CN100485335C - Pressure transducer with external heater - Google Patents
Pressure transducer with external heater Download PDFInfo
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- CN100485335C CN100485335C CNB2005800195600A CN200580019560A CN100485335C CN 100485335 C CN100485335 C CN 100485335C CN B2005800195600 A CNB2005800195600 A CN B2005800195600A CN 200580019560 A CN200580019560 A CN 200580019560A CN 100485335 C CN100485335 C CN 100485335C
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- sensor
- heater
- transmitter
- connector
- temperature
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0627—Protection against aggressive medium in general
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- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
An improved pressure transducer (50, 70, 80) is disclosed. The transducer (50, 70, 80) includes a connector, an enclosure, a sensor portion (58), and an external heater (32, 76) disposed to heat the sensor portion (58). In some aspects, the sensor portion (58) includes a sensor constructed from a brittle material and does not employ any fill fluid within the sensor. In another aspect, the invention includes a kit (30, 52, 72, 82) that adapts non-heated high purity vacuum transducers (10) for heated use. The kit (30, 52, 72, 82) includes a connector portion (36, 84) and a heater portion (32, 76) that is coupled to the connector portion (36, 84). The connector portion (36, 84) may also include one or more indicators (58).
Description
Technical field
The present invention relates to pressure/vacuum transducer.More particularly, the present invention relates to be used in pressure/vacuum transducer in the high-purity applications.
Background technology
Pressure/vacuum transducer is known.This equipment typically is connected to pressure or vacuum source; Generation is according to the electrical feature of pressure or vacuum change; And the electrical representation of multiple electrical feature is provided, so that the other parts of operating personnel or process can be understood vacuum or pressure.
High purity pressure or vacuum transducer are the very little subclass of conventional vacuum or pressure transducer.These equipment specifically are suitable for superprecision and/or utmost point cleaning course.These be wherein separating pressure transmitter particle or even exhaust therefrom can have the procedural type of deleterious effect to the entire process line.An example of this application is a semiconductor machining.
Because multiple reason, the vacuum transducer that relates to such as the high-purity applications of the deposition of for example material in semi-conductor industry or removal (etching) is frequently heated.At first, this vacuum transducer is heated to reduce to be accumulated in the amount of deposition on the vacuum transducer in the sensor or etching material potentially.In addition, known genuine empty sensor and associated components are temperature sensitive, thereby need the temperature of transmitter accurately to be controlled by fully-integrated well heater.This integrated heater has guaranteed that vacuum transducer and associated components are maintained at precisely controlled temperature.
In the art, there are many problems in the layout of integrated (or be called one, whole) well heater of safeguarding the accurate temperature of vacuum transducer and associated components.For example, the integrated characteristic of well heater requires: the supplier of this equipment and client bear non-heating transmitter and cover two stocks to the transmitter of the heating of three temperature ranges usually.This requirement has the three-to-four-fold stock of non-heating sensor, thereby produces the much higher stock that does not need fully-integrated well heater to need such as fruit.Another problem of current design is: when the purchase of customer vacuum transducer, they must determine definite position that transmitter is used and if any, with the heat levels of needs.Non-heating, vacuum sensor can not be converted into heating sensor simply.Therefore, current design wishes that to client the multiple application of using them can not expand.Another problem of current design is: for given process, wish to assess vacuum transducer and must buy different sensors the user that all temps adds thermal effect, every kind of being used to assess temperature.Client can try out the different heating device usually on single vacuum transducer, and points out effect.Therefore, determine to use simply attempting and to produce the fringe cost of buying one or more useless (being at least described application) vacuum transducer and the additional period of during process, removing and various sensors being installed usually of which sensor.Another problem of current design is: well heater is integrated in the shell identical with sensor and electronic installation.This means that electronic installation always is exposed to higher temperature, this limits its serviceable life.
Summary of the invention
Improved pressure unit is disclosed.Described transmitter is specially adapted to sensing vacuum in high-purity applications.Described transmitter comprises: connector; Shell; Sensor part; With the external heater that is set to be used for heating sensor portion.In certain embodiments, sensor part comprises the sensor that is made of hard brittle material, and does not use any fill fluid in sensor.On the other hand, the present invention includes and make non-heated high-purity vacuum transducer be suitable for heating the assembly of purposes (or being called external member, kit utility).Described assembly comprises connector portion and is connected to the well heater portion of connector portion.Described connector portion also can comprise one or more indicators.
Description of drawings
Fig. 1 and 2 is particularly useful its sketches of high purity vacuum transducer of embodiments of the invention.
Fig. 3 is the high purity vacuum transducer schematic drawing according to prior art.
Fig. 4 is the sketch for the assembly that can be applied to non-heated high-purity vacuum transducer of implementing the embodiment of the invention.
Fig. 5 is the sketch that is connected to the high purity vacuum transducer 50 of external heating assembly 52 according to an embodiment of the invention.
Fig. 6 is the sketch that comprises the sensor part 58 of the sensor 60 that is formed by a pair of hard brittle material substrate.
Fig. 7 is the sketch of high purity vacuum transducer system 70 according to another embodiment of the present invention.
Fig. 8 is the amplification sketch of cover 76 according to an embodiment of the invention;
Fig. 9 is the schematic drawing of external heating high purity vacuum transducer system according to another embodiment of the present invention.
Embodiment
Fig. 1 and 2 is particularly useful its schematic drawings of high purity vacuum transducer of embodiments of the invention.Transmitter 10 generally comprises: sensor electronics enclosure 12; Sensor part 14; The process connection (or the process unitor, the PROCESS COUPLING device) 16; With electric connector 18.Process connects 16 vacuum or the pressure sources that are coupled to usually in the high purity environment, and with vacuum or pressure source fluid be connected to sensor part 14.Pressure transducer in the module 14 has the electrical feature with pressure change.But but the example of this pressure transducer includes, but not limited to polarizing coating capacitance type sensor and polarizing coating strain gauge transducer.Electronic installation in the sensor electronics enclosure 12 is electrically coupled to sensor part 14, so that can measure the electrical feature of variation.Additional electronic installation in the shell 12 can be carried out such as the additional function that with electrical signal conversion is the output of numeral and linearization and/or characterization numeral.In addition, electric output can be arranged to according to such as
Or FOUNDATION
TMThe transmission of any suitable industrial standard process communication protocols of Fieldbus agreement.Process Control System and/or additional process relevant device can be coupled to electric connector 18.
Fig. 3 has shown the high purity vacuum transducer according to prior art.Transmitter 20 has many similarities with transmitter 10, and like has similar label.Transmitter 20 comprises the sensor electronics 22 that is arranged in the sensor electronics enclosure 12.Heating source 24 and 26 is connected (or being called thermal coupling) to shell 12 and detecting means 14 by hot respectively.For reducing to be accumulated on the vacuum transducer in the transmitter amount of deposition or etching material, heating source 24 and 26 provides heat.For traditional design, because vacuum transducer and associated components are temperature sensitive, well heater must obtain split-hair control to keep the precision of transmitter.Therefore, thermal source 24 and 26 is made with transmitter 20 usually, and is integrated in the transmitter 20 (that is, being integral at transmitter 20).This has produced the situation that the transmitter of wherein making fully has the actual temp scope.
Fig. 4 is the sketch for the assembly that can be applied to high purity pressure of implementing embodiments of the invention.Assembly 30 generally includes two parts.At first, assembly 30 comprises the heating part 32 that is fit to be connected to sensor part 14.In embodiment shown in Fig. 4, heating part 32 comprises that size forms the hole 34 of the external diameter that can pass sensor part 14.Heating part 32 comprises can take to comprise that coil, tube, etched trace etc. are fit to one or more heating elements 35 of form arbitrarily.Can use the clamping and/or other method that heating part 32 are connected to sensor part 14.Connector 36 is electrically coupled to heating part 32 through being electrically connected 38.Connector portion 36 preferably includes circuit, so that use the temperature sensor 33 that is arranged on heating part 32 to calculate the temperature of heating part 32.In addition, connector portion 36 comprises known control circuit for heater (not shown), so that selectively for the heating element 35 in the heating part 32 provides energy, heating part 32 is remained on the temperature of rising.Electrical connection 38 between connector portion 36 and the heating part 32 can comprise the conductor of any suitable number.For example, heating part 32 comprises among the embodiment of electrical heating elements and temperature-sensing element (device) therein, is electrically connected 38 and will comprises all electrical heating elements that are suitable in the heating part 32 and/or the conductor of sensor.
Connector portion 36 preferably is determined size and is configured to directly be connected to the connector 18 of the high purity pressure at input 40 places.For example, when connector 18 is 25 pin D-miniature public connector, input 40 will be 25 pin D-miniature female connectors.Connector portion 36 also comprises output 42, and output 42 preferably is configured to imitate the output of connector 18.In above-mentioned example, output 42 will be 25 pin D-miniature public connection.Input 40 and output 42 are that this layout of male and female type is preferred each other.Yet clearly: they can be dissimilar connections.For example, hold described layout as long as the connector that is fit to is configured and is connected to the system of output 42 each other, input 40 can be 9 pin D-miniature female connection, and output can be 25 pin D-miniature female connection.
Fig. 5 is the schematic drawing that is connected to the high purity pressure 50 of external heating assembly 52 according to an embodiment of the invention.The system 54 that comprises transmitter 50 and assembly 52 is considered to external heating high purity vacuum sensing system 54 according to an embodiment of the invention.
In this embodiment, transmitter 50 is different with sensor 20 at least one importance.Open more fully improved sensor part 58 below transmitter 50 is included in.Sensor part 58 presents hysteresis and the temperature effect that reduces.Sensor part 58 has realized the temperature control of the potential still less cost of sensor part, and the sensor temperature that separates compensation.
Fig. 6 is the schematic drawing that comprises the exemplary sensor portion 58 of the sensor 60 that is formed by a pair of hard brittle material substrate 62,64.This structure is known in the pressure sensing field, and further information can authorized the United States Patent (USP) 5,637,802 and 6,089 of Frick etc., finds in 097, and above-mentioned two all are awarded applicant of the present invention.Fig. 6 has shown to have between them the top substrate 62 that forms chamber 66 and the sensor 60 of lower substrate 64.Fig. 6 has shown the minimum cavity width w and because the central deflection y of applied pressure of the deflection structure in total length L, thickness T, width W, sensing chamber.Preferably, substrate 62 and 64 is formed by the single crystal material such as sapphire, and by fusion bonded together to form one-piece construction.In other words, do not have the extraneous material of mispriming or pollution in conjunction with essence between the substrate 62 and 64.In addition, preferably, sensor 60 is not being operated under the situation as any fill fluid in another source of potentially contaminated.
Get back to Fig. 5, assembly 52 comprises around the sensor part 58 that is arranged on transmitter 50 and is coupled to the heating part 32 of the sensor part 58 of sensor 50.Except indicator 58, the connector portion 56 of assembly 52 is preferably identical with connector portion 36 (shown in Figure 4).Indicator 58 is coupled to the circuit in the connector portion 36, so that indicate the state of external heating assembly 52 and/or high purity pressure 50 to the outside.In one embodiment, indicator 58 is LED.LED can be used in the powering up of heating element in the total system power of indication, the heating part 32, the actual temperature that preferred temperature is following, the actual temperature at preferred temperature place, and/or surpasses the actual temperature of preferred temperature.In addition, indicator 58 can be taked any suitable form, including, but not limited to showing the digital indicator of Current Temperatures, set-point and/or warning code.At last, indicator 58 can also be used to indicate the condition of high purity vacuum transducer.For example, high purity vacuum transducer 50 can be endowed diagnostic circuit/software, so that make transmitter 50 can judge its whether effectively operation, or it does not need to repair.This situation is indicated to the outside by one or more indicators 58 then.
Shown in Figure 4 and 5, connector portion 36 and 56 preferably has the input and output that are connected (miniature such as 25 pin D) of same type, but the input and output with opposite sex.
Fig. 7 is the schematic drawing of high purity pressure system 70 according to another embodiment of the present invention.Transmitter 70 comprises the external electrical heaters assembly 72 that is similar to the assembly of describing with reference to Fig. 5 52 a little.Yet, be outside the heating part 74 of assembly 72 and heating part 54 different: the heater sensor 76 that heating part 74 is comprising.Heater sensor 76 is formed by the cardinal principle flexible unit that has rectangular shape when keeping flat.Heater sensor 76 comprises heating element and such as the thermal sensing element of thermistor, hot coupling or RTD.The rectangular dimension of heater sensor wrap 76 can be applied to pressure transducer portion 58 for cover 76, and essence is surrounded sensor part 58.For heater housing 76 is fixed to sensor part 58, can use any suitable viscosity and/or clamp device.
Fig. 8 is the amplification sketch of cover 76 according to an embodiment of the invention.As shown, cover 76 is fit to be placed on around the sensor senses device portion 58, and utilizes bonding agent, clamp device or both to be fixed on the sensor part 58.
Fig. 9 is the schematic drawing of external heating high purity vacuum transducer system 80 according to another embodiment of the present invention.System 80 comprises external heating assembly 82, and this external heating assembly 82 comprises the heating mantles portion 76 that is electrically coupled to connector portion 84.Be outside connector portion 84 and previously described connector portion different: connector portion 84 is determined size to have identical external dimensions (such as diameter) with sensor electronics enclosure 12.Connector portion 84 provides and has been used for the wherein additional space of circuit.Preferably, connector portion 84 comprises the connector that a pair of essence is identical, and wherein: the input and output connector has opposite sex.As shown, connector portion 84 preferably includes one or more securing members 86 (such as screw), and this has guaranteed that connector portion 84 can be fixed to sensor electronics enclosure 12 fastenedly.Connector portion 84 also comprises a plurality of indicators 58, so that aforesaid indication to be provided.Indicator 58 is displayed among Fig. 9, and is set at the top surface 88 of connector portion 84.Yet indicator 58 can be set at any suitable position.
Near the sensor part of pressure transmitter, use well heater/sensor module to have many benefits.At first, if it breaks down, assembly can be removed and be replaced.In addition, different heating device sensor module can be exchanged fast and easily mutually, to be fit to multiple application and temperature range.For example, an assembly can be used for high temperature; Another assembly can be used for the higher calorific power requirement; And another assembly can be used for split-hair heat control.Therefore, an assembly can be used to first temperature range, and second assembly can be used for second temperature range simultaneously.First and second scopes can be overlapping, but that they need not is overlapping.Therefore, the selection of assembly can provide wide extensibility.
Though the present invention is described with reference to preferred enforcement, those of skill in the art will appreciate that: under the situation of not leaving the spirit and scope of the present invention, can do the change of some forms and details.For example, when embodiments of the invention are absorbed in sensing vacuum in high purity environment usually, embodiments of the invention also can use with the gaseous tension transmitter that transmitter wherein is subjected to the JouleThompson cooling that produced by expanding gas.
Claims (27)
1. pressure unit comprises:
Have the connector the removed portion of input and output, described input is coupled to the connector of transmitter;
Be arranged on the control circuit for heater in the connector portion;
Sensor electronics enclosure;
Sensor part, described sensor part have and are formed on sensor wherein and are coupled to sensor electronics enclosure; With
External heater, described external heater are set at sensor part on every side to improve the temperature of sensor part, and described external heater is coupled to described control circuit for heater, and replaceable to change the operating temperature range of transmitter.
2. transmitter according to claim 1, wherein: described sensor is formed by monocrystal material.
3. transmitter according to claim 1, wherein: described sensor is by fusion bonded.
4. according to the described transmitter of claim 1, further comprise: be arranged in the connector portion and be connected to the control circuit for heater of external heater.
5. according to the described transmitter of claim 4, further comprise: temperature sensor, described temperature sensor are coupled to control circuit for heater and are set for the temperature of sensor/sensor portion.
6. transmitter according to claim 1, wherein: external heater is coupled to the connector portion of sensor electronics enclosure outside.
7. transmitter according to claim 1, wherein: input and output are measure-alike and have identical pin number, but sex is opposite each other.
8. transmitter according to claim 1, wherein: described connector portion comprises at least one indicator.
9. transmitter according to claim 8, wherein: described at least one indicator comprises LED.
10. transmitter according to claim 1, wherein: described external heater comprises the hole, the size in described hole is confirmed as passing sensor part.
11. transmitter according to claim 1, wherein: described external heater comprises the temperature sensor of the temperature that is used for sensor/sensor portion.
12. transmitter according to claim 1, wherein: described external heater comprises the heater housing that is fixed to sensor part.
13. transmitter according to claim 12, wherein: described heater housing comprises the temperature sensor of the temperature that is used for sensor/sensor portion.
14. transmitter according to claim 1, wherein: described transmitter is the high-purity sensor of sensing vacuum.
15. transmitter according to claim 1, wherein: described sensor is formed by hard brittle material.
16. transmitter according to claim 1, wherein: external heater is replaceable to change the operating temperature range of transmitter.
17. transmitter according to claim 1, wherein: described external heater comprises at least one heating element.
18. transmitter according to claim 17, wherein: described at least one heating element is a coil.
19. transmitter according to claim 17, wherein: described at least one heating element is etched trace.
20. an assembly that is used for the sensor part of external heating pressure unit, described assembly comprises:
External heater portion, the replaceable operating temperature range of described external heater portion with the change transmitter, and this heater size is determined so that the sensor part from external stability to the pressure transducer;
The control circuit for heater that is connected with this well heater portion; With
The connector removed portion with input and output, described input is coupled to the connector of transmitter, described connector portion is coupled to well heater portion and has the control circuit for heater that is arranged on wherein, described connector portion is suitable for selectively for well heater portion provides energy, well heater portion is remained on the temperature of rising.
21. assembly according to claim 20, wherein: described well heater portion comprises the hole, and the size in described hole is confirmed as passing the sensor part of pressure transducer.
22. assembly according to claim 20, wherein: described well heater portion also comprises the temperature sensor that is connected to connector portion.
23. assembly according to claim 20, wherein: described well heater portion comprises the heater housing of the outer surface that is suitable for being fixed to sensor part.
24. assembly according to claim 23, wherein: described heater housing comprises the temperature sensor that is connected to connector portion.
25. assembly according to claim 20, wherein: described connector portion comprises input and output, and wherein said input and output are measure-alike and have identical pin number, but sex is opposite each other.
26. assembly according to claim 20, wherein: described connector portion comprises at least one indicator.
27. assembly according to claim 20, wherein: described pressure transducer is the high purity vacuum sensor.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/893,189 US7347099B2 (en) | 2004-07-16 | 2004-07-16 | Pressure transducer with external heater |
| US10/893,189 | 2004-07-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1969174A CN1969174A (en) | 2007-05-23 |
| CN100485335C true CN100485335C (en) | 2009-05-06 |
Family
ID=34967198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005800195600A Expired - Fee Related CN100485335C (en) | 2004-07-16 | 2005-04-25 | Pressure transducer with external heater |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7347099B2 (en) |
| EP (1) | EP1769225B1 (en) |
| JP (1) | JP5049780B2 (en) |
| CN (1) | CN100485335C (en) |
| RU (1) | RU2358249C2 (en) |
| WO (1) | WO2006019439A1 (en) |
Families Citing this family (7)
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| US8387463B2 (en) * | 2008-10-06 | 2013-03-05 | Rosemount Inc. | Pressure-based diagnostic system for process transmitter |
| DE102017122631A1 (en) * | 2017-09-28 | 2019-03-28 | Tdk Electronics Ag | Pressure sensor on ceramic discharge nozzle |
| DE102017122605A1 (en) * | 2017-09-28 | 2019-03-28 | Tdk Electronics Ag | Pressure sensor on ceramic substrate |
| JP7285621B2 (en) * | 2017-11-29 | 2023-06-02 | 株式会社堀場エステック | Vacuum gauge |
| CN111060236A (en) * | 2018-10-17 | 2020-04-24 | 北京自动化控制设备研究所 | Silicon piezoresistive pressure sensor packaging assembly structure |
| CN111207882A (en) * | 2020-01-17 | 2020-05-29 | 中国科学院微电子研究所 | Pressure sensor |
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| US6772640B1 (en) * | 2000-10-10 | 2004-08-10 | Mks Instruments, Inc. | Multi-temperature heater for use with pressure transducers |
| US6612176B2 (en) * | 2000-12-28 | 2003-09-02 | Mks Instruments, Inc. | Pressure transducer assembly with thermal shield |
| US6769415B2 (en) * | 2001-05-25 | 2004-08-03 | General Motors Corporation | Evaporative control system |
| US20030012563A1 (en) * | 2001-07-10 | 2003-01-16 | Darrell Neugebauer | Space heater with remote control |
| US6931936B2 (en) * | 2001-12-27 | 2005-08-23 | Spx Corporation | Apparatus and method for determining pressure and vacuum |
| US6588280B1 (en) * | 2002-04-22 | 2003-07-08 | Mks Instruments, Inc. | Pressure transducer with compensation for thermal transients |
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| US20040169771A1 (en) * | 2003-01-02 | 2004-09-02 | Washington Richard G | Thermally cooled imaging apparatus |
| US7339671B2 (en) * | 2004-01-20 | 2008-03-04 | Hong Peng | Apparatus and method for monitoring biological cell culture |
| US7000479B1 (en) * | 2005-05-02 | 2006-02-21 | Mks Instruments, Inc. | Heated pressure transducer |
-
2004
- 2004-07-16 US US10/893,189 patent/US7347099B2/en active Active
-
2005
- 2005-04-25 WO PCT/US2005/014267 patent/WO2006019439A1/en active Application Filing
- 2005-04-25 JP JP2007521456A patent/JP5049780B2/en not_active Expired - Fee Related
- 2005-04-25 RU RU2007105747/28A patent/RU2358249C2/en active
- 2005-04-25 EP EP05739987.5A patent/EP1769225B1/en not_active Not-in-force
- 2005-04-25 CN CNB2005800195600A patent/CN100485335C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US7347099B2 (en) | 2008-03-25 |
| EP1769225B1 (en) | 2018-11-28 |
| JP2008506947A (en) | 2008-03-06 |
| JP5049780B2 (en) | 2012-10-17 |
| EP1769225A1 (en) | 2007-04-04 |
| WO2006019439A1 (en) | 2006-02-23 |
| CN1969174A (en) | 2007-05-23 |
| RU2358249C2 (en) | 2009-06-10 |
| RU2007105747A (en) | 2008-08-27 |
| US20060010983A1 (en) | 2006-01-19 |
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Granted publication date: 20090506 Termination date: 20200425 |