CN100539107C - Strengthen the circuit substrate and the IC circuit packing structure thereof of lead wire tensile strength - Google Patents
Strengthen the circuit substrate and the IC circuit packing structure thereof of lead wire tensile strength Download PDFInfo
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- CN100539107C CN100539107C CN 200610145950 CN200610145950A CN100539107C CN 100539107 C CN100539107 C CN 100539107C CN 200610145950 CN200610145950 CN 200610145950 CN 200610145950 A CN200610145950 A CN 200610145950A CN 100539107 C CN100539107 C CN 100539107C
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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Abstract
The invention relates to a kind of circuit substrate and IC circuit packing structure thereof that strengthens lead wire tensile strength.The circuit substrate that this strengthens lead wire tensile strength mainly comprises a substrate core layer, a plurality of connection gasket, plurality of leads and a welding resisting layer.Those connection gaskets and those lead-in wires are to be arranged on this substrate core layer.This welding resisting layer is to be formed on this substrate core layer, to cover those lead-in wires but appear those connection gaskets.Wherein, those lead-in wires are to have an I type cross section, use the tensile strength that improves those lead-in wires.This IC circuit packing structure comprises aforesaid circuit substrate.The present invention can overcome that wire breaking causes the problem that electrically opens circuit in the thermal cycling test, is specially adapted to the high-density base board of integrated circuit encapsulation.
Description
Technical field
The present invention relates to a kind of circuit substrate, particularly relate to a kind of circuit substrate and IC circuit packing structure thereof that strengthens lead wire tensile strength, can be in the use of semiconductor packages.
Background technology
Circuit substrate (Substrate) can be used as the chip carrier of an electrical interconnects, to apply to semiconductor packages.Integrated circuit (IC) wafer produces heat when computing, can amass heat in circuit substrate, will drop to room temperature after stopping computing, the formation temperature circulation.When circuit substrate is in the circulation that heats up with cooling, the inner thermal stress that produces of circuit substrate has rupture of line cause electrically the opening circuit risk of (circuit broken).
See also Figure 1 and Figure 2, Fig. 1 is the schematic partial cross-sectional view that has known circuit substrate now, and Fig. 2 is the wherein schematic partial cross-sectional view of a lead-in wire of existing known circuit substrate edge.In a kind of existing known circuit substrate 100, on a substrate core layer 110, be provided with a plurality of connection gaskets 120 and plurality of leads 130, and with a welding resisting layer 140 coverings.Those lead-in wires 130 can be arranged on this substrate core layer 110, and connect those corresponding connection gaskets 120 to inner via hole or interior connection pad.Those connection gaskets 120 can be used as the external connection pad of an integrated circuit encapsulating products, for example can engage soldered ball or tin cream.But this welding resisting layer 140 is to cover those lead-in wires 130 at least one position that appears those connection gaskets 120.Usually each lead-in wire 130 is to have a upper surface 131 and a lower surface 132, and has the square-section.The lower surface 132 of those lead-in wires 130 is to be attached at this substrate core layer 110; The upper surface 131 and the side of those lead-in wires 130 are covered by this welding resisting layer 140.Yet along with high density distribution demand, the live width of those lead-in wires 130 further requires narrower, causes the tensile strength (tensile strength) of those lead-in wires 130 that the reduction phenomenon is arranged.When the thermal cycling test of analog equipment computing (Thermal Cycle Test, TCT) in, find that lead-in wire partly 130 can produce fracture place 133 (as shown in Figure 2) be arranged, cause can't normal operation electrically open circuit.
This shows that above-mentioned existing circuit substrate obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.In order to solve the problem of above-mentioned existence, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found a kind of circuit substrate and IC circuit packing structure thereof of enhancing lead wire tensile strength of new structure, real one of the current important research and development problem that belongs to, also becoming the current industry utmost point needs improved target.
Because the defective that above-mentioned existing circuit substrate exists, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of founding a kind of circuit substrate and IC circuit packing structure thereof of novel enhancing lead wire tensile strength, can improve general existing circuit substrate, make it have more practicality.Through constantly research, design, and, create the present invention who has practical value finally through after studying sample and improvement repeatedly.
Summary of the invention
Main purpose of the present invention is, overcome the defective that existing circuit substrate exists, and provide a kind of circuit substrate and IC circuit packing structure thereof of enhancing lead wire tensile strength of new structure, technical problem to be solved is to make it can overcome that wire breaking causes the problem that electrically opens circuit in the thermal cycling test, be specially adapted to the high-density base board of integrated circuit encapsulation, thereby be suitable for practicality more.
The object of the invention to solve the technical problems realizes by the following technical solutions.According to a kind of circuit substrate that the present invention proposes, it comprises: a substrate core layer; A plurality of connection gaskets, it is to be arranged on this substrate core layer; Plurality of leads, it is to be arranged on this substrate core layer and to be connected to those connection gaskets; And a welding resisting layer, it is to be formed on this substrate core layer, to cover those lead-in wires but appear those connection gaskets; Wherein, those lead-in wires are to have an I type cross section, and each lead-in wire is can have a upper surface, a lower surface and in the recessed side of both sides.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid circuit substrate, the recessed side of wherein said those lead-in wires and upper surface are to be covered by this welding resisting layer.
Aforesaid circuit substrate, it also can include a dielectric layer in addition, and it is between this substrate core layer and this welding resisting layer, to cover the recessed side of those lead-in wires.
Aforesaid circuit substrate, wherein said dielectric layer are to include the identical close anti-welding material of this welding resisting layer.
Aforesaid circuit substrate, the lower surface of wherein said those lead-in wires are to be attached at this substrate core layer.
Aforesaid circuit substrate, wherein said those connection gaskets are to can be circular pad.
Aforesaid circuit substrate, a position of wherein said those lead-in wires are can be embedded in this substrate core layer.
The object of the invention to solve the technical problems also realizes by the following technical solutions.According to a kind of IC circuit packing structure that the present invention proposes, it comprises as the described circuit substrate of above-mentioned claim 1.
The object of the invention to solve the technical problems can also be further achieved by the following technical measures.Aforesaid IC circuit packing structure, it also comprises a plurality of soldered balls in addition, and it is engaged in those connection gaskets.
The object of the invention to solve the technical problems also realizes in addition by the following technical solutions.According to a kind of circuit substrate that the present invention proposes, it comprises: a substrate core layer; A plurality of connection gaskets, it is arranged on this substrate core layer; Plurality of leads, it is arranged on this substrate core layer and is connected to those connection gaskets; And a welding resisting layer, it is formed on this substrate core layer, to cover those lead-in wires but appear those connection gaskets; Wherein, each lead-in wire is to have a upper surface, a lower surface and in the recessed side of both sides, those recessed sides and this upper surface are covered by this welding resisting layer.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid circuit substrate, a position of wherein said those lead-in wires are to be embedded in this substrate core layer.
Aforesaid circuit substrate, wherein said those recessed sides are to be selected from one of them of arc groove, v-depression and U-shaped groove.
The present invention compared with prior art has tangible advantage and beneficial effect.As known from the above, in order to achieve the above object, the invention provides a kind of circuit substrate that strengthens lead wire tensile strength, is to comprise a substrate core layer, a plurality of connection gasket, plurality of leads and a welding resisting layer.Those connection gaskets are to be arranged on this substrate core layer.Those lead-in wires are to be arranged on this substrate core layer and to be connected to those connection gaskets.This welding resisting layer is to be formed on this substrate core layer, to cover those lead-in wires but appear those connection gaskets.Wherein, those lead-in wires are to have an I type cross section, can strengthen the tensile strength of those lead-in wires by this.
By technique scheme, circuit substrate and IC circuit packing structure thereof that the present invention strengthens lead wire tensile strength have following advantage at least:
1, the circuit substrate of enhancing lead wire tensile strength of the present invention comprises a substrate core layer, a plurality of connection gasket, plurality of leads and a welding resisting layer, and those lead-in wires have an I type cross section, and is covered by this welding resisting layer.Those lead-in wires of the present invention have stronger tensile strength compared to traditional lead-in wire, when applying to the integrated circuit encapsulation, this IC circuit packing structure can comprise circuit substrate as the aforementioned, a plurality of soldered balls more can be engaged in those connection gaskets, the width of those lead-in wires can design narrower, is not easy to produce the problem of fracture in thermal cycling test.
2 moreover, comprise a substrate core layer, a plurality of connection gasket, plurality of leads and a welding resisting layer at the another kind of circuit substrate that strengthens lead wire tensile strength of the present invention, the framework that utilizes the side recessed, I type cross section of those lead-in wires to be capped with it, the tensile strength that can promote those lead-in wires.
3, in addition, the circuit substrate of another enhancing lead wire tensile strength of the present invention comprises a substrate core layer, plurality of leads and a welding resisting layer at least.Can form by those lead-in wire both sides and to be provided with a recessed side, can make the cross section of those lead-in wires is I type or funnel type etc., and structure can be promoted the tensile strength and the polarization of this lead-in wire by this.
In sum, the circuit substrate and the IC circuit packing structure thereof of the enhancing lead wire tensile strength of novelty of the present invention can overcome that wire breaking causes the problem that electrically opens circuit in the thermal cycling test, are specially adapted to the high-density base board of integrated circuit encapsulation.The present invention has above-mentioned plurality of advantages and practical value, no matter it all has bigger improvement on product structure or function, obvious improvement is arranged technically, and produced handy and practical effect, and more existing circuit substrate has the outstanding effect of enhancement, thereby being suitable for practicality more, and having the extensive value of industry, really is a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is the schematic partial cross-sectional view that has known circuit substrate now.
Fig. 2 is the wherein schematic partial cross-sectional view of a lead-in wire of existing known circuit substrate edge.
Fig. 3 is according to first specific embodiment of the present invention, a kind of schematic partial cross-sectional view that strengthens the circuit substrate of lead wire tensile strength.
Fig. 4 is according to first specific embodiment of the present invention, and this circuit substrate edge is the schematic partial cross-sectional view of a lead-in wire wherein.
Fig. 5 A to Fig. 5 E illustrates the schematic partial cross-sectional view of this circuit substrate in its lead-in wire processing procedure.
Fig. 6 is according to second specific embodiment of the present invention, the another kind of schematic partial cross-sectional view that strengthens the circuit substrate of lead wire tensile strength.
Fig. 7 is according to the 3rd specific embodiment of the present invention, the another kind of schematic partial cross-sectional view that strengthens the circuit substrate of lead wire tensile strength.
100: circuit substrate 110: the substrate core layer
120: connection gasket 130: lead-in wire
131: upper surface 132: lower surface
133: fracture place 140: welding resisting layer
200: circuit substrate 210: the substrate core layer
220: connection gasket 230: lead-in wire
231: upper surface 232: lower surface
233: recessed side 234: bottom
235: intermediate layer 236: top layer
240: welding resisting layer 250: dielectric layer
300: circuit substrate 310: the substrate core layer
330: lead-in wire 331: upper surface
332: lower surface 333: recessed side
340: welding resisting layer 400: circuit substrate
410: substrate core layer 430: lead-in wire
431: recessed side 440: welding resisting layer
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, circuit substrate and its embodiment of IC circuit packing structure, structure, feature and the effect thereof of the enhancing lead wire tensile strength that foundation the present invention is proposed, describe in detail as after.
According to first specific embodiment of the present invention, disclosed a kind of circuit substrate that strengthens lead wire tensile strength.See also Fig. 3 and shown in Figure 4, Fig. 3 is according to first specific embodiment of the present invention, a kind of schematic partial cross-sectional view that strengthens the circuit substrate of lead wire tensile strength, and Fig. 4 is the wherein schematic partial cross-sectional view of a lead-in wire of this circuit substrate edge.The circuit substrate 200 that this strengthens lead wire tensile strength comprises a substrate core layer 210, a plurality of connection gasket 220, plurality of leads 230 and a welding resisting layer 240; Wherein:
This substrate core layer 210 is to be dielectric material, contains resin pickup (FR-3, FR-4) or pi (PI) as glass fabric.Jian Ge line layer number of plies difference according to need, this circuit substrate 200 may have a plurality of substrate core layers 210.
Those connection gaskets 220 are to be arranged on this substrate core layer 210, and its material is to be copper or other conductive materials, with as externally electrically connecting contact.In the present embodiment, those connection gaskets 220 are to can be circular pad, can engage soldered ball or tin cream, as the external connection end of integrated circuit encapsulating products.
Those lead-in wires 230 are to be arranged on this substrate core layer 210, and are connected to those connection gaskets 220.Those lead-in wire other ends of 230 are the via (via) that can be connected to this circuit substrate 200 or conductive finger or the like, to reach electrical interconnects.The material of those lead-in wires 230 also can be copper or other conductive materials.
This welding resisting layer 240 is to form to be arranged on this substrate core layer 210, to cover those lead-in wires 230 but appear those connection gaskets 220.Usually the surface that appears at those connection gaskets 220 is to form to be provided with a coat of metal (not drawing among the figure), as nickel gold, tin, tin lead or the like, also promotes external welding in order to the oxidation that prevents those connection gaskets 220.
In addition, as shown in Figure 3, those lead-in wires 230 are to have an I type cross section, and are covered by this welding resisting layer 240.In a concrete structure, each lead-in wire 230 is to have a upper surface 231, a lower surface 232 and the recessed side 233 that is positioned at both sides.The lower surface 232 of those lead-in wires 230 is to be attached at this substrate core layer 210, and this welding resisting layer 240 is the upper surfaces 231 that cover those lead-in wires 230.In the present embodiment, this circuit substrate 200 can include a dielectric layer 250 in addition, and it is between this substrate core layer 210 and this welding resisting layer 240, to cover the recessed side 233 of those lead-in wires 230.Preferably, this dielectric layer 250 is to include the close anti-welding material of this welding resisting layer 240, so that the formation technology of this dielectric layer 250 can be identical with this welding resisting layer 240, helps making this dielectric layer 250.
Therefore, those lead-in wires 230 have stronger tensile strength compared to traditional lead-in wire.When applying to the integrated circuit encapsulation, one IC circuit packing structure is to comprise foregoing circuit substrate 200, a plurality of soldered balls (not drawing among the figure) more can be engaged in those connection gaskets 220, the width of those lead-in wires 230 can design narrower, also is not easy to produce the problem of fracture in thermal cycling test.
Seeing also shown in Fig. 5 A to Fig. 5 E, is to illustrate the schematic partial cross-sectional view of this circuit substrate in its lead-in wire processing procedure.Come further to specify the making flow process of the lead-in wire 230 of this circuit substrate 200 below.At first, shown in Fig. 5 A, provide a substrate core layer 210, a Copper Foil in the pressing again, this Copper Foil of etching, to form the bottom 234 of those lead-in wires 230, the below of this bottom 234 is the lower surface 232 of those lead-in wires 230.Wherein the thickness of above-mentioned Copper Foil is about 1/3rd of those lead-in wire thickness of 230.
Afterwards, shown in Fig. 5 B, form an intermediate layer 235 in the mode of electro-coppering above this bottom 234, the width in this intermediate layer 235 is the width less than this bottom 234, to form above-mentioned recessed side 233.
Afterwards, shown in Fig. 5 C, utilize printing or deposition technique to form this dielectric layer 250 at the exposed surface of this substrate core layer 210.Be noted that especially and should in these dielectric layer 250 formation or with lapping mode, appear this intermediate layer 235.
Afterwards, shown in Fig. 5 D, mode with electro-coppering forms a top layer 236 above this intermediate layer 235 again, the width of this top layer 236 is the width greater than this intermediate layer 235, the part of this top layer 236 can be formed on this dielectric layer 250, with upper surface 231 and the formation lead-in wire 230 that forms above-mentioned lead-in wire 230.
At last, shown in Fig. 5 E, this welding resisting layer 240 is formed on this dielectric layer 250, and covers the upper surface 231 of this lead-in wire 230, have the lead-in wire 230 that the recessed side 233 of I type cross section and its is tamped to make.
Seeing also shown in Figure 6ly, is according to second specific embodiment of the present invention, the another kind of schematic partial cross-sectional view that strengthens the circuit substrate of lead wire tensile strength.In second specific embodiment of the present invention, disclosed the circuit substrate of another kind of enhancing lead wire tensile strength.This circuit substrate 300 comprises a substrate core layer 310, a plurality of connection gasket (not drawing among the figure), plurality of leads 330 and a welding resisting layer 340.
Those connection gaskets and those lead-in wires 330 are to be arranged on this substrate core layer 310.This welding resisting layer 340 is to be formed on this substrate core layer 310, still appears those connection gaskets to cover those lead-in wires 330.And those lead-in wires 330 are to have an I type cross section.In the present embodiment, each lead-in wire 330 can have upper surface 331, a lower surface 332 and recessed side 333 in both sides.This lower surface 332 is to be attached at this substrate core layer 310, and the recessed side 333 and the upper surface 331 of those lead-in wires 330 are to be covered by this welding resisting layer 340.So the framework that utilizes the side 333 recessed, I type cross section of those lead-in wires 330 to be capped with it, the tensile strength that can promote those lead-in wires 330.
Seeing also shown in Figure 7ly, is according to the 3rd specific embodiment of the present invention, the another kind of schematic partial cross-sectional view that strengthens the circuit substrate of lead wire tensile strength.In the 3rd specific embodiment of the present invention, disclosed the circuit substrate of another kind of enhancing lead wire tensile strength.This circuit substrate 400 comprises a substrate core layer 410, plurality of leads 430 and a welding resisting layer 440 at least.
The both sides of those lead-in wires 430 can form and be provided with a recessed side 431, and as arc groove, v-depression or U-shaped groove, can make the cross section of those lead-in wires 430 is I type or funnel type etc.Preferably, a position of those lead-in wires 430 is can be embedded in this substrate core layer 410, and covers other position that those lead-in wires 430 protrude in this substrate core layer 410 with this welding resisting layer 440.Structure can be promoted the tensile strength and the polarization of this lead-in wire 430 by this.
In addition, can further specify the formation method of those lead-in wires 430, at first, to a Copper Foil over etching, have the lead-in wire 430 of recessed side 431, both sides with formation, this substrate core layer 410 of pressing again is so that the bottom of those lead-in wires 430 is embedded into slightly in this substrate core layer 410, be arranged on this substrate core layer 410 with these welding resisting layer 440 formation more in addition, to cover those lead-in wires 430.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be not break away from the technical solution of the present invention content, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (12)
1, a kind of circuit substrate is characterized in that it comprises:
One substrate core layer;
A plurality of connection gaskets, it is to be arranged on this substrate core layer;
Plurality of leads, it is to be arranged on this substrate core layer and to be connected to those connection gaskets; And
One welding resisting layer, it is to be formed on this substrate core layer, to cover those lead-in wires but appear those connection gaskets;
Wherein, those lead-in wires are to have an I type cross section, and each lead-in wire has a upper surface, a lower surface and in the recessed side of both sides.
2, circuit substrate according to claim 1 is characterized in that the recessed side and the upper surface of wherein said those lead-in wires covered by this welding resisting layer.
3, circuit substrate according to claim 1 is characterized in that it also includes a dielectric layer in addition, and it is between this substrate core layer and this welding resisting layer, to cover the recessed side of those lead-in wires.
4, circuit substrate according to claim 3 is characterized in that wherein said dielectric layer includes the close anti-welding material of this welding resisting layer.
5, circuit substrate according to claim 1, the lower surface that it is characterized in that wherein said those lead-in wires are to be attached at this substrate core layer.
6, circuit substrate according to claim 1 is characterized in that wherein said those connection gaskets are to be circular pad.
7, according to the described circuit substrate of arbitrary claim in the claim 1 to 6, a position that it is characterized in that wherein said those lead-in wires is to be embedded in this substrate core layer.
8, a kind of IC circuit packing structure is characterized in that it comprises circuit substrate as claimed in claim 1.
9, IC circuit packing structure according to claim 8 is characterized in that it comprises a plurality of soldered balls in addition, and it is engaged in those connection gaskets.
10, a kind of circuit substrate is characterized in that it comprises:
One substrate core layer;
A plurality of connection gaskets, it is arranged on this substrate core layer;
Plurality of leads, it is arranged on this substrate core layer and is connected to those connection gaskets; And
One welding resisting layer, it is formed on this substrate core layer, to cover those lead-in wires but appear those connection gaskets;
Wherein, each lead-in wire is to have a upper surface, a lower surface and in the recessed side of both sides, those recessed sides and this upper surface are covered by this welding resisting layer.
11, circuit substrate according to claim 10, a position that it is characterized in that wherein said those lead-in wires are to be embedded in this substrate core layer.
12,, it is characterized in that wherein said those recessed sides are to be selected from one of them of arc groove, v-depression and U-shaped groove according to claim 10 or 11 described circuit substrates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610145950 CN100539107C (en) | 2006-11-28 | 2006-11-28 | Strengthen the circuit substrate and the IC circuit packing structure thereof of lead wire tensile strength |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610145950 CN100539107C (en) | 2006-11-28 | 2006-11-28 | Strengthen the circuit substrate and the IC circuit packing structure thereof of lead wire tensile strength |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101192591A CN101192591A (en) | 2008-06-04 |
| CN100539107C true CN100539107C (en) | 2009-09-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610145950 Expired - Fee Related CN100539107C (en) | 2006-11-28 | 2006-11-28 | Strengthen the circuit substrate and the IC circuit packing structure thereof of lead wire tensile strength |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100539107C (en) |
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2006
- 2006-11-28 CN CN 200610145950 patent/CN100539107C/en not_active Expired - Fee Related
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| Publication number | Publication date |
|---|---|
| CN101192591A (en) | 2008-06-04 |
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Granted publication date: 20090909 Termination date: 20121128 |