CN100554506C - Film that semiconductor processes is used and device - Google Patents
Film that semiconductor processes is used and device Download PDFInfo
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- CN100554506C CN100554506C CNB2006100569821A CN200610056982A CN100554506C CN 100554506 C CN100554506 C CN 100554506C CN B2006100569821 A CNB2006100569821 A CN B2006100569821A CN 200610056982 A CN200610056982 A CN 200610056982A CN 100554506 C CN100554506 C CN 100554506C
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Abstract
The present invention comprises first of silane-based gas and handles gas, comprises second of nitride gas or oxides of nitrogen gas and handle gas and the 3rd handling in the treatment zone of gas of comprising appropriate hydrocarbon gas selectively supplying with, and is formed insulating film on processed substrate by CVD.This film has first operation, second operation, the 3rd operation and the 4th operation alternately.Wherein said first operation is supplied with the first and the 3rd to described treatment zone and is handled gas, on the other hand described treatment zone is stopped the supply of the described second processing gas; Described second operation stop to described treatment zone first, second, and the 3rd supply of handling gas; Described the 3rd operation is supplied with second to described treatment zone and is handled gas, on the other hand described treatment zone is stopped the supply of the described first and the 3rd processing gas; Described the 4th operation stop to described treatment zone first, second, and the 3rd supply of handling gas.
Description
The cross reference of related application
The application is based on following Japanese patent application and require its right of priority, and the full content of described two Japanese publication is embodied in this.
Application number: 2005-066340; The applying date: on March 9th, 2005
Application number: 2006-004191; The applying date: on January 11st, 2006
Technical field
The present invention relates to form formation method and the device of the semiconductor processes of insulating film with film on processed substrates such as semiconductor wafer.Here, so-called semiconductor processes, be meant by forming semiconductor layer, insulation layer, conductive layer etc., all processing of implementing in order to make works such as comprising semiconductor devices, the distribution that is connected with semiconductor devices, electrode according to set pattern on the processed substrates such as glass substrate that use at wafer, LCD (Liquid Crystal Display) and FPD (Fla Panel Display).
Background technology
In the manufacturing of the semiconductor devices that constitutes semiconductor integrated circuit,, for example on semiconductor wafer, implement the various processing such as removal of film forming, etching, oxidation, diffusion, modification, annealing, natural oxide film at processed substrate.Japanese kokai publication hei 6-34974 communique has provided this semiconductor processing in longitudinal type (the being so-called sheet type) thermal treatment unit.In this invention, at first, semiconductor wafer moves to from wafer case on the wafer boat of longitudinal type, and multistage supports.For example can receive and keep 25 pieces of wafers in the wafer case, can load 30～150 pieces of wafers on the wafer boat.Then, wafer boat its inside of packing into from the below of processing vessel, processing vessel is sealed airtightly simultaneously.Then, under the state of various treatment condition such as the flow of controlling processing gas, processing pressure, treatment temp, carry out set thermal treatment.
In order to improve the characteristic of semiconductor integrated circuit, the characteristic that then improves the insulating film of semiconductor devices is very important.As the insulating film of semiconductor devices, can use SiO
2, PSG (Phospho Silicate Glass), P (generating)-SiO, P (generating)-SiN, SOG (Spin on Glass), Si by plasma activated chemical vapour deposition by plasma activated chemical vapour deposition
3N
4(silicon nitride) etc.Silicon nitride film particularly, its insulation characterisitic ratio silicon oxide film is good, and also has enough effects as etching stop film and interlayer dielectric, so the tendency of frequent use is arranged.And, owing to same reason, also use the carbon nitride films of doped with boron sometimes.
As the method that forms above-mentioned silicon nitride film on the surface of semiconductor wafer, known have a use silicomethane (SiH
4), dichlorosilane (DCS:SiH
2Cl
2), disilicone hexachloride (HCD:Si
2Cl
6), di-t-butyl aminosilane (BTBAS; SiH
2(NH (C
4H
9))
2Etc. silane-based gas as silicon source gas, by the film forming method of thermal chemical vapor deposition (CVD).For example by SiH
2Cl
2+ NH
3(with reference to Japanese kokai publication hei 6-34974 communique) or Si
2Cl
6+ NH
3Combination forms silicon nitride film by thermal chemical vapor deposition method.And, in order to reduce specific inductivity, also proposed in silicon nitride film, to add the motion (with reference to Japanese kokai publication hei 2-93071 communique) of boron as impurity.
In recent years, be accompanied by the higher integrated and high miniaturization of semiconductor integrated circuit, hope can alleviate the thermal history in the manufacturing processed of semiconductor devices, improves the characteristic of equipment.Even in the treatment unit of longitudinal type, also wish as requested semiconductor processing to be improved.For example, in the CVD (chemical vapour deposition) that a kind of film forming is handled, base feed gas is off and on arranged, and every simultaneously one or more layers ground repeats the method (for example with reference to Japanese kokai publication hei 6-45256 communique, Japanese kokai publication hei 11-87341 communique) of the floor of film forming atom or molecule level thickness.Such film is commonly referred to as ALD (ald), thus, even be not placed on high temperature, also can make to handle to reach the appointment requirement.
For example, using dichlorosilane (DCS) and ammonia (NH as nitriding gas
3) and form under the situation of silicon nitride film (SiN), carry out following processing.In other words, during purifying (removing), clamping in processing vessel, supplies with DCS and NH alternately off and on
3Supply with NH
3Apply high frequency (RF) during gas, in processing vessel, generate plasma body thus, promote nitrogenizing reaction.Here, at first by in processing vessel, supplying with DCS, make wafer surface adsorb the DCS of one or more layers molecule level.Unnecessary DCS gas is discharged during purifying.Then, by supplying with NH
3Gas and generate plasma body generates silicon nitride film by cryogenic nitrogenizing reaction.Repeat so a series of technology, finish the film of set thickness.
Yet, after forming above-mentioned insulating film, forming again thereon under the situation of other film, there is the possibility of pollutents such as sticking organism and particulate on the surface of above-mentioned insulating film.Therefore, must carry out as required to remove the clean that this pollutent is a purpose.In this case, be semiconductor wafer to be immersed in the scavenging solutions such as diluted hydrofluoric acid, the surface of wafer is cleaned.Thus, the surface of insulating film deducts extremely thin one deck, with pollutant removal.
For example formed by CVD under the high temperature about 760 ℃ under the situation of above-mentioned insulating film, when insulating film cleaned, it is very little that etching speed becomes.Therefore, can be when etching this insulating film of attenuate exceedingly not, can under the state of controlling thickness well, clean.But, form at the bottom layer under the situation of the low film of thermotolerance, can not adopt the pyritous hot CVD to handle.
In contrast to this, for example formed by ALD under the low temperature about 400 ℃ under the situation of above-mentioned insulating film, when insulating film cleaned, it is bigger that etching speed becomes.Therefore, the situation of this insulating film of attenuate is exceedingly just arranged when etching, the controlled variation of the thickness of insulating film during cleaning.
And, the situation of silicon nitride film as above-mentioned etching stop film and interlayer dielectric of using also arranged.In this case, need the etching speed of silicon nitride film fully little, but in film always, can not satisfy this requirement fully.
Summary of the invention
The present invention proposes in view of the above problems, even its purpose is to provide formation film forming under lower temperature, etching speed in the time of also can making etching diminishes, the thickness of film is controlled when improve cleaning, and has fully method and the device of using as the semiconductor processes of the insulating film of the function of etching stop film and interlayer dielectric.Also have, the present invention is the improvement invention of the disclosed invention of TOHKEMY 2003-282566 (on October 3rd, 2003).
First focus of the present invention is the film that a kind of semiconductor processes is used, be comprise first of silane-based gas and handle gas, comprise second of nitriding gas or nitrogen oxidizing gas and handle gas, comprise the 3rd of hydrocarbonize gas and handle in the treatment zone of gas selectively supplying with, on processed substrate, form the film that the semiconductor processes of insulating film is used, have first operation, second operation, the 3rd operation and the 4th operation alternately by CVD (chemical vapour deposition).Wherein said first operation is supplied with the first and the 3rd to described treatment zone and is handled gas, on the other hand described treatment zone is stopped the supply of the described second processing gas; Described second operation stop to described treatment zone first, second, and the 3rd supply of handling gas; Described the 3rd operation is supplied with second to described treatment zone and is handled gas, on the other hand described treatment zone is stopped the supply of the described first and the 3rd processing gas; Described the 4th operation stop to described treatment zone first, second, and the 3rd supply of handling gas.
Second focus of the present invention is the film that a kind of semiconductor processes is used, be comprise first of hydrocarbonize gas and handle gas, comprise second of nitriding gas or nitrogen oxidizing gas and handle gas, comprise the 3rd of boron-containing gas and handle in the treatment zone of gas selectively supplying with, on processed substrate, form the film that the semiconductor processes of insulating film is used, have first operation, second operation, the 3rd operation and the 4th operation alternately by CVD (chemical vapour deposition).Wherein said first operation is supplied with the first and the 3rd to described treatment zone and is handled gas, on the other hand described treatment zone is stopped the supply of the described second processing gas; Described second operation stop to described treatment zone first, second, and the 3rd supply of handling gas; Described the 3rd operation is supplied with second to described treatment zone and is handled gas, on the other hand described treatment zone is stopped the supply of the described first and the 3rd processing gas; Described the 4th operation stop to described treatment zone first, second, and the 3rd supply of handling gas.
The 3rd focus of the present invention is the film deposition system that a kind of semiconductor processes is used, and is provided with, and has the processing vessel of the treatment zone of the processed substrate of harvesting; In described treatment zone, support the support component of described processed substrate; Heat the well heater of the described processed substrate in the described treatment zone; To deflated exhaust system in the described treatment zone; In described treatment zone, supply with first of siliceous methane series gas and handle first treating-gas supply system of gas; In described treatment zone, supply with second of nitrogen gas or nitrogen oxidizing gas and handle second treating-gas supply system of gas; In described treatment zone, supply with the 3rd of carbon containing hydrogenated gas and handle the 3rd treating-gas supply system of gas; And the control part of controlling the action of described device.Described control part forms insulating film by CVD on described processed film, therefore mutual first operation, second operation, the 3rd operation and the 4th operation carried out.Wherein said first operation is supplied with the first and the 3rd to described treatment zone and is handled gas, on the other hand described treatment zone is stopped the supply of the described second processing gas; Described second operation stop to described treatment zone first, second, and the 3rd supply of handling gas; Described the 3rd operation is supplied with second to described treatment zone and is handled gas, on the other hand described treatment zone is stopped the supply of the described first and the 3rd processing gas; Described the 4th operation stop to described treatment zone first, second, and the 3rd supply of handling gas.
The 4th focus of the present invention is the film deposition system that a kind of semiconductor processes is used, and is provided with, and has the processing vessel of the treatment zone of the processed substrate of harvesting; In described treatment zone, support the support component of described processed substrate; Heat the well heater of the described processed substrate in the described treatment zone; To deflated exhaust system in the described treatment zone; In described treatment zone, supply with first of carbon containing hydrogenated gas and handle first treating-gas supply system of gas; In described treatment zone, supply with second of nitrogen gas or nitrogen oxidizing gas and handle second treating-gas supply system of gas; In described treatment zone, supply with and contain the 3rd treating-gas supply system that the 3rd of boron-containing gas is handled gas; And the control part of controlling the action of described device.Described control part forms insulating film by CVD on described processed film, the old friend carries out first operation, second operation, the 3rd operation and the 4th operation mutually.Wherein said first operation is supplied with the first and the 3rd to described treatment zone and is handled gas, on the other hand described treatment zone is stopped the supply of the described second processing gas; Described second operation stop to described treatment zone first, second, and the 3rd supply of handling gas; Described the 3rd operation is supplied with second to described treatment zone and is handled gas, on the other hand described treatment zone is stopped the supply of the described first and the 3rd processing gas; Described the 4th operation stop to described treatment zone first, second, and the 3rd supply of handling gas.
The 5th focus of the present invention is to be used for the programmed instruction carried out at treater a kind of comprising, the medium that can read by computer, when described programmed instruction is carried out by treater, selectively supplying with the first processing gas that comprises silane-based gas, comprise second of nitriding gas or nitrogen oxidizing gas and handle gas, comprising the 3rd of hydrocarbonize gas handles in the treatment zone of gas, on processed substrate, form in the film deposition system that the semiconductor processes of insulating film uses, carry out first operation alternately by CVD (chemical vapour deposition), second operation, the 3rd operation and the 4th operation.Wherein said first operation is supplied with the first and the 3rd to described treatment zone and is handled gas, on the other hand described treatment zone is stopped the supply of the described second processing gas; Described second operation stop to described treatment zone first, second, and the 3rd supply of handling gas; Described the 3rd operation is supplied with second to described treatment zone and is handled gas, on the other hand described treatment zone is stopped the supply of the described first and the 3rd processing gas; Described the 4th operation stop to described treatment zone first, second, and the 3rd supply of handling gas.
The 6th focus of the present invention is to be used for the programmed instruction carried out at treater a kind of comprising, the medium that can read by computer, when described programmed instruction is carried out by treater, selectively supplying with the first processing gas that comprises hydrocarbonize gas, comprise the second processing gas of nitriding gas or nitrogen oxidizing gas and comprise the 3rd of boron-containing gas and handle in the treatment zone of gas, on processed substrate, form in the film deposition system that the semiconductor processes of insulating film uses, carry out first operation alternately by CVD (chemical vapour deposition), second operation, the 3rd operation and the 4th operation.Wherein said first operation is supplied with the first and the 3rd to described treatment zone and is handled gas, on the other hand described treatment zone is stopped the supply of the described second processing gas; Described second operation stop to described treatment zone first, second, and the 3rd supply of handling gas; Described the 3rd operation is supplied with second to described treatment zone and is handled gas, on the other hand described treatment zone is stopped the supply of the described first and the 3rd processing gas; Described the 4th operation stop to described treatment zone first, second, and the 3rd supply of handling gas.
Other purpose and advantage of the present invention will be described further in the following description, and wherein a part can be better understood from describe.By the explanation below in conjunction with the embodiment of accompanying drawing, other purpose and advantage of the present invention can access better understanding and understanding.
Description of drawings
Below be for the accompanying drawing of embodiment is described.By the explanation of the following drawings and embodiment in conjunction with the accompanying drawings, can access and understand the present invention better.
Fig. 1 is the sectional view of film deposition system (CVD device) in the expression embodiment of the present invention.
Fig. 2 is the transversal plane figure of the part of presentation graphs 1 shown device.
Fig. 3 is the time diagram that the pattern of high frequency (RF) was supplied with and applied to gas in the film of expression first embodiment.
Fig. 4 is the time diagram that the pattern of high frequency (RF) was supplied with and applied to gas in the film of expression second embodiment.
Fig. 5 is the time diagram that the pattern of high frequency (RF) was supplied with and applied to gas in the film of expression the 3rd embodiment.
Fig. 6 is the time diagram that the pattern of high frequency (RF) was supplied with and applied to gas in the film of expression the 4th embodiment.
Fig. 7 is the sectional view of expression according to an example of the rhythmo structure of the film of the 4th embodiment formation.
Fig. 8 is the chart as a result that respectively etching speed of three embodiment PE1, PE2, PE3 film is judged in expression first to the 3rd embodiment.
Fig. 9 is the general block diagram of expression master control part.
Embodiment
Describe embodiments of the present invention with reference to the accompanying drawings in detail.Also have, for the integrant with cardinal principle identical function and formation, all give same symbol, its repeat specification is only carried out in the case of necessary.
Fig. 1 is the sectional view of film deposition system in the expression embodiment of the present invention (vertical formula CVD device).Fig. 2 is the transversal plane figure of the part of presentation graphs 1 shown device.This film deposition system 2 has the first processing gas of selectively supplying with dichlorosilane (DCS) gas that comprises silane-based gas, comprises the ammonia (NH of nitriding gas
3) gas second handle gas, comprise the C of appropriate hydrocarbon gas
2H
4The 3rd processing gas of (ethylene gas), and the BCl that comprises boron-containing gas
3Regulate the flow of vital energy the everywhere treatment zone of body of of gas.Film deposition system 2 is the structures that formed the carbon containing insulating film in such treatment zone by the CVD method on processed substrate.Also have, though in the following description, comprise above whole gas delivery system in the film deposition system 2, the situation of a part of not using these gases is also arranged in each embodiment described later.And, in constructing each embodiment, under the situation of special-purpose device, obsolete gas delivery system can be omitted.
Manifold 8 for example can be made by stainless steel, supports the lower end of processing vessel 4.By the lower ending opening of manifold 8, wafer boat 12 liftables of quartzy system, thus, processing vessel 4 can load and unloading for wafer boat 12.On wafer boat 12, be mounted with many pieces of semiconductor wafers multistage.For example, under the situation of present embodiment, on the pillar 12A of wafer boat 12, the diameter that for example can support equally spacedly about 50～100 pieces is the wafer W of 300mm.
Wafer boat 12 is loaded into worktable 16 by the heat-preservation cylinder 14 of quartz system.Worktable 16 is supported in the lower ending opening that opens and closes manifold 8, for example on the turning axle 20 by the perforation lid 18 of stainless steel.
At the breakthrough part of turning axle 20, for example be provided with magnetic fluid seal spare 22, airtight and supporting rotating shaft 20 rotatably.In the bottom of the periphery and the manifold 8 of lid 18, for example be provided with the sealing element 24 that is constituted by O type circle etc., keep the stopping property of container.
Turning axle 20 for example is installed in the front end of the arm 26 of hoisting appliances such as being supported in screw elevator 25.Making wafer boat 12 and lid 18 one liftings by hoisting appliance 25, also have, also can be that worktable 16 is fixedly set in lid 18 1 sides, does not make wafer boat 12 rotations and carries out the processing of wafer W.
Side surface part at manifold 8 is connected with for the treatment zone in the processing vessel 45 being supplied with the gas supply part of set gas.Gas supply part comprises second treating-gas supply system 28, first treating-gas supply system 30, the 4th treating-gas supply system 32, the 3rd treating-gas supply system 34 and Purge gas plenum system 36.First treating-gas supply system 30 is supplied with the first processing gas that contains DCS (dichlorosilane) gas that comprises silane-based gas.Second treating-gas supply system 28 is supplied with the ammonia (NH that comprises nitride gas
3) second handle gas.The 3rd treating-gas supply system 34 is supplied with the C that comprises appropriate hydrocarbon gas
2H
4The 3rd processing gas of (ethene).The 4th treating-gas supply system 32 is supplied with as the BCl that comprises boron-containing gas (impurity gas)
3Of the gas body of regulating the flow of vital energy everywhere.The rare gas element that Purge gas plenum system 36 is supplied with as Purge gas, for example nitrogen.Handle in the gas first to fourth, can be mixed into an amount of vector gas as required, but in the following description,, vector gas is no longer mentioned in order to make explanation easily.
Particularly, second, first, the 4th, and the 3rd treating- gas supply system 28,30,32,34 have respectively sidewall at manifold 8 connect inboardly crookedly upward extend, by gas dispersion nozzle 38,40,42,44 (with reference to Fig. 1) that silica tube constituted.In each gas dispersion nozzle 38～44, form a plurality of gas jetting hole 38A, 40A, 42A, 44A, all wafer W on the cover wafers boat 12 along its length direction (above-below direction) according to set interval. Gas jetting hole 38A, 40A, 42A, 44A supply with corresponding processing gas, the feasible air-flow that forms level for many pieces of wafer W on the wafer boat 12 in the horizontal direction substantially equably.On the other hand, Purge gas plenum system 36 has the sidewall of through-manifolds 8 and the gas jet 46 of the weak point that is provided with.
On the part of the sidewall of processing vessel 4, be provided with gas excitation portion 66 along its short transverse.With the opposite side of the processing vessel on gas excitation portion 66 opposites, for this internal atmosphere is carried out vacuum exhaust, for example the sidewall by the processing vessel 4 of pruning at above-below direction is provided with elongated venting hole 68.
Particularly, gas excitation portion 66 has by in the above-below direction width elongated open 70 that the sidewall of processing vessel 4 forms of pruning in accordance with regulations.Opening 70 is connected to 72 coverings of lid of quartz system of the outer wall of processing vessel 4 by pressure-tight weld.Lid 72 becomes to the outstanding cross section concavity in the outside of processing vessel 4, and has elongated shape up and down.
Constitute the gas excitation portion 66 that forms and a side direction processing vessel 4 inner openings outstanding by this from the sidewall of processing vessel 4.In other words, the internal space of gas excitation portion 66 is connected with the treatment zone 5 of processing vessel 4.Opening 70 is to form whole wafer W that can be kept on cover wafers boat 12 on the short transverse on above-below direction fully longways.
On the outer side of lid 72 two side, be provided with a pair of elongated electrode 74 on mutual opposite along its length direction (above-below direction).Be connected with the high frequency electric source 76 of plasma body generation usefulness on the electrode 74 by supply lines 78.Counter electrode 74 applies for example high-frequency voltage of 13.56MHz, forms in order to encourage the high-frequency electric field of plasma body between pair of electrodes 74 thus.Also have, the frequency of high-frequency voltage is not limited to 13.56MHz, also can use other frequency, for example 400kHz.
Second handles the gas dispersion nozzle 38 of gas, is positioned at the following position of the wafer W of descending level (highly) most on the wafer boat 12, to the radial direction foreign side bending of processing vessel 4.Thereafter, second handles the gas dispersion nozzle 38 of gas, and () position vertically erects apart from the center of processing vessel 4 farthest for the darkest in gas excitation portion 66.As shown in Figure 2, gas dispersion nozzle 38 is arranged at by the zone (position that high-frequency electric field is the strongest) of a pair of opposite electrode 74 clampings, promptly produces the position that the plasma generation area PS of main plasma body leaves more laterally than reality.Comprised NH from what the gas jetting hole 38A of gas dispersion nozzle 38 sprayed
3Second of gas is handled gas, sprays to plasma generation area PS, in this excitation (decomposing or activation), in the wafer W that supplies under such state on the wafer boat 12.
In the outside of lid 72, what this lid of covering was installed for example covers 80 by the insulation protection that quartz constituted.Insulation protection is covered on 80 inboards and parts electrode 74 opposite faces, is provided with the cooling body (not shown) that is made of the heat-eliminating medium path.The heat-eliminating medium path flows through for example refrigerative nitrogen gas stream as heat-eliminating medium, counter electrode 74 coolings thus.Also have, the outside at insulation protection lid 80 is provided with the guard shield (not shown) that covers this protective cover, prevents HF leakage.
Near the outside of the opening 70 of gas excitation portion 66, it is a side in the outside (in the processing vessel 4) of opening 70, vertically erect and be provided with the first and the gas dispersion nozzle 40,42 of regulating the flow of vital energy body everywhere, vertically erect at opposite side and be provided with the 3rd gas dispersion nozzle 44 of handling gas.Gas jetting hole 40A, the 42A, the 44A that form from gas dispersion nozzle 40,42,44 spray to the center position of processing vessel 4 and to comprise first of DCS and handle gas, comprise BCl
3Regulate the flow of vital energy everywhere body and comprise C of of gas
2H
4The 3rd handle gas.
On the other hand, there are the vent cap parts 82 that cover this venting hole, are configured as the コ font by the cross section that quartz constituted at venting hole 68 places being provided with gas excitation portion 66 opposites by welded and installed.Vent cap parts 82 extend upward along the sidewall of processing vessel 4, form pneumatic outlet 84 above processing vessel 4.Be connected with the vacuum evacuating system GE that is provided with vacuum pump etc. on the pneumatic outlet 84.
Be provided with and surround processing vessel 4, the well heater 86 that the atmosphere and the wafer W of processing vessel 4 heated.Near the venting hole 68 of processing vessel 4, be provided with thermopair (not shown) for control heater 86.
Then, the film (being so-called ALD (ald) film forming) that carries out using device shown in Figure 1 is illustrated.
＜the first embodiment 〉
In the film of first embodiment, on semiconductor wafer W, form the insulating film that is constituted by SiBCN (boron doped silicon carbon nitride) by the CVD method.For this reason, first of dichlorosilane (DCS) gas that has the treatment zone 5 of wafer W optionally to supply with to contain siliceous methane series gas to the harvesting ammonia (NH that handles gas, nitride gas
3) second handle gas, comprise the C of appropriate hydrocarbon gas
2H
4The 3rd BCl that handles gas and comprise boron-containing gas of (ethene)
3Of the gas body of regulating the flow of vital energy everywhere.
At first, in being set at the processing vessel 4 of both fixed temperatures, load and maintain many pieces, the wafer boat 12 of the normal temperature of 50～100 pieces of wafer W that are of a size of 300mm for example, processing vessel 4 is airtight.Then, to vacuumizing in the processing vessel 8, keep set processing pressure, the temperature of wafer is risen, standby is to being stable at the treatment temp that film forming is used.Then, rotate wafer boat 12, and supplying with first to fourth processing gas off and in the dominant discharge respectively by gas dispersion nozzle 40,38,44,42.
Particularly, containing first of DCS handles gas, contains C
2H
4The 3rd handle gas and contain BCl
3The of the gas body of regulating the flow of vital energy everywhere supplies to many pieces of wafer W on the wafer boat 12 by gas jetting hole 40A, 44A, the 42A of gas dispersion nozzle 40,44,42, forms parallel gas flow.During this period, DCS gas, C
2H
4Gas and BCl
3The molecule of the molecule of gas or the resolvent that is produced by their decomposition or atomic adsorption are on wafer.
On the other hand, contain NH
3Second of gas is handled gas and is supplied to many pieces of wafer W on the wafer boat 12 by the gas jetting hole 38A of gas dispersion nozzle 38, forms parallel gas flow.Second handles gas optionally encourages a part of plasma bodyization by the plasma generation area PS between a pair of electrode 74 time.At this moment, for example generate N*, NH*, NH
2*, NH
3* wait atomic group (spike) (mark * represents atomic group).These atomic groups flow out to the center of processing vessel 4 from the opening 70 of gas excitation portion 66, supply to wafer W each other with streamlined state.
The DCS gas of the surface adhesion of above-mentioned atomic group and wafer W, C
2H
4The molecule of gas etc. reacts, and forms film thus on wafer W.And then this moment is by BCl
3The B atom that decomposing gas produced enters film, forms the SiBCN film that contains as impurity boron.Also have, in contrast, the position of atomic group is arranged, can flow through DCS gas, C at the surface adhesion of wafer W
2H
4Gas and BCl
3Under the situation of gas, same reaction taking place also, forms the SiBCN film on wafer W.
Fig. 3 is the time diagram that the pattern of high frequency (RF) was supplied with and applied to gas in the film of expression first embodiment.As shown in Figure 3, in the film of this embodiment, repeat first to fourth operation T1～T4 alternately.Promptly repeatedly repeat the circulation that constituted by operation T1～T4,, obtain the SiBCN film of final thickness by the formed SiBCN film of the each circulation of lamination.
Particularly, in the first operation T1, gas (being expressed as DCS among Fig. 3) is handled in 5 supplies first to treatment zone, the 3rd processing gas (is expressed as C among Fig. 3
2H
4), body of regulating the flow of vital energy everywhere (is expressed as BCl among Fig. 3
3), and being handled gas, second of treatment zone 5 (is expressed as NH among Fig. 3
3) supply then stop.In the second operation T2, stop that first, second, third, fourth of treatment zone 5 is handled gas and supply with.In the 3rd operation T3, carry out second of treatment zone 5 is handled the supply of gas, and stop first, the 3rd, the of treatment zone 5 body of regulating the flow of vital energy is everywhere supplied with.And in the 3rd operation T3, RF power supply 76 for connecting (ON), makes second to handle gaseous plasmaization by gas excitation portion 66 from midway, only during the operation T3b the second processing gas is being supplied to treatment zone 5 under the state of excitation thus.In the 4th operation T4, stop that first, second, third, fourth of treatment zone 5 is handled gas and supply with.
In the 3rd operation T3, be connection through RF power supply behind the set time Δ t 76, make second to handle gaseous plasmaization by gas excitation portion 66, only during the auxiliary process T3b the second processing gas is being supplied to treatment zone 5 under the state of excitation thus.This so-called set time Δ t is to instigate NH
3Flow reach and stablize the required time, for example about 5 seconds.But, also can be that the whole period during the supply that runs through the second processing gas makes second to handle gaseous plasmaization by gas excitation portion 66.Make the RF power connection start plasma body by arriving at second flow of handling gas like this after stable, can improve the homogeneity that direction (short transverse) between the face of wafer W goes up the concentration of spike.
The second and the 4th operation T2, T4, be as get rid of in the processing vessel 4 residual gas cleaning operation and using.Here so-called the purification is meant and carries out vacuum exhaust when flowing through rare gas element such as nitrogen in the processing vessel 4, or stops whole gas and supply with processing vessel 4 is carried out vacuum exhaust, remove thus in the processing vessel 4 residual gas.And, also can be that the first half of the second and the 4th operation T2, T4 carries out vacuum exhaust, latter half carries out vacuum exhaust and rare gas element simultaneously and supplies with.Also have, in the first and the 3rd operation T1, T3, when supplying with first to fourth processing gas, the vacuum exhaust of processing vessel 4 can be stopped.But first to fourth handles the supply of gas, carry out at the same time under the situation of vacuum exhaust of processing vessel 4, and also can be connect first to fourth operation T1～T4 whole, continue the interior vacuum exhaust of processing vessel 4.
In Fig. 3, can be set at about 1～20 second of the first operation T1, for example about 10 seconds, about 5～15 seconds of the second operation T2, for example about 10 seconds, about 1～30 second of the 3rd operation T3, for example about 20 seconds, about 1～25 second of auxiliary process T3b, for example about 10 seconds, about 5～15 seconds of the 4th operation T4, for example about 10 seconds.And a formed thickness of circulation by first to fourth operation T1～T4 is approximately 0.11～0.13nm usually.So, for example be 70nm if wish thickness, then need to repeat this and circulate about 600 times.But these times and thickness only are represented examples, are not to be limited to this numerical value.
As mentioned above, supply with first, the 3rd, the operation T1 that regulates the flow of vital energy body everywhere together, and comprise independent supply and comprise NH
3Second handle gas and with them jointly by the operation T3 during the plasma excitation, be to clip cleaning section T2, T4 and mutual enforcement.Thus, can make the specific inductivity of formed SiBCN very low, and the elching resistant can increase substantially this dry-etching the time.Its reason is considered as follows.In other words, usually, its elching resistant worsens when adding boron in the silicon nitride film, still, as first embodiment, by plasma body it is encouraged when second handles the gas supply, can produce nitrogenous atomic group (spike), promotes the nitrogenize of film.Consequently, the Si-H in the film is in conjunction with minimizing, and the strong Si-N of etch resistant is in conjunction with increase.The elching resistant of film is increased substantially.
And, as mentioned above, when film forms, in processing vessel 8, supply with C
2H
4Gas makes silicon nitride film become carbonaceous state as appropriate hydrocarbon gas thus.Thus, though for example be,, when carrying out clean and etch processes, also can reduce the etching speed of employed diluted hydrofluoric acid on the surface of this film for example 550 ℃ of film forming than always film-forming temperature 760 ℃ of low temperature for example.Consequently, film is etched away too much in the time of can preventing etching, can improve the controlled of this thickness.And, also can give full play to function as etching stop film and interlayer dielectric.
And, as mentioned above,, have the function of carrying out modification as to film at the second and the 4th operation T2, the T4 that stop to handle gas that supply with between first and second operation of handling gas.Quality can be improved obtaining modification during this period in the surface of formed SiBCN film before will entering during this period.The etching speed that will further suppress thus, the SiBCN film.The effect of the atomic level when this modification is handled is considered as follows.In other words, when the SiBCN film that contains carbon atom formed, the Cl atom of failing to break away from when the most surperficial DCS gas of this film is piled up was with the active state combination.In the operation T2, the T4 that stop the supply of DCS gas, C
2H
4Gas and NH
3The Cl atom on the top layer of C atom and the above-mentioned film of N atomic substitutions in the gas, the composition of the C1 in the film reduces, and the result is that etching speed descends.
Particularly using C
2H
4Under the situation of gas, increase owing to enter the amount of the C atom in the film, so may further control etching speed.And, in boron nitride film, add carbon, compare film forming speed with the situation of not adding and can improve about 20%～30%.Its reason can be thought to have promoted the adsorption of boron for wafer surface owing to the interpolation of carbon.
The treatment condition that above-mentioned film forming is handled are as follows.The flow of DCS gas for example is 1000sccm in the scope of 50～2000sccm.NH
3The flow of gas for example is 1000sccm in the scope of 500～5000sccm.C
2H
4The flow of gas for example is 500sccm (1slm) in the scope of 200～2000sccm.BCl
3The flow of gas for example is 4sccm in the scope of 1～40sccm.C
2H
4The flow of gas is at below 3 times of flow of DCS gas.Its reason is that when the flow of appropriate hydrocarbon gas was too much, the quality that film can take place was sharply descended the undesirable incident of degradation.
Treatment temp is to handle low temperature than common CVD, 300～700 ℃ scope specifically, and hope is in 550～630 ℃ scope.When treatment temp was lower than 300 ℃, reaction did not take place, and film is piled up hardly.When treatment temp is higher than 700 ℃, form accumulating film by the CVD of the quality deteriorated of film, the metallic membrane that has formed simultaneously also can be subjected to thermal damage.
Processing pressure is wished in the scope of 40Pa (0.3Torr)～266Pa (2Torr) in the scope of 13Pa (0.1Torr)～1330Pa (10Torr).For example, processing pressure is 1Torr at first operation (absorption process) TI, and T3 is 0.3Torr in the 3rd operation (using the pecvd nitride operation).In the situation following time of processing pressure less than 13Pa, film forming speed is below practical level.Become film pressure when 1330Pa is following,,, can access good result so can stably pile up the second best in quality film with high film forming speed owing to the reaction for wafer is to be main flow with the absorption reaction.But processing pressure is during greater than 1330Pa, and reaction formation to the gas-phase reaction transition, is a main flow with the gas-phase reaction from absorption reaction.Consequently be not only between the face of film with face in homogeneity descend, and also sharply increase, so be undesirable by the caused particle of gas-phase reaction.
＜the second embodiment 〉
In the film of second embodiment, on semiconductor wafer W, form the insulating film that the SiCN of doped with boron (B) (silicon carbon nitride) is not constituted by the CVD method.For this reason, first of dichlorosilane (DCS) gas that has the treatment zone 5 of wafer W optionally to supply with to contain silane-based gas to the harvesting ammonia (NH that handles gas, nitrogen gas
3) second C that handles gas and comprise appropriate hydrocarbon gas
2H
4The 3rd of (ethene) gas is handled gas.
In other words, in second embodiment, change first embodiment shown in Figure 3, corresponding to not supplying with the BCl that comprises boron-containing gas fully
3Of gas is regulated the flow of vital energy body everywhere and is carried out film forming method.So, under the situation of carrying out second embodiment, in film deposition system shown in Figure 1, do not need the 4th treating-gas supply system 32.Also have, the treatment condition of this second embodiment are except regulating the flow of vital energy everywhere the condition of body about the, identical with the situation of first embodiment of front.
Fig. 4 is the time diagram that the pattern of RF (high frequency) was supplied with and applied to gas in the film of expression second embodiment.As shown in Figure 4, in the film of this embodiment, also be the mutual first to fourth operation T11～T14 of repetition.In other words, repeatedly repeat the circulation that constituted by first to fourth operation T11～T14.By the formed SiCN film of the each circulation of lamination, obtain the SiCN film of final thickness.
Particularly, in the first operation T11, treatment zone 5 implementations, the first processing gas (being expressed as DCS among Fig. 4) and the 3rd is handled gas (be expressed as C among Fig. 4
2H
4) supply, (be expressed as NH among Fig. 4 and second of treatment zone 5 is handled gas
3) supply then stop.In the second operation T12, stop first, second, third of treatment zone 5 is handled the supply of gas.In the 3rd operation T13, carry out second of treatment zone 5 is handled the supply of gas, supply with and stop that the first, the 3rd of treatment zone 5 is handled gas.And in the 3rd operation T13, RF power supply 76 for connecting, makes second to handle gaseous plasmaization by gas excitation portion 66 from midway, only during the operation T13b the second processing gas is being supplied to treatment zone 5 under the state of excitation thus.In the 4th operation T14, stop that first, second, third of treatment zone 5 is handled gas and supply with.
In second embodiment and since also be supply with second when handling gas by plasma excitation, so produce the atomic group (spike) that contains N, promote nitrogenize thus.Consequently, the Si-H in the film is in conjunction with minimizing, and the strong Si-N of etch resistant is in conjunction with increase.And, when film forms, in processing vessel 8, supply with C
2H
4Gas makes silicon nitride film become carbonaceous state as appropriate hydrocarbon gas thus.Thus, though for example be,, when carrying out clean and etch processes, also can reduce the etching speed of employed diluted hydrofluoric acid on the surface of this film for example 550 ℃ of film forming than always film-forming temperature 760 ℃ of low temperature for example.Consequently, film is etched away too much in the time of can preventing etching, can improve the controlled of this thickness.And, also can give full play to function as etching stop film and interlayer dielectric.
＜the three embodiment 〉
In the film of the 3rd embodiment, on semiconductor wafer W, be formed with the insulating film that BCN (boron doped carbon nitride) is constituted by the CVD method.For this reason, there is the treatment zone 5 of wafer W optionally to supply with the ammonia (NH that contains nitriding gas to harvesting
3) second the handling gas, comprise the C of appropriate hydrocarbon gas of gas
2H
4The 3rd BCl that handles gas and comprise boron-containing gas of (ethene) gas
3Of the gas body of regulating the flow of vital energy everywhere.
In other words, in the 3rd embodiment, change first embodiment shown in Figure 3, carry out film forming method corresponding to the first processing gas of not supplying with dichlorosilane (DCS) gas that contains silane-based gas fully.So, under the situation of carrying out the 3rd embodiment, in film deposition system shown in Figure 1, do not need first treating-gas supply system 30.Also have, the treatment condition of the 3rd embodiment are except handling the condition of gas about first, identical with the situation of first embodiment of front.
Fig. 5 is the time diagram that the pattern of RF (high frequency) was supplied with and applied to gas in the film of expression the 3rd embodiment.As shown in Figure 5, in the film of this embodiment, also be the mutual first to fourth operation T21～T24 of repetition.In other words, repeatedly repeat the circulation that constituted by first to fourth operation T21～T24.By the formed BCN film of the each circulation of lamination, obtain the BCN film of final thickness.
Particularly, in the first operation T21, treatment zone 5 is carried out the 3rd processing gas (be expressed as C among Fig. 5
2H
4) and body of regulating the flow of vital energy everywhere (be expressed as BCl among Fig. 5
3) supply, (be expressed as NH among Fig. 5 and second of treatment zone 5 is handled gas
3) supply then stop.In the second operation T22, stop to treatment zone 5 second, third, supply of regulating the flow of vital energy body everywhere.In the 3rd operation T23, carry out second of treatment zone 5 is handled the supply of gas, and stop the 3rd, the of treatment zone 5 body of regulating the flow of vital energy is everywhere supplied with.And in the 3rd operation T23, RF power supply 76 for connecting, makes second to handle gaseous plasmaization by gas excitation portion 66 from midway, only during the auxiliary process T23b the second processing gas is being supplied to treatment zone 5 under the state of excitation thus.In the 4th operation T24, stop to treatment zone 5 second, third, the body of regulating the flow of vital energy everywhere supplies with.
In the 3rd embodiment and since be supply with second when handling gas by plasma excitation, so produce the atomic group (spike) that contains N, promote nitrogenize thus.Consequently, the C-H in the film is in conjunction with minimizing, and the strong C-N of etch resistant is in conjunction with increase.Thus, though for example be,, when carrying out clean and etch processes, also can reduce the etching speed of employed diluted hydrofluoric acid on the surface of this film for example 550 ℃ of film forming than always film-forming temperature 760 ℃ of low temperature for example.Consequently, film is etched away too much in the time of can preventing etching, can improve the controlled of this thickness.And, also can give full play to function as etching stop film and interlayer dielectric.
＜the four embodiment 〉
In the film of the 4th embodiment, on semiconductor wafer W, be formed with SiBN (boron doped silicon nitride) film and the SiCN of institute (silicon carbonnitride) the film repetition insulating film that lamination constituted by the CVD method.For this reason, first of the dichlorosilane (DCS) that has the treatment zone 5 of wafer W optionally to supply with to contain siliceous methane series gas to harvesting handle gas, contain the ammonia (NH of nitride gas
3) second handle gas, comprise the C of appropriate hydrocarbon gas
2H
4The 3rd BCl that handles gas and comprise boron-containing gas of gas (ethene)
3Of the gas body of regulating the flow of vital energy everywhere.
In other words, in the 4th embodiment, change first embodiment shown in Figure 3, corresponding to repeating not supply with fully the C that comprises appropriate hydrocarbon gas alternately
2H
4The 3rd of gas (ethene) is handled first circulation of gas, and does not supply with the BCl that comprises boron-containing gas fully
3The of gas regulate the flow of vital energy everywhere body second circulation and carry out film forming method.Also have, the treatment condition of the 4th embodiment are except carrying out first circulation and second circulation alternately, identical with the situation of first embodiment of front.
Fig. 7 is the sectional view of expression according to an example of the rhythmo structure of the film of the 4th embodiment formation.As shown in Figure 7, mutual lamination SiBN film 92 and SiCN film 94 on semiconductor wafer W.This SiBN/SiCN rhythmo structure film demonstrates the characteristic similar to SiBCN on all.Fig. 7 represents the state of the setting that repeats to be made of above-mentioned first and second circulation for 3 times.
Fig. 6 is the time diagram that the pattern of RF (high frequency) was supplied with and applied to gas in the film of expression the 4th embodiment.As shown in Figure 6, in the film of this embodiment, be mutual first circulation that is constituted by first to fourth operation T31～T34 and second circulation that is constituted by the 5th to the 8th operation T35～T38 of repeating.In other words, repeatedly repeat first circulation and second circulation.By each formed SiBN film of circulation of lamination and SiCN film, obtain the SiBN/SiCN film of final thickness.Also have, first circulation and second round-robin order also can opposite (circulating since second).
Particularly, at first, carry out first to fourth operation T31～T34 as first circulation.In the first operation T31, treatment zone 5 is supplied with first handle gas (being expressed as DCS among Fig. 6) and the body of regulating the flow of vital energy everywhere and (be expressed as BCl among Fig. 6
3), and being handled gas, second of treatment zone 5 (is expressed as NH among Fig. 6
3) and the 3rd handle gas and (be expressed as C among Fig. 6
2H
4) supply then stop.In the second operation T32, stop to treatment zone 5 first, second, the 4th, supply of regulating the flow of vital energy body everywhere.In the 3rd operation T33, carry out second of treatment zone 5 is handled the supply of gas, and stop first, the 3rd, the of treatment zone 5 body of regulating the flow of vital energy is everywhere supplied with.And in the 3rd operation T33, RF power supply 76 for connecting, makes second to handle gaseous plasmaization by gas excitation portion 66 from midway, only during the auxiliary process T33b the second processing gas is being supplied to treatment zone 5 under the state of excitation thus.In the 4th operation T34, stop that first, second, third, fourth of treatment zone 5 is handled gas and supply with.
Then, carry out the 5th to the 8th operation T35～T38 as second circulation.In the 5th operation T35, treatment zone 5 is supplied with the first and the 3rd handle gas, second and the supply of regulating the flow of vital energy body everywhere of treatment zone 5 is then stopped.In the 6th operation T36, stop to treatment zone 5 first, second, the 4th, supply of regulating the flow of vital energy body everywhere.In the 7th operation T37, carry out second of treatment zone 5 is handled the supply of gas, and stop first, the 3rd, the of treatment zone 5 body of regulating the flow of vital energy is everywhere supplied with.And in the 7th operation T37, RF power supply 76 for connecting, makes second to handle gaseous plasmaization by gas excitation portion 66 from midway, only during the auxiliary process T37b the second processing gas is being supplied to treatment zone 5 under the state of excitation thus.In the 8th operation T38, stop that first, second, third, fourth of treatment zone 5 is handled gas and supply with.
In the 4th embodiment and since be supply with second when handling gas by plasma excitation, so produce the atomic group (spike) that contains N, promote the nitrogenize of film thus.And, when the formation of film, in processing vessel 8, supply with for example C as hydrocarbon polymer
2H
4Gas makes silicon nitride film become carbonaceous state thus.Thus, though for example be,, when carrying out clean and etch processes, also can reduce the etching speed of employed diluted hydrofluoric acid on the surface of this film for example 550 ℃ of film forming than always film-forming temperature 760 ℃ of low temperature for example.Consequently, film is etched away too much in the time of can preventing etching, can improve the controlled of this thickness.And, also can give full play to function as etching stop film and interlayer dielectric.And then, owing to contain boron in the film, so its elching resistant can be further enhanced.
＜experiment 1 〉
Use device shown in Figure 1, form insulating film, it is estimated by the film in first to the 3rd embodiment.The benchmark of the treatment condition that the film forming in this experiment is handled as mentioned above, film-forming temperature is 550 ℃, uses 1% dilution aqueous hydrogen fluoride solution as etching solution.
Fig. 8 is the chart of respectively etching speed of the film of three embodiment PE1, PE2, PE3 being estimated in expression first to the 3rd embodiment as a result.The film of embodiment PE1, PE2, PE3 as mentioned above, is made of SiBCN film, SiCN film and BCN film.Fig. 8 represents the etching speed of each film, and the etching speed (benchmark) under the carbon-free situation of each film.
As can be seen from Figure 8, adding under the situation of carbon component in each film, compare with the film that does not add carbon component, all is to reduce etching speed, has guaranteed the improvement of the quality of film.For example the SiBCN film is compared with the SiBN film, and etching speed can improve 13.8%.The SiCN film is compared with the SiN film, and etching speed can improve 6.8%.The BCN film is compared with the BN film, and etching speed can improve 48%.Can confirm to add the availability of carbon thus.
Common item in＜first to fourth embodiment 〉
As mentioned above, the method in first to fourth embodiment is based on handling procedure, carries out under the control of master control part 60.Fig. 9 is the general block diagram of expression master control part 60.Master control part 60 has CPU210, and CPU210 is connected with storage part 212, input part 214, efferent 216 etc.Store handling procedure in the storage part 212 and handle prescription.Input part 214 be for the input unit of user dialogue, for example comprise keyboard, pointing device, and the driving mechanism of storage media etc.The control signal that efferent 216 is exported for each apparatus of controlling treatment unit.Fig. 9 has also represented for the detachable storage media 218 of computer.
Method in the above-mentioned embodiment is to can be used as the programmed instruction that is used for carrying out on the treater, writes the storage media of embodied on computer readable, can be applicable to various semiconductor processing devices.Perhaps, this programmed instruction is transmitted by communication medium, is applicable to various semiconductor processing devices.Storage media for example is disk (floppy disk, a hard disk (hard disk of an example for comprising in the storage part 212)), CD (CD, DVD etc.), magneto-optic disk (MO etc.), semiconductor memory etc.The computer of control semiconductor device action is carried out it, and is implemented aforesaid method by reading in the programmed instruction of remembering in the storage media on treater.
In the above-described embodiment, as film deposition system 2, example be to form the gas excitation portion 66 of plasma body and the formation of processing vessel 4 one assembling.Also can replace it, encourage portion 66 and processing vessel 4 to be provided with separately gas, outside processing vessel 4, encourage NH in advance by following structure
3Gas (being so-called remote plasma) is with the NH of this excitation
3Gas is supplied with to processing vessel 4.And, also can be not to NH
3Gas activation and supplying with.In this case, in order to compensate the decline of not using the caused energy of plasma body, treatment temp must be improved slightly.
In the above-described embodiment, what handle silane-based gas example in the gas is DCS gas as first.About this point,, can use the gas of selecting more than one gaseous group that constitutes from following gas: dichlorosilane (DCS), disilicone hexachloride (HCD), silicomethane (SiH as silane-based gas
4), silicoethane (Si
2H
6), hexamethyldisilazane (HMDS), tetrachloro silicane (TCS), dimethyl silanyl amine (DSA), three silyl ammonia (TSA), di-t-butyl aminosilane (BTBAS)
2Deng.
In the above-described embodiment, that handle that nitriding gas in the gas uses is NH as second
3Gas, N
2Gas.And, under the situation of the film that the present invention is applicable to the silicon nitride system, can use following gas to replace nitriding gas: nitrous oxide (N
2O), nitrogen protoxide oxides of nitrogen gas such as (NO).In this case, the film of formation is the film that contains the silicon oxynitride system of oxygen [O].
In the above-described embodiment, what handle appropriate hydrocarbon gas example in the gas is ethylene gas as the 3rd.About this point, also can use the gas of selecting one or more gaseous group that constitutes from following gas as appropriate hydrocarbon gas: acetylene, ethene, methane, ethane, propane, butane etc.
In the above-described embodiment, that regulate the flow of vital energy boron-containing gas example in the body everywhere is BCl as
3Gas.About this point, also can use the gas of selecting more than one gaseous group that constitutes from following gas: BCl as boron-containing gas
3, B
2H
6, BF
3, B (CH
3)
3Deng.
As processed substrate, also be not limited to semiconductor wafer, also can be other substrates such as LCD substrate, glass substrate.
Those skilled in the art can change the present invention.Therefore the present invention is not limited to above-mentioned embodiment, under the prerequisite that does not break away from its aim, can carry out various changes certainly.
Claims (19)
1. film that semiconductor processes is used, it is characterized in that, comprise first of silane-based gas and handle gas, comprise second of nitride gas or oxides of nitrogen gas and handle gas and the 3rd handling in the treatment zone of gas of comprising appropriate hydrocarbon gas selectively supplying with, on processed substrate, form insulating film by CVD
Described film has first operation, second operation, the 3rd operation and the 4th operation alternately,
Described first operation is supplied with the first and the 3rd to described treatment zone and is handled gas, on the other hand described treatment zone is stopped the supply of the described second processing gas;
Described second operation stop to described treatment zone first, second, and the 3rd supply of handling gas;
Described the 3rd operation is supplied with second to described treatment zone and is handled gas, on the other hand described treatment zone is stopped the supply of the described first and the 3rd processing gas;
Described the 4th operation stop to described treatment zone first, second, and the 3rd supply of handling gas.
2. method according to claim 1 is characterized in that, described the 3rd operation has under by the state of excitation mechanism excitation handles gas during the excitation that described treatment zone is supplied with described second.
3. method according to claim 2 is characterized in that, described the 3rd operation has before during the described excitation, will described second under without the state of excitation mechanism excitation handles gas during described treatment zone supply.
4. method according to claim 1 is characterized in that, described treatment zone constitutes selectively to supply with and contains the of the boron-containing gas body of regulating the flow of vital energy everywhere, described method have to described treatment zone supply with described the regulate the flow of vital energy everywhere body during,
Described the regulates the flow of vital energy body everywhere to the supply of described treatment zone, with the described first and the 3rd handle gas at least one of them to the identical moment operation of the supply of described treatment zone and stop.
5. method according to claim 4 is characterized in that, has first operation, second operation, the 3rd operation and the 4th operation,
Described first operation is supplied with the described first and the 3rd to described treatment zone and is handled gas, on the other hand described treatment zone is stopped described second and the supply of regulating the flow of vital energy body everywhere;
Described second operation stop to described treatment zone first, second, third, and the supply of regulating the flow of vital energy body everywhere;
Described the 3rd operation is supplied with described second to described treatment zone and is handled gas, on the other hand described treatment zone is stopped described first, the 3rd and the supply of regulating the flow of vital energy body everywhere;
Described the 4th operation stop to described treatment zone first, second, third, and the supply of regulating the flow of vital energy body everywhere,
Described method after described first to fourth operation also and then have the 5th operation, the 6th operation, the 7th operation and the 8th operation alternately,
Wherein said the 5th operation is supplied with first and the body of regulating the flow of vital energy everywhere to described treatment zone, on the other hand described treatment zone is stopped described second and third to handle the supply of gas;
Described the 6th operation stop to described treatment zone first, second, third, and the supply of regulating the flow of vital energy body everywhere;
Described the 7th operation is supplied with described second to described treatment zone and is handled gas, on the other hand described treatment zone is stopped described first, the 3rd and the supply of regulating the flow of vital energy body everywhere;
Described the 8th operation stop to described treatment zone first, second, third, and the supply of regulating the flow of vital energy body everywhere.
6. method according to claim 5 is characterized in that, described the 7th operation has under by the state of excitation mechanism excitation handles gas during the excitation that described treatment zone is supplied with described second.
7. method according to claim 6 is characterized in that, described the 7th operation has before during the described excitation, will described second under without the state of excitation mechanism excitation handles gas during described treatment zone supply.
8. method according to claim 1 is characterized in that, the described second and the 4th operation has respectively during the described treatment zone supply Purge gas.
9. method according to claim 1 is characterized in that, continues exhaust in the described treatment zone from described first operation to described the 4th operation.
10. method according to claim 1, it is characterized in that, described first handles gas comprises selected more than one gas from following gas: dichlorosilane, disilicone hexachloride, silicomethane, silicoethane, hexamethyldisilazane, tetrachloro silicane, dimethyl silanyl amine, three silyl amine, the di-t-butyl aminosilane, described second handles gas comprises selected more than one gas from following gas: ammonia, nitrogen, nitrous oxide, nitrogen protoxide, the described the 3rd handles gas comprises selected more than one gas from following gas: acetylene, ethene, methane, ethane, propane, butane.
11. method according to claim 4 is characterized in that, described body of regulating the flow of vital energy everywhere comprises selected more than one gas: BCl from following gas
3, B
2H
6, BF
3, B (CH
3)
3
12. film that semiconductor processes is used, it is characterized in that, comprise first of appropriate hydrocarbon gas and handle gas, comprise second of nitride gas or oxides of nitrogen gas and handle gas and the 3rd handling in the treatment zone of gas of comprising boron-containing gas selectively supplying with, on processed substrate, form insulating film by CVD
Described film has first operation, second operation, the 3rd operation and the 4th operation alternately,
Wherein said first operation is supplied with the described first and the 3rd to described treatment zone and is handled gas, on the other hand described treatment zone is stopped the supply of the described second processing gas;
Described second operation stop to described treatment zone first, second, and the 3rd supply of handling gas;
Described the 3rd operation is supplied with described second to described treatment zone and is handled gas, on the other hand described treatment zone is stopped the supply of the described first and the 3rd processing gas;
Described the 4th operation stop to described treatment zone first, second, and the 3rd supply of handling gas.
13. method according to claim 12 is characterized in that, described the 3rd operation has under by the state of excitation mechanism excitation handles gas during the excitation that described treatment zone is supplied with described second.
14. method according to claim 13 is characterized in that, described the 3rd operation has before during the described excitation, will described second under without the state of excitation mechanism excitation handles gas during described treatment zone supply.
15. method according to claim 12 is characterized in that, the described second and the 4th operation has respectively during the described treatment zone supply Purge gas.
16. method according to claim 12 is characterized in that, continues to carry out exhaust in the described treatment zone to described the 4th operation from described first operation.
17. method according to claim 12 is characterized in that,
Described first handles gas comprises selected more than one gas from following gas: acetylene, ethene, methane, ethane, propane, butane,
Described second handles gas comprises selected more than one gas from following gas: ammonia, nitrogen, nitrous oxide, nitrogen oxide,
The described the 3rd handles gas comprises selected more than one gas: BCl from following gas
3, B
2H
6, BF
3, B (CH
3)
3
18. a semiconductor processes film deposition system is characterized in that, is provided with:
Processing vessel with treatment zone of the processed substrate of harvesting;
In described processing vessel, support the support component of described processed substrate;
Heat the well heater of the described processed substrate in the described processing vessel;
To deflated exhaust system in the described processing vessel;
In described processing vessel, supply with first of siliceous methane series gas and handle first treating-gas supply system of gas;
In described processing vessel, supply with second of nitrogenate gas or oxides of nitrogen gas and handle second treating-gas supply system of gas;
In described treatment zone, supply with the 3rd of gas containing hydrocarbon and handle the 3rd treating-gas supply system of gas;
And the control part of controlling the action of described device,
Described control part is carried out first operation, second operation, the 3rd operation and the 4th operation alternately in order to form insulating film by CVD on described processed substrate,
Wherein said first operation is supplied with the described first and the 3rd to described treatment zone and is handled gas, on the other hand described treatment zone is stopped the supply of the described second processing gas;
Described second operation stop to described treatment zone first, second, and the 3rd supply of handling gas;
Described the 3rd operation is supplied with described second to described treatment zone and is handled gas, on the other hand described treatment zone is stopped the supply of the described first and the 3rd processing gas;
Described the 4th operation stop to described treatment zone first, second, and the 3rd supply of handling gas.
19. a semiconductor processes film deposition system is characterized in that, is provided with:
Processing vessel with treatment zone of the processed substrate of harvesting;
In described treatment zone, support the support component of described processed substrate;
Heat the well heater of the described processed substrate in the described processing vessel;
To carrying out the deflated exhaust system in the described processing vessel;
In described treatment zone, supply with first of gas containing hydrocarbon and handle first treating-gas supply system of gas;
In described treatment zone, supply with second of nitrogenate gas or oxides of nitrogen gas and handle second treating-gas supply system of gas;
In described treatment zone, supply with and contain the 3rd treating-gas supply system that the 3rd of boron-containing gas is handled gas;
And the control part of controlling the action of described device,
Described control part is carried out first operation, second operation, the 3rd operation and the 4th operation alternately in order to form insulating film by CVD on described processed substrate,
Wherein said first operation is supplied with the described first and the 3rd to described treatment zone and is handled gas, on the other hand described treatment zone is stopped the supply of the described second processing gas;
Described second operation stop to described treatment zone first, second, and the 3rd supply of handling gas;
Described the 3rd operation is supplied with described second to described treatment zone and is handled gas, on the other hand described treatment zone is stopped the supply of the described first and the 3rd processing gas;
Described the 4th operation stop to described treatment zone first, second, and the 3rd supply of handling gas.
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|---|---|---|---|
| JP2005066340 | 2005-03-09 | ||
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| JP2006004191 | 2006-01-11 |
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| CN1831191A CN1831191A (en) | 2006-09-13 |
| CN100554506C true CN100554506C (en) | 2009-10-28 |
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| JP2023003828A (en) * | 2021-06-24 | 2023-01-17 | 東京エレクトロン株式会社 | Film deposition apparatus and film deposition method |
| CN114515519B (en) * | 2022-03-16 | 2022-10-04 | 南京工业大学 | Mixed matrix carbon molecular sieve membrane, preparation method and composite membrane prepared by using same 2 H 4 /C 2 H 6 Use in separations |
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| TW200506093A (en) * | 2003-04-21 | 2005-02-16 | Aviza Tech Inc | System and method for forming multi-component films |
| JP4658486B2 (en) * | 2003-06-30 | 2011-03-23 | ルネサスエレクトロニクス株式会社 | Semiconductor device and manufacturing method thereof |
| JP3960987B2 (en) * | 2004-04-23 | 2007-08-15 | 株式会社日立国際電気 | Reaction vessel |
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| CN1831191A (en) | 2006-09-13 |
| JP2009065203A (en) | 2009-03-26 |
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