TWI341148B - Method and apparatus for removing substrate solder - Google Patents

Method and apparatus for removing substrate solder

Info

Publication number
TWI341148B
TWI341148B TW096113119A TW96113119A TWI341148B TW I341148 B TWI341148 B TW I341148B TW 096113119 A TW096113119 A TW 096113119A TW 96113119 A TW96113119 A TW 96113119A TW I341148 B TWI341148 B TW I341148B
Authority
TW
Taiwan
Prior art keywords
removing substrate
substrate solder
solder
substrate
Prior art date
Application number
TW096113119A
Other languages
Chinese (zh)
Other versions
TW200806122A (en
Inventor
Norio Gouko
Toshihisa Taniguchi
Atsushi Sakaida
Kyoichi Takeda
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Publication of TW200806122A publication Critical patent/TW200806122A/en
Application granted granted Critical
Publication of TWI341148B publication Critical patent/TWI341148B/en

Links

TW096113119A 2006-04-25 2007-04-13 Method and apparatus for removing substrate solder TWI341148B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006120265A JP4839947B2 (en) 2006-04-25 2006-04-25 Board desoldering equipment

Publications (2)

Publication Number Publication Date
TW200806122A TW200806122A (en) 2008-01-16
TWI341148B true TWI341148B (en) 2011-04-21

Family

ID=38764973

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096113119A TWI341148B (en) 2006-04-25 2007-04-13 Method and apparatus for removing substrate solder

Country Status (3)

Country Link
JP (1) JP4839947B2 (en)
CN (1) CN100556239C (en)
TW (1) TWI341148B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101332748B1 (en) * 2012-10-22 2013-11-25 김규영 Electronic component mounting and mounting state inspecting inline system and method using the same
US10362720B2 (en) 2014-08-06 2019-07-23 Greene Lyon Group, Inc. Rotational removal of electronic chips and other components from printed wire boards using liquid heat media

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04270064A (en) * 1991-02-20 1992-09-25 Fujitsu Ltd Soldering apparatus
JP3444557B2 (en) * 1994-06-15 2003-09-08 千住金属工業株式会社 Method and apparatus for collecting solder
JP3460480B2 (en) * 1996-11-29 2003-10-27 松下電器産業株式会社 Apparatus and method for separating electronic components and solder from printed circuit board
JP4116184B2 (en) * 1999-04-21 2008-07-09 三菱電機株式会社 Electronic board member recovery apparatus and electronic board member recovery method
JP3799200B2 (en) * 1999-09-22 2006-07-19 キヤノン株式会社 Solder recovery method and solder recovery device

Also Published As

Publication number Publication date
CN101064995A (en) 2007-10-31
CN100556239C (en) 2009-10-28
JP2007294648A (en) 2007-11-08
TW200806122A (en) 2008-01-16
JP4839947B2 (en) 2011-12-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees