CN100561348C - 使用干涉成像光刻法的部件优化 - Google Patents
使用干涉成像光刻法的部件优化 Download PDFInfo
- Publication number
- CN100561348C CN100561348C CNB2004100822905A CN200410082290A CN100561348C CN 100561348 C CN100561348 C CN 100561348C CN B2004100822905 A CNB2004100822905 A CN B2004100822905A CN 200410082290 A CN200410082290 A CN 200410082290A CN 100561348 C CN100561348 C CN 100561348C
- Authority
- CN
- China
- Prior art keywords
- mask
- optimization
- eigenfunction
- illumination
- focus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/36—Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2037—Exposure with X-ray radiation or corpuscular radiation, through a mask with a pattern opaque to that radiation
- G03F7/2039—X-ray radiation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70125—Use of illumination settings tailored to particular mask patterns
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
- G03F7/70433—Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors
- G03F7/70441—Optical proximity correction [OPC]
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
Claims (20)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US53065603P | 2003-12-19 | 2003-12-19 | |
US60/530656 | 2003-12-19 | ||
US10/756,829 US7594199B2 (en) | 2003-01-14 | 2004-01-14 | Method of optical proximity correction design for contact hole mask |
US10/756829 | 2004-01-14 | ||
US10/975,342 US7506299B2 (en) | 2003-12-19 | 2004-10-29 | Feature optimization using interference mapping lithography |
US10/975342 | 2004-10-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1680878A CN1680878A (zh) | 2005-10-12 |
CN100561348C true CN100561348C (zh) | 2009-11-18 |
Family
ID=34527975
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100822905A Expired - Fee Related CN100561348C (zh) | 2003-12-19 | 2004-12-17 | 使用干涉成像光刻法的部件优化 |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP1544680A3 (zh) |
JP (1) | JP2005183981A (zh) |
KR (1) | KR100927455B1 (zh) |
CN (1) | CN100561348C (zh) |
SG (1) | SG125970A1 (zh) |
TW (1) | TWI326002B (zh) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7126672B2 (en) * | 2004-12-27 | 2006-10-24 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US20090213354A1 (en) * | 2005-08-08 | 2009-08-27 | Micronic Laser Systems Ab | Method and apparatus for projection printing |
US7934172B2 (en) | 2005-08-08 | 2011-04-26 | Micronic Laser Systems Ab | SLM lithography: printing to below K1=.30 without previous OPC processing |
US7493589B2 (en) * | 2005-12-29 | 2009-02-17 | Asml Masktools B.V. | Method, program product and apparatus for model based geometry decomposition for use in a multiple exposure process |
JP2007184378A (ja) * | 2006-01-05 | 2007-07-19 | Canon Inc | 露光装置における露光量および/または焦点合わせのための基板の位置を求める方法および装置 |
JP2008076683A (ja) | 2006-09-20 | 2008-04-03 | Canon Inc | 原版データ作成プログラム、原版データ作成方法、原版作成方法、露光方法及びデバイスの製造方法 |
JP4804294B2 (ja) | 2006-09-20 | 2011-11-02 | キヤノン株式会社 | 原版データ作成プログラム、原版データ作成方法、原版作成方法、露光方法及びデバイスの製造方法 |
US8732625B2 (en) | 2007-06-04 | 2014-05-20 | Asml Netherlands B.V. | Methods for performing model-based lithography guided layout design |
JP4484909B2 (ja) | 2007-07-24 | 2010-06-16 | キヤノン株式会社 | 原版データ作成方法、原版作成方法、露光方法および原版データ作成プログラム |
US9779186B2 (en) | 2007-08-28 | 2017-10-03 | Asml Netherlands B.V. | Methods for performing model-based lithography guided layout design |
JP2009093138A (ja) * | 2007-09-19 | 2009-04-30 | Canon Inc | 原版データの生成方法、原版作成方法、露光方法、デバイス製造方法及び原版データを作成するためのプログラム |
JP2009194107A (ja) | 2008-02-13 | 2009-08-27 | Canon Inc | 有効光源形状のデータベースの生成方法、光学像の算出方法、プログラム、露光方法及びデバイス製造方法 |
JP5311326B2 (ja) * | 2008-02-18 | 2013-10-09 | ルネサスエレクトロニクス株式会社 | フォトマスク、パターンの形成方法および電子デバイスの製造方法 |
CN102224459B (zh) | 2008-11-21 | 2013-06-19 | Asml荷兰有限公司 | 用于优化光刻过程的方法及设备 |
JP5607308B2 (ja) | 2009-01-09 | 2014-10-15 | キヤノン株式会社 | 原版データ生成プログラムおよび方法 |
JP5607348B2 (ja) | 2009-01-19 | 2014-10-15 | キヤノン株式会社 | 原版データを生成する方法およびプログラム、ならびに、原版製作方法 |
KR101560332B1 (ko) | 2009-02-20 | 2015-10-15 | 삼성전자주식회사 | 마스크 및 마스크의 형성 방법 |
CN101957555B (zh) * | 2009-07-16 | 2012-10-03 | 中芯国际集成电路制造(上海)有限公司 | 掩模版图修正方法、掩模版制作方法和光学邻近校正方法 |
KR101198348B1 (ko) | 2009-10-28 | 2012-11-06 | 에이에스엠엘 네델란즈 비.브이. | 풀-칩 소스 및 마스크 최적화를 위한 패턴 선택 |
NL2005523A (en) | 2009-10-28 | 2011-05-02 | Asml Netherlands Bv | Selection of optimum patterns in a design layout based on diffraction signature analysis. |
JP5279745B2 (ja) * | 2010-02-24 | 2013-09-04 | 株式会社東芝 | マスクレイアウト作成方法、マスクレイアウト作成装置、リソグラフィ用マスクの製造方法、半導体装置の製造方法、およびコンピュータが実行可能なプログラム |
NL2006091A (en) | 2010-03-05 | 2011-09-06 | Asml Netherlands Bv | Design rule optimization in lithographic imaging based on correlation of functions representing mask and predefined optical conditions. |
JP5450262B2 (ja) | 2010-05-28 | 2014-03-26 | 株式会社東芝 | 補助パターン配置方法、プログラムおよびデバイス製造方法 |
KR101991966B1 (ko) | 2012-11-27 | 2019-06-24 | 에스티엑스조선해양 주식회사 | 과도 진동 방지 및 원자재 절감을 위한 선박의 독립형 유체 탱크 형상 |
US9666495B2 (en) | 2013-12-13 | 2017-05-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for reducing core-to-core mismatches in SOC applications |
DE102019215800A1 (de) * | 2019-10-15 | 2021-04-15 | Carl Zeiss Smt Gmbh | Verfahren zur Bestimmung einer optischen Phasendifferenz von Messlicht einer Messlichtwellenlänge über eine Fläche eines strukturierten Objektes |
CN112612181B (zh) * | 2020-12-08 | 2022-09-20 | 华虹半导体(无锡)有限公司 | 针对特定图形旁波效应的opc方法及通孔层opc处理方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3343054A1 (de) * | 1983-11-29 | 1985-06-05 | ANT Nachrichtentechnik GmbH, 7150 Backnang | System fuer den austausch von daten zwischen funkueberleiteinrichtungen |
US4891094A (en) * | 1989-05-25 | 1990-01-02 | Motorola, Inc. | Method of optimizing photoresist contrast |
JPH04216548A (ja) * | 1990-12-18 | 1992-08-06 | Mitsubishi Electric Corp | フォトマスク |
JP3343910B2 (ja) * | 1999-11-26 | 2002-11-11 | 日本電気株式会社 | 光強度スロープ計算方法、光強度ログスロープ計算方法およびこれらの計算方法を記述したプログラムを記録した情報記録媒体 |
TW552561B (en) * | 2000-09-12 | 2003-09-11 | Asml Masktools Bv | Method and apparatus for fast aerial image simulation |
TWI285295B (en) * | 2001-02-23 | 2007-08-11 | Asml Netherlands Bv | Illumination optimization in lithography |
JP3706364B2 (ja) * | 2001-10-09 | 2005-10-12 | アスムル マスクツールズ ビー.ブイ. | 2次元フィーチャ・モデルの較正および最適化方法 |
JP3592666B2 (ja) * | 2001-12-04 | 2004-11-24 | 株式会社東芝 | 露光用マスクパターンの補正方法、プログラム、マスクパターン形成方法、及び半導体装置の製造方法 |
KR100474571B1 (ko) * | 2002-09-23 | 2005-03-10 | 삼성전자주식회사 | 웨이퍼의 패턴 검사용 기준 이미지 설정 방법과 이 설정방법을 이용한 패턴 검사 방법 및 장치 |
EP1439420A1 (en) * | 2003-01-14 | 2004-07-21 | ASML Masktools B.V. | Simulation based method of optical proximity correction design for contact hole mask |
US7247574B2 (en) * | 2003-01-14 | 2007-07-24 | Asml Masktools B.V. | Method and apparatus for providing optical proximity features to a reticle pattern for deep sub-wavelength optical lithography |
-
2004
- 2004-12-10 SG SG200407336A patent/SG125970A1/en unknown
- 2004-12-16 EP EP04257866A patent/EP1544680A3/en not_active Withdrawn
- 2004-12-17 JP JP2004365569A patent/JP2005183981A/ja active Pending
- 2004-12-17 CN CNB2004100822905A patent/CN100561348C/zh not_active Expired - Fee Related
- 2004-12-17 KR KR1020040107537A patent/KR100927455B1/ko not_active IP Right Cessation
- 2004-12-20 TW TW093139707A patent/TWI326002B/zh not_active IP Right Cessation
Non-Patent Citations (2)
Title |
---|
Near 0.3 k1 full pitch range contact holepatterningusingchromeless phase lithography (CPL). Douglas Van Den Broeke ET AL.Proceedings of SPIE,Vol.5256 . 2003 |
Near 0.3 k1 full pitch range contact holepatterningusingchromeless phase lithography (CPL). Douglas Van Den Broeke ET AL.Proceedings of SPIE,Vol.5256 . 2003 * |
Also Published As
Publication number | Publication date |
---|---|
CN1680878A (zh) | 2005-10-12 |
JP2005183981A (ja) | 2005-07-07 |
EP1544680A2 (en) | 2005-06-22 |
KR20050062409A (ko) | 2005-06-23 |
KR100927455B1 (ko) | 2009-11-19 |
TWI326002B (en) | 2010-06-11 |
TW200534047A (en) | 2005-10-16 |
SG125970A1 (en) | 2006-10-30 |
EP1544680A3 (en) | 2006-01-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100561348C (zh) | 使用干涉成像光刻法的部件优化 | |
US8730452B2 (en) | Source and mask optimization by changing intensity and shape of the illumination source and magnitude and phase of mask diffraction orders | |
US7506299B2 (en) | Feature optimization using interference mapping lithography | |
US7594199B2 (en) | Method of optical proximity correction design for contact hole mask | |
US6792591B2 (en) | Method of identifying an extreme interaction pitch region, methods of designing mask patterns and manufacturing masks, device manufacturing methods and computer programs | |
JP3779637B2 (ja) | 極端相互作用ピッチ領域を識別する方法、マスクパターンを設計する方法およびマスクを製造する方法、デバイス製造方法およびコンピュータプログラム | |
KR101096145B1 (ko) | 모델-기반 리소그래피 안내 레이아웃 설계를 수행하는 방법들 | |
CN100465789C (zh) | 亚波长光刻的实施相平衡散射条放置模型的方法及其装置 | |
US20070209029A1 (en) | SLM Lithography: Printing to below K1=.30 without previous OPC processing | |
US8043797B2 (en) | Lithographic apparatus and device manufacturing method | |
CN103246173A (zh) | 用于3d抗蚀剂轮廓模拟的光刻模型 | |
US7735052B2 (en) | Method of identifying an extreme interaction pitch region, methods of designing mask patterns and manufacturing masks, device manufacturing methods and computer programs | |
Fenger | Image-based EUVL aberration metrology |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: ASML HOLLAND CO., LTD. Free format text: FORMER OWNER: ASML FRISKET TOOLS B.V. Effective date: 20140217 |
|
TR01 | Transfer of patent right |
Effective date of registration: 20140217 Address after: Holland Weide Eindhoven Patentee after: ASML Holland Co., Ltd. Address before: Holland Weierde Eindhoven Patentee before: ASML Frisket Tools B.V. |
|
TR01 | Transfer of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091118 Termination date: 20181217 |
|
CF01 | Termination of patent right due to non-payment of annual fee |