CN100545320C - A kind of method that is used to make the electroformed nickel of plane electrotyping plate - Google Patents
A kind of method that is used to make the electroformed nickel of plane electrotyping plate Download PDFInfo
- Publication number
- CN100545320C CN100545320C CNB2005101013813A CN200510101381A CN100545320C CN 100545320 C CN100545320 C CN 100545320C CN B2005101013813 A CNB2005101013813 A CN B2005101013813A CN 200510101381 A CN200510101381 A CN 200510101381A CN 100545320 C CN100545320 C CN 100545320C
- Authority
- CN
- China
- Prior art keywords
- electroforming
- plane
- nickel
- make
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title claims abstract description 40
- 238000000034 method Methods 0.000 title claims abstract description 34
- 229910052759 nickel Inorganic materials 0.000 title claims abstract description 20
- 238000005323 electroforming Methods 0.000 claims abstract description 41
- 239000000243 solution Substances 0.000 claims abstract description 31
- DITXJPASYXFQAS-UHFFFAOYSA-N nickel;sulfamic acid Chemical compound [Ni].NS(O)(=O)=O DITXJPASYXFQAS-UHFFFAOYSA-N 0.000 claims abstract description 11
- 238000001914 filtration Methods 0.000 claims abstract description 8
- 238000002347 injection Methods 0.000 claims abstract description 4
- 239000007924 injection Substances 0.000 claims abstract description 4
- 230000010287 polarization Effects 0.000 claims abstract description 4
- 238000003756 stirring Methods 0.000 claims abstract description 4
- 239000003153 chemical reaction reagent Substances 0.000 claims description 8
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 claims description 7
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 claims description 5
- 239000004141 Sodium laurylsulphate Substances 0.000 claims description 5
- 235000019333 sodium laurylsulphate Nutrition 0.000 claims description 5
- 239000004327 boric acid Substances 0.000 claims description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 claims description 4
- 125000005619 boric acid group Chemical group 0.000 claims description 3
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical class CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005518 electrochemistry Effects 0.000 description 1
- 239000002659 electrodeposit Substances 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005101013813A CN100545320C (en) | 2005-11-14 | 2005-11-14 | A kind of method that is used to make the electroformed nickel of plane electrotyping plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005101013813A CN100545320C (en) | 2005-11-14 | 2005-11-14 | A kind of method that is used to make the electroformed nickel of plane electrotyping plate |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1804139A CN1804139A (en) | 2006-07-19 |
CN100545320C true CN100545320C (en) | 2009-09-30 |
Family
ID=36866279
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005101013813A Expired - Fee Related CN100545320C (en) | 2005-11-14 | 2005-11-14 | A kind of method that is used to make the electroformed nickel of plane electrotyping plate |
Country Status (1)
Country | Link |
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CN (1) | CN100545320C (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102534695B (en) * | 2010-12-29 | 2015-06-17 | 京东方科技集团股份有限公司 | Metal substrate for flexible display and preparation method for metal substrate |
CN108221006A (en) * | 2018-02-11 | 2018-06-29 | 常德金德新材料科技股份有限公司 | A kind of efficient method for preparing nickel plate |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1341513A (en) * | 2001-08-22 | 2002-03-27 | 魏志凌 | Preparation method of surface tiling and veneering technology form |
CN1465753A (en) * | 2002-06-25 | 2004-01-07 | 首钢总公司 | Electroplating method for internal surface of crystallizer |
CN1515703A (en) * | 2003-01-08 | 2004-07-28 | 鞍钢集团机械制造公司风机电镀厂 | Method for electroforming nickel-cobalt alloy |
-
2005
- 2005-11-14 CN CNB2005101013813A patent/CN100545320C/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1341513A (en) * | 2001-08-22 | 2002-03-27 | 魏志凌 | Preparation method of surface tiling and veneering technology form |
CN1465753A (en) * | 2002-06-25 | 2004-01-07 | 首钢总公司 | Electroplating method for internal surface of crystallizer |
CN1515703A (en) * | 2003-01-08 | 2004-07-28 | 鞍钢集团机械制造公司风机电镀厂 | Method for electroforming nickel-cobalt alloy |
Non-Patent Citations (4)
Title |
---|
印制电路板氨基磺酸镍盐镀镍工艺. 羊秋福.电镀与精饰,第26卷第1期. 2004 |
印制电路板氨基磺酸镍盐镀镍工艺. 羊秋福.电镀与精饰,第26卷第1期. 2004 * |
脉冲参数对氨基磺酸盐镀镍择优取向的影响. 王庆富,张鹏程,周晋林,王晓红,张延志,王嘉勇.材料保护,第36卷第11期. 2003 |
脉冲参数对氨基磺酸盐镀镍择优取向的影响. 王庆富,张鹏程,周晋林,王晓红,张延志,王嘉勇.材料保护,第36卷第11期. 2003 * |
Also Published As
Publication number | Publication date |
---|---|
CN1804139A (en) | 2006-07-19 |
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Effective date of registration: 20090206 Address after: Floor 1, building 215437, Tsinghua Science and Technology Park, 1666 Reed Road South, Jiangsu, Kunshan Applicant after: SHENZHEN POWER STENCIL Co.,Ltd. Address before: A4, building three, Fu Qiao District, Qiaotou community, Fuyong street, Baoan District, Guangdong, Shenzhen 518103, China Applicant before: SHENZHEN POWER STENCIL Co.,Ltd. |
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Owner name: KUNSHAN YUNSHENGJI PHOTOELECTRIC TECHNOLOGY CO., L Free format text: FORMER OWNER: KUNSHAN YUNSHENGJI ELECTRONICS CO., LTD. Effective date: 20090911 |
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Effective date of registration: 20090911 Address after: Jiangsu city of Kunshan province city red Yang Road Patentee after: KUN SHAN POWER STENCIL Co.,Ltd. Address before: Floor 1, innovation building, Tsinghua Science Park, No. 1666 Reed Road, Jiangsu, Kunshan Patentee before: SHENZHEN POWER STENCIL Co.,Ltd. |
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