CN100481476C - Image sensor module with real protection flange, and fabricating method thereof - Google Patents
Image sensor module with real protection flange, and fabricating method thereof Download PDFInfo
- Publication number
- CN100481476C CN100481476C CNB2005101186032A CN200510118603A CN100481476C CN 100481476 C CN100481476 C CN 100481476C CN B2005101186032 A CNB2005101186032 A CN B2005101186032A CN 200510118603 A CN200510118603 A CN 200510118603A CN 100481476 C CN100481476 C CN 100481476C
- Authority
- CN
- China
- Prior art keywords
- substrate
- chip
- electrode
- microscope base
- sidewall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Microscoopes, Condenser (AREA)
- Lens Barrels (AREA)
Abstract
The image sensor module includes following parts: a basal plate with an upper surface and a lower surface; first electrode formed on the upper surface, and second electrode formed on the lower surface and connected to corresponding first electrode; a chip setup on upper surface of the basal plate; sensing area and weld pads formed on the chip; wires connect weld pads of chip to first electrode on the basal plate; adhesion agent is coated on upper surface of the basal plate; a lens seat contains ringed protective flange, and internal thread. When using adhesion agent sets up sidewall of the lens seat on the upper surface, the ringed protective flange just surrounds sensing area of the chip so as to prevent the chip from pollution of the adhesion agent. External thread on lens barrel is matched and locked to internal thread on the lens seat.
Description
Technical field
The present invention is a kind of image sensor module and manufacture method thereof of miniaturization, is meant especially a kind ofly can effectively promote yield and product is more compact.
Background technology
See also Fig. 1, be a kind of cutaway view of image sensor module structure, it comprises that it includes; One substrate 10 is provided with a upper surface 12 and a lower surface 14, and upper surface 12 is formed with first electrode 16, and lower surface 14 is formed with second electrode 18 and connects the first corresponding electrode 16; Chip 20 is the upper surfaces 12 that are arranged at substrate 10, is formed with weld pad 22 on it; Plurality of wires 24 is to be electrically connected first electrode 16 of the weld pad 22 of chip 20 to substrate 10; One solid 26 is upper surfaces 12 of coating substrate 10; One microscope base 28 is provided with internal thread 30, is by by the sticking upper surfaces 12 of being located at substrate 10 of solid 26, with chip 20 around living; Reaching a lens barrel 32 and be provided with external screw thread 34, is that screw lock is on the internal thread 30 of microscope base 28.
But, above-mentioned image sensor module, when coating solid 26, the amount control of solid 26 also causes solid 26 to expose outside microscope base 28 not at that time, makes that making the block size of finishing differs, thereby must scrap larger-size module, and form waste.And solid 26 easily pollutes chip 20, has influence on the quality of product.
In view of this, the inventor be this in the spirit of keeping on improving, innovate breakthrough, be devoted to the encapsulation research and development of image sensor, and invent out image sensor module of the present invention, make it effectively promote yield and product is more compact.
Summary of the invention
Main purpose of the present invention is to provide a kind of image sensor module and manufacture method thereof of miniaturization, and it has the effect that improves the product yield, to reach the purpose that reduces production costs.
Another object of the present invention is to provide a kind of image sensor module and manufacture method thereof of miniaturization, and it has the effect of dwindling small product size, to reach compact purpose.
The present invention includes a substrate and be provided with a upper surface and a lower surface, this upper surface is formed with first electrode, and this lower surface is formed with first electrode that second electrode connects this correspondence; One chip is the upper surface that is arranged at this substrate, is formed with sensing area and weld pad on it; Plurality of wires is to be electrically connected first electrode of the weld pad of this chip to this substrate; One solid is a upper surface of coating this substrate; One microscope base is provided with the real protection flange and the internal thread of a sidewall, a ring-type, when the sidewall of this microscope base is located at the upper surface of this substrate by being glued by this solid, this real protection flange just with the sensing area of chip around living, avoid this solid to pollute the sensing area of this chip; One lens barrel is provided with external screw thread, is that screw lock is on the internal thread of this microscope base.
Above-mentioned and other purpose, advantage and characteristic of the present invention are by the detailed description of following preferred embodiment and with reference to graphic so that more understood in depth.
Description of drawings
Fig. 1 is the schematic diagram of existing image sensor module;
Fig. 2 is the schematic diagram of the image sensor module of tool overcoat of the present invention;
Fig. 3 is the manufacture method schematic diagram of the image sensor module of tool overcoat of the present invention.
Figure number of the present invention
Substrate 40 chips 42 flange layers 43
Plurality of wires 44 grooves 45 solids 46
Lower surface 54 first electrodes 56 second electrodes 58
Embodiment
See also Fig. 2, be the schematic diagram of the image sensor module of tool real protection flange of the present invention, it includes a substrate 40, chip 42, plurality of wires 44, solid 46, microscope base 48 and lens barrel 50:
It is provided with a upper surface 52 and a lower surface 54 substrate 40, and upper surface 54 is formed with first electrode 56, and lower surface 54 is formed with second electrode 58 and connects the first corresponding electrode 56.
Plurality of wires 44 is to be electrically connected first electrode 56 of the weld pad 62 of chip 42 to substrate 40.
Solid 46 is to coat on the upper surface 52 of substrate 40, and is positioned at first electrode, 56 peripheries for adhesion glue.
It is provided with the real protection flange 65 and the internal thread 67 of a sidewall 63, a ring-type microscope base 48, when the sidewall 63 of microscope base 48 is located at the upper surface 52 of substrate 40 by being glued by solid 46, real protection flange 65 just with the sensing area 60 of chip 40 around living, avoid solid 46 to pollute the sensing area 60 of chip 40.
See also Fig. 3, be the image sensor module manufacture method of tool overcoat of the present invention, it comprises the following steps:
One substrate 40 is provided, and it is provided with a upper surface 52 and a lower surface 54, and upper surface 54 is formed with first electrode 56, and lower surface 54 is formed with second electrode 58 and connects the first corresponding electrode 56.
One flange layer 43 is provided, and it is the upper surface 52 that is arranged at substrate 40, and forms a groove 45 with substrate 40.
It is the upper surface 52 that is arranged at substrate 40 that one chip 42 is provided, and is positioned at groove 45, is formed with sensing area 60 and weld pad 62 on it.
It is to be electrically connected first electrode 56 of the weld pad 62 of chip 42 to substrate 40 that plurality of wires 44 is provided.
One solid 46 is provided, and is to coat on the upper surface 52 of substrate 40, and 43 of chip 40 and flange layers.
One microscope base 48 is provided, it is provided with the real protection flange 65 and the internal thread 67 of a sidewall 63, a ring-type, when the sidewall 63 of microscope base 48 is located at the upper surface 52 of substrate 40 by being glued by solid 46, real protection flange 65 just with the sensing area 60 of chip 40 around living, avoid solid 46 to pollute the sensing area 60 of chip 40.A part of sidewall 63 of cutting microscope base 48 and and be adhered to the substrate 40 of sidewall 63, and become the module of reduced size.
So the present invention has following advantage:
1. during with the excision of the sidewall of microscope base 48, can make the module volume-diminished, and can obtain consistent product size.
2. the real protection flange 65 of microscope base 48 around living, can prevent that solid 46 from polluting the sensing area of chip 42 with the sensing area 60 of chip 42.
The specific embodiment that is proposed in the detailed description of preferred embodiment is only in order to be easy to illustrate technology contents of the present invention, be not with narrow sense of the present invention be limited to embodiment, all scopes that all belongs to this creation according to many variations that situation the is done enforcement of spirit of the present invention and following claim.
Claims (4)
1. the image sensor module of a tool real protection flange is characterized in that, includes:
One substrate, it is provided with a upper surface and a lower surface, and this upper surface is formed with first electrode, and this lower surface is formed with first electrode that second electrode connects this correspondence;
One chip is the upper surface that is arranged at this substrate, is formed with sensing area and weld pad on it;
Plurality of wires, it is to be electrically connected first electrode of the weld pad of this chip to this substrate;
One solid is a upper surface of coating this substrate;
One microscope base, it is provided with the real protection flange and the internal thread of a sidewall, a ring-type, when the sidewall of this microscope base when being located at the upper surface of this substrate by this solid is sticking, this real protection flange just with the sensing area of chip around living, avoid this solid to pollute the sensing area of this chip; And
One lens barrel, it is provided with external screw thread, is that screw lock is on the internal thread of this microscope base.
2. the image sensor module of tool real protection flange as claimed in claim 1 is characterized in that, a part of sidewall of this microscope base and the substrate that is adhered to this microscope base are cut, and forms the module of reduced size.
3. the manufacture method of the image sensor module of a tool real protection flange is characterized in that, comprises the following steps:
One substrate is provided, and it is provided with a upper surface and a lower surface, and this upper surface is formed with first electrode, and this lower surface is formed with first electrode that second electrode connects this correspondence;
One chip is provided, and is the upper surface that is arranged at this substrate, is formed with sensing area and weld pad on it;
Plurality of wires is provided, and it is to be electrically connected first electrode of the weld pad of this chip to this substrate;
One solid is provided, and is the upper surface of coating this substrate;
One microscope base is provided, it is provided with the real protection flange and the internal thread of a sidewall, a ring-type, when the sidewall of this microscope base when being located at the upper surface of this substrate by this solid is sticking, this real protection flange just with the sensing area of chip around living, avoid this solid to pollute the sensing area of this chip;
With a part of sidewall of this microscope base and be adhered to the substrate excision of this sidewall; And
One lens barrel is provided, and it is provided with external screw thread, is that screw lock is on the internal thread of this microscope base.
4. the manufacture method of the image sensor module of tool real protection flange as claimed in claim 3, it is characterized in that, the upper surface of described this substrate is formed with a flange layer, this solid is to coat this flange layer and chip chamber, and this microscope base is by being located on this substrate by this solid is sticking, cuts a part of sidewall of this microscope base and is adhered to the substrate of this sidewall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101186032A CN100481476C (en) | 2005-10-31 | 2005-10-31 | Image sensor module with real protection flange, and fabricating method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101186032A CN100481476C (en) | 2005-10-31 | 2005-10-31 | Image sensor module with real protection flange, and fabricating method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1959995A CN1959995A (en) | 2007-05-09 |
| CN100481476C true CN100481476C (en) | 2009-04-22 |
Family
ID=38071570
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005101186032A Expired - Fee Related CN100481476C (en) | 2005-10-31 | 2005-10-31 | Image sensor module with real protection flange, and fabricating method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100481476C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101409298B (en) * | 2007-10-11 | 2010-09-29 | 鸿富锦精密工业（深圳）有限公司 | Imaging apparatus and assembling method thereof |
| TWI794101B (en) * | 2022-04-21 | 2023-02-21 | 大根光學工業股份有限公司 | Imaging lens module and electronic device |
-
2005
- 2005-10-31 CN CNB2005101186032A patent/CN100481476C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1959995A (en) | 2007-05-09 |
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Granted publication date: 20090422 Termination date: 20201031 |