CN100525581C - Method for manufacturing the lamination porcelain base board - Google Patents
Method for manufacturing the lamination porcelain base board Download PDFInfo
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- CN100525581C CN100525581C CNB2006100018829A CN200610001882A CN100525581C CN 100525581 C CN100525581 C CN 100525581C CN B2006100018829 A CNB2006100018829 A CN B2006100018829A CN 200610001882 A CN200610001882 A CN 200610001882A CN 100525581 C CN100525581 C CN 100525581C
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- ceramic substrate
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- substrate unit
- sintering
- crystal grain
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Abstract
The disclosed manufacture method for lamination ceramic base comprises: stacking multiple Al2O3 ceramic base units together, setting an oxide media layer growing into grain when sintering between units; then, sintering the stack units with media layer to grow grain, wherein the said grown grain enters pore on base unit surface to combine with oxide layer.
Description
Technical field
The present invention relates to a kind of method of making laminated ceramic substrate, relate in particular to a kind of fixed size of guaranteeing the laminated ceramic substrate whole unit of sintering, and significantly reduce the manufacture method of the laminated ceramic substrate of production process, reduction cost of manufacture and fraction defective.
Background technology
Thick film mixes layer circuit and is printed on the surface of individual layer or laminated ceramic substrate or inner, and its employed material has: baseplate material, electric conducting material, resistance material, dielectric material, and assembling and encapsulation with material etc.The thick film of individual layer mixes layer line road employing back burning formula and electronic circuit is fired on ceramic substrate.The ceramic substrate of lamination then burns till electronic circuit and baseplate material simultaneously with co-fired type (cofire).
For the unit intensity that increases chip on the substrate, lower the length that connects chip conductors, and lower internetwork capacity effect, improve the performance and the reliability thereof of circuit, and can reach the requirement of electronic product lightweight and miniaturization, so laminated substrate module (Multi-layer Modulus) is used widely.Pottery laminated substrate module system makes the required multilayer of module with the lamination thick film technology of maturation and gives birth to the blastema plate, the living blastema plate of multilayer is burnt altogether to form again.And comply with the difference of the firing temperature that uses, and the processing procedure of ceramic laminated substrate module can be divided into 1000 ℃ of high temperature (〉) common burning porcelain technology (HTCC) and low temperature (＜1000 ℃) common burning porcelains (LTCC) technology.
Existing manufacturing with the laminated ceramic substrate that mixes layer circuit as shown in Figure 1, has the following step:
(1) ceramic raw material is mixed and grinds to form the grinding steps 101 of attritive powder;
(2) deaeration step 102 of bubble in the removal gained pottery attritive powder;
(3) with the step 103 of ceramic attritive powder moulding;
(4) ceramic attritive powder formed body punch die is become the punch die step 104 that ceramic substrate is given birth to the embryo thin slice;
(5) give birth on the embryo thin slice in different ceramic substrates, utilize printing or etching technique, form the step 105 of circuit layout pattern (Layout pattern);
(6) most ceramic substrates that will have the circuit layout pattern are given birth to the upper and lower storehouse of embryo thin slice together, and give the step 106 of pressing;
(7) laminated ceramic substrate is given birth to the step 107 that the embryo thin slice cuts out the identical unit substrate of size;
(8) laminated ceramic substrate that will form line of cut is given birth to the step 108 that the embryo thin slice carries out sintering;
(9) laminated ceramic substrate of check sintering gives birth to whether the embryo thin slice is the checking procedure 109 of non-defective unit;
(10) measure the size of the non-defective unit laminated ceramic substrate of sintering, and the step of being revised 110;
(11) check the step 111 of the characteristic of the qualified laminated ceramic substrate of size again;
(12) last, promptly get lamination co-fired ceramic substrate 112.
Tradition laminated substrate module is made with the High Temperature Co Fired Ceramic technology, and its baseplate material is mainly at least 96% aluminium oxide.Because it must burn till under at least 1400 ℃ hot conditions, its employed conductor material is mainly electric conducting materials such as tungsten or platinum; Very easily oxidized, and make substrate under the reducing atmosphere of hydrogen-oxygen, generate sintering.Compared to High Temperature Co Fired Ceramic (HTCC) and thick film processing procedure, LTCC is more suitable for the manufacturing of high density and high-speed laminated substrate module of producing.The laminated substrate module system of easy fired is a baseplate material with the oxide mixture of glass and aluminium oxide or cordierite, can burn till under low temperature (＜1000 ℃) and the general atmosphere relatively.Traditional resistance and electric conducting material can be used in the laminated substrate module of easy fired, electronics passive components such as lead, resistance and electric capacity can be imbedded in the laminated ceramic substrate, or directly fire at substrate surface, to increase circuit and component density and to save the space and use, to reach the purpose of dwindling substrate size for driving component.
Yet, the manufacture method of above-mentioned existing laminated ceramic substrate, because its substrate system burns till to give birth to embryo, quite expend Production Time and formality, cause work flow numerous and diverse, cost significantly increases, and to give birth to the mode that embryo burns till, cause the size of laminated ceramic substrate to differ easily, the end properties instability.
The inventor is because the shortcoming of above-mentioned prior art, be engaged in the manufacturing experience and the technology accumulation of various ceramic substrates according to it, method at the various solutions of the concentrated research of above-mentioned disappearance, after through constantly research, experiment and improvement, finally development and Design goes out the invention of the method for a kind of brand-new manufacturing laminated ceramic substrate of the present invention, in the hope of the disappearance that prior art produced of forgoing.
Summary of the invention
The objective of the invention is to by providing a kind of method of making laminated ceramic substrate, the homogeneous of the laminated ceramic substrate multilager base plate size that sintering forms to guarantee, and the program and the cost of significantly reduction making.
The present invention adopts following technological means to realize:
A kind of method of making laminated ceramic substrate, this method comprises the following steps:
(a) fire majority with the ceramic substrate unit cooked flake of alumina material formation and with laser processing technology, make cooked flake formation can obtain the state of the identical unit substrate of most sizes;
(b) etching or printing have the layout pattern of electronic building bricks such as lead, resistance or electric capacity or circuit on the constituent parts substrate;
(c) together, and between described two ceramic substrate unit cooked flakes, be laid with a medium of oxides layer that can generate crystal grain with the described upper and lower storehouse of ceramic substrate unit cooked flake that is formed with electronic building brick or circuit layout pattern; And
(d) the storehouse ceramic substrate unit that again this is folded with the medium of oxides layer carries out sintering, makes the effect of the crystal grain that two ceramic substrate unit cooked flakes are grown because of the medium of oxides layer, with the medium of oxides layer mutually closely firm combining become one.
Above-mentioned sintering temperature is no more than 1200 ℃.
The above-mentioned medium of oxides series of strata that generate crystal grain can generate crystal grain below 1200 ℃ during sintering.
The material of aforesaid ceramic substrate unit is alundum (Al (Al
2O
3).
This method can also adopt the following step to realize:
(A) fire most ceramic substrate unit cooked flakes that constitute with alumina material;
(B) together, and between two ceramic substrate unit, be laid with a medium of oxides layer that can the mat sintering generates crystal grain with the upper and lower storehouse of described ceramic substrate unit cooked flake of majority; And
(C) the described ceramic substrate unit cooked flake that is laid with the storehouse of medium of oxides layer is carried out sintering, the crystal grain that two ceramic substrate unit cooked flakes are generated because of the medium of oxides layer of being laid, and closely firmly be combined into one with the generation of medium of oxides layer.
Aforementioned sintering temperature is no more than 1200 ℃.
The aforementioned medium of oxides series of strata that this can generate crystal grain can generate crystal grain below 1200 ℃ during sintering.
The method of aforesaid manufacturing laminated ceramic substrate, the material of described ceramic substrate unit is alundum (Al (Al
2O
3).
The present invention compared with prior art has remarkable advantages and beneficial effect:
The mode of manufacturing laminated ceramic substrate of the present invention, do not need numerous and diverse work flow, therefore can significantly reduce production costs, and adopt the mode of the ceramic substrate unit sintering of non-living embryo, produce the variation of size when the ceramic substrate unit can be because of sintering, can produce stable laminated ceramic substrate unit, the yield of laminated ceramic substrate unit is significantly improved.
Description of drawings
Fig. 1 is the existing flow chart of making the method for laminated ceramic substrate;
Fig. 2 is the flow chart of one embodiment of the invention;
Fig. 3 is in the cooked flake surface of electron microscope gained manufacture method of the present invention phase I method for making gained structure;
Fig. 4 is that the laminated ceramic substrate of manufacture method gained of the present invention constitutes schematic diagram;
Fig. 5 is the formation decomposing schematic representation in the laminated ceramic substrate of manufacture method gained of the present invention;
Fig. 6 is the cross-sectional configuration schematic diagram of laminated ceramic substrate of the present invention.
Embodiment
Below in conjunction with accompanying drawing specific embodiments of the invention are illustrated:
See also shown in Figure 2, the method for the manufacturing laminated ceramic substrate of the first embodiment of the present invention, the manufacturing of reaching laminated ceramic substrate with two stages, narration as back:
Phase I: the preparation of cooked flake;
Step 1 (201): at first, ceramic raw material is planted milling apparatus with ball mill or he, ceramic raw material is ground and fine powder, preferable ceramic raw material is that minimized content reaches 96% alundum (Al (Al
2O
3), its characteristic is shown in table table one;
Step 2 (202): utilize technology such as oven dry, the bubble in the ceramic attritive powder of removal above-mentioned steps 1 gained;
Step 3 (203): the ceramic attritive powder of removing bubble of above-mentioned steps 2 gained is mixed stirring with organic bond, and give and spreading on a substrate film, green compact are shaped to the green thin slice;
Step 4 (204): utilize mould, the green thin slice punching press of above-mentioned steps 3 gained become the certain lamellar body of size, and substrate is given birth to embryo;
Step 5 (205): with suitable temperature the substrate of above-mentioned steps 4 gained is given birth to embryo, in sintering furnace, carry out sintering, and get the slaking plate;
Step 6 (206):, make its surperficial roughness even, and form many holes, in order to the formation of following second stage laminated ceramic substrate with the slaking plate surface sand-blasting of above-mentioned steps 5 gained.
Step 7 (207): the slaking plate to the even surface roughness of above-mentioned steps 6 gained is revised, test simultaneously, make its size accurate, quality is closed in requiring, be the method for making of second stage of the present invention, form the desired cooked flake of laminated ceramic substrate (ceramic substrate unit);
The cooked flake of above-mentioned phase I gained, as shown in Figure 3, the intercrystalline that it is surperficial forms many hole A, so help the formation of second stage ceramic substrate.
Below refer again to Fig. 2～Fig. 6, the method for the manufacturing laminated ceramic substrate of narration second stage.
Second stage: the formation of laminated ceramic substrate;
Step 8 (208):,, cut out the unit substrate 12 of a plurality of identical sizes that can separate with technology such as laser processings to the ceramic substrate unit (cooked flake) 11 of phase I gained;
Step 9 (209): on the ceramic substrate unit (cooked flake) 11 that is formed with unit substrate 12 cutting lines, utilize methods such as light shield etching, printing, form layout (Layout) design layer (pattern) of electronic building brick such as lead, resistance or electric capacity or electronic circuit;
Step 10 (210): will be formed with most ceramic substrates unit 11 upper and lower storehouses of electronic building brick design layer, and between these ceramic substrate unit 11,, can generate the medium of oxides layer 13 of crystal grain when being folded with a sintering with methods such as coatings;
Step 11 (211): the unit substrate 11 of storehouse that can generate the medium of oxides layer 13 of crystal grain in the time of will being folded with sintering again, in sintering furnace, carry out sintering, the effect that the crystal grain that upper and lower unit substrate 11 is grown because of medium of oxides layer 13 enters its surface microstructure gap, and closely firmly be together with each other with dielectric layer 13 respectively;
Step 12 (212): through checking the binding characteristic of its ceramic substrate unit 11, promptly form a laminated ceramic substrate that conforms with demand again.
As above-mentioned, the mode of manufacturing laminated ceramic substrate of the present invention does not need numerous and diverse work flow, therefore can significantly reduce production costs, and adopt the mode of the ceramic substrate unit sintering of non-living embryo, produce the variation of size when ceramic substrate unit 11 can be because of sintering, can produce stable laminated ceramic substrate unit, the yield of laminated ceramic substrate unit is significantly improved.
In the above-described embodiments, respectively on this unit substrate 12 the electronic building brick patterns such as lead, resistance or electric capacity of institute's etching or printing can be and mix a layer circuit (hybrid circuit).
In the above-described embodiments, this medium of oxides layer 13 is a low-temperature sintering (below 1000 a ℃) medium, and described ceramic substrate unit 11 then can be alundum (Al (Al
2O
3) cooked flake of material; When the base board unit 11 of storehouse carries out sintering, utilize the crystal grain of medium of oxides layer 13 to generate, and enter ceramic substrate unit 11 surface microstructures between the gap, can making respectively, these base board unit 11 lip-deep formation crystal grain combine formation one tight firm laminated ceramic substrate 14 with the crystal grain generation that medium of oxides is generated.
In the another embodiment of the present invention, because the visual different needs of laminated ceramic substrate, and multiple different structure is arranged, also can not on surface, ceramic substrate unit (cooked flake), form electronic circuit layout pattern, therefore, in the method for the manufacturing laminated ceramic substrate of above-mentioned first embodiment, not on ceramic substrate unit 11, form electronic circuit layout pattern if omit step (209), promptly become another embodiment of the present invention.
Table one
It should be noted that at last: above embodiment only in order to the explanation the present invention and and unrestricted technical scheme described in the invention; Therefore, although this specification has been described in detail the present invention with reference to each above-mentioned embodiment,, those of ordinary skill in the art should be appreciated that still and can make amendment or be equal to replacement the present invention; And all do not break away from the technical scheme and the improvement thereof of the spirit and scope of invention, and it all should be encompassed in the middle of the claim scope of the present invention.
Claims (8)
1, a kind of method of making laminated ceramic substrate, it is characterized in that: this method comprises the following steps:
(a) fire a plurality of ceramic substrate unit cooked flakes that constitute with alumina material and, make cooked flake form the state that can obtain the identical unit substrate of a plurality of sizes with laser processing technology;
(b) etching or be printed with the layout pattern of lead, resistance or electric capacity electronic building brick or circuit on the constituent parts substrate;
(c) together, and between described two ceramic substrate unit cooked flakes, be laid with a medium of oxides layer that can become germination with the described upper and lower storehouse of ceramic substrate unit cooked flake that is formed with electronic building brick or circuit layout pattern; And
(d) the storehouse ceramic substrate unit that again this is folded with the medium of oxides layer carries out sintering, makes the effect of the crystal grain that two ceramic substrate unit cooked flakes are grown because of the medium of oxides layer, with the medium of oxides layer mutually closely firm combining become one.
2, the method for manufacturing laminated ceramic substrate according to claim 1 is characterized in that: sintering temperature is no more than 1200 ℃.
3, the method for manufacturing laminated ceramic substrate according to claim 1 is characterized in that: these medium of oxides series of strata that can generate crystal grain can generate crystal grain when sintering below 1200 ℃.
4, the method for manufacturing laminated ceramic substrate according to claim 1 is characterized in that: the material of described ceramic substrate unit is an alundum (Al.
5, a kind of method of making laminated ceramic substrate, it is characterized in that: this method comprises the following steps:
(A) fire a plurality of ceramic substrate unit cooked flakes that constitute with alumina material;
(B) together, and between two ceramic substrate unit, be laid with a medium of oxides layer that can generate crystal grain by sintering with the upper and lower storehouse of a plurality of described ceramic substrates unit cooked flake; And
(C) the described ceramic substrate unit cooked flake that is laid with the storehouse of medium of oxides layer is carried out sintering, the crystal grain that two ceramic substrate unit cooked flakes are generated because of the medium of oxides layer of being laid, and closely firmly be combined into one with the generation of medium of oxides layer.
6, the method for manufacturing laminated ceramic substrate according to claim 5 is characterized in that: sintering temperature is no more than 1200 ℃.
7, the method for manufacturing laminated ceramic substrate according to claim 5 is characterized in that: these medium of oxides series of strata that can generate crystal grain can generate crystal grain when sintering below 1200 ℃.
8, the method for manufacturing laminated ceramic substrate according to claim 5 is characterized in that: the material of described ceramic substrate unit is an alundum (Al.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100018829A CN100525581C (en) | 2006-01-25 | 2006-01-25 | Method for manufacturing the lamination porcelain base board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100018829A CN100525581C (en) | 2006-01-25 | 2006-01-25 | Method for manufacturing the lamination porcelain base board |
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|---|---|
| CN101009975A CN101009975A (en) | 2007-08-01 |
| CN100525581C true CN100525581C (en) | 2009-08-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100018829A Expired - Fee Related CN100525581C (en) | 2006-01-25 | 2006-01-25 | Method for manufacturing the lamination porcelain base board |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103295914B (en) * | 2012-02-29 | 2018-01-16 | 深圳光启高等理工研究院 | A kind of Meta Materials based on ceramic substrate and preparation method thereof |
| CN103414096A (en) * | 2013-08-13 | 2013-11-27 | 安徽环巢光电科技有限公司 | Method for manufacturing laser resonant cavity |
| CN105043605B (en) * | 2015-07-06 | 2018-07-17 | 中北大学 | A kind of passive pressure sensing head based on HTCC technologies |
| CN110493979A (en) * | 2019-08-08 | 2019-11-22 | 苏州山人纳米科技有限公司 | 3-dimensional multi-layered circuit ceramic substrate fast preparation method |
| CN112074106A (en) * | 2020-09-07 | 2020-12-11 | 中国振华集团云科电子有限公司 | High-precision alignment stacking method for multilayer heterogeneous fired ceramic substrates |
| CN112004325A (en) * | 2020-09-07 | 2020-11-27 | 中国振华集团云科电子有限公司 | Multilayer heterogeneous mature porcelain structure thin film component and circuit board preparation method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4299873A (en) * | 1979-04-06 | 1981-11-10 | Hitachi, Ltd. | Multilayer circuit board |
-
2006
- 2006-01-25 CN CNB2006100018829A patent/CN100525581C/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4299873A (en) * | 1979-04-06 | 1981-11-10 | Hitachi, Ltd. | Multilayer circuit board |
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| CN101009975A (en) | 2007-08-01 |
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