CN100556239C - Be used to remove the method and apparatus of substrate solder - Google Patents
Be used to remove the method and apparatus of substrate solder Download PDFInfo
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- CN100556239C CN100556239C CNB200710101891XA CN200710101891A CN100556239C CN 100556239 C CN100556239 C CN 100556239C CN B200710101891X A CNB200710101891X A CN B200710101891XA CN 200710101891 A CN200710101891 A CN 200710101891A CN 100556239 C CN100556239 C CN 100556239C
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- scolder
- substrate
- heat medium
- treatment pond
- defectively
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Abstract
Disclosed the method and apparatus that is used for removing scolder from the substrate of welding defectively.Solder removing device (31) comprises that being used for reparation chamber (37), the substrate transporter of substrate turnover scolder treatment pond that is used to carry defectively welding and the surface of the substrate of welding defectively of immersing the heat medium in the scolder treatment pond of being used to rub of heat medium of liquid form that storing temperature is higher than the fusing point of scolder wipes brush (45) by the superheated scolder of heat medium thus.Even thereby can remove defective solders fully from high-density substrate.
Description
Technical field
The present invention relates to be used for removing the method and apparatus of scolder from the substrate of welding defectively.
Background technology
Recently the demand of high-performance semiconductor has been strengthened the development of the higher enclosed chip of the density that is used to install semiconductor chip.Be used to install solder bump all increases to some extent on fineness and density of flip-chip, cause piece to reduce to 150 microns to the distance of piece.Thereby, shown in Fig. 3 A, 3B, lack defective generation continually on substrate 11 of 17 such as cross-over connection between the solder bump 13 15 and scolder.
In the prior art, by heater 19 heating as mentioned above and the substrate 11 of welding defectively shown in Figure 4,, with the rub surface of substrates 11 of brush 21, remove scolder thus simultaneously with melting solder in the anti-oxidant atmosphere that forms by nitrogen etc.After that, carry out repair (with the state that removes solder bump and recover to print again), think that printing process is prepared again.
Because the fineness of increase, the pitch of tending to recently between the piece 13 is littler, even after by friction, scolder maintenance in thin layer is not removed, the feasible thus more difficult cross-over connection 15 that removes.
Recently developed the high density substrate that is called PALAP (forming the laminated process of prepreg of pattern) substrate.In the PALAP substrate, the surface forms pattern, and a plurality of thermoplastic resin sheet with the metal cream of filling via the hole be stacked on go up each other and all simultaneously pressing mold with connection and combination simultaneously.Each pad on the superficial layer of PALAP substrate is very little, makes that being additionally formed resin bed on the outer peripheral edge of pad comes off to prevent pad.Each pad 23 is positioned on the lower surface of the depression 25 that is centered on by resin bed, and corresponding solder bump 13 is installed on the pad 23.
Therefore, the PALAP substrate has many irregular portion and scolder is difficult to remove on working surface.And in case solder fusing, scolder can flow into depression.Thereby above-mentioned traditional method causes the problem that can not remove scolder fully.
The scolder absorber that can be used as the solution that is used to remove scolder has ensuing problem.Particularly, the pad that is formed by Copper Foil has priming coat to improve and the combining of solder bump.If use the scolder in the scolder absorber absorption dip, it also absorbs priming coat, make thus can not be after repairing printed substrate again.
Summary of the invention
Purpose of the present invention is the method and apparatus that solves foregoing problems and be provided for removing fully from the high density substrate defective solders.
In order to realize this purpose, according to an aspect of the present invention, the method that is used for removing from the substrate (S) of welding defectively by melting solder scolder is provided, may further comprise the steps: the substrate that will weld defectively (S) immerses the heat medium (L) of the liquid form of the fusing point that temperature is higher than scolder, and with brush (45) the friction surface of the substrate (S) of welding defectively, to wipe defective solders.This method also is included in before the described immersion step and after described friction step, substrate (S) is transmitted by cooling chamber (41), this cooling chamber (41) is arranged on heat medium (L) top that is stored in the scolder treatment pond (33) and forms continuously with scolder treatment pond (33), and the steam that is used to cool off heat medium (L) cools off the scolder that is retained on the substrate surface simultaneously in anti-oxidant atmosphere.According to another aspect of the present invention, provide and be used for removing equipment from the substrate solder that the substrate (S) that welds defectively removes scolder by melting solder, comprise: be used for the scolder treatment pond (33) of heat medium (L) of liquid form that storing temperature is higher than the fusing point of scolder, be used to transmit the substrate transporter of substrate (S) the turnover scolder treatment pond (33) of welding defectively, being used for friction immerses the surface of the substrate (S) of welding defectively of the heat medium (L) in the scolder treatment pond (33) and wipes the brush (45) of the scolder by heat medium (L) fusing thus and be arranged on heat medium (L) top that is stored in the scolder treatment pond (33) and form continuously with scolder treatment pond (33), the steam that is used to cool off heat medium (L) simultaneously in anti-oxidant atmosphere cooling be retained in the cooling chamber (41) of the scolder on the substrate surface.
In said method and equipment, be printed on scolder on the substrate surface with many irregular portion even can remove definitely with tiny pitch.Consider that substrate immerses the fact of liquid, realize that on whole substrate even temperature distributes, thereby reduced temperature stress.In addition, prevent from liquid, to be heated and the scolder that melts solidifies in the position of leaving the substrate certain distance, make thus to remove scolder smoothly.And the surface coverage that scolder is removed from it has heat medium, and therefore, prevents that scolder is melted and deposition once more.In addition, the heating by heat medium removes scolder with the state of fusing, and therefore, can remove scolder by stirring with the brush that is applied to substrate lightly, minimizes thus and is applied to on-chip mechanical stress.
According to a further aspect of the invention, the substrate solder that provides removes method and also comprises by being arranged on the step that scolder returnable (49) below the substrate reclaims the scolder of wiping with brush (45), wherein, be recovered in the scolder that the following substrate from welding defectively of scolder treatment pond (33) is wiped by scolder returnable (49).Therefore, can reclaim and collect scolder from the substrate tiny fusing of wiping of welding defectively little by little to assemble subsequently.
According to a further aspect of the invention, provide substrate solder to remove equipment, wherein, scolder treatment pond (33) comprises setting heater (39) in its lower section.Thereby, can easily add the heat medium (L) in the hot solder treatment pond (33), and can remove scolder effectively.
According to a further aspect of the invention, provide substrate solder to remove equipment, wherein cooling chamber (41) has cooling device (43) on its outer peripheral edge.Thus, cool off the steam of heat medium (L) on the one hand, and in anti-oxidant atmosphere, cool off the scolder that is retained on the substrate surface on the other hand.Thereby, can heat the substrate in the equipment of being delivered in advance, and can alleviate on-chip thermal shock.
The example of the specific device that comprises in the corresponding embodiment that describes below of reference number indication in the bracket of each title back of said apparatus.
By understanding the present invention more all sidedly to the description of preferred embodiment of the present invention below in conjunction with accompanying drawing.
Description of drawings
Fig. 1 schematically shows the sectional view of solder removing device according to an embodiment of the invention.
Fig. 2 is the enlarged drawing by the part of reference character A indication among Fig. 1.
Fig. 3 A is that vertical view and Fig. 3 B of the substrate of welding defectively is its front view.
Fig. 4 shows the figure that traditional scolder removes method.
Embodiment
Below with reference to Fig. 1 and 2 embodiments of the invention are described.
Fig. 1 shows according to an embodiment of the invention, and substrate solder removes equipment 31.This substrate solder removes equipment 31 and comprises columniform scolder treatment pond 33, is provided with the lid 35 that is used to close scolder treatment pond 33 above it.
The cooling chamber 41 that is used to hold from the steam G of heat medium L is formed in the first half 33b of scolder treatment pond 33.The heat exchanger 43 that is used for circulating coolant is arranged on the outer peripheral edge of the first half 33b.Thereby cool off, condense and reclaim the steam G of the heat medium of cooling chamber 37.
The substrate S that solder removing device 31 also is included in defectively welding is used for surface by friction substrate S with brush 45 that removes scolder from substrate S and the brush retainer 47 that is used to keep brush 45 when being positioned at the P3 place, position of repairing in the chamber 37.In addition, equipment 31 comprises and being used for respect to the substrate surface brush-driven unit (not shown) of motion brush 45 longitudinally and laterally.Brush 45 is for repairing brush with the scolder in the control depression by the felted of solidifying 8 microns stainless steel metal fibre NASLON (NipponSeisen Co., the registered trade mark of Ltd) formation.This brush can be followed the irregular portion of substrate surface and can be removed tiny scolder.Heat fused by heat medium L and wipe by the substrate transporter with brush 45 and to be sent to scolder on the substrate S that repairs chamber 37.
The outer peripheral edge of scolder treatment pond 33 and heater 39 is coated with heat-insulating material 51.Like this, preventing that heat leakage is controlled at the temperature that each position is set in the scolder treatment pond 33 to outside with when improving energy efficiency.
Next explanation uses the solder removing device 31 with previous constructions to remove the method for scolder from the PALAP substrate S of welding defectively.
At first, substrate S is remained on (not shown) on the substrate transporter, substrate S is moved to position P2 and is sent in the cooling chamber 41 of scolder treatment pond 33 from position P1.
The cooling chamber 41 of low boiling point component that is filled with the heat medium of evaporation remains on 150 degrees centigrade to 200 degrees centigrade, makes the heat medium composition of evaporation by cools down and recirculation.The substrate S that is sent in the cooling chamber 41 is heated to the fusing point of about scolder in advance to alleviate thermal shock.
Next, substrate S is moved to the position P3 that repairs in the chamber 37 and immerses heat medium L from the position P2 in the cooling chamber 41.Heat medium L is heated to 250 degrees centigrade of the fusing points of scolder for example, makes on-chip solder fusing.
The scolder that is present in the such fusing in the heat medium of liquid form tends to because the surface tension of scolder and heat medium L is separated into tiny particle in heat medium L, and therefore can relatively easily remove from substrate.Prevent that the scolder that is separated into tiny particle in heat medium L from condensing once more.
Next, as shown in Figure 2, with the surface of the substrate S that rub by the felted brush 45 that solidifies thin stainless steel fibre formation.In this process, not the motion brush on the fixing substrate that leans against as in this embodiment, substrate can alternatively move and stationary brush 45.Thereby the scolder in the irregular portion of substrate and the depression is separated into tiny particle and can easily removes.Especially, the PALAP substrate S for forming the pad Sc with the Copper Foil on the lower surface that from the substrate surface Sa degree of depth is about 50 microns depression Sb by using thin brush 45, can remove scolder in detailed subtly mode.In this process, must be noted that not remove the priming coat that is applied on the bond pad surface, so that guarantee combination between Copper Foil and the piece scolder.Scolder is removed to the piece scolder usually can be from the outstanding degree of substrate surface.
Proportion falls and is accommodated in the setting scolder receiver 49 in its lower section greater than the scolder 61 that removes from substrate S like this of heat medium.The tiny particle of the dispersion of scolder is collected in the position that can condense gradually at the tiny particle of the dispersion of scolder.Thereby, promote to reclaim scolder.
Next, with longitudinally and laterally the rub surperficial predetermined number of times of substrate S of brush 45, by substrate transporter (not shown) substrate S is moved upwards up to position P2 in the cooling chamber 37 then.In cooling chamber 37, solidify scolder in the bond pad surface layer, and subsequently, substrate S is taken out to finish repair in cooling chamber 37 with level and smooth state.
As mentioned above, the solder removing device 31 of using scolder according to this embodiment to remove method comprises that being used for scolder treatment pond 33, the substrate transporter of substrate S turnover scolder treatment pond 33 that is used to carry welding defectively and the surface of the substrate S of welding defectively of immersing the heat medium L in the scolder treatment pond 33 of being used to rub of heat medium L of liquid condition that storing temperature is higher than the fusing point of scolder wipes brush 45 by the superheated scolder of heat medium L thus.Thereby, be printed on solder bump on the substrate surface with irregular portion even can remove definitely with thin pitch.Because substrate S immerses liquid, guarantee that whole on-chip even temperature distributes.Different with the situation of heated substrate partly, alleviated and be applied to on-chip temperature stress.In addition, consider the fact that heating and fusion process are carried out in liquid, the scolder that leaves substrate can not cool off and keep fusing.Thereby, prevent solder solidification and can remove scolder smoothly.The surface coverage that scolder is removed from it has heat medium, and therefore, prevents that scolder from depositing once more.In addition, can stir by the brush that is applied to substrate lightly and remove the scolder that is in the state of fusing by the heating of heat medium, and therefore, minimize the mechanical stress on the substrate surface.
Usually, scolder is oxidized to oxide and can not melts in oxidizing atmosphere.Yet, in solder removing device according to the present invention and method, by heat fused scolder in the heat medium in being positioned at anti-oxidant atmosphere.Thereby scolder can be not oxidized, but remain on the form of fusing.Thereby expensive scolder can easily condense and reclaim.Because in anti-oxidant atmosphere, remove scolder, do not need to be provided for to supply inert gas such as nitrogen so that prevent the supplementary instrument of pad Copper Foil oxidation after scolder removes, reduce cost thus.
In addition, the steam of heat medium forms continuously with scolder treatment pond 33 above remaining on 150 degrees centigrade to 200 degrees centigrade the heat medium of cooling chamber 37 in being stored in scolder treatment pond 33 therein.Therefore, can heat the substrate that is transported in the cooling chamber 37 in advance, and alleviate and be applied to on-chip thermal shock.
Be formed in the scolder treatment pond 33 because be used to store the reparation chamber 37 and the cooling chamber 41 of heat medium, this equipment can be constructed with compact structure.
Though the foregoing description uses the example of PALAP as the substrate of handling, and the invention is not restricted to PALAP, but is applicable to the substrate of any kind with equal effect.
Though described the present invention, should be understood that those skilled in the art can make many modifications to it under the situation that does not depart from basic conception of the present invention and scope with reference to the certain embodiments of selecting for illustrative purpose.
Claims (6)
1. one kind removes the method for scolder by melting solder from the substrate (S) of welding defectively, and it may further comprise the steps:
The substrate (S) of welding is defectively immersed the heat medium (L) of the liquid form of the fusing point that temperature is higher than scolder;
With brush (45) the friction surface of the substrate (S) of welding defectively, wipe defective solders thus; And
Before the described immersion step and after described friction step, substrate (S) is transmitted by cooling chamber (41), this cooling chamber (41) is arranged on heat medium (L) top that is stored in the scolder treatment pond (33) and forms continuously with scolder treatment pond (33), and the steam that is used to cool off heat medium (L) cools off the scolder that is retained on the substrate surface simultaneously in anti-oxidant atmosphere.
2. the method that removes scolder according to claim 1, further comprising the steps of:
Receive the scolder of wiping with brush (45) in the scolder receiver (49) below being arranged on substrate.
3. one kind is used for removing the equipment of scolder by melting solder from the substrate (S) of welding defectively, and it comprises:
Be used for the scolder treatment pond (33) of heat medium (L) of liquid form that storing temperature is higher than the fusing point of scolder;
Be used to carry the substrate transporter of substrate (S) the turnover scolder treatment pond (33) of welding defectively;
Being used for friction immerses the surface of the substrate (S) of welding defectively of the heat medium (L) in the scolder treatment pond (33) and wipes brush (45) by the scolder of heat medium (L) heating and fusing thus; And
The steam that is arranged on heat medium (L) top that is stored in the scolder treatment pond (33) and forms continuously with scolder treatment pond (33), be used to cool off heat medium (L) cools off the cooling chamber (41) that is retained in the scolder on the substrate surface simultaneously in anti-oxidant atmosphere.
4. the equipment that is used to remove scolder according to claim 3,
Wherein, scolder treatment pond (33) comprises heater (39) in its underpart.
5. the equipment that is used to remove scolder according to claim 3 also comprises:
Be arranged on the scolder receiver (49) that being used in the bottom of scolder treatment pond (33) receives the scolder of wiping from the substrate of welding defectively.
6. the equipment that is used to remove scolder according to claim 3,
Wherein, cooling chamber (41) comprises the cooling device (43) that is arranged on its outer peripheral edge.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006120265A JP4839947B2 (en) | 2006-04-25 | 2006-04-25 | Board desoldering equipment |
| JP2006120265 | 2006-04-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101064995A CN101064995A (en) | 2007-10-31 |
| CN100556239C true CN100556239C (en) | 2009-10-28 |
Family
ID=38764973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB200710101891XA Expired - Fee Related CN100556239C (en) | 2006-04-25 | 2007-04-25 | Be used to remove the method and apparatus of substrate solder |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4839947B2 (en) |
| CN (1) | CN100556239C (en) |
| TW (1) | TWI341148B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101332748B1 (en) * | 2012-10-22 | 2013-11-25 | 김규영 | Electronic component mounting and mounting state inspecting inline system and method using the same |
| US10362720B2 (en) | 2014-08-06 | 2019-07-23 | Greene Lyon Group, Inc. | Rotational removal of electronic chips and other components from printed wire boards using liquid heat media |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04270064A (en) * | 1991-02-20 | 1992-09-25 | Fujitsu Ltd | Soldering apparatus |
| JP3444557B2 (en) * | 1994-06-15 | 2003-09-08 | 千住金属工業株式会社 | Method and apparatus for collecting solder |
| JP3460480B2 (en) * | 1996-11-29 | 2003-10-27 | 松下電器産業株式会社 | Apparatus and method for separating electronic components and solder from printed circuit board |
| JP4116184B2 (en) * | 1999-04-21 | 2008-07-09 | 三菱電機株式会社 | Electronic board member recovery apparatus and electronic board member recovery method |
| JP3799200B2 (en) * | 1999-09-22 | 2006-07-19 | キヤノン株式会社 | Solder recovery method and solder recovery device |
-
2006
- 2006-04-25 JP JP2006120265A patent/JP4839947B2/en not_active Expired - Fee Related
-
2007
- 2007-04-13 TW TW096113119A patent/TWI341148B/en not_active IP Right Cessation
- 2007-04-25 CN CNB200710101891XA patent/CN100556239C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| TW200806122A (en) | 2008-01-16 |
| CN101064995A (en) | 2007-10-31 |
| JP4839947B2 (en) | 2011-12-21 |
| JP2007294648A (en) | 2007-11-08 |
| TWI341148B (en) | 2011-04-21 |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
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Granted publication date: 20091028 Termination date: 20180425 |