TWI341148B - Method and apparatus for removing substrate solder - Google Patents
Method and apparatus for removing substrate solderInfo
- Publication number
- TWI341148B TWI341148B TW096113119A TW96113119A TWI341148B TW I341148 B TWI341148 B TW I341148B TW 096113119 A TW096113119 A TW 096113119A TW 96113119 A TW96113119 A TW 96113119A TW I341148 B TWI341148 B TW I341148B
- Authority
- TW
- Taiwan
- Prior art keywords
- removing substrate
- substrate solder
- solder
- substrate
- Prior art date
Links
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006120265A JP4839947B2 (en) | 2006-04-25 | 2006-04-25 | Board desoldering equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200806122A TW200806122A (en) | 2008-01-16 |
TWI341148B true TWI341148B (en) | 2011-04-21 |
Family
ID=38764973
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096113119A TWI341148B (en) | 2006-04-25 | 2007-04-13 | Method and apparatus for removing substrate solder |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4839947B2 (en) |
CN (1) | CN100556239C (en) |
TW (1) | TWI341148B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101332748B1 (en) * | 2012-10-22 | 2013-11-25 | 김규영 | Electronic component mounting and mounting state inspecting inline system and method using the same |
US10362720B2 (en) | 2014-08-06 | 2019-07-23 | Greene Lyon Group, Inc. | Rotational removal of electronic chips and other components from printed wire boards using liquid heat media |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04270064A (en) * | 1991-02-20 | 1992-09-25 | Fujitsu Ltd | Soldering apparatus |
JP3444557B2 (en) * | 1994-06-15 | 2003-09-08 | 千住金属工業株式会社 | Method and apparatus for collecting solder |
JP3460480B2 (en) * | 1996-11-29 | 2003-10-27 | 松下電器産業株式会社 | Apparatus and method for separating electronic components and solder from printed circuit board |
JP4116184B2 (en) * | 1999-04-21 | 2008-07-09 | 三菱電機株式会社 | Electronic board member recovery apparatus and electronic board member recovery method |
JP3799200B2 (en) * | 1999-09-22 | 2006-07-19 | キヤノン株式会社 | Solder recovery method and solder recovery device |
-
2006
- 2006-04-25 JP JP2006120265A patent/JP4839947B2/en not_active Expired - Fee Related
-
2007
- 2007-04-13 TW TW096113119A patent/TWI341148B/en not_active IP Right Cessation
- 2007-04-25 CN CNB200710101891XA patent/CN100556239C/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN101064995A (en) | 2007-10-31 |
CN100556239C (en) | 2009-10-28 |
JP2007294648A (en) | 2007-11-08 |
TW200806122A (en) | 2008-01-16 |
JP4839947B2 (en) | 2011-12-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2220670A4 (en) | Method and apparatus for removing contaminants from substrate | |
TWI370508B (en) | Substrate processing apparatus and substrate processing method | |
EP1995771A4 (en) | Substrate processing apparatus and substrate processing method | |
TWI348189B (en) | Substrate treatment apparatus and substrate treatment method | |
TWI367538B (en) | Substrate processing apparatus and substrate processing method | |
TWI347650B (en) | Substrate processing apparatus and substrate transferring method | |
TWI317807B (en) | Positioning apparatus and method | |
TWI340997B (en) | Substrate treatment apparatus and substrate treatment method | |
EP2012569A4 (en) | Method for mounting solder ball and apparatus for mounting solder ball | |
EP2043759A4 (en) | Method and apparatus for enhanced mercury removal | |
EP2080219A4 (en) | Chip pickup method and chip pickup apparatus | |
GB0724107D0 (en) | Moisture removal apparatus and method | |
EP2030229A4 (en) | Apparatus and method for semiconductor bonding | |
EP1898453A4 (en) | Substrate processing method and substrate processing apparatus | |
EP2127062A4 (en) | Versatile apparatus and method for electronic devices | |
EP1936671A4 (en) | Substrate processing apparatus and substrate processing method | |
EP1994671A4 (en) | A method and apparatus for a token | |
EP2143046A4 (en) | Electronic interface apparatus and method and system for manufacturing same | |
TWI370503B (en) | Apparatus and method for treating substrate | |
EP1909313A4 (en) | Substrate processing apparatus and substrate processing method | |
GB0820346D0 (en) | Method and apparatus for laser processing | |
TWI371638B (en) | Electro-optical device, method for manufacturing electro-optical device, and electronic apparatus | |
GB2453892B (en) | Method and apparatus for clamping a substrate | |
TWI368071B (en) | Apparatus and method for attaching substrates | |
EP2092454A4 (en) | Method and apparatus for geomodel uplayering |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |