CN100524720C - Outer down-lead assembly of multimodule spliced long alignment infrared focal plane detector - Google Patents
Outer down-lead assembly of multimodule spliced long alignment infrared focal plane detector Download PDFInfo
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- CN100524720C CN100524720C CNB200610118767XA CN200610118767A CN100524720C CN 100524720 C CN100524720 C CN 100524720C CN B200610118767X A CNB200610118767X A CN B200610118767XA CN 200610118767 A CN200610118767 A CN 200610118767A CN 100524720 C CN100524720 C CN 100524720C
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- film band
- band line
- printed substrate
- focal plane
- plane detector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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Abstract
The invention relates to an external line of multi-module linear infrared focus plane detector, wherein said line is formed by medlin flim band line, transfer print circuit board, and restrain-pulse print circuit board. The invention can use plugging electric connector, transfer circuit board combine line, and restrain-interference print circuit board, to realize high reliability in low temperature, high pulse resistance, and simple application, while it can reduce 3/4 number of lines.
Description
Technical field
The present invention relates to super long alignment infrared focus plane detector, be meant a kind of 2000～6000 yuan, the outer lead assembly of the long alignment infrared focal plane detector of multimode splicing especially.
Background technology
In Aeronautics and Astronautics infrared remote sensing technology field, its developing direction, the one, the photoelectric properties of raising Infrared Detectors improve detectivity, to obtain more information; The 2nd, increase infrared-sensitive unit quantity, improve the system space detection resolution, promptly at the remote sensing instrument of equal height, identical swath, responsive first quantity is many more, and then spatial resolution is high more.High spatial resolution infrared remote sensing instrument is the primary index of infrared early warning, search, tracking system.Therefore, the manufacturing technology of super long alignment infrared focus plane detector has conclusive significance for satisfying above-mentioned remote sensing instrument, has important effect to strengthening national defense construction.
Super long alignment (2000～6000 yuan) infrared focal plane detector, on the one dimension direction, be arranged with a kind of scanning-type infrared focal plane detector of a large amount of infrared-sensitive unit exactly, by one-dimensional scanning (perpendicular to photosensitive identical permutation direction), form a kind of image device of two dimensional image.Because manufacturing technology and detector low-temperature working for the manufacturing of super long alignment infrared focus plane detector, all adopt the method for a plurality of submodule splicings to realize.
Because submodule is subjected to a series of restrictions, is generally the scale less than 300 yuan.With 256 * 1 submodules is example, and 6000 yuan long alignments need 24 sub-module spliced to fetch realization.On the electricity, each submodule is independently.The signal lead of general each submodule, working pulse lead-in wire, detection signal lead-in wire etc. have 20 approximately.If all draw, one 6000 components and parts will have 450～500 outer leads.So many outer lead, the greatest problem that runs into has: 1. a large amount of lead-out wires causes the reliability of device to reduce; 2. to the Infrared Detectors of cryogenic applications, a large amount of outer leads will cause heat conduction to increase sharply, thereby cold damage is serious, the consumption low-temperature receiver, or cause device temperature to raise, and be unfavorable for that the device service behaviour improves; 3. a large amount of outer leads, implementation and operation difficulty, maintenance overhaul difficulty are made mistakes easily; 4. intersect easily between discrete lead, cause that pulse disturbs holding wire, reduce device performance.
Summary of the invention
Problem at above-mentioned long alignment infrared focal plane detector outer lead existence, according to long each submodule of alignment focus planardetector on electricity be independently and the lead-in wire content be consistent characteristics, the present invention proposes a kind of employing flexible film band line, the switching printed substrate merges common lead-in wire, the outer lead assembly that outer lead quantity is reduced significantly.
The outer lead assembly of the long alignment infrared focal plane detector of a kind of multimode splicing, the long alignment infrared focal plane detector of described multimode splicing is made up of splicing substrate and a plurality of submodule.Described submodule is 256 * 1 or 512 * 1 a yuan less alignment infrared focal plane detector of a kind of scale.Described outer lead assembly disturbs printed substrate to constitute by the first film band line, switching printed substrate, the second film band line and suppressor pulse, and the first film band line is shorter than the second film band line.Wherein, the first film band line one end preparation has and each exit of submodule key pressure side one to one, and other end preparation has welding ends, with the corresponding tie point welding on one side of switching printed substrate.The preparation of the first film band line has last welding ends and following welding ends, the corresponding tie point welding of last welding ends with the another side of switching printed substrate, and following welding ends and suppressor pulse disturb the corresponding tie point welding of printed substrate.The tape base of the first and second film band lines adopts the good polyimide-based material of cryogenic property, is suitable for cryogenic applications.The switching printed substrate adopts two-layer wiring, merges by the lead-out wire of wiring with each submodule content unanimity, thereby significantly reduces final lead-out wire quantity.Between pulse lead-in wire on the suppressor pulse interference printed substrate and earth point the high and low frequency decoupling capacitance is installed, purpose is to avoid the influence of various electromagnetic interference to the weak signal line.
The present invention has following advantage:
1. be that consistent lead-out wire merges by the switching printed substrate with content, significantly reduce final outer lead-out wire quantity;
2. between pulse lead-in wire and ground, be connected the high and low frequency decoupling capacitance, avoid of the influence of various electromagnetic interference, reduce electromagnetic interference between line, thereby improve the Electro Magnetic Compatibility of lead-in wire the weak signal line;
3. adopt flexible film band line lead-out mode, layout is flexible, inspection, use, easy to maintenance;
4. owing to reduce outer lead quantity, the cold damage that outer lead causes greatly reduces;
5. exempt from the reliability that the connector connected mode effectively improves connector under the low temperature;
6. adopt the cross section of every lead-in wire of film band line littler, further reduce cold damage than discrete lead-in wire.
Description of drawings
Fig. 1 is an outer lead modular construction schematic diagram of the present invention.
Fig. 2 (a) splices length alignment infrared focal plane detectors and draws the structural representation that assembly is connected outward for a plurality of submodules, and Fig. 2 (b) is the partial enlarged drawing of Fig. 2 (a).
Embodiment
Below beyond the splicing of lead assemblies and multimode rotation symmetrical chiasma grow the embodiment that is connected to of alignment infrared focal plane detector, in conjunction with the accompanying drawings embodiments of the present invention are elaborated:
Outer lead assembly of the present invention disturbs printed substrate 4 to constitute by short film band line 1, switching printed substrate 2, long film band line 3 and suppressor pulse.Wherein, the preparation of short film band line 1 one ends has and each exit of submodule key pressure side 101 one to one, and other end preparation has welding ends 102.Long film band line 3 preparations have last welding ends 301 and following welding ends 302.
The long alignment infrared focal plane detector of multimode rotation symmetrical chiasma splicing is spliced to form along two sideway swivel symmetrical chiasmas of substrate 7 respectively by a plurality of odd number submodules 5 and a plurality of even number submodule 6.The splicing of so-called rotation symmetrical chiasma is meant 256 photosensitive yuan of submodule alignment infrared focal plane detector to arrange by odd and even number rotation symmetrical chiasma and is spliced to form odd number submodule and even number submodule and (specifically asks for an interview Chinese patent: 200610027004.4).
At first the alignment unit number according to long alignment infrared focal plane detector calculates required short film band line 1 quantity, then the method that one by one short film band line 1 is adopted welding its welding ends 102 successively with switching printed substrate 2 on one side corresponding welding spots weld; The corresponding welding spots welding of another side on the last welding ends 301 of long film band line 3 and the switching printed substrate 2; The following welding ends 302 of long film band line 3 disturbs the welding of printed substrate 4 corresponding welding spots with suppressor pulse.Then make another group outer lead assembly with the same manner.For guaranteeing the reliability under the solder joint low temperature, through the low-temperature impact screening, pointwise test is communicated with situation to the outer lead assembly that welding is finished then again.To be installed in splicing substrate 7 both sides of long alignment infrared focal plane detector through two groups of outer lead assemblies of test respectively by the fixing hole 103 usefulness screws on the short film band line 1.And the key pressure side 101 spun gold keys of the short film band line 1 that the output of odd number submodule 5 and the output of even number submodule 6 is corresponding with it press, and finish drawing of whole submodule output end signals.Suppressor pulse disturbs printed substrate 4 preparations that external terminal 401 is arranged, and is connected with peripheral circuit.
Claims (2)
1. the outer lead assembly of the long alignment infrared focal plane detector of multimode splicing, the long alignment infrared focal plane detector of described multimode splicing is made up of splicing substrate and a plurality of submodule; Described submodule is that a kind of scale is 256 * 1 or 512 * 1 yuan an alignment infrared focal plane detector; It is characterized in that:
Described outer lead assembly disturbs printed substrate (4) to constitute by the first film band line (1), switching printed substrate (2), the second film band line (3) and suppressor pulse, and the first film band line (1) is shorter than the second film band line (3); Wherein, the first film band line one end preparation has and each exit of submodule key pressure side (101) one to one, and other end preparation has welding ends (102), with the corresponding tie point welding on one side of switching printed substrate; The preparation of the second film band line (3) has last welding ends (301) and following welding ends (302), the corresponding tie point welding of last welding ends (301) with the another side of switching printed substrate, following welding ends (302) and suppressor pulse disturb the corresponding tie point welding of printed substrate (4); Said switching printed substrate adopts two-layer wiring, merges by the lead-out wire of wiring with each submodule content unanimity; Between pulse lead-in wire on the suppressor pulse interference printed substrate and earth point the high and low frequency decoupling capacitance is installed.
2. splice the outer lead assembly of long alignment infrared focal plane detector according to a kind of multimode of claim 1, it is characterized in that: the tape base of the said the first film band line (1) and the second film band line (3) adopts polyimide-based insulating material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200610118767XA CN100524720C (en) | 2006-11-24 | 2006-11-24 | Outer down-lead assembly of multimodule spliced long alignment infrared focal plane detector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200610118767XA CN100524720C (en) | 2006-11-24 | 2006-11-24 | Outer down-lead assembly of multimodule spliced long alignment infrared focal plane detector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1967827A CN1967827A (en) | 2007-05-23 |
| CN100524720C true CN100524720C (en) | 2009-08-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB200610118767XA Active CN100524720C (en) | 2006-11-24 | 2006-11-24 | Outer down-lead assembly of multimodule spliced long alignment infrared focal plane detector |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101226925B (en) * | 2008-02-01 | 2011-02-16 | 中国科学院上海技术物理研究所 | Wiring structure of long line series infrared detector dewar assembly and connecting method thereof |
| JPWO2012086107A1 (en) * | 2010-12-24 | 2014-05-22 | パナソニック株式会社 | Electronic component mounting structure intermediate, electronic component mounting structure, and method of manufacturing electronic component mounting structure |
| CN110571550B (en) * | 2018-05-18 | 2021-06-01 | 岱炜科技股份有限公司 | USB C female socket connector |
| CN110035607B (en) * | 2019-05-07 | 2022-04-01 | 昆明能讯科技有限责任公司 | Ethernet port communication method based on laminated welding of DIP pins of finished circuit board |
| CN110289509B (en) * | 2019-06-19 | 2021-12-28 | 江苏铁锚玻璃股份有限公司 | Round cable, switching box, flat cable and round cable mutual switching method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050109918A1 (en) * | 2003-09-12 | 2005-05-26 | Shouleh Nikzad | Solid-state curved focal plane arrays |
| CN1220887C (en) * | 2003-11-04 | 2005-09-28 | 中国科学院上海技术物理研究所 | Discrete light filter structure of ultralong lines range infrared focal plane detector |
| CN1858906A (en) * | 2006-05-26 | 2006-11-08 | 中国科学院上海技术物理研究所 | Super long alignment infrared focus plane detector |
-
2006
- 2006-11-24 CN CNB200610118767XA patent/CN100524720C/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050109918A1 (en) * | 2003-09-12 | 2005-05-26 | Shouleh Nikzad | Solid-state curved focal plane arrays |
| CN1220887C (en) * | 2003-11-04 | 2005-09-28 | 中国科学院上海技术物理研究所 | Discrete light filter structure of ultralong lines range infrared focal plane detector |
| CN1858906A (en) * | 2006-05-26 | 2006-11-08 | 中国科学院上海技术物理研究所 | Super long alignment infrared focus plane detector |
Non-Patent Citations (1)
| Title |
|---|
| The vertical photoconductor: A novel device structuresuitable for HgCdTe two-dimensional infrared focal planearrays. J.F. Siliquini, L. Faraone.Infrared Physics & Technology,Vol.38 No.4. 1997 * |
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| CN1967827A (en) | 2007-05-23 |
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