CN100526949C - Panel combining device and method thereof - Google Patents
Panel combining device and method thereof Download PDFInfo
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- CN100526949C CN100526949C CNB200710151646XA CN200710151646A CN100526949C CN 100526949 C CN100526949 C CN 100526949C CN B200710151646X A CNB200710151646X A CN B200710151646XA CN 200710151646 A CN200710151646 A CN 200710151646A CN 100526949 C CN100526949 C CN 100526949C
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- substrate
- vacuum chamber
- lower substrate
- subtegulum
- pressure
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
Abstract
Substrate combining device and method using dropping due to gravity and absorption due to a difference in pressures. The substrate combining device includes a vacuum chamber, the inner pressure of which is controlled by the operation of a gate valve, an upper base plate for mounting substrates on the top portion of the inside of the vacuum chamber by vacuum absorption, and a lower base plate for fixing substrates with a sealing material applied to the upper surface thereof to the bottom portion of the inside of the vacuum chamber. The upper base plate includes substrate-falling means causing the substrates to drop.
Description
The application divides an application, and the application number of its original bill application is 200410091653.1, and the applying date is on November 24th, 2004, and denomination of invention is " substrate unit equipment and a method ".
Technical field
The present invention relates to substrate unit equipment and method, more specifically, relate to a kind of substrate unit equipment, it improves its combination by the difference that the decline that causes owing to gravity uses vacuum chamber to make up on upper and lower substrate and the working pressure; And relate to a kind of substrate combined method.
Background technology
Because the use that increases day by day of computing machine and TV now, the demand of LCD (LCD) is increased sharply.
As the parts of LCD, the liquid crystal substrate comprises two substrates, and it is made up mutually so that the inner space is formed between two substrates, and liquid crystal is injected in two inner spaces between the substrate.
Japan publication NO.2000-147528 and Korea S publication NO.2003-66845 disclose conventional equipment and the method that is used for the combination of liquid crystals substrate.The disclosed substrate unit equipment of Korea S publication NO.2003-66845 is illustrated in Fig. 1, and its operation will be described as follows.
In other words, liquid crystal 12 is loaded on first glass substrate 11.The Ag point is formed on second glass substrate 13, and encapsulant 14 is applied in second glass substrate 13.First and second glass substrates 11 and 13 load on the appearing on the stage and leave office on 16 of chamber 10 of described equipment respectively by vacuum absorption.Appearing on the stage and leaving office 15 and 16 is driven so that liquid crystal is filled first and second glass substrates 11 and 13 equably, and by uniform pressure being put on itself and combination mutually, and encapsulant 14 is hardened.
At this, because first and second glass substrates 11 and 13 combination realize under vacuum condition, the vacuum tightness in the chamber 10 is than appearing on the stage and second 15 and 16 height, thereby causes the loss of the absorbability of first and second glass substrates 11 and 13.Therefore, for the loss of the absorbability that prevents first and second glass substrates 11 and 13, substrate container (receiver) is installed in appears on the stage on 15.
As shown in the above conventional substrate unit equipment, the chamber 10 under the vacuum condition needs expensive 15 and 16 (for example electrostatic chucks) of appearing on the stage and leave office so that absorb corresponding substrate 11 and 13, increases the size and the production cost of products of equipment thus.Operator's console 15 and 16 mistake can cause keeping the difficulty in the homogeneity of absorbability of substrate 11 and 13.
Vacuum tightness in the chamber 10 is normally low, as 0.001 holder.Like this, chamber 10 needs the expansion turbine pump.
Because the combination to substrate 11 and 13 realizes that under vacuum condition the absorption of appearing on the stage or leaving office between 15 or 16 and first or second glass substrate 11 or 13 can be released.Therefore, in order to overcome the above problems, 15 or 16 substrate containers that need add of appearing on the stage or leave office.
Summary of the invention
Therefore, consider above problem and made the present invention, and the purpose of this invention is to provide substrate unit equipment and method that wherein simple and inexpensive structure is obtained to reduce production cost of products, substrate is made up effectively, and the pressure that is used to make up substrate is freely regulated.
Another object of the present invention provides substrate unit equipment and method, wherein at least two substrate combinations simultaneously by single step.
According to the present invention, above and other purpose can realize that this equipment comprises by the substrate unit equipment is provided: vacuum chamber, and its internal pressure is controlled by the operation to gate valve; Upper substrate is used for by vacuum absorption substrate being installed in the top of internal vacuum chamber, and this upper substrate comprises the substrate falling apparatus, and it descends substrate; And infrabasal plate, be used for the substrate that upper surface has applied encapsulant is fixed in the bottom of internal vacuum chamber.
Preferably, vacuum chamber can comprise medium vacuum pump and malleation supply line, and the inside of vacuum chamber can be in medium vacuum state or barotropic state by the operation to gate valve.
Description of drawings
To comparatively be expressly understood above and other purpose of the present invention, characteristics and other advantage from carrying out following detailed description in conjunction with the accompanying drawings, in the accompanying drawings:
Fig. 1 is vertical sectional drawing of conventional substrate unit equipment;
Fig. 2 is the vertical sectional drawing according to the substrate unit equipment of first embodiment of the invention;
Fig. 3 A is vertical sectional drawing of the operation steps of the substrate unit equipment of key diagram 2 respectively to 3F;
Fig. 4 is the process flow diagram that the substrate combined method of the substrate unit equipment that uses Fig. 2 is described;
Fig. 5 is the vertical sectional drawing according to the substrate unit equipment of second embodiment of the invention;
Fig. 6 is that the synoptic diagram that makes up upper and lower substrate according to the substrate unit equipment of first embodiment of the invention is used in explanation;
Fig. 7 is the process flow diagram of explanation according to the substrate combined method of second embodiment of the invention;
Fig. 8 is the vertical sectional drawing according to the substrate unit equipment of third embodiment of the invention;
Fig. 9 is the process flow diagram of explanation according to the substrate combined method of third embodiment of the invention; And
Figure 10 A is the vertical sectional drawing of explanation according to the substrate combined method of third embodiment of the invention to 10D.
Embodiment
Now with reference to accompanying drawing in detail the preferred embodiments of the present invention are described in detail.
＜the first embodiment 〉
As shown in Figure 2, the substrate unit equipment according to first embodiment of the invention comprises: vacuum chamber 110; Upper substrate 120, it is installed on the top of vacuum chamber 110; And infrabasal plate 130, it is installed on the bottom of vacuum chamber 110.
At the following operation that will describe above-mentioned substrate unit equipment of the present invention (with reference to Fig. 3 A to 3F and Fig. 4).
At first, as shown in Fig. 3 A, under atmosphere pressure state, last substrate P1 and subtegulum P2 are absorbed by upper substrate 120 and infrabasal plate 130 respectively.At this, the encapsulant S with appointed thickness is applied in the edge of the upper surface of subtegulum P2 (the step S1 of Fig. 4).
Afterwards, as shown in Fig. 3 B, gate valve 111 be changed to the medium vacuum state the position so that the inside of vacuum chamber 110 be maintained at 500 the holder the medium vacuum states under.At this, because upper and lower substrate P1 and P2 absorb by upper and lower substrate 120 and 130 respectively under low vacuum state, although the inside of vacuum chamber 110 is under the medium vacuum state, upper and lower substrate P1 and P2 are not separated from upper and lower substrate 120 and 130 yet.Therefore, different with the substrate unit equipment of routine, substrate unit equipment of the present invention is without any need for additional substrate container.Then, the alignment device 131 of infrabasal plate 130 is operated with aligning subtegulum P2, thereby makes subtegulum P2 parallel with last substrate P1 (the step S2 of Fig. 4).
As shown in Fig. 3 C, the substrate falling apparatus (not shown) of upper substrate 120 is operated to discharge the absorption of last substrate P1 and to make substrate P1 owing to gravity descends.By the decline that causes owing to gravity, last substrate P1 is attached to the encapsulant S of the upper surface that imposes on subtegulum P2, and is fixed in subtegulum P2 (the step S3 of Fig. 4).
Afterwards, as shown in Fig. 3 D, the gate valve 111 of vacuum chamber 110 is positioned at the position that is used for atmosphere pressure state.Therefore, the inside of vacuum chamber 110 becomes the atmosphere pressure state of 760 holders.Because the inner space that is formed by last substrate P1 that adheres to mutually by using encapsulant S and subtegulum P2 is under the 500 medium vacuum states that hold in the palm, adhesion is forced on upper and lower substrate P1 and the P2 by means of the pressure differential between upper and lower substrate P1 and P2 inside and outside.In other words, the height of encapsulant S is lowered and the width of encapsulant S is increased, and has increased the contact area between last substrate P1 and the subtegulum P2 thus, and has sealed the inside (the step S4 of Fig. 4) between upper and lower substrate P1 and the P2 thus.In other words,, compare with routine techniques thus, had the simple structure of equipment and the low production cost of product according to the expansion platform (stage) that the substrate combination technique of working pressure difference of the present invention need not used in routine techniques.
Afterwards, as shown in Fig. 3 E, the gate valve 111 of vacuum chamber 110 is positioned at the position that is used for barotropic state.In other words, the inside of vacuum chamber 110 becomes barotropic state (1,500 holder) to increase through the pressure differential between the upper and lower substrate P1 of combination and P2 inside and outside, improves the combination (the step S5 of Fig. 4) of upper and lower substrate P1 and P2 thus.
At last, as shown in Fig. 3 F, the gate valve 111 of vacuum chamber 110 is positioned at the position that is used for atmosphere pressure state.Then, through the upper and lower substrate P1 and the P2 outside (the step S6 of Fig. 4) that is discharged to vacuum chamber 110 of combination.
＜the second embodiment 〉
As shown in Figure 5, the substrate unit equipment 200 according to second embodiment of the invention comprises: vacuum chamber 210, upper substrate 220, infrabasal plate 230, vacuum plant 240, substrate falling apparatus (not shown) and pressure recovery device 260.
The vacuum chamber 210 that is used to form vacuum atmosphere is formed in the main body of substrate unit equipment 200.Sealed so that the vacuum atmosphere of vacuum chamber 210 is formed on wherein, and is opened so that substrate is entered into vacuum chamber 210.
Be used for making the substrate of on upper substrate 220, installing owing to the substrate falling apparatus (not shown) that gravity descends is installed in vacuum chamber 210.The substrate falling apparatus is used for adhering in advance substrate S1 and subtegulum S2.The substrate falling apparatus makes substrate S1 drop to subtegulum S2, causes adhering in advance last substrate S1 and subtegulum S2 thus.Because encapsulant is applied in the edge to subtegulum S2, last substrate S1 drops to the upper surface of subtegulum S2, is attached to subtegulum S2 thus.In this embodiment, electrostatic chuck or vacuum draw chuck are installed on the upper substrate 220, and power shutoff unit or vacuum absorption cutting unit are used as the substrate falling apparatus.In other words, substrate falling apparatus rupturing duty, its generation is used for absorbing the absorbability of going up substrate S1 by upper substrate 220, perhaps cuts off absorbability, and it is produced to cut off vacuum absorption power by vacuum pump.
In the process of combination substrate, importantly keep the depth of parallelism between the upper and lower substrate to increase the quality of panel.In this embodiment, substrate is attached to each other in advance so that the seal cavity between the upper and lower substrate is formed, the pressure of substrate outside then, and promptly the pressure of internal vacuum chamber is increased, thus by using pascal's principle that pressure is imposed on upper and lower substrate.Therefore, uniform power is imposed on all surface of upper and lower substrate, allow upper and lower substrate under the condition of keeping the depth of parallelism between it, to be made up mutually thus by means of the pressure differential between upper and lower substrate inside and outside.When the pressure differential more than using imposed on upper and lower substrate S1 and S2 with pressure, as shown in Figure 6, power was applied in to upper and lower on-chip any point uniformly.Therefore, kept equably through the upper and lower substrate S1 of combination and the interval between the S2.
At this, pressure recovery device 260 is configured to make it that gas stably is fed in the vacuum chamber 210.Therefore, the substrate unit equipment with pressure recovery device 260 does not need to be used for the pressure of vacuum chamber 210 is returned to any attachment device of atmospheric pressure.
Preferably, the substrate unit equipment 200 of this embodiment further comprises alignment device 270, is used to aim at by positions last or infrabasal plate 220 or 230 substrates of drawing.As shown in Figure 5, alignment device 270 moves infrabasal plate 230, proofreaies and correct the position of the subtegulum S2 that installs on infrabasal plate 230 thus.Therefore, alignment device 270 changes the relative position of subtegulum S2 with respect to last substrate S1, make the position of upper and lower substrate S1 and S2 consistent with each other thus.At this, alignment device 270 is mobile infrabasal plate 230 on the horizontal direction parallel with substrate.Last substrate S1 mobile on the vertical direction vertical with substrate realized by vertical drive 280.
Be subjected to the help of sighting device 290 by the correction to subtegulum S2 position of alignment device 270 realizations.Sighting device 290 uses the mark that forms on the edge of upper and lower substrate S1 and S2 to determine whether the position of upper and lower substrate S1 and S2 is consistent with each other in vertical direction by observation panel, and described observation panel forms so that observe the inside of vacuum chamber 210 by the top of vacuum chamber 210.When the position of determining upper and lower substrate S1 and S2 was mutually internally inconsistent, alignment device 270 was driven, and makes the position of upper and lower substrate S1 and S2 consistent with each other thus.
In the substrate combined method of describing hereinafter with reference to Fig. 7 according to this embodiment.Fig. 7 is the process flow diagram of explanation according to the substrate combined method of this embodiment of the present invention.
At first, last substrate S1 and subtegulum S2 are installed in respectively on upper substrate 220 and the infrabasal plate 230 (step S210).At this moment, vacuum chamber 210 is opened, and last substrate S1 and subtegulum S2 are supplied to upper substrate 220 and infrabasal plate 230 respectively by the haulage equipment (not shown), and is absorbed into respectively on upper and lower substrate 220 and 230.
Afterwards, preferably, the position of upper and lower substrate S1 and S2 is corrected (step S220).When the position of upper and lower substrate S1 and S2 was consistent with each other in vertical direction, this step was unnecessary, but was necessary when the position of upper and lower substrate S1 and S2 is in vertical direction mutually internally inconsistent.When the position of upper and lower substrate S1 and S2 was in vertical direction mutually internally inconsistent, the position of subtegulum S2 was corrected so that the position of upper and lower substrate S1 and S2 is consistent with each other.
Then, the inside of vacuum chamber 210 is evacuated (step S230).At this moment, it is airtight that vacuum chamber 210 is become, and use vacuum plant 240 with the gaseous emission in the vacuum chamber 210 to the outside so that the pressure in the vacuum chamber 210 be lowered.
Upper and lower substrate S1 and S2 are attached to each other (step S240) in advance.At this moment, upper and lower substrate S1 and S2 temporarily are attached to each other.In this embodiment, be installed in last substrate S1 on the upper substrate 220, and be attached to the subtegulum S2 that on infrabasal plate 230, installs in advance owing to gravity lowers.
Afterwards, upper and lower substrate S1 and the S2 that is attached in advance each other firmly made up (step S250) each other.At this moment, pressure is applied in to the upper and lower substrate S1 and the S2 that are attached in advance each other, firmly makes up upper and lower substrate S1 and S2 thus so that upper and lower substrate S1 and S2 are not separated each other.In this embodiment, the pressure in the vacuum chamber 210 is increased, and upper and lower substrate S1 and S2 are by the pressure differential between upper and lower substrate S1 and S2 inside and outside and firmly made up mutually.At this moment, preferably, the pressure that inside returned to of vacuum chamber 210 is atmospheric pressures.Atmospheric pressure is removed easily, and without any need for other step, this is because upper and lower substrate S1 that will finish afterwards and the unloading of S2 realize under atmospheric pressure.
＜the three embodiment 〉
As shown in Figure 8, the substrate unit equipment 300 according to the 3rd embodiment comprises vacuum chamber 310, upper substrate 320, infrabasal plate 330, vacuum plant 340, composite set 360, alignment device 370 and sighting device 380.
The vacuum chamber 310 of the substrate unit equipment 300 of this embodiment is configured to make at least two last substrates and at least two subtegulums to be inserted into wherein.In other words, the yardstick of vacuum chamber 310 infrabasal plate 330 that is extended to the upper substrate 320 that is used at least two substrates of installation and is used for installing at least two substrates can be placed on vacuum chamber 310.
After upper and lower substrate S1 and S2 were entered into vacuum chamber 310 and be installed on the upper and lower substrate 320 and 330 of vacuum chamber 310, vacuum plant 340 was removed gases by suction from vacuum chamber 310, thereby makes the inside of vacuum chamber 310 be in vacuum atmosphere.Vacuum plant 340 can adopt dried pump, TMP or mechanical booster pump.
Composite set 360 is used for firmly making up upper and lower substrate S1 and the S2 that is adhered in advance each other.In this embodiment, composite set 360 is pressure recovery devices, it increases the pressure in the vacuum chamber 310 than the height of the inner space that is formed by upper and lower substrate S1 and S2 by gas being injected in the vacuum chamber 310, firmly makes up upper and lower substrate S1 and S2 thus.In other words, after upper and lower substrate S1 and S2 were adhered to each other in advance, composite set 360 was injected in the vacuum chamber 310 air or inert gas to increase the pressure in the vacuum chamber 310.Then, because the height of the inside of the upper and lower substrate S1 of pressure ratio of the outside of upper and lower substrate S1 and S2 and S2, identical pressure is applied in all surface to upper and lower substrate S1 and S2.Therefore, upper and lower substrate S1 and S2 are combined under the condition of evenly keeping the interval between upper and lower substrate S1 and the S2.At this moment, preferably, the pressure that vacuum chamber returned to is atmospheric pressure.Atmospheric pressure allows to be discharged to the outside and to need not any other step through the substrate of combination.
Preferably, the substrate unit equipment 300 of this embodiment further comprises sighting device 380, and it is formed the specified portions by vacuum chamber 310 upper surfaces, thereby allows the user to observe the upper and lower substrate that is absorbed in upper and lower substrate 320 and 330.At this, sighting device 380 is configured to make the user to see all substrates of installing on upper and lower substrate 320 and 330 by it.In other words, sighting device 380 is configured to make upper and lower substrate 320 and 330 to be scanned separately by the part that is divided into several sections virtually and divided.Therefore, the upper and lower substrate 320 of upper and lower substrate S1 and S2 and 330 part have been installed on it have been divided into several virtual parts, and sighting device 380 is mounted respectively on several virtual parts.
The substrate unit equipment 300 of this embodiment further comprises the control module (not shown).Control module drives alignment device 370 so that the position consistency of the position of substrate S1 and the first subtegulum S2 on first, control upper substrate 320 so that on first substrate owing to gravity drops to the first subtegulum S2, drive alignment device 370 once more so that the position consistency of the position of substrate S1 and the second subtegulum S2 on second, control upper substrate 320 then so that on second substrate be disassembled from upper substrate 320.Control module control makes that with upper-part above process is carried out successively, and upper and lower substrate S1 of all in vacuum chamber 310 and S2 are adhered to mutually in advance.After the upper and lower substrate of in vacuum chamber all was adhered to mutually in advance, control module drove composite set 360 so that made up mutually simultaneously by all upper and lower substrate S1 in the vacuum chamber 310 that adheres in advance mutually and S2.
Hereinafter with reference to Fig. 9 and Figure 10 A the substrate combined method of using substrate unit equipment 300 according to this embodiment is being described to 10D.
At first, last substrate S1 and subtegulum S2 are installed in respectively on upper substrate 320 and the infrabasal plate 330 (step S310).At this moment, the upper and lower substrate S1 of equal number and S2 are installed in respectively on upper and lower substrate 320 and 330, and promptly at least two upper and lower substrate S1 and S2 are installed in respectively on upper and lower substrate 320 and 330.
Afterwards, the inside of vacuum chamber 310 is evacuated (step S320).In other words, finish upper and lower substrate S1 and S2 be installed in upper and lower substrate 320 and 330 after, it is airtight that vacuum chamber 310 is become, and the gas in the vacuum chamber 310 is discharged into the outside by suction so that the pressure in the vacuum chamber 310 is lowered.
Then, upper and lower substrate S1 and S2 are attached to each other (step S330) in advance.At this moment, on being installed in upper substrate 320 on substrate S1 the position be installed in after the position consistency of the subtegulum S2 on the infrabasal plate 330, upper and lower substrate S1 and S2 temporarily are attached to each other.In this embodiment, because at least two upper and lower substrate S1 and S2 are attached to each other in advance, this step S330 is divided into as Figure 10 A to several sub-steps as shown in the 10D.At first, as shown in Figure 10 A, the position for the treatment of the upper and lower substrate S1 of mutually combination and S2 is corrected so that go up the position of substrate S1 and the position consistency of subtegulum S2, and upper and lower then substrate S1 and S2 are attached to each other in advance.In other words, use sighting device to observe under the condition of the position of substrate S1 and the first subtegulum S2 on first, using alignment device to make on first the position of substrate S1 and the first subtegulum S2 consistent with each other.Then, as shown in Figure 10 B, substrate S1 and is attached to first subtegulum owing to gravity descends on first.
Afterwards, adhering to of ensuing upper and lower substrate is carried out.At this moment, because the first upper and lower substrate is adhered to mutually, the variation of the position of the upper and lower substrate through adhering on the infrabasal plate 330 is inessential.Therefore, as shown in Figure 10 C, might freely proofread and correct the position of the second upper and lower substrate S1 and S2.Afterwards, as shown in Figure 10 D, substrate S1 and is attached to the second subtegulum S2 owing to gravity lowers on second.More than adhere to according to being repeated continuously with the ratio of the quantity of upper and lower substrate S1 that on upper and lower substrate 320 and 330, installs and S2.
Afterwards, upper and lower substrate S1 and the S2 that is attached in advance each other made up (step S340) mutually.At this moment, pressure is applied in to the upper and lower substrate S1 and the S2 that are attached in advance each other, firmly makes up upper and lower substrate S1 and S2 thus.In this embodiment, the pressure in the vacuum chamber 310 is increased, and upper and lower substrate S1 and S2 are by the pressure differential between upper and lower substrate S1 and S2 inside and outside and firmly made up mutually.At this moment, in this embodiment, all upper and lower substrates that are attached to are in advance each other made up simultaneously mutually.Therefore, might simultaneously a plurality of upper and lower substrates be made up mutually by single step.
As conspicuous from the above description, the invention provides substrate unit equipment and method, wherein simple and cheap structure is obtained, and substrate is made up effectively to reduce production cost of products, and the pressure that is used to make up substrate is freely regulated.
In according to substrate unit equipment of the present invention and method, pressure is not to impose on upper and lower substrate through adhering in advance by the mechanical hook-up that uses in conventional substrate combined method, but by using pressure differential between upper and lower substrate inside and outside to impose on upper and lower substrate through adhering in advance.In other words, as shown in Figure 6, identical pressure is applied in any point to upper and lower substrate S1 and S2.Therefore, the interval between the upper and lower substrate that makes up mutually by identical pressure is kept equably.Therefore, might produce and have high-quality panel, wherein the depth of parallelism of upper and lower substrate is kept.
This substrate unit equipment is without any need for additional mechanical hook-up, and only needs the pressure recovery device, is used for the pressure of described chamber is returned to atmospheric pressure, has simple configuration thus and produced easily.
After the combination of keeping upper and lower substrate, the pressure in the described chamber is changed to atmospheric pressure, is discharged to the outside of chamber then through the upper and lower substrate of combination.Because the inside of chamber is under the atmospheric pressure when making up upper and lower substrate with substrate combined method of the present invention, the advantage of substrate unit equipment of the present invention and method is to make up the time that upper and lower substrate spends and is shortened.
Because the combination simultaneously by single step of a plurality of upper and lower substrates, the advantage of substrate unit equipment of the present invention and method are to make up the time that each upper and lower substrate spends and are shortened.
Although disclose the preferred embodiments of the present invention for illustrative purposes, it will be apparent to one skilled in the art that the various modifications, interpolation and the replacement that do not break away from as being disclosed the spirit and scope of the present invention in the claims are possible.
Claims (8)
1. substrate unit equipment comprises:
Vacuum chamber, at least two last substrates and at least two subtegulums can be inserted into wherein;
The upper substrate that provides on the top of internal vacuum chamber is used for installing at least two thereon and goes up substrates and do not have overlapping and dismantle substrate separably from it;
The infrabasal plate that provides on the bottom of internal vacuum chamber is used at least two subtegulums are installed thereon and does not have overlapping;
The substrate position means for correcting, be used to proofread and correct on installing on last or the infrabasal plate or the position of subtegulum so that the position of upper and lower substrate is consistent with each other;
Vacuum plant is used for forming vacuum state at vacuum chamber; And
Composite set is used on relative direction pressure being imposed on upper and lower substrate so that upper and lower substrate is made up mutually.
2. the substrate unit equipment of claim 1 further comprises control module, is used for:
Drive the substrate position means for correcting so that the position consistency of position of going up substrate and corresponding subtegulum, and the control upper substrate is so that go up substrate and drop to and have and be somebody's turn to do the upward subtegulum of substrate consistent location;
In vacuum chamber, also have under the situation of other substrates, drive the substrate position means for correcting once more so that the ensuing position and the position consistency of ensuing subtegulum of going up substrate, and the control upper substrate is so that go up substrate and drop to and have and the last subtegulum of substrate consistent location; And
After the upper and lower substrate of in vacuum chamber all is adhered to each other in advance, drive composite set so that all upper and lower substrates through adhering to are in advance made up simultaneously mutually.
3. the substrate unit equipment of claim 2, wherein composite set is the pressure recovery device, be used for increasing the pressure in the vacuum chamber than the pressure height of the inner space that forms by upper and lower substrate, make up upper and lower substrate thus by gas being injected into vacuum chamber.
4. the substrate unit equipment of claim 2, wherein control module is the substrate removable unit, it is provided on the upper substrate, is used to control upper substrate, makes that going up substrate is disassembled from upper substrate.
5. claim 1 or 2 substrate unit equipment further comprise sighting device, and the specified portions that it is formed by the upper surface of vacuum chamber is used for observing separably each upper and lower substrate of installing on upper and lower substrate.
6. method that is used for the substrate of combination of liquid crystals panel may further comprise the steps:
(a) substrate is inserted in the vacuum chamber, and will two goes up substrates and at least two subtegulums at least and be installed in respectively on the upper and lower substrate and do not have overlapping;
(b) in vacuum chamber, form vacuum state;
(c) make install on the upper substrate each on the substrate subtegulum corresponding and adhere to upper and lower substrate in advance owing to gravity drops to; And
(d) increase in the described vacuum chamber pressure so that the upper and lower substrate through adhering in advance made up mutually.
7. the method for the substrate of the combination of liquid crystals panel of claim 6, wherein in step (c), position by proofreading and correct upper and lower substrate is to a unification of going up the position of substrate and corresponding subtegulum, and by making substrate drop to corresponding subtegulum, according to being repeated successively with the ratio of the quantity of the upper and lower substrate of in vacuum chamber, installing to the adhering in advance of upper and lower substrate.
8. the method for the substrate of the combination of liquid crystals panel of claim 6, wherein in step (d), the pressure in the vacuum chamber is increased so that the combination mutually by the pressure differential between the upper and lower substrate through adhering in advance inside and outside of upper and lower substrate.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020030083672A KR100477121B1 (en) | 2003-11-24 | 2003-11-24 | Panel combining device and method thereof |
| KR1020030083672 | 2003-11-24 | ||
| KR1020040065455 | 2004-08-19 | ||
| KR1020040066011 | 2004-08-20 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100916531A Division CN100373240C (en) | 2003-11-24 | 2004-11-24 | Substrate combination apparatus and method therefor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101126856A CN101126856A (en) | 2008-02-20 |
| CN100526949C true CN100526949C (en) | 2009-08-12 |
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ID=37387122
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB200710151646XA Expired - Fee Related CN100526949C (en) | 2003-11-24 | 2004-11-24 | Panel combining device and method thereof |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR100477121B1 (en) |
| CN (1) | CN100526949C (en) |
-
2003
- 2003-11-24 KR KR1020030083672A patent/KR100477121B1/en not_active IP Right Cessation
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2004
- 2004-11-24 CN CNB200710151646XA patent/CN100526949C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN101126856A (en) | 2008-02-20 |
| KR100477121B1 (en) | 2005-03-21 |
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