-01
CN101009973B true CN101009973B (zh) 2010-06-09

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JP (1) JP4896533B2 (ja)
CN (1) CN101009973B (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4829647B2 (ja) * 2006-03-10 2011-12-07 三菱瓦斯化学株式会社 プリント配線板及びその製造方法
TWI342323B (en) * 2007-01-22 2011-05-21 Chang Chun Plastics Co Ltd Thermoset resin modified polyimide resin composition
JP4752910B2 (ja) * 2007-12-26 2011-08-17 三菱瓦斯化学株式会社 ドリル孔明け用エントリーシート
KR20120011032A (ko) * 2009-05-08 2012-02-06 미츠비시 가스 가가쿠 가부시키가이샤 열경화성 폴리이미드 수지 조성물, 경화물 및 점착제
JP5494341B2 (ja) * 2010-08-12 2014-05-14 Ｄｉｃ株式会社 熱硬化型樹脂組成物、その硬化物およびプリント配線板用層間接着フィルム
WO2012105558A1 (ja) * 2011-02-01 2012-08-09 Dic株式会社 熱硬化型樹脂組成物、その硬化物およびプリント配線板用層間接着フィルム
CN104735929B (zh) * 2013-12-24 2017-12-29 深南电路有限公司 电路板加工方法和设备
WO2019073891A1 (ja) * 2017-10-10 2019-04-18 三井金属鉱業株式会社 プリント配線板用樹脂組成物、樹脂付銅箔、銅張積層板、及びプリント配線板
CN110381676B (zh) * 2018-04-13 2021-10-12 台郡科技股份有限公司 曝光成孔薄型化埋入式线路卷式制造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5298331A (en) * 1990-08-27 1994-03-29 E. I. Du Pont De Nemours And Company Flexible multi-layer polyimide film laminates and preparation thereof
CN1402959A (zh) * 1999-12-06 2003-03-12 出光石油化学株式会社 多层印刷线路板
CN1410262A (zh) * 2001-10-10 2003-04-16 台虹科技股份有限公司 二层电路软板的高效率制程方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3897576B2 (ja) * 2001-10-12 2007-03-28 株式会社ピーアイ技術研究所 ケトン及び／又はエーテルの溶媒に可溶なブロック共重合ポリイミド組成物及びその製造法
JP2003147171A (ja) * 2001-11-15 2003-05-21 Hitachi Chem Co Ltd 絶縁樹脂組成物の製造方法、絶縁樹脂組成物、該絶縁樹脂組成物を用いた銅箔付き絶縁材及び銅張積層板
JP4303623B2 (ja) * 2003-04-07 2009-07-29 三井化学株式会社 ポリイミド金属積層板の製造方法および接着剤組成物
JP4767517B2 (ja) * 2004-09-14 2011-09-07 三菱瓦斯化学株式会社 樹脂複合銅箔とこれを用いた銅張積層板及びプリント配線板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5298331A (en) * 1990-08-27 1994-03-29 E. I. Du Pont De Nemours And Company Flexible multi-layer polyimide film laminates and preparation thereof
US5411765A (en) * 1990-08-27 1995-05-02 E. I. Du Pont De Nemours And Company Flexible multi-layer polyimide film laminates and preparation thereof
CN1402959A (zh) * 1999-12-06 2003-03-12 出光石油化学株式会社 多层印刷线路板
CN1410262A (zh) * 2001-10-10 2003-04-16 台虹科技股份有限公司 二层电路软板的高效率制程方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开2000-261144A 2000.09.22

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Publication number Publication date
JP2007196471A (ja) 2007-08-09
CN101009973A (zh) 2007-08-01
JP4896533B2 (ja) 2012-03-14

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