CN100477099C - Clapboard for dividing semiconductor wafer - Google Patents

Clapboard for dividing semiconductor wafer Download PDF

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Publication number
CN100477099C
CN100477099C CNB2004800435898A CN200480043589A CN100477099C CN 100477099 C CN100477099 C CN 100477099C CN B2004800435898 A CNB2004800435898 A CN B2004800435898A CN 200480043589 A CN200480043589 A CN 200480043589A CN 100477099 C CN100477099 C CN 100477099C
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China
Prior art keywords
cut
line
dividing plate
group
distance
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CNB2004800435898A
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Chinese (zh)
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CN1989599A (en
Inventor
瓦罗里斯·L.·弗西斯
桑德林·沙里耶
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Illinois Tool Works Inc
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Illinois Tool Works Inc
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Publication date
Application filed by Illinois Tool Works Inc filed Critical Illinois Tool Works Inc
Publication of CN1989599A publication Critical patent/CN1989599A/en
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Publication of CN100477099C publication Critical patent/CN100477099C/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67396—Closed carriers characterised by the presence of antistatic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions

Abstract

A separator of semiconductor wafers (10) is made from polyethylene with a dissipative material and includes a first and second set of embossed cut parallel lines. The first set is typically parallel to the second set; and each set includes pairs of cut lines which are spaced from adjacent pairs. The depth of grid lines cut into the material allows air flow, circulation and vacuum release.

Description

The dividing plate of separating semiconductor wafer
As the partial continuous application, the sequence number that the application requires on July 13rd, 2004 to propose is the priority of 60/587,884 provisional application.
Technical field
The present invention relates to semiconductor wafer packing and transportation dividing plate.
Background technology
When semiconductor wafer transports,, between adjacent chip, use dividing plate usually for static and the mechanical stability that keeps wafer.A kind of wafer separator of prior art is used embossed grid pattern.Though this dividing plate is satisfactory in many aspects, however semiconductor wafer and dividing plate in the multi-tank container time, and wherein wafer and dividing plate can stick together.This can form " wafer cake " shape, and coherent wafer and spacer blocks are difficult to separately.When attempting that wafer can be caused broken wafers when dividing plate separates.This manual usually carrying out is not used the device of unpacking automatically.This problem may be that the lattice by mold pressing on the dividing plate causes.Wafer is during by vacuum packaging, and each independent grid plays the effect that is similar to small sucker on the grid.
Summary of the invention
In order to overcome above-mentioned deficiency, dividing plate is provided with line image, is generally two groups of vertical each other lines.This allows air flows and circulation.This also is used to remove vacuum.
Dividing plate is generally polyethylene, is impregnated with consumptive material, and makes circle, and many different-diameters can be arranged.
Description of drawings
Also pass through accompanying drawing by following description and claim, other purpose of the present invention and advantage can be very clear.Wherein:
Fig. 1 is the plane graph of wafer separator of the present invention.
Fig. 2 is the partial enlarged drawing of Fig. 1.
Embodiment
Fig. 1 is the plane graph of circular wafer separator 10 of the present invention.In fact wafer separator 10 can be Any shape and specification, but the diameter of circular wafer separator 10 is 4,5,6,8 or 12 inches.
Wafer separator 10 is made by polythene material usually, as
Figure C20048004358900041
Or the 1207LLDPE Lamination Grade Film (86-R0438) of assignee Illinois Tool Works Inc. sale, the gauge that uses is 86-R0438, it has provided the prescription and the characteristic requirement of this antistatic film in detail.Wafer separator 10 be generally 0.006 inch thick, be impregnated with consumptive material, it is processed into usually, guarantees that consumptive material is the organic and part material structure of inorganic pollution level below 50ppm, this is very desirable for semiconductor application.
Circular wafer separator 10 is to form with the mold pressing of first and second groups of cutting parallel lines, and first group of cutting parallel lines is usually perpendicular to second group of cutting parallel lines.The two ends of every line terminate in the periphery of circular wafer separator 10.In addition, as Fig. 2 institute best image, the cutting parallel lines are generally right, so that the distance between centers of tracks of line centering is generally 0.036 inch, the spacing that adjacent lines is right is 0.208 inch, and the cutting parallel lines cut into air can be flowed and circulate, the releasing vacuum.
Therefore, aforesaid several purpose and advantage have been obtained most effectively.Though only disclose and described a preferred embodiment of the present invention in detail at this, should be appreciated that never therefore the present invention is restricted, and should be indicated in the appended claims.

Claims (7)

1. dividing plate of separating semiconductor wafer, this dividing plate is made up of the static consumptive material, and comprise line of cut, wherein the two ends of line of cut terminate on the periphery of described dividing plate, described line of cut is designed to first group of line of cut and second group of line of cut, and wherein said first group of line of cut is perpendicular to second group of line of cut.
2. dividing plate as claimed in claim 1, wherein said first group and second group of line of cut are designed to paired line of cut, wherein giving the line-spacing of alignment centering is first distance, and the right spacing of adjacent lines is second distance, and wherein said first distance is different with described second distance.
3. dividing plate as claimed in claim 1, wherein said line of cut cut into enough dark so that air flows, circulation and releasing vacuum.
4. dividing plate as claimed in claim 1, wherein said dividing plate is circular.
5. dividing plate as claimed in claim 1, wherein said dividing plate is made up of polythene material.
6. dividing plate as claimed in claim 1, wherein, described line of cut is the cutting parallel lines, described cutting parallel lines are paired, so that the distance between centers of tracks of line centering is 0.036 inch, the spacing that adjacent lines is right is 0.208 inch.
7. dividing plate as claimed in claim 1, wherein, described line of cut is continuous.
CNB2004800435898A 2004-07-13 2004-08-17 Clapboard for dividing semiconductor wafer Active CN100477099C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US58788404P 2004-07-13 2004-07-13
US60/587,884 2004-07-13

Publications (2)

Publication Number Publication Date
CN1989599A CN1989599A (en) 2007-06-27
CN100477099C true CN100477099C (en) 2009-04-08

Family

ID=35839547

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004800435898A Active CN100477099C (en) 2004-07-13 2004-08-17 Clapboard for dividing semiconductor wafer

Country Status (3)

Country Link
CN (1) CN100477099C (en)
MY (1) MY139640A (en)
WO (1) WO2006016883A1 (en)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5183699A (en) * 1989-08-01 1993-02-02 Mitsui Toatsu Chemicals, Inc. Wafer processing films
US5091229A (en) * 1989-10-13 1992-02-25 E. I. Du Pont De Nemours And Company Electronics protective packaging film
US20020192432A1 (en) * 2001-05-07 2002-12-19 Vermillion Robert J. Dissipative layer suitable for use in protective package
US6723143B2 (en) * 1998-06-11 2004-04-20 Honeywell International Inc. Reactive aqueous metal oxide sols as polishing slurries for low dielectric constant materials
US6550619B2 (en) * 2000-05-09 2003-04-22 Entergris, Inc. Shock resistant variable load tolerant wafer shipper
US7425362B2 (en) * 2002-09-06 2008-09-16 E.Pak International, Inc. Plastic packaging cushion

Also Published As

Publication number Publication date
MY139640A (en) 2009-10-30
CN1989599A (en) 2007-06-27
WO2006016883A1 (en) 2006-02-16

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