CN100559541C - Plasma display panel and manufacture method thereof - Google Patents

Plasma display panel and manufacture method thereof Download PDF

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Publication number
CN100559541C
CN100559541C CNB2006100513510A CN200610051351A CN100559541C CN 100559541 C CN100559541 C CN 100559541C CN B2006100513510 A CNB2006100513510 A CN B2006100513510A CN 200610051351 A CN200610051351 A CN 200610051351A CN 100559541 C CN100559541 C CN 100559541C
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China
Prior art keywords
protective layer
plasma display
display panel
scandium
amount
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CN1801436A (en
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崔侦植
朴应彻
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LG Electronics Inc
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LG Electronics Inc
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20Constructional details
    • H01J11/34Vessels, containers or parts thereof, e.g. substrates
    • H01J11/40Layers for protecting or enhancing the electron emission, e.g. MgO layers
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/28Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using luminous gas-discharge panels, e.g. plasma panels
    • G09G3/288Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using luminous gas-discharge panels, e.g. plasma panels using AC panels
    • G09G3/291Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using luminous gas-discharge panels, e.g. plasma panels using AC panels controlling the gas discharge to control a cell condition, e.g. by means of specific pulse shapes
    • G09G3/293Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using luminous gas-discharge panels, e.g. plasma panels using AC panels controlling the gas discharge to control a cell condition, e.g. by means of specific pulse shapes for address discharge
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/10AC-PDPs with at least one main electrode being out of contact with the plasma
    • H01J11/12AC-PDPs with at least one main electrode being out of contact with the plasma with main electrodes provided on both sides of the discharge space
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02Manufacture of electrodes or electrode systems

Abstract

A kind of plasma display panel and manufacture method thereof are disclosed.Plasma display panel of the present invention comprises: the front panel with protective layer; With with front panel setting spaced a predetermined distance from and with the rear board of this front panel combination.The protective layer that comprises magnesium oxide (MgO) has been doped scandium (Sc) and calcium (Ca).The advantage of plasma display panel of the present invention is to show the splendid plate characteristic that depends on temperature.The further advantage of plasma display panel of the present invention is the voltage margin of splendid addressing voltage.

Description

Plasma display panel and manufacture method thereof
Technical field
The present invention relates to plasma display panel (PDP), and more specifically relate to plasma display panel and manufacture method thereof, wherein improved the panel characteristics that depends on temperature.
Background technology
Usually, plasma display panel has a plurality of unit cells (unit cell), and each unit cell is limited by the partition wall of arranging between plate and the rear board in front (barrier rib).Unit cell is used such as the main discharge gas of the mixed gas (Ne+He) of neon (Ne), helium (He) or neon (Ne) and helium (He) and the inert gas that comprises a spot of xenon (Xe) and is filled.
If described gas discharges with high frequency voltage, inert gas will generate vacuum ultraviolet so.The fluorophor of excited by vacuum ultraviolet deposit between partition wall, so fluorophor just sends luminous ray, thereby has generated image.Because above-mentioned plasma display panel can be implemented with thin and light structure, so it is as display unit of future generation and noticeable.
Fig. 1 is the schematic diagram of demonstration according to the structure of the plasma display panel of prior art.
With reference to figure 1, plasma display panel comprises front panel 100 and the rear board 110 that combines togather, and is provided with although they are spaced from each other.Front panel 100 comprises as the front glass panel 101 of display surface and is arranged in a plurality of electrode pairs of keeping on the front glass panel 101 that every pair comprises scan electrode 102 and keeps electrode 103.Rear board 110 comprises the back glass plate 111 of the rear surface that plasma display panel is provided and is arranged on the glass plate 111 of back and keeps electrode pair address electrodes intersecting 113.
As mentioned above, front panel 100 comprises a plurality of electrode pairs of keeping, wherein each is kept electrode pair and comprises scan electrode 102 and keep electrode 103, they discharge mutually and keep a discharge in the discharge cell, and scan electrode 102 and keep electrode 103 and all have transparency electrode of being made by tin indium oxide (ITO) material " a " and the bus electrode of being made by metal material " b " wherein, electrode a and b are a pair of.
Scan electrode 102 and keep electrode 103 coated one or more upper dielectric layers 104 is used to limit discharging current and makes every pair to keep electrode a and b and other and keep electrode pair and insulate.Further, on the surface of upper dielectric layer 104, form protective layer 105.
Rear board 110 comprises being arranged in parallel and be arranged in parallel with by causing address discharge to produce vacuum ultraviolet addressing electrode 113 to limit the bar shaped that a plurality of discharge spaces are discharge cell (or well shape) partition wall 112 and a plurality of and partition wall 112.
Rear board 110 comprises that also deposit is at an upper portion thereof to send R, G, the B fluorophor 114 of luminous ray display image when the address discharge.Dielectric layer 115 is with protection addressing electrode 113 under providing between addressing electrode 113 and fluorophor 114.
In the plasma display panel of aforesaid prior art, has the front panel of the protective layer of making by magnesium oxide according to following method manufacturing.
Fig. 2 has shown the order of step of the front panel of the plasma display panel of making prior art.
As shown in Figure 2, at step a, form on front glass panel and keep electrode pair, every pair comprises scan electrode and keeps electrode.
Each scan electrode and keep electrode and comprise transparency electrode and bus electrode.Scan electrode and keep the following formation of electrode: the ELD that preparation is made by tin indium oxide (ITO), tin indium oxide is made by indium oxide and tin oxide; Stacked one deck dry film on ELD; The photomask that use has predetermined pattern transmits the photoresist composition on dry film; The etching ELD, thus be formed for scan electrode and the transparency electrode of keeping electrode.
Bus electrode is following to be formed on transparency electrode: print photosensitive silver (Ag) cream by the screen printing method, order is carried out photoetching process and etch process then.After forming bus electrode, carry out baking technology transparency electrode and bus electrode are heated to 550 ℃, finish scan electrode and the making of keeping electrode thus.
At step b, form scan electrode thereon and keep on the whole surface of front glass panel of electrode and form dielectric layer.
According to an illustrative methods that forms dielectric layer, by apply, dry dielectric glass cream and bake this dielectric glass cream 500 to 600 ℃ temperature and form dielectric layer.
At last, at step c, on dielectric layer, form the protective layer of magnesium oxide (MgO) by chemical vapor deposition (CVD) method, ion plating or vaccum gas phase sedimentation method.
In plasma display panel, the front panel made from said method is installed so that the protective layer of front panel is faced rear board.
Therefore, when to the addressing electrode of keeping electrode pair and rear board of front panel when applying the driving voltage display image, guiding discharge on protective layer.In this case, determine to impose on the driving voltage of electrode according to the characteristic of the discharging gap between front panel and the rear board, the kind that is filled in the discharge gas in the discharge space and pressure and dielectric layer and protective layer.When applying driving voltage, the surface of protective layer becomes state as described below.
Fig. 3 has described the state on the surface of protective layer when electrode applies driving voltage.
As shown in Figure 3, if causing plasma discharge when plasma display panel applies driving voltage, cation moves to the opposite side of discharge space with the electronics with opposite polarity.Therefore, the surface of protective layer is divided into the part of the electric charge with opposite polarity.The electric charge that accumulates on the protective layer is called as the wall electric charge.
Because protective layer is made by having high-resistance insulating material, so the wall electric charge remains on the surface of protective layer.Therefore, because the wall electric charge is kept discharge with the voltage lower than driving voltage.
Further, protective layer has reduced the discharge voltage of plasma display panel by secondary electron is provided.That is to say; viewpoint from the aspect of electricity; protective layer has played the effect that improves discharging efficiency; viewpoint from mechanical aspects; protective layer has played the effect that prevents that the upper dielectric layer made by PbO from decomposing, wherein the decomposition of upper dielectric layer when it is exposed to plasma owing to ion bombardment causes.
Because protective layer has played above-mentioned effect; therefore it must be made by the material that can be enough to play given effect; and must propagate luminous ray capitally, so that can propagate the front panel that passes plasma display panel from fluorophor visible light emitted line.
MgO is the material that satisfies the protective layer requirement, and therefore up to the present it all is used as the material of protective layer.But, magnesium oxide (MgO) also has the shortcoming of jitter: it is a kind of discharge delay phenomenon, wherein be not guiding discharge at once after having applied the signal of telecommunication that is used to discharge, but after having applied this signal of telecommunication, crossed certain hour just guiding discharge afterwards.This jitter is that the low-launch-rate by secondary electron causes, and when it had its source in ion bombardment MgO in plasma, magnesium oxide (MgO) showed unique characteristic.
That is to say airborne hydrogen oxide (H 2O) and carbon dioxide (CO 2) attracted on the surface of magnesium oxide (MgO), they cause the chemistry and the physical deformation on the surface of the protective layer made by MgO.Because the surface of the deformation of protective layer, reduced the emissivity of secondary electron, cause the decline of flash-over characteristic thus.
Therefore, when producing plasma discharge in the plasma display panel in prior art because jittering characteristic, after having imported the previous signal of telecommunication, wait for can guiding discharge time enough, just need to import next discharge signal.Therefore, the plasma display panel of prior art needs one or more circuit that are used to scan.
A kind of trend is arranged: if the temperature step-down of surrounding environment or plasma display panel, jitter can worsen.Therefore, when low temperature, address discharge is unsettled, causes mistake to write.Just, when low temperature, discharge cell is not selected, causes the black noise to display image thus.
In order to solve and overcome the problems referred to above and the shortcoming of the plasma display panel of prior art, developed the new material that is used for protective layer, and carried out improving magnesian The Characteristic Study.For example, the more protective layer used dopant materials of magnesium oxide (MgO) mix or protective layer has sandwich construction.
Summary of the invention
Therefore, the objective of the invention is to solve at least problem and shortcoming in the background technology.
The purpose of this invention is to provide a kind of plasma display panel with protective layer, this display panel is along with the change of temperature has splendid plate characteristic.Especially, the invention provides a kind of plasma display panel, it comprises protective layer, and this protective layer has the response time of the weak point under the low temperature, the narrow excursion of response time and the splendid addressing voltage nargin under the high temperature.
According to one embodiment of present invention; a kind of plasma display panel is provided; it comprises: front panel; be formed on the protective layer on the described front panel; with with front panel setting spaced a predetermined distance from and with the rear board of this front panel combination; protective layer comprising magnesium oxide (MgO) has been doped scandium (Sc) and calcium (Ca), and the scope that wherein is entrained in the amount of the scandium (Sc) in the protective layer is 50 to 2000ppm.
The scope that is entrained in the amount of the scandium (Sc) in the protective layer is 100 to 1000ppm.
The scope that is entrained in the amount of the scandium (Sc) in the protective layer is 300 to 700ppm.
The scope that is entrained in the amount of the calcium (Ca) in the protective layer is 100 to 1000ppm.
Wherein said protective layer further comprises silicon (Si).
The scope that is entrained in the amount of the scandium (Sc) in the protective layer is 50 to 2000ppm.
The scope that is entrained in the amount of the scandium (Sc) in the protective layer is 100 to 1000ppm.
The scope that is entrained in the amount of the scandium (Sc) in the protective layer is 300 to 700ppm.
The scope that is entrained in the amount of the silicon (Si) in the protective layer is 10 to 1000ppm.
The scope that is entrained in the amount of the silicon (Si) in the protective layer is 30 to 500ppm.
The scope that is entrained in the amount of the calcium (Ca) in the protective layer is 100 to 1000ppm.
According to still a further embodiment; a kind of plasma display panel is provided; it comprises: front panel; be formed on the protective layer on the described front panel; with with front panel setting spaced a predetermined distance from and with the rear board of this front panel combination; protective layer comprising magnesium oxide (MgO) has been doped scandium (Sc) and silicon (Si), and the scope that is entrained in the amount of the scandium (Sc) in the protective layer is 50 to 2000ppm.
The scope that is entrained in the amount of the scandium (Sc) in the protective layer is 100 to 1000ppm.
The scope that is entrained in the amount of the scandium (Sc) in the protective layer is 300 to 700ppm.
The scope that is entrained in the amount of the silicon (Si) in the protective layer is 10 to 1000ppm.
The scope that is entrained in the amount of the silicon (Si) in the protective layer is 30 to 500ppm.
Description of drawings
Describe the present invention below with reference to accompanying drawings, wherein identical reference number is represented identical parts:
Fig. 1 is the schematic diagram of the structure of the plasma display panel of demonstration prior art;
Fig. 2 has shown the order of the processing step of the plasma display panel of making prior art;
Fig. 3 has shown that schematically driving voltage wherein is applied in the surface to protective layer under the situation of plasma display panel and protective layer;
Fig. 4 has schematically shown the structure of plasma display panel according to an embodiment of the invention;
Fig. 5 has schematically shown the protective layer of plasma display panel according to this embodiment of the invention;
The curve display of Fig. 6 protective layer only by magnesium oxide (MgO) make make by magnesium oxide (MgO) with protective layer and the various situations of mixed scandium (Sc) under response time with variation of temperature;
The curve display of Fig. 7 the response time under constant temperature with the variation of the amount of scandium (Sc), wherein the amount of other dopant materials in magnesium oxide (MgO) is constant;
The curve display of Fig. 8 protective layer make by magnesium oxide (MgO) and mixed scandium (Sc) and protective layer is made by magnesium oxide (MgO) and the various situations of mixed scandium (Sc) and calcium (Ca) under the comparison of addressing voltage (Va) voltage margin in the time of 60 ℃;
Fig. 9 has shown the variation with the amount of calcium (Ca) in the following response time of constant temperature, and wherein the amount of other dopant materials of quantitative changeization of calcium (Ca) is then constant in magnesium oxide (MgO);
The flow chart of Figure 10 has shown the method for making plasma display panel according to an embodiment of the invention;
The curve display of Figure 11 protective layer only by magnesium oxide (MgO) make, silicon (Si) is made and mixed to protective layer by magnesium oxide (MgO) and protective layer is made by magnesium oxide (MgO) and the various situations of mixed silicon (Si) and scandium (Sc) under response time with variation of temperature;
The curve display of Figure 12 the response time under constant temperature with the variation of the amount of silicon (Si) in the magnesium oxide (MgO), wherein the amount of other dopant materials except silicon (Si) is constant in magnesium oxide (MgO);
The curve display of Figure 13 protective layer make by magnesium oxide and mixed silicon (Si) and scandium (Sc) and protective layer are made by magnesium oxide and the various situations of mixed silicon (Si), scandium (Sc) and calcium (Ca) under the comparison of addressing voltage (Va) voltage margin in the time of 60 ℃; With
The curve display of Figure 14 in magnesium oxide (MgO), mix the quantitative changeization of scandium (Sc), silicon (Si) and calcium (Ca) and calcium (Ca) and under the constant situation of the amount of scandium (Sc) and silicon (Si) under constant temperature voltage margin with the variation of the amount of calcium (Ca).
Embodiment
The preferred embodiments of the present invention are described below with reference to accompanying drawings in more detail.
Fig. 4 has schematically shown the structure of plasma display panel according to an embodiment of the invention.
With reference to Fig. 4, plasma display panel comprises front panel 400 and rear board 410, front panel 400 comprises front glass panel 401 and a plurality of electrode pair of keeping of display image thereon, every pair comprises scan electrode 402 and keeps electrode 403, rear board 410 comprise the back glass plate 411 of the rear surface that plasma display panel is provided and be arranged on the glass plate 411 of back and with keep a plurality of addressing electrodes 413 that electrode pair intersects, wherein front panel 400 and rear board 410 are combined in the layout that separates each other mutually.
In front in the plate 400, scan electrode 402 and keep electrode 403 and be formed on and produce discharge in the discharge cell mutually and keep a pair of of discharge.Further, scan electrode 402 and keep in the electrode 403 each all comprise transparency electrode a that makes by transparent material and the bus electrode b that makes by metal material.
Scan electrode 402 and keep electrode 403 and be capped dielectric layer 404, its restriction discharging current also makes electrode pair insulated from each other, and dielectric layer 404 has been capped protective layer 405.
Rear board 410 comprises and defines the bar shaped partition wall 412 that discharge space is discharge cell and layout parallel to each other.Rear board 410 also comprises a plurality of addressing electrodes 413 that are arranged in parallel with partition wall 412.
R, G, B fluorophor 414 are coated on the surface of rear board 410 to send the luminous ray that is used for display image when the address discharge.Rear board 410 also comprises the following dielectric layer 415 that is used to protect addressing electrode 413 between addressing electrode 413 and fluorophor 414.
Protective layer 405 has been doped scandium (Sc) and calcium (Ca).
Fig. 5 has explained the surface of the protective layer 405 of plasma display panel according to this embodiment of the invention.
With reference to Fig. 5, the protective layer 405 of plasma display panel is mainly made by magnesium oxide (MgO) 52 according to an embodiment of the invention, and the dopant material as scandium (Sc) 50 and calcium (Ca) 51 of having mixed.In Fig. 5, elements scandium (Sc) 50 is represented as circle, and element calcium (Ca) 51 is represented as rectangle.
So, being included in the effect that scandium (Sc) 50 in the protective layer and calcium (Ca) 51 plays is to improve protective layer 405 temperature variant characteristics.Below temperature variant characteristic will be described in more detail.
Be doped at protective layer under the situation of scandium (Sc) 50, the response time is improved.This improvement of response time is described with reference to Fig. 6.
The curve display of Fig. 6 protective layer only by magnesium oxide (MgO) make make by magnesium oxide (MgO) with protective layer and the various situations of mixed scandium (Sc) under response time with variation of temperature.
With reference to Fig. 6, to lack under the situation that the response time of plasma display panel has only been made by magnesium oxide (MgO) than protective layer 405 under protective layer 405 has mixed the situation of scandium (Sc) 50.Particularly, at-10 ℃ of low temperature or be lower than under the situation of-10 ℃ of low temperature, use the response speed of situation of the protective layer of mixed scandium (Sc) approximately to be to use the twice of response speed of situation of the protective layer of the scandium that do not mix (Sc).This is that the situation of the dopant material that do not mix is compared because only made by magnesium oxide with protective layer, and along with protective layer has been doped scandium (Sc), the emission characteristics of secondary electron is improved.Therefore, because the improvement of secondary electron emission characteristic, it is stable that address discharge becomes at short notice, even response also becomes very fast so at low temperatures.
Further, under the situation of also find to have mixed in magnesium oxide (MgO) scandium (Sc), the response time is not very big with variation of temperature.For example, under the situation that protective layer is only formed by magnesium oxide (MgO), the response time varies with temperature greatly and changes.But, protective layer make by magnesium oxide (MgO) and the situation of mixed scandium (Sc) under, even the temperature of plasma display panel sharply changes, the response time also only changes in the scope of relative narrower.Just, make by magnesium oxide (MgO) and the protective layer of mixed scandium (Sc) makes the response time change in narrow scope.The response time of protective layer determines that according to the content of the scandium (Sc) of protective layer the amount of scandium (Sc) and the relation between the response time are shown among Fig. 7.
The curve display of Fig. 7 the response time under constant temperature with the variation of the amount of scandium (Sc), wherein protective layer is made and the scandium that mixed (Sc) and other dopant materials by magnesium oxide (MgO), and the amount of other dopant materials is constant.
With reference to Fig. 7, the amount in the scandium (Sc) in the magnesium oxide (MgO) of being entrained in is preferably in 50 to 2000ppm scope, more preferably in 100 to 1000ppm scope, most preferably in 300 to 700ppm scope.
The amount of scandium (Sc) is lower than under the situation of 50ppm in magnesium oxide (MgO), the minimizing effect of the excursion of response time is too little, in addition, in magnesium oxide (MgO) under the situation of amount greater than 2000ppm of scandium (Sc), can destroy the crystal structure of the uniqueness of magnesium oxide (MgO), cause the deterioration of magnesium oxide (MgO) primary characteristic.
According to another embodiment of the invention, provide by magnesium oxide (MgO) and made and the protective layer of mixed calcium (Ca).Make and the characteristic of the protective layer of mixed calcium (Ca) is described with reference to Fig. 8 by magnesium oxide (MgO).
Fig. 8 shown protective layer make by magnesium oxide (MgO) and mixed scandium (Sc) and protective layer is made by magnesium oxide (MgO) and the various situations of mixed scandium (Sc) and calcium (Ca) under the comparison of addressing voltage (Va) voltage margin in the time of 60 ℃.
As shown in Figure 8, the purpose of doping calcium (Ca) is not the response time when improving low temperature, but the voltage margin of the addressing voltage (Va) when improving high temperature.Just; under the situation of scandium (Sc) but also doping calcium (Ca) of in magnesium oxide (MgO), not only mixing; protective layer have addressing voltage nargin on the occasion of, and under the situation of scandium (Sc) that only mix in magnesium oxide (MgO), protective layer has the negative value of addressing voltage nargin.The mixed magnesium oxide (MgO) of calcium (Ca) has the relative addressing voltage nargin of having improved, and has improved the addressing jitter thus.
Fig. 9 has shown under the situation of doping scandium (Sc) and calcium (Ca) in magnesium oxide (MgO) voltage margin with the variation of the amount of calcium (Ca) in the magnesium oxide (MgO), wherein the temperature constant of the constant and magnesium oxide (MgO) of the amount of other dopant material except calcium (Ca).
As shown in Figure 9, the amount of calcium (Ca) in 100 to 1000ppm scope, more preferably is 500ppm preferably in the magnesium oxide (MgO).
If the doping of calcium (Ca) is lower than 100ppm or is higher than 1000ppm, then the voltage margin of addressing voltage do not have on the occasion of.
The flow chart of Figure 10 has shown the method for making plasma display panel according to an embodiment of the invention.
As shown in figure 10, on the front glass panel (not shown), form scan electrode and keep electrode (S90).
Subsequent, be formed with scan electrode and keep on the front glass panel of electrode at S90 set by step, form dielectric layer to cover scan electrode and to keep electrode (S91).
Subsequent, on the dielectric layer that S91 forms set by step, form protective layer (S92).Scandium (Sc) and calcium (Ca) are made and be doped with to protective layer mainly by magnesium oxide (MgO).
Make and the protective layer of mixed scandium (Sc) and calcium (Ca) preferably forms by vaccum gas phase sedimentation method by magnesium oxide (MgO).
In addition, can pass through chemical vapour deposition technique, electronic beam method, ion plating or sputtering method according to protective layer of the present invention forms.
The curve display of Figure 11 protective layer only by magnesium oxide (MgO) make, silicon (Si) is made and mixed to protective layer by magnesium oxide (MgO) and protective layer is made by magnesium oxide (MgO) and the various situations of mixed silicon (Si) and scandium (Sc) under response time with variation of temperature.
As shown in figure 11, protective layer make by magnesium oxide (MgO) and the situation of mixed silicon (Si) under response time situation about only making by magnesium oxide (MgO) than protective layer under response time short because the emission characteristic of secondary electron is improved.Just, along with the improvement of secondary, address discharge can stably form at short notice.Therefore, though the response time also very short at low temperatures.
Further; under the situation of scandium (Sc) and silicon (Si) of in the protective layer of making by magnesium oxide (MgO), having mixed; the excursion of response time make by magnesium oxide (MgO) with protective layer and the situation of scandium (Sc) that only mix under the excursion of response time the same very narrow, and make by magnesium oxide (MgO) with protective layer and only the situation of doped silicon (Si) to compare the response time shorter.As shown in figure 11, mixed response time under the situation of silicon (Si) and scandium (Sc) of protective layer is shorter than protective layer and only mixes response time under the situation of scandium (Sc).
The curve display of Figure 12 the variation of response time with the amount of silicon (Si) in the magnesium oxide (MgO), wherein the amount of other dopant materials except silicon (Si) is constant in the temperature of protective layer and the magnesium oxide (MgO).
As shown in figure 12, the amount of the middle silicon (Si) of magnesium oxide (MgO) is preferably in 10 to 1000ppm scope, more preferably in 30 to 500ppm scope.The amount of silicon (Si) is lower than under the situation of 10ppm in magnesium oxide (MgO), the reduction effect of response time is very little, in addition, the amount of silicon (Si) is higher than under the situation of 1000ppm in magnesium oxide (MgO), the crystal structure of magnesium oxide (MgO) is damaged, and causes the deterioration of the special performance of magnesium oxide (MgO).
The curve display of Figure 13 the comparison of addressing voltage Va voltage margin in the time of 60 ℃ under the various situations of mixed in mixed in the magnesium oxide silicon (Si) and scandium (Sc) and the magnesium oxide silicon (Si), scandium (Sc) and calcium (Ca).
As shown in figure 13, the reason of doping calcium (Ca) is not the response time properties of improving under the low temperature, but improves the voltage margin characteristic of the addressing voltage (Va) under the high temperature.Just, under the situation of mixed in magnesium oxide (MgO) silicon (Si) and scandium (Sc), the voltage margin of addressing voltage (Va) is a negative value.And under the situation of in magnesium oxide, mix calcium (Ca) and silicon (Si) and scandium (Sc), voltage margin be on the occasion of.Just, mainly make and the protective layer of mixed calcium (Ca) has the voltage margin of the addressing voltage that has improved by magnesium oxide (MgO).Therefore, jitter is improved.
The curve display of Figure 14 in magnesium oxide (MgO), mix under the constant situation of the amount of scandium (Sc), silicon (Si) and calcium (Ca) and scandium (Sc) and silicon (Si) voltage margin with the variation of the amount of calcium (Ca).
As shown in figure 14, the amount of calcium (Ca) and more preferably is 500ppm preferably in 100 to 1000ppm scope in the magnesium oxide (MgO).
If the amount of calcium (Ca) is lower than 100ppm or is higher than 1000ppm in the magnesium oxide (MgO), then the voltage margin of addressing voltage do not have on the occasion of.
Make and the protective layer of mixed silicon (Si), scandium (Sc) and calcium (Ca) forms by vaccum gas phase sedimentation method by magnesium oxide (MgO).
In addition, protective layer can also pass through chemical vapor deposition (CVD) method, electronic beam method, ion plating or sputtering method formation.
Plasma display panel with above-mentioned protective layer according to the present invention is depending on that performance is splendid aspect the plate characteristic of temperature.Particularly, because the secondary efficient of protective layer is improved, so address discharge can stably form at short notice.Therefore, weak point of the response time under the low temperature and the excursion of response time are narrow.
In addition, the performance of the voltage margin of addressing voltage (Va) is splendid.
As above invention has been described, and obviously the present invention can also change in a variety of modes.Such change does not think to have departed from the spirit and scope of the present invention, and those of ordinary skill in the art's all these changes are obviously all fallen in the scope of additional claim.

Claims (15)

1. plasma display panel comprises:
Front panel;
Be formed on the described front panel protective layer and
With front panel setting spaced a predetermined distance from and with the rear board of this front panel combination,
Be doped scandium and calcium comprising magnesian protective layer, and the scope that wherein is used to the amount of the scandium that mixes is 50ppm to 2000ppm.
2. plasma display panel as claimed in claim 1, the scope that wherein is used to the amount of the scandium that mixes is 100ppm to 1000ppm.
3. plasma display panel as claimed in claim 2, the scope that wherein is used to the amount of the scandium that mixes is 300ppm to 700ppm.
4. plasma display panel as claimed in claim 1, the scope that wherein is used to the amount of the calcium that mixes is 100ppm to 1000ppm.
5. plasma display panel as claimed in claim 1, wherein said protective layer further comprises silicon.
6. plasma display panel as claimed in claim 5, wherein, the scope of the amount of the scandium that is used to mix is 100ppm to 1000ppm.
7. plasma display panel as claimed in claim 6, wherein, the scope of the amount of the scandium that is used to mix is 300ppm to 700ppm.
8. plasma display panel as claimed in claim 5, wherein, the scope of the amount of the silicon that is used to mix is 10ppm to 1000ppm.
9. plasma display panel as claimed in claim 8, wherein, the scope of the amount of the silicon that is used to mix is 30ppm to 500ppm.
10. plasma display panel as claimed in claim 5, wherein, the scope of the amount of the calcium that is used to mix is 100ppm to 1000ppm.
11. a plasma display panel comprises:
Front panel;
Be formed on the described front panel protective layer and
With front panel setting spaced a predetermined distance from and with the rear board of this front panel combination,
Be doped scandium and silicon comprising magnesian protective layer, and wherein, the scope of the amount of the scandium that is used to mix is 50ppm to 2000ppm.
12. plasma display panel as claimed in claim 11, wherein, the scope of the amount of the scandium that is used to mix (Sc) is 100ppm to 1000ppm.
13. plasma display panel as claimed in claim 12, wherein, the scope of the amount of the scandium that is used to mix is 300ppm to 700ppm.
14. plasma display panel as claimed in claim 11, wherein, the scope of the amount of the silicon that is used to mix is 10ppm to 1000ppm.
15. plasma display panel as claimed in claim 14, wherein, the scope of the amount of the silicon that is used to mix is 30ppm to 500ppm.
CNB2006100513510A 2005-01-05 2006-01-05 Plasma display panel and manufacture method thereof Expired - Fee Related CN100559541C (en)

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