CN100529776C - Electron component pull force tester and method - Google Patents

Abstract

The invention provides an electronic component tensile test device and method, which pulls up the electronic component with a vertical upward pulling force, so that the solder joint of the electronic component is separated from the test piece under uniform pulling force. The tensile test device for electronic components at least includes a fixed clip seat and a movable clip seat, and the fixed clip seat and the movable clip seat are respectively sleeved on two opposite support bodies, and are in an upper and lower relative structural relationship. A hook for hanging a steel cable is installed under the seat, and the steel cable is connected to the adhesive block bonded to the electronic component, and the electronic component is welded on the test piece assembled on the fixed clip seat; when in use, the movable clip seat Move, the hook pulls the adhesive block accordingly, until the electronic component is separated from the test piece under uniform tension, so as to avoid damage to the solder joints of the electronic component.

Description

Device and method for tensile test of electronic components

【Technical field】

The present invention provides a tensile test device and method, in particular, an electronic component tensile test device and method that pull up an electronic component with a vertical upward pulling force, so that each solder joint of the electronic component is separated from the test piece under a uniform tensile force .

【Background technique】

With the rapid development of electronic products in the direction of portable, miniaturized, networked and multimedia, higher requirements are put forward for electronic assembly technology. On the other hand, due to the limitation of integrated circuit pin frame and processing accuracy, the assembly density cannot Improve again. So the Ball Grid Array (BGA) technology came into being, which eliminates the problems of coplanarity and warpage caused by the plug-in wires of the fine-pitch integrated circuits.

However, it is very difficult to test the solder joints of the BGA components, and it is not easy to guarantee its quality and reliability. When the BGA components fail, the solder joints must be destructively analyzed to obtain the failure location of the solder joints. The existing method for separating the ball grid array element from the PCB board (Printed Circuit Board, printed circuit board) is to use a crowbar close to the edge of the ball grid array element and apply force to pry it open. Due to the small range of lateral force applied by this method, the outermost solder joints of the ball grid array components may be damaged and deformed by the crowbar, and the stress on each solder joint is uneven, which will also affect the subsequent failure analysis of the ball grid array. accuracy.

In view of this, it is necessary to provide an electronic component tensile test device and method, which pulls up the electronic component with a vertical upward pulling force, so that each solder joint of the electronic component is separated from the PCB board under uniform force, and overcomes the problem of damaging the solder joint. missing.

【Content of invention】

Therefore, the object of the present invention is to provide a device and method for tensile testing of electronic components, which is used to pull up electronic components with a vertical upward pulling force, so that each solder joint of the electronic component is separated from the test piece under uniform pulling force, so as to avoid damage to the solder joints. Points to improve the accuracy of failure testing of electronic components.

In order to achieve the above purpose, the present invention provides an electronic component tensile test device and method, which are used to pull up the electronic component with a vertical upward pulling force, so that each solder joint of the electronic component is separated from the test piece under a uniform pulling force. The tensile test device for electronic components at least includes a fixed clip seat and a movable clip seat, and the fixed clip seat and the movable clip seat are respectively sleeved on two opposite support bodies, and are in an upper and lower relative structural relationship. A hook for hanging a steel cable is installed under the seat, and the steel cable is connected with an adhesive block bonded to the electronic component, and the electronic component is welded on the test piece assembled on the fixing clamp seat.

The electronic component tensile test method of the present invention is applied on the above-mentioned electronic component tensile test device, which includes: (1) bonding the electronic components on the adhesive block and the test piece, so that the adhesive block is consistent with the center point of the electronic component; (2) positioning Adhesive block; (3) Fix the test piece on the fixing clip seat; (4) Apply a vertical upward pulling force to the adhesive block until the electronic component is separated from the test piece.

Compared with the prior art, the present invention pulls up the electronic component with a vertical upward pulling force, so that each solder joint of the electronic component is separated from the test piece under a uniform force, which has solved the existing deficiency.

【Description of drawings】

Fig. 1 is a front view of the electronic component tensile testing machine of the present invention in use.

Fig. 2 is a three-dimensional exploded view of the electronic component tensile testing device of the present invention.

Fig. 3 is a schematic diagram of a vertically used electronic component tensile test device of the present invention.

Fig. 3 is a flow chart of the electronic component tensile test method of the present invention.

【Detailed ways】

Please refer to Fig. 1, which is a front view of the use state of the electronic component tensile test device of the present invention. As shown in the figure, the electronic component tensile test device 1 at least includes a fixed clip seat 80 and a movable clip seat 60, and the fixed clip The seat 80 and the movable clamp seat 60 are sleeved on two relative support bodies 70 respectively, and are in an up-and-down relative structural relationship. A hanging hook 30 is installed below the movable clamp seat 60, and a hanging hook 30 is hung on the hanging hook 30. Steel cable 20, this steel cable 20 is connected with an adhesive block 12, and this adhesive block 12 is combined with the electronic component 11 that is welded on the test piece 10, and this test piece 10 is fixed on the fixed clip seat 80, with movable clip seat When 60 moves upward, the hook 30 pulls the adhesive block 12 thereupon until the electronic component 11 is separated from the test piece 10 .

Please refer to Fig. 1 and Fig. 2 together, wherein, Fig. 2 is the three-dimensional exploded view of the electronic component tensile test device of the present invention, wherein, the hanging hook 30 is installed under the movable clamp seat 60, in order to hang the steel cable 20 The other end of the steel cable 20 passes through the perforation 211 provided on the top side of the steel lock screw 21; in addition, a power part (not shown) is arranged in the movable clamp seat 60, and one end of the power part pulls the hook 30 , the other end transmits the pulling force to a sensor (not shown), the sensor converts the pulling force into an electrical measurement signal, and displays it; and, the two ends of the movable clamp seat 60 are provided with slide plugs (not shown) , accommodated in the chute 71.

A test piece platform 40 is carried on the fixing clamp seat 80, and a plurality of second screw holes 41 are provided at intervals on the test piece platform 40, so as to be locked by the fixing screws 43 of the pressing piece 42, and one end of the pressing piece 42 is Press and place a test piece 10 welded with the electronic component 11 to be tested, and then fix the test piece 10 on the test piece platform 40; The center point of the electronic component 11 remains consistent, wherein the adhesive block 12 has a regular and symmetrical shape and a uniform texture, and the adhesive block 12 can be implemented as one of square, rectangular, circular, equilateral triangle, oval, etc., and the adhesive block 12 is located at the other end of the steel cable 20, that is, below the steel lock screw 21; in addition, the adhesive block 12 defines a first screw hole 121 with its center as the axis to lock with the steel lock screw 21.

Please refer to FIG. 1 , the supporting body 70 is provided with a slide groove 71 in a recessed manner relative to the sliding plug of the movable clamp seat 60 , and the slide groove 71 extends from the position where the support body 70 is assembled with the fixed clamp seat 80 to the support. The top of the body 70 is used to accommodate the slide plug so that the movable clamp seat 60 can slide along the sliding groove 71.

The present invention also discloses a method for tensile testing of electronic components. Referring to FIG. 4 , it is a flow chart of the method for tensile testing of electronic components of the present invention. The steps are as follows:

Step 410, bonding the adhesive block 12 and the electronic component 11 on the test piece 10 so that the center point of the adhesive block 12 is consistent with the electronic component 11, and placing the test piece 10 on the test piece table 40;

Step 420, positioning the adhesive block 12, that is, hanging the plumb 50 on the hook 30, and fine-tuning the test piece 10 (see FIG. 3 ) at the same time, until the plumb 50 is aligned with the first screw hole 121 of the adhesive block 12 Axis, at this time, the force direction of the hook 30 is the opposite direction of the centerline of the adhesive block 12, which is the vertical upward pulling force;

Step 430, fix the test piece 10 on the test piece platform 40, that is, lock the fixing screw 43 and the second screw hole 41, and let the pressing piece 42 press and fix the test piece 10 soldered with the electronic component 11 to be tested on the test piece. On the piece platform 40, then lock the steel cable screw 21 and the first screw hole 121 of the adhesive block 12, and hang the steel cable 20 passing through the perforation 211 on the hook 30;

Step 440, apply a vertical upward pulling force to the adhesive block 12, that is, use the power part to pull up the hook 30. At this time, due to the dispersion effect of the pulling force of the adhesive block 12, each solder joint of the electronic component 11 is evenly stressed until the The electronic component 11 is separated from the test piece 10, and at the same time, the pulling force is converted into an electrical measurement signal by the sensor and displayed.

Compared with the prior art, the electronic component tensile test device and method of the present invention pull up the adhesive block combined with the electronic component with a vertical upward pulling force. Due to the dispersion effect of the tensile force of the adhesive block, the solder joints of the electronic component are uniform force, and at the same time obtain the tensile value of the electronic component when it is separated from the test piece, so as to carry out the failure analysis of the subsequent electronic component, which has solved the existing deficiencies.

Claims (9)

1. An electronic component tensile test device, which is used to separate an electronic component welded on a test piece from the test piece with a vertical upward pulling force, which includes a fixed clamp seat and a movable clamp seat respectively sleeved on two opposite On the support body, and in an upper and lower relative structural relationship, and the movable clip seat slides along the support body in a manner approaching or away from the fixed clip seat, and it is characterized in that: the device further includes: A hanging hook, which is installed under the movable clamp seat; a steel cable, one end of which is hung on the hook; An adhesive block is connected to the other end of the cable. 2. The electronic component tensile test device according to claim 1, characterized in that: the adhesive block is regular and symmetrical in shape and uniform in texture. 3. The electronic component tensile testing device according to claim 1, wherein a first screw hole is opened with the center of the adhesive block as the axis, and locked with the screw. 4. The tensile test device for electronic components as claimed in claim 3, wherein a hole is formed on the side of the top of the screw for the steel cable to pass through. 5. The device for tensile testing of electronic components as claimed in claim 1, further comprising: a test piece table installed on the fixing clip seat, a plurality of second screw holes are set at intervals on the test piece table, and are connected with the set pressure. The fixing screw of the setting piece is locked tightly, and one end of the pressing piece is placed on the test piece. 6. The device for tensile testing of electronic components as claimed in claim 1, further comprising a power part accommodated in the movable clamp seat, and one end of the power part pulls the hook, and the other end transmits the pulling force to a general Transducer that converts the tension value into an electrical measurement signal. 7. The electronic component tensile test device according to claim 1, characterized in that: there are sliding plugs at both ends of the movable clamp seat, and the supporting body is provided with a sliding groove in a concave manner relative to the sliding plug, and the sliding The groove extends from the position where the support body is assembled with the fixing clip seat to the top end of the support body, and accommodates the sliding plug. 8. A tensile test method for electronic components, which is applied to a tensile test device for electronic components. The device includes a fixed clip seat, a movable clip seat, and an adhesive block on the movable clip seat. The fixed clip seat and the movable clip seat are relatively moved and applied With pulling force, the method steps are as follows: Glue the adhesive block to the electronic component on the test piece, so that the adhesive block is consistent with the center point of the electronic component; Position the sticky block; Fix the test piece on the holder; Apply a vertical upward pulling force to the adhesive block until the electronic component is separated from the test piece. 9. The electronic component tensile test method according to claim 8, wherein the step of positioning the adhesive block further comprises aligning the center of the adhesive block with a plumb.

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