CN100563003C - 太阳能发光装置 - Google Patents

太阳能发光装置 Download PDF

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CN100563003C
CN100563003C CNB2007100862573A CN200710086257A CN100563003C CN 100563003 C CN100563003 C CN 100563003C CN B2007100862573 A CNB2007100862573 A CN B2007100862573A CN 200710086257 A CN200710086257 A CN 200710086257A CN 100563003 C CN100563003 C CN 100563003C
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light
solar
utmost point
chip
integrated component
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CN101192602A (zh
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赖利弘
黄堃芳
谢文昇
赖利温
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HIGHERWAY ELECTRONIC CO Ltd
HLJ TECHNOLOGY Co Ltd
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Millennium Communication Co Ltd
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Abstract

一种太阳能发光装置，包含一具有太阳能芯片及发光二极管芯片的光接收发射集成元件、一可充电式电池及一特殊应用集成电路；利用光接收发射集成元件的透明封装体将入射的太阳光聚焦至太阳能芯片以产生一第一电压；可充电式电池电性连接至光接收发射集成元件，且通过太阳能芯片所产生的第一电压充电；该特殊应用集成电路电性连接至可充电式电池及光接收发射集成元件，以将第一电压升压至一第二电压，并通过可充电式电池放电，以第二电压驱动LED芯片发光。此太阳能发光装置具备有尺寸小、紧密、整合简单、安装容易及符合成本效益的优点。

Description

太阳能发光装置
技术领域
本发明涉及一种太阳能发光装置，特别是一种整合光接收元件及光发射元件的太阳能发光装置。
背景技术
随着技术的进步，固态照明光源(solid-state lighting source)，如发光二极管(Light Emitting Diode，LED)，因LED具有体积小、节电、寿命长、无玻璃及无毒气等优点，越来越可符合成本效益；各式的发光二极管LED，如红光LED、蓝光LED、绿光LED及白光LED等，可根据装饰、指示、展示及照明等不同的使用方式，而被应用于许多光的应用领域中。
另一方面，相较于石油的逐渐短缺与昂贵缺点，由于太阳能具有免费与不被耗尽的优点，因此其已逐渐被使用，作为一种洁净能源的根源。举例来说，一种以砷化镓(GaAs)、铟砷化镓(InGaAs)、碲化镉(CdTe)、铝砷化镓(AlGaAs)或铜铟硒化镓(CuIn(Ga)Se2)等化合物为基底的聚光型太阳能芯片，具备有高光能转换效率(photo-voltaicefficiency)的优点，因此，如此的太阳能电池已愈来愈受欢迎且普遍被使用。
一种以LED作为光发射元件且于夜间使用的太阳能发光装置已广泛的应用于街道上，如路灯、警示记号及指示记号等；或使用于户外装饰灯、庭院照明、花园造景照明及广告灯等。常见的太阳能发光装置通常包含一LED芯片、一太阳能芯片、一可充电式电池及一控制器，太阳能芯片于白天接收太阳光，且将太阳能转换为电能以储存在可充电式电池中，在夜间时，控制器控制可充电式电池释放所储存的电能，以便驱动LED芯片发光。此种已知的太阳能发光装置的优点在于不需以困难、不方便且昂贵的硬接线(hard-wiring)方式与外部电子系统进行连接，或不需通过外部电源对可充电式电池进行耗时、麻烦、棘手且昂贵的再充电过程。
然而，由于太阳能芯片与LED芯片的分开封装，已知的太阳能发光装置具有整合复杂、体积庞大及昂贵的缺陷。
再者，已知的太阳能发光装置通常包含一感应器侦测入射的太阳光的强度，以便提供给控制器决定何时需驱动LED芯片发光。一般来说，白天侦测所得的太阳光强度较强，因此LED芯片不发光。反之，夜间侦测所得的强度较弱，因此LED芯片会发光。然而，此额外的感应器与一些其它元件之间需以硬接线方式连接，将导致已知的太阳能发光装置的整合过程更为复杂；因此，此种设有感应器的太阳能发光装置更具有体积庞大、昂贵及组装不便的缺陷。
发明内容
为了解决上述太阳能芯片及LED分开封装的太阳能发光装置复杂、体积庞大及昂贵的问题，本发明目的之一在于提供一种使用光接收发射集成元件的太阳能发光装置。
本发明目的之一是提供一种不需以硬接线方式与外部电子系统进行连接，或不需通过外部电源对可充电式电池进行再充电的太阳能发光装置。
本发明目的之一是提供一种使用光接收发射集成元件的太阳能发光装置，具备有尺寸小、紧密、整合简单、安装容易及符合成本效益的优点。
本发明目的之一是提供一种太阳能发光装置，适用于如装饰灯等户外设备中，亦可作为路灯、警示记号及指示记号等街道应用。
为了达到上述目的，本发明之一实施例提供一种光接收发射集成元件，包含：一太阳能芯片设置于一承载基座上；一发光二极管芯片设置于承载基座上；一透明封装体覆盖发光二极管芯片及太阳能芯片；以及一导电结构部分暴露于透明封装体外，其中太阳能芯片经由承载基座及导电结构至少其中之一提供一能量给发光二极管芯片。
为了达到上述目的，本发明的另一实施例提供一种太阳能发光装置，包含：一具有太阳能芯片及发光二极管芯片的光接收发射集成元件、一可充电式电池及一特殊应用集成电路；利用光接收发射集成元件的透明封装体将入射的太阳光聚焦至太阳能芯片以产生一第一电压；可充电式电池电性连接至光接收发射集成元件，且通过太阳能芯片所产生的第一电压充电；又，特殊应用集成电路并电性连接至可充电式电池及光接收发射集成元件，以将第一电压升压至一第二电压，且经由可充电式电池以第二电压驱动发光二极管芯片发光。此外，当夜间所侦测的太阳光强度较弱而导致第一电压低于一预设的临界电压时，特殊应用集成电路可进而驱动发光二极管芯片发光。
附图说明
图1所示为本发明一实施例光接收发射集成元件结构剖面示意图。
图2所示为本发明另一实施例光接收发射集成元件结构剖面示意图。
图3所示为本发明又一实施例光接收发射集成元件结构剖面示意图。
图4所示为本发明又一实施例光接收发射集成元件结构剖面示意图。
图5所示为本发明一实施例的太阳能发光装置方块示意图。
图中符号说明：
1    太阳能发光装置
2    光接收发射集成元件
3    光接收发射集成元件
4    光接收发射集成元件
5    光接收发射集成元件
6    可充电式电池
7    特殊应用集成电路
10   导线架
20   太阳能芯片
30   发光二极管芯片
42   第一金属引线
44   第二金属引线
46   第一导电胶
48   第二导电胶
50   第三金属引线
52   环氧树脂
60   透明封装体
70   导电结构
102  第一正极金属导线
104  第二正极金属导线
106  共极金属导线
108  承载基座
202  第一P极
204  第一N极
302  第二P极
304  第二N极
306  第二N极
具体实施方式
以下通过具体实施例配合所示的附图详加说明，当更容易了解本发明的目的、技术内容、特点及其所达成的功效，当不能以的限定本发明的专利范围。
图1所示为本发明一实施例光接收发射集成元件2结构剖面示意图，于本实施例中，一光接收发射集成元件2为一表面粘着型元件(Surface Mount Device)，包含：一太阳能芯片20及一发光二极管(LED)芯片30设置于一承载基座108上，一透明封装体60覆盖LED芯片30与太阳能芯片20，一导电结构70部分暴露于透明封装体60外，其中太阳能芯片20经由承载基座108及导电结构70提供能量给LED芯片30。
在一较佳实施例中，透明封装体60具有一弧形表面，但本发明不局限于此，且太阳能芯片20位于透明封装体60之一焦点位置上；透明封装体60可由环氧化合物或玻璃所构成，藉以防止入射光反射并保护太阳能芯片20与LED芯片30。又太阳能芯片20可为一种以化合物为基底的太阳能芯片，例如以砷化镓(GaAs)为基底、以铟砷化镓(InGaAs)为基底、以碲化镉(CdTe)为基底、以铝砷化镓(AlGaAs)为基底、以铜铟硒化镓(CuIn(Ga)Se2)为基底或以上述的组合物为基底。而LED芯片30可选自多种类型，如LDE阵列、红光LED芯片、蓝光LED芯片、绿光LED芯片或白光LED芯片。
于是，本发明之一特征是将太阳能芯片20及LED芯片30共同封装为一光接收发射集成元件2，与已知的利用LED作为发光元件的太阳能发光装置相比较，由于已知的太阳能芯片与LED芯片为分离设计，因此本发明光接收发射集成元件2具有整合简单、小巧及符合成本效益的优点。
图2所示为本发明另一实施例光接收发射集成元件3结构剖面示意图，于本实施例中，导线结构包含一第一正极金属导线102、一第二正极金属导线104及一共极金属导线106，其中经由第一正极金属导线102与共极金属导线106间所产生的第一电压，为太阳能芯片20接收入射的太阳光后，可将太阳能转换为电能，其中透明封装体60可用以将入射的太阳光聚焦至太阳能芯片20，并防止入射的太阳光被反射出去；又通过第二正极金属导线104与共极金属导线106间所产生的第二电压，驱动LED芯片30发光。
在本发明的实施例中，LED芯片30具有数种不同的类型，其中一种类型为将LED芯片的P极设置于LED芯片顶面，而LED芯片的N极则设置于LED芯片底面；另一种类型为将LED芯片的P极与N极皆设置于LED芯片顶面；此二种类型所对应的封装结构描述于以下的实施例中。
图3所示为本发明又一实施例光接收发射集成元件4结构剖面示意图，于本实施例中，一第一P极202设置于太阳能芯片20顶面，一第一N极204设置于太阳能芯片20底面，一第二P极302设置于LED芯片30顶面，一第二N极304设置于LED芯片30底面；又此光接收发射集成元件4具有一导线架10，其包含承载基座108、第一正极金属导线102、共极金属导线106与第二正极金属导线104。
请继续参阅图3，在一较佳实施例中，第一P极202通过第一金属引线42电性连接至第一正极金属导线102，且第二P极302通过一第二金属引线44电性连接至第二正极金属导线104；并于第一N极204及承载基座108之间设置一第一导电胶46，以便粘固太阳能芯片20于导线架10上且使第一N极204与共极金属导线106电性连接，且于第二N极304及承载基座108之间设置一第二导电胶48，以便粘固LED芯片30于导线架10上且使第二N极304与共极金属导线106电性连接，上述的第一导电胶46与第二导电胶48可为银胶。
图3所示的太阳能芯片20、LED芯片30、第一正极金属导线102、共极金属导线106、第二正极金属导线104与透明封装体60的相对结构与功能，已于图2的描述中说明，故在此不再赘述。
图4所示为本发明又一实施例光接收发射集成元件5结构剖面示意图，此实施例与图3所示的光接收发射集成元件4的差异点如下所述。如图4所示，于LED芯片30顶面且第二P极302旁设有一第二N极306，其通过一第三金属引线50电性连接至共极金属导线106；另有一绝缘的环氧树脂52设置于LED芯片30与承载基座108之间，藉以粘固LED芯片30于导线架10上。
因此，本发明之一特征为LED芯片的P极与N极可以被设置在同一面或相对面，又本发明光接收发射集成元件4可包含一导线架，用以承载太阳能芯片与LED芯片，使太阳能芯片可经由导线架提供能量给LED芯片。
图5所示为本发明一实施例的太阳能发光装置1方块示意图，请同时参阅图1，太阳能发光装置1包括：一光接收发射集成元件2，如图1所示，其中透明封装体60将入射的太阳光聚焦至太阳能芯片20以产生一第一电压；一可充电式电池6电性连接至导电结构70，且通过太阳能芯片20所产生的第一电压充电；一特殊应用集成电路(Application Specific Integrated Circuit，ASIC)7电性连接至可充电式电池6以将第一电压升压至第二电压，特殊应用集成电路7亦电性连接至导电结构70，以便经由可充电式电池6以第二电压驱动LED芯片30发光。
在一较佳实施例中，第二电压高于第一电压，进一步地，第二电压不低于一截止电压，且第一电压高于一截止电压；当由太阳能芯片20所产生且被特殊应用集成电路7所接收的第一电压低于预设的临界电压(threshold voltage)时，特殊应用集成电路7可驱动LED芯片30发光。通常在白天里，所入射的太阳光的强度较强，太阳能芯片20所产生的第一电压高于预设的临界电压，因此LED芯片并不发光；相反地，在夜间所入射的太阳光的强度较弱，太阳能芯片20所产生的第一电压低于预设的临界电压，因此将驱动LED芯片发光。
综上所述，利用本发明光接收发射集成元件所设计的太阳能发光装置，具备有整合简单、小巧及符合成本效益的优点，此太阳能发光装置不需以硬接线方式与外部电子系统进行连接，或不需通过外部电源对可充电式电池进行再充电。此外，本发明太阳能发光装置亦不需多余的感应器来侦测并决定何时需驱动LED芯片发光，使本发明太阳能发光装置相较于已知的太阳能发光装置而言，更具有简单、小巧、便宜与容易安装的优点。
因此，本发明太阳能发光装置非常适合应用于户外设备中，例如装饰灯...等；进一步地，亦可作为街道应用，如路灯、警示记号及指示记号。
以上所述的实施例仅为说明本发明的技术思想及特点，其目的在使熟习此项技艺的人士能够了解本发明的内容并据以实施，当不能以的限定本发明的专利范围，即大凡依本发明所揭示的精神所作的均等变化或修饰，仍应涵盖在本发明的专利范围内。

Claims (19)

1.一种光接收发射集成元件，包含：
一太阳能芯片，设置于一承载基座上；
一发光二极管芯片，设置于该承载基座上；
一透明封装体，覆盖该发光二极管芯片及该太阳能芯片；以及
一导电结构，部分暴露于该透明封装体外，其中该太阳能芯片经由该承载基座及该导电结构至少其中之一提供一能量给该发光二极管芯片。
2.如权利要求1所述的光接收发射集成元件，其中，该透明封装体具有一弧形表面。
3.如权利要求1所述的光接收发射集成元件，其中，该太阳能芯片位于该透明封装体之一焦点位置。
4.如权利要求1所述的光接收发射集成元件，其中，该透明封装体为环氧化合物或玻璃。
5.如权利要求1所述的光接收发射集成元件，其中，该发光二极管芯片为一发光二极管阵列。
6.如权利要求1所述的光接收发射集成元件，其中，该发光二极管芯片选自红光发光二极管芯片、蓝光发光二极管芯片、绿光发光二极管芯片及白光发光二极管芯片其中之一。
7.如权利要求1所述的光接收发射集成元件，其中，该太阳能芯片以一化合物为基底，该化合物为砷化镓、铟砷化镓、碲化镉、铝砷化镓、铜铟硒化镓或其组合物。
8.如权利要求1所述的光接收发射集成元件，其中，该太阳能芯片包含一第一P极及一第一N极，该发光二极管芯片包含一第二P极及一第二N极，该导电结构包含一第一正极金属导线、一共极金属导线及一第二正极金属导线，其中，该第一正极金属导线、该共极金属导线与该第二正极金属导线彼此电性绝缘，且该第一N极与该第二N极电性连接至该共极金属导线，该第一P极电性连接至该第一正极金属导线，该第二P极电性连接至该第二正极金属导线。
9.如权利要求8所述的光接收发射集成元件，更包含一导线架具有该承载基座、该第一正极金属导线、该共极金属导线与该第二正极金属导线。
10.如权利要求9所述的光接收发射集成元件，其中，该第一P极设置于该太阳能芯片顶面，该第一N极设置于该太阳能芯片底面，该第二P极设置于该发光二极管芯片顶面，该第二N极设置于该发光二极管芯片底面。
11.如权利要求10所述的光接收发射集成元件，其中，该第一P极通过一第一金属引线电性连接至该第一正极金属导线，该第二P极通过一第二金属引线电性连接至该第二正极金属导线，在该第一N极及该承载基座之间设置一第一导电胶，藉以粘固该太阳能芯片于该导线架上且电性连接该第一N极与该共极金属导线，又在该第二N极及该承载基座之间设置一第二导电胶，藉以粘固该发光二极管芯片于该导线架上且电性连接该第二N极与该共极金属导线。
12.如权利要求11所述的光接收发射集成元件，其中，该第一导电胶与该第二导电胶为银胶。
13.如权利要求9所述的光接收发射集成元件，其中，该第一P极设置于该太阳能芯片顶面，该第一N极设置于该太阳能芯片底面，该第二P极设置于该发光二极管芯片顶面，该第二N极设置于该发光二极管芯片顶面，且位于该第二P极旁。
14.如权利要求13所述的光接收发射集成元件，其中，该第一P极通过一第一金属引线电性连接至该第一正极金属导线，该第二P极通过一第二金属引线电性连接至该第二正极金属导线，在该第一N极及该承载基座之间设置一导电胶，藉以粘固该太阳能芯片于该导线架上，且电性连接该第一N极与该共极金属导线，该第二N极通过一第三金属引线与该导线架接合而电性连接至该共极金属导线，并有一绝缘的环氧树脂设置于该发光二极管芯片及该承载基座之间，藉以粘固该发光二极管芯片于该导线架上。
15.如权利要求14所述的光接收发射集成元件，其中，该导电胶为银胶。
16.一种应用权利要求1所述的光接收发射集成元件的太阳能发光装置，包含：
该光接收发射集成元件，其中该透明封装体将入射的太阳光聚焦至该太阳能芯片以产生一第一电压；
一可充电式电池，电性连接至该导电结构，且通过该太阳能芯片以该第一电压充电；以及
一特殊应用集成电路，电性连接至该可充电式电池，以将该第一电压升压至一第二电压，且电性连接至该导电结构，以便经由该可充电式电池以该第二电压驱动该发光二极管芯片发光。
17.如权利要求16所述的太阳能发光装置，其中，当该特殊应用集成电路所接收的该第一电压低于一预设的临界电压时，该特殊应用集成电路驱动该发光二极管芯片发光。
18.如权利要求16所述的太阳能发光装置，其中，该第二电压高于该第一电压。
19.如权利要求18所述的太阳能发光装置，其中，该第二电压不低于一截止电压，且该第一电压高于该截止电压。
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